CN112147543A - Test structures and test systems - Google Patents

Test structures and test systems Download PDF

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CN112147543A
CN112147543A CN202010877242.4A CN202010877242A CN112147543A CN 112147543 A CN112147543 A CN 112147543A CN 202010877242 A CN202010877242 A CN 202010877242A CN 112147543 A CN112147543 A CN 112147543A
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circuit board
test
connection
test point
connection part
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杨宏琳
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Interface Optoelectronics Shenzhen Co Ltd
Interface Technology Chengdu Co Ltd
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Yecheng Optoelectronics Wuxi Co Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66Testing of connections, e.g. of plugs or non-disconnectable joints
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416Connectors, terminals
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

本发明涉及一种测试结构和测试系统,所述测试结构包括:第一连接部,设置于第一电路板上;第二连接部,设置于第二电路板上,与所述第一连接部的位置相对应,以在所述第一电路板和所述第二电路板绑定后,与所述第一连接部连接;第一测试点组,与所述第一连接部或所述第二连接部连接,所述第一测试点组用于连接测试设备,以获取所述第一电路板和所述第二电路板之间的第一绑定状态。通过设置第一测试点组,测试设备可以获取第一连接部与第二连接部连接后的电学性能参数,并可以根据电学性能参数获取第一连接部和第二连接部之间的重合面积,从而根据重合面积准确地获取第一绑定状态,即提供了一种测试结果准确的测试结构。

Figure 202010877242

The invention relates to a test structure and a test system. The test structure comprises: a first connection part, which is arranged on a first circuit board; a second connection part, which is arranged on the second circuit board and is connected to the first connection part. corresponding to the positions of the first circuit board and the second circuit board, so as to connect with the first connection part after the first circuit board and the second circuit board are bound; the first test point group is connected with the first connection part or the first connection part. The two connecting parts are connected, and the first test point group is used to connect a test device to obtain a first binding state between the first circuit board and the second circuit board. By setting the first test point group, the test equipment can obtain the electrical performance parameters after the first connecting part is connected with the second connecting part, and can obtain the overlapping area between the first connecting part and the second connecting part according to the electrical performance parameters, Therefore, the first binding state can be accurately obtained according to the overlapping area, that is, a test structure with accurate test results is provided.

Figure 202010877242

Description

测试结构和测试系统Test structures and test systems

技术领域technical field

本发明涉及显示技术领域,特别是涉及一种测试结构和测试系统。The present invention relates to the field of display technology, in particular to a test structure and a test system.

背景技术Background technique

在显示技术领域中,通常需要通过异方性导电胶(Anisotropic ConductiveFilm,ACF)实现柔性印制电路板(Flexible Printed Circuit board,简称FPC)和玻璃、硬质电路板等结构之间的电性连接。进一步地,异方性导电胶通过绑定(bonding)工艺将柔性印制电路板和其他结构连接在一起。In the field of display technology, it is usually necessary to use anisotropic conductive film (ACF) to realize the electrical connection between flexible printed circuit board (Flexible Printed Circuit board, FPC for short) and glass, rigid circuit board and other structures . Further, the anisotropic conductive adhesive connects the flexible printed circuit board and other structures together through a bonding process.

绑定工艺的准确度直接决定了显示设备的显示质量和可靠性,因此,需要在绑定工艺后,对绑定结果进行检测,以筛选出绑定不合格的产品,从而及时进行修复,提高绑定质量。The accuracy of the binding process directly determines the display quality and reliability of the display device. Therefore, it is necessary to test the binding results after the binding process to screen out unqualified products, so as to repair them in time and improve the Binding quality.

目前常用的绑定检测手段是自动光学检测(Automatic Optic Inspection,AOI)或人工检测,自动光学检测是基于光学原理对绑定结果进行检测的手段,因此,若检测的光学环境发生变化或被绑定结构的光学透光率等特性发生变化,极易导致检测结果错误,从而影响显示设备的生产良率,因此,现有的绑定工艺的检测手段已无法满足测试的准确度需求。At present, the commonly used binding detection method is automatic optical inspection (Automatic Optic Inspection, AOI) or manual detection. Automatic optical inspection is a means of detecting binding results based on optical principles. Therefore, if the detected optical environment changes or is bound Changes in the optical transmittance and other characteristics of the fixed structure can easily lead to wrong test results, thereby affecting the production yield of the display device. Therefore, the existing detection methods of the bonding process can no longer meet the accuracy requirements of the test.

发明内容SUMMARY OF THE INVENTION

基于此,有必要针对现有的绑定工艺的检测手段准确度不足的问题,提供一种测试结构和测试系统。Based on this, it is necessary to provide a test structure and a test system to solve the problem of insufficient accuracy of the detection means of the existing binding process.

一种测试结构,包括:A test structure that includes:

第一连接部,设置于第一电路板上;the first connection part is arranged on the first circuit board;

第二连接部,设置于第二电路板上,与所述第一连接部的位置相对应,以在所述第一电路板和所述第二电路板绑定后,与所述第一连接部连接;A second connecting portion is disposed on the second circuit board and corresponds to the position of the first connecting portion, so as to be connected with the first circuit board after the first circuit board and the second circuit board are bound connection;

第一测试点组,与所述第一连接部或所述第二连接部连接,所述第一测试点组用于连接测试设备,以获取所述第一电路板和所述第二电路板之间的第一绑定状态。a first test point group, connected to the first connection part or the second connection part, the first test point group is used to connect a test device to obtain the first circuit board and the second circuit board The first binding state between.

在其中一个实施例中,还包括:In one embodiment, it also includes:

第三连接部,设置于第三电路板上,与所述第二连接部的位置相对应,以使所述第三电路板和所述第二电路板绑定后,与所述第二连接部的远离所述第一连接部的一端连接;The third connection part is arranged on the third circuit board and corresponds to the position of the second connection part, so that after the third circuit board and the second circuit board are bound, they are connected to the second circuit board one end of the part away from the first connecting part is connected;

第二测试点组,与所述第一连接部、所述第二连接部和所述第三连接部中的一个连接,所述第二测试点组用于连接所述测试设备,以获取所述第三电路板和所述第二电路板之间的第二绑定状态。The second test point group is connected to one of the first connection part, the second connection part and the third connection part, and the second test point group is used to connect the test equipment to obtain all the the second binding state between the third circuit board and the second circuit board.

在其中一个实施例中,所述第一连接部包括第一连接线和第二连接线,所述第二连接部用于在所述第一电路板和所述第二电路板绑定后,导通所述第一连接线和所述第二连接线;In one of the embodiments, the first connection part includes a first connection wire and a second connection wire, and the second connection part is used for, after the first circuit board and the second circuit board are bound, Conducting the first connection line and the second connection line;

所述第一测试点组包括第一测试点和第二测试点,所述第一测试点与所述第一连接线连接,所述第二测试点与所述第二连接线连接,所述第一测试点和第二测试点共同用于连接所述测试设备。The first test point group includes a first test point and a second test point, the first test point is connected with the first connection line, the second test point is connected with the second connection line, the The first test point and the second test point are jointly used to connect the test equipment.

在其中一个实施例中,所述第一连接部还包括第三连接线,所述第三连接部用于在所述第一电路板和所述第二电路板绑定后,经由所述第二连接部导通所述第二连接线和所述第三连接线;In one embodiment, the first connection part further includes a third connection wire, and the third connection part is used for connecting the first circuit board and the second circuit board through the first circuit board after binding the second circuit board. two connecting parts conduct the second connecting line and the third connecting line;

所述第二测试点组与所述第一测试点组共用所述第二测试点,所述第二测试点组还包括第三测试点,所述第三测试点与所述第三连接线连接,所述第二测试点和所述第三测试点共同用于连接所述测试设备。The second test point group shares the second test point with the first test point group, the second test point group further includes a third test point, and the third test point is connected to the third connection line connection, the second test point and the third test point are jointly used to connect the test equipment.

在其中一个实施例中,所述第一测试点组和所述第二测试点组均设置于所述第一电路板上。In one embodiment, both the first test point group and the second test point group are disposed on the first circuit board.

在其中一个实施例中,所述第一连接部和所述第二连接部在连接处形成有第一连接面积,所述第一连接面积为所述第一连接部和所述第二连接部在垂直于所述第一电路板方向上的重合面积,所述第一连接面积与所述第一绑定状态相对应。In one of the embodiments, the first connection portion and the second connection portion are formed with a first connection area at the connection, and the first connection area is the first connection portion and the second connection portion In the overlapping area in the direction perpendicular to the first circuit board, the first connection area corresponds to the first binding state.

在其中一个实施例中,所述第一连接部和所述第二连接部在连接处形成有第一电阻,所述第一电阻与所述第一绑定状态相对应。In one of the embodiments, a first resistance is formed at the connection between the first connection part and the second connection part, and the first resistance corresponds to the first binding state.

一种测试系统,包括:A test system including:

第一电路板;the first circuit board;

第二电路板;the second circuit board;

如上述的测试结构;Test structure as above;

测试设备,与所述测试结构连接,用于测试所述第一电路板和所述第二电路板之间的第一绑定状态。A test device, connected to the test structure, is used for testing the first bonding state between the first circuit board and the second circuit board.

在其中一个实施例中,所述测试设备包括:In one embodiment, the test equipment includes:

探针模块,用于连接第一测试点组,以测试第一连接部和第二连接部之间的第一电阻;a probe module for connecting the first test point group to test the first resistance between the first connection part and the second connection part;

运动模块,与所述探针模块连接,用于带动所述探针模块运动,以使所述探针模块连接至所述第一测试点组;a movement module, connected with the probe module, for driving the probe module to move, so that the probe module is connected to the first test point group;

分析模块,与所述探针模块连接,用于获取所述第一电阻,并根据所述第一电阻获取所述第一绑定状态。An analysis module, connected to the probe module, for acquiring the first resistance, and acquiring the first binding state according to the first resistance.

在其中一个实施例中,所述第一绑定状态包括多个状态等级,所述分析模块配置有多个电阻阈值,所述电阻阈值与所述状态等级一一对应,所述分析模块用于根据所述第一电阻和多个所述电阻阈值确定所述第一绑定状态的状态等级。In one embodiment, the first binding state includes a plurality of state levels, the analysis module is configured with a plurality of resistance thresholds, the resistance thresholds correspond to the state levels one-to-one, and the analysis module is configured to A state level of the first binding state is determined based on the first resistance and a plurality of the resistance thresholds.

上述测试结构包括:第一连接部,设置于第一电路板上;第二连接部,设置于第二电路板上,与所述第一连接部的位置相对应,以在所述第一电路板和所述第二电路板绑定后,与所述第一连接部连接;第一测试点组,与所述第一连接部或所述第二连接部连接,所述第一测试点组用于连接测试设备,以获取所述第一电路板和所述第二电路板之间的第一绑定状态。通过设置第一测试点组,测试设备可以获取第一连接部与第二连接部连接后的电学性能参数,并可以根据电学性能参数获取第一连接部和第二连接部之间的重合面积,从而根据重合面积准确地获取第一绑定状态,即提供了一种测试结果准确的测试结构。The above-mentioned test structure includes: a first connection part, arranged on the first circuit board; a second connection part, arranged on the second circuit board, corresponding to the position of the first connection part, so as to connect the first circuit After the board is bound to the second circuit board, it is connected to the first connection part; the first test point group is connected to the first connection part or the second connection part, and the first test point group is connected to the first connection part or the second connection part. It is used to connect a test device to obtain the first binding state between the first circuit board and the second circuit board. By setting the first test point group, the test equipment can obtain the electrical performance parameters after the first connection part and the second connection part are connected, and can obtain the overlapping area between the first connection part and the second connection part according to the electrical performance parameters, Therefore, the first binding state can be accurately obtained according to the overlapping area, that is, a test structure with accurate test results is provided.

附图说明Description of drawings

图1为一实施例的第一连接部的结构示意图;FIG. 1 is a schematic structural diagram of a first connecting portion according to an embodiment;

图2为一实施例的第二连接部的结构示意图;2 is a schematic structural diagram of a second connecting portion of an embodiment;

图3为图1的第一电路板与图2的第二电路板绑定后的结构示意图;FIG. 3 is a schematic structural diagram of the first circuit board of FIG. 1 and the second circuit board of FIG. 2 after binding;

图4为一第一电路板和第二电路板绑定失效的示意图;4 is a schematic diagram of a first circuit board and a second circuit board binding failure;

图5为另一实施例的测试结构的结构示意图;5 is a schematic structural diagram of a test structure of another embodiment;

图6为另一第一电路板和第二电路板绑定失效的示意图;6 is a schematic diagram of another first circuit board and a second circuit board binding failure;

图7为一实施例的第三连接部的结构示意图;7 is a schematic structural diagram of a third connecting portion according to an embodiment;

图8为图7的第三电路板与图2的第二电路板绑定后的结构示意图;FIG. 8 is a schematic structural diagram of the third circuit board of FIG. 7 and the second circuit board of FIG. 2 after binding;

图9为另一实施例的第一连接部的结构示意图;9 is a schematic structural diagram of a first connecting portion of another embodiment;

图10为另一实施例的第二连接部的结构示意图;10 is a schematic structural diagram of a second connecting portion of another embodiment;

图11为另一实施例的第三连接部的结构示意图;11 is a schematic structural diagram of a third connecting portion of another embodiment;

图12为一实施例的第一电路板、第二电路板和第三电路板均绑定后的结构示意图;FIG. 12 is a schematic structural diagram of the first circuit board, the second circuit board and the third circuit board after binding according to an embodiment;

图13为图12实施例的测试结构的等效电路图;FIG. 13 is an equivalent circuit diagram of the test structure of the embodiment of FIG. 12;

图14为又一实施例的测试结构的结构示意图;14 is a schematic structural diagram of a test structure of another embodiment;

图15为一实施例的测试系统的结构示意图。FIG. 15 is a schematic structural diagram of a testing system according to an embodiment.

元件标号说明:Component label description:

第一电路板:10;第一连接部:100;第一连接线:110;第二连接线:120;第三连接线:130;第二电路板:20;第二连接部:200;第四连接线:210;第五连接线:220;第三电路板:30;第三连接部:300;第六连接线:310;第一测试点组:40;第二测试点组:50;探针模块:60;运动模块:70;壳体:80The first circuit board: 10; the first connecting part: 100; the first connecting line: 110; the second connecting line: 120; the third connecting line: 130; the second circuit board: 20; the second connecting part: 200; Four connecting lines: 210; fifth connecting line: 220; third circuit board: 30; third connecting part: 300; sixth connecting line: 310; first test point group: 40; second test point group: 50; Probe Module: 60; Motion Module: 70; Housing: 80

具体实施方式Detailed ways

为了便于理解本发明,下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的首选实施例。但是,本发明可以以许多不同的形式来实现,并不限于本文所描述的实施例。相反地,提供这些实施例的目的是使对本发明的公开内容更加透彻全面。In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the related drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

除非另有定义,本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的,不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

在本发明的描述中,需要理解的是,术语“上”、“下”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方法或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. is based on the drawings shown in the drawings. The method or positional relationship is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention .

本申请实施例提供了一种测试结构,在本实施例中,测试结构包括第一连接部100、第二连接部200和第一测试点组40。The embodiment of the present application provides a test structure. In this embodiment, the test structure includes a first connection part 100 , a second connection part 200 and a first test point group 40 .

第一连接部100设置于第一电路板10上。图1为一实施例的第一连接部100的结构示意图,参考图1,第一连接部100覆盖部分第一电路板10的表面,且第一连接部100位于第一电路板10待绑定的一侧的表面,即第一电路板10待粘接异方性导电胶的一侧。示例性地,第一电路板10具有相背设置的第一面和第二面,若第一电路板10和第二电路板20绑定后,第一电路板10的第一面朝向第二电路板20,则第一连接部100设置于第一电路板10的第一面。其中,第一电路板10可以为柔性印刷电路板。The first connection portion 100 is disposed on the first circuit board 10 . 1 is a schematic structural diagram of a first connecting portion 100 according to an embodiment. Referring to FIG. 1 , the first connecting portion 100 covers part of the surface of the first circuit board 10 , and the first connecting portion 100 is located on the first circuit board 10 to be bound. The surface of one side of the first circuit board 10 is the side of the first circuit board 10 to be bonded with the anisotropic conductive adhesive. Exemplarily, the first circuit board 10 has a first side and a second side opposite to each other. If the first circuit board 10 and the second circuit board 20 are bound, the first side of the first circuit board 10 faces the second side. The circuit board 20 , the first connection portion 100 is disposed on the first surface of the first circuit board 10 . Wherein, the first circuit board 10 may be a flexible printed circuit board.

第二连接部200,设置于第二电路板20上,与所述第一连接部100的位置相对应,以在所述第一电路板10和所述第二电路板20绑定后,与所述第一连接部100连接。图2为一实施例的第二连接部200的结构示意图,参考图2,第二连接部200覆盖部分第二电路板20的表面,且至少第二电路板20待与第一电路板10绑定的一侧设置有第二连接部200。其中,第二电路板20可以为硬质电路板。The second connection part 200 is disposed on the second circuit board 20 and corresponds to the position of the first connection part 100 , so that after the first circuit board 10 and the second circuit board 20 are bound, the The first connection part 100 is connected. 2 is a schematic structural diagram of the second connecting portion 200 according to an embodiment. Referring to FIG. 2 , the second connecting portion 200 covers part of the surface of the second circuit board 20 , and at least the second circuit board 20 is to be bound with the first circuit board 10 A second connection part 200 is provided on the fixed side. Wherein, the second circuit board 20 may be a rigid circuit board.

进一步地,所述第一连接部100和所述第二连接部200在连接处形成有第一连接面积,所述第一连接面积为所述第一连接部100和所述第二连接部200在垂直于所述第一电路板10方向上的重合面积,所述第一连接面积与所述第一绑定状态相对应。图3为图1的第一电路板10与图2的第二电路板20绑定后的结构示意图,参考图3,第一电路板10和第二电路板20平行设置并进行绑定,在第一电路板10和第二电路板20绑定后,第一连接部100和第二连接部200在垂直于第一电路板10的表面的方向上相重合,重合面积即可有效地反映第一电路板10和第二电路板20之间的第一绑定状态,第一绑定状态例如可以包括有效和无效。具体地,当重合面积满足预设条件时,例如图3所示,可以认为第一电路板10和第二电路板20进行了有效的绑定,即不会影响显示设备的显示质量和可靠性,否则例如图4所示,则可以认为第一电路板10和第二电路板20进行了无效的绑定,会造成显示设备的显示质量或可靠性降低。Further, the first connection part 100 and the second connection part 200 are formed with a first connection area at the connection, and the first connection area is the first connection part 100 and the second connection part 200 In the overlapping area in the direction perpendicular to the first circuit board 10 , the first connection area corresponds to the first binding state. FIG. 3 is a schematic structural diagram of the first circuit board 10 of FIG. 1 and the second circuit board 20 of FIG. 2 after binding. Referring to FIG. 3 , the first circuit board 10 and the second circuit board 20 are arranged in parallel and bound. After the first circuit board 10 and the second circuit board 20 are bound, the first connection part 100 and the second connection part 200 overlap in the direction perpendicular to the surface of the first circuit board 10, and the overlapping area can effectively reflect the first circuit board 10 and the second circuit board 20. A first binding state between a circuit board 10 and a second circuit board 20, the first binding state may include, for example, valid and invalid. Specifically, when the overlapping area satisfies a preset condition, such as shown in FIG. 3 , it can be considered that the first circuit board 10 and the second circuit board 20 are effectively bound, that is, the display quality and reliability of the display device will not be affected , otherwise, for example, as shown in FIG. 4 , it can be considered that the first circuit board 10 and the second circuit board 20 are bound in an invalid manner, which will reduce the display quality or reliability of the display device.

第一测试点组40,与所述第一连接部100或所述第二连接部200连接,所述第一测试点组40用于连接测试设备,以获取所述第一电路板10和所述第二电路板20之间的第一绑定状态。在本实施例中,第一连接部100和第二连接部200均为导电结构,测试设备通过第一测试点组40对第一连接部100和第二连接部200的连接性能进行测试,具体地,测试设备对第一连接部100和第二连接部200的连接处的电学性能参数进行测试。其中,测试设备可以向第一测试点组40传输电学信号,以获取第一连接部100和第二连接部200的连接处的电学性能参数。示例性地,电学性能参数可以是但不局限于电阻、电容、电感和电流等。The first test point group 40 is connected to the first connection part 100 or the second connection part 200 , and the first test point group 40 is used to connect test equipment to obtain the first circuit board 10 and all the The first binding state between the second circuit boards 20 is described. In this embodiment, the first connection part 100 and the second connection part 200 are both conductive structures, and the test equipment tests the connection performance of the first connection part 100 and the second connection part 200 through the first test point group 40 . Ground, the test equipment tests the electrical performance parameters of the connection between the first connection part 100 and the second connection part 200 . Wherein, the test equipment may transmit electrical signals to the first test point group 40 to obtain electrical performance parameters at the connection between the first connection part 100 and the second connection part 200 . Illustratively, the electrical performance parameters may be, but are not limited to, resistance, capacitance, inductance, current, and the like.

可以理解的是,随着第一连接部100和第二连接部200的重合面积的变化,连接处的电学性能也必然发生改变,而且相比基于光学原理的测试方式,电学性能参数受环境因素的影响更小。因此,基于本实施例的测试结构,可以更加准确地获取第一连接部100和第二连接部200的连接情况,从而更加准确地评价第一电路板10和第二电路板20的绑定效果,例如绑定时是否发生了第一电路板10和第二电路板20之间的位置偏移,或压接异方性导电胶时的压接力是否足以让第一电路板10和第二电路板20之间形成稳定的连接。It can be understood that, with the change of the overlapping area of the first connection part 100 and the second connection part 200, the electrical performance of the connection will inevitably change, and compared with the test method based on the optical principle, the electrical performance parameters are affected by environmental factors. less impact. Therefore, based on the test structure of the present embodiment, the connection of the first connection part 100 and the second connection part 200 can be obtained more accurately, so that the binding effect of the first circuit board 10 and the second circuit board 20 can be more accurately evaluated , for example, whether there is a positional shift between the first circuit board 10 and the second circuit board 20 during bonding, or whether the crimping force when crimping the anisotropic conductive adhesive is sufficient to make the first circuit board 10 and the second circuit board 10. A stable connection is formed between the plates 20 .

在本实施例中,测试结构包括:第一连接部100,设置于第一电路板10上;第二连接部200,设置于第二电路板20上,与所述第一连接部100的位置相对应,以在所述第一电路板10和所述第二电路板20绑定后,与所述第一连接部100连接;第一测试点组40,与所述第一连接部100或所述第二连接部200连接,所述第一测试点组40用于连接测试设备,以获取所述第一电路板10和所述第二电路板20之间的第一绑定状态。通过设置第一测试点组40,测试设备可以获取第一连接部100与第二连接部200连接后的电学性能参数,并可以根据电学性能参数获取第一连接部100和第二连接部200之间的重合面积,从而根据重合面积准确地获取第一绑定状态,即提供了一种测试结果准确的测试结构。In this embodiment, the test structure includes: a first connection part 100 disposed on the first circuit board 10 ; a second connection part 200 disposed on the second circuit board 20 , and the position of the first connection part 100 Correspondingly, after the first circuit board 10 and the second circuit board 20 are bound, they are connected to the first connection part 100 ; the first test point group 40 is connected to the first connection part 100 or The second connection part 200 is connected, and the first test point group 40 is used for connecting a test device to obtain a first binding state between the first circuit board 10 and the second circuit board 20 . By setting the first test point group 40, the test equipment can obtain the electrical performance parameters after the first connection part 100 and the second connection part 200 are connected, and can obtain the electrical performance parameters between the first connection part 100 and the second connection part 200 according to the electrical performance parameters Therefore, the first binding state can be accurately obtained according to the overlapping area, that is, a test structure with accurate test results is provided.

图5为另一实施例的测试结构的结构示意图,参考图5,在本实施例中,第一电路板10上形成有两个第一连接部100,在第二电路板20上的对应位置形成有两个第二连接部200,第一连接部100和第二连接部200在绑定后一一对应连接,即对应的第一连接部100和第二连接部200的位置对应,且对应的第一连接部100和第二连接部200的尺寸也相匹配。FIG. 5 is a schematic structural diagram of a test structure according to another embodiment. Referring to FIG. 5 , in this embodiment, two first connection parts 100 are formed on the first circuit board 10 , at corresponding positions on the second circuit board 20 . Two second connection parts 200 are formed, and the first connection part 100 and the second connection part 200 are connected in one-to-one correspondence after binding, that is, the positions of the corresponding first connection part 100 and the second connection part 200 are corresponding, and the corresponding The dimensions of the first connecting part 100 and the second connecting part 200 are also matched.

当第一电路板10和第二电路板20绑定时,一个第一连接部100与一个第二连接部200相重合,另一个第一连接部100与另一个第二连接部200相重合,通过测试设备进行测试时,分别测试每一对第一连接部100和第二连接部200的连接处的电学性能参数。图6为一第一电路板10和第二电路板20绑定失效的示意图,参考图6,可以理解的是,第一电路板10和第二电路板20绑定时,存在发生倾斜的风险,从而第一电路板10和第二电路板20的部分区域进行了如图6中左侧所示的有效绑定,但第一电路板10和第二电路板20的另一部分区域进行了如图6右侧所示的无效绑定。因此,本实施例通过设置两对第一连接部100和第二连接部200,可以更加有效地识别绑定时发生倾斜的情况,从而提高测试结构的检测准确性。When the first circuit board 10 and the second circuit board 20 are bound, one first connection part 100 overlaps with one second connection part 200 , and the other first connection part 100 overlaps with another second connection part 200 , When the test is performed by the test equipment, the electrical performance parameters of the connection of each pair of the first connection part 100 and the second connection part 200 are respectively tested. FIG. 6 is a schematic diagram of the failure of binding between the first circuit board 10 and the second circuit board 20. Referring to FIG. 6, it can be understood that when the first circuit board 10 and the second circuit board 20 are bound, there is a risk of tilting , so that part of the first circuit board 10 and the second circuit board 20 are effectively bound as shown on the left in FIG. 6 , but another part of the first circuit board 10 and the second circuit board 20 are bound as shown on the left Invalid binding shown on the right side of Figure 6. Therefore, in this embodiment, by providing two pairs of the first connecting part 100 and the second connecting part 200 , the situation of tilting during binding can be more effectively identified, thereby improving the detection accuracy of the test structure.

进一步地,两个第一连接部100的中心之间的距离与两个第二连接部200的中心之间的距离相同,而且上述中心之间的距离与电路板的尺寸相匹配,即,两个第一连接部100的中心之间的距离与第一电路板10和/或第二电路板20的尺寸相匹配,两个第二连接部200的中心之间的距离也与第一电路板10和/或第二电路板20的尺寸相匹配。示例性地,若第二电路板20的长度为5cm,则可以设置两个第一连接部100的中心之间的距离为4cm,且设置两个第二连接部200的中心之间的距离也为4cm,其中,定义第一电路板10和第二电路板20绑定后的排列方向为第一方向,第二方向垂直于第一方向,第二电路板20的长度是指第二电路板20在第二方向上的尺寸。在本实施例中,通过使两个第一连接部100的中心之间的距离与电路板的尺寸相匹配,且两个第二连接部200的中心之间的距离与电路板的尺寸相匹配,可以避免中心距离过小导致测试结果不准确的问题,从而提供了一种测试结果更加准确的测试结构。Further, the distance between the centers of the two first connection parts 100 is the same as the distance between the centers of the two second connection parts 200, and the distance between the centers above matches the size of the circuit board, that is, the two The distance between the centers of the first connecting parts 100 matches the size of the first circuit board 10 and/or the second circuit board 20, and the distance between the centers of the two second connecting parts 200 is also the same as that of the first circuit board 10 and/or the dimensions of the second circuit board 20 are matched. Exemplarily, if the length of the second circuit board 20 is 5 cm, the distance between the centers of the two first connection parts 100 can be set to be 4 cm, and the distance between the centers of the two second connection parts 200 can be set as well. is 4cm, wherein the bound arrangement direction of the first circuit board 10 and the second circuit board 20 is defined as the first direction, the second direction is perpendicular to the first direction, and the length of the second circuit board 20 refers to the second circuit board 20 dimension in the second direction. In this embodiment, the distance between the centers of the two first connection parts 100 is matched with the size of the circuit board, and the distance between the centers of the two second connection parts 200 is matched with the size of the circuit board , the problem of inaccurate test results caused by too small center distance can be avoided, thereby providing a test structure with more accurate test results.

在其他实施例中,也可以在第一电路板10上设置三个或三个以上第一连接部100,并在第二电路板20上与第一连接部100数量相同的第二连接部200,并使第一连接部100和第二连接部200的位置一一对应,从而进一步提升测试结构的准确性。可以理解的是,设置多个第一连接部100和第二连接部200提高测试结构的测试成本,因此,可以根据测试准确度要求和电路板的尺寸选择恰当数量的第一连接部100和第二连接部200。当在第一电路板10上设置三个或三个以上第一连接部100时,可以使多个第一连接部100在第二方向上等距排列。In other embodiments, three or more first connection parts 100 may also be provided on the first circuit board 10 , and the second circuit board 20 has the same number of second connection parts 200 as the first connection parts 100 . , and make the positions of the first connecting part 100 and the second connecting part 200 correspond one-to-one, so as to further improve the accuracy of the test structure. It can be understood that providing a plurality of first connection parts 100 and second connection parts 200 increases the test cost of the test structure. Therefore, an appropriate number of first connection parts 100 and second connection parts can be selected according to the test accuracy requirements and the size of the circuit board. Two connecting parts 200 . When three or more first connection parts 100 are provided on the first circuit board 10 , the plurality of first connection parts 100 may be arranged at equal distances in the second direction.

在另一实施例中,测试结构还包括第三连接部300和第二测试点组50。In another embodiment, the test structure further includes a third connection part 300 and a second test point group 50 .

图7为一实施例的第三连接部300的结构示意图,图8为图7的第三电路板30与图2的第二电路板20绑定后的结构示意图,参考图7,第三连接部300设置于第三电路板30上,与所述第二连接部200的位置相对应,以使所述第三电路板30和所述第二电路板20绑定后,与所述第二连接部200的远离所述第三连接部300的一端连接;第二测试点组50,与所述第一连接部100、所述第二连接部200和所述第三连接部300中的一个连接,所述第二测试点组50用于连接所述测试设备,以获取所述第三电路板30和所述第二电路板20之间的第二绑定状态。示例性地,第三电路板30可以为显示设备的玻璃基板30。FIG. 7 is a schematic structural diagram of a third connection portion 300 according to an embodiment, and FIG. 8 is a schematic structural diagram of the third circuit board 30 of FIG. 7 and the second circuit board 20 of FIG. 2 after binding. Referring to FIG. 7 , the third connection The part 300 is disposed on the third circuit board 30 and corresponds to the position of the second connecting part 200, so that after the third circuit board 30 and the second circuit board 20 are bound, they are connected to the second connection part 200. One end of the connection part 200 away from the third connection part 300 is connected; the second test point group 50 is connected to one of the first connection part 100 , the second connection part 200 and the third connection part 300 connection, the second test point group 50 is used to connect the test equipment to obtain the second binding state between the third circuit board 30 and the second circuit board 20 . Exemplarily, the third circuit board 30 may be a glass substrate 30 of a display device.

参考图8,第二电路板20和第三电路板30平行设置并进行绑定,在第三电路板30和第二电路板20绑定后,第二连接部200和第三连接部300在垂直于第三电路板30的表面的方向上相重合,重合面积即可有效地反映第三电路板30和第二电路板20之间的第二绑定状态,第二绑定状态例如可以包括有效和无效。具体地,当重合面积满足预设条件时,可以认为第三电路板30和第二电路板20进行了有效的绑定,即不会影响显示设备的显示质量和可靠性,否则可以认为第三电路板30和第二电路板20进行了无效的绑定,会造成显示设备的显示质量或可靠性降低。Referring to FIG. 8 , the second circuit board 20 and the third circuit board 30 are arranged in parallel and bound. After the third circuit board 30 and the second circuit board 20 are bound, the second connection part 200 and the third connection part 300 are The directions perpendicular to the surface of the third circuit board 30 overlap, and the overlapping area can effectively reflect the second binding state between the third circuit board 30 and the second circuit board 20 . The second binding state may include, for example, valid and invalid. Specifically, when the overlapping area satisfies the preset condition, it can be considered that the third circuit board 30 and the second circuit board 20 are effectively bound, that is, the display quality and reliability of the display device will not be affected, otherwise it can be considered that the third circuit board 30 and the second circuit board 20 are effectively bound. The circuit board 30 and the second circuit board 20 are ineffectively bound, which may reduce the display quality or reliability of the display device.

图9为另一实施例的第一连接部100的结构示意图,参考图9,在本实施例中,所述第一连接部100包括第一连接线110和第二连接线120,所述第二连接部200用于在所述第一电路板10和所述第二电路板20绑定后,导通所述第一连接线110和所述第二连接线120;所述第一测试点组40包括第一测试点和第二测试点,所述第一测试点与所述第一连接线110连接,所述第二测试点与所述第二连接线120连接,所述第一测试点和第二测试点共同用于连接所述测试设备。其中,第一连接线110与第二连接线120之间电性隔离。在本实施例中,第一测试点和第二测试点均设置于第一电路板10上。进一步地,所述第一连接部100和所述第二连接部200在连接处形成有第一电阻,所述第一电阻与所述第一绑定状态相对应,测试设备为电阻测试设备。FIG. 9 is a schematic structural diagram of a first connection part 100 according to another embodiment. Referring to FIG. 9 , in this embodiment, the first connection part 100 includes a first connection line 110 and a second connection line 120 . The second connection part 200 is used to conduct the first connection line 110 and the second connection line 120 after the first circuit board 10 and the second circuit board 20 are bound; the first test point The group 40 includes a first test point and a second test point, the first test point is connected to the first connection line 110, the second test point is connected to the second connection line 120, and the first test point is connected to the second connection line 120. The point and the second test point are used together to connect the test equipment. The first connection line 110 and the second connection line 120 are electrically isolated. In this embodiment, both the first test point and the second test point are disposed on the first circuit board 10 . Further, a first resistance is formed at the connection between the first connection part 100 and the second connection part 200 , the first resistance corresponds to the first binding state, and the testing device is a resistance testing device.

图10为另一实施例的第二连接部200的结构示意图,参考图10,在本实施例中,第二连接部200包括第四连接线210,第四连接线210的形状和位置与第一连接线110及第二连接线120相对应。结合图9和图10,当第一电路板10和第二电路板20未进行绑定时,第一连接部100与第二连接部200相断开,第一连接线110和第二连接线120相断开,当采用电阻测试设备搭接在第一测试点和第二测试点上时,测试到的电阻为无穷大;当第一电路板10和第二电路板20进行无效的绑定时,第一连接部100与第二连接部200相连接,但连接面积较小,第四连接线210导通第一连接线110和第二连接线120,当采用电阻测试设备搭接在第一测试点和第二测试点上时,测试到的电阻大于或等于电阻阈值,则存在影响显示质量和可靠性的风险;当第一电路板10和第二电路板20进行有效的绑定时,第一连接部100与第二连接部200相连接,且连接面积较大,第四连接线210导通第一连接线110和第二连接线120当采用电阻测试设备搭接在第一测试点和第二测试点上时,测试到的电阻小于电阻阈值,显示设备即可具有较佳的显示质量和可靠性。因此,本实施例通过设置第一连接线110和第二连接线120可以有效、准确地评价第一电路板10和第二电路板20之间的第一绑定状态。FIG. 10 is a schematic structural diagram of a second connection part 200 according to another embodiment. Referring to FIG. 10 , in this embodiment, the second connection part 200 includes a fourth connection line 210 , and the shape and position of the fourth connection line 210 are the same as those of the first connection line 210 . A connection line 110 corresponds to a second connection line 120 . 9 and 10 , when the first circuit board 10 and the second circuit board 20 are not bound, the first connection part 100 and the second connection part 200 are disconnected, and the first connection line 110 and the second connection line The 120 phase is disconnected. When the resistance test equipment is used to overlap the first test point and the second test point, the measured resistance is infinite; when the first circuit board 10 and the second circuit board 20 are invalidly bound , the first connection part 100 is connected with the second connection part 200, but the connection area is small, and the fourth connection line 210 conducts the first connection line 110 and the second connection line 120. When the tested resistance is greater than or equal to the resistance threshold value on the test point and the second test point, there is a risk of affecting the display quality and reliability; when the first circuit board 10 and the second circuit board 20 are effectively bound, The first connection part 100 is connected with the second connection part 200, and the connection area is large. and the second test point, the tested resistance is smaller than the resistance threshold, and the display device can have better display quality and reliability. Therefore, in this embodiment, the first bonding state between the first circuit board 10 and the second circuit board 20 can be effectively and accurately evaluated by setting the first connection line 110 and the second connection line 120 .

在其中一个实施例中,继续参考图9,所述第一连接部100还包括第三连接线130,所述第三连接部300用于在所述第一电路板10和所述第二电路板20绑定后,经由所述第二连接部200导通所述第二连接线120和所述第三连接线130;所述第二测试点组50与所述第一测试点组40共用所述第二测试点,所述第二测试点组50还包括第三测试点,所述第三测试点与所述第三连接线130连接,所述第二测试点和所述第三测试点共同用于连接所述测试设备。图11为另一实施例的第三连接部300的结构示意图,参考图11,第三连接部300包括第六连接线310,且第六连接线310的位置与第四连接线210及第五连接线220对应。In one of the embodiments, continuing to refer to FIG. 9 , the first connection part 100 further includes a third connection wire 130 , and the third connection part 300 is used for connecting between the first circuit board 10 and the second circuit After the board 20 is bound, the second connection line 120 and the third connection line 130 are connected through the second connection part 200 ; the second test point group 50 is shared with the first test point group 40 The second test point, the second test point group 50 further includes a third test point, the third test point is connected to the third connection line 130, the second test point and the third test point The points are used together to connect the test equipment. FIG. 11 is a schematic structural diagram of a third connection part 300 according to another embodiment. Referring to FIG. 11 , the third connection part 300 includes a sixth connection line 310 , and the position of the sixth connection line 310 is the same as that of the fourth connection line 210 and the fifth connection line 210 . The connection line 220 corresponds.

图12为一实施例的第一电路板10、第二电路板20和第三电路板30均绑定后的结构示意图,参考图12,在本实施例中,每两条连接线的连接处均形成有一个接触电阻,具体地,第一连接线110和第四连接线210之间形成电阻R1,第一连接线110和第四连接线210之间形成电阻R1,第三连接线130和第五连接线220之间形成电阻R3,第四连接线210和第六连接线310之间形成电阻R4,第五连接线220和第六连接线310之间形成电阻R5。图13为图12实施例的测试结构的等效电路图,可以理解的是,接触电阻R1至R5会随着重合面积的变化而实时变化,从而准确反映第一电路板10与第二电路板20之间的第一绑定状态、以及第二电路板20与第三电路板30之间的第二绑定状态。FIG. 12 is a schematic structural diagram of the first circuit board 10 , the second circuit board 20 and the third circuit board 30 after binding according to an embodiment. Referring to FIG. 12 , in this embodiment, the connection of each two connecting lines is Each has a contact resistance, specifically, a resistance R1 is formed between the first connection line 110 and the fourth connection line 210, a resistance R1 is formed between the first connection line 110 and the fourth connection line 210, and the third connection line 130 and A resistance R3 is formed between the fifth connection lines 220 , a resistance R4 is formed between the fourth connection line 210 and the sixth connection line 310 , and a resistance R5 is formed between the fifth connection line 220 and the sixth connection line 310 . FIG. 13 is an equivalent circuit diagram of the test structure of the embodiment of FIG. 12. It can be understood that the contact resistances R1 to R5 will change in real time with the change of the overlapping area, so as to accurately reflect the first circuit board 10 and the second circuit board 20. A first binding state between the second circuit board 20 and the third circuit board 30 , and a second binding state between the second circuit board 20 and the third circuit board 30 .

在其中一个实施例中,所述第一测试点组40和所述第二测试点组50均设置于所述第一电路板10上。在本实施例中,第一电路板10为硬质电路板,硬质电路板不容易发生形变和损伤,而形变和损伤会导致测试结构的电阻变大,从而影响测试结构的测试准确性,因此在本实施例中,通过将第一测试点组40和第二测试点组50设置在第一电路板10上,不会造成电路板损伤,从而提高了测试结构的可靠性。In one embodiment, the first test point group 40 and the second test point group 50 are both disposed on the first circuit board 10 . In this embodiment, the first circuit board 10 is a rigid circuit board, and the rigid circuit board is not easily deformed and damaged, and the deformation and damage will cause the resistance of the test structure to increase, thereby affecting the test accuracy of the test structure. Therefore, in this embodiment, by arranging the first test point group 40 and the second test point group 50 on the first circuit board 10, the circuit board will not be damaged, thereby improving the reliability of the test structure.

在其他实施例中,若采用材质较硬的柔性印刷电路板,则也可以将第一测试点组40和/或第二测试点组50设置在第二电路板20上。示例性地,图14为又一实施例的测试结构的结构示意图,参考图14,在本实施例中,第一测试点组40(T2和T3)设置在第一电路板10上,并将第二测试点组50(T4和T5)设置在第二电路板20上,通过设置材质较硬的第二电路板20,可以进一步减少布线的条数,从而降低生产成本和难度。在进行测试时,可以通过第一测试点组40(T2和T3)获取R2和R3的阻值,从而获取第一电路板10和第二电路板20之间的第一绑定状态,并通过第二测试点组50(T4和T5)获取R4和R5的阻值,从而获取第二电路板20和第三电路板30之间的第二绑定状态,而且,在本实施例中,第二绑定状态的测试结果也无需依赖于第一绑定状态的测试结果,从而提高了测试结构的灵活性和可靠性。In other embodiments, if a flexible printed circuit board with a harder material is used, the first test point group 40 and/or the second test point group 50 may also be disposed on the second circuit board 20 . Exemplarily, FIG. 14 is a schematic structural diagram of a test structure according to another embodiment. Referring to FIG. 14 , in this embodiment, the first test point group 40 (T2 and T3) is provided on the first circuit board 10, and the The second test point group 50 ( T4 and T5 ) is arranged on the second circuit board 20 . By setting the second circuit board 20 with a harder material, the number of wirings can be further reduced, thereby reducing the production cost and difficulty. During the test, the resistance values of R2 and R3 can be obtained through the first test point group 40 (T2 and T3), so as to obtain the first bonding state between the first circuit board 10 and the second circuit board 20, and through The second test point group 50 (T4 and T5) obtains the resistance values of R4 and R5, thereby obtaining the second bonding state between the second circuit board 20 and the third circuit board 30, and, in this embodiment, the first The test result of the second binding state also does not need to depend on the test result of the first binding state, thereby improving the flexibility and reliability of the test structure.

在其中一个实施例中,还提供了一种测试系统,包括第一电路板10、第二电路板20、如上述的测试结构,以及测试设备,测试设备与所述测试结构连接,用于测试所述第一电路板10和所述第二电路板20之间的第一绑定状态。具体地,第一电路板10、第二电路板20和测试结构参考图3所示的实施例。图15为一实施例的测试系统的结构示意图,参考图15,绑定后的第一电路板10和第二电路板20放置与测试设备上,以进行测试,从而获取第一电路板10和第二电路板20之间的第一绑定状态。In one of the embodiments, a test system is also provided, including a first circuit board 10, a second circuit board 20, the above-mentioned test structure, and test equipment, the test equipment is connected to the test structure for testing The first binding state between the first circuit board 10 and the second circuit board 20 . Specifically, the first circuit board 10 , the second circuit board 20 and the test structure refer to the embodiment shown in FIG. 3 . FIG. 15 is a schematic structural diagram of a test system according to an embodiment. Referring to FIG. 15 , the bound first circuit board 10 and the second circuit board 20 are placed on the test equipment for testing, so as to obtain the first circuit board 10 and the second circuit board 20 . The first bonding state between the second circuit boards 20 .

在其中一个实施例中,继续参考图15,所述测试设备包括探针模块60、运动模块70和分析模块。In one of the embodiments, with continued reference to FIG. 15, the test apparatus includes a probe module 60, a motion module 70, and an analysis module.

探针模块60用于连接第一测试点组40,以测试第一连接部100和第二连接部200之间的第一电阻。具体地,探针模块60的一端与运动模块70固定连接,从而在运动模块70的带动下移动至目标测试位置,探针模块60的另一端用于连接第一测试点组40,从而测试第一电阻,进一步地,探针模块60还用于将测试获得的第一电阻发送至分析模块,从而进行分析。The probe module 60 is used to connect the first test point group 40 to test the first resistance between the first connection part 100 and the second connection part 200 . Specifically, one end of the probe module 60 is fixedly connected with the motion module 70, so as to move to the target test position under the driving of the motion module 70, and the other end of the probe module 60 is used to connect to the first test point group 40, so as to test the first test point group 40. A resistance, further, the probe module 60 is further configured to send the first resistance obtained by the test to the analysis module for analysis.

运动模块70,与所述探针模块60连接,用于带动所述探针模块60运动,以使所述探针模块60连接至所述第一测试点组40。具体地,运动模块70与壳体80连接,并可以进行运动,示例性地,运动模块70可以进行三轴运动,即X方向、Y方向和Z方向,X方向和Y方向上的运动可以将探针模块60移动至第一测试点组40的坐标位置,Z方向上的运动可以使探针模块60与第一测试点组40接触,从而进行测试。在本实施例中,运动模块70先进行X方向和Y方向上的运动,到达目标坐标位置后进行Z方向上的运动,测试完成后,运动模块70在进行Z方向上的运动以远离第一电路板10和第二电路板20,达到预设高度后,再进行X方向和Y方向上的运动。The movement module 70 is connected to the probe module 60 and used to drive the probe module 60 to move, so that the probe module 60 is connected to the first test point group 40 . Specifically, the motion module 70 is connected to the housing 80 and can perform motion. Exemplarily, the motion module 70 can perform three-axis motion, that is, the X direction, the Y direction, and the Z direction. The motion in the X direction and the Y direction can The probe module 60 moves to the coordinate position of the first test point group 40 , and the movement in the Z direction can make the probe module 60 contact with the first test point group 40 to perform the test. In this embodiment, the motion module 70 moves in the X direction and the Y direction first, and then moves in the Z direction after reaching the target coordinate position. After the test is completed, the motion module 70 moves in the Z direction to keep away from the first The circuit board 10 and the second circuit board 20 move in the X direction and the Y direction after reaching the preset height.

分析模块,设置于壳体80中,与所述探针模块60连接,用于获取所述第一电阻,并根据所述第一电阻获取所述第一绑定状态。具体地,分析模块通过比较第一电阻和电阻阈值即可获取第一绑定状态。The analysis module is disposed in the housing 80 and is connected to the probe module 60 for obtaining the first resistance and obtaining the first binding state according to the first resistance. Specifically, the analysis module can obtain the first binding state by comparing the first resistance and the resistance threshold.

在其中一个实施例中,所述第一绑定状态包括多个状态等级,所述分析模块配置有多个电阻阈值,所述电阻阈值与所述状态等级一一对应,所述分析模块用于根据所述第一电阻和多个所述电阻阈值确定所述第一绑定状态的状态等级。示例性地,多个电阻阈值例如为0.1Ω、1Ω和5Ω,当第一电阻小于0.1Ω时,则判定第一绑定状态为第一等级;当第一电阻大于或等于0.1Ω且小于1Ω时,则判定第一绑定状态为第二等级;当第一电阻大于或等于1Ω且小于5Ω时,则判定第一绑定状态为第三等级;当第一电阻大于或等于5Ω时,则判定第一绑定状态为第四等级。在本实施例中,根据第一电阻对第一绑定状态进行分级,可以更加准确地评价第一绑定状态。进一步地,也可以通过相似的方法对第二绑定状态进行分级,从而进行更加准确的评价。In one embodiment, the first binding state includes a plurality of state levels, the analysis module is configured with a plurality of resistance thresholds, the resistance thresholds correspond to the state levels one-to-one, and the analysis module is configured to A state level of the first binding state is determined based on the first resistance and a plurality of the resistance thresholds. Exemplarily, the multiple resistance thresholds are, for example, 0.1Ω, 1Ω, and 5Ω. When the first resistance is less than 0.1Ω, it is determined that the first binding state is the first level; when the first resistance is greater than or equal to 0.1Ω and less than 1Ω , the first binding state is determined to be the second level; when the first resistance is greater than or equal to 1Ω and less than 5Ω, the first binding state is determined to be the third level; when the first resistance is greater than or equal to 5Ω, then It is determined that the first binding state is the fourth level. In this embodiment, the first binding state is graded according to the first resistance, so that the first binding state can be more accurately evaluated. Further, the second binding state can also be graded by a similar method, so as to perform a more accurate evaluation.

以上所述实施例的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施例中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity, all possible combinations of the technical features in the above-described embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be regarded as the scope described in this specification.

以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。The above-mentioned embodiments only represent several embodiments of the present invention, and the descriptions thereof are specific and detailed, but should not be construed as a limitation on the scope of the invention patent. It should be pointed out that for those skilled in the art, without departing from the concept of the present invention, several modifications and improvements can be made, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the appended claims.

Claims (10)

1. A test structure, comprising:
the first connecting part is arranged on the first circuit board;
the second connecting part is arranged on a second circuit board and corresponds to the first connecting part in position so as to be connected with the first connecting part after the first circuit board and the second circuit board are bound;
the first test point group is connected with the first connecting part or the second connecting part and used for connecting test equipment so as to obtain a first binding state between the first circuit board and the second circuit board.
2. The test structure of claim 1, further comprising:
the third connecting part is arranged on a third circuit board and corresponds to the second connecting part in position, so that the third circuit board is connected with one end, away from the first connecting part, of the second connecting part after being bound with the second circuit board;
and the second test point group is connected with one of the first connecting part, the second connecting part and the third connecting part, and is used for connecting the test equipment to acquire a second binding state between the third circuit board and the second circuit board.
3. The test structure of claim 2, wherein the first connection portion comprises a first connection line and a second connection line, and the second connection portion is configured to conduct the first connection line and the second connection line after the first circuit board and the second circuit board are bound;
the first test point group comprises a first test point and a second test point, the first test point is connected with the first connecting line, the second test point is connected with the second connecting line, and the first test point and the second test point are jointly used for connecting the test equipment.
4. The test structure of claim 3, wherein the first connection portion further comprises a third connection line, and the third connection portion is configured to conduct the second connection line and the third connection line via the second connection portion after the first circuit board and the second circuit board are bound;
the second test point group and the first test point group share the second test point, the second test point group further comprises a third test point, the third test point is connected with the third connecting line, and the second test point and the third test point are jointly used for connecting the test equipment.
5. The test structure of claim 2, wherein the first set of test points and the second set of test points are both disposed on the first circuit board.
6. The test structure according to claim 1, wherein the first connection portion and the second connection portion are formed with a first connection area at a connection, the first connection area being an overlapping area of the first connection portion and the second connection portion in a direction perpendicular to the first circuit board, the first connection area corresponding to the first bound state.
7. The test structure of claim 1, wherein the first connection portion and the second connection portion are formed with a first resistance at the connection, the first resistance corresponding to the first binding state.
8. A test system, comprising:
a first circuit board;
a second circuit board;
the test structure of any one of claims 1 to 7;
and the test equipment is connected with the test structure and used for testing a first binding state between the first circuit board and the second circuit board.
9. The test system of claim 8, wherein the test equipment comprises:
the probe module is used for connecting the first test point group so as to test a first resistor between the first connecting part and the second connecting part;
the movement module is connected with the probe module and used for driving the probe module to move so as to enable the probe module to be connected to the first test point group;
and the analysis module is connected with the probe module and used for acquiring the first resistance and acquiring the first binding state according to the first resistance.
10. The test system of claim 9, wherein the first binding state comprises a plurality of state levels, wherein the analysis module is configured with a plurality of resistance thresholds, wherein the resistance thresholds correspond to the state levels one-to-one, and wherein the analysis module is configured to determine the state level of the first binding state based on the first resistance and the plurality of resistance thresholds.
CN202010877242.4A 2020-08-27 2020-08-27 Test structures and test systems Pending CN112147543A (en)

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