CN112147543A - Test structure and test system - Google Patents
Test structure and test system Download PDFInfo
- Publication number
- CN112147543A CN112147543A CN202010877242.4A CN202010877242A CN112147543A CN 112147543 A CN112147543 A CN 112147543A CN 202010877242 A CN202010877242 A CN 202010877242A CN 112147543 A CN112147543 A CN 112147543A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- test
- connection
- test point
- connecting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 209
- 239000000523 sample Substances 0.000 claims description 22
- 238000004458 analytical method Methods 0.000 claims description 13
- 238000010586 diagram Methods 0.000 description 27
- 238000000034 method Methods 0.000 description 8
- 238000001514 detection method Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention relates to a test structure and a test system, the test structure comprising: the first connecting part is arranged on the first circuit board; the second connecting part is arranged on a second circuit board and corresponds to the first connecting part in position so as to be connected with the first connecting part after the first circuit board and the second circuit board are bound; the first test point group is connected with the first connecting part or the second connecting part and used for connecting test equipment so as to obtain a first binding state between the first circuit board and the second circuit board. By arranging the first test point group, the test equipment can acquire the electrical performance parameters after the first connecting part and the second connecting part are connected, and can acquire the coincidence area between the first connecting part and the second connecting part according to the electrical performance parameters, so that the first binding state can be accurately acquired according to the coincidence area, and a test structure with accurate test results is provided.
Description
Technical Field
The invention relates to the technical field of display, in particular to a test structure and a test system.
Background
In the field of display technology, it is generally required to realize electrical connection between a Flexible Printed Circuit board (FPC) and a glass or hard Circuit board structure through an Anisotropic Conductive Film (ACF). Further, the anisotropic conductive paste connects the flexible printed circuit board and other structures together through a bonding process.
The accuracy of the binding process directly determines the display quality and reliability of the display device, and therefore, the binding result needs to be detected after the binding process so as to screen out products which are unqualified to be bound, repair in time and improve the binding quality.
Currently, a commonly used binding detection means is Automatic Optical Inspection (AOI) or manual detection, and Automatic optical Inspection is a means for detecting a binding result based on an optical principle, so that if a detected optical environment changes or characteristics such as optical transmittance of a bound structure change, a detection result error is easily caused, and thus a production yield of display equipment is affected, and therefore, the detection means of the existing binding process cannot meet the requirement of accuracy of a test.
Disclosure of Invention
Therefore, it is necessary to provide a test structure and a test system for solving the problem of insufficient accuracy of the detection means of the existing bonding process.
A test structure, comprising:
the first connecting part is arranged on the first circuit board;
the second connecting part is arranged on a second circuit board and corresponds to the first connecting part in position so as to be connected with the first connecting part after the first circuit board and the second circuit board are bound;
the first test point group is connected with the first connecting part or the second connecting part and used for connecting test equipment so as to obtain a first binding state between the first circuit board and the second circuit board.
In one embodiment, the method further comprises the following steps:
the third connecting part is arranged on a third circuit board and corresponds to the second connecting part in position, so that the third circuit board is connected with one end, away from the first connecting part, of the second connecting part after being bound with the second circuit board;
and the second test point group is connected with one of the first connecting part, the second connecting part and the third connecting part, and is used for connecting the test equipment to acquire a second binding state between the third circuit board and the second circuit board.
In one embodiment, the first connection portion includes a first connection line and a second connection line, and the second connection portion is configured to conduct the first connection line and the second connection line after the first circuit board and the second circuit board are bound;
the first test point group comprises a first test point and a second test point, the first test point is connected with the first connecting line, the second test point is connected with the second connecting line, and the first test point and the second test point are jointly used for connecting the test equipment.
In one embodiment, the first connection portion further includes a third connection line, and the third connection portion is configured to conduct the second connection line and the third connection line through the second connection portion after the first circuit board and the second circuit board are bound;
the second test point group and the first test point group share the second test point, the second test point group further comprises a third test point, the third test point is connected with the third connecting line, and the second test point and the third test point are jointly used for connecting the test equipment.
In one embodiment, the first test point group and the second test point group are both disposed on the first circuit board.
In one embodiment, a first connection area is formed at a connection position of the first connection portion and the second connection portion, the first connection area is an overlapped area of the first connection portion and the second connection portion in a direction perpendicular to the first circuit board, and the first connection area corresponds to the first binding state.
In one embodiment, the first connection portion and the second connection portion are formed with a first resistance at a connection, the first resistance corresponding to the first binding state.
A test system, comprising:
a first circuit board;
a second circuit board;
a test structure as described above;
and the test equipment is connected with the test structure and used for testing a first binding state between the first circuit board and the second circuit board.
In one embodiment, the test apparatus includes:
the probe module is used for connecting the first test point group so as to test a first resistor between the first connecting part and the second connecting part;
the movement module is connected with the probe module and used for driving the probe module to move so as to enable the probe module to be connected to the first test point group;
and the analysis module is connected with the probe module and used for acquiring the first resistance and acquiring the first binding state according to the first resistance.
In one embodiment, the first binding state includes a plurality of state levels, the analysis module is configured with a plurality of resistance thresholds, the resistance thresholds correspond to the state levels one to one, and the analysis module is configured to determine the state level of the first binding state according to the first resistance and the plurality of resistance thresholds.
The test structure comprises: the first connecting part is arranged on the first circuit board; the second connecting part is arranged on a second circuit board and corresponds to the first connecting part in position so as to be connected with the first connecting part after the first circuit board and the second circuit board are bound; the first test point group is connected with the first connecting part or the second connecting part and used for connecting test equipment so as to obtain a first binding state between the first circuit board and the second circuit board. By arranging the first test point group, the test equipment can acquire the electrical performance parameters after the first connecting part and the second connecting part are connected, and can acquire the coincidence area between the first connecting part and the second connecting part according to the electrical performance parameters, so that the first binding state can be accurately acquired according to the coincidence area, and a test structure with accurate test results is provided.
Drawings
Fig. 1 is a schematic structural diagram of a first connection portion according to an embodiment;
FIG. 2 is a schematic structural diagram of a second connecting portion according to an embodiment;
FIG. 3 is a schematic structural diagram of the first circuit board of FIG. 1 and the second circuit board of FIG. 2 after being bound together;
FIG. 4 is a schematic illustration of a binding failure of a first circuit board and a second circuit board;
FIG. 5 is a schematic structural diagram of a test structure according to another embodiment;
FIG. 6 is a schematic illustration of a binding failure of another first circuit board and a second circuit board;
FIG. 7 is a schematic structural diagram of a third connecting portion according to an embodiment;
FIG. 8 is a schematic diagram of the third circuit board of FIG. 7 bonded to the second circuit board of FIG. 2;
FIG. 9 is a schematic structural diagram of a first connecting portion according to another embodiment;
FIG. 10 is a schematic structural diagram of a second connecting portion according to another embodiment;
FIG. 11 is a schematic structural diagram of a third connecting portion according to another embodiment;
FIG. 12 is a schematic structural diagram of a first circuit board, a second circuit board, and a third circuit board after being bonded according to an embodiment;
FIG. 13 is an equivalent circuit diagram of the test structure of the embodiment of FIG. 12;
FIG. 14 is a schematic structural diagram of a test structure according to yet another embodiment;
FIG. 15 is a block diagram of a test system according to an embodiment.
Element number description:
a first circuit board: 10; a first connection portion: 100, respectively; a first connection line: 110; a second connecting line: 120 of a solvent; a third connecting line: 130, 130; a second circuit board: 20; a second connection portion: 200 of a carrier; a fourth connecting line: 210; a fifth connecting line: 220, 220; a third circuit board: 30, of a nitrogen-containing gas; a third connecting part: 300, respectively; a sixth connecting line: 310; a first test point group: 40; a second test point group: 50; a probe module: 60, adding a solvent to the mixture; a motion module: 70; a housing: 80
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on methods or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
The embodiment of the present application provides a test structure, and in this embodiment, the test structure includes a first connection portion 100, a second connection portion 200, and a first test point group 40.
The first connection portion 100 is disposed on the first circuit board 10. Fig. 1 is a schematic structural diagram of a first connection portion 100 according to an embodiment, referring to fig. 1, the first connection portion 100 covers a portion of a surface of a first circuit board 10, and the first connection portion 100 is located on a surface of a side to be bonded of the first circuit board 10, that is, a side to be bonded with an anisotropic conductive adhesive of the first circuit board 10. For example, the first circuit board 10 has a first surface and a second surface opposite to each other, and if the first surface of the first circuit board 10 faces the second circuit board 20 after the first circuit board 10 and the second circuit board 20 are bound, the first connection portion 100 is disposed on the first surface of the first circuit board 10. The first circuit board 10 may be a flexible printed circuit board.
And a second connection part 200 disposed on the second circuit board 20 and corresponding to the first connection part 100 in position, so as to be connected to the first connection part 100 after the first circuit board 10 and the second circuit board 20 are bound. Fig. 2 is a schematic structural diagram of a second connection portion 200 according to an embodiment, and referring to fig. 2, the second connection portion 200 covers a portion of a surface of the second circuit board 20, and at least one side of the second circuit board 20 to be bonded to the first circuit board 10 is provided with the second connection portion 200. The second circuit board 20 may be a hard circuit board.
Further, a first connection area is formed at a connection position of the first connection portion 100 and the second connection portion 200, the first connection area is an overlapping area of the first connection portion 100 and the second connection portion 200 in a direction perpendicular to the first circuit board 10, and the first connection area corresponds to the first binding state. Fig. 3 is a schematic structural diagram of the first circuit board 10 in fig. 1 and the second circuit board 20 in fig. 2 after being bound, referring to fig. 3, the first circuit board 10 and the second circuit board 20 are arranged in parallel and bound, after the first circuit board 10 and the second circuit board 20 are bound, the first connection portion 100 and the second connection portion 200 are overlapped in a direction perpendicular to the surface of the first circuit board 10, and the overlapping area can effectively reflect a first binding state between the first circuit board 10 and the second circuit board 20, where the first binding state may include, for example, valid and invalid. Specifically, when the overlapping area satisfies a preset condition, for example, as shown in fig. 3, it may be considered that the first circuit board 10 and the second circuit board 20 are effectively bonded, that is, the display quality and the reliability of the display device are not affected, otherwise, as shown in fig. 4, it may be considered that the first circuit board 10 and the second circuit board 20 are inefficiently bonded, which may cause the display quality or the reliability of the display device to be reduced.
The first test point group 40 is connected to the first connection portion 100 or the second connection portion 200, and the first test point group 40 is used for connecting a test device to obtain a first binding state between the first circuit board 10 and the second circuit board 20. In this embodiment, the first connection portion 100 and the second connection portion 200 are both conductive structures, and the test equipment tests connection performance of the first connection portion 100 and the second connection portion 200 through the first test point group 40, specifically, the test equipment tests electrical performance parameters at a connection position of the first connection portion 100 and the second connection portion 200. Wherein, the testing equipment can transmit an electrical signal to the first testing point group 40 to obtain the electrical performance parameter at the connection of the first connection portion 100 and the second connection portion 200. Illustratively, the electrical performance parameter may be, but is not limited to, resistance, capacitance, inductance, current, and the like.
It is understood that as the overlapping area of the first connection portion 100 and the second connection portion 200 changes, the electrical performance of the connection portion inevitably changes, and the electrical performance parameters are less affected by environmental factors than in a test method based on an optical principle. Therefore, based on the test structure of the present embodiment, the connection condition of the first connection portion 100 and the second connection portion 200 can be more accurately obtained, so as to more accurately evaluate the binding effect of the first circuit board 10 and the second circuit board 20, such as whether a position deviation between the first circuit board 10 and the second circuit board 20 occurs during binding, or whether the crimping force during crimping of the anisotropic conductive adhesive is sufficient to form a stable connection between the first circuit board 10 and the second circuit board 20.
In this embodiment, the test structure includes: a first connection portion 100 disposed on the first circuit board 10; a second connection part 200 disposed on a second circuit board 20 corresponding to the first connection part 100 in position to be connected to the first connection part 100 after the first circuit board 10 and the second circuit board 20 are bound; the first test point group 40 is connected to the first connection portion 100 or the second connection portion 200, and the first test point group 40 is used for connecting a test device to obtain a first binding state between the first circuit board 10 and the second circuit board 20. By setting the first test point group 40, the test equipment can acquire the electrical performance parameters after the first connection portion 100 is connected with the second connection portion 200, and can acquire the overlapping area between the first connection portion 100 and the second connection portion 200 according to the electrical performance parameters, so that the first binding state can be accurately acquired according to the overlapping area, and a test structure with an accurate test result is provided.
Fig. 5 is a schematic structural diagram of a test structure according to another embodiment, and referring to fig. 5, in this embodiment, two first connection portions 100 are formed on a first circuit board 10, two second connection portions 200 are formed at corresponding positions on a second circuit board 20, and the first connection portions 100 and the second connection portions 200 are connected in a one-to-one correspondence manner after being bound, that is, the corresponding first connection portions 100 and the corresponding second connection portions 200 correspond in position, and sizes of the corresponding first connection portions 100 and the corresponding second connection portions 200 are also matched.
When the first circuit board 10 and the second circuit board 20 are bonded, one first connection portion 100 coincides with one second connection portion 200, and the other first connection portion 100 coincides with the other second connection portion 200, and when a test is performed by a test apparatus, electrical performance parameters at the connection point of each pair of the first connection portion 100 and the second connection portion 200 are respectively tested. Fig. 6 is a schematic diagram showing a binding failure of the first circuit board 10 and the second circuit board 20, and referring to fig. 6, it can be understood that when the first circuit board 10 and the second circuit board 20 are bound, there is a risk of inclination occurring, so that a partial area of the first circuit board 10 and the second circuit board 20 is effectively bound as shown in the left side of fig. 6, but another partial area of the first circuit board 10 and the second circuit board 20 is inefficiently bound as shown in the right side of fig. 6. Therefore, in the present embodiment, by providing two pairs of the first connection portion 100 and the second connection portion 200, the situation of the inclination occurring during the binding can be more effectively identified, so as to improve the detection accuracy of the test structure.
Further, the distance between the centers of the two first connection parts 100 is the same as the distance between the centers of the two second connection parts 200, and the distance between the centers matches the size of the circuit board, that is, the distance between the centers of the two first connection parts 100 matches the size of the first circuit board 10 and/or the second circuit board 20, and the distance between the centers of the two second connection parts 200 also matches the size of the first circuit board 10 and/or the second circuit board 20. For example, if the length of the second circuit board 20 is 5cm, a distance between centers of the two first connection portions 100 may be set to be 4cm, and a distance between centers of the two second connection portions 200 may also be set to be 4cm, where an arrangement direction of the first circuit board 10 and the second circuit board 20 after being bound is defined as a first direction, a second direction is perpendicular to the first direction, and the length of the second circuit board 20 refers to a dimension of the second circuit board 20 in the second direction. In this embodiment, the distance between the centers of the two first connecting portions 100 is matched with the size of the circuit board, and the distance between the centers of the two second connecting portions 200 is matched with the size of the circuit board, so that the problem that the test result is inaccurate due to the excessively small center distance can be avoided, and a test structure with a more accurate test result is provided.
In other embodiments, three or more first connection portions 100 may be disposed on the first circuit board 10, and the number of the second connection portions 200 on the second circuit board 20 is the same as that of the first connection portions 100, so that the positions of the first connection portions 100 and the positions of the second connection portions 200 are in one-to-one correspondence, thereby further improving the accuracy of the test structure. It can be understood that providing a plurality of first and second connection portions 100 and 200 increases the test cost of the test structure, and thus, an appropriate number of first and second connection portions 100 and 200 can be selected according to the test accuracy requirements and the size of the circuit board. When three or more first connection portions 100 are provided on the first circuit board 10, the plurality of first connection portions 100 may be arranged at equal intervals in the second direction.
In another embodiment, the test structure further comprises a third connection portion 300 and a second test point group 50.
Fig. 7 is a schematic structural diagram of a third connecting portion 300 according to an embodiment, fig. 8 is a schematic structural diagram of the third circuit board 30 of fig. 7 and the second circuit board 20 of fig. 2 after being bound, referring to fig. 7, the third connecting portion 300 is disposed on the third circuit board 30 and corresponds to the second connecting portion 200, so that after the third circuit board 30 and the second circuit board 20 are bound, the third connecting portion is connected to one end of the second connecting portion 200, which is far away from the third connecting portion 300; and a second test point group 50 connected to one of the first connection portion 100, the second connection portion 200, and the third connection portion 300, wherein the second test point group 50 is used for connecting the test equipment to obtain a second binding state between the third circuit board 30 and the second circuit board 20. Exemplarily, the third circuit board 30 may be a glass substrate 30 of the display device.
Referring to fig. 8, the second circuit board 20 and the third circuit board 30 are arranged in parallel and bound, after the third circuit board 30 and the second circuit board 20 are bound, the second connection portion 200 and the third connection portion 300 are overlapped in a direction perpendicular to the surface of the third circuit board 30, and the overlapping area can effectively reflect a second binding state between the third circuit board 30 and the second circuit board 20, where the second binding state may include, for example, valid and invalid. Specifically, when the overlapping area satisfies the preset condition, it may be considered that the third circuit board 30 and the second circuit board 20 are effectively bound, that is, the display quality and the reliability of the display device are not affected, otherwise, it may be considered that the third circuit board 30 and the second circuit board 20 are inefficiently bound, which may cause the display quality or the reliability of the display device to be reduced.
Fig. 9 is a schematic structural diagram of a first connection portion 100 of another embodiment, and referring to fig. 9, in this embodiment, the first connection portion 100 includes a first connection line 110 and a second connection line 120, and the second connection portion 200 is used for conducting the first connection line 110 and the second connection line 120 after the first circuit board 10 and the second circuit board 20 are bound; the first test point group 40 includes a first test point and a second test point, the first test point is connected to the first connection line 110, the second test point is connected to the second connection line 120, and the first test point and the second test point are commonly used for connecting the test equipment. The first connection line 110 is electrically isolated from the second connection line 120. In the present embodiment, the first test point and the second test point are both disposed on the first circuit board 10. Further, a first resistor is formed at a connection position of the first connection portion 100 and the second connection portion 200, the first resistor corresponds to the first binding state, and the test device is a resistance test device.
Fig. 10 is a schematic structural diagram of a second connection portion 200 according to another embodiment, and referring to fig. 10, in the present embodiment, the second connection portion 200 includes a fourth connection line 210, and the shape and position of the fourth connection line 210 correspond to the first connection line 110 and the second connection line 120. Referring to fig. 9 and 10, when the first circuit board 10 and the second circuit board 20 are not bonded, the first connection portion 100 is disconnected from the second connection portion 200, the first connection line 110 is disconnected from the second connection line 120, and when the resistance test device is used to lap-joint the first circuit board and the second circuit board, the tested resistance is infinite; when the first circuit board 10 and the second circuit board 20 are bound ineffectively, the first connection portion 100 is connected with the second connection portion 200, but the connection area is small, the fourth connection line 210 conducts the first connection line 110 and the second connection line 120, when resistance testing equipment is adopted to be lapped on the first test point and the second test point, the tested resistance is greater than or equal to a resistance threshold value, and then the risk of influencing the display quality and the reliability exists; when the first circuit board 10 and the second circuit board 20 are effectively bonded, the first connection portion 100 is connected to the second connection portion 200, and the connection area is large, and the fourth connection line 210 connects the first connection line 110 and the second connection line 120, when the resistance test device is used for overlapping the first test point and the second test point, the tested resistance is smaller than the resistance threshold, and the display device has better display quality and reliability. Therefore, the present embodiment can effectively and accurately evaluate the first binding state between the first circuit board 10 and the second circuit board 20 by providing the first connection line 110 and the second connection line 120.
In one embodiment, with continued reference to fig. 9, the first connecting portion 100 further includes a third connecting line 130, and the third connecting portion 300 is configured to conduct the second connecting line 120 and the third connecting line 130 through the second connecting portion 200 after the first circuit board 10 and the second circuit board 20 are bound; the second test point group 50 and the first test point group 40 share the second test point, the second test point group 50 further includes a third test point, the third test point is connected to the third connecting line 130, and the second test point and the third test point are used together to connect the test equipment. Fig. 11 is a schematic structural diagram of a third connecting portion 300 according to another embodiment, referring to fig. 11, the third connecting portion 300 includes a sixth connecting line 310, and the position of the sixth connecting line 310 corresponds to the fourth connecting line 210 and the fifth connecting line 220.
Fig. 12 is a schematic structural diagram of the first circuit board 10, the second circuit board 20, and the third circuit board 30 after being bonded according to an embodiment, referring to fig. 12, in this embodiment, a contact resistor is formed at a connection point of every two connection lines, specifically, a resistor R1 is formed between the first connection line 110 and the fourth connection line 210, a resistor R1 is formed between the first connection line 110 and the fourth connection line 210, a resistor R3 is formed between the third connection line 130 and the fifth connection line 220, a resistor R4 is formed between the fourth connection line 210 and the sixth connection line 310, and a resistor R5 is formed between the fifth connection line 220 and the sixth connection line 310. Fig. 13 is an equivalent circuit diagram of the test structure of the embodiment of fig. 12, and it can be understood that the contact resistances R1 to R5 change in real time with the change of the overlapping area, so as to accurately reflect the first binding state between the first circuit board 10 and the second circuit board 20 and the second binding state between the second circuit board 20 and the third circuit board 30.
In one embodiment, the first test point group 40 and the second test point group 50 are disposed on the first circuit board 10. In this embodiment, the first circuit board 10 is a hard circuit board, and the hard circuit board is not easy to deform and damage, and the deformation and damage can lead to the resistance of the test structure becoming large, thereby affecting the test accuracy of the test structure, therefore, in this embodiment, by setting the first test point group 40 and the second test point group 50 on the first circuit board 10, the circuit board can not be damaged, thereby improving the reliability of the test structure.
In other embodiments, if a flexible printed circuit board with a hard material is used, the first test point group 40 and/or the second test point group 50 may be disposed on the second circuit board 20. For example, fig. 14 is a schematic structural diagram of a test structure according to yet another embodiment, and referring to fig. 14, in this embodiment, a first test point group 40(T2 and T3) is disposed on a first circuit board 10, and a second test point group 50(T4 and T5) is disposed on a second circuit board 20, and by disposing the second circuit board 20 which is made of a harder material, the number of wirings can be further reduced, thereby reducing the production cost and difficulty. In the test, the resistance values of R2 and R3 may be obtained through the first test point group 40(T2 and T3) to obtain a first binding state between the first circuit board 10 and the second circuit board 20, and the resistance values of R4 and R5 may be obtained through the second test point group 50(T4 and T5) to obtain a second binding state between the second circuit board 20 and the third circuit board 30.
In one embodiment, a test system is further provided, which includes a first circuit board 10, a second circuit board 20, a test structure as described above, and a test device connected to the test structure for testing a first binding state between the first circuit board 10 and the second circuit board 20. Specifically, the first circuit board 10, the second circuit board 20 and the test structure refer to the embodiment shown in fig. 3. Fig. 15 is a schematic structural diagram of a test system according to an embodiment, and referring to fig. 15, the bonded first circuit board 10 and second circuit board 20 are placed on a test apparatus for testing, so as to obtain a first bonding state between the first circuit board 10 and second circuit board 20.
In one embodiment, with continued reference to FIG. 15, the test equipment includes a probe module 60, a motion module 70, and an analysis module.
The probe module 60 is used to connect the first test point group 40 to test a first resistance between the first connection portion 100 and the second connection portion 200. Specifically, one end of the probe module 60 is fixedly connected to the moving module 70, so as to move to the target test position under the driving of the moving module 70, the other end of the probe module 60 is used for connecting the first test point group 40, so as to test the first resistor, and further, the probe module 60 is further used for sending the first resistor obtained by the test to the analysis module, so as to perform analysis.
And a moving module 70 connected to the probe module 60, for driving the probe module 60 to move, so that the probe module 60 is connected to the first test point group 40. Specifically, the motion module 70 is connected to the housing 80 and may perform a motion, and illustratively, the motion module 70 may perform a three-axis motion, i.e., an X direction, a Y direction, and a Z direction, where the X direction and the Y direction may move the probe module 60 to a coordinate position of the first test point group 40, and the Z direction may contact the probe module 60 with the first test point group 40, thereby performing a test. In this embodiment, the movement module 70 first performs the movement in the X direction and the Y direction, and performs the movement in the Z direction after reaching the target coordinate position, and after the test is completed, the movement module 70 performs the movement in the Z direction to be away from the first circuit board 10 and the second circuit board 20, and after reaching the preset height, performs the movement in the X direction and the Y direction.
And the analysis module is arranged in the shell 80, connected with the probe module 60, and used for acquiring the first resistance and acquiring the first binding state according to the first resistance. Specifically, the analysis module may obtain the first binding state by comparing the first resistance to a resistance threshold.
In one embodiment, the first binding state includes a plurality of state levels, the analysis module is configured with a plurality of resistance thresholds, the resistance thresholds correspond to the state levels one to one, and the analysis module is configured to determine the state level of the first binding state according to the first resistance and the plurality of resistance thresholds. Illustratively, the plurality of resistance thresholds are, for example, 0.1 Ω, 1 Ω, and 5 Ω, and when the first resistance is less than 0.1 Ω, the first binding state is determined to be a first level; when the first resistance is greater than or equal to 0.1 omega and less than 1 omega, the first binding state is judged to be a second level; when the first resistance is greater than or equal to 1 omega and less than 5 omega, the first binding state is judged to be a third level; when the first resistance is greater than or equal to 5 Ω, the first binding state is determined to be a fourth level. In this embodiment, the first binding state is graded according to the first resistance, and the first binding state can be evaluated more accurately. Further, the second binding state may also be ranked by a similar method, thereby performing more accurate evaluation.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A test structure, comprising:
the first connecting part is arranged on the first circuit board;
the second connecting part is arranged on a second circuit board and corresponds to the first connecting part in position so as to be connected with the first connecting part after the first circuit board and the second circuit board are bound;
the first test point group is connected with the first connecting part or the second connecting part and used for connecting test equipment so as to obtain a first binding state between the first circuit board and the second circuit board.
2. The test structure of claim 1, further comprising:
the third connecting part is arranged on a third circuit board and corresponds to the second connecting part in position, so that the third circuit board is connected with one end, away from the first connecting part, of the second connecting part after being bound with the second circuit board;
and the second test point group is connected with one of the first connecting part, the second connecting part and the third connecting part, and is used for connecting the test equipment to acquire a second binding state between the third circuit board and the second circuit board.
3. The test structure of claim 2, wherein the first connection portion comprises a first connection line and a second connection line, and the second connection portion is configured to conduct the first connection line and the second connection line after the first circuit board and the second circuit board are bound;
the first test point group comprises a first test point and a second test point, the first test point is connected with the first connecting line, the second test point is connected with the second connecting line, and the first test point and the second test point are jointly used for connecting the test equipment.
4. The test structure of claim 3, wherein the first connection portion further comprises a third connection line, and the third connection portion is configured to conduct the second connection line and the third connection line via the second connection portion after the first circuit board and the second circuit board are bound;
the second test point group and the first test point group share the second test point, the second test point group further comprises a third test point, the third test point is connected with the third connecting line, and the second test point and the third test point are jointly used for connecting the test equipment.
5. The test structure of claim 2, wherein the first set of test points and the second set of test points are both disposed on the first circuit board.
6. The test structure according to claim 1, wherein the first connection portion and the second connection portion are formed with a first connection area at a connection, the first connection area being an overlapping area of the first connection portion and the second connection portion in a direction perpendicular to the first circuit board, the first connection area corresponding to the first bound state.
7. The test structure of claim 1, wherein the first connection portion and the second connection portion are formed with a first resistance at the connection, the first resistance corresponding to the first binding state.
8. A test system, comprising:
a first circuit board;
a second circuit board;
the test structure of any one of claims 1 to 7;
and the test equipment is connected with the test structure and used for testing a first binding state between the first circuit board and the second circuit board.
9. The test system of claim 8, wherein the test equipment comprises:
the probe module is used for connecting the first test point group so as to test a first resistor between the first connecting part and the second connecting part;
the movement module is connected with the probe module and used for driving the probe module to move so as to enable the probe module to be connected to the first test point group;
and the analysis module is connected with the probe module and used for acquiring the first resistance and acquiring the first binding state according to the first resistance.
10. The test system of claim 9, wherein the first binding state comprises a plurality of state levels, wherein the analysis module is configured with a plurality of resistance thresholds, wherein the resistance thresholds correspond to the state levels one-to-one, and wherein the analysis module is configured to determine the state level of the first binding state based on the first resistance and the plurality of resistance thresholds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010877242.4A CN112147543A (en) | 2020-08-27 | 2020-08-27 | Test structure and test system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010877242.4A CN112147543A (en) | 2020-08-27 | 2020-08-27 | Test structure and test system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112147543A true CN112147543A (en) | 2020-12-29 |
Family
ID=73889104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010877242.4A Pending CN112147543A (en) | 2020-08-27 | 2020-08-27 | Test structure and test system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112147543A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105403826A (en) * | 2016-01-04 | 2016-03-16 | 京东方科技集团股份有限公司 | Test tool |
| CN105632382A (en) * | 2016-01-04 | 2016-06-01 | 京东方科技集团股份有限公司 | Display device and method for detecting binding condition of binding area |
| CN105842608A (en) * | 2016-03-24 | 2016-08-10 | 深圳市科美集成电路有限公司 | Circuit board testing jig and circuit board testing system |
| US20170052216A1 (en) * | 2015-08-19 | 2017-02-23 | Tektronix, Inc. | Test and measurement probe with adjustable test point contact |
| CN107015137A (en) * | 2017-05-26 | 2017-08-04 | 深圳市赛伦北斗科技有限责任公司 | A kind of circuit board detection device, system and method |
| CN206609925U (en) * | 2017-02-24 | 2017-11-03 | 河源市星通时频电子有限公司 | A kind of quartz wafer electrical characteristics test tool |
| CN108956703A (en) * | 2018-07-17 | 2018-12-07 | 深圳市国威科创新能源科技有限公司 | A kind of detection device and its detection method of welding quality |
| CN111123170A (en) * | 2019-12-20 | 2020-05-08 | 上海视欧光电科技有限公司 | Display module assembly, binding test device of display module assembly and binding device |
-
2020
- 2020-08-27 CN CN202010877242.4A patent/CN112147543A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170052216A1 (en) * | 2015-08-19 | 2017-02-23 | Tektronix, Inc. | Test and measurement probe with adjustable test point contact |
| CN105403826A (en) * | 2016-01-04 | 2016-03-16 | 京东方科技集团股份有限公司 | Test tool |
| CN105632382A (en) * | 2016-01-04 | 2016-06-01 | 京东方科技集团股份有限公司 | Display device and method for detecting binding condition of binding area |
| CN105842608A (en) * | 2016-03-24 | 2016-08-10 | 深圳市科美集成电路有限公司 | Circuit board testing jig and circuit board testing system |
| CN206609925U (en) * | 2017-02-24 | 2017-11-03 | 河源市星通时频电子有限公司 | A kind of quartz wafer electrical characteristics test tool |
| CN107015137A (en) * | 2017-05-26 | 2017-08-04 | 深圳市赛伦北斗科技有限责任公司 | A kind of circuit board detection device, system and method |
| CN108956703A (en) * | 2018-07-17 | 2018-12-07 | 深圳市国威科创新能源科技有限公司 | A kind of detection device and its detection method of welding quality |
| CN111123170A (en) * | 2019-12-20 | 2020-05-08 | 上海视欧光电科技有限公司 | Display module assembly, binding test device of display module assembly and binding device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7847567B2 (en) | Verifying a printed circuit board manufacturing process prior to electrical intercoupling | |
| US5268645A (en) | Method of and apparatus for testing circuit boards and the like with an inhomogeneous electric field | |
| US8049511B2 (en) | Method of detecting faulty via holes in printed circuit boards | |
| CN103063677A (en) | Multifunctional printed circuit board (PCB) test system | |
| CN112164359B (en) | Display device and detection method thereof | |
| CN112946536B (en) | Crimping detection device and detection method | |
| CN105705955B (en) | Electrical detection device | |
| CN114062840A (en) | Test device and test method for conduction of card connector of interface board of ATE (automatic test equipment) tester | |
| US10247772B2 (en) | Position calibration method, test circuit board, sample panel and position calibration apparatus | |
| CN202815137U (en) | Electrical connecting component | |
| EP0294925A2 (en) | Coplanarity testing device for surface mounted components | |
| CN112147543A (en) | Test structure and test system | |
| US20040040008A1 (en) | Determining via placement in the printed circuit board of a wireless test fixture | |
| CN103134438A (en) | Compound measurement jig | |
| CN108469583A (en) | ICT tester | |
| US4328264A (en) | Method for making apparatus for testing traces on a printed circuit board substrate | |
| CN1797012A (en) | Impedance measurement system and method | |
| US6563313B2 (en) | Electronic device and manufacturing method thereof | |
| US7082666B2 (en) | Method for testing print circuit boards | |
| CN212112226U (en) | Vehicle-mounted controller testing device | |
| CN116643154B (en) | Test system and test method for multilayer soft and hard combined circuit board | |
| CN111025130B (en) | SMT detection method for multilayer interconnected FPC | |
| KR101877253B1 (en) | Tape Automated Bonding Resistance Inspection System | |
| KR101428661B1 (en) | Apparatus for testing | |
| CN214375115U (en) | Testing device and system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20240204 Address after: 611731 No. 689, Hezuo Road, West District, hi tech Zone, Chengdu, Sichuan Applicant after: Interface Technology (Chengdu) Co., Ltd. Country or region after: China Applicant after: INTERFACE OPTOELECTRONICS (SHENZHEN) Co.,Ltd. Address before: No.75, Xinmei Road, Xinwu District, Wuxi City, Jiangsu Province Applicant before: Yicheng Photoelectric (Wuxi) Co.,Ltd. Country or region before: China |
|
| TA01 | Transfer of patent application right |