CN112147543A - Test structures and test systems - Google Patents

Abstract

The invention relates to a test structure and a test system. The test structure comprises: a first connection part, which is arranged on a first circuit board; a second connection part, which is arranged on the second circuit board and is connected to the first connection part. corresponding to the positions of the first circuit board and the second circuit board, so as to connect with the first connection part after the first circuit board and the second circuit board are bound; the first test point group is connected with the first connection part or the first connection part. The two connecting parts are connected, and the first test point group is used to connect a test device to obtain a first binding state between the first circuit board and the second circuit board. By setting the first test point group, the test equipment can obtain the electrical performance parameters after the first connecting part is connected with the second connecting part, and can obtain the overlapping area between the first connecting part and the second connecting part according to the electrical performance parameters, Therefore, the first binding state can be accurately obtained according to the overlapping area, that is, a test structure with accurate test results is provided.

Description

Test structures and test systems

technical field

The present invention relates to the field of display technology, in particular to a test structure and a test system.

Background technique

In the field of display technology, it is usually necessary to use anisotropic conductive film (ACF) to realize the electrical connection between flexible printed circuit board (Flexible Printed Circuit board, FPC for short) and glass, rigid circuit board and other structures . Further, the anisotropic conductive adhesive connects the flexible printed circuit board and other structures together through a bonding process.

The accuracy of the binding process directly determines the display quality and reliability of the display device. Therefore, it is necessary to test the binding results after the binding process to screen out unqualified products, so as to repair them in time and improve the Binding quality.

At present, the commonly used binding detection method is automatic optical inspection (Automatic Optic Inspection, AOI) or manual detection. Automatic optical inspection is a means of detecting binding results based on optical principles. Therefore, if the detected optical environment changes or is bound Changes in the optical transmittance and other characteristics of the fixed structure can easily lead to wrong test results, thereby affecting the production yield of the display device. Therefore, the existing detection methods of the bonding process can no longer meet the accuracy requirements of the test.

SUMMARY OF THE INVENTION

Based on this, it is necessary to provide a test structure and a test system to solve the problem of insufficient accuracy of the detection means of the existing binding process.

A test structure that includes:

the first connection part is arranged on the first circuit board;

A second connecting portion is disposed on the second circuit board and corresponds to the position of the first connecting portion, so as to be connected with the first circuit board after the first circuit board and the second circuit board are bound connection;

a first test point group, connected to the first connection part or the second connection part, the first test point group is used to connect a test device to obtain the first circuit board and the second circuit board The first binding state between.

In one embodiment, it also includes:

The third connection part is arranged on the third circuit board and corresponds to the position of the second connection part, so that after the third circuit board and the second circuit board are bound, they are connected to the second circuit board one end of the part away from the first connecting part is connected;

The second test point group is connected to one of the first connection part, the second connection part and the third connection part, and the second test point group is used to connect the test equipment to obtain all the the second binding state between the third circuit board and the second circuit board.

In one of the embodiments, the first connection part includes a first connection wire and a second connection wire, and the second connection part is used for, after the first circuit board and the second circuit board are bound, Conducting the first connection line and the second connection line;

The first test point group includes a first test point and a second test point, the first test point is connected with the first connection line, the second test point is connected with the second connection line, the The first test point and the second test point are jointly used to connect the test equipment.

In one embodiment, the first connection part further includes a third connection wire, and the third connection part is used for connecting the first circuit board and the second circuit board through the first circuit board after binding the second circuit board. two connecting parts conduct the second connecting line and the third connecting line;

The second test point group shares the second test point with the first test point group, the second test point group further includes a third test point, and the third test point is connected to the third connection line connection, the second test point and the third test point are jointly used to connect the test equipment.

In one embodiment, both the first test point group and the second test point group are disposed on the first circuit board.

In one of the embodiments, the first connection portion and the second connection portion are formed with a first connection area at the connection, and the first connection area is the first connection portion and the second connection portion In the overlapping area in the direction perpendicular to the first circuit board, the first connection area corresponds to the first binding state.

In one of the embodiments, a first resistance is formed at the connection between the first connection part and the second connection part, and the first resistance corresponds to the first binding state.

A test system including:

the first circuit board;

the second circuit board;

Test structure as above;

A test device, connected to the test structure, is used for testing the first bonding state between the first circuit board and the second circuit board.

In one embodiment, the test equipment includes:

a probe module for connecting the first test point group to test the first resistance between the first connection part and the second connection part;

a movement module, connected with the probe module, for driving the probe module to move, so that the probe module is connected to the first test point group;

An analysis module, connected to the probe module, for acquiring the first resistance, and acquiring the first binding state according to the first resistance.

In one embodiment, the first binding state includes a plurality of state levels, the analysis module is configured with a plurality of resistance thresholds, the resistance thresholds correspond to the state levels one-to-one, and the analysis module is configured to A state level of the first binding state is determined based on the first resistance and a plurality of the resistance thresholds.

The above-mentioned test structure includes: a first connection part, arranged on the first circuit board; a second connection part, arranged on the second circuit board, corresponding to the position of the first connection part, so as to connect the first circuit After the board is bound to the second circuit board, it is connected to the first connection part; the first test point group is connected to the first connection part or the second connection part, and the first test point group is connected to the first connection part or the second connection part. It is used to connect a test device to obtain the first binding state between the first circuit board and the second circuit board. By setting the first test point group, the test equipment can obtain the electrical performance parameters after the first connection part and the second connection part are connected, and can obtain the overlapping area between the first connection part and the second connection part according to the electrical performance parameters, Therefore, the first binding state can be accurately obtained according to the overlapping area, that is, a test structure with accurate test results is provided.

Description of drawings

FIG. 1 is a schematic structural diagram of a first connecting portion according to an embodiment;

2 is a schematic structural diagram of a second connecting portion of an embodiment;

FIG. 3 is a schematic structural diagram of the first circuit board of FIG. 1 and the second circuit board of FIG. 2 after binding;

4 is a schematic diagram of a first circuit board and a second circuit board binding failure;

5 is a schematic structural diagram of a test structure of another embodiment;

6 is a schematic diagram of another first circuit board and a second circuit board binding failure;

7 is a schematic structural diagram of a third connecting portion according to an embodiment;

FIG. 8 is a schematic structural diagram of the third circuit board of FIG. 7 and the second circuit board of FIG. 2 after binding;

9 is a schematic structural diagram of a first connecting portion of another embodiment;

10 is a schematic structural diagram of a second connecting portion of another embodiment;

11 is a schematic structural diagram of a third connecting portion of another embodiment;

FIG. 12 is a schematic structural diagram of the first circuit board, the second circuit board and the third circuit board after binding according to an embodiment;

FIG. 13 is an equivalent circuit diagram of the test structure of the embodiment of FIG. 12;

14 is a schematic structural diagram of a test structure of another embodiment;

FIG. 15 is a schematic structural diagram of a testing system according to an embodiment.

Component label description:

The first circuit board: 10; the first connecting part: 100; the first connecting line: 110; the second connecting line: 120; the third connecting line: 130; the second circuit board: 20; the second connecting part: 200; Four connecting lines: 210; fifth connecting line: 220; third circuit board: 30; third connecting part: 300; sixth connecting line: 310; first test point group: 40; second test point group: 50; Probe Module: 60; Motion Module: 70; Housing: 80

Detailed ways

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the related drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. is based on the drawings shown in the drawings. The method or positional relationship is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention .

The embodiment of the present application provides a test structure. In this embodiment, the test structure includes a first connection part 100 , a second connection part 200 and a first test point group 40 .

The first connection portion 100 is disposed on the first circuit board 10 . 1 is a schematic structural diagram of a first connecting portion 100 according to an embodiment. Referring to FIG. 1 , the first connecting portion 100 covers part of the surface of the first circuit board 10 , and the first connecting portion 100 is located on the first circuit board 10 to be bound. The surface of one side of the first circuit board 10 is the side of the first circuit board 10 to be bonded with the anisotropic conductive adhesive. Exemplarily, the first circuit board 10 has a first side and a second side opposite to each other. If the first circuit board 10 and the second circuit board 20 are bound, the first side of the first circuit board 10 faces the second side. The circuit board 20 , the first connection portion 100 is disposed on the first surface of the first circuit board 10 . Wherein, the first circuit board 10 may be a flexible printed circuit board.

The second connection part 200 is disposed on the second circuit board 20 and corresponds to the position of the first connection part 100 , so that after the first circuit board 10 and the second circuit board 20 are bound, the The first connection part 100 is connected. 2 is a schematic structural diagram of the second connecting portion 200 according to an embodiment. Referring to FIG. 2 , the second connecting portion 200 covers part of the surface of the second circuit board 20 , and at least the second circuit board 20 is to be bound with the first circuit board 10 A second connection part 200 is provided on the fixed side. Wherein, the second circuit board 20 may be a rigid circuit board.

Further, the first connection part 100 and the second connection part 200 are formed with a first connection area at the connection, and the first connection area is the first connection part 100 and the second connection part 200 In the overlapping area in the direction perpendicular to the first circuit board 10 , the first connection area corresponds to the first binding state. FIG. 3 is a schematic structural diagram of the first circuit board 10 of FIG. 1 and the second circuit board 20 of FIG. 2 after binding. Referring to FIG. 3 , the first circuit board 10 and the second circuit board 20 are arranged in parallel and bound. After the first circuit board 10 and the second circuit board 20 are bound, the first connection part 100 and the second connection part 200 overlap in the direction perpendicular to the surface of the first circuit board 10, and the overlapping area can effectively reflect the first circuit board 10 and the second circuit board 20. A first binding state between a circuit board 10 and a second circuit board 20, the first binding state may include, for example, valid and invalid. Specifically, when the overlapping area satisfies a preset condition, such as shown in FIG. 3 , it can be considered that the first circuit board 10 and the second circuit board 20 are effectively bound, that is, the display quality and reliability of the display device will not be affected , otherwise, for example, as shown in FIG. 4 , it can be considered that the first circuit board 10 and the second circuit board 20 are bound in an invalid manner, which will reduce the display quality or reliability of the display device.

The first test point group 40 is connected to the first connection part 100 or the second connection part 200 , and the first test point group 40 is used to connect test equipment to obtain the first circuit board 10 and all the The first binding state between the second circuit boards 20 is described. In this embodiment, the first connection part 100 and the second connection part 200 are both conductive structures, and the test equipment tests the connection performance of the first connection part 100 and the second connection part 200 through the first test point group 40 . Ground, the test equipment tests the electrical performance parameters of the connection between the first connection part 100 and the second connection part 200 . Wherein, the test equipment may transmit electrical signals to the first test point group 40 to obtain electrical performance parameters at the connection between the first connection part 100 and the second connection part 200 . Illustratively, the electrical performance parameters may be, but are not limited to, resistance, capacitance, inductance, current, and the like.

It can be understood that, with the change of the overlapping area of the first connection part 100 and the second connection part 200, the electrical performance of the connection will inevitably change, and compared with the test method based on the optical principle, the electrical performance parameters are affected by environmental factors. less impact. Therefore, based on the test structure of the present embodiment, the connection of the first connection part 100 and the second connection part 200 can be obtained more accurately, so that the binding effect of the first circuit board 10 and the second circuit board 20 can be more accurately evaluated , for example, whether there is a positional shift between the first circuit board 10 and the second circuit board 20 during bonding, or whether the crimping force when crimping the anisotropic conductive adhesive is sufficient to make the first circuit board 10 and the second circuit board 10. A stable connection is formed between the plates 20 .

In this embodiment, the test structure includes: a first connection part 100 disposed on the first circuit board 10 ; a second connection part 200 disposed on the second circuit board 20 , and the position of the first connection part 100 Correspondingly, after the first circuit board 10 and the second circuit board 20 are bound, they are connected to the first connection part 100 ; the first test point group 40 is connected to the first connection part 100 or The second connection part 200 is connected, and the first test point group 40 is used for connecting a test device to obtain a first binding state between the first circuit board 10 and the second circuit board 20 . By setting the first test point group 40, the test equipment can obtain the electrical performance parameters after the first connection part 100 and the second connection part 200 are connected, and can obtain the electrical performance parameters between the first connection part 100 and the second connection part 200 according to the electrical performance parameters Therefore, the first binding state can be accurately obtained according to the overlapping area, that is, a test structure with accurate test results is provided.

FIG. 5 is a schematic structural diagram of a test structure according to another embodiment. Referring to FIG. 5 , in this embodiment, two first connection parts 100 are formed on the first circuit board 10 , at corresponding positions on the second circuit board 20 . Two second connection parts 200 are formed, and the first connection part 100 and the second connection part 200 are connected in one-to-one correspondence after binding, that is, the positions of the corresponding first connection part 100 and the second connection part 200 are corresponding, and the corresponding The dimensions of the first connecting part 100 and the second connecting part 200 are also matched.

When the first circuit board 10 and the second circuit board 20 are bound, one first connection part 100 overlaps with one second connection part 200 , and the other first connection part 100 overlaps with another second connection part 200 , When the test is performed by the test equipment, the electrical performance parameters of the connection of each pair of the first connection part 100 and the second connection part 200 are respectively tested. FIG. 6 is a schematic diagram of the failure of binding between the first circuit board 10 and the second circuit board 20. Referring to FIG. 6, it can be understood that when the first circuit board 10 and the second circuit board 20 are bound, there is a risk of tilting , so that part of the first circuit board 10 and the second circuit board 20 are effectively bound as shown on the left in FIG. 6 , but another part of the first circuit board 10 and the second circuit board 20 are bound as shown on the left Invalid binding shown on the right side of Figure 6. Therefore, in this embodiment, by providing two pairs of the first connecting part 100 and the second connecting part 200 , the situation of tilting during binding can be more effectively identified, thereby improving the detection accuracy of the test structure.

Further, the distance between the centers of the two first connection parts 100 is the same as the distance between the centers of the two second connection parts 200, and the distance between the centers above matches the size of the circuit board, that is, the two The distance between the centers of the first connecting parts 100 matches the size of the first circuit board 10 and/or the second circuit board 20, and the distance between the centers of the two second connecting parts 200 is also the same as that of the first circuit board 10 and/or the dimensions of the second circuit board 20 are matched. Exemplarily, if the length of the second circuit board 20 is 5 cm, the distance between the centers of the two first connection parts 100 can be set to be 4 cm, and the distance between the centers of the two second connection parts 200 can be set as well. is 4cm, wherein the bound arrangement direction of the first circuit board 10 and the second circuit board 20 is defined as the first direction, the second direction is perpendicular to the first direction, and the length of the second circuit board 20 refers to the second circuit board 20 dimension in the second direction. In this embodiment, the distance between the centers of the two first connection parts 100 is matched with the size of the circuit board, and the distance between the centers of the two second connection parts 200 is matched with the size of the circuit board , the problem of inaccurate test results caused by too small center distance can be avoided, thereby providing a test structure with more accurate test results.

In other embodiments, three or more first connection parts 100 may also be provided on the first circuit board 10 , and the second circuit board 20 has the same number of second connection parts 200 as the first connection parts 100 . , and make the positions of the first connecting part 100 and the second connecting part 200 correspond one-to-one, so as to further improve the accuracy of the test structure. It can be understood that providing a plurality of first connection parts 100 and second connection parts 200 increases the test cost of the test structure. Therefore, an appropriate number of first connection parts 100 and second connection parts can be selected according to the test accuracy requirements and the size of the circuit board. Two connecting parts 200 . When three or more first connection parts 100 are provided on the first circuit board 10 , the plurality of first connection parts 100 may be arranged at equal distances in the second direction.

In another embodiment, the test structure further includes a third connection part 300 and a second test point group 50 .

FIG. 7 is a schematic structural diagram of a third connection portion 300 according to an embodiment, and FIG. 8 is a schematic structural diagram of the third circuit board 30 of FIG. 7 and the second circuit board 20 of FIG. 2 after binding. Referring to FIG. 7 , the third connection The part 300 is disposed on the third circuit board 30 and corresponds to the position of the second connecting part 200, so that after the third circuit board 30 and the second circuit board 20 are bound, they are connected to the second connection part 200. One end of the connection part 200 away from the third connection part 300 is connected; the second test point group 50 is connected to one of the first connection part 100 , the second connection part 200 and the third connection part 300 connection, the second test point group 50 is used to connect the test equipment to obtain the second binding state between the third circuit board 30 and the second circuit board 20 . Exemplarily, the third circuit board 30 may be a glass substrate 30 of a display device.

Referring to FIG. 8 , the second circuit board 20 and the third circuit board 30 are arranged in parallel and bound. After the third circuit board 30 and the second circuit board 20 are bound, the second connection part 200 and the third connection part 300 are The directions perpendicular to the surface of the third circuit board 30 overlap, and the overlapping area can effectively reflect the second binding state between the third circuit board 30 and the second circuit board 20 . The second binding state may include, for example, valid and invalid. Specifically, when the overlapping area satisfies the preset condition, it can be considered that the third circuit board 30 and the second circuit board 20 are effectively bound, that is, the display quality and reliability of the display device will not be affected, otherwise it can be considered that the third circuit board 30 and the second circuit board 20 are effectively bound. The circuit board 30 and the second circuit board 20 are ineffectively bound, which may reduce the display quality or reliability of the display device.

FIG. 9 is a schematic structural diagram of a first connection part 100 according to another embodiment. Referring to FIG. 9 , in this embodiment, the first connection part 100 includes a first connection line 110 and a second connection line 120 . The second connection part 200 is used to conduct the first connection line 110 and the second connection line 120 after the first circuit board 10 and the second circuit board 20 are bound; the first test point The group 40 includes a first test point and a second test point, the first test point is connected to the first connection line 110, the second test point is connected to the second connection line 120, and the first test point is connected to the second connection line 120. The point and the second test point are used together to connect the test equipment. The first connection line 110 and the second connection line 120 are electrically isolated. In this embodiment, both the first test point and the second test point are disposed on the first circuit board 10 . Further, a first resistance is formed at the connection between the first connection part 100 and the second connection part 200 , the first resistance corresponds to the first binding state, and the testing device is a resistance testing device.

FIG. 10 is a schematic structural diagram of a second connection part 200 according to another embodiment. Referring to FIG. 10 , in this embodiment, the second connection part 200 includes a fourth connection line 210 , and the shape and position of the fourth connection line 210 are the same as those of the first connection line 210 . A connection line 110 corresponds to a second connection line 120 . 9 and 10 , when the first circuit board 10 and the second circuit board 20 are not bound, the first connection part 100 and the second connection part 200 are disconnected, and the first connection line 110 and the second connection line The 120 phase is disconnected. When the resistance test equipment is used to overlap the first test point and the second test point, the measured resistance is infinite; when the first circuit board 10 and the second circuit board 20 are invalidly bound , the first connection part 100 is connected with the second connection part 200, but the connection area is small, and the fourth connection line 210 conducts the first connection line 110 and the second connection line 120. When the tested resistance is greater than or equal to the resistance threshold value on the test point and the second test point, there is a risk of affecting the display quality and reliability; when the first circuit board 10 and the second circuit board 20 are effectively bound, The first connection part 100 is connected with the second connection part 200, and the connection area is large. and the second test point, the tested resistance is smaller than the resistance threshold, and the display device can have better display quality and reliability. Therefore, in this embodiment, the first bonding state between the first circuit board 10 and the second circuit board 20 can be effectively and accurately evaluated by setting the first connection line 110 and the second connection line 120 .

In one of the embodiments, continuing to refer to FIG. 9 , the first connection part 100 further includes a third connection wire 130 , and the third connection part 300 is used for connecting between the first circuit board 10 and the second circuit After the board 20 is bound, the second connection line 120 and the third connection line 130 are connected through the second connection part 200 ; the second test point group 50 is shared with the first test point group 40 The second test point, the second test point group 50 further includes a third test point, the third test point is connected to the third connection line 130, the second test point and the third test point The points are used together to connect the test equipment. FIG. 11 is a schematic structural diagram of a third connection part 300 according to another embodiment. Referring to FIG. 11 , the third connection part 300 includes a sixth connection line 310 , and the position of the sixth connection line 310 is the same as that of the fourth connection line 210 and the fifth connection line 210 . The connection line 220 corresponds.

FIG. 12 is a schematic structural diagram of the first circuit board 10 , the second circuit board 20 and the third circuit board 30 after binding according to an embodiment. Referring to FIG. 12 , in this embodiment, the connection of each two connecting lines is Each has a contact resistance, specifically, a resistance R1 is formed between the first connection line 110 and the fourth connection line 210, a resistance R1 is formed between the first connection line 110 and the fourth connection line 210, and the third connection line 130 and A resistance R3 is formed between the fifth connection lines 220 , a resistance R4 is formed between the fourth connection line 210 and the sixth connection line 310 , and a resistance R5 is formed between the fifth connection line 220 and the sixth connection line 310 . FIG. 13 is an equivalent circuit diagram of the test structure of the embodiment of FIG. 12. It can be understood that the contact resistances R1 to R5 will change in real time with the change of the overlapping area, so as to accurately reflect the first circuit board 10 and the second circuit board 20. A first binding state between the second circuit board 20 and the third circuit board 30 , and a second binding state between the second circuit board 20 and the third circuit board 30 .

In one embodiment, the first test point group 40 and the second test point group 50 are both disposed on the first circuit board 10 . In this embodiment, the first circuit board 10 is a rigid circuit board, and the rigid circuit board is not easily deformed and damaged, and the deformation and damage will cause the resistance of the test structure to increase, thereby affecting the test accuracy of the test structure. Therefore, in this embodiment, by arranging the first test point group 40 and the second test point group 50 on the first circuit board 10, the circuit board will not be damaged, thereby improving the reliability of the test structure.

In other embodiments, if a flexible printed circuit board with a harder material is used, the first test point group 40 and/or the second test point group 50 may also be disposed on the second circuit board 20 . Exemplarily, FIG. 14 is a schematic structural diagram of a test structure according to another embodiment. Referring to FIG. 14 , in this embodiment, the first test point group 40 (T2 and T3) is provided on the first circuit board 10, and the The second test point group 50 ( T4 and T5 ) is arranged on the second circuit board 20 . By setting the second circuit board 20 with a harder material, the number of wirings can be further reduced, thereby reducing the production cost and difficulty. During the test, the resistance values of R2 and R3 can be obtained through the first test point group 40 (T2 and T3), so as to obtain the first bonding state between the first circuit board 10 and the second circuit board 20, and through The second test point group 50 (T4 and T5) obtains the resistance values of R4 and R5, thereby obtaining the second bonding state between the second circuit board 20 and the third circuit board 30, and, in this embodiment, the first The test result of the second binding state also does not need to depend on the test result of the first binding state, thereby improving the flexibility and reliability of the test structure.

In one of the embodiments, a test system is also provided, including a first circuit board 10, a second circuit board 20, the above-mentioned test structure, and test equipment, the test equipment is connected to the test structure for testing The first binding state between the first circuit board 10 and the second circuit board 20 . Specifically, the first circuit board 10 , the second circuit board 20 and the test structure refer to the embodiment shown in FIG. 3 . FIG. 15 is a schematic structural diagram of a test system according to an embodiment. Referring to FIG. 15 , the bound first circuit board 10 and the second circuit board 20 are placed on the test equipment for testing, so as to obtain the first circuit board 10 and the second circuit board 20 . The first bonding state between the second circuit boards 20 .

In one of the embodiments, with continued reference to FIG. 15, the test apparatus includes a probe module 60, a motion module 70, and an analysis module.

The probe module 60 is used to connect the first test point group 40 to test the first resistance between the first connection part 100 and the second connection part 200 . Specifically, one end of the probe module 60 is fixedly connected with the motion module 70, so as to move to the target test position under the driving of the motion module 70, and the other end of the probe module 60 is used to connect to the first test point group 40, so as to test the first test point group 40. A resistance, further, the probe module 60 is further configured to send the first resistance obtained by the test to the analysis module for analysis.

The movement module 70 is connected to the probe module 60 and used to drive the probe module 60 to move, so that the probe module 60 is connected to the first test point group 40 . Specifically, the motion module 70 is connected to the housing 80 and can perform motion. Exemplarily, the motion module 70 can perform three-axis motion, that is, the X direction, the Y direction, and the Z direction. The motion in the X direction and the Y direction can The probe module 60 moves to the coordinate position of the first test point group 40 , and the movement in the Z direction can make the probe module 60 contact with the first test point group 40 to perform the test. In this embodiment, the motion module 70 moves in the X direction and the Y direction first, and then moves in the Z direction after reaching the target coordinate position. After the test is completed, the motion module 70 moves in the Z direction to keep away from the first The circuit board 10 and the second circuit board 20 move in the X direction and the Y direction after reaching the preset height.

The analysis module is disposed in the housing 80 and is connected to the probe module 60 for obtaining the first resistance and obtaining the first binding state according to the first resistance. Specifically, the analysis module can obtain the first binding state by comparing the first resistance and the resistance threshold.

In one embodiment, the first binding state includes a plurality of state levels, the analysis module is configured with a plurality of resistance thresholds, the resistance thresholds correspond to the state levels one-to-one, and the analysis module is configured to A state level of the first binding state is determined based on the first resistance and a plurality of the resistance thresholds. Exemplarily, the multiple resistance thresholds are, for example, 0.1Ω, 1Ω, and 5Ω. When the first resistance is less than 0.1Ω, it is determined that the first binding state is the first level; when the first resistance is greater than or equal to 0.1Ω and less than 1Ω , the first binding state is determined to be the second level; when the first resistance is greater than or equal to 1Ω and less than 5Ω, the first binding state is determined to be the third level; when the first resistance is greater than or equal to 5Ω, then It is determined that the first binding state is the fourth level. In this embodiment, the first binding state is graded according to the first resistance, so that the first binding state can be more accurately evaluated. Further, the second binding state can also be graded by a similar method, so as to perform a more accurate evaluation.

The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity, all possible combinations of the technical features in the above-described embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be regarded as the scope described in this specification.

The above-mentioned embodiments only represent several embodiments of the present invention, and the descriptions thereof are specific and detailed, but should not be construed as a limitation on the scope of the invention patent. It should be pointed out that for those skilled in the art, without departing from the concept of the present invention, several modifications and improvements can be made, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the appended claims.

Claims (10)

1. A test structure, comprising:

the first connecting part is arranged on the first circuit board;

the second connecting part is arranged on a second circuit board and corresponds to the first connecting part in position so as to be connected with the first connecting part after the first circuit board and the second circuit board are bound;

the first test point group is connected with the first connecting part or the second connecting part and used for connecting test equipment so as to obtain a first binding state between the first circuit board and the second circuit board.

2. The test structure of claim 1, further comprising:

the third connecting part is arranged on a third circuit board and corresponds to the second connecting part in position, so that the third circuit board is connected with one end, away from the first connecting part, of the second connecting part after being bound with the second circuit board;

and the second test point group is connected with one of the first connecting part, the second connecting part and the third connecting part, and is used for connecting the test equipment to acquire a second binding state between the third circuit board and the second circuit board.

3. The test structure of claim 2, wherein the first connection portion comprises a first connection line and a second connection line, and the second connection portion is configured to conduct the first connection line and the second connection line after the first circuit board and the second circuit board are bound;

the first test point group comprises a first test point and a second test point, the first test point is connected with the first connecting line, the second test point is connected with the second connecting line, and the first test point and the second test point are jointly used for connecting the test equipment.

4. The test structure of claim 3, wherein the first connection portion further comprises a third connection line, and the third connection portion is configured to conduct the second connection line and the third connection line via the second connection portion after the first circuit board and the second circuit board are bound;

the second test point group and the first test point group share the second test point, the second test point group further comprises a third test point, the third test point is connected with the third connecting line, and the second test point and the third test point are jointly used for connecting the test equipment.

5. The test structure of claim 2, wherein the first set of test points and the second set of test points are both disposed on the first circuit board.

6. The test structure according to claim 1, wherein the first connection portion and the second connection portion are formed with a first connection area at a connection, the first connection area being an overlapping area of the first connection portion and the second connection portion in a direction perpendicular to the first circuit board, the first connection area corresponding to the first bound state.

7. The test structure of claim 1, wherein the first connection portion and the second connection portion are formed with a first resistance at the connection, the first resistance corresponding to the first binding state.

8. A test system, comprising:

a first circuit board;

a second circuit board;

the test structure of any one of claims 1 to 7;

and the test equipment is connected with the test structure and used for testing a first binding state between the first circuit board and the second circuit board.

9. The test system of claim 8, wherein the test equipment comprises:

the probe module is used for connecting the first test point group so as to test a first resistor between the first connecting part and the second connecting part;

the movement module is connected with the probe module and used for driving the probe module to move so as to enable the probe module to be connected to the first test point group;

and the analysis module is connected with the probe module and used for acquiring the first resistance and acquiring the first binding state according to the first resistance.

10. The test system of claim 9, wherein the first binding state comprises a plurality of state levels, wherein the analysis module is configured with a plurality of resistance thresholds, wherein the resistance thresholds correspond to the state levels one-to-one, and wherein the analysis module is configured to determine the state level of the first binding state based on the first resistance and the plurality of resistance thresholds.

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