CN112147428A

CN112147428A - Electromagnetic compatibility testing system and method

Info

Publication number: CN112147428A
Application number: CN201911365227.5A
Authority: CN
Inventors: 肖朝晖; 延少霞; 刘关东; 丁明明
Original assignee: Anbofu Electronics Suzhou Co ltd
Current assignee: Anbofu Electronics Suzhou Co ltd
Priority date: 2019-12-26
Filing date: 2019-12-26
Publication date: 2020-12-29

Abstract

The electromagnetic compatibility test system comprises a power source, an electromagnetic shielding cavity and a photoelectric conversion module. The power source may supply power to the electromagnetic compatibility test system. The interior of the electromagnetic shielding cavity may include at least one acquisition module, at least one analog-to-digital converter, a processor, and an electrical-to-optical conversion module. The at least one acquisition module may acquire a sampling signal from a device under test located outside the electromagnetic shielding cavity. The at least one analog-to-digital converter may correspond one-to-one to the at least one acquisition module and convert a sampling signal received from the corresponding acquisition module into a digital signal. The processor can combine and convert the digital signals received from the at least one analog-to-digital converter into serial port data and send the serial port data to the electro-optical conversion module. The electro-optical conversion module may convert the digital signal into an optical signal. In addition, the photoelectric conversion module may be optically coupled to the electro-optical conversion module, and convert the optical signal from the electro-optical conversion module into serial data and transmit the serial data to the computing device.

Description

Electromagnetic compatibility testing system and method

Technical Field

The present invention relates to a system and a method for testing electromagnetic compatibility, and more particularly, to a system and a method for testing electromagnetic compatibility using serial data.

Background

Electromagnetic Compatibility (EMC) refers to the ability of a device or system to function properly in its Electromagnetic environment without creating intolerable Electromagnetic disturbance to any device in that environment. On one hand, the electromagnetic compatibility means that the electromagnetic disturbance generated to the environment in which the equipment is located in the normal operation process cannot exceed a certain limit value; on the other hand, the device has a certain degree of immunity to electromagnetic disturbance in the environment.

When an electric wave darkroom is used for testing and researching the electromagnetic compatibility of a tested product, an output signal of a port of the tested product needs to be detected so as to judge whether the function of the tested product meets the design requirement. However, the conventional test system presents the test result by using an oscilloscope, and has the problems that the data cannot be stored and the complexity of system construction and debugging is high.

Disclosure of Invention

Example embodiments provide an electromagnetic compatibility test system including a power source, an electromagnetic shielding cavity, and a photoelectric conversion module. The power source may be configured to supply power to the electromagnetic compatibility testing system. The interior of the electromagnetic shielding cavity may include at least one acquisition module, at least one analog-to-digital converter, a processor, and an electrical-to-optical conversion module. The at least one acquisition module may be configured to acquire a sampled signal from a device under test located outside of the electromagnetic shielding cavity. The at least one analog-to-digital converter may be in one-to-one correspondence with the at least one acquisition module and configured to convert a sampled signal received from the corresponding acquisition module into a digital signal. The processor may be configured to combine and convert digital signals received from the at least one analog-to-digital converter into serial data and send the serial data to the electro-optical conversion module. The electrical-to-optical conversion module may be configured to convert the digital signal to an optical signal. In addition, the optical-to-electrical conversion module may be optically coupled with the electrical-to-optical conversion module and configured to convert the optical signal from the electrical-to-optical conversion module into serial data and transmit the serial data to the computing device.

Example embodiments also provide an electromagnetic compatibility test method, including: collecting sampling signals of at least one channel from equipment to be tested, converting the collected sampling signals into digital signals, combining and converting the digital signals into serial port data and converting the serial port data into optical signals in the electromagnetic shielding cavity; and converting the optical signal into serial port data and transmitting the digital signal to the computing device outside the electromagnetic shielding cavity.

Drawings

The drawings illustrate generally, by way of example, but not by way of limitation, various embodiments discussed in this document. In the drawings, which are not necessarily drawn to scale, like numerals may describe similar components in different views. Like numerals having different letter suffixes may represent different instances of similar components.

FIG. 1 is a block diagram illustrating an example electromagnetic compatibility test system 100, according to an embodiment;

FIG. 2 illustrates a flow diagram of an example electromagnetic compatibility testing method 200, according to an embodiment; and is

FIG. 3 is a block diagram illustrating an example electromagnetic compatibility test system 300, according to an embodiment; and is

FIG. 4 illustrates a flow diagram of an example electromagnetic compatibility testing method 400, according to an embodiment.

Detailed Description

The technical solutions of the present invention will be described more clearly and completely with reference to the accompanying drawings, and the described embodiments are only some embodiments, not all embodiments, of the present invention. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, will fall within the scope of the present invention.

References in the specification to "one embodiment," "an example embodiment," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.

It should be noted that the terms "comprises," "comprising," "has," "having," "includes," "including," "contains," "containing," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises, has, includes, contains a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. The terms "comprising," "having," "including," and "containing," when used in the context of this specification, do not exclude the presence of other elements, components, methods, articles, or apparatus, which may be present in, include, or contain the recited elements. The terms "a" and "an" are defined as one or more unless explicitly stated otherwise herein.

In some embodiments, the numerical parameters used in the specification and claims are approximations that may vary depending upon the desired properties of the individual embodiments. In some embodiments, the numerical parameter should take into account the specified significant digits and employ a general digit preserving approach. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the range are approximations, in the specific examples, such numerical values are set forth as precisely as possible within the scope of the application.

In the drawings, for ease of description, specific arrangements or sequences of illustrative elements, such as those representing devices, modules, instruction blocks, and data elements, are shown. However, those skilled in the art will appreciate that the particular ordering or arrangement of the illustrative elements in the figures is not intended to imply that a particular order or sequence of processing, or separation of processes, is required. Moreover, the inclusion of schematic elements in the figures is not meant to imply that such elements are required in all embodiments, or that features represented by such elements may not be included in or combined with other elements in some embodiments.

Moreover, in the figures, the absence of any such connecting element does not imply that no connection, relationship, or association may exist, where a connecting element, such as a solid or dashed line or arrow, is used to illustrate a connection, relationship, or association between two or more other exemplary elements. In other words, some connections, relationships, or associations between elements are not shown in the drawings in order to avoid obscuring the disclosure. In addition, for ease of explanation, a single connected element is used to represent multiple connections, relationships, or associations between elements. For example, where connection elements represent communication of signals, data, or instructions, those skilled in the art will appreciate that such elements may represent one or more signal paths (e.g., buses) as needed to effect the communication.

FIG. 1 is a block diagram illustrating an example electromagnetic compatibility test system 100, according to an embodiment. The electromagnetic compatibility test system 100 of the present embodiment is used to test the electromagnetic compatibility of the device under test 2 and output the test data to the external computing device 4 for storage, processing, presentation, or other operations.

Referring to fig. 1, the system 100 generally includes a power source 1, an electromagnetic shielding cavity 3, and a computing device 4. The electromagnetic shielding cavity 3 may be made of metal, for example, and is provided to be grounded. The power source 1 and the device under test 2 are located outside the electromagnetic shielding cavity 3 and are powered by the power source 1. The electromagnetic shielding cavity 3 may include an acquisition module 32, a processor 34, and an electro-optical converter 61. The power source 1 is configured to supply power to the devices within the electromagnetic shielding cavity 3.

The acquisition module 32 may be configured to acquire a sampled signal from the device under test 2. The sampling signal is, for example, a voltage signal or a current signal. The sampled signal is then passed to an analog-to-digital (AD) converter 342 for conversion to a digital signal. The analog-to-digital converter 342 may be integrated within the processor 34 or may be separate from the processor 34. The digital signal converted by the analog-to-digital converter 342 is transmitted to the processor 34.

The processor 34 is powered by the power source 1 and may be configured to convert digital signals received from the analog-to-digital converter 342 into serial port data.

The serial port is also called a serial communication interface, and is an expansion interface adopting a serial communication mode. The serial data are transmitted in sequence one bit by one bit, and long-distance communication can be realized. The serial port may be based on, for example, the RS-232 standard (ANSI/EIA-232 standard). Processor 34 may then pass the serial data to electro-optic converter 61 in the form of TTL levels.

The processor 34 may be, for example, a Digital Signal Processor (DSP), a microcontroller, an Application Specific Integrated Circuit (ASIC), or a microprocessor, among others.

The electro-optical converter 61 may convert serial port data in TTL level received from the processor 34 into an optical signal and transmit the optical signal to the electro-optical converter 62 located outside the electromagnetic shielding chamber 3 through the optical fiber 63. The optical-to-electrical converter 62 converts the optical signal received from the electrical-to-optical converter 61 into an electrical signal, i.e., serial port data, which is then transmitted to the computing device 4 for storage, analysis, and/or presentation of the serial port data.

Computing device 4 may be, for example, a Personal Computer (PC), a tablet PC, a Personal Digital Assistant (PDA), a mobile phone, and so forth.

FIG. 2 illustrates a flow diagram of an example electromagnetic compatibility testing method 200, according to an embodiment. The method 200 may be implemented by the system 100 shown in fig. 1.

As shown in fig. 2, the method begins at step 202, where a sampled signal may be collected by the collection module 32 from a device under test 2 powered by the power source 1. The sampling signal may be a voltage signal or a current signal. The process then proceeds to step 204.

In step 204, the sampled signal acquired by the acquisition module 32 may be converted to a digital signal using an analog-to-digital converter 342. The process then proceeds to step 206.

In step 206, the digital signal converted by the analog-to-digital converter 342 may be converted into serial data by the processor 34. The process then proceeds to step 208.

In step 208, serial port data from the processor 34 may be converted to an optical signal using the electrical-to-optical converter 61. The process then proceeds to step 210.

In step 210, the optical signal transmitted from the electrical-to-optical converter 61 via the optical fiber 63 may be converted into an electrical signal by the optical-to-electrical converter 62, i.e., recovered into serial data. The process then proceeds to step 212.

In step 212, serial port data from the opto-electric converter 62 may be transmitted to the computing device 4.

In the above process, steps 202, 204, 206 and 208 may be performed inside the electromagnetic shielding chamber 3, and steps 210 and 212 may be performed outside the electromagnetic shielding chamber 3.

According to the present embodiment, the processor 34 converts the digital signal of the sampling signal into serial data and transmits the serial data to the computing device 4 through the electrical-to-optical converter 61 and the optical-to-electrical converter 62, so that the sampling signal can be stored, saved, and processed by the computing device. Further, by transmitting an optical signal by optical coupling between the electro-optical converter 61 and the photoelectric converter 62, it is possible to prevent an electric signal from being unable to be transmitted due to grounding inside and outside the electromagnetic shielding cavity 3, and it is possible to increase the distance of signal transmission and reduce transmission loss. So that the photoelectric converter 62 and/or the computing device 4 can be arranged at a distance from the electromagnetic shielding cavity 3.

FIG. 3 is a block diagram illustrating an example electromagnetic compatibility test system 300, according to an embodiment. The electromagnetic compatibility testing system 300 of the present embodiment, like the electromagnetic compatibility testing system 100 shown in fig. 1, is capable of testing the electromagnetic compatibility of the device under test 2 and outputting the test data to the external computing device 4 for storage, processing, presentation, or other operations.

Referring to fig. 3, the system 100 generally includes a power source 1, an electromagnetic shielding cavity 3, and a computing device 4. The power source 1 and the device under test 2 are located outside the electromagnetic shielding cavity 3 and are powered by the power source 1. In this embodiment, a LISN (Line Impedance Stabilization Network) filter 5 is disposed between the power source 1 and the device under test 2, and is used for isolating the electric wave interference from the power source 1 so as to provide pure power to the device under test 2, provide stable test Impedance, and play a role of filtering.

In this embodiment, the electromagnetic shielding cavity 3 may include the

acquisition modules

32a, 32b, the processor 34, and the electro-optical converter 61. The power source 1 is configured to supply power to the devices within the electromagnetic shielding cavity 3.

Acquisition module 32a may be configured to acquire voltage signals from device under test 2, and acquisition module 32b may be configured to acquire current signals from device under test 2. The acquisition of the current signal can be achieved, for example, by providing a current sensor. Further, analog-to-digital converters 342 are provided corresponding to the

acquisition modules

32a and 32b, respectively.

The sampled signal is then passed to an analog-to-digital converter 342 for conversion to a digital signal. The analog-to-digital converter 342 may be integrated within the processor 34 or may be separate from the processor 34. The digital signal converted by the analog-to-digital converter 342 is transmitted to the processor 34.

In this embodiment, in order to obtain a clear and stable sampling signal, an amplifying circuit 35 may be further disposed between the acquisition module 32a for acquiring the voltage signal and the analog-to-digital converter 342, and an amplifying and converting circuit 36 may be further disposed between the acquisition module 32b for acquiring the current signal and the analog-to-digital converter 342. The amplification conversion circuit 36 is mainly used to amplify and convert the current signal from the acquisition module 32b into a voltage signal and output the voltage signal to the analog-to-digital converter 342, and is therefore also referred to as a current-to-voltage converter. In some embodiments, the amplifying circuit 35 and the amplifying and converting circuit 36 may further have a filtering function.

In the present embodiment, the acquisition module 32a supplies the three channels of voltage sampling signals V1 to V3 to the amplification circuit 35, and the acquisition module 32b supplies the one channel of current sampling signal I1 to the amplification conversion circuit 36. However, it should be understood that the kind of the sampling signal, i.e. the voltage, the current or the combination thereof, and the number of channels may be arbitrarily changed according to the requirement of the electromagnetic compatibility test, and the number of the acquisition modules is not limited to two, as long as the analog-to-digital converter 342, the amplifying circuit 35, and the amplifying and converting circuit 36 are correspondingly arranged according to the number of channels of the kind of the acquisition signal.

In some embodiments, the output voltage of the power source 1 may be higher in order to obtain a higher quality sampled signal. However the input voltage required by the processor 34 may be lower than the output voltage of the power source 1. For this purpose, an LDO (low dropout regulator) module 37 may be provided between the power source 1 and the processor 34. LDO module 37 is a linear regulator that subtracts excess voltage from the applied input voltage to produce a regulated output voltage. The voltage regulated by LDO module 37 may be provided to processor 34, amplification circuit 35, and amplification conversion circuit 36.

For example, in the case that power source 1 provides a 12V voltage output and processor 34 requires an input voltage of 5V, LDO module 37 may regulate the output voltage of power source 1 to 5V and provide it to processor 34. Of course, other types of dc buck converters may be used depending on the voltage conversion requirements.

The processor 34 may be configured to packetize and convert the voltage sampling signals V1-V3 and the current sampling signal I1 received from the analog-to-digital converter 342 into serial data, which may then be transmitted to the electro-optical converter 61 in the form of TTL levels.

The electro-optical converter 61 may convert serial port data in TTL level received from the processor 34 into an optical signal and transmit the optical signal to the electro-optical converter 62 located outside the electromagnetic shielding chamber 3 through the optical fiber 63. The photoelectric converter 62 converts the optical signal received from the electro-optical converter 61 into an electrical signal, i.e., serial data.

In this embodiment, the system 300 includes two sets of electro-optical converters 61 and opto-electrical converters 62. One of the groups may be used to transmit serial data DAT to the outside, and the other group may be used to receive command data CMD from the outside. The command data CMD can be used to indicate, for example, the start and end of acquiring a sampling signal, various parameters when acquiring a sampling signal, and the like.

Since the Serial data DAT is in the form of TTL level, a Serial conversion interface 6 such as a USB-UART connector may be further provided, and the Serial conversion interface 6 may be configured to convert between TTL data and USB (Universal Serial Bus) data. The converted USB data may be input to computing device 4 via USB connector 7 for storage, analysis, and/or presentation of the serial data, or other operations.

FIG. 4 illustrates a flow diagram of an example electromagnetic compatibility testing method 400, according to an embodiment. The method 400 may be implemented by the system 300 shown in fig. 3.

As shown in fig. 4, the method begins at step 402, where a sampled signal may be acquired by acquisition module 32a and acquisition module 32b from a device under test 2 powered by power source 1. The sampling signal may be a voltage signal and/or a current signal. The process then proceeds to step 404.

In step 404, the sampled signals acquired by the

acquisition modules

32a and 32b may be converted to digital signals using analog-to-digital converters 342. The process then proceeds to step 406.

In step 406, the digital signal converted by the analog-to-digital converter 342 may be packaged and converted into serial data by the processor 34. The process then proceeds to step 408.

In step 408, serial data from the processor 34 may be converted to an optical signal using the electrical-to-optical converter 61. The process then proceeds to step 410.

In step 410, the optical signal transmitted from the electrical-to-optical converter 61 via the optical fiber 63 may be converted into an electrical signal by the optical-to-electrical converter 62, i.e., restored into serial data. The process then proceeds to step 412.

In step 412, serial port data from the optical-to-electrical converter 62 may be converted to USB data using the serial port conversion interface 6 and transmitted to the computing device 4 via the USB connector 7.

Computing device 4 may then store, process, and/or render the received USB data, or perform other operations as desired.

In the above process, steps 402, 404, 406 and 408 may be performed inside the electromagnetic shielding chamber 3, and steps 410 and 412 may be performed outside the electromagnetic shielding chamber 3.

According to the embodiment, the electromagnetic compatibility test system can monitor the voltages and/or sampling signals of a plurality of channels at the same time, the system building complexity can be effectively reduced, the debugging time is shortened, and the test cost is reduced. In addition, the electromagnetic shielding cavity made of metal is adopted, so that the electromagnetic radiation of the serial port equipment can be reduced, and the reliability of the electromagnetic compatibility test is improved.

The preferred embodiments of the present invention have been described above in detail. It will be appreciated that various embodiments and modifications may be made thereto without departing from the broader spirit and scope of the invention. Many modifications and variations will be apparent to those of ordinary skill in the art in light of the above teachings without undue experimentation. Therefore, the technical solutions available to those skilled in the art through logic analysis, reasoning and limited experiments based on the prior art according to the concept of the present invention should fall within the scope of protection defined by the claims of the present invention.

Claims

1. An electromagnetic compatibility testing system comprising:

a power source configured to supply power to the electromagnetic compatibility testing system;

an electromagnetic shielding chamber, an interior of the electromagnetic shielding chamber comprising:

at least one acquisition module configured to acquire a sampling signal from a device under test located outside the electromagnetic shielding cavity;

at least one analog-to-digital converter in one-to-one correspondence with the at least one acquisition module and configured to convert the sampled signals received from the corresponding acquisition module into digital signals;

a processor configured to combine and convert the digital signals received from the at least one analog-to-digital converter into serial port data and send the serial port data to an electro-optical conversion module; and

the electro-optical conversion module configured to convert the digital signal into an optical signal; and

and the photoelectric conversion module is optically coupled with the electro-optical conversion module and is configured to convert the optical signal from the electro-optical conversion module into the serial port data and transmit the serial port data to a computing device.

2. The electromagnetic compatibility testing system of claim 1,

comprises a plurality of acquisition modules, and

the sampling signal is selected from the group consisting of a current signal, a voltage signal, and combinations thereof.

3. The electromagnetic compatibility testing system of claim 2, wherein the plurality of acquisition modules comprises:

a first acquisition module configured to provide voltage signals of at least one channel to a corresponding analog-to-digital converter; and

a second acquisition module configured to provide the current signal of the at least one channel to a corresponding analog-to-digital converter.

4. The electromagnetic compatibility testing system of claim 3, wherein the first acquisition module is configured to provide three channels of voltage signals to the corresponding analog-to-digital converters.

5. The emc testing system of claim 3, wherein a current-to-voltage converter is disposed between the second collection module and the corresponding adc.

6. The emc testing system of claim 1, wherein the digital signal is transmitted to the computing device via a serial conversion interface.

7. The electromagnetic compatibility testing system of claim 1, wherein the computing device is configured to store, process, and/or present the digital signal.

8. An electromagnetic compatibility testing method, comprising:

in the interior of the electromagnetic shielding cavity there is,

collecting sampling signals of at least one channel from equipment to be tested;

converting the acquired sampling signal into a digital signal;

merging and converting the digital signals into serial port data; and

converting the serial port data into optical signals, outside the electromagnetic shielding cavity,

converting the optical signal into the serial port data; and

the digital signal is transmitted to a computing device.

9. The emc method of claim 8, wherein the sampling signal is selected from the group consisting of a current signal, a voltage signal, and combinations thereof.

10. The emc testing method of claim 9, wherein the digital signal is transmitted to the computing device via a serial port conversion interface, and wherein

The electromagnetic compatibility testing method further comprises the following steps:

storing, processing, and/or presenting the digital signal by the computing device.