CN112146652A - Micro-mechanical inertial measurement combination for satellite - Google Patents
Micro-mechanical inertial measurement combination for satellite Download PDFInfo
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- CN112146652A CN112146652A CN202011021743.9A CN202011021743A CN112146652A CN 112146652 A CN112146652 A CN 112146652A CN 202011021743 A CN202011021743 A CN 202011021743A CN 112146652 A CN112146652 A CN 112146652A
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- gyroscope
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- micromechanical
- accelerometer
- machined
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- 238000005259 measurement Methods 0.000 title claims abstract description 49
- 238000004891 communication Methods 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 3
- 230000001133 acceleration Effects 0.000 abstract description 3
- 108091092878 Microsatellite Proteins 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 230000008859 change Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C21/00—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00
- G01C21/10—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration
- G01C21/12—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning
- G01C21/16—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning by integrating acceleration or speed, i.e. inertial navigation
- G01C21/18—Stabilised platforms, e.g. by gyroscope
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/24—Guiding or controlling apparatus, e.g. for attitude control
- B64G1/36—Guiding or controlling apparatus, e.g. for attitude control using sensors, e.g. sun-sensors, horizon sensors
- B64G1/369—Guiding or controlling apparatus, e.g. for attitude control using sensors, e.g. sun-sensors, horizon sensors using gyroscopes as attitude sensors
Abstract
The invention discloses a micro-mechanical inertial measurement combination for a satellite, which comprises: a body having a first plane, a second plane, and a third plane, wherein a relative position between the first plane, the second plane, and the third plane is fixed; the first MEMS gyroscope and the first MEMS accelerometer are arranged on the first plane; the second MEMS gyroscope and the second MEMS accelerometer are arranged on the second plane; the third MEMS gyroscope and the third MEMS accelerometer are arranged on a third plane; any two of the measuring axis of the first MEMS gyroscope, the measuring axis of the second MEMS gyroscope and the measuring axis of the third MEMS gyroscope are vertical to each other; the invention carries out miniaturization and low power consumption processing on the gyro combination in order to meet the requirements of small volume, low power consumption, high reliability and the like of the microsatellite on the satellite-borne gyro combination. The invention selects the MEMS gyroscope as an angular velocity sensitive device, and the MEMS accelerometer as an acceleration sensitive device, and has the characteristics of small volume, high precision, low power consumption and the like.
Description
Technical Field
The invention relates to the field of inertial navigation, in particular to a micro-mechanical inertial measurement unit for a satellite.
Background
The technical principle of micromechanical gyroscopes is based on the Coriolis principle: the Coriolis force is in a direct proportion relation with the angular speed of the rotation of the object, changes of the Coriolis force are converted into changes of capacitance, and finally the changes of the capacitance are read through the special integrated circuit, so that the value of the angular speed of the rotation of the object is obtained. The technical principle of the micro-mechanical accelerometer is based on Newton's second law, the micro-mechanical sensitive structure converts the change of the acceleration into the change of the capacitance, and finally the change of the capacitance is read by the special integrated circuit to obtain the acceleration value of the object movement.
The attitude sensitive inertial measurement combination used by the existing satellite generally comprises a vibration gyro represented by a hemispherical resonance gyro and a quartz accelerometer, and an optical gyro represented by a fiber-optic gyro and the quartz accelerometer, and the two types of inertial measurement combinations have the characteristics of high precision and long service life, but have large volume, heavy weight and high power consumption, along with the development of commercial satellites and micro-nano satellites, the satellite attitude and orbit control system provides the requirements of small volume, heavy weight, low power consumption and low cost for the inertial measurement combination, so that the traditional inertial measurement combination is not suitable for the use of the commercial and micro-nano satellites.
The foreign micro mechanical inertial measurement combination generally uses industrial components, has weak radiation resistance and short service life, and can only be used on the small satellites with low orbits and short service lives. Therefore, a micro-mechanical inertial measurement unit with small volume and weight, low power consumption, low cost, high radiation resistance and long service life is urgently needed in the field of aerospace.
Disclosure of Invention
The invention aims to provide a micro-mechanical inertial measurement unit for a satellite,
in order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a micro-machined inertial measurement unit for a satellite, the inertial measurement unit comprising:
a top support;
a first micromechanical gyroscope mounted to the gyroscope support;
a second micromechanical gyroscope mounted to the gyroscope support;
a third micromechanical gyroscope mounted to the gyroscope support;
a first micromechanical accelerometer mounted to the gyro frame;
a second micro-machined accelerometer mounted to the gyro-mount;
a third micro-machined accelerometer mounted to the gyro-mount;
wherein any two of the measurement axis of the first micromachined gyroscope, the measurement axis of the second micromachined gyroscope, and the measurement axis of the third micromachined gyroscope are perpendicular to each other; any two of the measurement axis of the first micro-machined accelerometer, the measurement axis of the second micro-machined accelerometer, and the measurement axis of the third micro-machined accelerometer are perpendicular to each other.
Furthermore, lead skins are arranged on the top surface of the first micro-machined gyroscope mounting position, the top surface of the second micro-machined gyroscope mounting position, the top surface of the third micro-machined gyroscope mounting position, the top surface of the first micro-machined accelerometer mounting position, the top surface of the second micro-machined accelerometer mounting position and the top surface of the third micro-machined accelerometer mounting position.
Further, the first micro-machined gyroscope, the second micro-machined gyroscope, the third micro-machined gyroscope, the first micro-machined accelerometer, the second micro-machined accelerometer and the third micro-machined accelerometer are all mounted on the communication board assembly.
Further, the top cover of the first micro-mechanical gyroscope, the top cover of the second micro-mechanical gyroscope, the top cover of the third micro-mechanical gyroscope, the top cover of the first micro-mechanical accelerometer, the top cover of the second micro-mechanical accelerometer and the top cover of the third micro-mechanical accelerometer are adhered to a gyroscope support through glue with high viscosity, heat conductivity and strong insulating property.
Further, the inertia measurement combination further comprises:
a housing;
a base;
the housing and the base form an accommodating space, and the first micro-machined gyroscope, the second micro-machined gyroscope, the third micro-machined gyroscope, the first micro-machined accelerometer, the second micro-machined accelerometer, the third micro-machined accelerometer and the communication circuit board assembly are all located in the accommodating space.
Compared with the prior art, the invention has at least one of the following advantages:
the invention fully utilizes the internal space of the inertia measurement assembly, can ensure the installation precision of the inertia device, and can transmit the heat generated by the inertia device out through the combined structure in time.
Drawings
FIG. 1 is a schematic diagram of a micro-mechanical inertial measurement unit for a satellite according to an embodiment of the present invention;
FIG. 2 is an exploded view of a micro-mechanical inertial measurement unit for a satellite according to an embodiment of the present invention;
fig. 3 is a schematic position diagram of a mechanical gyroscope and a mechanical accelerometer in a rectangular spatial coordinate system according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the embodiments shown in FIGS. 1 to 3. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are all used in a non-precise scale for the purpose of facilitating and distinctly aiding in the description of the embodiments of the present invention. To make the objects, features and advantages of the present invention comprehensible, reference is made to the accompanying drawings. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the implementation conditions of the present invention, so that the present invention has no technical significance, and any structural modification, ratio relationship change or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or field device that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or field device. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or field device that comprises the element.
Referring to fig. 1-3, in the present embodiment, an aerospace quality class device is adopted in a micro-mechanical inertial measurement unit for a satellite, which has a strong space environment adaptability, and a top surface structure of an installation position of a micro-mechanical gyroscope and a micro-mechanical accelerometer is protected by a lead-clad method to enhance the space environment adaptability of a micro-mechanical inertial device, where the micro-mechanical inertial measurement unit includes:
a top support 4;
a first micromechanical gyroscope 101 mounted to the gyroscope support 4;
a second micromechanical gyroscope 102 mounted to the gyroscope support 4;
a third micromechanical gyroscope 103 mounted on the gyroscope support 4;
a first micro-machined accelerometer 104 mounted to the gyro-mount 4;
a second micro-machined accelerometer 105 mounted to the gyro-bracket 4;
a third micro-machined accelerometer 106 mounted to the gyro-bracket 4;
wherein any two of the measurement axis of the first micromachined gyroscope 101, the measurement axis of the second micromachined gyroscope 102, and the measurement axis of the third micromachined gyroscope 103 are perpendicular to each other; any two of the measurement axis of the first micro-machined accelerometer 104, the measurement axis of the second micro-machined accelerometer 105, and the measurement axis of the third micro-machined accelerometer 106 are perpendicular to each other.
In this embodiment, lead covers are mounted on the top surface of the mounting position of the first micro-mechanical gyroscope 101, the top surface of the mounting position of the second micro-mechanical gyroscope 102, the top surface of the mounting position of the third micro-mechanical gyroscope 103, the top surface of the mounting position of the first micro-mechanical accelerometer 104, the top surface of the mounting position of the second micro-mechanical accelerometer 105, and the top surface of the mounting position of the third micro-mechanical accelerometer 106.
In this embodiment, the first micro-mechanical gyroscope 101, the second micro-mechanical gyroscope 102, the third micro-mechanical gyroscope 103, the first micro-mechanical accelerometer 104, the second micro-mechanical accelerometer 105, and the third micro-mechanical accelerometer 106 are all mounted on the communication board assembly.
The micromechanical gyroscope and the micromechanical accelerometer are welded on a circuit board to form a communication board assembly.
In this embodiment, the top cover of the first micro-mechanical gyroscope 101, the top cover of the second micro-mechanical gyroscope 102, the top cover of the third micro-mechanical gyroscope 103, the top cover of the first micro-mechanical accelerometer 104, the top cover of the second micro-mechanical accelerometer 105, and the top cover of the third micro-mechanical accelerometer 106 are attached to the gyroscope support 4 by using a high-viscosity heat-conducting property, a high-heat-conducting property, and a strong insulating property; therefore, the internal space of the inertia measurement assembly can be fully utilized, the installation precision of the inertia device can be ensured, and heat generated by the inertia device can be conducted out through the combined structure in time.
In this embodiment, the inertia measurement assembly further includes:
a housing 1;
a base 8;
an accommodating space is formed between the cover 1 and the base 8, and the first micro-machined gyroscope 101, the second micro-machined gyroscope 102, the third micro-machined gyroscope 103, the first micro-machined accelerometer 104, the second micro-machined accelerometer 105, the third micro-machined accelerometer 106 and the communication board assembly are all located in the accommodating space.
In this embodiment, the inertia measurement assembly further includes: .
The micro-mechanical inertial measurement combination consists of a circuit component, a structural component and a micro-mechanical inertial device. 3 micromechanical gyroscopes and 3 micromechanical accelerometers are directly welded on the circuit board, and the welding positions are shown in figure 1; the printed board in the circuit assembly is a soft-hard combined board, the printed board for mounting the main electronic components is fixed on the top of the gyro bracket through screws, the printed board for welding the micromechanical inertia device is connected with the printed board through a flexible belt, and the top cover of the micromechanical inertia device is adhered on the top of the gyro bracket through glue. The scheme of the micro-mechanical inertia measurement combined circuit adopts the idea of digital integration design, and integrates all modules on one circuit board. Electromagnetic compatibility and anti-interference measures are adopted for each functional module, and the micromechanical gyroscope and the micromechanical accelerometer are directly attached to the gyroscope support in an adhesive mode, so that heat dissipation of an inertial device is facilitated, and the reliability of the device is prevented from being influenced by overhigh temperature. The micromechanical gyroscope and the micromechanical accelerometer are adhered to the structure, and lead sheets with certain thickness are arranged on the structure, so that the irradiation quantity of an inertial device in the space can be greatly reduced, and the improvement of the space environment adaptability of the micromechanical inertial measurement combination is facilitated.
While the present invention has been described in detail with reference to the preferred embodiments, it should be understood that the above description should not be taken as limiting the invention. Various modifications and alterations to this invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be determined from the following claims.
Claims (5)
1. A micro-mechanical inertial measurement unit for a satellite, the inertial measurement unit comprising:
a top support;
a first micromechanical gyroscope mounted to the gyroscope support;
a second micromechanical gyroscope mounted to the gyroscope support;
a third micromechanical gyroscope mounted to the gyroscope support;
a first micromechanical accelerometer mounted to the gyro frame;
a second micro-machined accelerometer mounted to the gyro-mount;
a third micro-machined accelerometer mounted to the gyro-mount;
wherein any two of the measurement axis of the first micromachined gyroscope, the measurement axis of the second micromachined gyroscope, and the measurement axis of the third micromachined gyroscope are perpendicular to each other; any two of the measurement axis of the first micro-machined accelerometer, the measurement axis of the second micro-machined accelerometer, and the measurement axis of the third micro-machined accelerometer are perpendicular to each other.
2. The micromechanical inertial measurement assembly for satellites according to claim 1, wherein the top surface of the first micromechanical gyroscope mounting location, the top surface of the second micromechanical gyroscope mounting location, the top surface of the third micromechanical gyroscope mounting location, the top surface of the first micromechanical accelerometer mounting location, the top surface of the second micromechanical accelerometer mounting location, and the top surface of the third micromechanical accelerometer mounting location are each mounted with a lead skin.
3. The micromechanical inertial measurement assembly for satellites according to claim 1, wherein the first micromechanical gyroscope, the second micromechanical gyroscope, the third micromechanical gyroscope, the first micromechanical accelerometer, the second micromechanical accelerometer, and the third micromechanical accelerometer are all mounted on a communication board assembly.
4. The micromechanical inertial measurement assembly for satellites according to claim 3, wherein the top cover of the first micromechanical gyroscope, the top cover of the second micromechanical gyroscope, the top cover of the third micromechanical gyroscope, the top cover of the first micromechanical accelerometer, the top cover of the second micromechanical accelerometer, and the top cover of the third micromechanical accelerometer are attached to a gyroscope support by using a highly viscous, highly thermally conductive, and highly insulating glue.
5. The micromechanical inertial measurement assembly for satellites according to claim 1, further comprising:
a housing;
a base;
the housing and the base form an accommodating space, and the first micro-machined gyroscope, the second micro-machined gyroscope, the third micro-machined gyroscope, the first micro-machined accelerometer, the second micro-machined accelerometer, the third micro-machined accelerometer and the communication board assembly are all located in the accommodating space.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011021743.9A CN112146652A (en) | 2020-09-25 | 2020-09-25 | Micro-mechanical inertial measurement combination for satellite |
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| CN202011021743.9A CN112146652A (en) | 2020-09-25 | 2020-09-25 | Micro-mechanical inertial measurement combination for satellite |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114414841A (en) * | 2021-12-21 | 2022-04-29 | 上海航天控制技术研究所 | Accelerometer combination |
| CN114413886A (en) * | 2021-12-24 | 2022-04-29 | 上海航天控制技术研究所 | Zero compensation method for combination of satellite-borne accelerometers |
| CN114413873A (en) * | 2021-12-10 | 2022-04-29 | 华中光电技术研究所（中国船舶重工集团公司第七一七研究所） | Inertial measurement unit based on atomic gyroscope and installation method thereof |
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