CN112133648A - Chip production is with wasing and impact vibration detection integrated device - Google Patents
Chip production is with wasing and impact vibration detection integrated device Download PDFInfo
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- CN112133648A CN112133648A CN202010974215.9A CN202010974215A CN112133648A CN 112133648 A CN112133648 A CN 112133648A CN 202010974215 A CN202010974215 A CN 202010974215A CN 112133648 A CN112133648 A CN 112133648A
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- support plate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M7/00—Vibration-testing of structures; Shock-testing of structures
- G01M7/02—Vibration-testing by means of a shake table
- G01M7/025—Measuring arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention discloses a cleaning and impact vibration detection integrated device for chip production, which comprises a device body, a fixing frame and a detection chamber, wherein the upper end of the left side of the device body is provided with a cleaning chamber, a water pump is arranged in the device body, the fixing frame is fixedly installed on the upper end surface of the device body, the top end in the fixing frame is provided with an electric telescopic rod, the lower end of the electric telescopic rod is connected with a storage rack, the detection chamber is arranged at the upper end of the right side of the device body, the upper end of a first spring is connected with a partition plate, and the upper end of a vibration test table is provided with a chip fixing. This chip production is with wasing and impact vibration detection integrated device takes the washing liquid in the wasing chamber out through the water pump and washes the chip through connecting pipe, raceway and spray tube blowout, guarantees that the chip surfacing is clean, and the chip puts on the mount through the charging tray, and the through-hole that sets up on the charging tray is convenient for the drippage of washing liquid, and the spread groove that sets up on the charging tray is conveniently got the chip of putting the thing inslot through tweezers clamp.
Description
Technical Field
The invention relates to the technical field related to chip production, in particular to a cleaning and impact vibration detection integrated device for chip production.
Background
Along with the development of science and technology, the kind of electronic product is also more and more, electronic product's core technology is inside chip, need carry out the impact vibration detection to the chip usually in the production and processing process of chip, vibration test's purpose is to confirm that the chip can bear external vibration from making, and not destroyed and can keep original performance from making, reach life-span and reliability expected, because the most sizes of chip are less, receive external factor influence very easily in vibration test, for example: chip surface impurity influences its and puts the unevenness, influences experimental testing result, and common chip vibration detection device can not wash the processing to the chip, and the chip clamping is fixed unstably in addition, takes place the skew easily in the vibration test process, leads to the testing result inaccuracy.
Disclosure of Invention
The invention aims to provide a cleaning and impact vibration detection integrated device for chip production, which aims to solve the problems that impurities on the surface of a chip, which are provided in the background art, influence the uneven arrangement of the chip and influence the test detection result, a common chip vibration detection device cannot clean the chip, and the chip is not stably clamped and fixed and is easy to deviate in the vibration test process, so that the test result is inaccurate.
In order to achieve the purpose, the invention provides the following technical scheme: a cleaning and impact vibration detection integrated device for chip production comprises a device body, a fixing frame and a detection chamber,
the device comprises a device body, wherein a cleaning chamber is arranged at the upper end of the left side of the device body, the lower end of the cleaning chamber is connected with a water pump, the water pump is arranged in the device body and is connected with a connecting pipe, the connecting pipe is connected with a water pipe, and one end of the water pipe, far away from the connecting pipe, penetrates through the side wall of the cleaning chamber and is connected with a spray pipe;
the fixing frame is fixedly arranged on the upper end face of the device body, a hot air fan is arranged on the inner side wall of the fixing frame, an electric telescopic rod is arranged at the inner top end of the fixing frame, the lower end of the electric telescopic rod is connected with the storage rack, and meanwhile, a material tray is placed on the storage rack;
the device comprises a detection chamber, wherein the detection chamber is arranged at the upper end of the right side of the device body, a first spring is arranged at the bottom in the detection chamber, the upper end of the first spring is connected with a partition plate, a vibration test bed is arranged at the upper end of the partition plate, a chip fixing mechanism is arranged at the upper end of the vibration test bed, and a bolt is arranged on the chip fixing mechanism.
Preferably, the cleaning chamber comprises a first filter layer and a second filter layer, the inner side wall of the cleaning chamber is provided with the first filter layer, the second filter layer is arranged above the first filter layer, and the second filter layer is arranged below the spray pipe.
Preferably, the hot air fans are arranged in two groups and are symmetrically arranged about the center line of the fixing frame.
Preferably, the charging tray is including putting thing groove, spread groove, through-hole and spacing spout, and the charging tray up end has been seted up and has been put thing groove and spread groove, it is linked together to put thing groove and spread groove, and puts the thing groove setting inboard at the spread groove, puts the thing inslot bottom plate simultaneously and has seted up the through-hole, the charging tray lower extreme is provided with spacing spout.
Preferably, the first springs are distributed on the bottom in the detection chamber at equal intervals, the upper ends of the first springs distributed at equal intervals are connected with a partition plate, and meanwhile, the partition plate is in sliding connection with the inner side wall of the detection chamber.
Preferably, the chip fixing mechanism comprises a clamp frame, a chip placing cavity, a U-shaped groove, a first support plate, a second support plate, a third support plate, a screw rod, a first pressing plate, a second spring, a connecting rod, a second pressing plate, a first cushion and a second cushion, the clamp frame is embedded in the side wall of the chip fixing mechanism, the chip placing cavity is arranged on the inner side wall of the clamp frame, the second cushion is arranged on the inner side wall of the chip placing cavity, the U-shaped groove is formed in the side wall of the clamp frame, the first support plate is arranged on the U-shaped groove, the second support plate is arranged on the outer side of the U-shaped groove, the third support plate is arranged on the outer side of the second support plate, the screw rod is arranged on the third support plate, the inner end of the screw rod penetrates through the third support plate and is connected with the first pressing plate, the inner end of the first pressing plate is connected with the second spring and the connecting rod, and the end of the, the inner end of the connecting rod penetrates through the second spring and the first support plate to be connected with the second pressing plate, and a first soft cushion is arranged on the inner end face of the second pressing plate.
Preferably, the chip is placed the equidistant distribution in chamber and is put up at anchor clamps, and every chip places the intracavity and all is provided with a second cushion, and the chip is placed the chamber and is set up inboard at first cushion simultaneously.
Preferably, the screws are distributed on the third support plate at equal intervals, and the screw threads penetrate through the third support plate and are connected with the first pressing plate in a rotating mode.
Preferably, the bolt penetrates through the chip fixing mechanism and is connected to the vibration test bed in a threaded mode, and the bolt is symmetrically arranged relative to the center line of the chip fixing mechanism.
Compared with the prior art, the invention has the beneficial effects that: the integrated cleaning and impact vibration detection device for chip production,
(1) cleaning liquid in the cleaning chamber is pumped out by a water pump and is sprayed out through a connecting pipe, a water delivery pipe and a spray pipe to wash the chip, so that the surface of the chip is ensured to be flat and clean, the chip is placed on the fixing frame through the material tray, the cleaning liquid is convenient to drip through a through hole formed in the material tray, and the chip in the material holding groove is convenient to clamp by tweezers through a connecting groove formed in the material tray;
(2) a first filter layer and a second filter layer are arranged in the cleaning chamber, the cleaning liquid can be filtered under the action of the first filter layer and the second filter layer, the cleaning liquid can be recycled, and the cleaned chip is dried under the action of a hot air fan;
(3) the first spring is arranged in the detection chamber, vibration generated in the operation process of the vibration test bed can be relieved through the first spring, and meanwhile, the chip fixing mechanism is fixedly arranged on the vibration test bed through a bolt, so that the bolt is disassembled, and the chip fixing mechanism is convenient to disassemble, take down, maintain or replace;
(4) place the intracavity with the chip as for the chip, twist and move the screw rod and promote first clamp plate, first clamp plate compression spring and first clamp plate promote the second clamp plate through the connecting rod and compress tightly fixedly to the chip, and first cushion and second cushion can play the protection to the chip, and the reinforcing avoids chip vibration test process to take place the skew to compressing tightly the pretightning force to the chip simultaneously.
Drawings
FIG. 1 is a schematic front sectional view of the present invention;
FIG. 2 is a schematic structural diagram of a vibration test bed according to the present invention;
FIG. 3 is a schematic structural view of a chip fixing mechanism according to the present invention;
FIG. 4 is a schematic view of the tray structure of the present invention;
FIG. 5 is a schematic view of a connection structure between a bolt and a chip fixing mechanism according to the present invention;
FIG. 6 is a schematic view of the structure between the tray and the rack of the present invention;
FIG. 7 is an enlarged view of the structure at A in FIG. 1 according to the present invention;
FIG. 8 is an enlarged view of the structure at B in FIG. 2 according to the present invention.
In the figure: 1. the device body, 2, the purge chamber, 201, first filter layer, 202, the second filter layer, 3, the water pump, 4, the connecting pipe, 5, the raceway, 6, the spray tube, 7, the mount, 8, hot-blast fan, 9, electric telescopic handle, 10, the supporter, 11, the charging tray, 1101, put the thing groove, 1102, the spread groove, 1103, the through-hole, 1104, spacing spout, 12, detect the room, 13, first spring, 14, the baffle, 15, the vibration test bench, 16, chip fixed establishment, 1601, the anchor clamps frame, 1602, the chamber is placed to the chip, 1603, U type groove, 1604, first extension board, 1605, the second extension board, 1606, the third extension board, 1607, the screw rod, 1608, first clamp plate, 1609, the second spring, 1610, the connecting rod, 1611, the second clamp plate, 1612, 161, 3, the second cushion, 17, the bolt.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-8, the present invention provides a technical solution: a cleaning and impact vibration detection integrated device for chip production is disclosed, as shown in figure 1, a cleaning chamber 2 is arranged at the upper end of the left side of a device body 1, the lower end of the cleaning chamber 2 is connected with a water pump 3, the cleaning chamber 2 comprises a first filter layer 201 and a second filter layer 202, the inner side wall of the cleaning chamber 2 is provided with the first filter layer 201, the second filter layer 202 is arranged above the first filter layer 201, the second filter layer 202 is arranged below a spray pipe 6, cleaning liquid can be filtered and recycled under the action of the first filter layer 201 and the second filter layer 202, the water pump 3 is arranged in the device body 1, the water pump 3 is connected with a connecting pipe 4, the connecting pipe 4 is connected with a water pipe 5, one end of the water pipe 5, which is far away from the connecting pipe 4, penetrates through the side wall of the cleaning chamber 2 and is connected with the spray pipe 6, a fixing frame 7 is fixedly arranged at the upper end, the hot air fans 8 are arranged in two groups, the hot air fans 8 are symmetrically arranged about the central line of the fixing frame 7, and the cleaned chips are dried under the action of the hot air fans 8.
As shown in fig. 1, 4, 6 and 7, an electric telescopic rod 9 is disposed at the top end of the fixing frame 7, the lower end of the electric telescopic rod 9 is connected to the rack 10, the rack 10 is placed with a tray 11, the tray 11 includes a placement groove 1101, a connection groove 1102, a through hole 1103 and a limit chute 1104, the upper end surface of the tray 11 is provided with a placement groove 1101 and a connection groove 1102, the placement groove 1101 is communicated with the connection groove 1102, the placement groove 1101 is disposed inside the connection groove 1102, the bottom plate of the placement groove 1101 is provided with a through hole 1103, the lower end of the tray 11 is provided with a limit chute 1104, the through hole 1103 facilitates the washing liquid to drip, the tray 11 is placed on the rack 10 through the limit chute 1104, the detection chamber 12 is disposed at the upper end of the right side of the device body 1, the bottom of the detection chamber 12 is provided with first springs 13, the first springs 13 are equidistantly distributed at the bottom of the detection chamber 12, and the upper ends of the first springs, meanwhile, the partition 14 is in sliding connection with the inner side wall of the detection chamber 12, and the first spring 13 can reduce vibration generated in the operation process of the vibration test bed 15.
As shown in fig. 1, 2, 3, 5 and 8, the upper end of the first spring 13 is connected to the partition 14, the upper end of the partition 14 is provided with a vibration testing table 15, the upper end of the vibration testing table 15 is provided with a chip fixing mechanism 16, the chip fixing mechanism 16 is provided with a bolt 17, the chip fixing mechanism 16 comprises a clamp frame 1601, a chip placing cavity 1602, a U-shaped groove 1603, a first support plate 1604, a second support plate 1605, a third support plate 1606, a screw 1607, a first pressing plate 1608, a second spring 1609, a connecting rod 1610, a second pressing plate 1611, a first cushion 1612 and a second cushion 1613, the side wall of the chip fixing mechanism 16 is embedded with the clamp frame 1601, the inner side wall of the clamp frame 1601 is provided with the chip placing cavity 1602, the inner side wall of the chip placing cavity 1602 is provided with the second cushion 1613, the side wall of the clamp frame 1601 is provided with the U-shaped groove 1603, the U-shaped groove 1603 is provided with the first cushion, the clamp frame 1601, the second support plate 1605 is arranged outside the U-shaped groove 1603, the third support plate 1606 is arranged outside the second support plate 1605, a screw 1607 is arranged on the third support plate 1606, the inner end of the screw 1607 penetrates through the third support plate 1606 to be connected with the first pressure plate 1608, the inner end of the first pressure plate 1608 is connected with the second spring 1609 and the connecting rod 1610, one end, far away from the first pressure plate 1608, of the second spring 1609 is arranged on the first support plate 1604, the inner end of the connecting rod 1610 penetrates through the second spring 1609 and the first support plate 1604 to be connected with the second pressure plate 1611, the inner end face of the second pressure plate 1611 is provided with a first soft cushion 1612, the chips are arranged in the chip placing cavities 1602 and are matched with the second pressure plate 1611 to press the chips tightly, so that the vibration detection process is prevented from deviating, the chip placing cavities 1602 are distributed on the fixture frame 1601 at equal intervals, each chip placing cavity 1602 is provided with a second soft cushion 1613, and the chip placing cavity 1602 is arranged, second cushion 1613 plays the protective effect to the chip, the reinforcing compresses tightly the pretightning force to the chip simultaneously, screw rod 1607 equidistant distribution is on third extension board 1606, and screw rod 1607 screw thread runs through third extension board 1606 and rotates and be connected with first clamp plate 1608, it promotes first clamp plate 1608 and compresses second spring 1609 to twist screw rod 1607, first clamp plate 1608 promotes second clamp plate 1611 through connecting rod 1610 and compresses tightly the chip, second spring 1609 plays certain buffering effect that compresses tightly, bolt 17 runs through 16 threaded connection of chip fixed establishment 15 on vibration test platform 15, and bolt 17 sets up about 16 central lines symmetry of chip fixed establishment, dismantle bolt 17, conveniently dismantle maintenance or change chip fixed establishment 16.
The working principle is as follows: when the integrated device for cleaning and impact vibration detection for chip production is used, a power supply is switched on, chips are placed in the storage groove 1101 on the tray 11, the tray 11 with the chips placed is placed on the storage rack 10 through the limiting sliding groove 1104, the storage rack 10 is pushed to descend to a proper height under the action of the electric telescopic rod 9, the water pump 3 sprays cleaning liquid in the cleaning chamber 2 through the connecting pipe 4, the water conveying pipe 5 and the spray pipe 6 to clean the chips, the cleaned liquid is filtered by the first filter layer 201 and the second filter layer 202 and can be recycled, after the chips are cleaned, the storage rack 10 is lifted under the action of the electric telescopic rod 9, the chips are dried under the action of the hot air fan 8, after the chips are dried, the tray 11 is taken down and placed on the device body 1, the chips are taken out through the connecting groove 1102 and placed in the chip placing cavity 1602 by using tweezers, the screw 1607 is screwed, screw 1607 promotes first clamp plate 1608 and compresses second spring 1609, first clamp plate 1608 promotes second clamp plate 1611 through connecting rod 1610 and compresses tightly the chip, second spring 1609 plays certain buffering effect that compresses tightly, play the protection effect to the chip under first cushion 1612 and second cushion 1613 effect, strengthen the pretightning force that compresses tightly to the chip simultaneously, through vibration test of vibration test bench 15 to the chip, can dismantle bolt 17, dismantle maintenance or change to chip fixed establishment 16, the content that does not make detailed description in this specification belongs to the prior art that the professional of this field knows well.
The terms "central," "longitudinal," "lateral," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for simplicity of description only and are not intended to indicate or imply that the referenced devices or elements must be in a particular orientation, constructed and operative in a particular orientation, and are not to be considered limiting of the claimed invention.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.
Claims (9)
1. The utility model provides a chip production is with wasing and impact vibration detection integrated device, includes the device body (1), mount (7) and detection room (12), its characterized in that:
the device comprises a device body (1), wherein a cleaning chamber (2) is arranged at the upper end of the left side of the device body (1), the lower end of the cleaning chamber (2) is connected with a water pump (3), the water pump (3) is arranged in the device body (1), the water pump (3) is connected with a connecting pipe (4), the connecting pipe (4) is connected with a water conveying pipe (5), and one end, far away from the connecting pipe (4), of the water conveying pipe (5) penetrates through the side wall of the cleaning chamber (2) and is connected with a spray pipe (6);
the fixing frame (7) is fixedly arranged on the upper end face of the device body (1), a hot air fan (8) is arranged on the inner side wall of the fixing frame (7), an electric telescopic rod (9) is arranged at the top end in the fixing frame (7), the lower end of the electric telescopic rod (9) is connected with a storage rack (10), and meanwhile, a storage tray (11) is placed on the storage rack (10);
detect room (12), detect room (12) and set up in the right side upper end of the device body (1), and the bottom is provided with first spring (13) in detecting room (12), first spring (13) upper end is connected with baffle (14), and baffle (14) upper end is provided with vibration test platform (15), vibration test platform (15) upper end is provided with chip fixed establishment (16), and is provided with bolt (17) on chip fixed establishment (16).
2. The integrated cleaning and impact vibration detection device for chip production according to claim 1, wherein the integrated cleaning and impact vibration detection device comprises: the cleaning chamber (2) comprises a first filter layer (201) and a second filter layer (202), the inner side wall of the cleaning chamber (2) is provided with the first filter layer (201), the second filter layer (202) is arranged above the first filter layer (201), and the second filter layer (202) is arranged below the spray pipe (6).
3. The integrated cleaning and impact vibration detection device for chip production according to claim 1, wherein the integrated cleaning and impact vibration detection device comprises: the hot air fans (8) are arranged in two groups, and the hot air fans (8) are symmetrically arranged relative to the center line of the fixing frame (7).
4. The integrated cleaning and impact vibration detection device for chip production according to claim 1, wherein the integrated cleaning and impact vibration detection device comprises: the utility model discloses a portable electronic device, including connecting groove (1102), connecting groove (1101), through-hole (1103) and spacing spout (1104), charging tray (11) are including putting thing groove (1101), connecting groove (1102), through-hole (1103) and spacing spout (1104), and charging tray (11) up end has seted up and has put thing groove (1101) and connecting groove (1102), it is linked together to put thing groove (1101) and connecting groove (1102), and puts thing groove (1101) and set up at connecting groove (1102) inboardly, puts thing groove (1101) infrabasal plate simultaneously and has seted up through-hole (1103), charging tray (.
5. The integrated cleaning and impact vibration detection device for chip production according to claim 1, wherein the integrated cleaning and impact vibration detection device comprises: the first springs (13) are distributed on the bottom in the detection chamber (12) at equal intervals, the upper ends of the first springs (13) distributed at equal intervals are connected with a partition plate (14), and meanwhile the partition plate (14) is in sliding connection with the inner side wall of the detection chamber (12).
6. The integrated cleaning and impact vibration detection device for chip production according to claim 1, wherein the integrated cleaning and impact vibration detection device comprises: the chip fixing mechanism (16) comprises a clamp frame (1601), a chip placing cavity (1602), a U-shaped groove (1603), a first support plate (1604), a second support plate (1605), a third support plate (1606), a screw (1607), a first pressing plate (1608), a second spring (1609), a connecting rod (1610), a second pressing plate (1611), a first cushion (1612) and a second cushion (1613), wherein the side wall of the chip fixing mechanism (16) is embedded into the clamp frame (1601), the inner side wall of the clamp frame (1601) is provided with the chip placing cavity (1602), the inner side wall of the chip placing cavity (1602) is provided with the second cushion (1613), the side wall of the clamp frame (1601) is provided with the U-shaped groove (1603), the U-shaped groove (1603) is provided with the first support plate (1604), the clamp frame (1601) is provided with the second support plate (1605), and the second support plate (1605) is arranged outside the U-shaped groove (1603), the outer side of the second support plate (1605) is provided with a third support plate (1606), the third support plate (1606) is provided with a screw rod (1607), the inner end of the screw rod (1607) penetrates through the third support plate (1606) and is connected with a first pressing plate (1608), the inner end of the first pressing plate (1608) is connected with a second spring (1609) and a connecting rod (1610), one end, far away from the first pressing plate (1608), of the second spring (1609) is arranged on the first support plate (1604), the inner end of the connecting rod (1610) penetrates through the second spring (1609) and the first support plate (1604) and is connected with a second pressing plate (1611), and the inner end face of the second pressing plate (1611) is provided with a first cushion (1612).
7. The integrated cleaning and impact vibration detection device for chip production according to claim 6, wherein: the chip is placed chamber (1602) equidistant distribution on anchor clamps frame (1601), and every chip places all is provided with a second cushion (1613) in chamber (1602), and the chip is placed chamber (1602) and is set up inboard at first cushion (1612) simultaneously.
8. The integrated cleaning and impact vibration detection device for chip production according to claim 6, wherein: the screw rods (1607) are distributed on the third support plate (1606) at equal intervals, and the screw threads of the screw rods (1607) penetrate through the third support plate (1606) and are connected with a first pressing plate (1608) in a rotating mode.
9. The integrated cleaning and impact vibration detection device for chip production according to claim 1, wherein the integrated cleaning and impact vibration detection device comprises: the bolt (17) penetrates through the chip fixing mechanism (16) and is in threaded connection with the vibration test bed (15), and the bolt (17) is symmetrically arranged relative to the center line of the chip fixing mechanism (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010974215.9A CN112133648A (en) | 2020-09-16 | 2020-09-16 | Chip production is with wasing and impact vibration detection integrated device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010974215.9A CN112133648A (en) | 2020-09-16 | 2020-09-16 | Chip production is with wasing and impact vibration detection integrated device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112133648A true CN112133648A (en) | 2020-12-25 |
Family
ID=73846889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010974215.9A Withdrawn CN112133648A (en) | 2020-09-16 | 2020-09-16 | Chip production is with wasing and impact vibration detection integrated device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112133648A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116453995A (en) * | 2023-06-16 | 2023-07-18 | 淄博美林电子有限公司 | Full-automatic IGBT production line |
-
2020
- 2020-09-16 CN CN202010974215.9A patent/CN112133648A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116453995A (en) * | 2023-06-16 | 2023-07-18 | 淄博美林电子有限公司 | Full-automatic IGBT production line |
| CN116453995B (en) * | 2023-06-16 | 2023-08-29 | 淄博美林电子有限公司 | Full-automatic IGBT production line |
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Application publication date: 20201225 |