CN112131911A

CN112131911A - Display module device, electronic apparatus, and method of assembling display module device

Info

Publication number: CN112131911A
Application number: CN201910554774.1A
Authority: CN
Inventors: 杨自美; 袁石林; 冉可
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-06-25
Filing date: 2019-06-25
Publication date: 2020-12-25

Abstract

The application discloses a display assembly device, an electronic apparatus, and an assembling method of the display assembly device. The display assembly device comprises a display module, a capacitive fingerprint sensor diaphragm and a cover plate. Capacitive fingerprint sensor diaphragm is located and covers the display surface of display module assembly between apron and the display module assembly to the user's fingerprint of response touch to apron. The capacitive fingerprint sensor diaphragm is used for achieving a fingerprint identification function, and the capacitive fingerprint sensor diaphragm is also used as a touch sensor of the display module to achieve a touch control function. In the embodiment of the application, the capacitive fingerprint sensor membrane covers the display surface, so that a full-screen fingerprint identification function can be realized, and compared with local fingerprint identification, the operation is more convenient; in addition, the capacitive fingerprint sensor diaphragm is adopted for fingerprint identification, and compared with optical fingerprint identification, a camera with a large size is not required to be arranged, only one layer of capacitive fingerprint sensor diaphragm is required, the thickness is small, and the capacitive fingerprint sensor diaphragm is more advantageous in space design.

Description

Display module device, electronic apparatus, and method of assembling display module device

Technical Field

The present disclosure relates to the field of fingerprint identification technologies, and more particularly, to a display module device, an electronic device, and an assembling method of the display module device.

Background

With the continuous development of the intelligent mobile terminal technology, the application of fingerprint identification is more and more extensive. For example, fingerprint recognition may be used for screen unlocking, quick payment, encryption, fingerprint key functionality, and the like. The current fingerprint identification scheme is mainly optical fingerprint identification under a partial screen. The optical fingerprint identification collects fingerprint pictures through the camera, then the fingerprint pictures are matched with user fingerprints input in the system, and if the fingerprint pictures are matched with the user fingerprints input in the system, the fingerprint identification is passed. However, the camera is bulky and requires a lot of space.

Disclosure of Invention

The embodiment of the application provides a display assembly device, an electronic device and an assembling method of the display assembly device.

The display module assembly device of this application embodiment includes display module assembly, capacitanc fingerprint sensor diaphragm and apron, capacitanc fingerprint sensor diaphragm is located the apron with between the display module assembly and cover the display surface of display module assembly, in order to respond to the touch extremely the user fingerprint of apron, capacitanc fingerprint sensor diaphragm is used for realizing the fingerprint identification function, capacitanc fingerprint sensor diaphragm still serves the touch sensor of display module assembly realizes the touch-control function.

The electronic device of the embodiment of the present application includes a housing and the display module apparatus of the above embodiment, and the display module apparatus is combined with the housing.

The method for assembling the display module device according to the embodiment of the present application includes: providing a display module, a capacitive fingerprint sensor diaphragm and a cover plate; arranging the capacitive fingerprint sensor membrane between the cover plate and the display module and enabling the capacitive fingerprint sensor membrane to cover the display surface of the display module so as to sense the fingerprint of a user touching the cover plate; the capacitive fingerprint sensor diaphragm is used for achieving a fingerprint identification function, and the capacitive fingerprint sensor diaphragm is also used as a touch sensor of the display module to achieve a touch control function.

According to the display component device, the electronic equipment and the assembling method of the display component device, the capacitive fingerprint sensor membrane covers the display surface, the full-screen fingerprint identification function can be achieved, and compared with local fingerprint identification, the operation is more convenient and faster; in addition, the capacitive fingerprint sensor diaphragm is adopted for fingerprint identification, compared with optical fingerprint identification, a camera with larger volume is not required to be arranged, only one layer of capacitive fingerprint sensor diaphragm is required, the thickness is thinner, and the space design is more advantageous; furthermore, the display module assembly does not need to be additionally provided with a touch sensor, the dual functions of fingerprint identification and touch control can be realized through the capacitive fingerprint sensor diaphragm, the display module assembly is simple in structure, thin in thickness, high in integration level, low in cost and better in light transmission, the number and the volume of connecting terminals of the display module assembly can be reduced, and the design difficulty is reduced.

Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIGS. 1 and 2 are schematic structural views of an electronic device according to some embodiments of the present application;

FIG. 3 is an exploded schematic view of a display assembly apparatus according to certain embodiments of the present application;

FIGS. 4-6 are schematic cross-sectional views of display assembly apparatus according to certain embodiments of the present application;

FIG. 7 is a schematic diagram of a capacitive fingerprint sensor diaphragm according to certain embodiments of the present application;

FIG. 8 is a schematic cross-sectional view of an LCM (liquid Crystal Display Module) Display screen according to certain embodiments of the present application;

FIG. 9 is a schematic cross-sectional view of an Organic Light-Emitting Diode (OLED) display panel according to some embodiments of the present disclosure;

FIGS. 10-15 are schematic cross-sectional views of display assembly apparatus according to certain embodiments of the present application;

FIGS. 16-20 are schematic flow charts illustrating methods of assembling display module assemblies according to certain embodiments of the present disclosure;

FIG. 21 is a schematic cross-sectional view of a display assembly apparatus according to certain embodiments of the present application;

FIG. 22 is a schematic cross-sectional view of a polarizer according to certain embodiments of the present application;

FIG. 23 is a schematic cross-sectional view of an LCM display screen according to certain embodiments of the present application;

FIG. 24 is a schematic cross-sectional view of an OLED display screen according to certain embodiments of the present application;

FIGS. 25-28 are schematic cross-sectional views of display assembly apparatus according to certain embodiments of the present application;

FIG. 29 is a schematic structural view of a capacitive fingerprint sensor diaphragm according to certain embodiments of the present application;

fig. 30-32 are schematic views of the capacitive fingerprint sensor membrane and the display module according to some embodiments of the present disclosure.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the embodiments of the present application.

Referring to fig. 1, an electronic device 1000 according to an embodiment of the present disclosure includes a housing 200 and a display assembly apparatus 100. The display module apparatus 100 is combined with the set cover 200. Specifically, the electronic device 1000 may be a mobile phone, a tablet computer, a display, a notebook computer, a teller machine, a gate, a smart watch, a head-up display device, a game console, and the like. In the embodiment of the present application, the electronic device 1000 is a mobile phone as an example, and it is understood that the specific form of the electronic device 1000 is not limited to the mobile phone.

The chassis 200 may be used to mount the display assembly apparatus 100, or the chassis 200 may serve as a mounting carrier of the display assembly apparatus 100. Specifically, referring to fig. 2, the chassis 200 includes a front case 210, and the display device assembly 100 may be assembled with the front case 210 by side glue or glue. The chassis 200 may also be used to install functional modules of the electronic device 1000, such as a power supply device, an imaging device, and a communication device, so that the chassis 200 provides protection for the functional modules, such as dust prevention, drop prevention, and water prevention.

Referring to fig. 3 and 4, the display device 100 includes a display module 30, a capacitive fingerprint sensor film 20, and a cover 10. The capacitive fingerprint sensor film 20 is located between the cover plate 10 and the display module 30 and covers the display surface 31 of the display module 30 to sense the fingerprint of a user touching the cover plate 10. The capacitive fingerprint sensor diaphragm 20 is used for realizing a fingerprint identification function, and the capacitive fingerprint sensor diaphragm 20 is also used as a touch sensor of the display module 30 to realize a touch function.

In the display module device 100 and the electronic device 1000 according to the embodiment of the application, the capacitive fingerprint sensor membrane 20 covers the display surface 31, so that a full-screen fingerprint identification function can be realized, and the operation is more convenient and faster compared with a local fingerprint; in addition, the capacitive fingerprint sensor diaphragm 20 is adopted for fingerprint identification, compared with optical fingerprint identification, a camera with a larger volume is not required to be arranged, only one layer of capacitive fingerprint sensor diaphragm 20 is required, the thickness is thinner, and the space design is more advantageous; furthermore, the display module assembly 30 does not need to be additionally provided with a touch sensor, and can realize dual functions of fingerprint identification and touch control through the capacitive fingerprint sensor diaphragm 20, so that the display module assembly device 100 is simple in structure, thin in thickness, high in integration level, low in cost and better in light transmission, the number and the volume of connecting terminals of the display module assembly device 100 can be reduced, and the design difficulty is reduced.

Wherein the capacitive fingerprint sensor membrane 20 may be a full screen capacitive fingerprint sensor membrane. "full screen" means that the capacitive fingerprint sensor membrane 20 covers the display surface 31 up to a predetermined percentage. For example, the capacitive fingerprint sensor membrane 20 covers the display surface 31 by 80%, 85%, 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, 99% or 100%, and even the capacitive fingerprint sensor membrane 20 covers the display surface 31 by more than 100%, where the capacitive fingerprint sensor membrane 20 covers and extends beyond the display surface 31.

Referring to fig. 3 and 4, in the present embodiment, the display device 100 includes a cover plate 10, a capacitive fingerprint sensor film 20, a display module 30 and a glue 40.

The display module device 100 has a light emitting direction, and the display module 30, the capacitive fingerprint sensor film 20 and the cover plate 10 are arranged along the light emitting direction; or, the cover plate 10, the capacitive fingerprint sensor film 20 and the display module 30 are disposed in the opposite direction of the light emitting direction. In the embodiment of the present application, the light emitting direction of the display device 100 is the light emitting direction of the display module 30.

The cover plate 10 serves to protect the capacitive fingerprint sensor membrane 20. The cover plate 10 may be made of any one of Sapphire (Sapphire), glass, Polyimide (PI), Polyethylene terephthalate (PET), and composite sheets. The composite plate includes Polymethyl methacrylate (PMMA) and polyamide resin (PC).

In one embodiment, the cover plate 10 is made of sapphire. Sapphire is a generic term for corundum stones of other colors than Ruby (Ruby). Sapphire has the advantages of high hardness, high transparency (about 85%), low dielectric constant (9.3-11.5) and the like. When the cover plate 10 is made of sapphire, the cover plate 10 has the advantages of high hardness, high strength, good sand paper falling effect (the cement ground can bear the falling of 1.2m height), scratch resistance and the like. When the cover plate 10 is made of sapphire, the thickness of the cover plate 10 is 0.2 mm-0.5 mm. That is, the thickness of the cap plate 10 is any value between 0.2mm and 0.5 mm. For example, the thickness of the cap plate 10 is 0.2mm, 0.23mm, 0.26mm, 0.29mm, 0.32mm, 0.35mm, 0.38mm, 0.41mm, 0.44mm, 0.47mm, 0.5mm, or the like.

In one embodiment, the cover plate 10 is made of glass. When the cover plate 10 is made of glass, the cover plate 10 has the advantages of high strength, low cost and the like. When the cover plate 10 is made of glass, the thickness of the cover plate 10 is 0.1 mm-0.4 mm. That is, the thickness of the cap plate 10 is any value between 0.1mm and 0.4 mm. For example, the thickness of the cap plate 10 is 0.1mm, 0.13mm, 0.16mm, 0.19mm, 0.22mm, 0.25mm, 0.28mm, 0.31mm, 0.34mm, 0.37mm, 0.4mm, or the like.

In one embodiment, the material of the cover plate 10 is PI. When the material of apron 10 is PI, apron 10 is flexible apron, and has advantages such as abrasive paper falls effectually. When the material of the cover plate 10 is PI, the thickness of the cover plate 10 is 0.1 mm-0.3 mm. That is, the thickness of the cap plate 10 is any value between 0.1mm and 0.3 mm. For example, the thickness of the cap plate 10 is 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, 0.2mm, 0.22mm, 0.24mm, 0.26mm, 0.28mm, 0.3mm, etc.

In one embodiment, the cover plate 10 is made of PET. When the material of apron 10 is PET, apron 10 is flexible apron, and has the advantage such as abrasive paper falls effectually. When the cover plate 10 is made of PET, the thickness of the cover plate 10 is 0.1 mm-0.3 mm. That is, the thickness of the cap plate 10 is any value between 0.1mm and 0.3 mm. For example, the thickness of the cap plate 10 is 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, 0.2mm, 0.22mm, 0.24mm, 0.26mm, 0.28mm, 0.3mm, etc.

In one embodiment, the cover plate 10 is made of a composite plate. The composite board is made of PMMA + PC through processes of welding, pressing and the like. PMMA has the advantages of scratch resistance and the like, while PC has the advantages of good toughness and the like, so that, when the cover plate 10 is made of a composite plate, the cover plate 10 has the advantages of scratch resistance, good toughness and the like. When the cover plate 10 is made of the composite plate, the thickness of the cover plate 10 is 0.1 mm-0.4 mm. That is, the thickness of the cap plate 10 is any value between 0.1mm and 0.4 mm. For example, the thickness of the cap plate 10 is 0.1mm, 0.13mm, 0.16mm, 0.19mm, 0.22mm, 0.25mm, 0.28mm, 0.31mm, 0.34mm, 0.37mm, 0.4mm, or the like. Wherein the thickness of PMMA is about 0.07 mm.

It will be appreciated that when the electronic device 1000 is used for fingerprint recognition, a user's finger presses on the cover 10. If the thickness of the cover plate 10 is large, the sensitivity of the capacitive fingerprint sensor diaphragm 20 will be affected, and the electronic device 1000 cannot be thinned; if the thickness of the cover plate 10 is small, the capacitive fingerprint sensor diaphragm 20 cannot be well protected by being pressed by a user. Therefore, when the material and thickness of the cover plate 10 satisfy the conditions in the above embodiments, the sensitivity of the capacitive fingerprint sensor diaphragm 20 can be ensured, and the electronic device 1000 can be thinned, and the capacitive fingerprint sensor diaphragm 20 can be well protected under the pressing of a user.

Referring to fig. 5, the cover plate 10 includes a cover plate light-emitting surface 11 and a cover plate back surface 12 opposite to each other. The cover back 12 is opposite the capacitive fingerprint sensor diaphragm 20. The cover plate back surface 12 may be provided with an ink layer 13. Specifically, the ink layer 13 may be formed on the cover plate back surface 12 by a screen printing technique. The ink layer 13 has a high attenuation rate for visible light, for example, up to 70%, so that it is difficult for a user to see the area covered by the ink in the electronic device 1000 with naked eyes in normal use. For example, it is difficult for a user to see the capacitive fingerprint sensor diaphragm 20 and the display module 30 inside the electronic device 1000 through the cover plate 10, and the electronic device 1000 has a beautiful appearance.

The thickness of the ink layer 13 is less than or equal to 0.2 mm. The thickness of the ink layer 13 is less than or equal to 0.2mm, so that the thickness of the display module device 100 is relatively thin, which is also beneficial for reducing the thickness of the electronic device 1000.

Referring to fig. 4 again, the capacitive fingerprint sensor film 20 is located between the cover 10 and the display module 30 and covers the display surface 31 of the display module 30 to sense the fingerprint of the user touching the cover 10. The capacitive fingerprint sensor membrane 20 may be arranged on the cover plate 10, in particular on one side of the cover plate back 12, by means of a glue 40. The capacitive fingerprint sensor membrane 20 comprises a sensor light exit surface 21 and a sensor back surface 22, which are opposite each other. The sensor light emitting surface 21 is opposite to the cover 10 (specifically, opposite to the cover back 12), and the sensor back 22 is opposite to the display module 30.

The capacitive fingerprint sensor membrane 20 may cover the entire display surface 31 to better achieve a full screen fingerprint identification function. Namely: the capacitive fingerprint sensor membrane 20 covers up to 100% or more than 100% of the display surface 31. When capacitanc fingerprint sensor diaphragm 20 covers whole display surface 31, the user can press at the optional position that display module assembly 30 corresponds, and the homoenergetic reaches fingerprint identification's purpose, and is not limited to certain specific position that display module assembly 30 corresponds, and user operation is comparatively convenient. Alternatively, the same user may press a plurality of corresponding positions on the display module 30 by using a plurality of fingers simultaneously or in a time-sharing manner; or, a plurality of users can adopt a plurality of fingers to press a plurality of positions that correspond on the display module assembly 30 simultaneously or timesharing to realize carrying out the purpose of discerning a plurality of fingerprints, strengthen the security level that electronic equipment 1000 encrypted and unlocked.

Referring to fig. 4, in an embodiment, the capacitive fingerprint sensor diaphragm 20 just covers the entire display surface 31 (that is, the capacitive fingerprint sensor diaphragm 20 just covers the display surface 31 by 100%), the edges of the capacitive fingerprint sensor diaphragm 20 and the display module 30 are neatly arranged, which is beneficial to ensuring the stability of the combination of the capacitive fingerprint sensor diaphragm 20 and the display module 30, and the capacitive fingerprint sensor diaphragm 20 can realize the capacitive fingerprint identification function of the entire display module 30 with a small area. Referring to fig. 6, in another embodiment, the capacitive fingerprint sensor film 20 covers and exceeds the entire display surface 31 (i.e. the capacitive fingerprint sensor film 20 covers more than 100% of the display surface 31) to ensure the reliability of the fingerprint identification performance of the edge position of the display module 30.

The thickness of the capacitive fingerprint sensor diaphragm 20 is about 0.3 mm. The material of the capacitive fingerprint sensor diaphragm 20 (i.e., the material of the sensor substrate 28 described later) is glass or PI. The circuit material of the capacitive fingerprint sensor diaphragm 20 (i.e., the material of the sensor circuit layer 29) includes any one of metal, Indium Tin Oxide (ITO), or nano silver paste. The material of the capacitive fingerprint sensor diaphragm 20 and the material of the circuit of the capacitive fingerprint sensor diaphragm 20 can be matched arbitrarily. For example, the capacitive fingerprint sensor diaphragm 20 is made of glass, and the circuit of the capacitive fingerprint sensor diaphragm 20 is made of metal; or, the capacitive fingerprint sensor diaphragm 20 is made of glass, and the circuit of the capacitive fingerprint sensor diaphragm 20 is made of ITO; or the capacitive fingerprint sensor diaphragm 20 is made of glass, and the circuit of the capacitive fingerprint sensor diaphragm 20 is made of nano silver paste; or the capacitive fingerprint sensor diaphragm 20 is made of PI, and the circuit of the capacitive fingerprint sensor diaphragm 20 is made of metal; or the capacitive fingerprint sensor diaphragm 20 is made of PI, and the circuit of the capacitive fingerprint sensor diaphragm 20 is made of ITO; or, the material of the capacitive fingerprint sensor diaphragm 20 is PI, and the material of the circuit of the capacitive fingerprint sensor diaphragm 20 is nano silver paste, etc., which is not limited herein.

Referring to FIG. 7, the capacitive fingerprint sensor diaphragm 20 may include a pixel sensor 23, a sensor plate 24, a pixel amplifier 25, output lines 26, and a power supply 27. The pixel sensor 23 is disposed on a sensor board 24. The pixel sensors 23 are distributed in an array. For example, inside one capacitive fingerprint sensor membrane 20, 100 x 100 pixel sensors 23, i.e. 10000 micro pixel sensors 23, may be comprised. The pixel sensor 23 is disposed on one side of the sensor board 24, and the pixel amplifier 25 and the output line 26 are disposed on the other side of the sensor board 24. The pixel amplifier 25 is for amplifying the signal of the pixel sensor 23 and outputting through an output line 26. The output line 26 may include a plurality of lines, one for each pixel amplifier 25 and one for each

pixel sensor

23, 26. A power supply 27 is connected to the sensor plate 24 for applying a voltage to form an electric field. The power supply 27 may or may not be provided on the sensor board 24. While the power supply 27 may be provided on the sensor board 24, the power supply 27 may be mounted on the sensor board 24 by welding or attaching. The capacitive fingerprint sensor diaphragm 20 may further comprise a semiconductor substrate (not shown), in which case the semiconductor substrate is opposite the sensor plate 24, the semiconductor substrate being arranged on the other side of the sensor plate 24, and the pixel amplifiers 25 and the output lines 26 being arranged on the semiconductor substrate. The side of the sensor board 24 on which the pixel sensors 23 are arranged serves as the sensor light exit surface 21, and the side on which the semiconductor substrate is located serves as the sensor back surface 22. It is noted that the configuration of the capacitive fingerprint sensor membrane 20 corresponding to fig. 7 is merely exemplary, and in other embodiments, the capacitive fingerprint sensor membrane 20 may have other configurations.

When the electronic device 1000 is used for fingerprint recognition, a user's finger is pressed against the capacitive fingerprint sensor membrane 20 by the cover plate 10, the pixel sensor 23 constituting one plate of a capacitor and the finger skin constituting the other plate of the capacitor. Because the finger surface has wave crests and wave troughs, and the distances between the wave crests and the wave troughs and the corresponding pixel sensors 23 are different, the formed capacitance values are also different, and the corresponding fingerprint images can be obtained according to the capacitance values.

The capacitive fingerprint sensor diaphragm 20 acquires a fingerprint image by using a capacitance value, so that fingerprint identification is performed, and compared with optical fingerprint identification, the capacitive fingerprint sensor diaphragm has the advantages of higher identification speed and high sensitivity, does not need the self-luminescence of the Display module 30 to collect a fingerprint picture, can perform fingerprint identification in a dark scene, can support an LCM (liquid Crystal Display module) Display screen, and is lower in cost.

Referring to fig. 4, the display module 30 can be used for displaying images such as pictures, videos, and texts. The display module 30 is disposed on the capacitive fingerprint sensor membrane 20, specifically on one side of the sensor back 22, through the glue 40. The display module 30 includes a display surface 31 and a screen back surface 32 opposite to each other. The display surface 31 is opposite the capacitive fingerprint sensor membrane 20 (in particular opposite the sensor back surface 22). In the above embodiment, when the capacitive fingerprint sensor diaphragm 20 just covers the entire display surface 31, the area of the sensor back 22 is equal to the area of the display surface 31 (as shown in FIG. 4), the length of the sensor back 22 is equal to the length of the display surface 31, and the width of the sensor back 22 is equal to the width of the display surface 31. When the capacitive fingerprint sensor diaphragm 20 covers and extends beyond the entire display surface 31, the area of the sensor back 22 is greater than the area of the display surface 31 (as shown in FIG. 6), the length of the sensor back 22 is greater than the length of the display surface 31, and the width of the sensor back 22 is equal to the width of the display surface 31; alternatively, the length of the sensor back 22 is equal to the length of the display surface 31, and the width of the sensor back 22 is greater than the width of the display surface 31; alternatively, the length of the sensor back surface 22 is greater than the length of the display surface 31, and the width of the sensor back surface 22 is greater than the width of the display surface 31.

The display module 30 may be a hard screen or a flexible screen. Preferably, when the display module 30 is a hard screen, the capacitive fingerprint sensor diaphragm 20 is made of glass, so that the cost is low; the circuit material of the capacitive fingerprint sensor diaphragm 20 includes any one of metal, ITO, or nano silver paste. When the display module 30 is a flexible screen, the capacitive fingerprint sensor diaphragm 20 is made of PI to form a flexible sensor; the circuit material of the capacitive fingerprint sensor diaphragm 20 includes ITO or nano silver paste to form a flexible circuit. Of course, in other embodiments, when the display module 30 is a hard screen, the material of the capacitive fingerprint sensor diaphragm 20 may also be PI, which is not limited herein.

Referring to fig. 8 and 9, the display module 30 may be an LCM display 33 or an Organic Light-Emitting Diode (OLED) display 34. Because the capacitive fingerprint sensor diaphragm 20 performs fingerprint identification through capacitance value, the display module 30 does not need to self-illuminate to collect fingerprint photos, and therefore when the display module 30 is an LCM display screen 33, an OLED display screen 34 or other types of display screens, the capacitive fingerprint identification function can be achieved, that is, the display module 30 is not limited to the OLED display screen 34.

Referring to fig. 8, when the display module 30 is an LCM display screen 33, it is beneficial to reduce the cost of the electronic device 1000 (the cost of the LCM display screen 33 is lower than that of the OLED display screen). The LCM display 33 may include a backlight module 331, a lower polarizer 332, a Thin-film transistor (TFT) substrate 333, a liquid crystal layer 334, a color filter 335, and an upper polarizer 336 disposed along the light emitting direction of the display device 100. The surface of the upper polarizer 336 opposite to the color filter 335 serves as the display surface 31, and the surface of the backlight module 331 opposite to the lower polarizer 332 serves as the screen back surface 32. The LCM display screen 33 emits light through the backlight module 331, and the light sequentially passes through the lower polarizer 332, the TFT substrate 333, the liquid crystal layer 334, the color filter 335, the upper polarizer 336, the capacitive fingerprint sensor diaphragm 20, and the cover plate 10 to reach the outside, and is sensed by human eyes, so that the human eyes acquire images displayed by the display module 30.

Referring to fig. 9, when the display module 30 is an OLED display 34, a curved screen or other forms can be implemented to provide more choices for users. The OLED display 34 may include a glass TFT substrate 341, an organic light emitting diode 342, an encapsulation glass 343, and an OLED polarizer 344 disposed along a light emitting direction of the display module apparatus 100. The surface of the OLED polarizer 344 opposite to the encapsulation glass 343 serves as the display surface 31, and the surface of the glass TFT substrate 341 opposite to the organic light emitting diode 342 serves as the screen back surface 32. The OLED display 34 self-emits light through the organic light emitting diode 342, and the light sequentially passes through the encapsulation glass 343, the OLED polarizer 344, the capacitive fingerprint sensor diaphragm 20 and the cover plate 10 to reach the outside, and is sensed by human eyes, so that the human eyes acquire images displayed by the display module 30.

Referring to fig. 4, the capacitive fingerprint sensor diaphragm 20 according to the embodiment of the present disclosure is not only used for implementing a fingerprint recognition function, but also used as a touch sensor of the display module 30 to implement a touch function. Generally, the display module 30 may be integrated with a touch function in addition to the display function. In order to realize the touch function, a touch sensor is further disposed on the display module 30 or in the display module 30. In the embodiment of the present application, the display module 30 does not need to additionally provide a touch sensor (the structure of the display module 30 is shown in fig. 8 and fig. 9), and the dual functions of fingerprint identification and touch control can be realized through the capacitive fingerprint sensor diaphragm 20, and the display module device 100 has the advantages of simple structure, small thickness, high integration level, low cost, better light transmission, capability of reducing the number and volume of the connection terminals of the display module device 100, and design difficulty reduction.

The fingerprint recognition function and the touch function of the capacitive fingerprint sensor diaphragm 20 can be multiplexed in time. When the capacitive fingerprint sensor diaphragm 20 is used to implement a fingerprint identification function, the capacitive fingerprint sensor diaphragm 20 is not used to implement a touch function; when the capacitive fingerprint sensor diaphragm 20 is used to implement a touch function, the capacitive fingerprint sensor diaphragm 20 is not used to implement a fingerprint recognition function.

When capacitanc fingerprint sensor diaphragm 20 is used for realizing the fingerprint identification function, capacitanc fingerprint sensor diaphragm 20 detects the capacitance value of a plurality of touch points, because there are crest and trough on the finger surface, the capacitance value that crest and trough correspond can be different, consequently, can judge this touch point whether crest or trough according to the capacitance value of different touch points to form fingerprint image, carry out fingerprint identification according to fingerprint image again.

When the capacitive fingerprint sensor diaphragm 20 is used to implement a touch function, the capacitive fingerprint sensor diaphragm 20 detects capacitance values of a plurality of touch points, and when a finger is pressed on the cover plate 10, the capacitance values of the same touch point are different from those of the same touch point when the finger is not pressed on the cover plate 10, so that whether the touch point is pressed or not can be determined according to the capacitance value change of the same touch point, and coordinates, pressing tracks and the like of the touch point pressed by the finger of a user can be determined by performing the determination operation on the plurality of touch points, so that the electronic device 1000 is controlled to respond to the pressing of the finger of the user to implement the touch function.

Referring to fig. 3, the display device 100 may further include a sensor chip 201, and the sensor chip 201 is connected to the capacitive fingerprint sensor diaphragm 20. The sensor chip 201 is configured to read a capacitance value detected by the capacitive fingerprint sensor diaphragm 20, and then form a fingerprint image according to the capacitance value and perform fingerprint identification, thereby implementing a fingerprint identification function. Or, the sensor chip 201 is configured to read a capacitance value detected by the capacitive fingerprint sensor diaphragm 20, and then determine a touch point coordinate, a pressing track, and the like according to the capacitance value, so as to implement a touch function.

After the sensor chip 201 reads the capacitance value detected by the capacitive fingerprint sensor diaphragm 20, the capacitance value is specifically used for implementing a fingerprint identification function or a touch function, and may be determined according to an application scenario of the electronic device 1000. For example, when the electronic device 1000 is applied to an encryption scenario, an unlocking scenario, a payment scenario, etc., the sensor chip 201 is used to realize a fingerprint identification function after reading a capacitance value detected by the capacitive fingerprint sensor diaphragm 20. When the electronic device 1000 is applied to a scene other than the above, the sensor chip 201 is used to realize a touch function after reading a capacitance value detected by the capacitive fingerprint sensor diaphragm 20.

Of course, in other embodiments, the electronic device 1000 may further provide other determination logic to determine whether the capacitive fingerprint sensor diaphragm 20 and the sensor chip 201 are used for implementing a fingerprint identification function or a touch function, which is not limited herein.

Referring to fig. 4 again, the adhesive 40 is used for adhering the cover plate 10, the capacitive fingerprint sensor film 20 and the display module 30. The adhesive 40 is used for bonding the cover plate 10, the full-screen capacitive fingerprint sensor 20 and the display screen 30, so that the structural strength of the display assembly 100 and the reliability of the fingerprint identification performance can be ensured. When the display module 30 is the LCM display screen 33, the glue 40 is used for bonding the cover plate 10, the capacitive fingerprint sensor film 20 and the upper polarizer 336. When the display module 30 is an OLED display 34, the adhesive 40 is used to adhere the cover plate 10, the capacitive fingerprint sensor film 20 and the OLED polarizer 344.

The colloid 40 is used for bonding the cover plate 10, the capacitive fingerprint sensor membrane 20 and the display module 30, and means that: the glue 40 bonds the cover plate 10, the capacitive fingerprint sensor membrane 20 and the display module 30 together. For example, the glue 40 adheres the cover plate 10 and the capacitive fingerprint sensor diaphragm 20, and adheres the capacitive fingerprint sensor diaphragm 20 and the display module 30 at the same time; or, the colloid 40 adheres the cover plate 10 and the capacitive fingerprint sensor diaphragm 20, and adheres the cover plate 10 and the display module 30 at the same time; or, the colloid 40 adheres the cover plate 10 and the display module 30, and adheres the capacitive fingerprint sensor diaphragm 20 and the display module 30 at the same time; or, the colloid 40 bonds the cover plate 10 and the capacitive fingerprint sensor diaphragm 20, bonds the cover plate 10 and the display module 30, and bonds the capacitive fingerprint sensor diaphragm 20 and the display module 30.

The colloid 40 may be an optical adhesive, specifically, any one of oca (optical Clear adhesive), PolyVinyl Butyral Film (PVB), or daf (die attach Film). That is, the colloid 40 is OCA; alternatively, the colloid 40 is PVB; alternatively, the colloid 40 is DAF.

Referring to fig. 4, in one embodiment, the glue 40 includes a first optical glue 41 and a second optical glue 42. The first optical adhesive 41 is used for bonding the cover plate 10 and the capacitive fingerprint sensor diaphragm 20, and specifically bonds the cover plate back 12 and the sensor light emitting surface 21. The second optical adhesive 42 is used for bonding the capacitive fingerprint sensor diaphragm 20 and the display module 30, and specifically bonds the sensor back 22 and the display surface 31. In this embodiment, the cover plate 10, the first optical adhesive 41, the capacitive fingerprint sensor film 20, the second optical adhesive 42, and the display module 30 are sequentially stacked along the opposite direction of the light emitting direction of the display module device 100.

The first optical adhesive 41 may be used to bond the cover plate 10 and the capacitive fingerprint sensor film 20 in a full-lamination manner.

The adoption of the full-lamination mode to bond the cover plate 10 and the capacitive fingerprint sensor diaphragm 20 is that: the cover plate 10 and the capacitive fingerprint sensor membrane 20 are completely adhered together in a seamless manner, the first optical glue 41 coats the whole surface of the cover plate 10 or the whole surface of the capacitive fingerprint sensor membrane 20, and no air layer exists between the cover plate 10 and the capacitive fingerprint sensor membrane 20. Adopt bonding apron 10 and capacitanc fingerprint sensor diaphragm 20 of full laminating mode for it is more firm to bond between apron 10 and the capacitanc fingerprint sensor diaphragm 20, and the skew can not take place along with the increase of live time for the position of apron 10 for capacitanc fingerprint sensor diaphragm 20, is favorable to improving capacitanc fingerprint sensor diaphragm 20 and carries out fingerprint identification's reliability, in addition, also can reduce the probability that dust, moisture etc. got into between apron 10 and the capacitanc fingerprint sensor diaphragm 20.

First optical adhesive 41 may include any one of OCA, PVB, or DAF. When first optical cement 41 is OCA, first optical cement 41 is softer, and laminating processing technology is simple, and when user's finger pressed on apron 10, first optical cement 41 can play certain cushioning effect to apron 10 and capacitive fingerprint sensor diaphragm 20. When first optical cement 41 is PVB, the bonding effect of first optical cement 41 is stronger, which is beneficial to ensuring the stability of the structure between cover plate 10 and capacitive fingerprint sensor diaphragm 20. When the first optical adhesive 41 is a DAF, the problem of bubbles generated during the attaching process can be reduced, which is beneficial to improving the attaching yield and improving the flatness between the cover plate 10 and the capacitive fingerprint sensor diaphragm 20.

When the first optical adhesive 41 is OCA, PVB, or DAF, the thickness of the first optical adhesive 41 is 0.05mm to 0.15 mm. That is, the thickness of the first optical glue 41 is any value between 0.05mm and 0.15 mm. For example, the thickness of the first optical glue 41 is 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.10mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, or the like. Preferably, the thickness of the first optical adhesive 41 is 0.1mm, which not only ensures the stability of the attachment between the cover plate 10 and the capacitive fingerprint sensor diaphragm 20, but also does not excessively increase the thickness of the electronic device 1000.

The second optical adhesive 42 can be used to bond the capacitive fingerprint sensor film 20 and the display module 30 by a full-lamination method or a frame-lamination method.

Adopt full laminating mode bonding capacitanc fingerprint sensor diaphragm 20 and display module assembly 30 to be promptly: completely pasting the capacitive fingerprint sensor diaphragm 20 and the display module 30 together in a seamless mode, coating the whole surface of the capacitive fingerprint sensor diaphragm 20 or the whole surface of the display module 30 with the second optical cement 42, and not having an air layer between the capacitive fingerprint sensor diaphragm 20 and the display module 30. Adopt bonding capacitanc fingerprint sensor diaphragm 20 and display module assembly 30 of full laminating mode for it is more firm to bond between capacitanc fingerprint sensor diaphragm 20 and the display module assembly 30, and the skew can not take place along with the increase of live time for the position of capacitanc fingerprint sensor diaphragm 20 for display module assembly 30, is favorable to improving the regional uniformity of display area and fingerprint identification, in addition, also can reduce the probability between dust, moisture etc. entering capacitanc fingerprint sensor diaphragm 20 and the display module assembly 30.

Referring to fig. 10, the capacitive fingerprint sensor film 20 and the display module 30 are bonded by frame bonding: the capacitive fingerprint sensor diaphragm 20 is adhered to the frame portion or the edge portion of the display module 30, the periphery of the capacitive fingerprint sensor diaphragm 20 or the periphery (periphery) of the display module 30 is coated with the second optical cement 42, and an air layer can exist between the capacitive fingerprint sensor diaphragm 20 and the display module 30. Of course, some transparent material (e.g., PET, which costs less than optical cement) may be used to fill the air layer, so as to make the structure more stable and reduce the possibility of dust, moisture, etc. entering between the capacitive fingerprint sensor diaphragm 20 and the display module 30. The capacitive fingerprint sensor diaphragm 20 and the display module 30 are bonded in a frame bonding mode, so that the using area of the second optical cement 42 is small, cost saving is facilitated, and the bonding yield is high. In addition, when the capacitive fingerprint sensor diaphragm 20 is damaged, the capacitive fingerprint sensor diaphragm 20 can be easily detached from the display module 30 to replace the capacitive fingerprint sensor diaphragm 20, and the capacitive fingerprint sensor diaphragm 20 and the display module 30 do not need to be replaced; or, when the display module 30 is damaged, the display module 30 can be easily detached from the capacitive fingerprint sensor diaphragm 20 to replace the display module 30, and the display module 30 and the capacitive fingerprint sensor diaphragm 20 do not need to be replaced.

Second optical adhesive 42 may include any one of OCA, PVB, or DAF. When second optical cement 42 is OCA, second optical cement 42 is softer, and laminating processing technology is simple, and when user's finger pressed on apron 10, second optical cement 42 can play certain cushioning effect to capacitanc fingerprint sensor diaphragm 20 and display module assembly 30. When second optical cement 42 is PVB, second optical cement 42's bonding effect is stronger, is favorable to guaranteeing the stability of structure between capacitive fingerprint sensor diaphragm 20 and the display module assembly 30. When the second optical adhesive 42 is DAF, the problem of bubbles generated during the attaching process can be reduced, which is beneficial to improving the attaching yield and improving the flatness between the capacitive fingerprint sensor film 20 and the display module 30.

When the second optical adhesive 42 is OCA, PVB or DAF, the thickness of the second optical adhesive 42 is 0.05 mm-0.15 mm. That is, the thickness of the second optical glue 42 is anywhere between 0.05mm to 0.15 mm. For example, the thickness of the second optical glue 42 is 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.10mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, etc. Preferably, the thickness of the second optical adhesive 42 is 0.1mm, which not only ensures the stability of the attachment between the cover plate 10 and the capacitive fingerprint sensor diaphragm 20, but also does not excessively increase the thickness of the electronic device 1000.

It should be noted that the kind of the first optical glue 41 and the kind of the second optical glue 42 may be the same or different, for example, when the kind of the first optical glue 41 is the same as the kind of the second optical glue 42, both the first optical glue 41 and the second optical glue 42 are OCA, both PVB, or both DAF. When the type of the first optical adhesive 41 is different from that of the second optical adhesive 42, the first optical adhesive 41 is OCA, and the second optical adhesive 42 is PVB; alternatively, the first optical adhesive 41 is PVB, and the second optical adhesive 42 is DAF; alternatively, the first optical adhesive 41 is DAF, the second optical adhesive 42 is OCA, and so on, which are not listed here. The thickness of the first optical glue 41 and the thickness of the second optical glue 42 may be the same or different, for example, when the thickness of the first optical glue 41 is the same as the thickness of the second optical glue 42, the thickness of the first optical glue 41 and the thickness of the second optical glue 42 are both 0.09mm, or both 0.1mm, or both 0.11 mm. When the thickness of the first optical adhesive 41 is different from that of the second optical adhesive 42, the thickness of the first optical adhesive 41 is 0.09mm, and the thickness of the second optical adhesive 42 is 0.1 mm; or the thickness of the first optical cement 41 is 0.1mm, and the thickness of the second optical cement 42 is 0.11 mm; alternatively, the thickness of the first optical glue 41 is 0.11mm, the thickness of the second optical glue 42 is 0.1mm, and so on, which are not listed here.

Referring to fig. 11, in another embodiment, the glue 40 includes a first optical glue 41 and a second optical glue 42. The first optical adhesive 41 is used for bonding the cover plate 10 and the capacitive fingerprint sensor diaphragm 20, and specifically bonds the cover plate back 12 and the sensor light emitting surface 21. The second optical adhesive 42 is used for bonding the cover plate 10 and the display module 30, and specifically bonds the cover plate back surface 12 and the display surface 31. In this embodiment, in the opposite direction of the light emitting direction of the display device 100, in the middle area of the cover plate 10, the first optical adhesive 41, the capacitive fingerprint sensor film 20, and the display module 30 are sequentially stacked; in the edge area of the cover plate 10, the second optical adhesive 42 and the display module 30 are sequentially stacked.

As in the previous embodiment, the first optical adhesive 41 may be a full-lamination adhesive for bonding the cover plate 10 and the capacitive fingerprint sensor diaphragm 20; first optical adhesive 41 may include any one of OCA, PVB, or DAF; when the first optical adhesive 41 is OCA, PVB, or DAF, the thickness of the first optical adhesive 41 is 0.05mm to 0.15mm, and will not be described in detail herein.

The second optical adhesive 42 can be used to bond the cover plate 10 and the display module 30 by frame adhesion.

The method of adhering the cover plate 10 and the display module 30 by frame adhesion is as follows: the cover plate 10 and the frame portion or the edge portion of the display module 30 are adhered together, the second optical adhesive 42 coats the periphery of the cover plate 10 or the periphery (one circle) of the display module 30, and an air layer may exist between the cover plate 10 and the display module 30 (as shown in fig. 11). Of course, some transparent materials (e.g. PET, which costs less than optical cement) can be used to fill the air layer, so that the structure is more stable and the probability of dust, moisture, etc. entering between the cover plate 10 and the display module 30 is reduced. The air layer can also be formed at the periphery of the second optical cement 42 instead of between the second optical cement 42 and the first optical cement 41 as shown in fig. 11, and at this time, the air layer can also be used for placing electronic components or performing circuit routing to save space. Or, since the first optical glue 41 and the capacitive fingerprint sensor diaphragm 20 are located between the cover plate 10 and the display module 30, the first optical glue 41 and the capacitive fingerprint sensor diaphragm 20 just fill the air gap between the cover plate 10 and the display module 30, so that there is no air layer between the cover plate 10 and the display module 30 (as shown in fig. 12). The cover plate 10 and the display module 30 are bonded by adopting a frame bonding mode, so that the use area of the second optical cement 42 is smaller, the cost is saved, and the bonding yield is higher. In addition, the thickness of the second optical adhesive 42 may be equal to or approximately equal to the sum of the thicknesses of the first optical adhesive 41 and the capacitive fingerprint sensor diaphragm 20, and compared to the case (shown in fig. 4) where the first optical adhesive 41 bonds the cover plate 10 and the capacitive fingerprint sensor diaphragm 20, and the second optical adhesive 42 bonds the capacitive fingerprint sensor diaphragm 20 and the display module 30, the thickness of the display device 100 is only composed of the cover plate 10, the first optical adhesive 41, the capacitive fingerprint sensor diaphragm 20, and the display module 30, that is, the thickness of the second optical adhesive 42 is saved, the thickness of the display device 100 is smaller, and the electronic device 1000 is lighter and thinner. Moreover, when the cover plate 10 is damaged, the cover plate 10 can be easily detached from the display module 30 to replace the cover plate 10, and the cover plate 10 and the display module 30 do not need to be replaced; or, when the display module 30 is damaged, the display module 30 can be easily detached from the cover plate 10 to replace the display module 30, and the display module 30 and the cover plate 10 do not need to be replaced.

As in the previous embodiment, second optical adhesive 42 may include any one of OCA, PVB, or DAF; when the second optical adhesive 42 is OCA, PVB or DAF, the thickness of the second optical adhesive 42 is 0.05 mm-0.15 mm; the kind of the first optical glue 41 and the kind of the second optical glue 42 may be the same or different.

Referring to fig. 13, the display device 100 may further include a reinforcing layer 50, wherein the reinforcing layer 50 is located between the capacitive fingerprint sensor film 20 and the display module 30, and specifically between the sensor back 22 and the display surface 31. The reinforcing layer 50 includes a reinforcing light-emitting surface 51 and a reinforcing back surface 52 opposite to each other. The reinforcing light emitting surface 51 is opposite to the sensor back surface 22, and the reinforcing back surface 52 is opposite to the display surface 31.

The reinforcing layer 50 and the cover plate 10 form a double-layer cover plate structure. The stiffening layer 50 may stiffen the entire display assembly apparatus 100 with a cover plate 10 having a thickness of only 0.3mm or less, reducing the probability of failure of the capacitive fingerprint sensor membrane 20 due to impacts or impacts on the electronic device 1000 during subsequent use.

The material of the reinforcing layer 50 may be any one of sapphire, glass, PI, PET, or a composite plate. The above explanations of sapphire, glass, PI, PET, and composite plates are also applicable to the embodiments of the present application, and will not be described in detail herein. When the material of the reinforcing layer 50 is any one of sapphire, glass, PI, PET, or a composite plate, the thickness of the reinforcing layer 50 is 0.1mm to 0.5 mm. That is, the thickness of the reinforcing layer 50 is any value between 0.1mm and 0.5 mm. For example, the thickness of the reinforcing layer 50 is 0.1mm, 0.14mm, 0.18mm, 0.22mm, 0.26mm, 0.3mm, 0.34mm, 0.38mm, 0.42mm, 0.46mm, 0.5mm, or the like.

When the display device assembly 100 includes the reinforcing layer 50, the adhesive 40 is used to adhere the cover plate 10, the capacitive fingerprint sensor film 20, the reinforcing layer 50 and the display module 30. The colloid 40 is used for bonding the cover plate 10, the capacitive fingerprint sensor membrane 20, the reinforcing layer 50 and the display module 30, and means that: the glue 40 bonds the cover plate 10, the capacitive fingerprint sensor membrane 20, the reinforcing layer 50 and the display module 30 together. For example, the glue 40 adheres the cover plate 10 and the capacitive fingerprint sensor diaphragm 20, adheres the capacitive fingerprint sensor diaphragm 20 and the reinforcing layer 50, and adheres the reinforcing layer 50 and the display module 30; or the colloid 40 bonds the cover plate 10 and the capacitive fingerprint sensor diaphragm 20, bonds the capacitive fingerprint sensor diaphragm 20 and the reinforcing layer 50, and bonds the capacitive fingerprint sensor diaphragm 20 and the display module 30; or, the colloid 40 bonds the cover plate 10 and the capacitive fingerprint sensor diaphragm 20, bonds the capacitive fingerprint sensor diaphragm 20 and the display module 30, and bonds the reinforcing layer 50 and the display module 30; or, the colloid 40 adheres the cover plate 10 and the capacitive fingerprint sensor diaphragm 20, adheres the capacitive fingerprint sensor diaphragm 20 and the reinforcing layer 50, adheres the capacitive fingerprint sensor diaphragm 20 and the display module 30, adheres the reinforcing layer 50 and the display module 30, and the like, which is not limited herein.

Referring to fig. 13, in one embodiment, the glue 40 includes a first optical glue 41, a third optical glue 43, and a fourth optical glue 44. The first optical adhesive 41 is used for bonding the cover plate 10 and the capacitive fingerprint sensor diaphragm 20, and specifically bonds the cover plate back 12 and the sensor light emitting surface 21. The third optical adhesive 43 is used for bonding the capacitive fingerprint sensor diaphragm 20 and the reinforcing layer 50, and specifically bonds the sensor back 22 and the reinforcing light-emitting surface 51. The fourth optical adhesive 44 is used for bonding the reinforcing layer 50 and the display module 30, and specifically for bonding the reinforcing back 52 and the display surface 31. In this embodiment, along the opposite direction of the light emitting direction of the display device 100, the cover plate 10, the first optical glue 41, the capacitive fingerprint sensor film 20, the third optical glue 43, the reinforcing layer 50, the fourth optical glue 44 and the display module 30 are sequentially stacked, that is, the original second optical glue 42 is replaced by the third optical glue 43 and the fourth optical glue 44, and the reinforcing layer 50 disposed between the capacitive fingerprint sensor film 20 and the display module 30 is added.

The third optical adhesive 43 may be used to bond the capacitive fingerprint sensor film 20 and the reinforcing layer 50 by a full-lamination method or a frame-lamination method.

Referring to fig. 13, the bonding of the capacitive fingerprint sensor film 20 and the reinforcing layer 50 by the full-lamination method is as follows: the capacitive fingerprint sensor membrane 20 and the reinforcing layer 50 are completely adhered together in a seamless mode, the third optical cement 43 coats the whole surface of the capacitive fingerprint sensor membrane 20 or the whole surface of the reinforcing layer 50, and an air layer does not exist between the capacitive fingerprint sensor membrane 20 and the reinforcing layer 50. Adopt full laminating mode bonding capacitanc fingerprint sensor diaphragm 20 and strengthening layer 50 for it is more firm to bond between capacitanc fingerprint sensor diaphragm 20 and the strengthening layer 50, and the reinforcement effect is better, in addition, also can reduce the probability that dust, moisture etc. got into between capacitanc fingerprint sensor diaphragm 20 and the strengthening layer 50.

Referring to fig. 14, the frame-bonding method for bonding the capacitive fingerprint sensor film 20 and the reinforcing layer 50 is as follows: the capacitive fingerprint sensor diaphragm 20 and the frame portion or the edge portion of the reinforcing layer 50 are adhered together, the third optical cement 43 coats the periphery of the capacitive fingerprint sensor diaphragm 20 or the periphery (one circle) of the reinforcing layer 50, and an air layer can exist between the capacitive fingerprint sensor diaphragm 20 and the reinforcing layer 50. Of course, some transparent material (e.g., PET, which costs less than optical cement) may be used to fill the air layer to make the structure more stable and reduce the chance of dust, moisture, etc. entering between the capacitive fingerprint sensor diaphragm 20 and the stiffening layer 50. The capacitive fingerprint sensor diaphragm 20 and the reinforcing layer 50 are bonded in a frame bonding mode, so that the using area of the third optical cement 43 is small, cost saving is facilitated, and the bonding yield is high.

Third optical adhesive 43 may include any one of OCA, PVB, or DAF. When the third optical cement 43 is OCA, the third optical cement 43 is softer, the fitting process is simple, and when a user's finger presses on the cover plate 10, the third optical cement 43 can play a certain buffering role in the capacitive fingerprint sensor diaphragm 20. When the third optical cement 43 is PVB, the bonding effect of the third optical cement 43 is strong, which is beneficial to ensuring the stability of the structure between the capacitive fingerprint sensor diaphragm 20 and the reinforcing layer 50. When the third optical adhesive 43 is DAF, the problem of bubbles generated during the attaching process can be reduced, which is beneficial to improving the attaching yield and improving the flatness between the capacitive fingerprint sensor diaphragm 20 and the reinforcing layer 50.

When the third optical adhesive 43 is OCA, PVB, or DAF, the thickness of the third optical adhesive 43 is 0.05mm to 0.15 mm. That is, the thickness of the third optical paste 43 is any value between 0.05mm and 0.15 mm. For example, the thickness of the third optical paste 43 is 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.10mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, or the like. Preferably, the thickness of the third optical adhesive 43 is 0.1mm, which not only ensures the stability of the attachment between the capacitive fingerprint sensor diaphragm 20 and the reinforcing layer 50, but also does not excessively increase the thickness of the electronic device 1000.

Similarly, the fourth optical adhesive 44 can be bonded to the reinforcing layer 50 and the display module 30 by a full-lamination method or a frame-lamination method.

Referring to fig. 13, the method for bonding the reinforcing layer 50 and the display module 30 by full lamination is as follows: the reinforcing layer 50 and the display module 30 are completely adhered together in a seamless manner, the fourth optical cement 44 coats the whole surface of the reinforcing layer 50 or the whole surface of the display module 30, and no air layer exists between the reinforcing layer 50 and the display module 30. Adopt full laminating mode bonding strengthening layer 50 and display module assembly 30 for it is more firm to bond between strengthening layer 50 and the display module assembly 30, and the reinforcement effect is better, in addition, also can reduce the probability between dust, moisture etc. entering strengthening layer 50 and the display module assembly 30.

Referring to fig. 15, the frame-bonding method for bonding the reinforcing layer 50 to the display module 30 is as follows: the frame portion or the edge portion of the display module 30 is adhered to the reinforcing layer 50, the fourth optical adhesive 44 is coated around the reinforcing layer 50 or around the display module 30 (one circle), and an air layer may exist between the reinforcing layer 50 and the display module 30. Of course, some transparent materials (e.g., PET, which costs less than optical cement) may be used to fill the air layer, so as to make the structure more stable and reduce the possibility of dust, moisture, etc. entering between the strengthening layer 50 and the display module 30. The reinforcing layer 50 and the display module 30 are bonded by frame bonding, so that the use area of the fourth optical cement 44 is small, cost saving is facilitated, and the bonding yield is high.

Fourth optical adhesive 44 may include any one of OCA, PVB, or DAF. When fourth optical cement 44 is OCA, fourth optical cement 44 is softer, and laminating processing technology is simple, and when user's finger pressed on apron 10, fourth optical cement 44 can play certain cushioning effect to display module assembly 30. When the fourth optical cement 44 is PVB, the adhesion effect of the fourth optical cement 44 is stronger, which is beneficial to ensuring the stability of the structure between the reinforcing layer 50 and the display module 30. When the fourth optical adhesive 44 is DAF, the problem of bubbles generated during the bonding process can be reduced, which is beneficial to improving the bonding yield and improving the flatness between the reinforcing layer 50 and the display module 30.

When the fourth optical adhesive 44 is OCA, PVB, or DAF, the thickness of the fourth optical adhesive 44 is 0.05mm to 0.15 mm. That is, the thickness of the fourth optical paste 44 is anywhere between 0.05mm to 0.15 mm. For example, the thickness of the fourth optical paste 44 is 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.10mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, etc. Preferably, the thickness of the fourth optical cement 44 is 0.1mm, which not only can ensure the stability of the adhesion between the reinforcing layer 50 and the display module 30, but also does not excessively increase the thickness of the electronic device 1000.

Referring to fig. 16, an assembling method of the display device 100 according to the embodiment of the present disclosure includes:

01: providing a display module 30, a capacitive fingerprint sensor membrane 20 and a cover plate 10;

02: arranging the capacitive fingerprint sensor membrane 20 between the cover plate 10 and the display module 30 and enabling the capacitive fingerprint sensor membrane 20 to cover the display surface 31 of the display module 30 so as to sense the fingerprint of a user touching the cover plate 10;

the capacitive fingerprint sensor diaphragm 20 is used for achieving a fingerprint identification function, and the capacitive fingerprint sensor diaphragm 20 is also used as a touch sensor of the display module 30 to achieve a touch function.

It should be noted that the explanation of the display device 100 in the foregoing embodiment is also applicable to the assembly method of the display device 100 in the embodiment of the present application, and is not repeated herein.

In the assembling method of the embodiment of the application, the capacitive fingerprint sensor diaphragm 20 covers the display surface 31, so that a full-screen fingerprint identification function can be realized, and compared with a local fingerprint, the operation is more convenient; in addition, the capacitive fingerprint sensor diaphragm 20 is adopted for fingerprint identification, compared with optical fingerprint identification, a camera with a larger volume is not required to be arranged, only one layer of capacitive fingerprint sensor diaphragm 20 is required, the thickness is thinner, and the space design is more advantageous; furthermore, the display module assembly 30 does not need to be additionally provided with a touch sensor, and can realize dual functions of fingerprint identification and touch control through the capacitive fingerprint sensor diaphragm 20, so that the display module assembly device 100 is simple in structure, thin in thickness, high in integration level, low in cost and better in light transmission, the number and the volume of connecting terminals of the display module assembly device 100 can be reduced, and the design difficulty is reduced.

Referring to fig. 17, in some embodiments, the assembling method further includes:

03: the cover plate 10 and the capacitive fingerprint sensor membrane 20 are bonded through the first optical adhesive 41;

04: the capacitive fingerprint sensor diaphragm 20 and the display module 30 are bonded by the second optical adhesive 42.

Specifically, when the display module device 100 is manufactured, the first optical adhesive 41 is coated on the back surface 12 of the cover plate or on the light emitting surface 21 of the sensor in the first step, and then the cover plate 10 and the capacitive fingerprint sensor diaphragm 20 are bonded by the first optical adhesive 41; and secondly, coating a second optical adhesive 42 on the sensor back surface 22 or the display surface 31, and then bonding the capacitive fingerprint sensor membrane 20 and the display module 30 through the second optical adhesive 42. The first step and the second step may be executed first, and then executed second; or the second step is executed first, and the first step is executed later; or the first step and the second step are performed simultaneously. The structure of the display module apparatus 100 obtained in this manner can be as shown in fig. 4 and 10. The cover plate 10 and the capacitive fingerprint sensor diaphragm 20 can be bonded by the first optical adhesive 41 in a full-lamination mode; the capacitive fingerprint sensor film 20 and the display module 30 are bonded by the second optical adhesive 42 in a full-bonding manner or a frame-bonding manner, which will not be described in detail herein.

Referring to fig. 18, in some embodiments, the assembling method further includes:

05: the cover plate 10 and the capacitive fingerprint sensor membrane 20 are bonded through the first optical adhesive 41;

06: the cover plate 10 and the display module 30 are bonded by the second optical adhesive 42.

Specifically, when the display module device 100 is manufactured, the first optical adhesive 41 is coated on the back surface 12 of the cover plate or on the light emitting surface 21 of the sensor in the first step, and then the cover plate 10 and the capacitive fingerprint sensor diaphragm 20 are bonded by the first optical adhesive 41; and in the second step, the second optical cement 42 is coated on the back surface 12 of the cover plate or on the display surface 31, and then the cover plate 10 and the display module 30 are bonded through the second optical cement 42. The structure of the display module apparatus 100 obtained in this manner can be as shown in fig. 11 and 12. The cover plate 10 and the capacitive fingerprint sensor diaphragm 20 can be bonded by the first optical adhesive 41 in a full-lamination mode; the cover plate 10 and the display module 30 are bonded by the second optical adhesive 42 in a frame-bonding manner, which will not be described in detail herein.

Of course, when the display device 100 is manufactured, the glue 40 may be used to perform other coating and bonding, as long as the cover plate 10, the capacitive fingerprint sensor film 20 and the display module 30 are bonded by the glue 40, and the display module 30, the capacitive fingerprint sensor film 20 and the cover plate 10 are disposed along the light emitting direction of the display device 100.

After the display device assembly 100 is manufactured, the display device assembly 100 is assembled with the front housing 210 by means of side glue or adhesive. The circuit board (such as the sensor chip 201 and the display chip 301) of the display module apparatus 100 is connected to the main board (such as the main board chip 220) of the electronic device 1000, so as to implement the display function and the fingerprint recognition function of the display module apparatus 100.

Referring to fig. 19, in some embodiments, the display device assembly 100 further includes a reinforcing layer 50, and the assembling method further includes:

07: the stiffening layer 50 is arranged between the capacitive fingerprint sensor membrane 20 and the display module 30.

Referring to fig. 20, in some embodiments, the assembling method further includes:

08: the cover plate 10 and the capacitive fingerprint sensor membrane 20 are bonded through the first optical adhesive 41;

09: the capacitive fingerprint sensor membrane 20 and the reinforcing layer 50 are bonded through the third optical cement 43;

010: the reinforcing layer 50 and the display module 30 are bonded by the fourth optical adhesive 44.

Specifically, when the display module device 100 is manufactured, the first optical adhesive 41 is coated on the back surface 12 of the cover plate or on the light emitting surface 21 of the sensor in the first step, and then the cover plate 10 and the capacitive fingerprint sensor diaphragm 20 are bonded by the first optical adhesive 41; secondly, coating a third optical adhesive 43 on the sensor back 22 or the reinforcing light-emitting surface 51, and then bonding the capacitive fingerprint sensor diaphragm 20 and the reinforcing layer 50 through the third optical adhesive 43; and thirdly, coating the fourth optical cement 44 on the reinforcing back surface 52 or the display surface 31, and then bonding the reinforcing layer 50 and the display module 30 through the fourth optical cement 44. The order of executing the first step, the second step and the third step may be arbitrary, for example, the first step, the second step and the third step are executed sequentially, or the first step and the second step are executed simultaneously, the third step is executed thereafter, and the like, which are not listed here. The structure of the display module apparatus 100 obtained in this manner can be as shown in fig. 13, 14, and 15. The capacitive fingerprint sensor membrane 20 and the reinforcing layer 50 can be bonded by the third optical adhesive 43 in a full-lamination mode or a frame lamination mode; the capacitive fingerprint sensor membrane 20 and the reinforcing layer 50 are bonded by the fourth optical adhesive 44 in a full-bonding manner or a frame-bonding manner, which will not be described in detail herein.

Of course, when the display device 100 is manufactured, the glue 40 may be used to perform other coating and bonding, as long as the cover plate 10, the capacitive fingerprint sensor film 20, the reinforcing layer 50 and the display module 30 are bonded by the glue 40, and the display module 30, the reinforcing layer 50, the capacitive fingerprint sensor film 20 and the cover plate 10 are disposed along the light emitting direction of the display device 100.

Referring to FIG. 21, in some embodiments, the display device 100 may further include a polarizer 60. The polarizer 60 is disposed on the cover plate 10, particularly on one side of the cover plate back 12, through the glue 40. The polarizer 60 is located between the cover plate 10 and the capacitive fingerprint sensor membrane 20, specifically between the cover plate back 12 and the sensor light exit surface 21. Polarizer 60 includes a polarized light exit surface 61 and a polarized back surface 62 opposite to each other. The polarized light exit surface 61 is opposite to the cover back 12, and the polarized light back 62 is opposite to the sensor exit surface 21.

The polarizer 60 has a thickness of 100 to 150 μm. That is, the thickness of the polarizer 60 is any value between 100 μm and 150 μm. For example, the thickness of the polarizer 60 is 100 μm, 105 μm, 110 μm, 115 μm, 120 μm, 125 μm, 130 μm, 135 μm, 140 μm, 145 μm, 150 μm, or the like.

The polarizer 60 is an optical film formed by compounding multiple layers of polymer materials and having a function of generating polarized light, and the polarizer 60 can convert natural light without polarization into polarized light, so that light rays perpendicular to an electric field pass through the polarizer, and the passing or not of the light rays is controlled. The polarizer 60 is additionally arranged between the cover plate 10 and the capacitive fingerprint sensor diaphragm 20, so that the brightness of incident light of external light from the cover plate 10 to the capacitive fingerprint sensor diaphragm 20 can be reduced, and the phenomenon that the appearance of the display module device 100 is different in color at a certain angle (such as the phenomenon of earthy yellow) due to the reflection of metal grid wires on the capacitive fingerprint sensor diaphragm 20 is reduced.

Referring to FIG. 22, polarizer 60 may be a circular polarizer. The polarizer 60 includes a protective film 63, a Triacetyl Cellulose (TAC) functional film 64, a polyvinyl alcohol (PVA) film 65, a light plate TAC film 66, a pressure sensitive adhesive 67, and a release film 68, which are disposed along a light emitting direction of the display module device 100. Wherein some processing may be performed on the surface of the TAC functional film 64 to achieve corresponding additional functions. For example, the surface of the TAC functional film 64 may be subjected to an anti-glare treatment (AG), an anti-glare + low reflection treatment (AG + LR), a transparent curing + low reflection treatment (CHC + LR), a transparent curing treatment (CHC), an anti-reflection treatment (AR), or the like. Different surface treatment methods can meet different application requirements of the electronic device 1000. The embodiment of the application performs the anti-reflection treatment on the surface of the TAC functional film 64, so that the TAC functional film 64 has the anti-reflection function (the interference effect is utilized to eliminate the incident light and the reflected light mutually so as to reduce the reflection light generated by the capacitive fingerprint sensor diaphragm 20, thereby further reducing the phenomenon that the display module device 100 appears yellowish due to the reflection of the metal grid lines on the capacitive fingerprint sensor diaphragm 20 at a specific angle.

Since the polarizer 60 reduces the brightness of the display module 30, the original polarizer in the display module 30 can be eliminated.

Specifically, referring to fig. 8 and 23, when the display module 30 is an LCM display screen 33, the LCM display screen 33 includes a backlight module 331, a lower polarizer 332, a TFT substrate 333, a liquid crystal layer 334, a color filter 335, and an upper polarizer 336 (as shown in fig. 8) disposed along the light emitting direction of the display device 100, and the upper polarizer 336 can be eliminated, that is, the LCM display screen 33 includes the backlight module 331, the lower polarizer 332, the TFT substrate 333, the liquid crystal layer 334, and the color filter 335 (as shown in fig. 23) disposed along the light emitting direction of the display device 100, and the polarizer 60 can be used as the upper polarizer 336 in the LCM display screen 33.

Referring to fig. 9 and 24, when the display module 30 is the OLED display 34, the OLED display 34 includes a glass TFT substrate 341, an organic light emitting diode 342, an encapsulation glass 343, and an OLED polarizer 344 (as shown in fig. 9) disposed along the light emitting direction of the display device 100, the OLED polarizer 344 may be eliminated, that is, the OLED display 34 includes the glass TFT substrate 341, the organic light emitting diode 342, and the encapsulation glass 343 disposed along the light emitting direction of the display device 100, and the polarizer 60 may be used as the OLED polarizer 344 in the OLED display 34.

Of course, in other embodiments, the original polarizer in the display module 30 may not be eliminated, but only the brightness of the display module 30 is slightly reduced, and at this time, the display module 30 still adopts the structure shown in fig. 8 and 9.

When the display device 100 includes the polarizer 60, the adhesive 40 is used to adhere the cover plate 10, the polarizer 60, the capacitive fingerprint sensor film 20 and the display module 30.

Referring to fig. 21, in an embodiment, when the adhesive 40 includes a first optical adhesive 41 and a second optical adhesive 42, the first optical adhesive 41 is used for bonding the cover plate 10 and the polarizer 60, and specifically for bonding the cover plate back 12 and the polarization light-emitting surface 61. The second optical adhesive 42 is used for bonding the capacitive fingerprint sensor diaphragm 20 and the display module 30, and specifically bonds the sensor back 22 and the display surface 31. In this embodiment, the cover plate 10, the first optical adhesive 41, the polarizer 60, the capacitive fingerprint sensor film 20, the second optical adhesive 42, and the display module 30 are sequentially stacked along the opposite direction of the light emitting direction of the display module device 100. The first optical adhesive 41 may be fully attached to the cover plate 10 and the polarizer 60. The second optical adhesive 42 can be used to bond the capacitive fingerprint sensor film 20 and the display module 30 by a full-lamination method or a frame-lamination method.

Referring to fig. 25, in another embodiment, when the glue 40 includes the first optical glue 41 and the second optical glue 42, the first optical glue 41 is used for bonding the cover 10 and the polarizer 60, and specifically, the cover back 12 and the polarization light-emitting surface 61. The second optical adhesive 42 is used for bonding the cover plate 10 and the display module 30, and specifically bonds the cover plate back surface 12 and the display surface 31. In this embodiment, in the opposite direction of the light emitting direction of the display device assembly 100, in the middle area of the cover plate 10, the first optical adhesive 41, the polarizer 60, the capacitive fingerprint sensor film 20, and the display module 30 are sequentially stacked; in the edge area of the cover plate 10, the second optical adhesive 42 and the display module 30 are sequentially stacked. The first optical adhesive 41 may be used to adhere the cover plate 10 and the polarizer 60 in a full-lamination manner, and the second optical adhesive 42 may be used to adhere the cover plate 10 and the display module 30 in a frame lamination manner.

Referring to FIG. 26, in some embodiments, the display assembly apparatus 100 can further include a reflection prevention film 70. The reflection preventing film 70 is located between the cover plate 10 and the capacitive fingerprint sensor diaphragm 20, specifically between the cover plate back 12 and the sensor light emitting surface 21. The anti-reflection film 70 includes an anti-reflection light-emitting surface 71 and an anti-reflection back surface 72 which are opposite to each other. The anti-reflection light emitting surface 71 is opposite to the cover plate back 12, and the anti-reflection back 72 is opposite to the sensor light emitting surface 21.

The thickness of the antireflection film 70 is 200nm to 300 nm. That is, the thickness of the antireflection film 70 is an arbitrary value between 200nm and 300 nm. For example, the thickness of the antireflection film 70 is 200nm, 210nm, 220nm, 230nm, 240nm, 250nm, 260nm, 270nm, 280nm, 290nm, 300nm, or the like.

The antireflection film 70 is also referred to as an antireflection film, an antireflection film, an AR (Anti-reflection) film, or the like. The reflection preventing film 70 is formed by plating a multilayer composite optical film on a substrate by a sputtering process, and uses a low refractive index (L) material and a high refractive index (H) material to alternately form a film stack, and reduces the surface reflection of the substrate by using an interference effect through film layer design and film thickness control. In the present embodiment, the substrate may be the cover plate 10 or the capacitive fingerprint sensor membrane 20.

Specifically, the reflection preventing film 70 may be formed on the cover back 12 (as shown in fig. 27) or on the sensor light emitting surface 21 (as shown in fig. 26). The anti-reflection film 70 is formed on the back surface 12 of the cover plate or the light-emitting surface 21 of the sensor, so that the reflected light generated by the capacitive fingerprint sensor diaphragm 20 can be reduced, the phenomenon of yellowing of the side edge of the display module 30 caused by the reflection of the metal grid circuit on the capacitive fingerprint sensor diaphragm 20 is reduced, and the appearance display effect is improved; meanwhile, the anti-glare effect can be achieved, and under the action of strong light, a user can clearly see the image displayed by the display module 30.

It should be noted that, compared to the structure of the display device assembly 100 shown in fig. 3, 4, 5, 6, 10, 11, 12, 13, 14 and 15, the display device assembly 100 of the embodiment of the present application only adds one anti-reflection film 70 on the back surface 12 of the cover plate or the light exit surface 21 of the sensor, and other structures may be the same as those in the above drawings. After the addition of one layer of anti-reflection film 70, the other structures in the above-described figures can be changed accordingly. For example, the adhesive 40 is used to adhere the cover plate 10, the anti-reflection film 70, the capacitive fingerprint sensor membrane 20, and the display module 30. When the glue body 40 includes the first optical glue 41 and the second optical glue 42, the first optical glue 41 is used to adhere the reflection preventing film 70 to the capacitive fingerprint sensor membrane 20 (as shown in fig. 27); alternatively, first optical adhesive 41 is used to adhere cover 10 to anti-reflection film 70 (as shown in fig. 26), and a description thereof is omitted here.

Referring to fig. 4 and 28, in some embodiments, the display device 100 may further include a high resistance film 80. At this time, the capacitive fingerprint sensor film 20 includes a sensor substrate 28 and a sensor circuit layer 29 (i.e., the aforementioned metal grid traces) disposed along the light emitting direction of the display module device 100. A sensor wiring layer 29 is provided on the sensor substrate 28, and the sensor wiring layer 29 is used to detect a capacitance value at the time of fingerprint recognition to acquire a fingerprint image. The high-resistance film 80 is located between the sensor wiring layer 29 and the sensor substrate 28. Referring to fig. 29, in one example, the high-impedance film 80 may be formed with a through hole so that the sensor circuit layer 29 is formed on the sensor substrate 28 through the through hole. The high-impedance film 80 includes a high-impedance light emitting surface 81 and a high-impedance back surface 82 opposite to each other. The high-impedance light emitting surface 81 is opposite to the sensor circuit layer 29, and the high-impedance back surface 81 is opposite to the sensor circuit layer 29.

The thickness of the high-resistance film 80 is 20nm to 60 nm. That is, the thickness of the high-resistance film 80 is any value between 20nm and 60 nm. For example, the high-resistance film 80 has a thickness of 20nm, 24nm, 28nm, 32nm, 36nm, 40nm, 44nm, 48nm, 52nm, 56nm, 60nm, or the like.

The high-resistance film 80 is composed of a mixture of graphite oxide, tin oxide, a surfactant, and a crosslinking agent. The high-impedance film 80 is added between the sensor circuit layer 29 and the sensor substrate 28, so that mutual interference between the capacitive fingerprint sensor diaphragm 20 and the display module 30 can be avoided or reduced, and the influence on the functions of the capacitive fingerprint sensor diaphragm 20 and the display module 30 due to the mutual interference between the capacitive fingerprint sensor diaphragm 20 and the display module 30 can be avoided.

It should be noted that, compared to the structures of the display device 100 shown in fig. 3, 4, 5, 6, 10, 11, 12, 13, 14 and 15, the display device 100 according to the embodiment of the present invention only adds one high-impedance film 80 between the sensor circuit layer 29 and the sensor substrate 28, and other structures may be the same as those in the above-mentioned drawings, and are not necessarily described herein.

In addition, the capacitive fingerprint sensor membrane 20 in the present embodiment may have the same or corresponding structure as the capacitive fingerprint sensor membrane 20 shown in fig. 7, or may have two different structures. When they are the same or corresponding structures, the sensor substrate 28 may correspond to the sensor board 24, and the sensor wiring layer 29 may correspond to the pixel sensors 23, the pixel amplifiers 25, and the output wirings 26; or when the capacitive fingerprint sensor membrane 20 further comprises a semiconductor substrate, the sensor substrate 28 may correspond to the semiconductor substrate and the sensor line layer 29 may correspond to the pixel sensor 23, the sensor plate 24, the pixel amplifier 25 and the output line 26. Of course, the capacitive fingerprint sensor diaphragm 20 need not include the pixel amplifier 25, and is not limited thereto.

Referring to fig. 1 and 3, in some embodiments, the electronic device 1000 may further include a motherboard chip 220. The display assembly apparatus 100 further includes a sensor chip 201 and a display chip 301. The sensor chip 201 is connected with the capacitive fingerprint sensor diaphragm 20, and the display chip 301 is connected with the display module 30. The sensor chip 201 and the display chip 301 are also both connected to the motherboard chip 220. The sensor chip 201 is connected to the motherboard chip 220 to realize the fingerprint recognition function, and the display chip 301 is connected to the motherboard chip 220 to realize the display function.

The main board chip 220 can control the capacitive fingerprint sensor diaphragm 20 and the display module 30 to work in a time-sharing manner through the sensor chip 201 and the main board chip 220. Specifically, referring to fig. 30, when the capacitive fingerprint sensor diaphragm 20 is used to realize a fingerprint identification function, the sensor chip 201 controls the capacitive fingerprint sensor diaphragm 20 to operate according to the first working signal T1, and meanwhile, the main board chip 220 obtains the first synchronization signal T10 corresponding to the first working signal T1 from the sensor chip 201, and controls the display chip 301 according to the first synchronization signal T10, so that the display module 30 does not operate. Alternatively, referring to fig. 31, when the display module 30 is used to implement the display function, the display chip 301 controls the display module 30 to operate according to the second operating signal T2, and meanwhile, the main board chip 220 obtains the second synchronizing signal T20 corresponding to the second operating signal T2 from the display chip 301, and then controls the sensor chip 201 according to the second synchronizing signal T20, so that the capacitive fingerprint sensor diaphragm 20 does not operate. In the embodiment of the application, the capacitive fingerprint sensor diaphragm 20 and the display module 30 work in a time-sharing manner, and the first working signal T1 and the second working signal T2 are staggered, so that the problem that the capacitive fingerprint sensor diaphragm 20 and the display module 30 work disorderly and interfere with each other in the process of using the electronic device 1000 by a user is avoided.

The display frequency of the display module 30 may be greater than the fingerprint detection frequency of the capacitive fingerprint sensor diaphragm 20. A plurality of second operating signals T2 may be included between two adjacent first operating signals T1. For example, in fig. 32, the display frequency of the display module 30 is twice the fingerprint detection frequency of the capacitive fingerprint sensor diaphragm 20. Two second operating signals T2 are included between two adjacent first operating signals T1. It can be understood that the user generally uses the display module 30 more frequently, and the condition that needs to use the capacitive fingerprint sensor diaphragm 20 is less, therefore, the display frequency of the display module 30 is greater than the fingerprint detection frequency of the capacitive fingerprint sensor diaphragm 20, and the actual use requirement of the user can be better satisfied.

In the description herein, references to the description of the terms "certain embodiments," "one example," "exemplary," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and the scope of the preferred embodiments of the present application includes other implementations in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the present application.

Although embodiments of the present application have been shown and described above, it is to be understood that the above embodiments are exemplary and not to be construed as limiting the present application, and that changes, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.

Claims

1. The utility model provides a display module assembly device, its characterized in that, includes display module assembly, capacitanc fingerprint sensor diaphragm and apron, capacitanc fingerprint sensor diaphragm is located the apron with between the display module assembly and cover the display surface of display module assembly to the response touches extremely the user fingerprint of apron, capacitanc fingerprint sensor diaphragm is used for realizing the fingerprint identification function, capacitanc fingerprint sensor diaphragm still is used as the touch sensor of display module assembly realizes the touch-control function.

2. The display device assembly of claim 1, wherein the fingerprint recognition function is time-multiplexed with the touch function.

3. The device according to claim 1, further comprising a glue, wherein the glue comprises a first optical glue and a second optical glue, the first optical glue is used for bonding the cover plate and the capacitive fingerprint sensor membrane, and the second optical glue is used for bonding the capacitive fingerprint sensor membrane and the display module.

4. The device according to claim 1, further comprising a glue, wherein the glue comprises a first optical glue and a second optical glue, the first optical glue is used for bonding the cover plate and the capacitive fingerprint sensor membrane, and the second optical glue is used for bonding the cover plate and the display module.

5. The display assembly device according to claim 3 or 4, wherein the first optical adhesive is applied in a full-lamination manner, and the second optical adhesive is applied in a full-lamination manner or a frame-lamination manner.

6. The display assembly device of claim 3 or 4, wherein the first optical glue comprises any one of OCA, PVB, or DAF; and/or

The second optical cement comprises any one of OCA, PVB or DAF.

7. The display module apparatus according to claim 1, wherein the cover plate is made of any one of sapphire, glass, PI, PET, or a composite plate, and the composite plate comprises PMMA and PA.

8. The display assembly device of claim 1, wherein the capacitive fingerprint sensor membrane is made of glass or PI; and/or

The connecting circuit material of the capacitive fingerprint sensor diaphragm comprises any one of metal, ITO (indium tin oxide) or nano silver paste.

9. The display assembly device of claim 1, wherein the display module is a hard screen or a flexible screen.

10. The device of claim 1, wherein the display module is an LCM display or an OLED display.

11. The display module device of claim 1, wherein the cover plate comprises a cover plate light exit surface and a cover plate back surface opposite the capacitive fingerprint sensor membrane, the cover plate back surface having an ink layer disposed thereon.

12. The display assembly device of claim 1, further comprising a stiffening layer between the capacitive fingerprint sensor membrane and the display module.

13. The device according to claim 12, further comprising a glue, wherein the glue comprises a first optical glue, a third optical glue and a fourth optical glue, the first optical glue is used for bonding the cover plate and the capacitive fingerprint sensor membrane, the third optical glue is used for bonding the capacitive fingerprint sensor membrane and the stiffening layer, and the fourth optical glue is used for bonding the stiffening layer and the display module.

14. An electronic device, comprising:

a housing; and

the display assembly device of any one of claims 1 to 13, in combination with the housing.

15. A method of assembling a display assembly apparatus, the method comprising:

providing a display module, a capacitive fingerprint sensor diaphragm and a cover plate;

arranging the capacitive fingerprint sensor membrane between the cover plate and the display module and enabling the capacitive fingerprint sensor membrane to cover the display surface of the display module so as to sense the fingerprint of a user touching the cover plate;

the capacitive fingerprint sensor diaphragm is used for achieving a fingerprint identification function, and the capacitive fingerprint sensor diaphragm is also used as a touch sensor of the display module to achieve a touch control function.