CN112129008A - Heat transfer type heat absorption refrigeration method and system for fully-closed space - Google Patents

Heat transfer type heat absorption refrigeration method and system for fully-closed space Download PDF

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CN112129008A
CN112129008A CN202010772455.0A CN202010772455A CN112129008A CN 112129008 A CN112129008 A CN 112129008A CN 202010772455 A CN202010772455 A CN 202010772455A CN 112129008 A CN112129008 A CN 112129008A
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heat
phase
storage material
change
heat storage
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葛睿
高卉
孟凡胜
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Zhejiang Quark Culture And Innovation Technology Co ltd
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Zhejiang Quark Culture And Innovation Technology Co ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0252—Removal of heat by liquids or two-phase fluids

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  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a heat transfer type heat absorption refrigeration method and system for a fully-closed space, wherein three working modes, namely heat absorption, heat transfer and refrigeration, are carried out in the fully-closed space; the heat absorption mode is that the organic phase-change heat storage material is used for continuously absorbing heat of the environment of the totally-enclosed space, and when the internal temperature of the material rises and approaches a phase-change point, the shape of the material is changed from a solid state to a liquid state, and then the phase-change latent heat stage is started; the heat transfer mode is realized based on a plurality of layers of phase change heat storage materials with different phase change points, and the mode is to transfer heat in the phase change material with low phase change point to the phase change material with high adjacent phase change point so as to achieve the effects of temperature reduction, heat transfer and realization of different temperature areas; the refrigeration mode is a rapid cooling process for the contacted phase change heat storage material by utilizing the cold and hot end balance principle of semiconductor refrigeration. This scheme is heat absorption, heat recovery to the surrounding environment in totally enclosed space, has that the heat is many, the cooling is fast, the heat can be shifted and realize different warm area effects.

Description

Heat transfer type heat absorption refrigeration method and system for fully-closed space
Technical Field
The invention relates to the field of heat absorption refrigeration facilities, in particular to a heat transfer type heat absorption refrigeration method and system for a fully-closed space.
Background
With the increasing global warming, the problem of green and economic heat absorption refrigeration is more and more emphasized, especially in the fully enclosed space. At present, for the heat absorption refrigeration problem of a closed space, a plurality of research methods are in progress, and the common methods are active and passive heat absorption refrigeration methods.
In a conventional active heat absorption refrigeration method, such as an air conditioner on-hook type, the refrigerant is converted into a refrigerant form, which mainly includes four steps: (1) a compression process; (2) a condensation process; (3) a throttling process; (4) the evaporation process, mediated by a refrigerant, constantly "carries" heat out of the density space, but has some problems: (1) the refrigeration effect is not good, and higher power consumption is needed to obtain good refrigeration effect; (2) the compressor has larger noise when working; (3) the used basic power energy is still chemical energy such as petroleum and is one of the main causes of environmental pollution. Therefore, a green and high-efficiency energy source is urgently needed;
passive heat dissipation methods, such as heat dissipation by water circulation, drive heat volatilization by water circulation, but water circulation has two problems (1) heat transmission efficiency is low; (2) an external water pump is needed, the generated noise is large, and the volume is large. Chemical materials are also used for passive heat dissipation, and the forms of the chemical materials are different at different melting points so as to absorb heat, the materials belong to phase change materials in a wider range, and although the chemical materials have higher efficiency than water, the chemical materials can also cause environmental pollution when leakage occurs.
Whether the air conditioner compressor method of active heat dissipation or the passive water or chemical material method, there are (1) lower ability to store or convert heat to some extent; (2) the stored or converted heat is directly discharged into the air, thereby exacerbating the global warming problem; (3) the problem of environmental pollution; (4) the problem of high power consumption. Therefore, a green and economical method which not only can process a large amount of heat, but also can transfer or cool the obtained part of heat to avoid directly discharging the heat into the air is needed.
Disclosure of Invention
The following presents a simplified summary of the invention in order to provide a basic understanding of some aspects of the invention. It should be understood that this summary is not an exhaustive overview of the invention. It is not intended to determine the key or critical elements of the present invention, nor is it intended to limit the scope of the present invention. Its sole purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is discussed later.
In order to solve the existing problems, the invention provides a heat transfer type heat absorption refrigeration method and system for a fully-closed space, wherein three working modes, namely heat absorption, heat transfer and refrigeration, are carried out in the fully-closed space; the heat absorption mode is that the organic phase-change heat storage material is used for continuously absorbing heat of the environment of the totally-enclosed space, and when the internal temperature of the material rises and approaches a phase-change point, the shape of the material is changed from a solid state to a liquid state, and then the phase-change latent heat stage is started; the heat transfer mode is realized based on a plurality of layers of phase change heat storage materials with different phase change points, the phase change heat storage materials of different layers are sequentially arranged according to the height of the phase change points, and the heat in the phase change material with the low phase change point is transferred to the phase change material with the high phase change point, so that the effects of cooling, heat transfer and realization of different temperature regions are achieved; the refrigeration mode is a rapid cooling process for the contacted phase change heat storage material by utilizing the cold and hot end balance principle of semiconductor refrigeration.
The heat absorption mode comprises the following specific steps:
(1) the centrifugal fan continuously rotates to accelerate heat in the gathering environment to the heat diffuser;
(2) the heat diffuser is tightly attached to the first layer of organic phase-change heat storage material and continuously transfers heat into the first layer of organic phase-change heat storage material;
(3) the first layer of organic phase-change heat storage material can store the transmitted heat, and the functional relationship among the total storable heat TQ, the temperature Temp and the energy storage density g.DEG C of the unit phase-change heat storage material in the first layer of organic phase-change heat storage material is shown as a formula (1.1):
TQ(temp,g·℃)＝(g·℃*Tempσ*TG+TQσ) /1000 formula (1.1)
Wherein TQ is the total heat quantity storable by the phase-change heat storage module, the unit is J/g DEG C, g DEG C is the energy storage density of the unit phase-change heat storage material, TG is the total quantity of the phase-change heat storage material used by the phase-change heat storage module, and the unit is g, TempσIs the ambient temperature TempEnvPhase change point Temp of phase change heat storage materialPThe temperature difference between them, in degrees Celsius, is shown in equation (1.2):
Tempσ＝TempEnv-TempPformula (1.2)
(4) After the first layer of organic phase change heat storage material absorbs heat until the internal temperature reaches the phase change point, the phase change heat storage material is changed from solid to liquid and enters the process of quickly absorbing heat and then slowing down the heat absorption, namely TQ in the phase change latent heat stageσThe heat absorbed in the phase of latent heat of phase change, namely a process of sectional heat absorption;
(5) at this time, the ambient external temperature is reduced to Temp by heat absorptionEnv1。
The heat transfer mode comprises the following specific steps:
(1) a second layer of phase change heat storage material modules with different phase change points are arranged below the first layer of phase change heat storage modules, and the temperature of the phase change points of the second layer of phase change heat storage material is lower than the ambient temperature Temp of the first phase change heat storage material modules and the ambient temperature Temp after being cooled by the first phase change heat storage material modulesEnv1；
(2) After the first layer of phase change heat storage material absorbs heat, the absorbed heat can be transferred into the second layer of phase change heat storage material module because the phase change point is higher than that of the second layer of phase change heat storage material module;
(3) the phase change heat storage material module of the second layer can absorb the external environment at the same time, and enters a slow phase change latent heat stage after reaching a phase change point;
(4) a plurality of layers of box-type variable-temperature heat storage material modules with different phase change points can be arranged, and the temperature difference of the phase change points between the adjacent modules is utilized to realize different temperature areas.
Furthermore, the phase-change heat storage material selected by the scheme belongs to an organic phase-change heat storage material, has the characteristic of latent heat of phase change, and can absorb heat which is about 5-10 times of the energy storage capacity of the phase-change heat storage material, if the high-carbon alkane of the organic phase-change heat storage material belongs to the frontal paraffin of the organic heat storage material, the unit storable heat density of the sixteen-carbon B alkane is 240 (J/g.DEG C), and if the phase-change heat storage module contains 1000g of the phase-change heat storage material, when absorbing heat, the storage capacity of the phase-change heat storage material can occupy 2.4 x 10 ℃ when absorbing every time absorbing the phase-change heat storage material with the temperature higher than the current temperature5(J) Heat, the total heat actually storable is 1.2 x 106(J) Therefore, through changing the quality of different phase change heat storage materials, the phase change heat storage material that this scheme chose for use can satisfy different demand heat occasions.
The phase change heat storage material is selected, and due to the fact that the phase change heat storage material is poor in heat conductivity, the phase change heat storage material is placed in a structure similar to capillary vessel tissue of a metal material, so that the heat conductivity of the phase change heat storage material can be improved, gaps, through which the phase change heat storage material can flow, in the structure are 100 nm-5 mm, the structure with smaller gaps is difficult to manufacture, and structures with different gaps can be manufactured according to different working occasions.
The refrigeration working mode comprises the following specific steps: utilize the refrigeration principle of semiconductor refrigeration piece, the cold junction lasts the cooling to the heat of phase change heat storage material inside, and up to reaching phase transition point of phase change heat storage material, its form can become the solid by liquid, reaches the cooling effect:
(1) for each layer of organic phase-change heat storage material, the semiconductor refrigerating sheet is tightly attached to the phase-change heat storage material;
(2) the refrigeration principle of the semiconductor refrigeration piece is utilized, namely when current passes through the semiconductor refrigeration piece, balanced temperature difference electromotive force can be generated between a P-type semiconductor and an N-type semiconductor in the semiconductor refrigeration piece, and a cold end and a hot end can be generated, in order to maintain the temperature difference between the cold end and the hot end, when the temperature of the hot end or the cold end rises or falls, the temperature of the other end also falls along with the temperature of the hot end, so that when the temperature of the hot end of the semiconductor refrigeration piece, which is not in contact with the phase-change heat storage module, rises, the temperature of the cold end also falls along with the temperature of the hot end, and falls to the phase-change heat storage material until; the heat diffuser and the centrifugal fan are arranged below the semiconductor refrigeration piece and used for accelerating the temperature rise of the hot end and balancing the temperature difference of the cold end temperature to achieve the effect that the cold end cools the phase change heat storage module.
The temperature difference of the semiconductor refrigeration piece is generally 67 ℃ in the refrigeration working mode, the whole time for cooling the phase-change heat storage module is slightly long, and the cooling speed and the cooling effect can be increased by increasing the specification and the size of the semiconductor refrigeration piece.
The phase-change heat storage material, its back that absorbs huge heat at itself of the phase-change heat storage material that this scheme chose for use, its inside temperature risees, but its surface temperature is nearly unchangeable, can prevent on the one hand that the reverse transmission of upper end heat diffuser heat, on the other hand has eliminated the surface temperature difference interference that causes the semiconductor refrigeration piece during operation nearly.
The working sequence of the three working modes is a heat absorption mode, a heat transfer mode and a cooling mode, and when any working mode is operated, other modes are not operated.
The gain effect of the method provided by the invention is as follows:
the invention provides a heat transfer type heat absorption refrigeration method and system used in a fully-closed space, and the scheme comprises the following steps: the heat absorption and refrigeration in the totally-enclosed space are carried out in two working modes. The heat absorption function is to absorb excessive heat in the environment, and the steps comprise: when the ambient temperature is higher than the phase change point of the organic phase-change heat storage material, the organic phase-change heat storage material continuously absorbs heat transmitted by the diffuser, and the form of the organic phase-change heat storage material is changed from a solid state to a liquid state in the heat absorption process until the heat storage material reaches the capacity of self-absorbable heat. The refrigeration work is to reduce the temperature of the phase change heat storage material, and the steps comprise: utilize the refrigeration principle of semiconductor refrigeration piece, the cold junction lasts the cooling to the heat of phase change heat storage material inside, and up to reaching phase transition point of phase change heat storage material, its form can become the solid by liquid, reaches the cooling effect.
This scheme is heat absorption, heat recovery to the surrounding environment in totally enclosed space, has that the heat is many, the cooling is fast, the heat can be shifted and realize different warm area effects.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for the embodiments or the technical solutions in the prior art are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a front view of the system and apparatus of the present invention
FIG. 2 is a functional relationship diagram of the temperature variation and the energy storage of the first phase change thermal storage module according to the present invention
FIG. 3 is a design diagram of a metal structure for storing phase change heat storage material in the system and apparatus of the present invention
FIG. 4 is a schematic diagram of a diffuser design in the system and apparatus of the present invention
In the figure, 1 is a centrifugal fan, 2 is a heat diffuser, 3 is a first layer of phase change heat storage material, 4 is a capillary vessel-like structure metal material structure, 5 is a second layer of phase change heat storage material, 6 is a third layer of phase change heat storage material, 7 is a semiconductor refrigeration sheet, 8 is a hot end diffuser, and 9 is a centrifugal fan.
Detailed Description
In order to make the technical solutions of the present invention more apparent, the present disclosure is described in more detail below with reference to examples, but the scope of the present invention is not limited to the examples described below, and all the features disclosed in the present specification, or all the steps in the disclosed methods or processes, may be combined in any manner, except for mutually exclusive features and/or steps.
The principle is further explained below with reference to the accompanying drawings:
referring to fig. 1 and 2, the invention provides a method and a system for heat transfer type heat absorption refrigeration in a fully-closed space, and belongs to the field of heat absorption refrigeration. This scheme includes: the heat absorption and refrigeration in the totally-enclosed space are carried out in two working modes. The heat absorption function is to absorb excessive heat in the environment, and the steps comprise: when the ambient temperature is higher than the phase change point of the organic phase-change heat storage material, the organic phase-change heat storage material continuously absorbs heat transmitted by the diffuser, and the form of the organic phase-change heat storage material is changed from a solid state to a liquid state in the heat absorption process until the heat storage material reaches the capacity of self-absorbable heat. The refrigeration work is to reduce the temperature of the phase change heat storage material, and the steps comprise: utilize the refrigeration principle of semiconductor refrigeration piece, the cold junction lasts the cooling to the heat of phase change heat storage material inside, and up to reaching phase transition point of phase change heat storage material, its form can become the solid by liquid, reaches the cooling effect.
Referring to fig. 1 and 3, the heat absorption mode includes the following specific steps:
(1) the centrifugal fan continuously rotates to accelerate heat in the gathering environment to the heat diffuser;
(2) the strip-shaped heat diffuser is tightly attached to the first layer of the phase change heat storage module and continuously transfers heat into the first layer of the organic phase change heat storage module;
(3) the first layer of phase-change heat storage module can store the transmitted heat, and the functional relationship among the total storable heat TQ, the temperature Temp and the energy storage density g-DEG C of the unit phase-change heat storage material in the first layer of phase-change heat storage module is shown as a formula (1.1):
TQ(temp,g·℃)＝(g·℃*Tempσ*TG+TQσ) /1000 formula (1.1)
Wherein TQ is the total heat quantity storable by the phase-change heat storage module, the unit is J/g DEG C, g DEG C is the energy storage density of the unit phase-change heat storage material, TG is the total quantity of the phase-change heat storage material used by the phase-change heat storage module, and the unit is g, TempσIs the ambient temperature TempEnvPhase change point Temp of phase change heat storage materialPThe temperature difference between them, in degrees Celsius, is shown in equation (1.2):
Tempσ＝TempEnv-TempPformula (1.2)
(4) After the phase-change material absorbs certain heat and the internal temperature reaches the phase-change point, the phase-change heat storage material is changed from solid to liquid and enters the process of quickly absorbing heat and then slowing down the heat absorption, namely the phase-change heat storage material is phase-changeIn the latent heat phase, TQσThe heat absorbed in the phase of latent heat of phase change, namely a process of sectional heat absorption;
(5) at this time, the ambient external temperature is reduced to Temp by heat absorptionEnv1。
(6) The curve of the relationship between the stored energy, the stored energy speed and the temperature is shown in fig. 3, and the stored energy is increased in the stage from solid to liquid, namely 0 to 15.5 ℃; after the endotherm reached the melting point 15 c, the speed was gradually increased up to 18.5 c, then the endotherm speed was slowly decreased up to 20.5 c, after which the endotherm speed was gradually slower, while the energy was always increased.
Furthermore, the phase-change heat storage material selected by the scheme belongs to an organic phase-change heat storage material, has the characteristic of latent heat of phase change, and can absorb heat which is about 5-10 times of the energy storage capacity of the phase-change heat storage material, if the high-carbon alkane of the organic phase-change heat storage material belongs to the frontal paraffin of the organic heat storage material, the unit storable heat density of the sixteen-carbon B alkane is 240 (J/g.DEG C), and if the phase-change heat storage module contains 1000g of the phase-change heat storage material, when absorbing heat, the storage capacity of the phase-change heat storage material can occupy 2.4 x 10 ℃ when absorbing every time absorbing the phase-change heat storage material with the temperature higher than the current temperature5(J) Heat, the total heat actually storable is 1.2 x 106(J) Therefore, through changing the quality of different phase change heat storage materials, the phase change heat storage material that this scheme chose for use can satisfy different demand heat occasions.
As shown in fig. 1, the thermal transfer mode specifically includes the following steps:
(1) a second layer of phase change heat storage material with different phase change points is arranged below the first layer of phase change heat storage material, and the temperature of the phase change points of the second layer of phase change heat storage material is lower than the ambient temperature Temp of the first phase change heat storage material module and the environment temperature after being cooled by the first phase change heat storage material moduleEnv1If the phase change point of the first layer of phase change heat storage material is 17 ℃, after absorbing the external environment temperature, the external environment temperature can reach 15 ℃, so in order to transfer the heat in the first layer of phase change heat storage material and continuously reduce the external environment temperature, the phase change point of the second layer of phase change heat storage material die is set to be lower than 5 ℃, namely 12 ℃;
(2) after the first layer of phase change heat storage material absorbs heat, the absorbed heat can be transferred into the second layer of phase change heat storage material module because the phase change point of the first layer of phase change heat storage material is higher than that of the second layer of phase change heat storage material;
(3) the phase change heat storage material of the second layer can absorb the external environment at the same time, and enters a slow phase change latent heat stage after reaching a phase change point;
(4) a plurality of layers of phase change heat storage materials with different phase change points can be arranged, and the temperature difference of the phase change points between the adjacent phase change heat storage materials is utilized to realize different temperature areas.
Referring to fig. 3, the phase change heat storage material is selected, and because the phase change heat storage material has poor thermal conductivity, the phase change heat storage material is placed in a structure similar to a capillary vessel structure of a metal material, so that the thermal conductivity of the phase change heat storage material can be improved, the gap where the phase change heat storage material can flow in the structure is 100nm to 5mm, the smaller the gap, the more difficult the manufacturing method of the structure is, and the structures with different gaps can be manufactured according to different working occasions.
As shown in fig. 1, the cooling mode specifically includes the steps of: by utilizing the refrigeration principle of the semiconductor refrigeration sheet, the cold end continuously cools the heat inside the phase change heat storage material until reaching the phase change point of the phase change heat storage material, and the form of the cold end can be changed from liquid to solid to achieve the cooling effect
(1) The semiconductor refrigerating sheet 6 is tightly attached to the lower part of the phase-change heat storage material (only one layer of semiconductor refrigerating sheet is drawn in the figure, and actually, one layer of semiconductor refrigerating sheet can be arranged for each layer of phase-change heat storage material);
(2) by utilizing the refrigeration principle of the semiconductor refrigeration piece 6, namely when current passes through the semiconductor refrigeration piece 6, balanced thermoelectric electromotive force can be generated between a P-type semiconductor and an N-type semiconductor in the semiconductor refrigeration piece 6, and a cold end and a hot end can also be generated, in order to maintain the temperature difference between the cold end and the hot end, when the temperature of the hot end or the cold end rises or falls, the temperature of the other end also falls along with the temperature of the hot end, so when the semiconductor refrigeration piece 6 does not contact with the temperature of the hot end of the phase-change heat storage module, the temperature of the cold end also falls along with the temperature of the hot end and the temperature of the cold end falls to the phase-change point of the phase-; a heat diffuser and a centrifugal fan are arranged below the semiconductor refrigerating sheet 6 and used for accelerating the temperature rise of the hot end and balancing the temperature difference of the cold end temperature to achieve the effect that the cold end cools the phase change heat storage module.
The temperature difference of the semiconductor refrigerating sheet 6 in the refrigerating working mode is generally 67 ℃, the whole time for cooling the phase-change heat storage material is slightly long, and the cooling speed and the cooling effect can be increased by increasing the specification and the size of the semiconductor refrigerating sheet 6.
The phase-change heat storage material, the phase-change heat storage material selected for use in the scheme has the advantages that after the phase-change heat storage material absorbs huge heat, the internal temperature of the phase-change heat storage material rises, but the surface temperature of the phase-change heat storage material is almost unchanged, so that the heat of an upper-end heat diffuser can be prevented from being reversely transferred, and the surface temperature difference interference caused when the semiconductor refrigerating sheet 6 works is almost eliminated.
Referring to fig. 4 and 1, the cold and hot end diffusers 8 are of the split strip design shown in fig. 4, which is more efficient than conventional diffusers, with the continuous rotation of the centrifugal fan 9 for rapid heat dissipation.
The working sequence of the three working modes is firstly a heat absorption working mode, then a heat transfer working mode and finally a refrigeration working mode, and when any working mode is operated, the other two working modes do not work any more.
This scheme is heat absorption, heat recovery to the surrounding environment in totally enclosed space, has that the heat is many, the cooling is fast, the heat can be shifted and realize different warm area effects.

Claims (8)

1. A heat transfer type heat absorption refrigeration method for a fully-closed space is characterized in that three working modes, namely a heat absorption mode, a heat transfer mode and a refrigeration mode, are carried out in the fully-closed space; the heat absorption mode is that the organic phase-change heat storage material is used for continuously absorbing heat of the environment of the totally-enclosed space, and when the internal temperature of the material rises and approaches a phase-change point, the shape of the material is changed from a solid state to a liquid state, and then the phase-change latent heat stage is started; the heat transfer mode is realized based on a plurality of layers of phase change heat storage materials with different phase change points, the phase change heat storage materials of different layers are sequentially arranged according to the height of the phase change points, and the heat in the phase change material with the low phase change point is transferred to the phase change material with the high phase change point, so that the effects of cooling, heat transfer and realization of different temperature regions are achieved; the refrigeration mode is a rapid cooling process for the contacted phase change heat storage material by utilizing the cold and hot end balance principle of semiconductor refrigeration.
2. A heat transfer type heat absorption refrigerating method for a totally enclosed space as claimed in claim 1, wherein said heat absorption mode comprises the following specific steps:
(1) the centrifugal fan continuously rotates to accelerate heat in the gathering environment to the heat diffuser;
(2) the heat diffuser is tightly attached to the first layer of organic phase-change heat storage material and continuously transfers heat into the first layer of organic phase-change heat storage material;
(3) the first layer of organic phase-change heat storage material can store the transmitted heat, and the functional relationship among the total storable heat TQ, the temperature Temp and the energy storage density g.DEG C of the unit phase-change heat storage material in the first layer of organic phase-change heat storage material is shown as a formula (1.1):
TQ(temp,g·℃)＝(g·℃*Tempσ*TG+TQσ) /1000 formula (1.1)
Wherein TQ is the total heat quantity storable by the phase-change heat storage module, the unit is J/g DEG C, g DEG C is the energy storage density of the unit phase-change heat storage material, TG is the total quantity of the phase-change heat storage material used by the phase-change heat storage module, and the unit is g, TempσIs the ambient temperature TempEnvPhase change point Temp of phase change heat storage materialPThe temperature difference between them, in degrees Celsius, is shown in equation (1.2):
Tempσ＝TempEnv-TempPformula (1.2)
(4) After the first layer of organic phase change heat storage material absorbs heat until the internal temperature reaches the phase change point, the phase change heat storage material is changed from solid to liquid and enters the process of quickly absorbing heat and then slowing down the heat absorption, namely TQ in the phase change latent heat stageσIs the heat absorbed in the phase of latent heat of phase change, i.e. a segmented heat absorptionThe process of (2);
(5) at this time, the ambient external temperature is reduced to Temp by heat absorptionEnv1。
3. A heat transfer type heat absorption refrigerating method for a totally enclosed space as claimed in claim 1, wherein said heat transfer mode comprises the following specific steps:
(1) a second layer of organic phase-change heat storage material with different phase-change points is arranged below the first layer of organic phase-change heat storage material, and the temperature of the phase-change points of the second layer of organic phase-change heat storage material is lower than the ambient temperature Temp of the first layer of organic phase-change heat storage material and the environment temperature after being cooled by the first layer of organic phase-change heat storage materialEnv1；
(2) After the first layer of organic phase-change heat storage material absorbs heat, the absorbed heat can be transferred into the second layer of organic phase-change heat storage material because the phase change point is higher than that of the second layer of organic phase-change heat storage material;
(3) the second layer of organic phase-change heat storage material can absorb the external environment at the same time, and enters a slow phase-change latent heat stage after reaching a phase-change point;
(4) heat is transferred in a plurality of layers of organic phase change heat storage materials in sequence, and different temperature areas are realized by utilizing the phase change point temperature difference between adjacent materials.
4. A heat transfer type heat absorption refrigerating method for a totally enclosed space as claimed in claim 1, wherein said refrigerating mode comprises the following specific steps:
(1) for each layer of organic phase-change heat storage material, the semiconductor refrigerating sheet is tightly attached to the phase-change heat storage material;
(2) by utilizing the refrigeration principle of the semiconductor refrigeration sheet, the cold end continuously cools the heat in the phase change heat storage material until reaching the phase change point of the phase change heat storage material, and the shape of the phase change heat storage material is changed from liquid to solid, so that the cooling effect is achieved;
(3) and a heat diffuser and a centrifugal fan are further arranged below the semiconductor refrigerating sheet and used for accelerating the temperature rise of the hot end and balancing the temperature difference with the temperature of the cold end to achieve the effect of cooling the phase-change heat storage material by the cold end.
5. The heat transfer type heat absorption refrigeration method for the totally enclosed space as claimed in claim 1, wherein the cooling speed and effect can be increased by increasing the specification size of the semiconductor refrigeration sheet in the refrigeration mode.
6. A heat transfer type heat absorption refrigerating method for a totally enclosed space as claimed in claim 1, wherein: the organic phase-change heat storage material adopts high-carbon alkane.
7. The heat-transfer type heat-absorption refrigeration method for the totally enclosed space as claimed in claim 1, wherein the layers of organic phase-change heat-storage material are placed in the metal material structure similar to the capillary vessel tissue due to the poor thermal conductivity of the phase-change heat-storage material itself.
8. A heat-transfer type heat absorption refrigerating method for a totally enclosed space as claimed in claim 1, wherein the three operation modes are a first heat absorption mode, a second heat transfer mode and a last refrigerating mode, and when any one of the operation modes is operated, the other operation modes are not operated.
CN202010772455.0A 2020-08-04 2020-08-04 Heat transfer type heat absorption refrigeration method and system for fully-closed space Pending CN112129008A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101827509A (en) * 2009-03-03 2010-09-08 赵继永 Phase-change energy accumulation and temperature control device of sealing equipment
CN102538230A (en) * 2011-12-30 2012-07-04 西安交通大学 Solar phase change thermal storage heating apparatus and method
WO2013003886A1 (en) * 2011-07-01 2013-01-10 The University Of Tasmania Personal cooling unit using phase change material
CN105571168A (en) * 2016-01-27 2016-05-11 北方工业大学 Solar heat collection automatic step phase change heat storage energy step utilization device
CN108243795A (en) * 2018-01-18 2018-07-06 中国农业大学 A kind of sub- often low temperature phase change heat accumulation thermal desorption system in greenhouse

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101827509A (en) * 2009-03-03 2010-09-08 赵继永 Phase-change energy accumulation and temperature control device of sealing equipment
WO2013003886A1 (en) * 2011-07-01 2013-01-10 The University Of Tasmania Personal cooling unit using phase change material
CN102538230A (en) * 2011-12-30 2012-07-04 西安交通大学 Solar phase change thermal storage heating apparatus and method
CN105571168A (en) * 2016-01-27 2016-05-11 北方工业大学 Solar heat collection automatic step phase change heat storage energy step utilization device
CN108243795A (en) * 2018-01-18 2018-07-06 中国农业大学 A kind of sub- often low temperature phase change heat accumulation thermal desorption system in greenhouse

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