CN112114599A - Temperature control method and device of power device - Google Patents
Temperature control method and device of power device Download PDFInfo
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Abstract
The invention provides a temperature control method of a power device, wherein the power device is a component of a current transformer, the power device is arranged on a table board of a radiator, the radiator is a component of a heat dissipation system of the power device, and the temperature control method comprises the following steps: determining the current junction temperature of the power device based on the working parameters of the radiator and the working parameters of the power device; and adjusting the control parameter of the heat dissipation system based on the current node temperature and the target node temperature to reduce the difference between the current node temperature and the target node temperature of the power device.
Description
Technical Field
The invention relates to the field of power electronics, in particular to a temperature control method and a temperature control device for a power device.
Background
The power device is a core component of the converter, and the safety and the reliability of the power device are key technologies of the converter. The failure of the power device caused by abnormal extreme conditions such as overvoltage or overcurrent is eliminated, and the failure reason of the power device such as an IGBT in the application process is mainly due to the accumulation and impact of thermal stress in the working process. Too high junction temperature or too large fluctuation amplitude of the power device can greatly reduce the reliability and the service life of the power device. Therefore, improving the stability of the junction temperature of the power device and reducing the fluctuation range of the junction temperature are important means for improving the safety and reliability of the power device.
Generally, the junction temperature of a power device is influenced by factors such as a control strategy, a heat exchange condition and an application condition of a converter to which the power device belongs, so that an active junction temperature control strategy of the current power device has two directions. In one direction, the output control of the power loss of the power device is realized by changing a circuit, adjusting voltage or increasing buffer capacitance and the like, so that the heat productivity and the junction temperature of the power device are controlled; the other direction is to realize the control of the heat exchange system of the power device by adjusting the temperature of the cooling medium in the heat exchange system, the temperature of the table board of the radiator, the flow of the cooling medium and the like, and further control the node temperature of the power device.
The power loss of the power device is related to the control strategy and the application condition of the rectifying circuit or the inverter circuit, the power loss cannot be regulated and controlled in real time, and a heat exchange system of the power device needs to be controlled in real time and actively to realize the real-time and active control of the junction temperature of the power device.
The heat exchange system of the existing power device generally adopts a water-cooling plate radiator to realize the heat exchange with the power device. The power device is arranged on the working table of the water-cooling plate radiator, and the water-cooling plate radiator is in contact with the other surface of the working table to exchange heat with the working table. Under the unsteady state working condition, because the loss of power device is constantly changing, so can produce the heat of different degrees, receive the influence of day and night ambient temperature change simultaneously, the nodal point temperature of power device can have great fluctuation. In order to prevent the node temperature of the power device from generating large fluctuation, the invention aims to provide a temperature control method and a temperature control device of the power device, which can be used for inhibiting the fluctuation of the node temperature of the power device so as to improve the safety and the reliability of the power device.
Disclosure of Invention
The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.
According to an aspect of the present invention, there is provided a temperature control method of a power device, the power device being a constituent device of a current transformer, the power device being mounted on a table of a heat sink, the heat sink being a constituent component of a heat dissipation system of the power device, the temperature control method including: determining the current junction temperature of the power device based on the working parameters of the radiator and the working parameters of the power device; and adjusting the control parameter of the heat dissipation system based on the current node temperature and the target node temperature to reduce the difference between the current node temperature and the target node temperature of the power device.
Further, the determining the current junction temperature of the power device based on the operating parameters of the heat sink and the operating parameters of the power device comprises: determining the power loss of the power device based on the working parameters of the converter; judging the power loss state of the power device based on the change rate of the power loss of the power device; determining a heat transfer model of the heat sink to the power device based on a power loss state of the power device; and calculating the current junction temperature of the power device by using the heat transfer model and the working parameters related to the heat transfer model.
Still further, the determining the power loss state of the power device based on the rate of change of the power loss of the power device includes: responding to the fact that the change rate of the power loss of the power device is smaller than or equal to a preset threshold value, and judging that the power loss of the power device is in a stable state; responding to the fact that the change rate of the power loss of the power device is larger than the preset threshold value, and judging that the power loss of the power device is in an unstable state; and said determining a heat transfer model of the heat sink to the power device based on the power loss state of the power device comprises: determining a thermal resistance heat transfer model as a heat transfer model of the heat sink to the power device in response to the power loss of the power device being in a steady state; and determining a thermal resistance-thermal capacitance heat transfer model as a heat transfer model of the heat sink to the power device in response to the power loss of the power device being in an unstable state.
Further, the calculating the current junction temperature of the power device by using the heat transfer model and the operating parameters related to the heat transfer model includes: calculating the table top temperature of the radiator based on the temperature of the heat exchange medium in the radiator by using the heat transfer model; calculating a housing temperature of the power device based on a mesa temperature of the heat sink using the heat transfer model; and calculating the junction temperature of the power device based on the shell temperature of the power device by using the heat transfer model.
Further, the adjusting the control parameter of the heat dissipation system based on the current junction temperature and the target junction temperature to reduce the difference between the current junction temperature and the target junction temperature of the power device includes: establishing a control model by utilizing a functional relation between the node temperature of the power device and the control parameter of the heat dissipation system and a difference between the current node temperature and the target node temperature; solving the optimal solution of the control model to determine the control parameters of the heat dissipation system; and adjusting the current control parameters of the heat dissipation system to the determined control parameters.
Still further, the temperature control method further includes: establishing a historical database of the control parameters of the heat dissipation system corresponding to the node temperature of the power device; fitting a functional relation between the junction temperature of the power device and the control parameter of the heat dissipation system based on the historical database; and the solving the optimal solution of the control model to determine the control parameters of the heat dissipation system comprises: determining a solution set of the control model by using the historical database; and determining a solution in the solution set that minimizes a difference between the current junction temperature and the target junction temperature as the optimal solution.
Still further, the operating parameters of the converter include operating current, operating voltage and switching frequency, and the determining the power loss of the power device based on the operating parameters of the converter includes: and calculating the power loss of the power device based on the working current, the working voltage and the switching frequency.
Further, the operating parameters of the converter include an operating condition and an operating environment temperature, and the determining the power loss of the power device based on the operating parameters of the converter includes: and calculating the power loss of the power device based on the operating condition and the working environment temperature.
According to another aspect of the present invention, there is also provided a temperature control apparatus for a power device, the power device being a constituent device of a current transformer, the power device being mounted on a table of a heat sink, the heat sink being a constituent component of a heat dissipation system of the power device, the temperature control apparatus including: a memory; and a processor coupled to the memory, the processor configured to: determining the current junction temperature of the power device based on the working parameters of the radiator and the working parameters of the power device; and adjusting the control parameter of the heat dissipation system based on the current node temperature and the target node temperature to reduce the difference between the current node temperature and the target node temperature of the power device.
Still further, the processor is further configured to: determining the power loss of the power device based on the working parameters of the converter; judging the power loss state of the power device based on the change rate of the power loss of the power device; determining a heat transfer model of the heat sink to the power device based on a power loss state of the power device; and calculating the current junction temperature of the power device by using the heat transfer model and the working parameters related to the heat transfer model.
Still further, the processor is further configured to: responding to the fact that the change rate of the power loss of the power device is smaller than or equal to a preset threshold value, and judging that the power loss of the power device is in a stable state; responding to the fact that the change rate of the power loss of the power device is larger than the preset threshold value, and judging that the power loss of the power device is in an unstable state; determining a thermal resistance heat transfer model as a heat transfer model of the heat sink to the power device in response to the power loss of the power device being in a steady state; and determining a thermal resistance-thermal capacitance heat transfer model as a heat transfer model of the heat sink to the power device in response to the power loss of the power device being in an unstable state.
Still further, the processor is further configured to: calculating the table top temperature of the radiator based on the temperature of the heat exchange medium in the radiator by using the heat transfer model; calculating a housing temperature of the power device based on a mesa temperature of the heat sink using the heat transfer model; and calculating the junction temperature of the power device based on the shell temperature of the power device by using the heat transfer model.
Still further, the processor is further configured to: establishing a control model by utilizing a functional relation between the node temperature of the power device and the control parameter of the heat dissipation system and a difference between the current node temperature and the target node temperature; solving the optimal solution of the control model to determine the control parameters of the heat dissipation system; and adjusting the current control parameters of the heat dissipation system to the determined control parameters.
Still further, the processor is further configured to: establishing a historical database of the control parameters of the heat dissipation system corresponding to the node temperature of the power device; determining a solution set of the control model by using the historical database; and determining a solution in the solution set that minimizes a difference between the current junction temperature and the target junction temperature as the optimal solution.
Still further, the operating parameters of the current transformer include operating current, operating voltage, and switching frequency, the processor being further configured to: and calculating the power loss of the power device based on the working current, the working voltage and the switching frequency.
Still further, the operating parameters of the converter include operating conditions and operating ambient temperature, and the processor is further configured to: and calculating the power loss of the power device based on the operating condition and the working environment temperature.
According to yet another aspect of the present invention, there is also provided a computer storage medium having a computer program stored thereon, the computer program when executed implementing the steps of the method of temperature control of a power device of any of the above.
Drawings
The above features and advantages of the present disclosure will be better understood upon reading the detailed description of embodiments of the disclosure in conjunction with the following drawings.
FIG. 1 is a schematic flow chart diagram illustrating a method for controlling the temperature of a power device in one embodiment according to one aspect of the present invention;
FIG. 2 is a partial flow diagram of a method of controlling the temperature of a power device in one embodiment according to one aspect of the present invention;
FIG. 3 is a schematic diagram of a heat transfer path of a thermal resistance heat transfer model according to one aspect of the present invention;
FIG. 4 is a schematic diagram of a heat transfer path of a thermal resistance-thermal capacity heat transfer model according to one aspect of the present invention;
FIG. 5 is a partial flow diagram of a method of controlling the temperature of a power device in one embodiment according to one aspect of the present invention;
FIG. 6 is a partial flow diagram of a method of controlling the temperature of a power device in one embodiment according to one aspect of the present invention;
FIG. 7 is a partial flow diagram of a method of controlling the temperature of a power device in one embodiment according to one aspect of the present invention;
fig. 8 is a block diagram of a temperature control apparatus of a power device in an embodiment according to another aspect of the present invention.
Detailed Description
The following description is presented to enable any person skilled in the art to make and use the invention and is incorporated in the context of a particular application. Various modifications, as well as various uses in different applications will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to a wide range of embodiments. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
In the following detailed description, numerous specific details are set forth in order to provide a more thorough understanding of the invention. It will be apparent, however, to one skilled in the art that the practice of the invention may not necessarily be limited to these specific details. In other instances, well-known structures and devices are shown in block diagram form, rather than in detail, in order to avoid obscuring the present invention.
The reader's attention is directed to all papers and documents which are filed concurrently with this specification and which are open to public inspection with this specification, and the contents of all such papers and documents are incorporated herein by reference. All the features disclosed in this specification (including any accompanying claims, abstract and drawings) may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise. Thus, unless expressly stated otherwise, each feature disclosed is one example only of a generic series of equivalent or similar features.
Note that where used, the designations left, right, front, back, top, bottom, positive, negative, clockwise, and counterclockwise are used for convenience only and do not imply any particular fixed orientation. In fact, they are used to reflect the relative position and/or orientation between the various parts of the object. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
It is noted that, where used, further, preferably, still further and more preferably is a brief introduction to the exposition of the alternative embodiment on the basis of the preceding embodiment, the contents of the further, preferably, still further or more preferably back band being combined with the preceding embodiment as a complete constituent of the alternative embodiment. Several further, preferred, still further or more preferred arrangements of the belt after the same embodiment may be combined in any combination to form a further embodiment.
The invention is described in detail below with reference to the figures and specific embodiments. It is noted that the aspects described below in connection with the figures and the specific embodiments are only exemplary and should not be construed as imposing any limitation on the scope of the present invention.
According to one aspect of the invention, a method for controlling the temperature of a power device is provided, in particular to a method for controlling the junction temperature of the power device by adjusting a heat dissipation system of the power device in real time.
The power device can be a thyristor, a field effect transistor, a diode or other switching devices, and is generally used for a converter. The converter refers to a device including a rectifying circuit or an inverting circuit.
The heat dissipation system of the power device can adopt a water cooling heat dissipation system or an air cooling heat dissipation system. Taking a water-cooling heat dissipation system as an example, the water-cooling plate is installed on a table top, the power device is installed on the other surface of the table top through silicone grease to exchange heat with a heat exchange medium in the water-cooling plate, and the water-cooling plate, a water channel of a cooling medium of the water-cooling plate, a water pump and a heat exchanger on the adaptive water channel form the water-cooling heat dissipation system of the power device.
Fig. 1 shows a flow diagram of a temperature control method in an embodiment. As shown in fig. 1, the temperature control method 100 includes steps S110 to S120.
Wherein, step S110 is: and determining the current junction temperature of the power device based on the working parameters of the radiator and the working parameters of the power device.
The heat sink refers to a heat sink used in a heat dissipation system of a power device, such as a water cooling plate in a water cooling heat dissipation system or a fan in an air cooling heat dissipation system.
An operating parameter refers to a parameter that indicates the operation of a device or appliance. The operating parameters of the heat sink and the operating parameters of the power device are related to the junction temperature of the power device and can be used for calculating the junction temperature of the power device.
In general, the operating parameters of the heat sink may include parameters such as the temperature of various devices within the heat dissipation system, the temperature of the cooling medium at different locations of the water channel, or the thermal resistance of the heat sink and other equipment or materials between the heat sink and the power device. The operating parameters of the power device may include parameters such as power loss of the power device or thermal resistance of the power device, wherein the power loss of the power device may be calculated based on the operating parameters of the converter, and the operating parameters of the converter may include current, voltage, switching frequency, power, operating conditions or operating environment temperature, and the like.
It is understood that the above-mentioned operating parameters for calculating the junction temperature of the power device may be obtained in real time or at preset time intervals. The junction temperature at a time is calculated based on the same batch of operating parameters acquired simultaneously at that time.
Further, the power device can be divided into a stable state and an unstable state based on the temperature change condition of the power device. In the steady state and the non-steady state, the calculation models of the junction temperature of the power device are different, and the related working parameters may also be different. Therefore, a calculation model of the junction temperature of the power device can be determined based on the power loss condition of the power device.
The power loss of a power device refers to the difference between the input power and the output power of the power device. Those skilled in the art will appreciate that power lost in power devices is typically due to heat generation, and thus, power loss based on power devices is related to junction temperature of the power devices.
As shown in fig. 2, step S110 may include steps S111 to S114.
Wherein, step S111 is: and determining the power loss of the power device based on the working parameters of the converter.
Based on the combination of the operating parameters of different converters, the power loss of the power device can be calculated by adopting a corresponding calculation method. Conventionally, the power loss of the power device can be calculated based on the working current, the working voltage and the switching frequency of the converter; and the power loss of the power device can be calculated based on the operating condition and the working environment temperature of the converter. These calculation methods are conventional calculation methods in the art and are not described in detail.
Step S112 is: and judging the power loss state of the power device based on the change rate of the power loss of the power device.
The rate of change of the power loss may be a difference between the power loss calculated at the present time and the power loss calculated at the previous time, or may be a fitted rate of change of the power loss for a period of time before the present time.
And judging the power loss state of the power device based on the change rate of the power loss at the current moment, thereby determining a calculation model of the node temperature corresponding to the power loss state.
Specifically, when the power loss variation is small, the variation of the junction temperature of the power device can be regarded as a steady-state problem, and at this time, the main factor affecting the junction temperature is the thermal resistance of the device or equipment, so the thermal capacity of the device or equipment can be ignored, and only the thermal resistance is considered; when the power loss changes greatly, the transient loss needs to be calculated, that is, not only the influence of the thermal resistance of the device or equipment on the junction temperature but also the influence of the thermal capacitance of the device or equipment need to be considered.
Therefore, a predetermined threshold value can be set based on the influence of the heat capacity corresponding to different power loss change rates. When the calculated change rate of the power loss at the current moment is less than or equal to the preset threshold value, judging that the power loss of the power device is in a stable state; and when the calculated change rate of the power loss at the current moment is larger than the preset threshold value, judging that the power loss of the power device is in an unstable state.
Step S113 is: determining a heat transfer model of the heat sink to the power device based on a power loss state of the power device.
When the power loss of the power device is in a stable state, the influence of the thermal resistance of the device or equipment on the junction temperature can be only considered, so that a thermal resistance heat transfer model is adopted as a calculation model of the junction temperature of the power device; when the power loss of the power device is in an unstable state, the influence of the heat capacity of the device or equipment needs to be considered, so that a thermal resistance-thermal capacity heat transfer model is adopted as a calculation model of the junction temperature of the power device.
Further, step S114 is: and calculating the current junction temperature of the power device by using the heat transfer model and the working parameters related to the heat transfer model.
And when the heat transfer model of the power device at the current moment is determined, calculating the node temperature at the current moment by using the working parameters related to the heat transfer model and the calculation formula of the node temperature of the power device corresponding to the heat transfer model.
Fig. 3 shows a schematic diagram of a heat transfer path of a thermal resistance heat transfer model. As shown in FIG. 3, the current temperature of the cooling medium of the radiator is Ta(ii) a Thermal resistance R through the heat sinksThen, the table temperature of the radiator is Ts(ii) a Thermal resistance R through silicone greaseCHThen, the temperature of the outer shell of the power device is Tc(ii) a N (N is a positive integer) power devices are included in the converter, and the power loss of the ith power device is PiThermal resistance of RiThe junction temperature is Ti(1≤i≤N)。
Correspondingly, the table temperature T of the radiatorsComprises the following steps:
temperature T of outer shell of power devicecComprises the following steps:
junction temperature T of ith power deviceiComprises the following steps:
Ti＝Tc+Pi·Ri (3)
wherein the content of the first and second substances,
is the sum of the power losses of all power devices within the converter.
FIG. 4 shows a schematic diagram of the heat transfer path between any adjacent nodes in a thermal resistance-thermal capacity heat transfer model. The adjacent node can be the heat dissipation medium and the table of the heat sink, the table of the heat sink and the housing of the power device or the housing of the power device and any one of the power devices.
As shown in FIG. 4, assume that the previous node is T1，T1Adjacent node of is T2Then the two nodes T1And T2Includes a thermal resistance R2And heat capacityC2And P is the power loss of the power device involved between the two adjacent nodes, node T2The calculation formula of (a) is as follows:
where t is the transient heat transfer time and τ is the time constant.
It can be understood that in the thermal resistance-thermal capacity heat transfer model, the heat dissipation medium and the table top of the heat sink are taken as adjacent nodes to calculate the table top temperature T of the heat sink2Wherein, T1P is the sum of the power losses of all power devices in the converter, R is the current temperature of the cooling medium2Is the thermal resistance of the heat sink; then the table board of the radiator and the shell of the power device are used as adjacent nodes to calculate the shell temperature T of the power device2Wherein, T1Is the table temperature of the heat sink, P is the sum of the power losses of all power devices in the converter, R2Is the thermal resistance of silicone grease; finally, the shell of the power device and any power device are used as adjacent nodes to calculate the node temperature T of the power device2Wherein, T1Temperature of the case of the power device, P being power loss of the power device, R2Is the thermal resistance of the power device.
In summary, the calculation process of the junction temperature of the power device is similar regardless of the thermal resistance heat transfer model or the thermal resistance-thermal capacitance heat transfer model, and only the related operating parameters and calculation formulas are different, so step S114 can be embodied as steps S1141 to S1143, as shown in fig. 5.
Wherein, S1141 is: and calculating the table board temperature of the radiator based on the temperature of the heat exchange medium in the radiator by using a heat transfer model.
S1142 is: and calculating the shell temperature of the power device based on the table temperature of the radiator by using the heat transfer model.
S1143 is: and calculating the junction temperature of the power device based on the shell temperature of the power device by using the heat transfer model.
Further, after the current node temperature of the power device is calculated, the control parameters of the heat dissipation system of the power device can be adjusted in real time based on the current node temperature. However, since the converter includes several power devices, such as multiple IGBTs and multiple diodes, etc., the current junction temperature corresponding to each power device can be calculated based on the operating parameters of the power device. Each node temperature has a corresponding optimal control parameter, but the heat dissipation system can only execute one group of optimal control parameters, so that only one power device needs to be determined, and the optimal control parameter corresponding to the node temperature of the power device is used as the control parameter of the heat dissipation system.
Preferably, the power device with the largest absolute difference value between the current junction temperature and the target junction temperature thereof may be determined as the power device for determining the control parameter of the heat dissipation system.
Correspondingly, step S120 is: and adjusting the control parameters of the heat dissipation system based on the current node temperature and the target node temperature so as to reduce the difference between the current node temperature and the target node temperature of the power device.
The current junction temperature may be understood as a junction temperature at the current time, and more precisely, the current junction temperature is a junction temperature at the acquisition time of an operating parameter for calculating the current junction temperature.
Those skilled in the art will appreciate that in order to improve the safety and reliability of power devices, it is desirable to maintain the junction temperature of the power devices within a safe temperature range. Therefore, if the current junction temperature of the power device is not within the safe temperature range, the control parameters of the heat dissipation system of the power device need to be adjusted so that the junction temperature of the power device gradually approaches the safe temperature range until the junction temperature is within the safe temperature range.
Further, when the heat dissipation system structure or the heat dissipation device adopted by the power device is different, the control parameters of the heat dissipation system are also different. For example, in a water-cooled heat dissipation system, the control parameters of the heat dissipation system may include the operating power of the heat exchanger, the water inlet and outlet temperatures of the heat exchanger, the flow rate of the cooling medium in the water-cooled plate, the water inlet and outlet temperatures of the water-cooled plate, and/or the pressure in the circulating water channel of the cooling medium; in an air-cooled heat dissipation system, the control parameters of the heat dissipation system may include the operating power of the fan, etc.
Specifically, a functional relationship between the node temperature of the power device and the control parameter of the heat dissipation system may be fitted based on the historical data of each node temperature of the power device and the control parameter of the heat dissipation system corresponding to the node temperature, and the control parameter of the heat dissipation system corresponding to the current node temperature of the power device may be determined based on the functional relationship.
Step S120 may specifically include steps S121 to S123, as shown in fig. 6.
Wherein, step S121 is: and establishing a control model by utilizing the functional relation between the node temperature of the power device and the control parameter of the heat dissipation system and the difference between the current node temperature and the target node temperature.
It is understood that the safe temperature range of the power device may have an upper limit value and a lower limit value, and the target node temperature of the current node may be any limit value of the safe temperature range closest to the current node temperature, i.e., the upper limit value or the lower limit value of the safe temperature range.
In order to approach the junction temperature of the power device to its safe temperature range, the control parameters of the heat dissipation system are required to reduce the difference between the current junction temperature and the target junction temperature. Therefore, a control model can be established by taking the difference between the current node temperature and the target node temperature as the initial state of the model, taking the difference between the current node temperature and the target node temperature as the minimum target function, taking the control parameter of the heat dissipation system corresponding to the node temperature of the power device as the control factor, and taking the functional relationship between the node temperature of the power device and the control parameter of the heat dissipation system as the boundary condition.
Step S122 is: and solving the optimal solution of the control model to determine the control parameters of the heat dissipation system.
It will be appreciated that intelligent algorithms may be employed to solve the control model. The intelligent algorithm is a common algorithm for solving complex engineering problems and comprises a genetic algorithm, a particle swarm algorithm, a support vector machine algorithm, a neural network method and the like. These genetic algorithms are conventional in the art and will not be described in detail.
And solving the optimal solution of the control model by using an intelligent algorithm, and determining the control parameters of the heat dissipation system corresponding to the optimal solution.
Step S123 is: and adjusting the current control parameters of the heat dissipation system into the determined control parameters. I.e. the determined control parameters are performed.
Further, to facilitate establishing a functional relationship between the junction temperature of the power device and the control parameter of the heat dissipation system, the temperature control method 100 may further include the step of establishing a historical database of the junction temperature of the power device and the control parameter of the heat dissipation system corresponding thereto.
Furthermore, since the historical database stores the corresponding relationship between the node temperature and the control parameter of the heat dissipation system, the control parameter corresponding to the node temperature between the current node temperature and the target node temperature in the historical database can be used as the solution of the control model, i.e., the solution of the control model can be determined based on the historical database.
In one embodiment, as shown in FIG. 7, step S122 may include steps S1221-S1222.
Wherein, step S1221 is: and determining a solution set of the control model by using the historical database.
Specifically, all control parameters corresponding to the node temperature between the current node temperature and the target node temperature in the historical database may be used as the solutions of the control model, and the solutions form a solution set of the control model.
Step S1222 is: determining a solution in the solution set that minimizes a difference between the current junction temperature and the target junction temperature as the optimal solution.
And calculating the difference value between each node temperature between the current node temperature and the target node temperature thereof stored in the historical database and the current node temperature, wherein the control parameter corresponding to the node temperature corresponding to the minimum difference value is the optimal solution of the control model.
It can be understood that, when the historical database stores the target node temperature of the current node temperature and the corresponding control parameter, the control parameter corresponding to the target node temperature is the optimal solution of the control model, and the optimal solution theoretically can make the difference between the current node temperature and the target node temperature reach 0.
While, for purposes of simplicity of explanation, the methodologies are shown and described as a series of acts, it is to be understood and appreciated that the methodologies are not limited by the order of acts, as some acts may, in accordance with one or more embodiments, occur in different orders and/or concurrently with other acts from that shown and described herein or not shown and described herein, as would be understood by one skilled in the art.
According to another aspect of the invention, a temperature control device of the power device is also provided.
In one embodiment, as shown in FIG. 8, temperature control device 800 includes a memory 810 and a processor 820.
The memory 810 is used to store computer programs.
The processor 820 is used to execute computer programs stored on the memory 810. The processor 820, when executing the computer program on the memory 810, implements the steps of the method for controlling the temperature of a power device as described in any of the above embodiments.
According to yet another aspect of the present invention, there is provided a computer storage medium having a computer program stored thereon, the computer program when executed implementing the steps of the method for controlling the temperature of a power device as described in any of the above embodiments.
Those of skill in the art would understand that information, signals, and data may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits (bits), symbols, and chips that may be referenced throughout the above description may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
The various illustrative logical modules, and circuits described in connection with the embodiments disclosed herein may be implemented or performed with a general purpose processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor such the processor can read information from, and write information to, the storage medium. In the alternative, the storage medium may be integral to the processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In the alternative, the processor and the storage medium may reside as discrete components in a user terminal.
In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software as a computer program product, the functions may be stored on or transmitted over as one or more instructions or code on a computer-readable medium. Computer-readable media includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. A storage media may be any available media that can be accessed by a computer. By way of example, and not limitation, such computer-readable media can comprise RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer. Any connection is properly termed a computer-readable medium. For example, if the software is transmitted from a web site, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, Digital Subscriber Line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium. Disk (disk) and disc (disc), as used herein, includes Compact Disc (CD), laser disc, optical disc, Digital Versatile Disc (DVD), floppy disk and blu-ray disc where disks (disks) usually reproduce data magnetically, while discs (discs) reproduce data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.
The previous description is provided to enable any person skilled in the art to practice the various aspects described herein. It is to be understood that the scope of the invention is to be defined by the appended claims and not by the specific constructions and components of the embodiments illustrated above. Those skilled in the art can make various changes and modifications to the embodiments within the spirit and scope of the present invention, and these changes and modifications also fall within the scope of the present invention.
Claims (17)
1. A temperature control method of a power device, the power device being a constituent device of a current transformer, the power device being mounted on a table of a heat sink, the heat sink being a constituent component of a heat dissipation system of the power device, the temperature control method comprising:
determining the current junction temperature of the power device based on the working parameters of the radiator and the working parameters of the power device; and
and adjusting the control parameters of the heat dissipation system based on the current node temperature and the target node temperature so as to reduce the difference between the current node temperature and the target node temperature of the power device.
2. The method of claim 1, wherein determining the current junction temperature of the power device based on the operating parameters of the heat sink and the operating parameters of the power device comprises:
determining the power loss of the power device based on the working parameters of the converter;
judging the power loss state of the power device based on the change rate of the power loss of the power device;
determining a heat transfer model of the heat sink to the power device based on a power loss state of the power device; and
and calculating the current junction temperature of the power device by using the heat transfer model and the working parameters related to the heat transfer model.
3. The temperature control method of claim 2, wherein the determining the power loss state of the power device based on the rate of change of the power loss of the power device comprises:
responding to the fact that the change rate of the power loss of the power device is smaller than or equal to a preset threshold value, and judging that the power loss of the power device is in a stable state; and
responding to the fact that the change rate of the power loss of the power device is larger than the preset threshold value, and judging that the power loss of the power device is in an unstable state; and
the determining a heat transfer model of the heat sink to the power device based on the power loss state of the power device comprises:
determining a thermal resistance heat transfer model as a heat transfer model of the heat sink to the power device in response to the power loss of the power device being in a steady state; and
determining a thermal resistance-thermal capacitance heat transfer model as a heat transfer model of the heat sink to the power device in response to a power loss of the power device being in an unstable state.
4. The method of claim 2, wherein the calculating the current junction temperature of the power device using the heat transfer model and the operating parameters related to the heat transfer model comprises:
calculating the table top temperature of the radiator based on the temperature of the heat exchange medium in the radiator by using the heat transfer model;
calculating a housing temperature of the power device based on a mesa temperature of the heat sink using the heat transfer model; and
and calculating the junction temperature of the power device based on the shell temperature of the power device by using the heat transfer model.
5. The method of claim 1, wherein the adjusting the control parameter of the heat dissipation system based on the current junction temperature and the target junction temperature to reduce the difference between the current junction temperature and the target junction temperature of the power device comprises:
establishing a control model by utilizing a functional relation between the node temperature of the power device and the control parameter of the heat dissipation system and a difference between the current node temperature and the target node temperature;
solving the optimal solution of the control model to determine the control parameters of the heat dissipation system; and
and adjusting the current control parameters of the heat dissipation system into the determined control parameters.
6. The temperature control method of claim 5, further comprising:
establishing a historical database of the control parameters of the heat dissipation system corresponding to the node temperature of the power device; and
fitting out a functional relation between the junction temperature of the power device and the control parameter of the heat dissipation system based on the historical database; and
the solving the optimal solution of the control model to determine the control parameters of the heat dissipation system comprises:
determining a solution set of the control model by using the historical database; and
determining a solution in the solution set that minimizes a difference between the current junction temperature and the target junction temperature as the optimal solution.
7. The method of claim 2, wherein the operating parameters of the converter include operating current, operating voltage, and switching frequency, and wherein determining the power loss of the power device based on the operating parameters of the converter comprises:
and calculating the power loss of the power device based on the working current, the working voltage and the switching frequency.
8. The method of claim 2, wherein the operating parameters of the converter include operating conditions and operating ambient temperature, and wherein determining the power loss of the power device based on the operating parameters of the converter comprises:
and calculating the power loss of the power device based on the operating condition and the working environment temperature.
9. A temperature control device of a power device, wherein the power device is a component of a current transformer, the power device is arranged on a table top of a radiator, and the radiator is a component of a heat dissipation system of the power device, and the temperature control device comprises:
a memory; and
a processor coupled to the memory, the processor configured to:
determining the current junction temperature of the power device based on the working parameters of the radiator and the working parameters of the power device; and
and adjusting the control parameters of the heat dissipation system based on the current node temperature and the target node temperature so as to reduce the difference between the current node temperature and the target node temperature of the power device.
10. The temperature control device of claim 9, wherein the processor is further configured to:
determining the power loss of the power device based on the working parameters of the converter;
judging the power loss state of the power device based on the change rate of the power loss of the power device;
determining a heat transfer model of the heat sink to the power device based on a power loss state of the power device; and
and calculating the current junction temperature of the power device by using the heat transfer model and the working parameters related to the heat transfer model.
11. The temperature control device of claim 10, wherein the processor is further configured to:
responding to the fact that the change rate of the power loss of the power device is smaller than or equal to a preset threshold value, and judging that the power loss of the power device is in a stable state;
responding to the fact that the change rate of the power loss of the power device is larger than the preset threshold value, and judging that the power loss of the power device is in an unstable state;
determining a thermal resistance heat transfer model as a heat transfer model of the heat sink to the power device in response to the power loss of the power device being in a steady state; and
determining a thermal resistance-thermal capacitance heat transfer model as a heat transfer model of the heat sink to the power device in response to a power loss of the power device being in an unstable state.
12. The temperature control device of claim 10, wherein the processor is further configured to:
calculating the table top temperature of the radiator based on the temperature of the heat exchange medium in the radiator by using the heat transfer model;
calculating a housing temperature of the power device based on a mesa temperature of the heat sink using the heat transfer model; and
and calculating the junction temperature of the power device based on the shell temperature of the power device by using the heat transfer model.
13. The temperature control device of claim 9, wherein the processor is further configured to:
establishing a control model by utilizing a functional relation between the node temperature of the power device and the control parameter of the heat dissipation system and a difference between the current node temperature and the target node temperature;
solving the optimal solution of the control model to determine the control parameters of the heat dissipation system; and
and adjusting the current control parameters of the heat dissipation system into the determined control parameters.
14. The temperature control device of claim 13, wherein the processor is further configured to:
establishing a historical database of the control parameters of the heat dissipation system corresponding to the node temperature of the power device;
determining a solution set of the control model by using the historical database; and
determining a solution in the solution set that minimizes a difference between the current junction temperature and the target junction temperature as the optimal solution.
15. The temperature control device of claim 10, wherein the operating parameters of the current transformer include operating current, operating voltage, and switching frequency, the processor further configured to:
and calculating the power loss of the power device based on the working current, the working voltage and the switching frequency.
16. The temperature control device of claim 10, wherein the operating parameters of the converter include operating conditions and operating ambient temperature, the processor further configured to:
and calculating the power loss of the power device based on the operating condition and the working environment temperature.
17. A computer storage medium having a computer program stored thereon, wherein the computer program when executed implements the steps of a method of temperature control of a power device according to any of claims 1-8.
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