CN112109255A - Device for resin potting honeycomb structure and method for resin potting honeycomb structure by using device - Google Patents
Device for resin potting honeycomb structure and method for resin potting honeycomb structure by using device Download PDFInfo
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- CN112109255A CN112109255A CN202010855169.0A CN202010855169A CN112109255A CN 112109255 A CN112109255 A CN 112109255A CN 202010855169 A CN202010855169 A CN 202010855169A CN 112109255 A CN112109255 A CN 112109255A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/24—Feeding the material into the mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/42—Casting under special conditions, e.g. vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/60—Multitubular or multicompartmented articles, e.g. honeycomb
- B29L2031/608—Honeycomb structures
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- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The present invention relates to an apparatus for resin potting a honeycomb structure and a method of resin potting a honeycomb structure using the apparatus. The device comprises a vacuum adsorption piece, a ventilation isolation piece, a potting area positioning frame, a non-potting area sealing piece and a vacuum power piece, wherein the vacuum adsorption piece, the ventilation isolation piece, the potting area positioning frame, the non-potting area sealing piece and the vacuum power piece are independent pieces; the vacuum adsorption piece is of a hollow structure, and a plurality of air guide holes are distributed on the upper surface of the vacuum adsorption piece; the gas-permeable partition is covered on the upper surface of the vacuum adsorption part during potting, and a honeycomb structure is placed on the upper surface of the gas-permeable partition; the potting area positioning frame is placed on the upper surface of the honeycomb structure during potting; the non-potting area seal seals the surface of the honeycomb structure outside the potting area locating frame during potting; the vacuum power piece provides power for the vacuum adsorption piece during encapsulation. The device can carry out the embedment resin of large tracts of land to honeycomb, guarantees simultaneously that the resin of embedment does not have the bubble, closely knit degree is high, appearance quality is high.
Description
Technical Field
The invention relates to the technical field of honeycomb sandwich structure preparation, in particular to a device for resin encapsulation of a honeycomb structure and a method for resin encapsulation of the honeycomb structure by using the device.
Background
The honeycomb sandwich structure is a special type in composite materials, generally the structure is composed of a composite material panel, a honeycomb and a composite material back plate, the honeycomb sandwich structure has the maximum fatigue resistance, the optimal specific rigidity and specific strength, and the application field is very wide, such as secondary bearing structural parts and functional composite material parts of passenger planes and unmanned planes: wave-absorbing laminates, noise elimination laminates, heat-insulating laminates and the like.
In honeycomb sandwich structures, due to assembly connection and local reinforcement, the honeycomb is often required to be filled with a potting resin. In the process of resin encapsulation, the encapsulation speed of the resin is strictly controlled, and the resin is ensured to be compact and compact without bubbles. The process of resin encapsulation is usually carried out at normal temperature, the viscosity of the resin at the temperature is high, the resin is not beneficial to flowing and encapsulation of the resin, and how to carry out large-area honeycomb encapsulation resin rapidly, efficiently and high-quality becomes a critical technical problem to be solved urgently.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, provides resin encapsulating equipment which is simple in structure and convenient to manufacture, and sets a set of process method with high operability, so that large-area resin encapsulation can be carried out on Nomex honeycombs, and the encapsulated resin is free of bubbles and high in compactness.
In order to solve the technical problems, the invention provides the following technical scheme:
the device for resin potting of the honeycomb structure is characterized by comprising a vacuum adsorption piece, a breathable isolation piece, a potting area positioning frame, a non-potting area sealing piece and a vacuum power piece, wherein the vacuum adsorption piece, the breathable isolation piece, the potting area positioning frame, the non-potting area sealing piece and the vacuum power piece are independent pieces;
the vacuum adsorption piece is of a hollow structure, and a plurality of air guide holes are distributed on the upper surface of the vacuum adsorption piece;
the gas-permeable partition is covered on the upper surface of the vacuum adsorption part during potting, and a honeycomb structure is placed on the upper surface of the gas-permeable partition;
the potting area positioning frame is placed on the upper surface of the honeycomb structure during potting;
the non-potting area seal seals the surface of the honeycomb structure outside the potting area locating frame during potting;
the vacuum power piece provides power for the vacuum adsorption piece during encapsulation.
Preferably, the air guide holes are round holes with the diameter of 2-6mm, and the hole spacing is 2-4 mm.
Preferably, the vacuum adsorption part is a cube-shaped split structure and comprises a vacuum adsorption body and a vacuum flow guide body, the vacuum adsorption body and the vacuum flow guide body are assembled to form the vacuum adsorption part, the vacuum adsorption body is of a flat plate-shaped structure, and the air guide holes are distributed in the vacuum adsorption body.
Preferably, the interior of the vacuum flow guiding body comprises an outer annular flow guiding main road and an inner criss-cross flow guiding channel network, the flow guiding channel network is of a non-closed structure, the annular flow guiding main road is communicated with the flow guiding channel network, and the annular flow guiding main road is connected with the vacuum power part; preferably, more than 2 communicating holes are uniformly distributed on the annular flow guide main road to realize the communication with the flow guide channel network; preferably, a connecting hole is formed in the annular main road, and the annular main road is connected with the vacuum power piece through the connecting hole; and/or
The periphery of the upper end face of the vacuum flow guide body is provided with an upper groove, and a sealing ring is arranged in the groove.
Preferably, the air-permeable separator is an air-permeable felt cloth;
the non-potting area seal is an adhesive tape; and/or
The vacuum power part is a vacuum pump.
Preferably, the device further comprises a resin cover;
after the potting is completed, the resin covering member is placed on the upper surface of the honeycomb structure.
The method for resin potting the honeycomb structure by using the device is characterized by comprising the following steps:
(1) connecting the vacuum power piece with the vacuum adsorption piece; placing the breathable isolating piece and the honeycomb structure on the upper surface of the vacuum absorbing piece in sequence;
(2) placing the potting area positioning frame on the upper surface of the honeycomb structure, and then sealing the upper surface of the honeycomb structure outside the potting area by using the non-potting area sealing element;
(3) pouring resin into the encapsulation area positioning frame, and opening the vacuum power part to carry out resin encapsulation after the resin completely covers the upper surface of the honeycomb structure;
(4) and (4) repeating the steps (2) to (3) until the whole area of the honeycomb structure is subjected to resin encapsulation.
Preferably, in the step (3), the pouring time of the resin is controlled within 5 min; and/or
And starting the vacuum power piece to ensure that the vacuum adsorption piece obtains a vacuum environment of 0.01-0.05 MPa.
Preferably, in step (1), the honeycomb structure is detachably fixed with the vacuum adsorption piece; and/or
In step (2), the potting area positioning frame is detachably fixed to the honeycomb structure.
Preferably, the upper surface of the honeycomb structure is covered with a resin cover after the step (4) is completed.
Advantageous effects
The technical scheme of the invention has the following advantages:
the filling and sealing device adopts a sealed pipeline structure, is simple and easy to process, a lower vacuum environment is manufactured by a vacuum pump capable of adjusting the air pumping speed, and resin flows into the honeycomb under the pressure difference; the honeycomb potting resin area is easy to adjust, is more suitable for large-area potting resin, and has high resin potting quality and good compactness.
The resin encapsulation process method has the advantages that: firstly, the operation flow is simple and easy to implement, and the resin encapsulation quality is easy to control; secondly, the vacuum valve is adjusted to change the air extraction rate of the vacuum pump, so that the encapsulating rate of the resin can be controlled; and thirdly, the resin is integrally and uninterruptedly pressed into the honeycomb under the action of atmospheric pressure difference, and the resin has few bubbles and high compactness.
Drawings
FIG. 1 is a schematic view of the assembled device;
fig. 2 is a schematic structural view of a vacuum baffle;
fig. 3 is a schematic view of another angle of the vacuum flow conductor;
FIG. 4 is a schematic structural view of a vacuum absorption body;
FIG. 5 is a schematic view of the construction of the breathable barrier;
FIG. 6 is a schematic structural diagram of a positioning frame of the potting region;
fig. 7 is a schematic structural view of a honeycomb structure.
In the figure:
1: a vacuum flow conductor; 11: an annular diversion main road; 12: a network of flow-directing channels; 13: a communicating hole; 14: connecting holes;
2: a vacuum adsorbent; 21: an air vent;
3: a breathable barrier; 4: a honeycomb structure; 5: and (5) positioning a frame in the encapsulation area.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
First aspect
The invention provides in a first aspect an apparatus for resin potting a honeycomb structure, the apparatus comprising a vacuum adsorption element, a gas permeable barrier element, a potting area locating frame, a non-potting area sealing element and a vacuum motive element, all of which are separate elements. The following is a detailed description of the various components:
vacuum adsorption piece
The vacuum adsorption piece is of a hollow closed structure, and a plurality of air guide holes are distributed on the upper surface of the vacuum adsorption piece. For the air vents, which are preferably round holes with a diameter of 2-6mm, and the hole spacing is preferably 2-4mm, the size and arrangement of the air vents can influence the resin encapsulation rate. When the air vents and/or the arrangement mode with the sizes are adopted, the resin encapsulation rate is appropriate.
The vacuum adsorption piece can be of an integral structure or a split structure. The vacuum suction member is preferably of a separate structure from many viewpoints of manufacturing, maintenance, and the like.
When the vacuum suction accessory is preferably in a cubic split structure, the vacuum suction accessory comprises a vacuum adsorption body and a vacuum flow guide body, at the moment, the vacuum adsorption body is in a flat plate structure, the air guide holes are distributed on the vacuum adsorption body, and the vacuum adsorption body and the vacuum flow guide body are assembled to form a vacuum suction part with a cavity inside. Assembly means securing the vacuum chuck and vacuum current carrier together. The fixing method may be any conventional method for fixing and connecting components, and the present invention is not limited thereto. In order to ensure the sealing effect after assembly, grooves can be designed around the upper end surface of the vacuum flow conductor, and sealing rings are placed in the grooves to realize elastic sealing. It should be noted that, in conjunction with the drawings and the description of the present invention, the relationship between the vacuum chuck and the vacuum current carrier after assembly can be unambiguously determined: the plate-shaped vacuum adsorption body is positioned on the upper surface of the vacuum flow guide body to form the upper surface of a cube (the assembled vacuum adsorption part is in a cube shape), and the vacuum flow guide body forms the other five surfaces of the cube.
For the vacuum flow conductor, the following optimization can be performed:
the vacuum flow guide body comprises an annular flow guide main road on the outer side and a criss-cross flow guide channel network on the inner side, the flow guide channel network is of an unsealed structure (namely, the network units are communicated), the annular flow guide main road is communicated with the flow guide channel network, and the annular flow guide main road is connected with the vacuum power part. Preferably, a plurality of communication holes are uniformly distributed on the annular flow guide main road to realize communication with the flow guide channel, and the meaning of the plurality of communication holes is more than 2. For example, when the vacuum suction accessory is cube-shaped, the annular diversion main road is also rectangular correspondingly, at this time, the communication between the annular diversion main road and the diversion channel can be realized through 3 communication holes, the 3 communication holes are respectively arranged on three sides of the annular diversion main road, and a port for connecting with the vacuum power component can be arranged on the last side. The criss-cross flow guide channel network can play a role in guiding vacuumizing, and the vacuumizing process is more stable due to the design.
As described above, the vacuum adsorption body may be a flat plate member with air holes distributed therein. When the vacuum suction accessory is in a cubic split structure, the vacuum suction body and the vacuum flow guide body need to be assembled to form a usable vacuum suction piece before filling. It can be unambiguously determined from the action of the vacuum adsorption element that when the vacuum adsorption element and the vacuum flow conductor are assembled, the distribution area of the gas-conducting holes of the vacuum adsorption element does not exceed the area corresponding to the network of flow-conducting channels in the vacuum flow conductor. The corresponding regions here refer to: when the vacuum adsorption body and the vacuum flow guide body are assembled into a cube-shaped vacuum adsorption part, the edge of the flow guide channel network is in a region formed by projection of the surface of the vacuum adsorption body.
The size of the vacuum adsorption piece can be customized according to the area of the encapsulation resin, and the vacuum adsorption piece has high flexibility.
Breathable partition
The ventilative separator is covered in when embedment the upper surface of vacuum adsorption spare to honeycomb is placed the upper surface of ventilative separator, and the positional relationship of three is from bottom to top in proper order: vacuum adsorption piece, ventilative separator and honeycomb. When the vacuum suction attachment has the above-described separate structure, the air-permeable spacer is covered on the upper surface of the vacuum suction body during potting, and is in contact with the vacuum suction body.
The function of the breathable isolating piece is to protect the vacuum absorbing piece (more specifically, the vacuum flow guide body in the split structure condition) and prevent resin from flowing into the vacuum absorbing piece (more specifically, the vacuum flow guide body in the split structure condition).
Another property of the gas-permeable barrier is gas permeability, ensuring efficient transfer of vacuum.
The air-permeable isolating piece is preferably an air-permeable structure with a smooth surface, and the smoothness of the surface of the potting resin is ensured under the condition of ensuring the effective transmission of vacuum.
The air-permeable partition may be an air-permeable felt.
Potting area positioning frame
The potting region positioning frame is placed on an upper surface of the gas-permeable partition at the time of potting, in contact with the gas-permeable partition. And during encapsulation, resin is injected into the encapsulation area positioning frame.
Non-potting area seal
The non-potting area sealing member seals the surface of the honeycomb structure outside the potting area positioning frame during potting, prevents resin from flowing to the non-potting area, and can also play a role in sealing.
The sealing element of the non-embedding region can be an adhesive tape, and is low in cost, good in sealing effect and flexible to use.
Vacuum power part
The vacuum power piece provides power for the vacuum adsorption piece during encapsulation.
The vacuum power member may be a vacuum pump.
The invention provides thisWorking principle of a device
When resin encapsulation is carried out, the vacuum power part vacuumizes the vacuum adsorption part, so that the internal pressure of the vacuum adsorption part is reduced. Since the honeycomb structure is in communication (indirect communication) with the vacuum-adsorbing member, the resin on the upper surface of the honeycomb structure flows into the interior of the honeycomb structure under the negative pressure.
In addition, the device provided by the invention can also comprise a resin covering part; after the potting is completed, the resin covering member is placed on the upper surface of the honeycomb structure. The resin can release heat in the curing process, so that the volume of the resin is expanded, and after the resin is well pressed by a resin covering part, the surface smoothness of the cured resin can be ensured, the volume of the resin can be ensured to be unchanged, and the compactness of the resin is improved. The resin covering piece can sequentially comprise an anti-sticking piece, a covering flat plate and a pressing piece from bottom to top; the covering flat plate of the anti-sticking piece is adhered with resin, so that the appearance quality of the honeycomb structure is protected. The anti-sticking piece can be made of demoulding cloth. The flat cover ensures the flatness of the surface of the honeycomb structure. The pressing piece is a member with a certain weight and is placed on the upper surface of the covering flat plate to play a pressing role.
Overall, the present invention provides such a device with the following advantages:
can carry out the embedment resin of large tracts of land to honeycomb, guarantee simultaneously that the resin of embedment does not have the bubble, closely knit degree is high, appearance quality is high.
The second aspect
The present invention provides in a second aspect a method of resin potting a honeycomb structure using the apparatus provided in the first aspect, the method comprising the steps of:
(1) connecting the vacuum power piece with the vacuum adsorption piece; and the breathable isolating piece and the honeycomb structure are sequentially placed on the upper surface of the vacuum adsorption piece.
In order to fix the honeycomb structure, the honeycomb structure and the vacuum adsorption piece can be detachably fixed, the phenomenon that the position is moved to influence resin encapsulation is avoided, and the resin can be prevented from seeping out along the gaps between the honeycomb structure and the air-permeable partition pieces. For example, the honeycomb structure may be clamped to the vacuum chuck using a clamp.
In order to further ensure the position precision, after the air-permeable partition is placed on the upper surface of the vacuum adsorption part, the periphery of the air-permeable partition can be clamped with the vacuum adsorption part by using clamps.
When the vacuum suction accessory is of a split structure, the vacuum suction body and the vacuum flow guide body need to be assembled to form a usable vacuum suction piece.
(2) And placing the potting area positioning frame on the upper surface of the honeycomb structure, and sealing the upper surface of the honeycomb structure outside the potting area by using the non-potting area sealing piece.
The potting region positioning frame determines a potting region in one potting, and therefore, the size of the potting region positioning frame can be designed according to the size of the honeycomb structure. After the encapsulation area positioning frame is placed, the encapsulation area positioning frame can be fixed with the honeycomb structure by using a detachable fixing piece (such as a fixture), so that the lower surface of the encapsulation area positioning frame is attached to the upper surface of the honeycomb structure, and resin is prevented from leaking out along a gap in the encapsulation process.
In the present invention, the outer shape of the potting region positioning frame is not particularly limited, and may be any shape, but is preferably a regular shape such as a rectangular shape (e.g., a rectangular shape, a square shape), a regular hexagonal shape, or the like.
Sealing the upper surface of the honeycomb structure outside the potting region with the non-potting region sealing member can prevent the resin from flowing into the non-potting region and also can perform a sealing function.
(3) And pouring resin into the encapsulation area positioning frame, and opening the vacuum power part (such as a vacuum pump) to carry out resin encapsulation after the resin completely covers the upper surface of the honeycomb structure.
When the vacuum power piece is turned on, the resin in the potting area positioning frame flows into the interior of the honeycomb structure with the assistance of the negative pressure. In a preferred embodiment, the vacuum power member is turned on to enable the vacuum adsorption member to obtain a vacuum environment of 0.01-0.05 MPa. The vacuum degree is too high, the encapsulating speed of the resin is increased, the resin is changed from continuous encapsulating to discontinuous encapsulating, the continuity of the encapsulating resin is deteriorated, air bubbles are mixed in the encapsulating process, and the encapsulating quality of the resin is influenced; the vacuum degree is too small, the exhaust effect of the encapsulating process can be weakened, meanwhile, the encapsulating time of the resin can be prolonged, the viscosity of the resin is increased, and the encapsulating efficiency and the encapsulating quality of the resin can be influenced. In order to better control the vacuum degree, a control valve can be arranged on a connecting pipeline of the vacuum power part and the vacuum adsorption part.
In some preferred embodiments, the pouring rate of the resin should not be too high during pouring of the resin into the inside of the positioning frame of the potting area, and is preferably controlled within 5min to avoid inclusion of air holes.
When the resin in the potting area positioning frame is no longer reduced, it is confirmed that the inside of the honeycomb structure is potted with the resin. At this time, the vacuum power unit may be turned off, and if there is a surplus of resin, the surplus resin in the potting region positioning frame may be taken out.
(4) And (4) repeating the steps (2) to (3) until the whole area of the honeycomb structure is subjected to resin encapsulation.
In some preferred embodiments, after step (4) is completed, the upper surface of the honeycomb structure is covered with a resin cover.
The method provided by the invention has the following advantages:
firstly, the resin is integrally and uninterruptedly pressed into the honeycomb under the action of atmospheric pressure difference, and the resin has less bubble inclusion and high compactness.
Secondly, the operation flow is simple and easy to implement, and the resin encapsulation quality is easy to control.
And thirdly, the vacuum valve is adjusted to change the air pumping speed of the vacuum pump, so that the encapsulating speed of the resin can be controlled.
The following are examples of the present invention.
The present embodiment provides an apparatus for resin potting a honeycomb structure, which includes, with reference to fig. 1 to 7, independent structures: a vacuum suction member, a gas-permeable partition member 3, an encapsulation area positioning frame 5, a non-encapsulation area sealing member (not shown), a vacuum power member (not shown), and a resin cover member (not shown).
A vacuum adsorption part: the vacuum adsorption piece is of a cubic hollow structure and comprises a vacuum adsorption body 2 and a vacuum flow guide body 1 which are assembled to form the vacuum adsorption piece;
the interior of the vacuum flow guiding body 1 comprises an annular flow guiding main road 11 at the outer side and a criss-cross flow guiding channel network 12 at the inner side, the flow guiding channel network 12 is of a non-closed structure and is communicated with the flow guiding channel network 12 (3 communication holes 13 are distributed on the annular flow guiding main road 11 to realize the communication with the flow guiding channel network 12), and the annular flow guiding main road is also provided with a connecting hole 14 which is connected with the vacuum power part; an upper groove (not marked in the figure) is designed around the upper end surface of the vacuum flow conductor 1, and a sealing ring (not marked in the figure) is placed in the groove;
the vacuum adsorption body 2 is of a flat plate structure, air guide holes 21 are distributed on the flat plate, the air guide holes 21 are round holes with the diameter of 2mm, and the hole distance is 2 mm.
The air-permeable separator 3: the air-permeable separator 3 is an air-permeable felt cloth, which is covered on the upper surface of the vacuum adsorber 2 at the time of potting, and a honeycomb structure 4 is placed on the upper surface of the air-permeable separator 3.
Potting area positioning frame 5: the potting region positioning frame 5 is a square frame, and is placed on the upper surface of the honeycomb structure 4 at the time of potting.
Non-potting area seal: the non-potting region sealing member is an adhesive tape, and seals the surface of the honeycomb structure 4 outside the potting region positioning frame 5 during potting.
A vacuum power part: the vacuum power part is a power system of the device, can maintain a stable vacuum environment, and ensures that the encapsulation rate of the resin is stable and slow; the vacuum power part is a vacuum pump and is connected with the vacuum flow guide body 1 through a connecting hole 14, and a control valve is arranged on a connecting pipeline.
Resin covering part: after the potting is completed, the resin covering member is placed on the upper surface of the honeycomb structure. The resin covering piece sequentially comprises an anti-sticking piece, a covering flat plate and a pressing piece from bottom to top; the covering flat plate of the anti-sticking piece is adhered with resin, so that the appearance quality of the honeycomb structure is protected. The anti-sticking piece is made of demolding cloth. The flat cover ensures the flatness of the surface of the honeycomb structure. The weight of the pressed piece can make the pressed piece play a pressing role after being placed on the upper surface of the covering flat plate.
The resin potting of the honeycomb structure 4 with this apparatus includes the steps of:
(1) assembling (including a fixing step) a vacuum adsorption body 2 and a vacuum flow guide body 1 to form a usable vacuum adsorption part, and connecting a vacuum pump with the vacuum flow guide body 1; the air-permeable partition 3 and the honeycomb structure 4 are sequentially placed on the upper surface of the vacuum adsorption body 2.
In order to fix the honeycomb structure 4, the honeycomb structure 4 and the vacuum adsorption part are clamped by a clamp, so that the influence of position movement on resin encapsulation is avoided, and the resin can be prevented from seeping out along a gap between the honeycomb structure 4 and the air-permeable partition 3.
In order to further ensure the position precision, after the air-permeable partition 3 is placed on the upper surface of the vacuum adsorption part, the periphery of the air-permeable partition 3 is clamped with the vacuum adsorption part by using clamps.
(2) The potting region positioning frame 5 is placed on the upper surface of the honeycomb structure 4, and then the upper surface of the honeycomb structure 4 outside the potting region is sealed with the non-potting region sealing member.
After the potting area positioning frame 5 is placed, the potting area positioning frame 5 is fixed with the honeycomb structure 4 through a fixture, so that the lower surface of the potting area positioning frame 5 is tightly attached to the upper surface of the honeycomb structure 4, and resin is prevented from leaking out along gaps in the potting process.
(3) And pouring resin into the encapsulation area positioning frame 5, adjusting the control valve after the resin completely covers the upper surface of the honeycomb structure 4, and starting the vacuum pump to ensure that the vacuum flow guide body 1 obtains a vacuum environment of 0.01MPa-0.02 MPa.
The resin in the potting area positioning frame 5 flows into the honeycomb interior with the aid of the underpressure. When the resin in the potting region positioning frame 5 is not reduced any more, it is verified that the resin is potted inside the honeycomb, and at this time, the vacuum pump needs to be turned off and the residual resin in the potting region positioning frame 5 needs to be taken out (in case of residual resin).
In some preferred embodiments, the pouring rate of the resin should not be too high during pouring of the resin into the inside of the potting area positioning frame 5, and is controlled within 5min, so as to avoid inclusion of air holes.
(4) And (4) repeating the steps (2) to (3) until the whole area of the honeycomb structure 4 is subjected to resin encapsulation.
After the step (4) is completed, a resin covering member is covered on the upper surface of the honeycomb structure 4.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. The device for resin potting of the honeycomb structure is characterized by comprising a vacuum adsorption piece, a breathable isolation piece, a potting area positioning frame, a non-potting area sealing piece and a vacuum power piece, wherein the vacuum adsorption piece, the breathable isolation piece, the potting area positioning frame, the non-potting area sealing piece and the vacuum power piece are independent pieces;
the vacuum adsorption piece is of a hollow structure, and a plurality of air guide holes are distributed on the upper surface of the vacuum adsorption piece;
the gas-permeable partition is covered on the upper surface of the vacuum adsorption part during potting, and a honeycomb structure is placed on the upper surface of the gas-permeable partition;
the potting area positioning frame is placed on the upper surface of the honeycomb structure during potting;
the non-potting area seal seals the surface of the honeycomb structure outside the potting area locating frame during potting;
the vacuum power piece provides power for the vacuum adsorption piece during encapsulation.
2. The apparatus of claim 1,
the air guide holes are round holes with the diameter of 2-6mm, and the distance between the holes is 2-4 mm.
3. The device according to claim 1 or 2,
the vacuum adsorption part is of a cube-shaped split structure and comprises a vacuum adsorption body and a vacuum flow guide body, the vacuum adsorption body and the vacuum flow guide body are assembled to form the vacuum adsorption part, the vacuum adsorption body is of a flat plate-shaped structure, and the air guide holes are distributed in the vacuum adsorption body.
4. The apparatus of claim 3,
the vacuum flow guide body comprises an annular flow guide main road at the outer side and a criss-cross flow guide channel network at the inner side, the flow guide channel network is of a non-closed structure, the annular flow guide main road is communicated with the flow guide channel network, and the annular flow guide main road is connected with the vacuum power part; preferably, more than 2 communicating holes are uniformly distributed on the annular flow guide main road to realize the communication with the flow guide channel network; preferably, a connecting hole is formed in the annular main road, and the annular main road is connected with the vacuum power piece through the connecting hole; and/or
The periphery of the upper end face of the vacuum flow guide body is provided with an upper groove, and a sealing ring is arranged in the groove.
5. The device according to any one of claims 1 to 4,
the breathable isolating piece is made of breathable felt cloth;
the non-potting area seal is an adhesive tape; and/or
The vacuum power part is a vacuum pump.
6. The device according to any one of claims 1 to 5,
the device further comprises a resin cover;
after the potting is completed, the resin covering member is placed on the upper surface of the honeycomb structure.
7. A method of resin potting a honeycomb structure using the apparatus of any one of claims 1 to 6, the method comprising the steps of:
(1) connecting the vacuum power piece with the vacuum adsorption piece; placing the breathable isolating piece and the honeycomb structure on the upper surface of the vacuum absorbing piece in sequence;
(2) placing the potting area positioning frame on the upper surface of the honeycomb structure, and then sealing the upper surface of the honeycomb structure outside the potting area by using the non-potting area sealing element;
(3) pouring resin into the encapsulation area positioning frame, and opening the vacuum power part to carry out resin encapsulation after the resin completely covers the upper surface of the honeycomb structure;
(4) and (4) repeating the steps (2) to (3) until the whole area of the honeycomb structure is subjected to resin encapsulation.
8. The method of claim 7,
in the step (3), the pouring time of the resin is controlled within 5 min; and/or
And starting the vacuum power piece to ensure that the vacuum adsorption piece obtains a vacuum environment of 0.01-0.05 MPa.
9. The method of claim 7,
in the step (1), detachably fixing the honeycomb structure and the vacuum adsorption piece; and/or
In step (2), the potting area positioning frame is detachably fixed to the honeycomb structure.
10. The method of claim 7,
after the step (4) is completed, covering the upper surface of the honeycomb structure with a resin covering member.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010855169.0A CN112109255A (en) | 2020-08-24 | 2020-08-24 | Device for resin potting honeycomb structure and method for resin potting honeycomb structure by using device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010855169.0A CN112109255A (en) | 2020-08-24 | 2020-08-24 | Device for resin potting honeycomb structure and method for resin potting honeycomb structure by using device |
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| CN112109255A true CN112109255A (en) | 2020-12-22 |
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| CN202010855169.0A Pending CN112109255A (en) | 2020-08-24 | 2020-08-24 | Device for resin potting honeycomb structure and method for resin potting honeycomb structure by using device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113942254A (en) * | 2021-09-24 | 2022-01-18 | 成都飞机工业（集团）有限责任公司 | Accurate control method for molding surface of honeycomb sandwich composite material part encapsulation area |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04290736A (en) * | 1991-03-19 | 1992-10-15 | Fuji Heavy Ind Ltd | Filling method for honeycomb core with resin |
| JPH0825533A (en) * | 1994-07-19 | 1996-01-30 | Fuji Heavy Ind Ltd | Method of filling resin into honeycomb core |
| US20020121719A1 (en) * | 2001-02-27 | 2002-09-05 | Petrovich Richard L. | Method and apparatus for subsurface venting or injecting in liquid molding |
| JP2006181813A (en) * | 2004-12-27 | 2006-07-13 | Yokohama Rubber Co Ltd:The | Method for producing honeycomb sandwich panel with frequency selection plate laminated |
| GB0815433D0 (en) * | 2008-08-22 | 2008-10-01 | Say Philip D | Manufacture of cast panels |
| KR20110032941A (en) * | 2009-09-24 | 2011-03-30 | 김인수 | Bubble remove apparatus for liquefied resin |
| CN208788905U (en) * | 2018-05-04 | 2019-04-26 | 深圳市德彩光电有限公司 | The encapsulating die of LED light source |
| CN210360440U (en) * | 2019-07-15 | 2020-04-21 | 东莞东阳光医疗智能器件研发有限公司 | Plate adsorption jig |
-
2020
- 2020-08-24 CN CN202010855169.0A patent/CN112109255A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04290736A (en) * | 1991-03-19 | 1992-10-15 | Fuji Heavy Ind Ltd | Filling method for honeycomb core with resin |
| JPH0825533A (en) * | 1994-07-19 | 1996-01-30 | Fuji Heavy Ind Ltd | Method of filling resin into honeycomb core |
| US20020121719A1 (en) * | 2001-02-27 | 2002-09-05 | Petrovich Richard L. | Method and apparatus for subsurface venting or injecting in liquid molding |
| JP2006181813A (en) * | 2004-12-27 | 2006-07-13 | Yokohama Rubber Co Ltd:The | Method for producing honeycomb sandwich panel with frequency selection plate laminated |
| GB0815433D0 (en) * | 2008-08-22 | 2008-10-01 | Say Philip D | Manufacture of cast panels |
| KR20110032941A (en) * | 2009-09-24 | 2011-03-30 | 김인수 | Bubble remove apparatus for liquefied resin |
| CN208788905U (en) * | 2018-05-04 | 2019-04-26 | 深圳市德彩光电有限公司 | The encapsulating die of LED light source |
| CN210360440U (en) * | 2019-07-15 | 2020-04-21 | 东莞东阳光医疗智能器件研发有限公司 | Plate adsorption jig |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113942254A (en) * | 2021-09-24 | 2022-01-18 | 成都飞机工业（集团）有限责任公司 | Accurate control method for molding surface of honeycomb sandwich composite material part encapsulation area |
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