CN112099599A - Temperature control method and device for electronic equipment - Google Patents
Temperature control method and device for electronic equipment Download PDFInfo
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- CN112099599A CN112099599A CN202010934464.5A CN202010934464A CN112099599A CN 112099599 A CN112099599 A CN 112099599A CN 202010934464 A CN202010934464 A CN 202010934464A CN 112099599 A CN112099599 A CN 112099599A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3055—Monitoring arrangements for monitoring the status of the computing system or of the computing system component, e.g. monitoring if the computing system is on, off, available, not available
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
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- Control Of Temperature (AREA)
Abstract
The invention discloses a temperature control method and a temperature control device for electronic equipment, wherein the method comprises the following steps: detecting the temperature of the electronic equipment to obtain a temperature signal; determining a first rotating speed corresponding to the temperature signal based on the temperature signal and a preset rotating speed meter; adjusting the first rotating speed according to the current operating state of the electronic equipment to obtain a target rotating speed; and driving the heat dissipation module to dissipate heat according to the target rotating speed. According to the invention, the first rotating speed corresponding to the temperature of the electronic equipment is obtained by detecting the temperature of the electronic equipment, then the first rotating speed is adjusted based on the current running state of the electronic equipment to obtain the target rotating speed, and the heat dissipation module is controlled based on the target rotating speed, so that the temperature of the electronic equipment is accurately controlled.
Description
Technical Field
The present invention relates to the field of electronic devices, and in particular, to a method and an apparatus for controlling a temperature of an electronic device.
Background
With the development of network technology, electronic devices are becoming more and more popular. After the electronic device works for a period of time, the temperature of the electronic device is higher and higher, so that the temperature of the electronic device needs to be controlled to lower the temperature of the electronic device.
In the prior art, when the temperature of the electronic device is controlled, the embedded controller EC is usually used to control the temperature of the electronic device, but some electronic devices do not have an embedded controller (for example, a flat-panel series electronic product), so that a Thermal Diode in the electronic device needs to be used to induce heat to further control the temperature, but the temperature cannot be accurately controlled by adopting the method.
Disclosure of Invention
The embodiment of the invention aims to provide a temperature control method and a temperature control device for electronic equipment, which are used for solving the problem that the temperature of the electronic equipment cannot be accurately controlled due to the fact that an embedded controller is not arranged in the electronic equipment in the prior art.
In order to solve the technical problem, the embodiment of the application adopts the following technical scheme: a temperature control method of an electronic device includes the following steps:
detecting the temperature of the electronic equipment to obtain a temperature signal;
determining a first rotating speed corresponding to the temperature signal based on the temperature signal and a preset rotating speed meter;
adjusting the first rotating speed according to the current operating state of the electronic equipment to obtain a target rotating speed;
and driving the heat dissipation module to dissipate heat according to the target rotating speed.
Optionally, the tachometer based on the temperature signal and preset further includes the following steps:
acquiring a corresponding relation between the temperature and the rotating speed;
and constructing the tachometer based on the corresponding relation.
Optionally, detecting the temperature of the electronic device to obtain a temperature signal includes the following steps:
detecting the temperature of each control chip by using a diode thermal sensor corresponding to each control chip to obtain a first temperature signal;
detecting the temperature of the central processing unit by using a temperature sensor to obtain a second temperature signal;
the temperature signal is obtained based on each of the first temperature signal and the second temperature signal.
Optionally, the running state includes one or more of the following number of application programs, number of processes, number of threads, and CPU utilization.
Optionally, the driving the heat dissipation module to dissipate heat according to the target rotation speed further includes: and detecting the actual rotating speed of the heat dissipation module by using a rotating speed measuring instrument, and adjusting the target rotating speed based on the difference value of the actual rotating speed and the target rotating speed.
Optionally, the method further includes the following steps of driving the heat dissipation module to dissipate heat according to the target rotation speed:
determining the duty ratio of the pulse modulation width according to the target rotating speed;
and sending the duty ratio of the pulse modulation width to the heat dissipation module so that the heat dissipation module carries out heat dissipation work based on the duty ratio of the pulse modulation width.
In order to solve the above problem, according to another embodiment of the present invention, there is provided a temperature control device for an electronic apparatus, including:
the temperature detection module is used for detecting the temperature of the electronic equipment to obtain a temperature signal;
the rotating speed configuration module is used for acquiring the temperature signal and determining a first rotating speed corresponding to the temperature signal based on a preset rotating speed meter;
the target control module is used for acquiring the information of the first rotating speed and adjusting the first rotating speed according to the current operating state of the electronic equipment to acquire a target rotating speed;
and the heat dissipation control module acquires the target rotating speed and drives the heat dissipation module to perform heat dissipation work according to the target rotating speed.
Optionally, the apparatus further includes a construction module, configured to obtain a correspondence between a temperature and a rotation speed; and constructing the tachometer based on the corresponding relation.
Optionally, the detection module is specifically configured to:
detecting the temperature of each control chip by using a diode thermal sensor corresponding to each control chip to obtain a first temperature signal;
detecting the temperature of the central processing unit by using a temperature sensor to obtain a second temperature signal;
the temperature signal is obtained based on each of the first temperature signal and the second temperature signal.
Optionally, the apparatus further includes an adjusting module, configured to detect an actual rotation speed of the heat dissipation module by using a rotation speed measuring instrument, and feed back the actual rotation speed to the heat dissipation control module, where the heat dissipation control module adjusts the target rotation speed based on a difference between the actual rotation speed and the target rotation speed.
The embodiment of the invention has the beneficial effects that: the first rotating speed corresponding to the temperature of the electronic equipment is obtained by detecting the temperature of the electronic equipment, then the first rotating speed is adjusted based on the current running state of the electronic equipment to obtain the target rotating speed, and the heat dissipation module is controlled based on the target rotating speed, so that the temperature of the electronic equipment is accurately controlled.
Drawings
Fig. 1 is a flowchart illustrating a method for controlling a temperature of an electronic device according to an embodiment of the invention;
FIG. 2 is a flowchart illustrating a method for controlling temperature of an electronic device according to another embodiment of the invention;
fig. 3 is a block diagram of a temperature control apparatus of an electronic device according to another embodiment of the invention.
Detailed Description
Various aspects and features of the present application are described herein with reference to the drawings.
It will be understood that various modifications may be made to the embodiments of the present application. Accordingly, the foregoing description should not be construed as limiting, but merely as exemplifications of embodiments. Those skilled in the art will envision other modifications within the scope and spirit of the application.
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with a general description of the application given above and the detailed description of the embodiments given below, serve to explain the principles of the application.
These and other characteristics of the present application will become apparent from the following description of preferred forms of embodiment, given as non-limiting examples, with reference to the attached drawings.
It should also be understood that, although the present application has been described with reference to some specific examples, a person of skill in the art shall certainly be able to achieve many other equivalent forms of application, having the characteristics as set forth in the claims and hence all coming within the field of protection defined thereby.
The above and other aspects, features and advantages of the present application will become more apparent in view of the following detailed description when taken in conjunction with the accompanying drawings.
Specific embodiments of the present application are described hereinafter with reference to the accompanying drawings; however, it is to be understood that the disclosed embodiments are merely exemplary of the application, which can be embodied in various forms. Well-known and/or repeated functions and constructions are not described in detail to avoid obscuring the application of unnecessary or unnecessary detail. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present application in virtually any appropriately detailed structure.
The specification may use the phrases "in one embodiment," "in another embodiment," "in yet another embodiment," or "in other embodiments," which may each refer to one or more of the same or different embodiments in accordance with the application.
An embodiment of the present invention provides a method for controlling a temperature of an electronic device, as shown in fig. 1, including the following steps:
step S101, detecting the temperature of the electronic equipment to obtain a temperature signal;
in the implementation of this step, a diode thermal sensor may be specifically used to detect the temperature of the electronic device.
Step S102, determining a first rotating speed corresponding to the temperature signal based on the temperature signal and a preset rotating speed meter;
in the specific implementation process of the step, the corresponding relation between the temperature and the rotating speed can be obtained in advance; and then constructing the tachometer based on the corresponding relation. The first speed can thus be determined by looking up the tachometer on the basis of the temperature signal.
Step S103, adjusting the first rotating speed according to the current running state of the electronic equipment to obtain a target rotating speed;
in the specific implementation process of this step, after the first rotation speed is obtained, the current operation state of the electronic device needs to be further obtained, for example, the number of application programs, the number of processes, the number of threads, the CPU utilization rate, and the like of the current electronic device are obtained, and then the target rotation speed is determined according to the operation state. For example, when one or more of the number of applications, the number of processes, the number of threads, and the CPU utilization exceeds corresponding preset values, the target rotation speed may be determined according to a predetermined ratio based on the first rotation speed, for example, according to a ratio of 1: 1.1 to increase the rotation speed, thereby obtaining the target rotation speed. For example, when the number of applications exceeds a preset value, for example, then the number of applications may be increased by 1: 1.1, increasing the rotating speed to obtain a target rotating speed, wherein the preset proportion can be set according to actual needs; for another example, if the CPU utilization is lower than the preset value, the CPU utilization may be set according to 1: the rotation speed is reduced by a ratio of 0.9, whereby the target rotation speed is obtained. The preset proportion in this example can be set according to actual needs.
And step S104, driving the heat dissipation module to dissipate heat according to the target rotating speed.
In the specific implementation process of the step, after the target rotating speed is determined, the fan control chip can be specifically used for controlling the heat dissipation module according to the target rotating speed to drive the heat dissipation module to dissipate heat, so that the electronic equipment is dissipated.
According to the embodiment of the invention, the first rotating speed of the heat dissipation module is obtained based on the current temperature of the electronic equipment, and then the target rotating speed of the heat dissipation module is determined according to the current running state of the electronic equipment and the first rotating speed, so that the heat dissipation module is controlled more reasonably and accurately, and the temperature of the electronic equipment can be accurately controlled.
Another embodiment of the present invention provides a method for controlling a temperature of an electronic device, where the electronic device in this embodiment includes a Central Processing Unit (CPU) and a plurality of control chips, and the CPU is used as an operation and control core of a computer system and is a final execution unit for information processing and program operation. Each control chip and CPU communication connection provide guarantee for the normal operation of electronic equipment, and the control information chip in the electronic equipment in this embodiment includes BIOS chip, north bridge chip, south bridge chip, etc. Since these control chips and CPUs need to perform data processing and other operations during their operation, their temperatures are becoming higher and higher, and if the temperatures exceed a certain temperature value, the data processing efficiency of each control chip is affected, and there is a possibility that the control chips are damaged due to their excessively high temperatures. Therefore, it is necessary to control the temperature of each control chip and perform heat dissipation treatment in time. In this embodiment, when controlling the temperature of the electronic device, the method specifically includes the following steps:
step S201, using the diode thermal sensor corresponding to each control chip to detect the temperature of each control chip, and obtaining a first temperature signal; detecting the temperature of the central processing unit by using a temperature sensor to obtain a second temperature signal; obtaining the temperature signal based on each of the first temperature signal and the second temperature signal;
in this step, the temperature of the control chip may be detected through the Diode thermal Sensor Diode Sensor, that is, after each Diode thermal Sensor Diode Sensor senses the temperature, the voltage value of the corresponding temperature may be sent to the inside of the temperature Sensor T Sensor-PMIC. That is, the voltage value of the temperature of each control chip and the voltage value of the temperature of the central processing unit are sent to the interior of the temperature sensor, and then calculation can be performed through a predetermined algorithm, such as weighting, averaging, and the like, to obtain a final temperature signal.
Step S202, determining a first rotating speed corresponding to the temperature signal based on the temperature signal and a preset rotating speed table;
in this step, after the first rotation speed is determined, the first rotation speed may be transmitted to the Thermal control chip Thermal control IC through the I2C bus.
Step S203, adjusting the first rotating speed according to the current running state of the electronic equipment to obtain a target rotating speed;
in the implementation of this step, the thermal control chip may be used to adjust the first rotation speed according to the current operating state of the electronic device to obtain a target rotation speed, and then send the target rotation speed to the fan control chip.
Step S204, determining the duty ratio of the pulse modulation width according to the target rotating speed; and sending the duty ratio of the pulse modulation width to the heat dissipation module so that the heat dissipation module carries out heat dissipation work based on the duty ratio of the pulse modulation width.
In the specific implementation process of this step, the duty ratio of the pulse modulation width may be determined according to the target rotation speed by using the fan control chip.
Step S205, detecting the actual rotation speed of the heat dissipation module by using a rotation speed measuring instrument, and adjusting the target rotation speed based on the difference between the actual rotation speed and the target rotation speed. In the specific implementation process of the embodiment, after the heat dissipation module is controlled based on the target rotation speed, the actual rotation speed of the heat dissipation module can be further obtained, and then the actual rotation speed is sent to the Fan Control chip Fan Control IC, so that the Fan Control chip can adjust the target rotation speed based on the difference between the actual rotation speed and the target rotation speed of the heat dissipation module, so that the actual rotation speed of the heat dissipation module is consistent with the expected target rotation speed, and the temperature of the electronic device is accurately controlled.
Another embodiment of the present invention provides a temperature control apparatus for an electronic device, including:
the temperature detection module 1 is used for detecting the temperature of the electronic equipment to obtain a temperature signal;
the rotating speed configuration module 2 is used for acquiring the temperature signal and determining a first rotating speed corresponding to the temperature signal based on a preset rotating speed meter;
the target control module 3 is used for acquiring the information of the first rotating speed and adjusting the first rotating speed according to the current operating state of the electronic equipment to acquire a target rotating speed;
and the heat dissipation control module 4 is used for acquiring the target rotating speed and driving the heat dissipation module to perform heat dissipation work according to the target rotating speed.
In the embodiment, in a specific implementation process, the operation state includes one or more of the following states: application program number, process number, thread number, CPU utilization rate.
In a specific implementation process of this embodiment, the apparatus further includes a construction module, configured to obtain a correspondence between a temperature and a rotation speed; and constructing the tachometer based on the corresponding relation.
In this embodiment, the temperature detection module is specifically configured to: detecting the temperature of each control chip by using a diode thermal sensor corresponding to each control chip to obtain a first temperature signal; detecting the temperature of the central processing unit by using a temperature sensor to obtain a second temperature signal; the temperature signal is obtained based on each of the first temperature signal and the second temperature signal.
The device in this embodiment further includes an adjusting module, configured to detect an actual rotation speed of the heat dissipation module by using the rotation speed measuring instrument, and feed back the actual rotation speed to the heat dissipation control module, where the heat dissipation control module adjusts the target rotation speed based on a difference between the actual rotation speed and the target rotation speed.
In a specific implementation process of this embodiment, the heat dissipation control module is specifically configured to:
determining the duty ratio of the pulse modulation width according to the target rotating speed;
and sending the duty ratio of the pulse modulation width to the heat dissipation module so that the heat dissipation module carries out heat dissipation work based on the duty ratio of the pulse modulation width.
In this embodiment, the first rotation speed corresponding to the temperature of the electronic device is obtained by detecting the temperature of the electronic device, and then the first rotation speed is adjusted to obtain the target rotation speed based on the current operating state of the electronic device, and the heat dissipation module is controlled based on the target rotation speed, so that the temperature of the electronic device is accurately controlled.
The above embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and the scope of the present invention is defined by the claims. Various modifications and equivalents may be made by those skilled in the art within the spirit and scope of the present invention, and such modifications and equivalents should also be considered as falling within the scope of the present invention.
Claims (10)
1. A temperature control method of an electronic device is characterized by comprising the following steps:
detecting the temperature of the electronic equipment to obtain a temperature signal;
determining a first rotating speed corresponding to the temperature signal based on the temperature signal and a preset rotating speed meter;
adjusting the first rotating speed according to the current operating state of the electronic equipment to obtain a target rotating speed;
and driving the heat dissipation module to dissipate heat according to the target rotating speed.
2. The method of claim 1, wherein said tachometer based on said temperature signal and preset further comprises the steps of:
acquiring a corresponding relation between the temperature and the rotating speed;
and constructing the tachometer based on the corresponding relation.
3. The method of claim 1, wherein detecting the temperature of the electronic device to obtain the temperature signal comprises the steps of:
detecting the temperature of each control chip by using a diode thermal sensor corresponding to each control chip to obtain a first temperature signal;
detecting the temperature of the central processing unit by using a temperature sensor to obtain a second temperature signal;
the temperature signal is obtained based on each of the first temperature signal and the second temperature signal.
4. The method of claim 1, wherein the operating state includes one or more of a number of applications, a number of processes, a number of threads, and a CPU utilization.
5. The method of claim 1, wherein driving the heat dissipation module to dissipate heat according to the target rotational speed further comprises: and detecting the actual rotating speed of the heat dissipation module by using a rotating speed measuring instrument, and adjusting the target rotating speed based on the difference value of the actual rotating speed and the target rotating speed.
6. The method of claim 1, wherein the driving the heat dissipation module to dissipate heat according to the target rotation speed further comprises:
determining the duty ratio of the pulse modulation width according to the target rotating speed;
and sending the duty ratio of the pulse modulation width to the heat dissipation module so that the heat dissipation module carries out heat dissipation work based on the duty ratio of the pulse modulation width.
7. A temperature control apparatus for an electronic device, comprising:
the temperature detection module is used for detecting the temperature of the electronic equipment to obtain a temperature signal;
the rotating speed configuration module is used for acquiring the temperature signal and determining a first rotating speed corresponding to the temperature signal based on a preset rotating speed meter;
the target control module is used for acquiring the information of the first rotating speed and adjusting the first rotating speed according to the current operating state of the electronic equipment to acquire a target rotating speed;
and the heat dissipation control module acquires the target rotating speed and drives the heat dissipation module to perform heat dissipation work according to the target rotating speed.
8. The apparatus of claim 7, wherein the apparatus further comprises a build module,
the device is used for acquiring the corresponding relation between the temperature and the rotating speed;
and constructing the tachometer based on the corresponding relation.
9. The apparatus of claim 7, wherein the detection module is specifically configured to:
detecting the temperature of each control chip by using a diode thermal sensor corresponding to each control chip to obtain a first temperature signal;
detecting the temperature of the central processing unit by using a temperature sensor to obtain a second temperature signal;
the temperature signal is obtained based on each of the first temperature signal and the second temperature signal.
10. The apparatus of claim 7, further comprising an adjustment module configured to detect an actual rotational speed of the heat dissipation module using a rotational speed measurement instrument and feed back the actual rotational speed to the heat dissipation control module, wherein the heat dissipation control module adjusts the target rotational speed based on a difference between the actual rotational speed and the target rotational speed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010934464.5A CN112099599A (en) | 2020-09-08 | 2020-09-08 | Temperature control method and device for electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010934464.5A CN112099599A (en) | 2020-09-08 | 2020-09-08 | Temperature control method and device for electronic equipment |
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| CN112099599A true CN112099599A (en) | 2020-12-18 |
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| CN202010934464.5A Pending CN112099599A (en) | 2020-09-08 | 2020-09-08 | Temperature control method and device for electronic equipment |
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| CN112799848A (en) * | 2021-02-10 | 2021-05-14 | 联想(北京)有限公司 | Control method and device |
| CN114281130A (en) * | 2021-12-30 | 2022-04-05 | 天津同阳科技发展有限公司 | Temperature control method and device |
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Application publication date: 20201218 |