CN112098360A - Detection device for semiconductor - Google Patents
Detection device for semiconductor Download PDFInfo
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- CN112098360A CN112098360A CN202010974707.8A CN202010974707A CN112098360A CN 112098360 A CN112098360 A CN 112098360A CN 202010974707 A CN202010974707 A CN 202010974707A CN 112098360 A CN112098360 A CN 112098360A
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- 238000001514 detection method Methods 0.000 title claims abstract description 62
- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
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- 238000004806 packaging method and process Methods 0.000 description 4
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
- G01N21/3581—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light using far infrared light; using Terahertz radiation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
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Abstract
The invention relates to the technical field of semiconductors and discloses a detection device for a semiconductor, which comprises a bottom plate, wherein a supporting plate is fixedly connected to the upper surface of the bottom plate, a detection seat is fixedly connected to the upper surface of the supporting plate, first fixed blocks are arranged on the left side and the right side of the back surface of the detection seat, a first rotating shaft is fixedly connected to the inner side surface of each first fixed block, a second fixed block is sleeved on the outer surface of each first rotating shaft, a cover plate is fixedly connected to the upper surface of each second fixed block, and a locking device is arranged on the front surface of the detection. This detection device for semiconductor through setting up fixed axle, second fixed block, spring and connecting axle, makes the locking lever can be comparatively convenient stable lock the dead lever to make the apron with detect the seat and can comparatively stably effectively drive and connect, make and detect the seat and apron comparatively accurate detect QFP encapsulation integrated circuit, comparatively effectual avoided the problem that the deviation appears in the test result.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a detection device for a semiconductor.
Background
The semiconductor is a substance with conductivity between an insulator and a conductor, the conductivity of the semiconductor is easy to control, the semiconductor can be used as an element material for information processing, the semiconductor material is mostly used for manufacturing chips, with the development of microelectronic technology, the chip technology with lighter weight, smaller volume and high reliability is gradually and widely used, QFN is a newer packaging form, which belongs to a leadless packaging of devices and has very small size, 3 × 3mm, 4 × 4mm, 5 × 5mm, 6 × 6mm and the like are common, a grounding heat dissipation pad is usually arranged at the packaging belly, and conductive pads for realizing electrical connection are arranged at the periphery of the packaging belly, and the number of the conductive pads is usually 20, 24, 32 and the like; the QFP package integrated circuit needs to be detected in the production process of the QFP package integrated circuit, so that unqualified products are prevented from flowing into the market; the detection device in the prior art directly detects the QFP packaged integrated circuit by closing the cover plate and the bottom plate, the cover plate is connected with the bottom plate poorly, the QFP packaged integrated circuit cannot be detected accurately, accurate contact of the electrodes and pins is affected, and deviation occurs in a test result.
Disclosure of Invention
Technical problem to be solved
In view of the deficiencies of the prior art, the present invention provides a semiconductor inspection apparatus that solves the problems set forth in the background art.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a detection device for semiconductor, includes the bottom plate, fixed surface is connected with the backup pad on the bottom plate, fixed surface is connected with in the backup pad and detects the seat, it all is provided with first fixed block to detect the seat back left and right sides, the first pivot of first fixed block medial surface fixedly connected with, the second fixed block has been cup jointed to first pivot surface, fixed surface is connected with the apron on the second fixed block, it openly is provided with locking device to detect the seat, it has seted up the standing groove to detect the seat upper surface, the rectangular channel has been seted up to the standing groove medial surface, the inside stop device that is provided with of rectangular channel, fixed surface is connected with the manipulation handle on the apron.
Preferably, locking device includes the second pivot, the second pivot with detect the seat and openly rotate and be connected, the positive fixedly connected with of second pivot is rotatory piece, detect the equal fixedly connected with fixed axle in the positive left and right sides of seat, the locking lever has been cup jointed to the fixed axle surface, detect the equal fixedly connected with second fixed block in the positive left and right sides of seat, second fixed block medial surface fixedly connected with spring, spring inner and locking lever lateral surface top fixed connection, the connecting axle has been pegged graft to locking lever medial surface bottom, the equal fixedly connected with dead lever in the apron upper surface left and right sides, the connecting rope has been cup jointed to the connecting axle surface, connect rope inner and second pivot surface fixed connection.
Preferably, stop device includes the spout, the inside carriage release lever that is provided with of spout, carriage release lever medial surface fixedly connected with limiting plate, the equal fixedly connected with connecting block in carriage release lever upper surface and the lower surface outside, the connecting block medial surface is pegged graft and is had first circle axle, detect the equal fixedly connected with third fixed block in seat lateral surface bottom and top, third fixed block medial surface is pegged graft and is had second circle axle, the worm wheel has been cup jointed to second circle off-axial surface, it is connected with the third pivot to detect the rotation of seat lateral surface, the worm has been cup jointed to third pivot surface, worm wheel and worm meshing, third pivot lateral surface fixedly connected with carousel, the transfer line has been cup jointed to third pivot surface, circular spout has.
Preferably, the bottom of the outer side face of the fixed rod is provided with a first clamping groove, the top of the inner side face of the locking rod is provided with a second clamping groove, and the first clamping groove is meshed with the second clamping groove.
Preferably, the width of the circular sliding groove is matched with the inner diameter of the first circular shaft, and the width of the circular sliding groove is five millimeters.
Preferably, the top and the bottom of the outer side face of the supporting plate are fixedly connected with triangular blocks, the lower surfaces of the triangular blocks at the bottom are welded with the upper surface of the bottom plate, and the upper surfaces of the triangular blocks at the top are welded with the surface ware under the detection seat.
Preferably, the outer surface of the control handle is provided with a rubber anti-skidding circular ring pad, and the outer surface of the rubber anti-skidding circular ring pad is provided with well-shaped grains.
Preferably, the semiconductor detection device includes:
a miniature camera is arranged in the placing groove;
the upper surface of the cover plate is provided with an alarm, a display screen and a controller;
the terahertz spectrum emitter is arranged on the lower surface of the cover plate;
the miniature camera, the alarm, the display screen and the terahertz spectrum transmitter are connected with the controller;
the miniature camera is used for acquiring a connection degree image of the placing groove and the cover plate;
the image processing platform is used for analyzing the linkage degree image, and specifically comprises:
the image processing platform is used for dividing the acquired linking degree image into N image blocks and simultaneously carrying out standardization processing on the light intensity of the N image blocks to obtain a light intensity label image corresponding to the linking degree image;
meanwhile, carrying out standardization processing on the structural image at the joint of the placing groove and the cover plate in the N image blocks to obtain a corresponding structural label diagram;
the image processing platform is further used for correspondingly integrating the obtained light intensity label graph and the structure label graph to obtain a mixed label graph corresponding to the connection degree image, calculating a convolution value of the mixed label graph, comparing the calculated convolution value with a preset threshold value, and judging whether the placing groove is tightly connected with the cover plate or not;
if the connection is not tight, the controller controls the alarm to alarm and remind;
if the connection is judged to be tight, the controller controls the terahertz spectrum transmitter to transmit terahertz waves to the circuit to be detected, packaged and integrated;
the image processing platform is also used for acquiring a terahertz spectrogram reflected by the circuit to be detected and packaged into an integrated circuit, analyzing the terahertz spectrogram to obtain corresponding terahertz spectrum data, and comparing the obtained data with preset comparison data in a database to generate an actual result image;
zooming the actual result image, extracting a characteristic value according to a preset rule, comparing the characteristic value in the actual result with a corresponding characteristic value preset in a rule base, generating a comparison result report and displaying the comparison result report on the display screen;
if the characteristic value in the actual result is the same as the corresponding characteristic value preset in the rule base, the circuit of the packaged integration to be detected is qualified;
otherwise, the packaged integrated circuit to be detected is unqualified.
Preferably, the semiconductor detection device includes:
the control handle is provided with a pressure sensor;
the cover plate is provided with a warning lamp and a central processor;
the pressure sensor and the warning lamp are connected with the central processor;
the pressure sensor is used for calculating the friction force between a target user and the cover plate when the target user opens the cover plate, the central processor calculates the friction torque of the control handle according to the friction force, and the specific steps comprise:
the pressure sensor is used for calculating the friction force between the target user and the cover plate according to the following formula:
wherein F represents a frictional force between the target user and the cover panel when the cover panel is opened; representing a coefficient of sliding friction of the steering grip;
the sensitivity coefficient of the pressure sensor is represented, and the value range is [0.5, 0.8 ]](ii) a f represents an external force value provided by opening the cover plate; m represents the mass of the cover plate; g represents the acceleration of gravity and takes 9.8m/s2(ii) a Sigma represents the external force correction coefficient for opening the cover plate, and the value range is [0.4, 0.7 ]](ii) a Theta represents the included angle value between the external force and the vertical direction;
the central processor is further configured to calculate a friction torque of the control handle according to the following formula:
wherein L represents a friction torque of the manipulation grip; a represents a static friction coefficient of the manipulation grip; beta represents an included angle value formed between the control handle and the applied external force when the cover plate is opened; f represents the friction force required to open the cover plate; l represents the length of the manipulation grip;
the central processor compares the calculated friction torque with a preset friction torque;
if the friction torque is smaller than the preset friction torque, the central processor controls the warning lamp to perform first flashing reminding to remind that the applied external force value is increased;
otherwise, the central processor controls the warning lamp to carry out second flicker reminding.
(III) advantageous effects
Compared with the prior art, the invention provides a detection device for a semiconductor, which has the following beneficial effects:
1. this detection device for semiconductor through setting up fixed axle, second fixed block, spring and connecting axle, makes the locking lever can be comparatively convenient stable lock the dead lever to make the apron with detect the seat and can comparatively stably effectively drive and connect, make and detect the seat and apron comparatively accurate detect QFP encapsulation integrated circuit, comparatively effectual avoided the problem that the deviation appears in the test result.
2. This detection device for semiconductor through setting up second pivot, rotatory piece and connecting the rope, makes the locking lever can comparatively make things convenient for effectually to remove fixedly to the dead lever to make the apron can comparatively make things convenient for effectual and detect the seat separation, thereby can comparatively convenient detect QFP encapsulation integrated circuit, improved QFP encapsulation integrated circuit detection's work efficiency greatly.
3. This detection device for semiconductor through setting up spout, carriage release lever, connecting block, first round axle and circular spout, makes the limiting plate that is located left limiting plate and is located the right side can be comparatively convenient carry on spacingly to QFP encapsulation integrated circuit to make that the detection seat can be comparatively accurate detect QFP encapsulation integrated circuit, improved detection device's practicality greatly.
4. This detection device for semiconductor through setting up third fixed block, second circle axle, worm wheel, third pivot, worm and carousel, makes the first circle axle motion of drive that the transfer line can be comparatively convenient to make limiting plate can be convenient carry on spacingly to QFP encapsulation integrated circuit, thereby make that the detection seat can be comparatively accurate detect QFP encapsulation integrated circuit, improved detection device's practicality greatly.
5. The detection device for the semiconductor obtains the connection degree image of the placing groove and the cover plate through the miniature camera, analyzes the obtained image based on the image processing platform, judges whether the placing groove and the cover plate are tightly connected, under the condition of tight connection, the controller controls the terahertz spectrum emitter to detect the packaged integrated circuit, generates a terahertz spectrum diagram according to the detection information, analyzes the terahertz spectrum diagram, extracts a characteristic value in the terahertz spectrum diagram and compares the characteristic value with a preset characteristic value, if the characteristic value in an actual result is the same as a corresponding characteristic value preset in a rule base, the circuit to be detected is qualified, otherwise, the circuit to be detected is unqualified, the scheme ensures that the placing groove and the cover plate are tightly connected before the packaged integrated circuit is detected, ensures the detection accuracy, and simultaneously when the packaged integrated circuit is detected, and the accuracy of a detection result is ensured by adopting a terahertz spectrum analysis method.
6. The semiconductor detection device calculates the friction force between the target user and the cover plate when the cover plate is opened, thereby calculating the friction torque of the control handle. When the friction force is calculated, the sliding friction coefficient of the control handle and the magnitude of the external force are involved, meanwhile, the self gravity of the cover plate is included, the influence of each variable on the friction force is determined, the reliability and the accuracy in the calculation process are ensured, the friction torque of the control handle is calculated through the friction force, an included angle formed between the handle and the external force is ensured, the force in the vertical direction when the cover plate is opened is ensured, a powerful guarantee is provided for calculating the friction torque, the friction force and the length of the handle are multiplied, the friction torque of the handle is obtained, and the scheme ensures that a target is used for being supported by the sufficient friction force between the target and the cover plate when the cover plate is opened so as to adjust the magnitude of the external force in time.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a close-up view of the structure of the present invention;
FIG. 3 is an enlarged view of the structure at A in FIG. 2 according to the present invention;
FIG. 4 is a schematic view of the structure of the position limiting device of the present invention;
FIG. 5 is an enlarged view of the structure at B in FIG. 4 according to the present invention;
FIG. 6 is a schematic diagram of the controller connection according to the present invention;
FIG. 7 is a diagram of the CPU connections of the present invention.
In the figure: 1. a base plate; 2. a support plate; 3. a detection seat; 4. a first fixed block; 5. a first rotating shaft; 6. A second fixed block; 7. a cover plate; 8. a locking device; 801. a second rotating shaft; 802. rotating the block; 803. a fixed shaft; 804. a locking lever; 805. a second fixed block; 806. a spring; 807. a connecting shaft; 808. fixing the rod; 809. connecting ropes; 9. a placement groove; 10. a rectangular groove; 11. a limiting device; 1101. a chute; 1102. a travel bar; 1103. a limiting plate; 1104. connecting blocks; 1105. a first circular shaft; 1106. a third fixed block; 1107. a second circular shaft; 1108. a worm gear; 1109. a third rotating shaft; 1110. a worm; 1111. A turntable; 1112. a transmission rod; 1113. a circular chute; 12. the grip is manipulated.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: the utility model provides a detection device for semiconductor, comprising a base plate 1, fixed surface is connected with backup pad 2 on the bottom plate 1, fixed surface is connected with in backup pad 2 and detects seat 3, it all is provided with first fixed block 4 to detect 3 back left and right sides in seat, the first pivot 5 of 4 medial surfaces fixedly connected with in first fixed block, second fixed block 6 has been cup jointed to 5 surfaces in first pivot, fixed surface is connected with apron 7 on the 6 second fixed blocks, it openly is provided with locking device 8 to detect seat 3, it has seted up standing groove 9 to detect 3 upper surfaces in seat, rectangular channel 10 has been seted up to standing groove 9 medial surfaces, the inside stop device 11 that is provided with of rectangular channel 10, fixedly connected with controls handle 12 on apron 7.
In the invention, in order to make the connection between the cover plate 7 and the detection seat 3 more firm, a locking device 8 is provided, the locking device 8 comprises a second rotating shaft 801, the second rotating shaft 801 is rotatably connected with the front surface of the detection seat 3, a rotating block 802 is fixedly connected with the front surface of the second rotating shaft 801, the left and right sides of the front surface of the detection seat 3 are fixedly connected with a fixed shaft 803, the outer surface of the fixed shaft 803 is sleeved with a locking rod 804, the left and right sides of the front surface of the detection seat 3 are fixedly connected with a second fixed block 805, the inner side surface of the second fixed block 805 is fixedly connected with a spring 806, the inner end of the spring 806 is fixedly connected with the top of the outer side surface of the locking rod 804, a connecting shaft 807 is inserted at the bottom of the inner side surface of the locking rod 804, the locking rod 804 can conveniently and stably lock the connecting shaft 808 by the, the relatively accurate QFP integrated circuit that encapsulates that makes detection seat 3 and apron 7 detects, the relatively effectual problem of deviation appearing in the test result of having avoided, the equal fixedly connected with dead lever 808 in apron 7 upper surface left and right sides, connecting axle 807 surface has cup jointed and has connected rope 809, through setting up second pivot 801, rotatory piece 802 and connection rope 809, make locking lever 804 can make things convenient for effectually to relieve fixedly to dead lever 808, thereby make apron 7 can make things convenient for effectually comparatively with detect seat 3 separation, thereby can be comparatively convenient detect QFP integrated circuit, the work efficiency that QFP integrated circuit detected has been improved greatly, connect rope 809 the inner and second pivot 801 surface fixed connection, locking device 8 has improved the stability that apron 7 and detection seat 3 are connected.
In the invention, in order to more accurately place the QFP packaged integrated circuit in the placing groove 9, a limiting device 11 is arranged, the limiting device 11 comprises a sliding groove 1101, a moving rod 1102 is arranged in the sliding groove 1101, a limiting plate 1103 is fixedly connected on the inner side surface of the moving rod 1102, a connecting block 1104 is fixedly connected on the outer sides of the upper surface and the lower surface of the moving rod 1102, a first round shaft 1105 is inserted into the inner side surface of the connecting block 1104, a third fixing block 1106 is fixedly connected on the bottom and the top of the outer side surface of the detection seat 3, a second round shaft 1107 is inserted into the inner side surface of the third fixing block 1106, a worm wheel 1108 is sleeved on the outer surface of the second round shaft 1107, a third rotating shaft 1109 is rotatably connected on the outer side surface of the detection seat 3, a worm 1110 is sleeved on the outer surface of the third rotating shaft 1109, the worm wheel 1108 is engaged with the worm, the inner side surface of the transmission rod 1112 is provided with a circular sliding chute 1113, and the transmission rod 1112 can conveniently drive the first circular shaft 1105 to move by arranging a third fixed block 1106, a second circular shaft 1107, a worm wheel 1108, a third rotating shaft 1109, a worm 1110 and a turntable 1111, so that the position-limiting plate 1103 can conveniently limit the QFP packaged integrated circuit, and the detection seat 3 can accurately detect the QFP packaged integrated circuit, thereby greatly improving the practicability of the detection device, by arranging the sliding groove 1101, the moving rod 1102, the connecting block 1104, the first circular shaft 1105 and the circular sliding groove 1113, the position of the position-limiting plate 1103 on the left side and the position of the position-limiting plate 1103 on the right side can be more conveniently limited, therefore, the detection seat 3 can accurately detect the QFP packaged integrated circuit, the practicability of the detection device is greatly improved, and the limiting device 11 improves the stability and the accuracy of placing the QFP packaged integrated circuit.
In the invention, in order to ensure that the connection between the cover plate 7 and the detection seat 3 is more stable, the bottom of the outer side surface of the fixing rod 808 is provided with a first clamping groove, the top of the inner side surface of the locking rod 804 is provided with a second clamping groove, the first clamping groove is meshed with the second clamping groove, the first clamping groove and the second clamping groove ensure that the connection between the fixing rod 808 and the locking rod 804 is more convenient and firm, and the convenience in connection between the cover plate 7 and the detection seat 3 is improved.
In the invention, in order to enable the circular chute 1113 to more conveniently drive the first circular shaft 1105 to move, the width of the circular chute 1113 is adapted to the inner diameter of the first circular shaft 1105, and the width of the circular chute 1113 is five millimeters, so that the adaptation of the circular chute 1113 to the first circular shaft 1105 improves the convenience of the movement of the first circular shaft 1105.
In the invention, in order to enable the support plate 2 to more stably support the detection seat 3, triangular prisms are fixedly connected to the top and the bottom of the outer side surface of the support plate 2, the lower surfaces of the triangular prisms at the bottom are welded with the upper surface of the bottom plate 1, the upper surfaces of the triangular prisms at the top are welded with the lower surface of the detection seat 3, and the welding improves the stability among the bottom plate 1, the support plate 2 and the detection seat 3.
In the present invention, in order to more conveniently hold the manipulation grip 12, the outer surface of the manipulation grip 12 is provided with a rubber anti-slip ring pad, and the outer surface of the rubber anti-slip ring pad is provided with a well-shaped pattern, which improves the friction between the palm and the manipulation grip 12 and increases the controllability of the manipulation grip 12.
The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.
When the device is used, firstly, the turntable 1111 on the right side is rotated clockwise, the turntable 1111 on the right side drives the third rotating shaft 1109 and the worm 1110 on the right side to rotate clockwise, the turntable 1111 on the left side is rotated counterclockwise, the turntable 1111 on the left side drives the third rotating shaft 1109 and the worm 1110 on the left side to rotate counterclockwise, the worm wheel 1108 and the worm 1110 are in meshed transmission, the worm wheel 1108 on the left side drives the transmission rod 1112 on the left side to rotate counterclockwise around the center of the second circular shaft 1107 on the left side, the transmission rod 1112 on the right side rotates clockwise around the center of the second circular shaft 1107 on the right side, the circular chute 1113 is matched with the first circular shaft 1105, the first circular shaft 1105 drives the connecting block 1104, the moving rod 1102 and the limiting plate 1103 to move inwards along the track of the chute 1101, when the distance between the limiting plates 1103 on the left side and the, then place QFP package integrated circuit in standing groove 9, limiting plate 1103 carries on spacingly to QFP package integrated circuit, then hold and operate handle 12, it uses the first pivot 5 centre of a circle as well clockwise rotation ninety degrees to operate handle 12 to drive apron 7 and second fixed block 6, then dead lever 808 extrudees locking lever 804, make the locking lever 804 top of left and right sides use the fixed axle 803 centre of a circle of left and right sides to move to the outside as the center, when the first draw-in groove of dead lever 808 lateral surface and the second draw-in groove of locking lever 804 lateral surface fit, make locking lever 804 lock dead lever 808 under the elastic action of spring 806, detect QFP package integrated circuit at last.
In summary, the detection apparatus for the semiconductor is provided with the fixing shaft 803, the second fixing block 805, the spring 806 and the connecting shaft 807, so that the locking rod 804 can be conveniently and stably locked on the fixing rod 808, the cover plate 7 and the detection base 3 can be stably and effectively driven to be connected, the detection base 3 and the cover plate 7 can be accurately used for detecting the QFP packaged integrated circuit, and the problem of deviation of a test result is effectively avoided.
This detection device for semiconductor through setting up second pivot 801, rotatory piece 802 and connecting rope 809, makes locking lever 804 can comparatively make things convenient for effectually to remove fixedly to dead lever 808 to make apron 7 can comparatively make things convenient for effectual and detect 3 separations of seat, thereby can comparatively convenient detect QFP encapsulation integrated circuit, improved QFP encapsulation integrated circuit detection's work efficiency greatly.
This detection device for semiconductor through setting up spout 1101, carriage release lever 1102, connecting block 1104, first round axle 1105 and circular spout 1113, makes that the limiting plate 1103 that is located left and the limiting plate 1103 that is located the right side can be comparatively convenient carry on spacingly to QFP package integrated circuit to make and detect that seat 3 can be comparatively accurate detect QFP package integrated circuit, improved detection device's practicality greatly.
This detection device for semiconductor through setting up third fixed block 1106, second circle axle 1107, worm wheel 1108, third pivot 1109, worm 1110 and carousel 1111, makes the motion of the first circle axle 1105 of drive that transfer line 1112 can be comparatively convenient to make limiting plate 1103 can be convenient carry on spacingly to QFP encapsulation integrated circuit, thereby make that detects seat 3 can be comparatively accurate detect QFP encapsulation integrated circuit, improved detection device's practicality greatly.
The invention provides a new technical scheme, and the detecting device for the semiconductor is as shown in figure 6:
a miniature camera is arranged in the placing groove 9;
an alarm, a display screen and a controller are arranged on the upper surface of the cover plate 7;
the lower surface of the cover plate 7 is provided with a terahertz spectrum transmitter;
the miniature camera, the alarm, the display screen and the terahertz spectrum transmitter are connected with the controller;
the micro camera is used for acquiring a connection degree image of the placing groove 9 and the cover plate 7;
the image processing platform is used for analyzing the linkage degree image, and specifically comprises:
the image processing platform is used for dividing the acquired linking degree image into N image blocks and simultaneously carrying out standardization processing on the light intensity of the N image blocks to obtain a light intensity label image corresponding to the linking degree image;
meanwhile, carrying out standardization processing on the structural image at the joint of the placing groove 9 and the cover plate 7 contained in the N image blocks to obtain a corresponding structural label diagram;
the image processing platform is further configured to correspondingly integrate the obtained light intensity label graph and the structure label graph to obtain a mixed label graph corresponding to the joining degree image, calculate a convolution value of the mixed label graph, compare the calculated convolution value with a preset threshold value, and determine whether the placement groove 9 and the cover plate 7 are tightly joined;
if the connection is not tight, the controller controls the alarm to alarm and remind;
if the connection is judged to be tight, the controller controls the terahertz spectrum transmitter to transmit terahertz waves to the circuit to be detected, packaged and integrated;
the image processing platform is also used for acquiring a terahertz spectrogram reflected by the circuit to be detected and packaged into an integrated circuit, analyzing the terahertz spectrogram to obtain corresponding terahertz spectrum data, and comparing the obtained data with preset comparison data in a database to generate an actual result image;
zooming the actual result image, extracting a characteristic value according to a preset rule, comparing the characteristic value in the actual result with a corresponding characteristic value preset in a rule base, generating a comparison result report and displaying the comparison result report on the display screen;
if the characteristic value in the actual result is the same as the corresponding characteristic value preset in the rule base, the circuit of the packaged integration to be detected is qualified;
otherwise, the packaged integrated circuit to be detected is unqualified.
The working principle and the beneficial effects of the technical scheme are as follows: acquiring a joining degree image of a placing groove and a cover plate through a micro camera, analyzing the acquired image based on an image processing platform, judging whether the placing groove and the cover plate are tightly joined, controlling a terahertz spectrum emitter to detect a packaged integrated circuit by a controller under the condition of tight joining, generating a terahertz spectrum diagram according to detection information, analyzing the terahertz spectrum diagram, extracting a characteristic value of the terahertz spectrum diagram and comparing the characteristic value with a preset characteristic value, if the characteristic value in an actual result is the same as a corresponding characteristic value preset in a rule base, indicating that the circuit to be detected is qualified, otherwise, indicating that the circuit to be detected is unqualified, ensuring that the placing groove and the cover plate are tightly joined before the packaged integrated circuit is detected, ensuring the detection accuracy, and simultaneously adopting a terahertz spectrum analysis method when the packaged integrated circuit is detected, the accuracy of the detection result is ensured.
The invention provides a new technical scheme, and the detecting device for the semiconductor is as shown in figure 7:
the control handle 12 is provided with a pressure sensor;
the cover plate 7 is provided with a warning lamp and a central processor;
the pressure sensor and the warning lamp are connected with the central processor;
the pressure sensor is used for calculating the friction force between a target user and the cover plate 7 when the target user opens the cover plate 7, the central processor calculates the friction torque of the control handle 12 according to the friction force, and the specific steps include:
the pressure sensor is used for calculating the friction force between the target user and the cover plate 7 according to the following formula:
wherein F represents a frictional force between the target user and the cover 7 when the cover 7 is opened; represents the coefficient of sliding friction of the manipulation grip 12;
the sensitivity coefficient of the pressure sensor is represented, and the value range is [0.5, 0.8 ]](ii) a f represents the external force value provided by opening the cover plate 7; m represents the mass of the cover plate 7; g represents the acceleration of gravity and takes 9.8m/s2(ii) a Sigma represents the external force correction coefficient for opening the cover plate 7, and the value range is [0.4, 0.7 ]](ii) a Theta represents the included angle value between the external force and the vertical direction;
the central processor is further configured to calculate the friction torque of the manipulation grip 12 according to the following formula:
wherein L represents the friction torque of the manipulation grip 12; α represents a static friction coefficient of the manipulation grip 12; β represents a value of a pinch angle formed between the manipulation grip 12 and an applied external force when the cover 7 is opened; f represents the friction required to open the cover 7; l represents the length of the manipulation grip 12;
the central processor compares the calculated friction torque with a preset friction torque;
if the friction torque is smaller than the preset friction torque, the central processor controls the warning lamp to perform first flashing reminding to remind that the applied external force value is increased;
otherwise, the central processor controls the warning lamp to carry out second flicker reminding.
The working principle and the beneficial effects of the technical scheme are as follows: the friction force between the target user and the cover plate when the cover plate is opened is calculated, so that the friction torque of the control handle is calculated. When the friction force is calculated, the sliding friction coefficient of the control handle and the magnitude of the external force are involved, meanwhile, the self gravity of the cover plate is included, the influence of each variable on the friction force is determined, the reliability and the accuracy in the calculation process are ensured, the friction torque of the control handle is calculated through the friction force, an included angle formed between the handle and the external force is ensured, the force in the vertical direction when the cover plate is opened is ensured, a powerful guarantee is provided for calculating the friction torque, the friction force and the length of the handle are multiplied, the friction torque of the handle is obtained, and the scheme ensures that a target is used for being supported by the sufficient friction force between the target and the cover plate when the cover plate is opened so as to adjust the magnitude of the external force in time.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A semiconductor inspection device comprising a base plate (1), characterized in that: fixed surface is connected with backup pad (2) on bottom plate (1), fixed surface is connected with and detects seat (3) on backup pad (2), it all is provided with first fixed block (4) to detect seat (3) back left and right sides, the first pivot (5) of first fixed block (4) medial surface fixedly connected with, second fixed block (6) have been cup jointed to first pivot (5) surface, fixed surface is connected with apron (7) on second fixed block (6), it openly is provided with locking device (8) to detect seat (3), it has seted up standing groove (9) to detect seat (3) upper surface, rectangular channel (10) have been seted up to standing groove (9) medial surface, inside stop device (11) that is provided with of rectangular channel (10), the fixed surface is connected with on apron (7) manipulates handle (12).
2. The inspection apparatus for semiconductor according to claim 1, wherein: locking device (8) include second pivot (801), second pivot (801) with detect seat (3) openly rotate to be connected, second pivot (801) openly fixedly connected with rotating block (802), detect seat (3) openly about the equal fixedly connected with fixed axle (803) of both sides, fixed axle (803) surface cup joints locking lever (804), detect seat (3) openly about the equal fixedly connected with second fixed block (805) of both sides, second fixed block (805) medial surface fixedly connected with spring (806), spring (806) inner and locking lever (804) lateral surface top fixed connection, connecting axle (807) is pegged graft to locking lever (804) medial surface bottom, the equal fixedly connected with dead lever (808) of apron (7) upper surface left and right sides, connecting axle (807) surface cup joints and connects rope (809), connect rope (809) inner and second pivot (801) surface fixed connection.
3. The inspection apparatus for semiconductor according to claim 1, wherein: the limiting device (11) comprises a sliding groove (1101), a moving rod (1102) is arranged inside the sliding groove (1101), a limiting plate (1103) is fixedly connected to the inner side surface of the moving rod (1102), a connecting block (1104) is fixedly connected to the outer sides of the upper surface and the lower surface of the moving rod (1102), a first round shaft (1105) is inserted into the inner side surface of the connecting block (1104), a third fixing block (1106) is fixedly connected to the bottom and the top of the outer side surface of the detection seat (3), a second round shaft (1107) is inserted into the inner side surface of the third fixing block (1106), a worm wheel (1108) is sleeved on the outer surface of the second round shaft (1107), a third rotating shaft (1109) is rotatably connected to the outer side surface of the detection seat (3), a worm (1110) is sleeved on the outer surface of the third rotating shaft (1109), the worm wheel (1108) is meshed with the worm (1110), a rotating disc (1111) is, the inner side surface of the transmission rod (1112) is provided with a circular sliding groove (1113).
4. The inspection apparatus for semiconductor according to claim 2, wherein: the bottom of the outer side face of the fixed rod (808) is provided with a first clamping groove, the top of the inner side face of the locking rod (804) is provided with a second clamping groove, and the first clamping groove is meshed with the second clamping groove.
5. The inspection apparatus for semiconductor according to claim 3, wherein: the width of the circular sliding groove (1113) is matched with the inner diameter of the first circular shaft (1105), and the width of the circular sliding groove (1113) is five millimeters.
6. The inspection apparatus for semiconductor according to claim 1, wherein: the supporting plate (2) is characterized in that the top of the outer side face of the supporting plate (2) and the bottom of the outer side face of the supporting plate are fixedly connected with triangular blocks, the lower surfaces of the triangular blocks located at the bottom of the supporting plate are welded with the upper surface of the bottom plate (1), and the upper surfaces of the triangular blocks located at the top of the supporting plate are welded with the surface ware located on the detection base.
7. The inspection apparatus for semiconductor according to claim 1, wherein: the outer surface of the control handle (12) is provided with a rubber anti-skidding circular ring pad, and the outer surface of the rubber anti-skidding circular ring pad is provided with well-shaped grains.
8. The inspection apparatus for semiconductor according to claim 1, wherein:
a miniature camera is arranged in the placing groove (9);
an alarm, a display screen and a controller are arranged on the upper surface of the cover plate (7);
the lower surface of the cover plate (7) is provided with a terahertz spectrum transmitter;
the miniature camera, the alarm, the display screen and the terahertz spectrum transmitter are connected with the controller;
the micro camera is used for acquiring a connection degree image of the placing groove (9) and the cover plate (7);
the image processing platform is used for analyzing the linkage degree image, and specifically comprises:
the image processing platform is used for dividing the acquired linking degree image into N image blocks and simultaneously carrying out standardization processing on the light intensity of the N image blocks to obtain a light intensity label image corresponding to the linking degree image;
meanwhile, carrying out standardization processing on the structural image at the joint of the placing groove (9) and the cover plate (7) in the N image blocks to obtain a corresponding structural label diagram;
the image processing platform is further used for correspondingly integrating the obtained light intensity label graph and the structure label graph to obtain a mixed label graph corresponding to the connection degree image, calculating a convolution value of the mixed label graph, comparing the calculated convolution value with a preset threshold value, and judging whether the placing groove (9) is tightly connected with the cover plate (7) or not;
if the connection is not tight, the controller controls the alarm to alarm and remind;
if the connection is judged to be tight, the controller controls the terahertz spectrum transmitter to transmit terahertz waves to the circuit to be detected, packaged and integrated;
the image processing platform is also used for acquiring a terahertz spectrogram reflected by the circuit to be detected and packaged into an integrated circuit, analyzing the terahertz spectrogram to obtain corresponding terahertz spectrum data, and comparing the obtained data with preset comparison data in a database to generate an actual result image;
zooming the actual result image, extracting a characteristic value according to a preset rule, comparing the characteristic value in the actual result with a corresponding characteristic value preset in a rule base, generating a comparison result report and displaying the comparison result report on the display screen;
if the characteristic value in the actual result is the same as the corresponding characteristic value preset in the rule base, the circuit of the packaged integration to be detected is qualified;
otherwise, the packaged integrated circuit to be detected is unqualified.
9. The inspection apparatus for semiconductor according to claim 1, wherein:
a pressure sensor is arranged on the control handle (12);
the cover plate (7) is provided with a warning lamp and a central processor;
the pressure sensor and the warning lamp are connected with the central processor;
the pressure sensor is used for calculating the friction force between a target user and the cover plate (7) when the target user opens the cover plate (7), the central processor calculates the friction torque of the control handle (12) according to the friction force, and the specific steps comprise:
the pressure sensor is used for calculating the friction force between the target user and the cover plate (7) according to the following formula:
wherein F represents the friction between the target user and the cover plate (7) when the cover plate (7) is opened; representing a coefficient of sliding friction of the steering grip (12);
the sensitivity coefficient of the pressure sensor is represented, and the value range is [0.5, 0.8 ]](ii) a f represents an external force value provided by opening the cover plate (7); m represents the mass of the cover plate (7); g represents the acceleration of gravity and takes 9.8m/s2(ii) a Sigma represents the external force correction coefficient for opening the cover plate (7), and the value range is [0.4, 0.7 ]](ii) a Theta represents the included angle value between the external force and the vertical direction;
the central processor is further configured to calculate a friction torque of the manipulation grip (12) according to the following formula:
wherein L represents a friction torque of the manipulation grip (12); a represents a static friction coefficient of the manipulation grip (12); beta represents the included angle value formed between the control handle (12) and the applied external force when the cover plate (7) is opened; f represents the friction force required for opening the cover plate (7); l represents the length of the manipulation grip (12);
the central processor compares the calculated friction torque with a preset friction torque;
if the friction torque is smaller than the preset friction torque, the central processor controls the warning lamp to perform first flashing reminding to remind that the applied external force value is increased;
otherwise, the central processor controls the warning lamp to carry out second flicker reminding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010974707.8A CN112098360A (en) | 2020-09-16 | 2020-09-16 | Detection device for semiconductor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010974707.8A CN112098360A (en) | 2020-09-16 | 2020-09-16 | Detection device for semiconductor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117571621A (en) * | 2024-01-16 | 2024-02-20 | 南京百阳垦生物技术有限责任公司 | Compound fertilizer component detection device based on spectrum detection and application method thereof |
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2020
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117571621A (en) * | 2024-01-16 | 2024-02-20 | 南京百阳垦生物技术有限责任公司 | Compound fertilizer component detection device based on spectrum detection and application method thereof |
| CN117571621B (en) * | 2024-01-16 | 2024-03-22 | 南京百阳垦生物技术有限责任公司 | Compound fertilizer component detection device based on spectrum detection and application method thereof |
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Application publication date: 20201218 |