CN112097922A - Based on infrared temperature measurement module of thermopile - Google Patents
Based on infrared temperature measurement module of thermopile Download PDFInfo
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- CN112097922A CN112097922A CN202010999675.7A CN202010999675A CN112097922A CN 112097922 A CN112097922 A CN 112097922A CN 202010999675 A CN202010999675 A CN 202010999675A CN 112097922 A CN112097922 A CN 112097922A
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- 238000009529 body temperature measurement Methods 0.000 title claims abstract description 32
- 239000000306 component Substances 0.000 claims description 15
- 239000008358 core component Substances 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 11
- 208000010668 atopic eczema Diseases 0.000 claims description 4
- 230000003993 interaction Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 230000000172 allergic effect Effects 0.000 claims description 3
- 239000005387 chalcogenide glass Substances 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 230000036760 body temperature Effects 0.000 abstract 1
- 238000001035 drying Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000004146 energy storage Methods 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 210000004243 sweat Anatomy 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0205—Mechanical elements; Supports for optical elements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
- G01J5/14—Electrical features thereof
- G01J5/16—Arrangements with respect to the cold junction; Compensating influence of ambient temperature or other variables
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
- G01J2005/123—Thermoelectric array
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Radiation Pyrometers (AREA)
Abstract
The invention discloses a thermopile-based infrared temperature measurement module, and relates to the technical field of body temperature measurement; the problem that temperature measurement is greatly influenced by distance is solved; the device comprises a core assembly and a placement assembly, wherein the core assembly comprises a device box and an MCU processor control board, and a thermopile infrared sensing chip, a distance sensing module, a high-precision NTC chip, a matching module and an external equipment interface are electrically installed on the outer wall of the top of the MCU processor control board; and a driving module is arranged in the MCU processor control panel and comprises a temperature calculation program and an environment compensation program. The matching module can amplify or reduce the body temperature measured in the centimeter range, and simultaneously, the measured temperature error is smaller than 0.1 ℃ by matching with an environment compensation program and a temperature calculation program.
Description
Technical Field
The invention relates to the technical field of body temperature measurement, in particular to an infrared temperature measurement module based on a thermopile.
Background
The existing infrared temperature measuring instrument mostly directly adopts a temperature sensor form to collect data, lacks a corresponding compensation mechanism, a small part uses the temperature measuring instrument of a thermopile technology, and also has the problem of environment limitation, and the systematic solution of the problems just needs a novel thermopile-based infrared temperature measuring module.
Through retrieval, chinese patent application No. 201610100597.6 discloses a non-contact cubical switchboard contact infrared thermopile temperature measurement ring, includes: the infrared thermopile temperature measuring device comprises a circular ring-shaped shell, an induction electricity taking device, an energy storage and power supply processing circuit, a signal acquisition and processing circuit and a wireless transceiving unit, wherein the induction electricity taking device, the energy storage and power supply processing circuit, the signal acquisition and processing circuit and the wireless transceiving unit are positioned in the shell, the energy storage and power supply processing circuit, the signal acquisition and processing circuit and the wireless transceiving unit are sequentially connected, and the signal acquisition and processing circuit is also connected with an infrared thermopile sensor to form an. The above patents suffer from the following disadvantages: lack the distance conversion mechanism, lead to the temperature data of remote collection can't carry out multiple regulation and control, and then make the temperature value that calculates based on this data great with actual conditions deviation, and under the unable prerequisite that realizes of distance conversion, the initial data that obtains of this instrument receives the environmental disturbance great.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides an infrared temperature measurement module based on a thermopile.
In order to achieve the purpose, the invention adopts the following technical scheme:
a thermopile-based infrared temperature measurement module comprises a core component and a placement component, wherein the core component comprises a device box and an MCU (microprogrammed control Unit) processor control board, and a thermopile infrared sensing chip, a distance sensing module, a high-precision NTC (negative temperature coefficient) chip, a matching module and an external equipment interface are electrically installed on the outer wall of the top of the MCU processor control board; and a driving module is arranged in the MCU processor control panel and comprises a temperature calculation program and an environment compensation program.
Preferably: the device box is internally provided with a dryer and a heating element, the dryer and the heating element are electrically connected with the MCU processor control board, and the outer wall of the top of the MCU processor control board is welded with an allergic resistor.
Further: the external equipment interface is connected with external equipment through a data line.
On the basis of the scheme: the external equipment interface communicates with the peripheral equipment by using a UART or IIC data interaction protocol.
The better scheme in the scheme is as follows: the thermopile infrared sensing chip is provided with a base, and the front end of the thermopile infrared sensing chip is provided with a packaged silicon lens, a packaged germanium lens or a packaged chalcogenide glass lens optical component.
As a further scheme of the invention: the MCU treater control panel material is flexible line way board or ultra-thin circuit board, and the thickness of this material is 0.8 millimeter or 1.0 millimeter.
And simultaneously, the inside humidity transducer and the temperature sensor that are provided with of device box, humidity transducer and temperature sensor all with MCU treater control panel electric connection.
As a preferable aspect of the present invention: the inner wall of the top of the device box is provided with a voice broadcaster and a data display screen, and the voice broadcaster and the data display screen are both electrically connected with the MCU processor control board; the MCU processor control panel is electrically connected with an external system module.
Meanwhile, the thermopile infrared sensing chip is packaged in a COB or CSP mode.
As a more preferable scheme of the invention: settle the subassembly and include fixed plate and fixed column, device box one side outer wall fixed connection is in fixed capital one side outer wall, fixed column one side outer wall fixed connection is in the fixed plate, the inner wall is seted up flutedly in the middle of the fixed plate, recess inner wall fixedly connected with casing, casing both sides inner wall fixedly connected with center pillar, center pillar outer wall swing joint has the spring, spring both ends outer wall fixedly connected with movable block, movable block one side outer wall fixedly connected with armful board, the quantity of armful board is two, and the installation opposite direction, the shape of armful board is C shape, armful inboard wall is fixedly connected with cushion one and cushion two respectively, fixed plate one side outer wall fixedly connected with slide rail, the slide rail cooperation is used there is the slider, slider one side outer.
The invention has the beneficial effects that:
1. the thermopile-based infrared temperature measurement module comprises a matching module, a distance sensor and a thermopile infrared sensor, wherein the matching module can automatically measure the temperature of a human body and measure the temperature of the human body in real time; furthermore, the thermopile infrared sensing chip is synchronously matched with the high-precision NTC chip for use, and the cold end temperature value of the thermopile infrared sensing chip is obtained and used for accurately calculating the target temperature value.
2. This based on infrared temperature measurement module of thermopile through adopting flexible line way board or ultra-thin circuit board, can make things convenient for relevant components and parts to encapsulate on MCU treater control panel with specific mode, and be difficult for droing, and is comparatively firm, and the thinner panel of thickness simultaneously can reduce the space of core subassembly in the device box and occupy for the whole size of device box can be dwindled, makes things convenient for personnel to carry, alleviates whole weight simultaneously, thereby alleviates the burden of carrying.
3. This one kind is based on infrared temperature measurement module of thermopile, through setting up drying apparatus and heating components and parts, one of them, can utilize the drying apparatus to make the inside whole environment of device box be in dry state, it is impaired to avoid the moisture of unit gas spare, especially carrying and use in-process, inside human sweat can get into the device box through the steam form, make the component wet, and this condition can be avoidd to the drying apparatus, the while heats components and parts, through the mode of heating stabilization temperature, make the temperature of thermopile cold junction be in the constant state, rely on the physics means to carry out temperature compensation.
4. According to the thermopile-based infrared temperature measurement module, the humidity sensor, the temperature sensor, the voice broadcaster and the data display screen are arranged, so that a core component can carry out independent temperature detection and report prompt, and meanwhile, the module is interacted with electronic products such as a mobile phone of a user by virtue of an external system module, so that data are transmitted; the human-computer optimization is realized, the selection of a user is facilitated, and the device can be used independently and can be used by depending on the assistance of an electronic product.
5. This kind of based on infrared temperature measurement module of thermopile, through setting up spring and center pillar, the center pillar can avoid the spring to bend at will and lead to replying the effect variation, and the setting of center pillar can provide the track for the motion of movable block simultaneously, avoids removing the transfinite, and further relies on the spring to stretch out and draw back, can realize embracing the arbitrary adjustment of relative distance of board, and then can satisfy the clamp to arbitrary external equipment tightly, and then enlarge the application scope of this kind of module.
Drawings
FIG. 1 is a schematic diagram of electrical connection of a thermopile-based infrared temperature measurement module according to the present invention;
FIG. 2 is a schematic diagram of an overall structure of a thermopile-based infrared temperature measurement module according to the present invention;
FIG. 3 is a schematic structural diagram of a mounting assembly based on a thermopile infrared temperature measurement module according to the present invention;
FIG. 4 is a schematic structural diagram of a device case based on a thermopile infrared temperature measurement module according to the present invention;
fig. 5 is a schematic structural diagram of a thermopile infrared sensor based on a thermopile infrared temperature measurement module according to the present invention.
In the figure: 1-core component, 2-dryer, 3-humidity sensor, 4-temperature sensor, 5-allergic resistor, 6-heating component, 7-MCU processor control board, 8-thermopile infrared sensor, 9-distance sensor, 10-matching module, 11-driving module, 12-external equipment interface, 13-voice broadcast device, 14-data display screen, 15-external system module, 16-shell, 17-center column, 18-movable block, 19-holding plate, 20-rubber cushion I, 21-rubber cushion II, 22-slide rail, 23-slide block, 24-spring, 25-fixing plate, 26-fixing column.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.
In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," "disposed," and "electrically connected" are to be construed broadly and may include, for example, fixedly connected, disposed, detachably connected, disposed, integrally connected, disposed, or wired, data-line, pin-point, etc. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
A thermopile-based infrared temperature measurement module is shown in figures 1-5 and comprises a core component 1 and a placement component, wherein the core component 1 comprises a device box and an MCU (microprogrammed control Unit) processor control board 7, and a thermopile infrared sensing chip, a distance sensing module, a high-precision NTC (negative temperature coefficient) chip, a matching module 10 and an external equipment interface 12 are electrically installed on the outer wall of the top of the MCU processor control board 7, wherein the thermopile infrared sensing chip is electrically connected with a thermopile infrared sensor 8, and the distance sensing module is electrically connected with a distance sensor 9; a driving module 11 is arranged in the MCU processor control board 7, and the driving module 11 comprises a temperature calculation program and an environment compensation program; the temperature measuring module comprises a matching module 10, a distance sensor 9 and a thermopile infrared sensor 8, wherein one of the matching module 10, the distance sensor 9 and the thermopile infrared sensor 8 can automatically measure the temperature of a human body and measure the temperature of the human body in real time, the matching module 10 can amplify or reduce the temperature of the human body measured in a range of 3-100 cm and is matched with an environment compensation program and a temperature calculation program to enable the measured temperature error to be smaller than 0.1 ℃, and the other one of the matching module 10, the distance sensor 9 and the thermopile infrared sensor is assisted by the environment compensation program to enable the environment temperature interference of the module during measurement to be reduced to the minimum; furthermore, the thermopile infrared sensing chip is synchronously matched with the high-precision NTC chip for use, and the cold end temperature value of the thermopile infrared sensing chip is obtained and used for accurately calculating the target temperature value.
In order to solve the problem of internal assembly of the core assembly 1; as shown in fig. 1, 2, 4 and 5, a dryer 2 and a heating element 6 are arranged inside the device box, the dryer 2 and the heating element 6 are both electrically connected with an MCU processor control board 7, and an allergic resistor 5 is welded on the outer wall of the top of the MCU processor control board 7; the external equipment interface 12 is connected with external equipment through a data line; the external equipment interface 12 communicates with the external equipment by using a UART or IIC data interaction protocol; the thermopile infrared sensing chip is provided with a base, and the front end of the thermopile infrared sensing chip is provided with optical components such as a silicon lens, a germanium lens or a chalcogenide glass lens which can be well packaged and can penetrate through a human body infrared wave band lens; the MCU processor control board 7 is made of a flexible circuit board or an ultrathin circuit board, and the thickness of the material is 0.8 mm or 1.0 mm; by adopting the flexible circuit board or the ultrathin circuit board, related components can be conveniently packaged on the MCU processor control board 7 in a specific mode, the components are not easy to fall off and are relatively stable, and meanwhile, the board with the thinner thickness can reduce the space occupation of the core component 1 in the device box, so that the whole size of the device box can be reduced, the device box is convenient for personnel to carry, and the whole weight is reduced, thereby reducing the carrying burden; through setting up drying apparatus 2 and heating components and parts 6, one of them, can utilize drying apparatus 2 to make the inside whole environment of device box be in dry state, avoid the moisture of elementary gas spare impaired, especially carrying and use in, inside human sweat can get into the device box through the steam form, make the component wet, and drying apparatus 2 can avoid this condition, heat components and parts 6 simultaneously, through the mode of heating stable temperature, make the temperature of thermopile cold junction be in the constant state, rely on the physics means to carry out temperature compensation.
In order to solve the problem of man-machine interaction; as shown in fig. 1 and 2, a humidity sensor 3 and a temperature sensor 4 are arranged inside the device box, and both the humidity sensor 3 and the temperature sensor 4 are electrically connected with an MCU processor control board 7; a voice broadcaster 13 and a data display screen 14 are arranged on the inner wall of the top of the device box, and the voice broadcaster 13 and the data display screen 14 are both electrically connected with the MCU processor control board 7; the MCU processor control board 7 is electrically connected with an external system module 15; the thermopile infrared sensing chip is packaged in a COB or CSP mode; by arranging the humidity sensor 3, the temperature sensor 4, the voice broadcaster 13 and the data display screen 14, the core component 1 can carry out independent temperature detection and report prompt, and meanwhile, the core component interacts with electronic products such as a mobile phone of a user by means of an external system module 15, so that data are transmitted; the human-computer optimization is realized, the selection of a user is facilitated, and the device can be used independently and can be used by depending on the assistance of an electronic product.
To solve the problem of being disposed above an external device; as shown in fig. 1, 2 and 3, the mounting assembly includes a fixing plate 25 and a fixing column 26, an outer wall of one side of the device box is fixedly connected to an outer wall of one top side of the fixing column 26, an outer wall of one side of the fixing column 26 is fixedly connected to the fixing plate 25, a groove is formed in an inner wall of the middle of the fixing plate 25, a housing 16 is fixedly connected to an inner wall of the groove, inner walls of two sides of the housing 16 are fixedly connected to a center pillar 17, a spring 24 is movably connected to an outer wall of the center pillar 17, outer walls of two ends of the spring 24 are fixedly connected to a movable, the mounting directions are opposite, the holding plate 19 is C-shaped, the inner wall of the holding plate 19 is fixedly connected with a first rubber cushion 20 and a second rubber cushion 21 respectively, the outer wall of one side of the fixed plate 25 is fixedly connected with a slide rail 22, the slide rail 22 is matched with a slide block 23, and the outer wall of one side of the slide block 23 is fixedly connected with the outer wall of one side of the holding plate 19; through setting up spring 24 and well post 17, well post 17 can avoid spring 24 to bend at will and lead to replying the effect variation, and the setting up of well post 17 can provide the track for the motion of movable block 18 simultaneously, avoids removing the transfinite, and further relies on spring 24 flexible, can realize embracing arbitrary adjustment of relative distance of board 19, and then can satisfy the clamp tight to arbitrary external equipment, and then enlarge the application scope of this kind of module.
This embodiment is when using, earlier through settling the subassembly, be fixed in on the external equipment with this kind of module, for example the cell-phone, simultaneously connect external equipment and core component 1 through the data line, through regulation and control external equipment or core component 1, start-up module, body temperature measurement carries out, thermopile infrared sensor 8 surveys the target temperature, rely on the thermopile principle to produce the difference in temperature, and with the signal passback, simultaneously apart from inductor 9 and matching module 10 can be to the target distance far and near, carry out data correction, passback signal to MCU treater control panel 7 simultaneously, rely on drive module 11 to carry out temperature compensation calculation afterwards, obtain final temperature data.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (10)
1. A thermopile-based infrared temperature measurement module comprises a core component (1) and a placement component, and is characterized in that the core component (1) comprises a device box and an MCU (microprogrammed control unit) processor control board (7), wherein a thermopile infrared sensing chip, a distance sensing module, a high-precision NTC (negative temperature coefficient) chip, a matching module (10) and an external equipment interface (12) are electrically installed on the outer wall of the top of the MCU processor control board (7), wherein the thermopile infrared sensing chip is electrically connected with a thermopile infrared sensor (8), and the distance sensing module is electrically connected with a distance sensor (9); the MCU processor control panel (7) is internally provided with a driving module (11), and the driving module (11) comprises a temperature calculation program and an environment compensation program.
2. The thermopile-based infrared temperature measurement module according to claim 1, wherein a dryer (2) and a heating element (6) are arranged inside the device box, the dryer (2) and the heating element (6) are both electrically connected with the MCU processor control board (7), and the outer wall of the top of the MCU processor control board (7) is welded with an allergic resistor (5).
3. The thermopile-based infrared temperature measurement module according to claim 1, wherein the external device interface (12) is connected to an external device via a data line.
4. The thermopile-based infrared temperature measurement module according to claim 1, wherein the external device interface (12) communicates with an external device via UART or IIC data interaction protocol.
5. The thermopile-based infrared temperature measurement module according to claim 1, wherein the thermopile infrared sensing chip is mounted with a base, and the front end thereof is provided with an optical assembly packaged with a silicon lens, a germanium lens or a chalcogenide glass lens.
6. The thermopile-based infrared temperature measurement module according to claim 1, wherein the MCU processor control board (7) is made of a flexible circuit board or an ultra-thin circuit board, and the thickness of the material is 0.8 mm or 1.0 mm.
7. The thermopile-based infrared temperature measurement module according to claim 1, wherein a humidity sensor (3) and a temperature sensor (4) are arranged inside the device box, and both the humidity sensor (3) and the temperature sensor (4) are electrically connected with the MCU processor control board (7).
8. The thermopile-based infrared temperature measurement module according to claim 1, wherein a voice broadcaster (13) and a data display screen (14) are disposed on the inner wall of the top of the device box, and both the voice broadcaster (13) and the data display screen (14) are electrically connected to the MCU processor control board (7); the MCU processor control panel (7) is electrically connected with an external system module (15).
9. The thermopile-based infrared temperature measurement module of claim 1, wherein the thermopile infrared sensing chip is packaged in a COB or CSP manner.
10. The thermopile-based infrared temperature measurement module according to claim 1, wherein the mounting assembly comprises a fixing plate (25) and a fixing column (26), an outer wall of one side of the device case is fixedly connected to an outer wall of one top side of the fixing column (26), an outer wall of one side of the fixing column (26) is fixedly connected to the fixing plate (25), a groove is formed in an inner wall of the middle of the fixing plate (25), a housing (16) is fixedly connected to an inner wall of two sides of the housing (16), a center pillar (17) is fixedly connected to an outer wall of the center pillar (17), a spring (24) is movably connected to an outer wall of two ends of the spring (24), a movable block (18) is fixedly connected to an outer wall of one side of the movable block (18), two holding plates (19) are provided, the mounting directions are opposite, the holding plates (19) are C-shaped, a first rubber pad (20) and a second rubber pad, the outer wall of one side of the fixed plate (25) is fixedly connected with a sliding rail (22), the sliding rail (22) is matched with a sliding block (23), and the outer wall of one side of the sliding block (23) is fixedly connected with the outer wall of one side of the holding plate (19).
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112857586A (en) * | 2021-01-08 | 2021-05-28 | 深圳市华能智创科技有限公司 | Infrared temperature measuring device based on fpga and temperature compensation calibration method |
| CN113432716A (en) * | 2021-01-25 | 2021-09-24 | 莫远豪 | Infrared temperature measurement module based on thermopile and temperature measurement method thereof |
| CN113616916A (en) * | 2021-09-14 | 2021-11-09 | 深圳市鑫辉微电子有限公司 | Remote auto-induction temperature measurement hand washing and sterilizing integrated machine |
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| CN111637978A (en) * | 2020-06-24 | 2020-09-08 | 南京信息工程大学 | Digital infrared temperature sensor of DFN encapsulation |
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