CN112091450A - Chip processing device - Google Patents

Chip processing device Download PDF

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Publication number
CN112091450A
CN112091450A CN202011029393.0A CN202011029393A CN112091450A CN 112091450 A CN112091450 A CN 112091450A CN 202011029393 A CN202011029393 A CN 202011029393A CN 112091450 A CN112091450 A CN 112091450A
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CN
China
Prior art keywords
motor
chip
fixed
supporting plate
laser cutting
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Withdrawn
Application number
CN202011029393.0A
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Chinese (zh)
Inventor
陈圆圆
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Hefei Highland Creative Technology Co ltd
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Hefei Highland Creative Technology Co ltd
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Application filed by Hefei Highland Creative Technology Co ltd filed Critical Hefei Highland Creative Technology Co ltd
Priority to CN202011029393.0A priority Critical patent/CN112091450A/en
Publication of CN112091450A publication Critical patent/CN112091450A/en
Withdrawn legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0426Fixtures for other work
    • B23K37/0435Clamps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67282Marking devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention discloses a chip processing device which comprises a laser cutting mechanism, a turnover mechanism and a collecting mechanism, wherein the left side wall of a bearing frame is connected with a first fastener through a mounting frame in a threaded manner, the turnover mechanism is fixed on a base, and the collecting mechanism is arranged on the upper end surface of the base. This chip processingequipment, laser cutting machine can be along with the second slider back-and-forth movement together, the vertical cutting operation of convenient control level, the second slider can be removed along with first slider is removed together, thereby it removes to drive the laser cutting machine, the horizontal transverse cutting operation of convenient control laser cutting machine, so that cut out appointed shape, accomplish all cutting operation backs, the sucking disc is along with the sucking pump downstream together, the sucking disc plays the absorbent effect of support to the chip that cuts off, leftover bits remain simultaneously and puts the thing frame, later change board upset 180 degrees, the chip is located the bottom of sucking disc, the chip is loosened to the sucking disc after, the chip drops thereupon, convenient collection.

Description

Chip processing device
Technical Field
The invention relates to the technical field of chip processing, in particular to a chip processing device.
Background
In order to distinguish the type of a chip from another chip, the chip needs to be clearly engraved on the chip, and thus a chip processing apparatus is required.
Disclosure of Invention
The invention aims to provide a chip processing device, wherein chips of different models can play different functions, and in order to better distinguish the models of the chips, the models need to be clearly engraved on the chips, so that the chip processing device is needed.
In order to achieve the purpose, the invention provides the following technical scheme: a chip processing device, which comprises a laser cutting mechanism, a turnover mechanism and a collecting mechanism,
the laser cutting mechanism is arranged in the top of the bearing frame, the bearing frame is fixed on the base, the left side wall of the bearing frame is connected with a first fastener through the thread of the mounting frame, and the right side of the mounting frame is fixed with a storage frame;
the turnover mechanism is fixed on the base and is positioned at the lower side of the storage frame;
the collecting mechanism is arranged on the upper end face of the base and is located on the inner side of the turnover mechanism.
Preferably, laser cutting mechanism includes first motor, first motor shaft, first lead screw, first slider, second motor shaft, second lead screw, second slider and laser cutting machine, and first motor is fixed in the top of bearing the frame, and the right side of first motor is connected with first lead screw through the rotation of first motor shaft simultaneously, first lead screw threaded connection is on first slider, and first slider sliding connection is at the interior top of bearing the frame.
Preferably, the rear side of the first slider is fixed with a second motor, the front side of the second motor is rotatably connected with a second lead screw through a second motor shaft, the second lead screw is in threaded connection with the second slider, the second slider is in sliding connection with the lower end face of the first slider, and a laser cutting machine is fixed at the bottom of the second slider.
Preferably, the turnover mechanism comprises a first support, a third motor shaft, a rotating plate, a second support, a hydraulic cylinder, a piston rod, a support plate, a bolt, a suction pump, a second fastener and a sucker, wherein the first support and the second support are fixed on the base, the first support is positioned on the left side of the second support, and the rotating plate is rotatably connected between the first support and the second support.
Preferably, a third motor is fixed on the left side of the first support, and a rotating plate is rotatably connected to the right side of the third motor through a third motor shaft.
Preferably, the left side and the right side of the upper end face of the rotating plate are both fixed with hydraulic cylinders, the upper sides of the hydraulic cylinders are connected with the supporting plate through piston rods, and the supporting plate is connected to the piston rods through bolt threads.
Preferably, the bottom of the suction pump penetrates through the supporting plate and is in threaded connection with a second fastener, the top of the suction pump is fixedly provided with a sucker, and the suction pumps are uniformly distributed on the supporting plate.
Preferably, the collecting mechanism comprises a supporting plate, a sliding groove, clamping columns, a collecting box, a pull handle, a bolt and a bolt hole, the bottom of the supporting plate is connected in the sliding groove in a sliding mode, the sliding groove is formed in the front side and the rear side of the upper end face of the base, the collecting box is connected to the clamping columns in a clamping mode, and the clamping columns are fixed to the front side and the rear side of the upper end face of the supporting plate.
Preferably, the bolt runs through and draws the block of handle to be connected in the bolt is downthehole, and draws the handle to fix at the right end face of layer board, and the bolt hole is seted up at the up end of base simultaneously.
Compared with the prior art, the beneficial effects of the invention are that: the chip processing device is provided with a chip processing device,
(1) the chip packaging device is provided with the storage frame, the supporting plate, the suction pump and the suction disc, after the whole chip is placed in the storage frame, the suction pump moves upwards along with the supporting plate until the suction disc contacts the chip, and then the suction disc adsorbs the chip, so that the stability of the chip is improved conveniently;
(2) the laser cutting machine can move back and forth along with the second slide block, so that horizontal longitudinal cutting operation is convenient to control, meanwhile, the second slide block can move left and right along with the first slide block, so that the laser cutting machine is driven to move left and right, and horizontal transverse cutting operation of the laser cutting machine is convenient to control, so that a specified shape can be cut;
(3) the cutting device is provided with a storage frame, a rotating plate, a suction pump and a suction disc, after all cutting operations are completed, the suction disc moves downwards along with the suction pump, the suction disc plays a role in supporting and adsorbing the cut chips, meanwhile, leftover materials remain in the storage frame, the rotating plate is turned over for 180 degrees, the chips are located at the bottom of the suction disc, then the chips are loosened by the suction disc, and the chips fall off along with the rotation plate, so that the chips are convenient to collect;
(4) the chip collecting device is provided with a turnover mechanism, a supporting plate, a collecting box, a pull handle, a bolt and a bolt hole, after a chip falls into the collecting box, a worker can pull out the bolt, hold the pull handle by hand and pull out the supporting plate rightwards to take the collecting box from the supporting plate, replace a new collecting box after the operation of taking the collecting box is completed, then push the supporting plate back to the inner side of the turnover mechanism, finally connect the bolt in the bolt hole in a clamping manner through the pull handle, and conveniently limit and fix the supporting plate;
(5) be provided with and put thing frame, mounting bracket, first fastener, bolt, suction pump and second fastener, can dismantle thing frame and mounting bracket are whole after unscrewing first fastener, can dismantle the suction pump after unscrewing bolt and second fastener, convenient maintenance or change.
Drawings
FIG. 1 is a schematic front sectional view of the present invention;
FIG. 2 is a schematic front view of the present invention;
FIG. 3 is a schematic diagram of a right-side cross-sectional structure of the present invention;
FIG. 4 is a schematic top cross-sectional view of the present invention;
FIG. 5 is a schematic view of the connection structure of the supporting plate, the sliding groove, the clamping column, the collecting box, the pull handle and the bolt of the present invention;
FIG. 6 is an enlarged view of the structure at A in FIG. 1 according to the present invention.
In the figure: 1. the laser cutting machine comprises a base, 2, a bearing frame, 3, a laser cutting mechanism, 301, a first motor, 302, a first motor shaft, 303, a first screw rod, 304, a first sliding block, 305, a second motor, 306, a second motor shaft, 307, a second screw rod, 308, a second sliding block, 309, a laser cutting machine, 4, a storage frame, 5, a mounting frame, 6, a first fastener, 7, a turnover mechanism, 701, a first support, 702, a third motor, 703, a third motor shaft, 704, a rotating plate, 705, a second support, 706, a hydraulic cylinder, 707, a piston rod, 708, a supporting plate, 709, a bolt, 710, a suction pump, 711, a second fastener, 712, a suction cup, 8, a collecting mechanism, 801, a supporting plate, 802, a sliding groove, 803, a clamping column, 804, a collecting box, 805, a pull handle, 806, a bolt, 807 and a bolt hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: a chip processing device is disclosed, according to the figure 1, figure 2 and figure 3, a laser cutting mechanism 3 is arranged in the top of a bearing frame 2, the bearing frame 2 is fixed on a base 1, the laser cutting mechanism 3 comprises a first motor 301, a first motor shaft 302, a first screw rod 303, a first slide block 304, a second motor 305, a second motor shaft 306, a second screw rod 307, a second slide block 308 and a laser cutting machine 309, the first motor 301 is fixed in the top of the bearing frame 2, meanwhile, the right side of the first motor 301 is rotatably connected with the first screw rod 303 through the first motor shaft 302, the first screw rod 303 is in threaded connection with the first slide block 304, the first slide block 304 is in sliding connection with the inner top of the bearing frame 2, the first screw rod 303 can rotate under the action of the first motor 301 and the first motor shaft 302, the first slide block 304 can slide left and right under the limiting action of the bearing frame 2 and the first screw rod 303, the laser cutting machine 309 moves left and right along with the same, so that the horizontal and transverse cutting operation of the laser cutting machine 309 is conveniently controlled, a second motor 305 is fixed at the rear side of the first sliding block 304, and the front side of the second motor 305 is rotatably connected with a second lead screw 307 through a second motor shaft 306, the second lead screw 307 is in threaded connection with a second slide block 308, the second slide block 308 is in sliding connection with the lower end surface of the first slide block 304, meanwhile, the bottom of the second slide block 308 is fixed with a laser cutting machine 309, the second screw 307 can rotate under the action of the second motor 305 and the second motor shaft 306, the second slide block 308 can slide back and forth under the limiting action of the first slide block 304 and the second screw 307, thereby drive laser cutting machine 309 back-and-forth movement, conveniently control the horizontal vertical cutting operation of laser cutting machine 309, the left side wall that bears frame 2 runs through 5 threaded connection of mounting bracket has first fastener 6, and the right side of mounting bracket 5 is fixed with puts thing frame 4.
Referring to fig. 1, 2, 3 and 4, the turnover mechanism 7 is fixed on the base 1, the turnover mechanism 7 is located at the lower side of the storage frame 4, the turnover mechanism 7 includes a first bracket 701, a third motor 702, a third motor shaft 703, a rotating plate 704, a second bracket 705, a hydraulic cylinder 706, a piston rod 707, a support plate 708, a bolt 709, a suction pump 710, a second fastener 711 and a suction cup 712, the first bracket 701 and the second bracket 705 are both fixed on the base 1, the first bracket 701 is located at the left side of the second bracket 705, the rotating plate 704 is rotatably connected between the first bracket 701 and the second bracket 705, the first bracket 701 and the second bracket 705 support the rotating plate 704, the third motor 702 is fixed at the left side of the first bracket 701, the rotating plate 704 is rotatably connected at the right side of the third motor shaft 703, after the complete cutting operation of the chip is completed, the cut chip is sucked down by the suction cup 712, leftover materials are remained in the storage frame 4, then the rotating plate 704 can be turned over for 180 degrees under the action of the third motor 702 and the third motor shaft 703, the blanking operation is convenient to be finished, hydraulic cylinders 706 are fixed on the left side and the right side of the upper end surface of the rotating plate 704, the upper sides of the hydraulic cylinders 706 are connected with a supporting plate 708 through piston rods 707, meanwhile, the supporting plate 708 is connected to the piston rod 707 through the bolt 709 in a threaded manner, the supporting plate 708 can be fixed to the piston rod 707 by tightening the bolt 709, then the supporting plate 708 can move up and down under the action of the hydraulic cylinder 706 and the piston rod 707, so that the chip can be conveniently adsorbed and the cut chip can be driven to move down, the bottom of the suction pump 710 penetrates through the supporting plate 708 in a threaded manner to be connected with a second fastening piece 711, and the top of the suction pump 710 is fixed with a suction cup 712, meanwhile, the suction pumps 710 are uniformly distributed on the support plate 708, and the suction cups 712 on the uniformly distributed suction pumps 710 can absorb more cut chips.
As shown in fig. 1, 2, 5 and 6, the collecting mechanism 8 is disposed on the upper end surface of the base 1, the collecting mechanism 8 is disposed inside the turnover mechanism 7, the collecting mechanism 8 includes a supporting plate 801, a sliding groove 802, a clamping column 803, a collecting box 804, a pull handle 805, a latch 806 and a latch hole 807, the bottom of the supporting plate 801 is slidably connected in the sliding groove 802, the sliding groove 802 is opened on the front and rear sides of the upper end surface of the base 1, the collecting box 804 is connected to the clamping column 803 in a snap-fit manner, the clamping column 803 is fixed on the front and rear sides of the upper end surface of the supporting plate 801, the latch 803 plays a role in limiting the snap-fit manner for the collecting box 804, after the cut chips are collected, the worker can pull out the latch 806, after holding the pull handle 805 to the right and pulling out the supporting plate 801, the collecting box 804 can be taken out from the supporting plate 801, the latch 806 is connected in the latch hole 807 in a snap-, meanwhile, the bolt holes 807 are formed in the upper end face of the base 1, a new collecting box 804 can be replaced after the collecting box 804 is taken, then the supporting plate 801 can be pushed back to the inner side of the turnover mechanism 7, and finally the bolts 806 penetrate through the pull handles 805 to be connected in the bolt holes 807 in a clamping mode, so that the supporting plate 801 is conveniently limited and fixed.
The working principle of the embodiment is as follows: when the chip processing device is used, an external power supply is connected, the whole chip is placed in the storage frame 4, then the hydraulic cylinder 706 is started, the hydraulic cylinder 706 drives the piston rod 707 to extend, the suction pump 710 moves upwards along with the supporting plate 708 until the suction cup 712 contacts the chip, then the suction pump 710 is started, the suction cup 712 adsorbs the chip, the stability of the chip is conveniently improved, then the laser cutting machine 309 is started, the whole chip is conveniently cut, meanwhile, the first motor 301 and the second motor 305 are started, the first motor 301 drives the first motor shaft 302 to rotate, so as to drive the first screw rod 303 to rotate, the first sliding block 304 slides back and forth under the limiting action of the bearing frame 2 and the first screw rod 303, so as to drive the second sliding block 308 to move back and forth, the laser cutting machine 309 moves back and forth along with the first screw rod 303 to control horizontal and longitudinal cutting operation, the second motor 305 drives the second motor shaft 306, thereby driving the second screw rod 307 to rotate, the second slide block 308 slides left and right under the limit action of the first slide block 304 and the second screw rod 307, thereby driving the laser cutting machine 309 to move left and right, thereby controlling the horizontal transverse cutting operation of the laser cutting machine 309, facilitating the cutting of a designated shape, after all the cutting operations are completed, the piston rod 707 contracts, the suction cup 712 moves downwards along with the suction pump 710, the suction cup 712 plays a role in supporting and adsorbing the cut chip, meanwhile, leftover materials remain in the storage frame 4, then the third motor 702 is started, the third motor 702 drives the third motor shaft 703 to rotate, thereby driving the rotating plate 704 to turn over by 180 degrees, the chip is positioned at the bottom of the suction cup 712, then the chip falls into the collecting box 804, then, a worker pulls down the bolt 806, holds the pull handle 805 by hand to pull out the supporting plate 801 rightwards, and then the collecting box 804 can be taken out from the supporting plate 801, after the collecting box 804 is taken, a new collecting box 804 can be replaced, the supporting plate 801 can be pushed back to the inner side of the turnover mechanism 7, finally, the bolt 806 penetrates through the pulling handle 805 to be clamped and connected in the bolt hole 807, the supporting plate 801 is conveniently limited and fixed, the object placing frame 4 and the mounting frame 5 can be integrally disassembled after the first fastener 6 is unscrewed, the suction pump 710 can be disassembled after the bolt 709 and the second fastener 711 are unscrewed, maintenance and repair or replacement are convenient, and the content which is not described in detail in the specification belongs to the prior art which is known by persons skilled in the art.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.

Claims (9)

1. The utility model provides a chip processingequipment, includes laser cutting mechanism (3), tilting mechanism (7) and collects mechanism (8), its characterized in that:
the laser cutting mechanism (3) is arranged in the top of the bearing frame (2), the bearing frame (2) is fixed on the base (1), the left side wall of the bearing frame (2) penetrates through the mounting frame (5) and is in threaded connection with a first fastener (6), and the right side of the mounting frame (5) is fixedly provided with a storage frame (4);
the turnover mechanism (7), the turnover mechanism (7) is fixed on the base (1), and the turnover mechanism (7) is positioned at the lower side of the storage frame (4);
the collecting mechanism (8) is arranged on the upper end face of the base (1), and the collecting mechanism (8) is located on the inner side of the turnover mechanism (7).
2. The chip processing apparatus according to claim 1, wherein: laser cutting mechanism (3) include first motor (301), first motor shaft (302), first lead screw (303), first slider (304), second motor (305), second motor shaft (306), second lead screw (307), second slider (308) and laser cutting machine (309), and first motor (301) are fixed in the top of bearing frame (2), and the right side of first motor (301) rotates through first motor shaft (302) and is connected with first lead screw (303) simultaneously, first lead screw (303) threaded connection is on first slider (304), and first slider (304) sliding connection is at the interior top of bearing frame (2).
3. The chip processing apparatus according to claim 2, wherein: the rear side of the first sliding block (304) is fixed with a second motor (305), the front side of the second motor (305) is rotatably connected with a second screw rod (307) through a second motor shaft (306), the second screw rod (307) is in threaded connection with a second sliding block (308), the second sliding block (308) is in sliding connection with the lower end face of the first sliding block (304), and meanwhile the bottom of the second sliding block (308) is fixed with a laser cutting machine (309).
4. The chip processing apparatus according to claim 1, wherein: the turnover mechanism (7) comprises a first support (701), a third motor (702), a third motor shaft (703), a rotary plate (704), a second support (705), a hydraulic cylinder (706), a piston rod (707), a supporting plate (708), a bolt (709), a suction pump (710), a second fastener (711) and a sucker (712), wherein the first support (701) and the second support (705) are fixed on the base (1), the first support (701) is positioned on the left side of the second support (705), and the rotary plate (704) is rotatably connected between the first support (701) and the second support (705).
5. The chip processing apparatus according to claim 4, wherein: a third motor (702) is fixed on the left side of the first support (701), and a rotating plate (704) is rotatably connected to the right side of the third motor (702) through a third motor shaft (703).
6. The chip processing apparatus according to claim 4, wherein: the left side and the right side of the upper end face of the rotating plate (704) are respectively fixed with a hydraulic cylinder (706), the upper side of the hydraulic cylinder (706) is connected with a supporting plate (708) through a piston rod (707), and meanwhile, the supporting plate (708) is in threaded connection with the piston rod (707) through a bolt (709).
7. The chip processing apparatus according to claim 4, wherein: the bottom of the suction pump (710) penetrates through the supporting plate (708) and is in threaded connection with a second fastener (711), the top of the suction pump (710) is fixed with a suction cup (712), and the suction pumps (710) are uniformly distributed on the supporting plate (708).
8. The chip processing apparatus according to claim 1, wherein: the collecting mechanism (8) comprises a supporting plate (801), a sliding groove (802), clamping columns (803), a collecting box (804), a pull handle (805), a bolt (806) and a bolt hole (807), the bottom of the supporting plate (801) is connected in the sliding groove (802) in a sliding mode, the sliding groove (802) is formed in the front side and the rear side of the upper end face of the base (1), the collecting box (804) is connected to the clamping columns (803) in a clamping mode, and the clamping columns (803) are fixed to the front side and the rear side of the upper end face of the supporting plate (801).
9. The chip processing apparatus according to claim 8, wherein: the bolt (806) penetrates through the pull handle (805) and is clamped and connected in the bolt hole (807), the pull handle (805) is fixed on the right end face of the supporting plate (801), and meanwhile the bolt hole (807) is formed in the upper end face of the base (1).
CN202011029393.0A 2020-09-27 2020-09-27 Chip processing device Withdrawn CN112091450A (en)

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Application Number Priority Date Filing Date Title
CN202011029393.0A CN112091450A (en) 2020-09-27 2020-09-27 Chip processing device

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CN202011029393.0A CN112091450A (en) 2020-09-27 2020-09-27 Chip processing device

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Cited By (6)

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Publication number Priority date Publication date Assignee Title
CN113263638A (en) * 2021-04-16 2021-08-17 山东温声玻璃科技股份有限公司 Toughened glass cutting equipment
CN113305759A (en) * 2021-06-11 2021-08-27 常州机电职业技术学院 Adjustable chip fixing jig for chip processing equipment
CN113798698A (en) * 2021-10-08 2021-12-17 江西先峰钢结构有限公司 Steel plate processing device and process for production of prefabricated steel structure
CN114012918A (en) * 2022-01-05 2022-02-08 江苏明芯微电子股份有限公司 Punching tool of electronic chip with clamping structure
CN114799555A (en) * 2022-04-28 2022-07-29 广州Jfe钢板有限公司 Cutting platform and cutting device
CN114799549A (en) * 2022-04-11 2022-07-29 四川敏山电子科技有限公司 Formed circuit board cutting device and cutting method

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CN208374371U (en) * 2018-06-06 2019-01-15 四川东泉机械设备制造有限公司 A kind of dedicated cutting tool of steel form processing
CN208496091U (en) * 2018-06-28 2019-02-15 攀钢成都汽车零部件有限公司 A kind of autobody sheet laser cutting machine being equipped with turnover mechanism
CN209664603U (en) * 2018-12-26 2019-11-22 无锡中胜兴智能装备科技有限公司 A kind of laser cutting machine for the production of laser optics eyeglass
CN210306301U (en) * 2019-07-02 2020-04-14 新昌县正导科技发展有限公司 Cutting machine
CN110125537A (en) * 2019-07-03 2019-08-16 苏州亘富机械科技有限公司 A kind of laser cutting machine for high technology ceramics
CN210392914U (en) * 2019-08-09 2020-04-24 深圳浩大数控设备有限公司 Unloading mechanism in convertible glass machinery
CN211498245U (en) * 2019-11-19 2020-09-15 佛山市泰乙皮革制品有限公司 Cutting device convenient for fixing leather wrapping cloth
CN210908126U (en) * 2019-12-01 2020-07-03 青岛迈特园林机械零部件有限公司 Make things convenient for digit control machine tool in plane car hole

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113263638A (en) * 2021-04-16 2021-08-17 山东温声玻璃科技股份有限公司 Toughened glass cutting equipment
CN113305759A (en) * 2021-06-11 2021-08-27 常州机电职业技术学院 Adjustable chip fixing jig for chip processing equipment
CN113798698A (en) * 2021-10-08 2021-12-17 江西先峰钢结构有限公司 Steel plate processing device and process for production of prefabricated steel structure
CN114012918A (en) * 2022-01-05 2022-02-08 江苏明芯微电子股份有限公司 Punching tool of electronic chip with clamping structure
CN114012918B (en) * 2022-01-05 2022-03-15 江苏明芯微电子股份有限公司 Punching tool of electronic chip with clamping structure
CN114799549A (en) * 2022-04-11 2022-07-29 四川敏山电子科技有限公司 Formed circuit board cutting device and cutting method
CN114799555A (en) * 2022-04-28 2022-07-29 广州Jfe钢板有限公司 Cutting platform and cutting device

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