CN112086397B - Forming device with removing function for manufacturing transistor - Google Patents
Forming device with removing function for manufacturing transistor Download PDFInfo
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- CN112086397B CN112086397B CN202010983447.0A CN202010983447A CN112086397B CN 112086397 B CN112086397 B CN 112086397B CN 202010983447 A CN202010983447 A CN 202010983447A CN 112086397 B CN112086397 B CN 112086397B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000001514 detection method Methods 0.000 claims abstract description 40
- 238000002955 isolation Methods 0.000 claims description 51
- 238000007493 shaping process Methods 0.000 claims description 29
- 238000003466 welding Methods 0.000 claims description 9
- 125000006850 spacer group Chemical group 0.000 claims description 4
- 238000005452 bending Methods 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 description 9
- 230000002950 deficient Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4896—Mechanical treatment, e.g. cutting, bending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a forming device with a rejecting function for manufacturing a transistor, which comprises a rack, a conveying mechanism for conveying, an isolating mechanism and a transistor, wherein the conveying mechanism is arranged on the inner side of the rack, the isolating mechanism is arranged on the front side and the rear side of the rack, the lower end of the transistor is positioned on the inner side of the rack and above the conveying mechanism, the forming device also comprises a rejecting mechanism and a forming mechanism, and the rejecting mechanism comprises a first laser detection head, a first support frame, a second laser detection head, a second support frame, a rejecting cylinder and a fixing frame. The invention utilizes the first laser detection head and the two second laser detection heads to detect the three pins of the transistor, thereby eliminating the transistor with unqualified bending angle, further lightening the labor intensity of workers, and utilizing the spring and the second locking frame to fix the pins of the transistor, thereby reducing the volume of the transistor forming device.
Description
Technical Field
The invention relates to the field of transistor manufacturing, in particular to a forming device with a rejecting function for manufacturing a transistor.
Background
The transistor needs to be pin-formed before it is mounted for use. The manual bending mode is generally adopted: placing the transistor at a forming position of a workbench, suspending a pin of the transistor, and manually punching the pin of the transistor to bend and form the pin; after the traditional transistor forming device, a mechanism for detecting unqualified transistor pins is not provided, if the transistor pins are detected manually, the manual labor intensity is high and the efficiency is too low; meanwhile, the whole size of the transistor is small, the traditional transistor pin fixing device generally adopts an air cylinder to fix the transistor, the structure of the fixing mode is complex, the size is large, and the transistor pin fixing device is very convenient to maintain.
Disclosure of Invention
The present invention is directed to solving the above problems and providing a forming apparatus with a rejecting function for manufacturing a transistor.
The invention realizes the purpose through the following technical scheme:
a forming device with a rejecting function for manufacturing a transistor comprises a rack, a conveying mechanism, an isolating mechanism and a transistor, wherein the conveying mechanism is used for conveying, the conveying mechanism is arranged on the inner side of the rack, the isolating mechanism is arranged on the front side and the rear side of the rack, the lower end of the transistor is arranged on the inner side of the rack and above the conveying mechanism, the forming device further comprises a rejecting mechanism and a forming mechanism, the rejecting mechanism comprises a first laser detection head, a first support frame, a second laser detection head, a second support frame, a rejecting cylinder and a fixing frame, the second support frame is arranged on one side of the front end of the rack, the first support frame is arranged on one side of the rear end of the rack, the first laser detection head is arranged on the upper end of the first support frame, the type of the first laser detection head is YJG-06NONPN, the second laser detection head is arranged on the upper end of the second support frame, the second laser detection head is YJG-06NONPN, the fixed frame is installed at one end of the front side of the rack, and the removing cylinder fixing part is installed at the front side of the fixed frame; forming mechanism includes first locking frame, shaping cylinder, second locking frame, shaping frame, spring, first locking frame lower extreme is installed the frame top, shaping cylinder fixed part is installed first locking frame rear end, install shaping frame upper end shaping cylinder pars contractilis, second locking frame upside is installed shaping frame front side, the spring mounting second locking frame upside just is located shaping frame is inboard.
Preferably: the second support frame with the frame passes through bolted connection, first laser detection head with first support frame passes through threaded connection, second laser detection head with the second support frame passes through threaded connection, the mount with the frame passes through bolted connection, the cylinder fixed part of rejecting with the mount passes through bolted connection.
According to the arrangement, the first support frame is used for supporting the first laser detection head, the second support frame is used for supporting the second laser detection head, and the unqualified transistors are removed through the extension of the telescopic part of the removing cylinder.
Preferably: the first locking frame with the frame passes through bolted connection, shaping cylinder fixed part with first locking frame passes through bolted connection, the shaping frame with shaping cylinder pars contractilis passes through threaded connection.
So set up, through the shaping cylinder pars contractilis drives the shaping frame removes, utilize simultaneously the second locking frame comes to compress tightly fixedly the pin of transistor.
Preferably: conveying mechanism includes conveying motor, conveyer belt, conveying roller, sprocket, chain, conveying motor sets up frame front end opposite side, the conveying roller sets up the frame is inboard, the conveyer belt sets up the conveying roller outside, the sprocket sets up the conveying roller rear end, the chain sets up the sprocket outside.
According to the arrangement, the conveying motor rotating part is used for driving the conveying rollers to rotate, and all the conveying rollers are driven to rotate through the transmission of the chain wheel and the chain.
Preferably: the conveying mechanism comprises a conveying motor, a conveying belt, a conveying roller, a belt wheel and a belt, the conveying motor is arranged on the other side of the front end of the rack, the conveying roller is arranged on the inner side of the rack, the conveying belt is arranged on the outer side of the conveying roller, the belt wheel is arranged at the rear end of the conveying roller, and the belt is arranged on the outer side of the belt wheel.
According to the arrangement, the conveying motor rotating part is used for driving the conveying rollers to rotate, and all the conveying rollers are driven to rotate through the transmission of the belt wheel and the belt.
Preferably: the isolation mechanism comprises isolation rollers, isolation belts and isolation plates, the isolation rollers are arranged on the front side and the rear side of the rack, the isolation belts are arranged on the outer sides of the isolation rollers, and the isolation plates are arranged on the outer sides of the isolation belts.
In this configuration, the isolation belt is supported by the isolation roller, and each transistor is separated by the isolation plate.
Preferably: the conveying motor is connected with the rack through bolts, the conveying roller is connected with the rack through a bearing, and the chain wheel is connected with the conveying roller through welding.
So set up, utilize the sprocket with the transmission of chain drives the conveying roller and rotates to rotate through every the conveying roller rotates and drives the conveyer belt and rotate, and then carry the transistor.
Preferably: the conveying motor is connected with the rack through a bolt, the conveying roller is connected with the rack through a bearing, and the belt wheel is connected with the conveying roller through welding.
So set up, utilize the band pulley with the transmission of belt drives the conveying roller and rotates to rotate through every the conveying roller rotates and drives the conveyer belt and rotate, and then carry the transistor.
Preferably: the isolation roller is connected with the rack through a bearing, the isolation belt is sleeved at the middle position of the outer side of the isolation roller, and the isolation plate is connected with the isolation belt through welding.
The arrangement is such that each transistor is located between two adjacent isolation plates by means of two isolation belts, thereby enabling the transistors to be separated one by one.
Preferably: the shape of the forming frame is of an inverted U-shaped structure, and the rear end of the forming frame is higher than the front end of the forming frame.
According to the arrangement, the forming frame and the first locking frame are used for extrusion, so that the pin in the middle of the transistor is bent.
Compared with the prior art, the invention has the following beneficial effects:
1. the first laser detection head and the two second laser detection heads are used for detecting three pins of the transistor, so that the transistor with unqualified bending angle can be removed, and the labor intensity of workers is reduced;
2. the pins of the transistor are fixed by the spring and the second locking frame, so that the volume of the transistor molding device can be reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a forming apparatus with a rejecting function for transistor fabrication according to the present invention;
FIG. 2 is a partial component view of a forming mechanism of a forming device with a rejecting function for transistor manufacturing according to the present invention;
FIG. 3 is a partial part view of an embodiment 1 of a conveying mechanism of a forming device with a rejecting function for manufacturing a transistor according to the present invention;
FIG. 4 is a partial part view of an embodiment 2 of a conveying mechanism of a forming device with a rejecting function for manufacturing a transistor according to the present invention;
FIG. 5 is a partial part diagram of a rejecting mechanism of a forming device with a rejecting function for manufacturing a transistor according to the present invention;
FIG. 6 is a partial sectional view of a frame of a forming apparatus with reject function for transistor fabrication according to the present invention;
FIG. 7 is a partial part view of a forming frame of a forming device with a rejecting function for manufacturing a transistor according to the present invention;
fig. 8 is a partial part view of a second locking frame of a molding device with a rejecting function for manufacturing a transistor according to the present invention.
The reference numerals are explained below:
1. a rejection mechanism; 2. a molding mechanism; 3. a frame; 4. a conveying mechanism; 5. an isolation mechanism; 6. a transistor; 11. a first laser detection head; 12. a first support frame; 13. a second laser detection head; 14. a second support frame; 15. removing the air cylinder; 16. a fixed mount; 21. a first locking bracket; 22. a forming cylinder; 23. a second locking frame; 24. forming a frame; 25. a spring; 41. a conveying motor; 42. a conveyor belt; 43. a conveying roller; 44. a sprocket; 45. a chain; 414. a pulley; 415. a belt; 51. a spacer roll; 52. an isolation zone; 53. and (4) a partition board.
Detailed Description
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The invention will be further described with reference to the accompanying drawings in which:
a forming device with a rejecting function for manufacturing a transistor comprises a rack 3, a conveying mechanism 4 for conveying, an isolating mechanism 5 and a transistor 6, wherein the conveying mechanism 4 is arranged on the inner side of the rack 3, the isolating mechanism 5 is arranged on the front side and the rear side of the rack 3, the lower end of the transistor 6 is arranged on the inner side of the rack 3 and above the conveying mechanism 4, the forming device also comprises a rejecting mechanism 1 and a forming mechanism 2, the rejecting mechanism 1 comprises a first laser detection head 11, a first support frame 12, a second laser detection head 13, a second support frame 14, a rejecting cylinder 15 and a fixing frame 16, the second support frame 14 is arranged on one side of the front end of the rack 3, the first support frame 12 is arranged on one side of the rear end of the rack 3, the first laser detection head 11 is arranged on the upper end of the first support frame 12, the second laser detection head 13 is arranged on the upper end of the second support frame 14, the fixing frame 16 is arranged on one end of the front end of the rack 3, the fixed part of the removing cylinder 15 is arranged at the front side of the fixed frame 16; forming mechanism 2 includes first locking frame 21, shaping cylinder 22, second locking frame 23, shaping frame 24, spring 25, and first locking frame 21 lower extreme is installed at frame 3 top, and shaping cylinder 22 fixed part is installed in first locking frame 21 rear end, and shaping frame 24 upper end is installed in shaping cylinder 22 pars contractilis, and the shaping frame 24 front side is installed to second locking frame 23 upside, and spring 25 installs at second locking frame 23 upside and is located shaping frame 24 inboardly.
Example 1
As shown in fig. 1, 2, 3, 5, 6, 7 and 8, the second support frame 14 is connected with the frame 3 through bolts, the first support frame 12 is connected with the frame 3 through bolts, the first laser detection head 11 is connected with the first support frame 12 through threads, the second laser detection head 13 is connected with the second support frame 14 through threads, the fixing frame 16 is connected with the frame 3 through bolts, the fixing part of the rejecting cylinder 15 is connected with the fixing frame 16 through bolts, the first laser detection head 11 is supported by the first support frame 12, the second laser detection head 13 is supported by the second support frame 14, and the unqualified transistor 6 is rejected by the extension of the telescopic part of the rejecting cylinder 15; the first locking frame 21 is connected with the rack 3 through a bolt, the fixed part of the forming cylinder 22 is connected with the first locking frame 21 through a bolt, the forming frame 24 is connected with the telescopic part of the forming cylinder 22 through a thread, the telescopic part of the forming cylinder 22 drives the forming frame 24 to move, and meanwhile, the second locking frame 23 is used for compressing and fixing pins of the transistor 6; the conveying mechanism 4 comprises a conveying motor 41, a conveying belt 42, a conveying roller 43, a chain wheel 44 and a chain 45, wherein the conveying motor 41 is arranged on the other side of the front end of the rack 3, the conveying roller 43 is arranged on the inner side of the rack 3, the conveying belt 42 is arranged on the outer side of the conveying roller 43, the chain wheel 44 is arranged at the rear end of the conveying roller 43, the chain 45 is arranged on the outer side of the chain wheel 44, the conveying roller 43 is driven to rotate by the rotating part of the conveying motor 41, and all the conveying rollers 43 are driven to rotate by the transmission of the chain wheel 44 and the chain 45; the isolation mechanism 5 comprises isolation rollers 51, isolation belts 52 and isolation plates 53, wherein the isolation rollers 51 are arranged on the front side and the rear side of the rack 3, the isolation belts 52 are arranged on the outer sides of the isolation rollers 51, the isolation plates 53 are arranged on the outer sides of the isolation belts 52, the isolation rollers 51 are used for supporting the isolation belts 52, and each transistor 6 is separated through the isolation plates 53; the conveying motor 41 is connected with the rack 3 through a bolt, the conveying roller 43 is connected with the rack 3 through a bearing, the chain wheel 44 is connected with the conveying roller 43 through welding, the conveying roller 43 is driven to rotate by the transmission of the chain wheel 44 and the chain 45, so that the conveying belt 42 is driven to rotate through the rotation of each conveying roller 43, and the transistor 6 is conveyed; the isolation roller 51 is connected with the frame 3 through a bearing, the isolation belt 52 is sleeved at the middle position outside the isolation roller 51, the isolation plates 53 are connected with the isolation belt 52 through welding, and each transistor 6 is positioned between two adjacent isolation plates 53 through two isolation belts 52, so that the transistors 6 can be separated one by one; the forming frame 24 is in an inverted U-shaped configuration, and the rear end of the forming frame 24 is higher than the front end, and the forming frame 24 and the first locking frame 21 are pressed to bend the pin at the middle position of the transistor 6.
The working principle is as follows: when in use, the head of each transistor 6 is placed downwards on the conveyer belt 42, then the rotating part of the conveyer motor 41 drives the conveyer roller 43 at the other end of the inner side of the conveyer belt 42 to rotate, then the transmission of the chain wheel 44 and the chain 45 drives the other several conveyer rollers 43 to synchronously rotate, the rotation of the conveyer rollers 43 drives the conveyer belt 42 to rotate, the transistor 6 starts to move to one side along with the rotation of the conveyer belt 42, when the transistor 6 moves to the other side of the two isolation belts 52, the pins of the transistor 6 are driven by the rotation of the conveyer belt 42 to push the isolation plates 53 at the outer sides of the isolation belts 52 to rotate, and the transistor 6 is positioned between the two adjacent isolation plates 53, so that the two isolation plates 53 are used for assisting in fixing the transistor 6; when all five transistors 6 are positioned at the lower side of the forming frame 24, the rotating part of the conveying motor 41 stops rotating, at the moment, the telescopic part of the forming cylinder 22 shortens to pull the forming frame 24 to move towards the rear side, the lower end of the second locking frame 23 presses three pins of the transistors 6 at the lower end of the first locking frame 21 along with the movement of the forming frame 24, and the spring 25 at the upper side of the second locking frame 23 in the forming frame 24 starts to compress along with the continuous movement towards the rear side of the forming frame 24, so that the pin at the middle position of the transistors 6 is pressed on the inclined surface at the lower side of the first locking frame 21 by the inclined surface at the lower side of the forming frame 24, and the pins at the middle positions of the five transistors 6 are bent and formed respectively; then the rotating part of the conveying motor 41 continuously drives the conveying belt 42 to rotate, the bent transistor 6 continuously moves towards one side, when the transistor 6 moves to a position between the first support frame 12 and the second support frame 14, the conveying belt 42 stops rotating, the first laser detection head 11 is used for detecting the bent pin at the middle position of the transistor 6, meanwhile, the two second laser detection heads 13 are used for detecting the pins at the two sides of the transistor 6, in addition, the detection principle of the pins of the first laser detection head 11 and the second laser detection heads 13 is that when the pins of the transistor 6 can simultaneously shield the lasers emitted by the first laser detection head 11 and the two second laser detection heads 13, the transistor 6 is considered to be qualified, and when the pins of the transistor 6 can not simultaneously shield the lasers of the first laser detection head 11 and the two second laser detection heads 13, the transistor 6 is considered to be unqualified, when the defective transistor 6 detected by the continuous rotation of the conveyor belt 42 moves to the rear end of the telescopic part of the removing cylinder 15, the defective transistor 6 is pushed out backward by the extension of the telescopic part of the removing cylinder 15, and the defective transistor 6 is sent out from one end along with the continuous rotation of the conveyor belt 42.
Example 2
As shown in fig. 4, the difference between the embodiment 2 and the embodiment 1 is that the conveying mechanism 4 includes a conveying motor 41, a conveying belt 42, conveying rollers 43, a belt wheel 414, and a belt 415, the conveying motor 41 is disposed on the other side of the front end of the frame 3, the conveying rollers 43 are disposed on the inner side of the frame 3, the conveying belt 42 is disposed on the outer side of the conveying rollers 43, the belt wheel 414 is disposed on the rear end of the conveying rollers 43, the belt 415 is disposed on the outer side of the belt wheel 414, the conveying rollers 43 are driven to rotate by the rotating portion of the conveying motor 41, and all the conveying rollers 43 are driven to rotate by the transmission of the belt wheel 414 and the belt 415; the conveying motor 41 is connected with the frame 3 through a bolt, the conveying roller 43 is connected with the frame 3 through a bearing, the belt wheel 414 is connected with the conveying roller 43 through welding, the conveying roller 43 is driven to rotate by the transmission of the belt wheel 414 and the belt 415, and the conveying belt 42 is driven to rotate through the rotation of each conveying roller 43, so that the transistor 6 is conveyed.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.
Claims (10)
1. The utility model provides a forming device that is used for transistor manufacturing to have a function of rejecting, includes frame (3), is used for conveying mechanism (4), isolator mechanism (5), transistor (6), conveyor mechanism (4) set up frame (3) are inboard, isolator mechanism (5) set up both sides around frame (3), transistor (6) lower extreme is located frame (3) are inboard and be located conveyor mechanism (4) top, its characterized in that: the laser detection device is characterized by further comprising a removing mechanism (1) and a forming mechanism (2), wherein the removing mechanism (1) comprises a first laser detection head (11), a first support frame (12), a second laser detection head (13), a second support frame (14), a removing cylinder (15) and a fixing frame (16), the second support frame (14) is installed on one side of the front end of the rack (3), the first support frame (12) is arranged on one side of the rear end of the rack (3), the first laser detection head (11) is installed at the upper end of the first support frame (12), the second laser detection head (13) is installed at the upper end of the second support frame (14), the fixing frame (16) is installed at one end of the front side of the rack (3), and a fixing part of the removing cylinder (15) is installed at the front side of the fixing frame (16); forming mechanism (2) are including first locking frame (21), shaping cylinder (22), second locking frame (23), shaping frame (24), spring (25), first locking frame (21) lower extreme is installed frame (3) top, shaping cylinder (22) fixed part is installed first locking frame (21) rear end, install shaping frame (24) upper end shaping cylinder (22) pars contractilis, second locking frame (23) upside is installed shaping frame (24) front side, spring (25) are installed second locking frame (23) upside just is located shaping frame (24) are inboard.
2. The forming device with rejecting function for transistor manufacture according to claim 1, wherein: the second support frame (14) with frame (3) pass through bolted connection, first support frame (12) with frame (3) pass through bolted connection, first laser detect first (11) with first support frame (12) pass through threaded connection, second laser detect first (13) with second support frame (14) pass through threaded connection, mount (16) with frame (3) pass through bolted connection, reject cylinder (15) fixed part with mount (16) pass through bolted connection.
3. The forming device with rejecting function for transistor manufacture according to claim 1, wherein: first locking frame (21) with frame (3) pass through bolted connection, shaping cylinder (22) fixed part with first locking frame (21) pass through bolted connection, shaping frame (24) with shaping cylinder (22) pars contractilis pass through threaded connection.
4. The forming device with rejecting function for transistor manufacture according to claim 1, wherein: conveying mechanism (4) are including conveying motor (41), conveyer belt (42), conveying roller (43), sprocket (44), chain (45), conveying motor (41) set up frame (3) front end opposite side, conveying roller (43) set up frame (3) are inboard, conveyer belt (42) set up conveying roller (43) outside, sprocket (44) set up conveying roller (43) rear end, chain (45) set up sprocket (44) outside.
5. The forming device with rejecting function for transistor manufacture according to claim 1, wherein: conveying mechanism (4) are including conveying motor (41), conveyer belt (42), conveying roller (43), band pulley (414), belt (415), conveying motor (41) set up frame (3) front end opposite side, conveying roller (43) set up frame (3) are inboard, conveying belt (42) set up the conveying roller (43) outside, band pulley (414) set up conveying roller (43) rear end, belt (415) set up the band pulley (414) outside.
6. The forming device with rejecting function for transistor manufacture according to claim 1, wherein: isolation mechanism (5) are including spacer roll (51), median (52), division board (53), spacer roll (51) set up both sides around frame (3), median (52) set up the spacer roll (51) outside, division board (53) are installed the median (52) outside.
7. The forming device with rejecting function for transistor manufacture according to claim 4, wherein: the conveying motor (41) is connected with the rack (3) through bolts, the conveying roller (43) is connected with the rack (3) through a bearing, and the chain wheel (44) is connected with the conveying roller (43) through welding.
8. The forming device with rejecting function for transistor manufacture according to claim 5, wherein: the conveying motor (41) is connected with the rack (3) through bolts, the conveying roller (43) is connected with the rack (3) through a bearing, and the belt wheel (414) is connected with the conveying roller (43) through welding.
9. The forming device with rejecting function for transistor manufacture according to claim 6, wherein: the isolation roller (51) is connected with the rack (3) through a bearing, the isolation belt (52) is sleeved at the middle position of the outer side of the isolation roller (51), and the isolation plate (53) is connected with the isolation belt (52) through welding.
10. The forming device with rejecting function for transistor manufacture according to claim 1, wherein: the shape of the forming frame (24) is an inverted U-shaped structure, and the rear end of the forming frame (24) is higher than the front end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010983447.0A CN112086397B (en) | 2020-09-17 | 2020-09-17 | Forming device with removing function for manufacturing transistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010983447.0A CN112086397B (en) | 2020-09-17 | 2020-09-17 | Forming device with removing function for manufacturing transistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112086397A CN112086397A (en) | 2020-12-15 |
| CN112086397B true CN112086397B (en) | 2021-09-24 |
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| CN202010983447.0A Active CN112086397B (en) | 2020-09-17 | 2020-09-17 | Forming device with removing function for manufacturing transistor |
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| CN209424442U (en) * | 2018-12-19 | 2019-09-24 | 东莞市高容精密机械有限公司 | The detection sub-material apparatus for bending of electronic component |
| CN210208427U (en) * | 2019-07-27 | 2020-03-31 | 大连宏信达电子有限公司 | Electronic components pin shaping jig |
| CN210403528U (en) * | 2019-10-18 | 2020-04-24 | 深圳市深之创科技有限公司 | Horizontal capacitor pin bending machine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH0616576B2 (en) * | 1989-08-18 | 1994-03-02 | セイコー電子工業株式会社 | Crystal unit lead wire forming device |
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| CN104575893A (en) * | 2015-01-06 | 2015-04-29 | 深圳市众之城电子科技有限公司 | Cement resistance test marking-molding all-in-one machine |
| CN104998990A (en) * | 2015-08-13 | 2015-10-28 | 福建农林大学 | Triode pin bending machine with cylindrical cam mechanism |
| CN107199187A (en) * | 2017-07-19 | 2017-09-26 | 东莞市联洲知识产权运营管理有限公司 | A kind of screening delivery track of diode detection |
| CN209424442U (en) * | 2018-12-19 | 2019-09-24 | 东莞市高容精密机械有限公司 | The detection sub-material apparatus for bending of electronic component |
| CN210208427U (en) * | 2019-07-27 | 2020-03-31 | 大连宏信达电子有限公司 | Electronic components pin shaping jig |
| CN210403528U (en) * | 2019-10-18 | 2020-04-24 | 深圳市深之创科技有限公司 | Horizontal capacitor pin bending machine |
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