CN112083226A - Frequency calibration method and device for electronic equipment, medium and electronic equipment - Google Patents
Frequency calibration method and device for electronic equipment, medium and electronic equipment Download PDFInfo
- Publication number
- CN112083226A CN112083226A CN201910509966.0A CN201910509966A CN112083226A CN 112083226 A CN112083226 A CN 112083226A CN 201910509966 A CN201910509966 A CN 201910509966A CN 112083226 A CN112083226 A CN 112083226A
- Authority
- CN
- China
- Prior art keywords
- temperature
- frequency
- crystal oscillator
- parameter
- temperature interval
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R23/00—Arrangements for measuring frequencies; Arrangements for analysing frequency spectra
- G01R23/02—Arrangements for measuring frequency, e.g. pulse repetition rate; Arrangements for measuring period of current or voltage
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
The embodiment of the disclosure provides a frequency calibration method, a frequency calibration device, a frequency calibration medium and electronic equipment. The electronic equipment comprises a crystal oscillator, and the frequency calibration method of the electronic equipment comprises the following steps: in the process flow of a factory production line of the electronic equipment, acquiring the actual output frequency of the crystal oscillator at each sampling temperature in a preset temperature interval; correcting parameters of a temperature frequency deviation characteristic function of the crystal oscillator based on each sampling temperature and the corresponding actual output frequency and expected frequency; and calibrating the output frequency of the crystal oscillator according to the corrected temperature frequency deviation characteristic function. According to the technical scheme of the embodiment of the disclosure, in the factory production process, the actual output frequency of the crystal oscillator is sampled in the environment containing the preset temperature interval so as to correct the parameters of the frequency deviation characteristic function of the crystal oscillator, so that the frequency calibration can be realized in the production process of the electronic equipment, and the frequency accuracy is improved.
Description
Technical Field
The disclosure relates to the field of crystal oscillator testing, and in particular relates to a frequency calibration method, device, medium and electronic equipment of the electronic equipment.
Background
The quartz crystal has piezoelectric effect, and the crystal oscillator can generate very stable resonance frequency which can be used as clock frequency of electronic products, so the crystal oscillator is called as the heart of the electronic products.
At present, in order to realize frequency calibration of electronic equipment, coarse calibration is firstly performed in a production process, and then in a use process after leaving a factory, continuous adjustment of frequency parameters of the electronic equipment is performed through networking.
In the related art, the clock frequency calibration of the electronic device may also be implemented by using a temperature controlled crystal oscillator and a voltage controlled crystal oscillator, however, the peripheral circuits of the temperature controlled crystal oscillator and the voltage controlled crystal oscillator are complicated, the occupation rate of the Printed Circuit Board (PCB) is high, and the cost is higher compared with that of a common crystal oscillator.
Therefore, a new frequency calibration method, device, medium and electronic device for electronic devices are needed.
It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.
Disclosure of Invention
The embodiments of the present disclosure provide a method, an apparatus, a medium, and an electronic device for frequency calibration of an electronic device, so as to overcome, at least to a certain extent, technical problems in the related art that the accuracy of an output frequency in a previous stage is low due to a long time consumed for frequency calibration of the electronic device, or a large area of a board occupied by a temperature controlled crystal oscillator and a voltage controlled crystal oscillator due to a complex peripheral circuit and a high cost in the related art.
Additional features and advantages of the disclosure will be set forth in the detailed description which follows, or in part will be obvious from the description, or may be learned by practice of the disclosure.
According to an aspect of the present disclosure, there is provided a frequency calibration method of an electronic device, the electronic device including a crystal oscillator; the method comprises the following steps: in the process flow of a factory production line of the electronic equipment, acquiring the actual output frequency of the crystal oscillator at each sampling temperature in a preset temperature interval; correcting parameters of a temperature frequency deviation characteristic function of the crystal oscillator based on each sampling temperature and the corresponding actual output frequency and expected frequency; and calibrating the output frequency of the crystal oscillator according to the corrected temperature frequency deviation characteristic function.
In an exemplary embodiment of the present disclosure, the electronic device includes a carrier board, the crystal oscillator is attached to the carrier board, the electronic device further includes a power management chip, the power management chip is electrically connected to the crystal oscillator, and the method is applied to the power management chip.
In an exemplary embodiment of the present disclosure, the process flow of the factory production line of the electronic device includes a burn-in test flow of the electronic device.
In an exemplary embodiment of the present disclosure, the preset temperature interval includes a first temperature interval, a second temperature interval and a third temperature interval, wherein the temperature of the first temperature interval is lower than that of the second temperature interval, and the second temperature interval is lower than that of the third temperature interval.
In an exemplary embodiment of the present disclosure, the parameter includes a first parameter and a second parameter; wherein, the parameter of the temperature frequency deviation characteristic function of the crystal oscillator is corrected based on each sampling temperature and the corresponding actual output frequency and expected frequency thereof, and the parameter comprises the following steps: determining a first frequency deviation value of each sampling temperature of the second temperature interval based on each sampling temperature of the second temperature interval and the corresponding actual output frequency; and correcting the first parameter and the second parameter according to the first frequency deviation value and the expected frequency.
In an exemplary embodiment of the present disclosure, the parameters include a third parameter and a fourth parameter; wherein, the parameter of the temperature frequency deviation characteristic function of the crystal oscillator is corrected based on each sampling temperature and the corresponding actual output frequency and expected frequency thereof, and the parameter comprises the following steps: determining a second frequency deviation value of each sampling temperature of the first temperature interval and the third temperature interval based on each sampling temperature of the first temperature interval and the third temperature interval and the corresponding actual output frequency; and correcting the third parameter and the fourth parameter according to the second frequency deviation value and the expected frequency.
In an exemplary embodiment of the present disclosure, the preset temperature interval is [ -20 ℃, +55 ℃ ].
In an exemplary embodiment of the present disclosure, the first temperature interval is [ -20 ℃, -10 ℃ ], the second temperature interval is (-10 ℃, +45 ℃), and the third temperature interval is [ +45 ℃, +55 ℃ ].
In an exemplary embodiment of the present disclosure, the electronic device further includes a positioning module; wherein the method further comprises: acquiring the arrival time of a satellite transmitting signal to the positioning module by using the output frequency of the crystal oscillator; and calculating the distance between the satellite and the electronic equipment according to the arrival time.
According to an aspect of the present disclosure, there is provided a frequency calibration apparatus of an electronic device, the electronic device including a crystal oscillator; the device comprises: the frequency sampling module is used for acquiring the actual output frequency of the crystal oscillator at each sampling temperature in a preset temperature interval in the process flow of a factory production line of the electronic equipment; the parameter correction module is used for correcting the parameter of the temperature frequency deviation characteristic function of the crystal oscillator based on each sampling temperature and the corresponding actual output frequency and expected frequency; and the frequency calibration module is used for calibrating the output frequency of the crystal oscillator according to the corrected temperature frequency deviation characteristic function.
According to an aspect of the present disclosure, there is provided a computer readable medium, on which a computer program is stored, which when executed by a processor, implements the frequency calibration method of the electronic device according to any of the embodiments described above.
According to one aspect of the present disclosure, there is provided an electronic device, one or more processors; storage means for storing one or more programs; when the one or more programs are executed by the one or more processors, the one or more processors implement the frequency calibration method of the electronic device according to any of the above embodiments.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:
in the technical solutions provided in some embodiments of the present disclosure, in a factory production process, an output frequency of a crystal oscillator is sampled in an environment including a preset temperature interval to correct a parameter of a frequency deviation characteristic function of the crystal oscillator, so that frequency calibration can be implemented in the production process of an electronic device, and frequency accuracy is improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without the exercise of inventive faculty. In the drawings:
fig. 1 schematically shows a flow chart of a method of frequency calibration of an electronic device according to one embodiment of the present disclosure.
FIG. 2 schematically shows a schematic diagram of a power management chip according to one embodiment of the present disclosure;
fig. 3 schematically shows a flow chart of an embodiment of step S120 in fig. 1.
Fig. 4 schematically shows a flow chart of a method of frequency calibration of an electronic device according to yet another embodiment of the present disclosure.
Fig. 5 schematically shows a block diagram of a frequency calibration arrangement of an electronic device according to an embodiment of the present disclosure.
Fig. 6 schematically shows a block diagram of an electronic device according to an embodiment of the present disclosure.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art.
Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the subject matter of the present disclosure can be practiced without one or more of the specific details, or with other methods, components, devices, steps, and so forth. In other instances, well-known methods, devices, implementations, or operations have not been shown or described in detail to avoid obscuring aspects of the disclosure.
The block diagrams shown in the figures are functional entities only and do not necessarily correspond to physically separate entities. I.e. these functional entities may be implemented in the form of software, or in one or more hardware modules or integrated circuits, or in different networks and/or processor means and/or microcontroller means.
The flow charts shown in the drawings are merely illustrative and do not necessarily include all of the contents and operations/steps, nor do they necessarily have to be performed in the order described. For example, some operations/steps may be decomposed, and some operations/steps may be combined or partially combined, so that the actual execution sequence may be changed according to the actual situation.
Fig. 1 schematically shows a flow chart of a method of frequency calibration of an electronic device according to one embodiment of the present disclosure.
As shown in fig. 1, a frequency calibration method of an electronic device provided by an embodiment of the present disclosure may include the following steps.
In step S110, in a process flow of a factory production line of the electronic device, an actual output frequency of the crystal oscillator at each sampling temperature in a preset temperature interval is obtained.
The electronic device may include a mobile phone, a computer, a tablet, and other devices, but the embodiment of the disclosure is not limited thereto.
In an embodiment of the present disclosure, the process flow of the factory production line of the electronic device may include a burn-in test flow of the electronic device. In the aging test process, the temperature is raised and lowered circularly, and some performance indexes of the electronic equipment are subjected to pressure test. The temperature environment provided by the aging test process is matched with the preset temperature interval so as to provide each sampling temperature in the preset temperature interval.
In the following embodiments, the aging test process is described as an example, but not limited thereto, and a temperature increasing and decreasing process may be added to the process flow of the factory production line to provide each sampling temperature in the preset temperature interval.
In step S120, a parameter of the temperature-frequency deviation characteristic function of the crystal oscillator is corrected based on each sampled temperature and its corresponding actual output frequency and desired frequency.
The difference between the actual output frequency and the expected frequency is a frequency deviation, i.e. a deviation to be calibrated by the method of the present embodiment. The temperature frequency deviation of the crystal oscillator can be represented by a function, namely a temperature frequency deviation characteristic function. The temperature frequency deviation characteristic function may be expressed, for example, as:
f(t)＝c3*(t-t0)3+c2*(t-t0)2+c1*(t-t0)+c0 (1)
wherein f (t) is frequency deviation, t is temperature, t0Is a constant temperature c0，c1，c2，c3Are the first to fourth parameters.
In an embodiment of the present disclosure, the preset temperature interval may include a first temperature interval, a second temperature interval, and a third temperature interval, where a temperature of the first temperature interval is lower than a temperature of the second temperature interval, and the second temperature interval is lower than a temperature of the third temperature interval. The preset temperature interval can be divided into three temperature intervals by dividing the preset temperature interval, and the first temperature interval, the second temperature interval and the third temperature interval can be disjoint sets. The union of the first temperature interval, the second temperature interval and the third temperature interval may be a preset temperature interval. Wherein the low temperature may be a limiting low temperature, such as a limiting low temperature within an operating temperature range of the electronic device. The elevated temperature may be an extreme elevated temperature, such as an extreme elevated temperature within an operating temperature range of the electronic device.
In an exemplary embodiment, the preset temperature range is [ -20 ℃, +55 ℃ ], but the frequency calibration method of the electronic device of the present disclosure is not limited thereto, and the preset temperature range may be adjusted according to an operating temperature of the electronic device.
In an exemplary embodiment, the first temperature interval is [ -20 ℃, -10 ℃ ], the second temperature interval is (-10 ℃, +45 ℃), and the third temperature interval is [ +45 ℃, +55 ℃ ]. In the aging test flow, the temperature is raised and lowered circularly. In this process, the temperature range provided by the aging test process may cover the temperature range of the preset temperature interval.
In the disclosed embodiment, the parameters include a first parameter and a second parameter; wherein, the correcting the parameter of the temperature frequency deviation characteristic function of the crystal oscillator based on each sampling temperature and the corresponding actual output frequency and the expected frequency thereof may include: determining a first frequency deviation value of each sampling temperature of the second temperature interval based on each sampling temperature of the second temperature interval and the corresponding actual output frequency; and correcting the first parameter and the second parameter according to the first frequency deviation value and the expected frequency. The first parameter and the second parameter can be c in formula (1), respectively0，c1. E.g. t0Belonging to a second temperature interval according to t ═ t0Frequency deviation f (t) of time0) Can calculate c0Is also, for example, given as c in formula (1)2，c3Is set to a fixed constant (where c20), can pass test t0F (t) of two nearby temperature points to substitute formula (1) for subtraction calculation c1The value of (c).
In the embodiment of the present disclosure, the parameters include a third parameter and a fourth parameter; wherein on a per basisThe sampling temperature and the corresponding actual output frequency and expected frequency thereof modify the parameters of the temperature frequency deviation characteristic function of the crystal oscillator, and the parameters may include: determining a second frequency deviation value of each sampling temperature of the first temperature interval and the third temperature interval based on each sampling temperature of the first temperature interval and the third temperature interval and the corresponding actual output frequency; and correcting the third parameter and the fourth parameter according to the second frequency deviation value and the expected frequency. The third parameter and the fourth parameter may be c in formula (1), respectively2，c3. For example, a temperature-frequency deviation value curve can be drawn by each of the sampled temperatures of the first temperature interval and the third temperature interval and the corresponding second frequency deviation value. By fitting the curve, the parameters in the temperature frequency deviation characteristic function can be corrected.
In step S130, the output frequency of the crystal oscillator is calibrated according to the corrected temperature frequency deviation characteristic function. In the using process of the electronic equipment, the temperature sensor collects the ambient temperature, the frequency deviation value corresponding to the current temperature is obtained according to the ambient temperature and the temperature frequency deviation characteristic function, and the actual frequency output value of the crystal oscillator is calibrated according to the frequency deviation value, so that the precision of the output frequency is improved.
In the embodiment of the present disclosure, the electronic device may further include a positioning module; wherein the method further comprises: acquiring the arrival time of a satellite transmitting signal to the positioning module by using the output frequency of the crystal oscillator; and calculating the distance between the satellite and the electronic equipment according to the arrival time. The positioning module is used for receiving the transmitting signal of the satellite. The distance between the satellite and the terminal equipment can be calculated by multiplying the arrival time by the propagation rate of the electromagnetic wave so as to achieve the purpose of positioning. By measuring and calculating the satellite distance through the electronic equipment in the embodiment, the positioning accuracy of the global navigation satellite system can be improved.
In the positioning principle of a Global Navigation Satellite System (GNSS), the distance between a Satellite and a terminal device is estimated by multiplying the time when a Satellite transmission signal reaches a GNSS reception module by the propagation rate of electromagnetic waves. Therefore, the clock accuracy of the terminal device directly affects the positioning accuracy of the GNSS.
In an embodiment of the present disclosure, the electronic device may include a carrier, the crystal oscillator is mounted on the carrier, the electronic device may further include a Power Management chip (PMIC), the PMIC is electrically connected to the crystal oscillator, and the method is applied to the PMIC. The power management chip is a chip that plays roles in conversion, distribution, detection and other power management of power in the electronic equipment system. The power management chip can be used for frequency sampling, temperature detection and input compensation, and further the method of the embodiment of the disclosure is realized. A schematic diagram of a power management chip in an embodiment of the disclosure may be shown in fig. 2. The carrier may be, for example, a Printed Circuit Board (PCB), but the specific form of the carrier is not particularly limited in the present disclosure.
In an exemplary embodiment, the power management chip may be configured to obtain an actual output frequency of the crystal oscillator at each sampling temperature in a preset temperature interval in a process flow of a factory production line of the electronic device; correcting parameters of a temperature frequency deviation characteristic function of the crystal oscillator based on each sampling temperature and the corresponding actual output frequency and expected frequency; and calibrating the output frequency of the crystal oscillator according to the corrected temperature frequency deviation characteristic function.
According to the frequency calibration method for the electronic device, the output frequency of the crystal oscillator is sampled in the factory production process in the environment including the preset temperature interval so as to correct the parameters of the frequency deviation characteristic function of the crystal oscillator, so that the frequency calibration can be realized in the production process of the electronic device, and the frequency accuracy is improved.
In the related art, the temperature controlled crystal oscillator uses an analog compensation network or a digital compensation method inside the crystal oscillator to compensate the temperature frequency characteristic of the crystal element by using the variation of the crystal load reactance with the temperature, so as to achieve the crystal oscillator capable of reducing the temperature frequency offset. The voltage-controlled crystal oscillator realizes the function of adjusting the oscillation frequency along with the voltage-controlled voltage by introducing an adjustable element into an oscillation loop of the crystal oscillator. The adjustable element is a varactor diode generally, the varactor is an element of which the capacitance can change along with the external voltage, and the load capacitance of the quartz resonator changes by changing the voltage applied to the varactor diode, so that the resonant frequency of the resonant circuit changes along with the change of the load capacitance, and the purpose of voltage control is achieved. The peripheral circuits of the temperature control crystal oscillator and the voltage control crystal oscillator are complex, the occupied area of the PCB is large, and the cost is far higher than that of the crystal oscillator. According to the frequency calibration method of the electronic equipment, the output frequency of the crystal oscillator is calibrated, and the frequency precision of the crystal oscillator can be guaranteed on the premise of low cost and low board occupation area.
Fig. 3 schematically shows a flow chart of an embodiment of step S120 in fig. 1. In the embodiment of the present disclosure, the parameters include a first parameter and a second parameter.
As shown in fig. 3, the step S120 may further include the following steps in the embodiment of the present disclosure.
In step S121, a first frequency deviation value of each sampled temperature of the second temperature interval is determined based on each sampled temperature of the second temperature interval and the corresponding actual output frequency.
In step S122, the first parameter and the second parameter are corrected according to the first frequency deviation value and the desired frequency.
Fig. 4 schematically shows a flow chart of a method of frequency calibration of an electronic device according to yet another embodiment of the present disclosure. In the embodiment of the present disclosure, the process flow of the factory production line of the electronic device is an aging test flow of the electronic device. In the aging test station, the temperature can be raised and lowered circularly, and some performance indexes of the terminal electronic equipment are subjected to pressure test.
As shown in fig. 4, the method of the embodiment of the present disclosure may include steps S410 to S420.
In step S410, in the temperature raising process of the aging test process, a current temperature value and an actual output frequency of the crystal oscillator are sampled and obtained.
In step S420, the parameters of the temperature-frequency deviation characteristic function are corrected according to the current temperature value and the actual output frequency, so as to complete the self-calibration of the output frequency of the crystal oscillator.
In step S430, in the cooling process of the aging test process, a current temperature value and an actual output frequency of the crystal oscillator are sampled and obtained.
In step S440, the parameters of the temperature-frequency deviation characteristic function are corrected according to the current temperature value and the actual output frequency, so as to complete the self-calibration of the output frequency of the crystal oscillator.
Steps S410 to S440 are looped to continuously calibrate the frequency. The frequency calibration method of the electronic equipment in the embodiment utilizes the processes of temperature rise and temperature drop in the aging test station to perform learning sampling, and then corrects the frequency deviation through the self-calibration algorithm of the chip, so that the frequency deviation of the crystal oscillator is reduced, and the clock precision of the electronic equipment is improved.
Embodiments of the apparatus of the present disclosure are described below, which can be used to perform the frequency calibration method of the electronic device of the present disclosure.
Fig. 5 schematically shows a block diagram of a frequency calibration arrangement of an electronic device according to an embodiment of the present disclosure. As shown in fig. 5, the frequency calibration apparatus 50 of the electronic device provided in the embodiments of the present disclosure may include a frequency sampling module 510, a parameter modification module 520, and a frequency calibration module 530.
The frequency sampling module 510 may be configured to obtain an actual output frequency of the crystal oscillator at each sampling temperature in a preset temperature interval in a process flow of a factory production line of the electronic device.
In the embodiment of the present disclosure, the process flow of the factory production line of the electronic device includes an aging test flow of the electronic device.
In an embodiment of the present disclosure, the preset temperature interval includes a first temperature interval, a second temperature interval and a third temperature interval, where a temperature of the first temperature interval is lower than a temperature of the second temperature interval, and the second temperature interval is lower than a temperature of the third temperature interval.
In an exemplary embodiment, the preset temperature interval is [ -20 ℃, +55 ℃ ].
The parameter modification module 520 may be configured to modify a parameter of the temperature frequency deviation characterization function of the crystal oscillator based on each sampled temperature and its corresponding actual output frequency and desired frequency.
In the disclosed embodiment, the parameters include a first parameter and a second parameter; the parameter modification module 520 may include: the first frequency deviation calculation module is used for determining a first frequency deviation value of each sampling temperature in the second temperature interval based on each sampling temperature in the second temperature interval and the corresponding actual output frequency; and the first correction module is used for correcting the first parameter and the second parameter according to the first frequency deviation value and the expected frequency.
In the embodiment of the present disclosure, the parameters include a third parameter and a fourth parameter; the parameter modification module 520 may include: the second frequency deviation calculation module is used for determining a second frequency deviation value of each sampling temperature of the first temperature interval and the third temperature interval based on each sampling temperature of the first temperature interval and the third temperature interval and the corresponding actual output frequency; and the second correction module is used for correcting the third parameter and the fourth parameter according to the second frequency deviation value and the expected frequency.
The frequency calibration module 530 is configured to calibrate the output frequency of the crystal oscillator according to the corrected temperature frequency deviation characteristic function.
In the embodiment of the present disclosure, the electronic device may further include a positioning module; the positioning module can be used for acquiring the arrival time of a satellite transmitting signal to the positioning module by utilizing the output frequency of the crystal oscillator; and calculating the distance between the satellite and the electronic equipment according to the arrival time.
In the embodiment of the present disclosure, the electronic device may include a carrier plate, the crystal oscillator is mounted on the carrier plate, the electronic device may further include a power management chip, the power management chip is electrically connected to the crystal oscillator, and the apparatus may be disposed in the power management chip.
As each functional module of the frequency calibration apparatus of the electronic device in the exemplary embodiment of the present disclosure corresponds to a step of the exemplary embodiment of the frequency calibration method of the electronic device, please refer to the embodiment of the frequency calibration method of the electronic device in the present disclosure for details that are not disclosed in the embodiment of the apparatus of the present disclosure.
According to the frequency calibration device for the electronic equipment, provided by the embodiment of the disclosure, in a factory production process, the output frequency of the crystal oscillator is sampled in an environment including a preset temperature interval so as to correct the parameters of the frequency deviation characteristic function of the crystal oscillator, so that the frequency calibration can be realized in the production process of the electronic equipment, and the frequency accuracy is improved.
Fig. 6 schematically illustrates a block diagram of an electronic device according to an embodiment of the present disclosure, and a computer system 600 of the electronic device illustrated in fig. 6 is only an example and should not bring any limitation to the functions and the scope of use of the embodiment of the present disclosure.
As shown in fig. 6, the computer system 600 includes a Central Processing Unit (CPU)601 that can perform various appropriate actions and processes according to a program stored in a Read Only Memory (ROM)602 or a program loaded from a storage portion 607 into a Random Access Memory (RAM) 603. In the RAM603, various programs and data necessary for system operation are also stored. The CPU 601, ROM 602, and RAM603 are connected to each other via a bus 604. An input/output (I/O) interface 605 is also connected to bus 604.
The following components are connected to the I/O interface 605: an input portion 606 including a keyboard, a mouse, and the like; an output portion 607 including a display such as a Cathode Ray Tube (CRT), a Liquid Crystal Display (LCD), and the like, and a speaker; a storage section 608 including a hard disk and the like; and a communication section 609 including a network interface card such as a LAN card, a modem, or the like. The communication section 609 performs communication processing via a network such as the internet. The driver 610 is also connected to the I/O interface 605 as needed. A removable medium 611 such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, or the like is mounted on the drive 610 as necessary, so that a computer program read out therefrom is mounted in the storage portion 607 as necessary.
In particular, according to an embodiment of the present disclosure, the processes described above with reference to the flowcharts may be implemented as computer software programs. For example, embodiments of the present disclosure include a computer program product comprising a computer program embodied on a computer readable medium, the computer program comprising program code for performing the method illustrated in the flow chart. In such an embodiment, the computer program may be downloaded and installed from a network through the communication section 609, and/or installed from the removable medium 611. The above-described functions defined in the system of the present application are executed when the computer program is executed by the Central Processing Unit (CPU) 601.
It should be noted that the computer readable media shown in the present disclosure may be computer readable signal media or computer readable storage media or any combination of the two. A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the foregoing. More specific examples of the computer readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the present disclosure, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device. In contrast, in the present disclosure, a computer-readable signal medium may include a propagated data signal with computer-readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated data signal may take many forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wire, fiber optic cable, RF, etc., or any suitable combination of the foregoing.
The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams or flowchart illustration, and combinations of blocks in the block diagrams or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
The modules described in the embodiments of the present disclosure may be implemented by software, or may be implemented by hardware, and the described modules may also be disposed in a processor. Wherein the names of the modules do not in some cases constitute a limitation of the module itself.
As another aspect, the present application also provides a computer-readable medium, which may be contained in the electronic device described in the above embodiments; or may exist separately without being assembled into the electronic device. The computer-readable medium carries one or more programs which, when executed by the electronic device, cause the electronic device to implement the image processing method as described in the above embodiments.
For example, the electronic device may implement the following as shown in fig. 1: step S110, in the process flow of the factory production line of the electronic equipment, acquiring the actual output frequency of the crystal oscillator at each sampling temperature in a preset temperature interval; step S120, correcting the parameter of the temperature frequency deviation characteristic function of the crystal oscillator based on each sampling temperature and the corresponding actual output frequency and expected frequency; and step S130, calibrating the output frequency of the crystal oscillator according to the corrected temperature frequency deviation characteristic function.
As another example, the electronic device may implement the steps shown in fig. 1, fig. 3, and fig. 4.
It should be noted that although in the above detailed description several modules or units of the device for action execution are mentioned, such a division is not mandatory. Indeed, the features and functionality of two or more modules or units described above may be embodied in one module or unit, according to embodiments of the present disclosure. Conversely, the features and functions of one module or unit described above may be further divided into embodiments by a plurality of modules or units.
Through the above description of the embodiments, those skilled in the art will readily understand that the exemplary embodiments described herein may be implemented by software, or by software in combination with necessary hardware. Therefore, the technical solution according to the embodiments of the present disclosure may be embodied in the form of a software product, which may be stored in a non-volatile storage medium (which may be a CD-ROM, a usb disk, a removable hard disk, etc.) or on a network, and includes several instructions to enable a computing device (which may be a personal computer, a server, a touch terminal, or a network device, etc.) to execute the method according to the embodiments of the present disclosure.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (12)
1. A frequency calibration method of an electronic device, characterized in that the electronic device comprises a crystal oscillator; the method comprises the following steps:
in the process flow of a factory production line of the electronic equipment, acquiring the actual output frequency of the crystal oscillator at each sampling temperature in a preset temperature interval;
correcting parameters of a temperature frequency deviation characteristic function of the crystal oscillator based on each sampling temperature and the corresponding actual output frequency and expected frequency;
and calibrating the output frequency of the crystal oscillator according to the corrected temperature frequency deviation characteristic function.
2. The method of claim 1, wherein the electronic device comprises a carrier board, the crystal oscillator is mounted on the carrier board, the electronic device further comprises a power management chip, and the power management chip is electrically connected with the crystal oscillator, and the method is applied to the power management chip.
3. The method of claim 1, wherein the process flow of the factory production line of the electronic device comprises a burn-in test flow of the electronic device.
4. The method of claim 1, wherein the predetermined temperature interval comprises a first temperature interval, a second temperature interval, and a third temperature interval, wherein the first temperature interval has a temperature lower than a temperature of the second temperature interval, and the second temperature interval has a temperature lower than a temperature of the third temperature interval.
5. The method of claim 4, wherein the parameters comprise a first parameter and a second parameter; wherein, the parameter of the temperature frequency deviation characteristic function of the crystal oscillator is corrected based on each sampling temperature and the corresponding actual output frequency and expected frequency thereof, and the parameter comprises the following steps:
determining a first frequency deviation value of each sampling temperature of the second temperature interval based on each sampling temperature of the second temperature interval and the corresponding actual output frequency;
and correcting the first parameter and the second parameter according to the first frequency deviation value and the expected frequency.
6. The method of claim 4, wherein the parameters comprise a third parameter and a fourth parameter; wherein, the parameter of the temperature frequency deviation characteristic function of the crystal oscillator is corrected based on each sampling temperature and the corresponding actual output frequency and expected frequency thereof, and the parameter comprises the following steps:
determining a second frequency deviation value of each sampling temperature of the first temperature interval and the third temperature interval based on each sampling temperature of the first temperature interval and the third temperature interval and the corresponding actual output frequency;
and correcting the third parameter and the fourth parameter according to the second frequency deviation value and the expected frequency.
7. The method of claim 4, wherein the predetermined temperature range is [ -20 ℃, +55 ℃ ].
8. The method of claim 7, wherein the first temperature interval is [ -20 ℃, -10 ℃ ], the second temperature interval is (-10 ℃, +45 ℃), and the third temperature interval is [ +45 ℃, +55 ℃ ].
9. The method of claim 1, wherein the electronic device further comprises a positioning module; wherein the method further comprises:
acquiring the arrival time of a satellite transmitting signal to the positioning module by using the output frequency of the crystal oscillator;
and calculating the distance between the satellite and the electronic equipment according to the arrival time.
10. A frequency calibration apparatus of an electronic device, characterized in that the electronic device comprises a crystal oscillator; the device comprises:
the frequency sampling module is used for acquiring the actual output frequency of the crystal oscillator at each sampling temperature in a preset temperature interval in the process flow of a factory production line of the electronic equipment;
the parameter correction module is used for correcting the parameter of the temperature frequency deviation characteristic function of the crystal oscillator based on each sampling temperature and the corresponding actual output frequency and expected frequency;
and the frequency calibration module is used for calibrating the output frequency of the crystal oscillator according to the corrected temperature frequency deviation characteristic function.
11. An electronic device, comprising:
one or more processors;
storage means for storing one or more programs;
when executed by the one or more processors, cause the one or more processors to implement the method of any one of claims 1-9.
12. A computer-readable medium, on which a computer program is stored, which, when being executed by a processor, carries out the method according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910509966.0A CN112083226A (en) | 2019-06-13 | 2019-06-13 | Frequency calibration method and device for electronic equipment, medium and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910509966.0A CN112083226A (en) | 2019-06-13 | 2019-06-13 | Frequency calibration method and device for electronic equipment, medium and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112083226A true CN112083226A (en) | 2020-12-15 |
Family
ID=73733281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910509966.0A Pending CN112083226A (en) | 2019-06-13 | 2019-06-13 | Frequency calibration method and device for electronic equipment, medium and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112083226A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112651210A (en) * | 2020-12-29 | 2021-04-13 | 海光信息技术股份有限公司 | Modeling method, device and equipment for chip aging performance and storage medium |
| CN113625862A (en) * | 2021-08-17 | 2021-11-09 | 浪潮商用机器有限公司 | Power consumption control method and device, electronic equipment and readable storage medium |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0913945A2 (en) * | 1997-10-31 | 1999-05-06 | CTS Corporation | Temperature compensating circuit for a crystal oscillator |
| CN101965568A (en) * | 2008-01-31 | 2011-02-02 | 高通股份有限公司 | Crystal oscillator frequency calibration |
| DE102011009799A1 (en) * | 2010-01-31 | 2011-08-04 | Infineon Technologies AG, 85579 | Temperature compensation for an oscillator crystal |
| CN103684255A (en) * | 2012-09-12 | 2014-03-26 | 无锡华润矽科微电子有限公司 | Judgment and control method for compensation and calibration of temperature-compensated crystal oscillator with built-in crystals |
| CN106160761A (en) * | 2015-03-31 | 2016-11-23 | 联想(北京)有限公司 | A kind of transmitting frequency calibration method and electronic equipment |
| CN107272821A (en) * | 2017-06-07 | 2017-10-20 | 上海东软载波微电子有限公司 | Calibration method of real-time clock and device, storage medium, electronic equipment |
| CN107465393A (en) * | 2017-07-05 | 2017-12-12 | 广州昂宝电子有限公司 | Frequency compensated system and method for Real Time Clock System |
| CN108663696A (en) * | 2018-04-27 | 2018-10-16 | Oppo广东移动通信有限公司 | Update method, device, storage medium and the mobile terminal of temperature and frequency deviation relationship |
-
2019
- 2019-06-13 CN CN201910509966.0A patent/CN112083226A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0913945A2 (en) * | 1997-10-31 | 1999-05-06 | CTS Corporation | Temperature compensating circuit for a crystal oscillator |
| CN101965568A (en) * | 2008-01-31 | 2011-02-02 | 高通股份有限公司 | Crystal oscillator frequency calibration |
| DE102011009799A1 (en) * | 2010-01-31 | 2011-08-04 | Infineon Technologies AG, 85579 | Temperature compensation for an oscillator crystal |
| CN103684255A (en) * | 2012-09-12 | 2014-03-26 | 无锡华润矽科微电子有限公司 | Judgment and control method for compensation and calibration of temperature-compensated crystal oscillator with built-in crystals |
| CN106160761A (en) * | 2015-03-31 | 2016-11-23 | 联想(北京)有限公司 | A kind of transmitting frequency calibration method and electronic equipment |
| CN107272821A (en) * | 2017-06-07 | 2017-10-20 | 上海东软载波微电子有限公司 | Calibration method of real-time clock and device, storage medium, electronic equipment |
| CN107465393A (en) * | 2017-07-05 | 2017-12-12 | 广州昂宝电子有限公司 | Frequency compensated system and method for Real Time Clock System |
| CN108663696A (en) * | 2018-04-27 | 2018-10-16 | Oppo广东移动通信有限公司 | Update method, device, storage medium and the mobile terminal of temperature and frequency deviation relationship |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112651210A (en) * | 2020-12-29 | 2021-04-13 | 海光信息技术股份有限公司 | Modeling method, device and equipment for chip aging performance and storage medium |
| CN112651210B (en) * | 2020-12-29 | 2023-04-25 | 海光信息技术股份有限公司 | Chip aging performance modeling method, device, equipment and storage medium |
| CN113625862A (en) * | 2021-08-17 | 2021-11-09 | 浪潮商用机器有限公司 | Power consumption control method and device, electronic equipment and readable storage medium |
| CN113625862B (en) * | 2021-08-17 | 2023-09-01 | 浪潮商用机器有限公司 | Power consumption control method and device, electronic equipment and readable storage medium |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110311673B (en) | Frequency calibration method, terminal and storage medium | |
| CN100456858C (en) | Time error compensation device and method for terminal | |
| CN107465393B (en) | System and method for frequency compensation of real time clock system | |
| US9917755B1 (en) | Providing fast radio-frequency delay measurements for envelope tracking | |
| US20170307762A1 (en) | Circuit device, oscillator, electronic apparatus, and vehicle | |
| CN108736984B (en) | Frequency offset calibration method and device for radio frequency module | |
| CN110212863B (en) | Method, apparatus, electronic device and storage medium for calibrating crystal oscillator | |
| CN112083226A (en) | Frequency calibration method and device for electronic equipment, medium and electronic equipment | |
| CN102185663B (en) | Frequency calibration method and device | |
| WO2016206384A1 (en) | Crystal oscillator circuit, crystal oscillator circuit tuning method, and storage medium | |
| US6636121B2 (en) | Method for estimating crystal coefficient values for a signal generator | |
| CN114647178B (en) | Automatic atomic clock calibration method and system based on Beidou and ground reference transmission | |
| CN109212560B (en) | Method and apparatus for compensating frequency inaccuracy of frequency generator such as oscillator | |
| US9838023B2 (en) | Slow-clock calibration method and unit, clock circuit, and mobile communication terminal | |
| CN114201001A (en) | Compensation method and device of real-time clock, terminal equipment and medium | |
| CN110031229B (en) | Motor bandwidth measuring method and device | |
| CN113114108A (en) | Method for estimating crystal oscillator frequency | |
| US8909164B2 (en) | Frequency offset correction | |
| CN101488752B (en) | Temperature frequency correcting apparatus | |
| CN111045317B (en) | Calibration method, device and system of equipment clock, self-calibration method and equipment | |
| CN105634473A (en) | Method and device for adjusting frequency of mobile terminal | |
| CN101488751B (en) | Measurement system and method for temperature frequency correcting apparatus | |
| CN111045318A (en) | Calibration method, device and system of equipment clock, self-calibration method and equipment | |
| CN214896238U (en) | Local clock calibration device of satellite time service system receiver | |
| CN110830033B (en) | Clock frequency compensation method and system for GNSS system, storage medium and terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201215 |