CN112072292A - Radio frequency antenna plate and array surface switching method - Google Patents
Radio frequency antenna plate and array surface switching method Download PDFInfo
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- CN112072292A CN112072292A CN202010939632.XA CN202010939632A CN112072292A CN 112072292 A CN112072292 A CN 112072292A CN 202010939632 A CN202010939632 A CN 202010939632A CN 112072292 A CN112072292 A CN 112072292A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
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Abstract
The embodiment of the invention provides a radio frequency antenna board and a wavefront switching method, relating to the technical field of radio frequency integration, wherein the radio frequency antenna board comprises a wavefront radio frequency board, a wavefront control connector, a power synthesizer, a plurality of surface-mounted connectors and a plurality of switch chips, wherein each switch chip is respectively connected with each surface-mounted connector and the power synthesizer, each surface-mounted connector and the power synthesizer are respectively connected with the wavefront control connector, each wavefront arranged on the wavefront radio frequency board is respectively connected with each switch chip, a radio frequency signal of each wavefront can be transmitted to each surface-mounted connector or the power synthesizer through each switch chip and output through the wavefront control connector, therefore, through the collocation of the switch chips, the surface-mounted connectors and the power synthesizer, when switching, different wavefronts can work only by connecting the switch chips with the surface-mounted connectors or the power synthesizers, the method is simple and convenient to operate, high in flexibility and good in instantaneity.
Description
Technical Field
The invention relates to the technical field of radio frequency integration, in particular to a radio frequency antenna plate and a method for switching a front surface.
Background
In an existing MIMO (Multiple-In Multiple-Out) architecture radio frequency network, a single array is generally used as a basic discrete unit, and each unit is independent from each other, and a radio frequency cable needs to be lapped externally to feed a composite network to realize unified management of the radio frequency network. Therefore, the unified management of most MIMO architecture radio frequency networks is complex, which causes the switching of the working states to be inconvenient, and is difficult to switch in time, thereby being difficult to meet the working requirements of different scenes.
Disclosure of Invention
Based on the above research, the present invention provides a radio frequency antenna board and a wavefront switching method to improve the above problems.
Embodiments of the invention may be implemented as follows:
in a first aspect, an embodiment of the present invention provides a radio frequency antenna board, including a front plane radio frequency board, a front plane control connector, a power combiner, a plurality of surface mount connectors, and a plurality of switch chips;
each switch chip is respectively connected with each surface-mounted connector and the power synthesizer, and each surface-mounted connector and the power synthesizer are respectively connected with the array surface control connector;
the array face radio frequency board is provided with a plurality of array faces, each array face is respectively connected with each switch chip, and radio frequency signals of each array face are transmitted to each surface-mounted connector or the power combiner through each switch chip and are output through the array face control connector.
In an alternative embodiment, the power combiner comprises a first power combiner and at least two second power combiners;
each second power combiner is connected with at least one switch chip, each second power combiner is connected with the first power combiner, and the first power combiner is connected with the front surface control connector;
each second power synthesizer is used for carrying out power combination on the radio-frequency signals transmitted by the connected switch chips and transmitting the combined radio-frequency signals to the first power synthesizer;
the first power synthesizer is used for power combination of the radio frequency signals transmitted by the second power synthesizers and transmitting the combined radio frequency signals to the array surface control connector.
In an optional embodiment, the rf antenna board further includes a controller, and the controller is connected to each of the switch chips;
the controller is used for controlling the working mode of the radio frequency antenna plate and controlling the switch chips to be communicated with the surface-mounted connectors or the second power synthesizer according to the working mode.
In an alternative embodiment, the mode of operation comprises a single-wavefront mode of operation;
and when the working mode is the single-array-face mode, all the switch chips are used for being communicated with the surface-mounted connector under the control of the controller.
In an optional embodiment, the working mode includes an N wavefront synthesis mode, where N is a positive integer, N > 1 and N < the number of wavefronts of the radio frequency antenna board;
and when the working mode is an N array surface synthesis mode, the N switch chips are used for being communicated with the connected second power synthesizer under the control of the controller, and the other switch chips are used for being communicated with the connected surface-mounted connector under the control of the controller.
In an alternative embodiment, the operational mode includes a full-front synthesis mode;
when the working mode is the full-array-face synthesis mode, all the switch chips are used for being communicated with the connected second power synthesizer under the control of the controller.
In an optional embodiment, each array plane is connected to each switch chip through a first radio frequency microstrip line, each switch chip is connected to each surface-mounted connector through a second radio frequency microstrip line, and each surface-mounted connector is connected to the array plane control connector through a first radio frequency cable;
each second power combiner is connected with the switch chip through a third radio frequency microstrip line, each second power combiner is connected with the first power combiner through a second radio frequency cable, and the first power combiner is connected with the array surface control connector through a third radio frequency cable.
In a second aspect, an embodiment of the present invention provides a wavefront switching method, applied to a controller, for wavefront switching of a radio frequency antenna board according to any one of the foregoing embodiments, where the method includes:
controlling a switch chip to be communicated with a surface-mounted connector connected according to the working mode of the radio frequency antenna board, so that radio frequency signals of all array surfaces are transmitted to the surface-mounted connector and transmitted to the array surface control connector through the surface-mounted connector; and/or, controlling the switch chip to be communicated with the connected power synthesizer, so that the radio-frequency signals of each array surface are transmitted to the power synthesizer and transmitted to the array surface control connector through the power synthesizer;
when the control switch chip is communicated with the connected surface-mounted connector and the control switch chip is communicated with the connected power synthesizer, any switch chip is only communicated with the surface-mounted connector or only communicated with the power synthesizer.
In an alternative embodiment, the power combiner includes a first power combiner and at least two second power combiners, each of the second power combiners is connected to at least one of the switching chips, each of the second power combiners is connected to the first power combiner, and the first power combiner is connected to the front plane control connector; the working mode comprises a single array surface mode and a full array surface synthesis mode;
the control switch chip is communicated with the surface-mounted connector connected according to the working mode of the radio frequency antenna plate; and/or the step of controlling the switching chip to be communicated with the connected power synthesizer comprises the following steps:
if the working mode is a single array plane mode, controlling all the switch chips to be communicated with the surface-mounted connectors connected with the switch chips, so that the radio-frequency signals of all the array planes are transmitted to the corresponding surface-mounted connectors through all the switch chips and are transmitted to the array plane control connectors through all the surface-mounted connectors;
and if the working mode is the full-array-face synthesis mode, controlling all the switch chips to be communicated with the connected second power synthesizer, so that the radio-frequency signals of all the array faces are transmitted to all the second power synthesizers through all the switch chips, performing power combination on the radio-frequency signals transmitted by all the switch chips through all the second power synthesizers, transmitting the combined radio-frequency signals to the first power synthesizer, combining the combined radio-frequency signals again through the first power synthesizer, and transmitting the combined radio-frequency signals to the array-face control connector.
In an optional embodiment, the operating mode further includes an N wavefront synthesis mode, where N is a positive integer, N > 1 and N < the number of wavefronts of the radio frequency antenna board;
controlling the switch chip to be communicated with the connected surface-mounted connector according to the working mode of the radio frequency antenna plate; and/or the step of controlling the switching chip to be communicated with the connected power synthesizer comprises the following steps:
if the working mode is an N array surface synthesis mode, determining any N target switch chips from all the switch chips;
controlling each target switch chip to be communicated with a connected second power synthesizer, performing power combination on radio-frequency signals transmitted by each target switch chip through each second power synthesizer, transmitting the combined radio-frequency signals to a first power synthesizer, combining the combined radio-frequency signals again through the first power synthesizer, and transmitting the combined radio-frequency signals to the array surface control connector;
and controlling other switch chips to be communicated with the surface-mounted connector, and transmitting radio-frequency signals to the array surface control connector through the surface-mounted connector.
The radio frequency antenna board and the array face switching method provided by the embodiment of the invention comprise an array face radio frequency board, an array face control connector, a power synthesizer, a plurality of surface-mounted connectors and a plurality of switch chips, wherein each switch chip is respectively connected with each surface-mounted connector and the power synthesizer, each surface-mounted connector and the power synthesizer are respectively connected with the array face control connector, each array face arranged on the array face radio frequency board is respectively connected with each switch chip, the radio frequency signal of each array face can be transmitted to each surface-mounted connector or the power synthesizer through each switch chip and is output through the array face control connector, therefore, different array faces can work by matching the switch chips with the surface-mounted connectors or the power synthesizer only by connecting the switch chips with the surface-mounted connectors or the power synthesizers during switching, thereby meeting the working requirements under different application scenes, the method is simple and convenient to operate, high in flexibility and good in instantaneity.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a radio frequency antenna board according to an embodiment of the present invention.
Fig. 2 is a second schematic structural diagram of the rf antenna board according to the embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a switch chip according to an embodiment of the present invention.
Fig. 4 is a third schematic structural diagram of a radio frequency antenna board according to an embodiment of the present invention.
Fig. 5 is a fourth schematic structural diagram of the rf antenna board according to the embodiment of the present invention.
Icon: 100-a radio frequency antenna board; 10-array face radio frequency board; 20-a wavefront control connector; 30-a power combiner; 31-a first power combiner; 32-a second power combiner; 40-surface mount connectors; 50-a switch chip; 60-wavefront; 71-a first radio frequency microstrip line; 72-a second radio frequency microstrip line; 73-a first radio frequency cable; 74-a third radio frequency microstrip line; 75-a second radio frequency cable; 76-a third radio frequency cable; 80-a controller.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
In the application scenario of a 5th generation mobile communication technology (5G) millimeter wave base station, large-scale multiple input multiple output (Massive MIMO) application is an important content. Due to the large bandwidth of the millimeter wave frequency band, the system architecture of the 5G millimeter wave frequency band product mainly adopts the Massive MIMO technology to overcome the higher path loss. Considering various factors such as cost and device maturity, the 5G millimeter wave frequency band Massive MIMO has many possible design schemes, including a full digital architecture, a digital-analog hybrid architecture and a lens antenna. Different architectures still need to be studied deeply for the hardware requirements of the system and the system performance, such as the key devices of antenna array, filter, PA, local oscillator, etc., and the key technologies of beam management, calibration, linearization, heat dissipation, etc.
In the existing radio frequency network with the MIMO architecture, a single array is generally used as a basic discrete unit, each unit is independent, and radio frequency cables are adopted to perform external discrete lap joint feeding synthesis network so as to realize unified management of the radio frequency network. Therefore, most MIMO architecture radio frequency networks have complex structures and difficult unified management, so that the switching of the working modes is inconvenient, the working modes are switched by manual operation, and timely switching is difficult to achieve, so that the multi-input multi-output function is difficult to realize, and the working requirements of different scenes are difficult to meet.
Meanwhile, when radio frequency cables are adopted to carry out external discrete lapping to realize the unified management of the radio frequency network, a feed synthetic network with a larger size is often needed, and meanwhile, the feed synthetic network generally adopts a metal cavity lapped radio frequency soft substrate to be matched with a waveguide cavity for transition to realize the unified management of the radio frequency network.
The feed synthesis network realized based on the metal structural member has wider application in the current radar, communication and other technical scenes, the design of the feed synthesis network is early, the current maturity is very high, a transmission line structure is generally realized by adopting a Rogers5880 radio frequency soft substrate, and then the structural support is realized by utilizing a metal cavity. The radio frequency soft substrate and metal cavity processing technology is mature in the millimeter wave industry, the single-layer or double-layer radio frequency board manufacturing process greatly solves the problem of transmission efficiency of radio frequency signals, signal quality is improved, and meanwhile, the metal cavity is convenient to achieve under the existing manufacturing process.
Although the continuity of radio frequency signal transmission is guaranteed when the feed combining network is butted with the antenna subunit, and the realization effect of the feed combining network basically guarantees the technical target of the current 4 × 64 antenna unit, the MIMO radio frequency network externally lapped with the feed combining network has larger size and higher processing cost, and is insufficient in competitiveness when applied to scenes such as millimeter wave base stations.
Based on the above research, the present embodiment provides a radio frequency antenna board 100 to improve the above problem.
Referring to fig. 1, the present embodiment provides an rf antenna board 100, which includes a front plane rf board 10, a front plane control connector 20, a power combiner 30, a plurality of surface mount connectors 40, and a plurality of switch chips 50.
Each switch chip 50 is connected to each surface-mount connector 40 and the power combiner 30, and each surface-mount connector 40 and the power combiner 30 are connected to the array-side control connector 20.
The array rf board 10 is provided with a plurality of arrays 60, each array 60 is connected to each switch chip 50, and the rf signal of each array 60 is transmitted to each surface-mounted connector 40 or the power combiner 30 through each switch chip 50 and output through the array control connector 20.
The radio frequency antenna board provided by this embodiment connects each switch chip with each surface-mount connector and power combiner, connects each surface-mount connector and power combiner with the array surface control connector, and connects each array surface arranged on the array surface radio frequency board with each switch chip, when switching, only needs to connect the switch chip with the surface-mount connector or the power combiner, so that different array surfaces can work, the realization of multi-input multi-output function becomes easier, the working requirements under different application scenarios are met, the operation is simple, the flexibility is high, and the real-time performance is better.
Optionally, the array surface 60 configured on the rf antenna board 100 may be an array surface of 64 array elements, and the array surface of 64 array elements is a subunit.
In practical application, a discrete subunit antenna system is adopted, so that when subunits are spliced, a certain array gap often exists, mutual coupling between the antennas is serious, the influence on the operation of the subunit antennas is weak, and when a plurality of subunit array elements operate, serious antenna grating lobes exist, the performance of the antennas is influenced, and the performance of a receiving and transmitting network of a base station is further influenced.
Therefore, in the present embodiment, the plurality of wavefront 60 disposed on the rf antenna board 100 are close and seamless, and the size of each wavefront 60 is the same. As shown in fig. 1, the rf antenna board 100 shown in fig. 1 is configured with four array surfaces 60, the four array surfaces 60 are the same and are 64 array elements, and each array surface is closely and seamlessly spliced, so that mutual coupling between the antenna array surfaces can be reduced, and the performance of the antenna array surfaces is not affected, thereby ensuring the performance of the transceiver network of the base station.
To further realize the switching and combining of the arbitrary wavefront 60, referring to fig. 2, in the present embodiment, the power combiner 30 includes a first power combiner 31 and at least two second power combiners 32.
Each second power combiner 32 is connected to at least one switching chip 50, the respective second power combiner 32 is connected to the first power combiner 31, and the first power combiner 31 is connected to the front plane control connector 20.
Each second power combiner 32 is configured to combine the powers of the radio frequency signals transmitted by the connected switch chips 50, and transmit the combined radio frequency signals to the first power combiner 31.
The first power combiner 31 is configured to combine the powers of the rf signals transmitted by the second power combiners 32, and transmit the combined rf signals to the front control connector 20.
Each second power combiner 32 is connected to at least one switch chip 50, and all the second power combiners 32 are connected to the first power combiner 31, so that after the radio-frequency signals with different wave fronts 60 are transmitted to each second power combiner 32 through the switch chip 50, each second power combiner 32 can perform power combination on the radio-frequency signals, and after combination, transmit the combined radio-frequency signals to the first power combiner 31, and perform power combination again by the first power combiner 31, thereby implementing combination and switching of any wave fronts 60.
Optionally, in order to increase the switching speed of the front 60, in this embodiment, the switch chip 50 is a single-pole double-throw switch chip 50, so that it can be ensured that one switch chip 50 is in communication with only the surface-mount connector 40 or the second power combiner 32 during operation, and the switching speed can be effectively increased, as shown in fig. 3.
Optionally, in this embodiment, the number of the switch chips 50 is the same as the number of the array planes 60, that is, one switch chip 50 is connected to each array plane 60, and meanwhile, the number of the switch chips 50 is the same as the number of the surface mount connectors 40, that is, each switch chip 50 is connected to one surface mount connector 40. Optionally, in this embodiment, the surface mount connector 40 may be a radio frequency surface mount SMP connector.
According to the radio frequency antenna board provided by the embodiment, the switch chip is connected with the surface-mounted connector and the second power synthesizer, and when switching is performed, switching of any array surface and combination of any array surface can be achieved only by communicating the switch chip with the surface-mounted connector or the second power synthesizer.
In addition, the rf antenna board 100 provided in this embodiment is based on a novel rf material system as a basic structure, and integrates a multi-channel array element antenna, a switch chip, a surface mount connector, and a power combiner, thereby solving the problems of a conventional structure, such as large volume and high cost.
In practical application, the conventional mode adopts a mode of fully integrating strip lines on a radio frequency plate, so that higher loss is introduced in a 5G millimeter wave frequency band, and radio frequency efficiency is reduced, in order to further reduce the volume and loss of the conventional architecture, please refer to fig. 4 in combination, each array plane 60 is connected with each switch chip 50 through a first radio frequency microstrip line 71, each switch chip 50 is connected with each surface-mounted connector 40 through a second radio frequency microstrip line 72, and each surface-mounted connector 40 is connected with the array plane control connector 20 through a first radio frequency cable 73.
Each second power combiner 32 is connected to the switch chip 50 through a third radio frequency microstrip line 74, each second power combiner 32 is connected to the first power combiner 31 through a second radio frequency cable 75, and the first power combiner 31 is connected to the wavefront control connector 20 through a third radio frequency cable 76.
The radio frequency antenna board 100 provided by this embodiment adopts a mode of hybrid integration of a radio frequency cable and a radio frequency microstrip line, reduces the volume and size of a radio frequency network, increases the flexibility of the radio frequency network, and greatly reduces the cost.
In order to facilitate the switching of the switch chips 50 to realize the switching of the operating modes of the rf antenna board 100, in this embodiment, please refer to fig. 5, the rf antenna board 100 further includes a controller 80, and the controller 80 is connected to each switch chip 50. Optionally, the controller 80 and each switch chip 50 may be connected in communication or electrically.
The controller 80 is configured to control an operation mode of the rf antenna board 100, and control each switch chip 50 to communicate with each surface mount connector 40 or each second power combiner 32 according to the operation mode.
The controller 80 may be integrated on the rf antenna board 100, and is in communication connection with each switch chip 50, and switches the operating mode of the rf antenna board 100 by controlling the switch chip 50 to be communicated with the surface-mount connector 40 or to be communicated with the second power combiner 32, so as to control the operating mode of the rf antenna board 100.
Optionally, in this embodiment, the operation modes of the rf antenna board 100 include a single-wavefront operation mode, an N-wavefront synthesis mode, and a full-wavefront synthesis mode, where N is a positive integer, N > 1, and N < the number of wavefronts 60 of the rf antenna board 100.
When the operation mode is the single-front mode, all the switch chips 50 are used to communicate with the attached surface mount connector 40 under the control of the controller 80.
When the operation mode is the N front plane combination mode, the N switching chips 50 are configured to communicate with the connected second power combiner 32 under the control of the controller 80, and the other switching chips 50 are configured to communicate with the connected surface mount connector 40 under the control of the controller 80.
When the operation mode is the full-front combining mode, all the switching chips 50 are used to communicate with the connected second power combiner 32 under the control of the controller 80.
Taking fig. 1, fig. 2, and fig. 4 as an example, the four front surfaces 60 of the rf antenna board 100 are a1, a2, a3, and a4, respectively. A1, a2, A3 and a4 on the wavefront control connector 20 respectively represent the link ports of the surface mount connector 40 corresponding to the four wavefronts 60, that is, a1 represents the link port of the surface mount connector 40 corresponding to the a1 wavefront, a2 represents the link port of the surface mount connector 40 corresponding to the a2 wavefront, A3 represents the link port of the surface mount connector 40 corresponding to the A3 wavefront, a4 represents the link port of the surface mount connector 40 corresponding to the a4 wavefront, and M on the wavefront control connector 20 represents the link port of the first power combiner 31.
When the operation mode is the single-wavefront mode, all the switch chips 50 are used to communicate with the connected surface mount connectors 40 under the control of the controller 80, so that the links a1, a2, A3, and a4 are all turned on, the radio frequency signal is transmitted to each switch chip 50 through each first radio frequency microstrip line 71, enters each surface mount connector 40 through each second radio frequency microstrip line 72, then enters the wavefront control connector 20 through each first radio frequency cable 73, and is output by the ports a1, a2, A3, and a4 on the wavefront control connector 20, thereby realizing the independent operation function of the four wavefronts 60(a1, a2, A3, and a 4).
When the operation mode is the N front combination mode, assuming that N is 2, the controller 80 controls the switching chips 50 of any two front planes 60 to communicate with the second power combiner 32, and controls the switching chips 50 of the other two front planes 60 to communicate with the surface mount connector 40. The radio frequency signals of the switch chips 50 and the array surfaces 60 communicated with the surface mount connector 40 are transmitted to each switch chip 50 through the first radio frequency microstrip line 71, then enter the surface mount connector 40 through the second radio frequency microstrip line 72, then enter the array surface control connector 20 through each first radio frequency cable 73, and are output by the corresponding port on the array surface control connector 20 as in a single array surface mode. For example, if the switch chip 50 of the a1 front plane 60 communicates with the surface mount connector 40, the radio frequency signal is output from the a 1.
The radio frequency signal received from the antenna array 60 of the switch chip 50 and the second power combiner 32 is transmitted to the switch chip 50 through the first radio frequency microstrip line 71, then enters the second power combiner 32 through the switch chip 50 and the third radio frequency microstrip line 74, is power-combined by the second power combiner 32, then enters the first power combiner 31 through the second radio frequency cable 75, is power-combined again by the first power combiner 31, and is transmitted to the array control connector 20 through the third radio frequency cable 76, and is output by the port M on the array control connector 20.
It should be noted that, if each second power combiner 32 is connected to only one single wavefront 60, that is, one second power combiner 32 receives only one rf signal of the wavefront 60, each second power combiner 32 transmits the received rf signal to the first power combiner 31 for power combining. If each second power combiner 32 is connected to the plurality of wavefronts 60, and one second power combiner 32 receives the radio frequency signals of the plurality of wavefronts 60, each second power combiner 32 power combines the received radio frequency signals of the plurality of wavefronts 60, and transmits the power-combined radio frequency signal to the first power combiner 31, and the first power combiner 31 combines the radio frequency signals transmitted by each second power combiner 32.
For example, if the switch chips 50 of the a1 and the a2 array planes 60 are communicated with the second power combiner 32, and the switch chips 50 of the a3 and the a4 array planes 60 are communicated with the surface mount connector 40, the radio frequency signals received by the a1 and the a2 array planes 60 respectively pass through the first radio frequency microstrip line 71 and then are transmitted to the corresponding switch chip 50, and then pass through the corresponding switch chip 50 and enter the second power combiner 32 through the third radio frequency microstrip line 74. Since the switching chips 50 of the a1 and a2 fronts 60 in fig. 1 are connected to the same second power combiner 32, the rf signals of the a1 and a2 fronts 60 are combined at the second power combiner 32, and the combined rf signal is transmitted to the first power combiner 31 through the second rf cable 75, transmitted to the front control connector 20 through the first power combiner 31 through the third rf cable 76, and output through the M port of the front control connector 20. The rf signals of a1 and a2 wavefront 60 are transmitted to the wavefront control connector 20 as in the single-wavefront operation mode and output through the a1 and a2 ports of the wavefront 60 controller 80.
For another example, when the switch chips 50 of the a1 and the a3 array planes 60 communicate with the second power combiner 32, and the switch chips 50 of the a2 and the a4 array planes 60 communicate with the surface mount connector 40, the radio frequency signals received by the a2 and the a4 array planes 60 are respectively transmitted to the corresponding switch chips 50 through the first radio frequency microstrip line 71, and then enter the second power combiner 32 through the third radio frequency microstrip line 74 through the corresponding switch chips 50. Since the switching chips 50 of the a2 and a4 fronts 60 in fig. 1 are connected to different second power combiners 32, after the rf signals of the a2 and a4 fronts 60 are transmitted to the corresponding second power combiners 32, the rf signals of the a2 and a4 fronts 60 are transmitted to the first power combiner 31 through the second rf cable 75, and the power of the rf signals of the a2 and a4 fronts 60 is combined by the first power combiner 31, and then transmitted to the front control connector 20 through the third rf cable 76, and output from the M port of the front control connector 20. The rf signals of the a1 and A3 wavefront 60 are transmitted to the wavefront control connector 20 as in the single-wavefront 60 operation mode and output through the a1 and A3 ports of the wavefront 60 controller 80.
When the operation mode is the N-wavefront 60 combining mode, assuming that N is 3, the controller 80 controls the switching chips 50 of any three of the wavefronts 60 to communicate with the second power combiner 32, and controls the switching chip 50 of another wavefront 60 to communicate with the surface mount connector 40. The radio frequency signals of the switch chips 50 and the array surface 60 communicated with the surface mount connector 40 are transmitted to each switch chip 50 through the first radio frequency microstrip line 71, then enter the surface mount connector 40 through the second radio frequency microstrip line 72, then enter the array surface control connector 20 through each first radio frequency cable 73, and are output by the corresponding port on the array surface control connector 20 as in the single array surface 60 mode.
The radio frequency signal received from the wavefront 60 by the switch chip 50 and the wavefront 60 communicated with the second power combiner 32 is transmitted to the switch chip 50 after passing through the first radio frequency microstrip line 71, then enters the second power combiner 32 for combining through the switch chip 50 via the third radio frequency microstrip line 74, enters the first power combiner 31 for power combining again through the second radio frequency cable 75 after power combining by the second power combiner 32, and is transmitted to the wavefront control connector 20 through the third radio frequency cable 76, and is output by the port M on the wavefront control connector 20.
When the operation mode is the full-front 60 combining mode, the controller 80 controls all the switching chips 50 to communicate with the connected second power combiner 32. The radio frequency signals received by each array face 60 are transmitted to each switch chip 50 after passing through each first radio frequency microstrip line 71, then enter each second power combiner 32 through each switch chip 50 via each third radio frequency microstrip line 74 for combining, after power combining by each second power combiner 32, enter the first power combiner 31 through each second radio frequency cable 75 for power combining again, and are transmitted to the array face control connector 20 through the third radio frequency cable 76, and are output by a port M on the array face control connector 20.
The radio frequency antenna board provided by the embodiment can rapidly realize the working state switching of any array surface through the matching of the switch chip, the surface-mounted connector and the power divider. Aiming at different application scenes of the 5G millimeter wave, the switching of any state such as a single array surface, a double array surface, a three array surface or a four array surface can be carried out, meanwhile, based on the expanded radio frequency interface, the antenna array surface can meet the working requirements of different power requirements under different scenes, and the realization of the 5G millimeter wave multi-input multi-output function is easier through the organic combination of the radio frequency cable and the switching device. Meanwhile, the controller controls the switch chip to switch the working mode of the array surface, the switching speed is higher, the strain capacity facing different application scenes is higher, the performance advantages of the novel radio-frequency plate are fully exerted, the flexibility is increased, and the application scene of the millimeter-wave radio-frequency front end is greatly improved.
The radio frequency antenna board provided by the embodiment is based on a novel radio frequency material system as a basic framework, integrates devices such as a switch chip, a radio frequency cable, a power combiner and a surface-mounted connector, overcomes the defects of high loss, large size and the like of a traditional mode, achieves the aim of switching work of any array plane and combination work of any array plane, and achieves the function of multiple input and multiple output of a radio frequency network based on different combination work modes of any array plane.
On the basis, this embodiment provides a method for switching a wavefront, which is applied to a controller, where the controller may be integrated with the rf antenna board or may be separately disposed from the rf antenna board, and the controller is connected to a switch chip on the rf antenna board, and is connected to a surface-mount connector or a power combiner by controlling the switch chip, so as to implement the switching of the wavefront of the rf antenna board.
The wavefront switching method provided by the embodiment comprises the following steps:
according to the working mode of the radio frequency antenna board, the control switch chip is communicated with the surface-mounted connector, so that the radio frequency signals of all array surfaces are transmitted to the surface-mounted connector and transmitted to the array surface control connector through the surface-mounted connector; and/or the control switch chip is communicated with the connected power synthesizer, so that the radio-frequency signals of all the array surfaces are transmitted to the power synthesizer and transmitted to the array surface control connector through the power synthesizer.
When the control switch chip is communicated with the surface-mounted connector connected with the control switch chip and the power synthesizer connected with the control switch chip, any switch chip is only communicated with the surface-mounted connector or only communicated with the power synthesizer.
In an alternative embodiment, the operation mode includes a single-wavefront mode and a full-wavefront synthesis mode; controlling the switch chip to be communicated with the connected surface-mounted connector according to the working mode of the radio frequency antenna board; and/or the step of controlling the switching chip to be communicated with the connected power synthesizer comprises the following steps:
and if the working mode is the single array surface mode, controlling all the switch chips to be communicated with the surface-mounted connectors connected with the switch chips, so that the radio-frequency signals of all the array surfaces are transmitted to the corresponding surface-mounted connectors through all the switch chips and are transmitted to the array surface control connectors through all the surface-mounted connectors.
And if the working mode is the full array plane synthesis mode, controlling all the switch chips to be communicated with the connected second power synthesizer, so that the radio-frequency signals of all the array planes are transmitted to all the second power synthesizers through all the switch chips, performing power combination on the radio-frequency signals transmitted by all the switch chips through all the second power synthesizers, transmitting the combined radio-frequency signals to the first power synthesizer, combining the combined radio-frequency signals again through the first power synthesizer, and transmitting the combined radio-frequency signals to the array plane control connector.
In an optional embodiment, the working mode includes an N wavefront synthesis mode, N is a positive integer, N > 1 and N < the number of wavefronts of the radio frequency antenna board;
controlling the switch chip to be communicated with the connected surface-mounted connector according to the working mode of the radio frequency antenna board; and/or the step of controlling the switching chip to be communicated with the connected power synthesizer comprises the following steps:
and if the working mode is the N array surface synthesis mode, determining any N target switch chips from all the switch chips.
And controlling each target switch chip to be communicated with the connected second power synthesizer, carrying out power combination on the radio-frequency signals transmitted by each target switch chip through each second power synthesizer, transmitting the combined radio-frequency signals to the first power synthesizer, combining the combined radio-frequency signals again through the first power synthesizer, and transmitting the combined radio-frequency signals to the array surface control connector.
And controlling other switch chips to be communicated with the surface-mounted connector, and transmitting the radio-frequency signal to the array surface control connector through the surface-mounted connector.
According to the array plane switching method provided by the embodiment, the switching of any array plane and the combination of any array plane can be realized by controlling the switch chip to be communicated with the surface-mounted connector or the second power combiner, so that the switching of the working state of the radio frequency antenna board is realized.
To sum up, the radio frequency antenna board and the array plane switching method provided by the embodiments of the present invention include an array plane radio frequency board, an array plane control connector, a power combiner, a plurality of surface mount connectors and a plurality of switch chips, wherein each switch chip is connected to each surface mount connector and the power combiner, each surface mount connector and the power combiner are connected to the array plane control connector, and each array plane configured on the array plane radio frequency board is connected to each switch chip, so that the radio frequency signal of each array plane can be transmitted to each surface mount connector or power combiner through each switch chip and output through the array plane control connector, and thus, by matching the switch chips with the surface mount connectors or power combiners, when switching, only the switch chips are connected to the surface mount connectors or power combiners, different array planes can work, and work requirements under different application scenarios can be met, the method is simple and convenient to operate, high in flexibility and good in instantaneity.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A radio frequency antenna board is characterized by comprising a front surface radio frequency board, a front surface control connector, a power combiner, a plurality of surface-mounted connectors and a plurality of switch chips;
each switch chip is respectively connected with each surface-mounted connector and the power synthesizer, and each surface-mounted connector and the power synthesizer are respectively connected with the array surface control connector;
the array face radio frequency board is provided with a plurality of array faces, each array face is respectively connected with each switch chip, and radio frequency signals of each array face are transmitted to each surface-mounted connector or the power combiner through each switch chip and are output through the array face control connector.
2. The radio frequency antenna panel according to claim 1, characterized in that the power combiner comprises a first power combiner and at least two second power combiners;
each second power combiner is connected with at least one switch chip, each second power combiner is connected with the first power combiner, and the first power combiner is connected with the front surface control connector;
each second power synthesizer is used for carrying out power combination on the radio-frequency signals transmitted by the connected switch chips and transmitting the combined radio-frequency signals to the first power synthesizer;
the first power synthesizer is used for power combination of the radio frequency signals transmitted by the second power synthesizers and transmitting the combined radio frequency signals to the array surface control connector.
3. The radio frequency antenna panel according to claim 2, further comprising a controller connected to each of the switch chips;
the controller is used for controlling the working mode of the radio frequency antenna plate and controlling the switch chips to be communicated with the surface-mounted connectors or the second power synthesizer according to the working mode.
4. The radio frequency antenna panel according to claim 3, wherein the mode of operation comprises a single-front-face mode of operation;
and when the working mode is the single-array-face mode, all the switch chips are used for being communicated with the surface-mounted connector under the control of the controller.
5. The radio frequency antenna plate according to claim 3, wherein the operation mode includes an N wavefront synthesis mode, N is a positive integer, N > 1 and N < the number of wavefronts of the radio frequency antenna plate;
and when the working mode is an N array surface synthesis mode, the N switch chips are used for being communicated with the connected second power synthesizer under the control of the controller, and the other switch chips are used for being communicated with the connected surface-mounted connector under the control of the controller.
6. The radio frequency antenna panel according to claim 3, wherein the operation mode includes a full-wavefront synthesis mode;
when the working mode is the full-array-face synthesis mode, all the switch chips are used for being communicated with the connected second power synthesizer under the control of the controller.
7. The radio frequency antenna board according to any one of claims 2 to 6, wherein each of the array planes is connected to each of the switch chips through a first radio frequency microstrip line, each of the switch chips is connected to each of the surface mount connectors through a second radio frequency microstrip line, and each of the surface mount connectors is connected to the array plane control connector through a first radio frequency cable;
each second power combiner is connected with the switch chip through a third radio frequency microstrip line, each second power combiner is connected with the first power combiner through a second radio frequency cable, and the first power combiner is connected with the array surface control connector through a third radio frequency cable.
8. A wavefront switching method, applied to a controller, for wavefront switching of a radio frequency antenna board according to any one of claims 1 to 7, the method comprising:
controlling a switch chip to be communicated with a surface-mounted connector connected according to the working mode of the radio frequency antenna board, so that radio frequency signals of all array surfaces are transmitted to the surface-mounted connector and transmitted to the array surface control connector through the surface-mounted connector; and/or the presence of a gas in the gas,
the control switch chip is communicated with the connected power synthesizer, so that the radio-frequency signals of all the array surfaces are transmitted to the power synthesizer and transmitted to the array surface control connector through the power synthesizer;
when the control switch chip is communicated with the connected surface-mounted connector and the control switch chip is communicated with the connected power synthesizer, any switch chip is only communicated with the surface-mounted connector or only communicated with the power synthesizer.
9. The wavefront switching method of claim 8, wherein the power combiner includes a first power combiner and at least two second power combiners, each of the second power combiners being connected to at least one of the switch chips, each of the second power combiners being connected to the first power combiner, the first power combiner being connected to the wavefront control connector; the working mode comprises a single array surface mode and a full array surface synthesis mode;
the control switch chip is communicated with the surface-mounted connector connected according to the working mode of the radio frequency antenna plate; and/or the step of controlling the switching chip to be communicated with the connected power synthesizer comprises the following steps:
if the working mode is a single array plane mode, controlling all the switch chips to be communicated with the surface-mounted connectors connected with the switch chips, so that the radio-frequency signals of all the array planes are transmitted to the corresponding surface-mounted connectors through all the switch chips and are transmitted to the array plane control connectors through all the surface-mounted connectors;
and if the working mode is the full-array-face synthesis mode, controlling all the switch chips to be communicated with the connected second power synthesizer, so that the radio-frequency signals of all the array faces are transmitted to all the second power synthesizers through all the switch chips, performing power combination on the radio-frequency signals transmitted by all the switch chips through all the second power synthesizers, transmitting the combined radio-frequency signals to the first power synthesizer, combining the combined radio-frequency signals again through the first power synthesizer, and transmitting the combined radio-frequency signals to the array-face control connector.
10. The wavefront switching method according to claim 9, wherein the operation mode further includes an N wavefront synthesis mode, N is a positive integer, N > 1 and N < the number of wavefronts of the radio frequency antenna board;
controlling the switch chip to be communicated with the connected surface-mounted connector according to the working mode of the radio frequency antenna plate; and/or the step of controlling the switching chip to be communicated with the connected power synthesizer comprises the following steps:
if the working mode is an N array surface synthesis mode, determining any N target switch chips from all the switch chips;
controlling each target switch chip to be communicated with a connected second power synthesizer, performing power combination on radio-frequency signals transmitted by each target switch chip through each second power synthesizer, transmitting the combined radio-frequency signals to a first power synthesizer, combining the combined radio-frequency signals again through the first power synthesizer, and transmitting the combined radio-frequency signals to the array surface control connector;
and controlling other switch chips to be communicated with the surface-mounted connector, and transmitting radio-frequency signals to the array surface control connector through the surface-mounted connector.
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