CN112071927A - 一种红外探测器及其制备方法 - Google Patents
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- 238000002360 preparation method Methods 0.000 title abstract description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 69
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 69
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 239000002096 quantum dot Substances 0.000 claims abstract description 54
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052737 gold Inorganic materials 0.000 claims abstract description 16
- 239000010931 gold Substances 0.000 claims abstract description 16
- 229940056932 lead sulfide Drugs 0.000 claims abstract description 14
- 229910052981 lead sulfide Inorganic materials 0.000 claims abstract description 14
- 239000002070 nanowire Substances 0.000 claims description 54
- 238000000034 method Methods 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 238000000151 deposition Methods 0.000 claims description 11
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 10
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 10
- 238000005507 spraying Methods 0.000 claims description 10
- 238000004528 spin coating Methods 0.000 claims description 9
- 238000003491 array Methods 0.000 claims description 7
- 239000013078 crystal Substances 0.000 claims description 7
- XCAUINMIESBTBL-UHFFFAOYSA-N lead(ii) sulfide Chemical compound [Pb]=S XCAUINMIESBTBL-UHFFFAOYSA-N 0.000 claims description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims description 6
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims description 5
- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 5
- 238000000137 annealing Methods 0.000 claims description 3
- 238000000231 atomic layer deposition Methods 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 238000011049 filling Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000004549 pulsed laser deposition Methods 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 239000013077 target material Substances 0.000 claims description 2
- 238000001514 detection method Methods 0.000 abstract description 17
- 238000006243 chemical reaction Methods 0.000 abstract description 16
- 239000002086 nanomaterial Substances 0.000 abstract description 11
- 239000004065 semiconductor Substances 0.000 abstract description 9
- 229910052751 metal Inorganic materials 0.000 abstract description 8
- 239000002184 metal Substances 0.000 abstract description 8
- 230000003287 optical effect Effects 0.000 abstract description 7
- 238000010521 absorption reaction Methods 0.000 description 7
- 230000008901 benefit Effects 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 7
- 210000002381 plasma Anatomy 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 239000000969 carrier Substances 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 230000008021 deposition Effects 0.000 description 5
- -1 quantum dot layer) Chemical compound 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 230000031700 light absorption Effects 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000002198 surface plasmon resonance spectroscopy Methods 0.000 description 2
- 238000006555 catalytic reaction Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000003331 infrared imaging Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002082 metal nanoparticle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000002165 resonance energy transfer Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Abstract
本发明公开了一种红外探测器及其制备方法,包括:从下至上依次设置的衬底、石墨烯层、量子点层以及叉指电极;量子点层包括由硫化铅形成的内核和由金形成的壳层,壳层包裹于内核表面,叉指电极镀接在壳层表面。金属金与半导体硫化铅的混合纳米结构(即量子点层)能够提高器件光电转换效率,并且能够显著增强器件的光探测性能。
Description
技术领域
本发明涉及红外光电探测技术领域,具体涉及一种红外探测器。
背景技术
红外探测器在导弹预警、安全防范、光电检测、红外成像等众多领域具有广泛的应用。石墨烯的电子迁移率高达350000cm2/(V·s),电导率为106S/m,方块电阻大约为31Ω/sq,常温下的热导率为5000W/mK。石墨烯表现出超快载流子动力学,能够实现光子或等离子体到电流或电压的快速转换。因此,石墨烯基光电器件具有巨大的发展潜力。石墨烯/GaAs红外探测器表现出良好的探测效率和高效选择性,因而受到了研究人员的青睐。目前,石墨烯基高光效红外探测是人们不懈追求的目标。
但是,当前的石墨烯/GaAs红外探测器还存在探测效率和探测范围还较低的问题,以及制备工艺的兼容性较弱的问题。
发明内容
本申请旨在至少在一定程度上解决相关技术中的技术问题之一。为此,本申请提出一种红外探测器及其制备方法,可以提高红外探测器对红外光的吸收效率和范围,提供一种与现有工艺兼容的石墨烯制备工艺,简化生产工艺,降低生产成本。
本发明解决其问题所采用的技术方案是:
一方面,本发明实施例提供了一种红外探测器,包括:从下至上依次设置的衬底、石墨烯层、量子点层以及叉指电极;所述量子点层包括由硫化铅形成的内核和由金形成的壳层,所述壳层设置于所述内核的表面,所述叉指电极镀接在所述壳层表面。
相比于传统技术中的红外探测器,本发明在叉指电极与石墨烯层之间设置有量子点层,其包括由硫化铅形成的内核和由金形成的壳层,所述壳层包裹于所述内核表面,其中,金属纳米结构产生的局域表面等离激元共振可以增强金属附近的局域电磁场,邻近的半导体可以受益于这种场增益,导致半导体光吸收增强,进而产生更多的光生载流子,此外还有散射效应,热载流子转移和共振能量转移等机理,都对光电转换有贡献。在金属金与硫化铅(即量子点层)的混合纳米结构中,硫化铅对这种场增益的充分利用是提高器件光电转换效率的关键,并且能够显著增强器件的光探测性能,即,通过设置量子点层能够提高红外探测器对红外光的吸收效率和范围。
可选地,在本发明的一个实施例中,所述衬底由砷化镓或铟镓砷单晶组成。用砷化镓制成的半导体器件具有高频、高温、低温性能好、噪声小、抗辐射能力强等优点,铟镓砷单晶制成的红外探测器具有响应时间短、室温工作、结构简单紧凑等优点。
可选地,在本发明的一个实施例中,所述量子点层的层数为1至5层,可根据需求设置相应的层数,以满足不同的探测精度。
可选地,在本发明的一个实施例中,所述内核的半径为5至50nm,所述壳层的厚度为0.1至2nm,硫化铅中引入贵金属纳米结构,由于其表面等离激元,能够显著增强器件的光探测性能。
可选地,在本发明的一个实施例中,还包括设置于所述衬底表面的纳米线阵列,用于划分预定的切割纹路作为生长区域。
另一方面,本发明实施例提供了一种制备红外探测器的方法,应用于红外探测器,红外探测器包括衬底、石墨烯层、量子点层以及叉指电极,所述量子点层包括内核和壳层,其特征在于,所述方法包括:
在所述衬底上沉积所述石墨烯层;
在所述石墨烯层的表面喷涂所述内核和所述壳层;
所述内核和所述壳层形成所述量子点层;
在所述量子点层上蒸镀所述叉指电极。
相比于传统技术中的红外探测器,本发明在叉指电极与石墨烯层之间喷涂有量子点层,在内核与壳层(即量子点层)的混合纳米结构中,内核对这种场增益的充分利用是提高器件光电转换效率的关键,并且能够显著增强器件的光探测性能,并且在所述衬底上沉积石墨烯层,石墨烯层结合量子点层能够进一步提高红外探测器的光响应能力,即,通过设置量子点层和石墨烯层能够提高红外探测器对红外光的吸收效率和范围。
实施例中,所述方法还包括:
在所述衬底的表面刻蚀、沉积所述纳米线阵列;
去除所述衬底的所述纳米线阵列。
可选地,在本发明的一个实施例中,在所述衬底的表面刻蚀、沉积所述纳米线阵列,其步骤包括:
在所述衬底上旋涂光刻胶;
将具有光刻胶的所述衬底曝光,以获得所述纳米线阵列的生长区域;
基于脉冲激光沉积的方式,在生长区域获得所述纳米线阵列。
基于所述纳米线阵列,划分预定的切割纹路作为生长区域。
可选地,在本发明的一个实施例中,在所述衬底以及所述铜网格或所述纳米线阵列上沉积所述石墨烯层,其特征在于:基于原子层沉积的方式,以纳米线阵列为模板在所述衬底上生长所述石墨烯层。
在上述实施例中,采用沉积的方式能够使石墨烯层稳定地设置在纳米线阵列上方,从而基于石墨烯层与纳米线阵列所配合构建下的异质结,能够加速光生载流子的分离,提高载流子的运输效率,石墨烯具有超快载流子动力学特性,能够实现光子或等离子体到电流或电压的快速转换,石墨烯/GaAs红外探测器表现出良好的探测效率和高效选择性。
可选地,在本发明的一个实施例中,一半到四分之一的所述石墨烯层是生长在纳米线阵列上,其余是直接生长在所述衬底上,以使石墨烯生长在预定的切割纹路上,实现光子或等离子体到电流或电压的快速转换。
可选地,在本发明的一个实施例中,去除所述衬底的所述纳米线阵列,其特征在于:
将所述纳米线阵列腐蚀;
将所述石墨烯层全部粘接在所述衬底上。
通过去除所述衬底的所述纳米线阵列,以使石墨烯生长在预定的切割纹路上,实现光子或等离子体到电流或电压的快速转换。
可选地,在本发明的一个实施例中,在所述石墨烯层的表面喷涂所述量子点层,其步骤包括:
采用旋涂设备,在所述石墨烯层上旋涂硫化铅量子点;
充入保护气体将硫化铅量子点烘干;
使用喷金仪溅射金靶材,以获得所述量子点层;
退火以使所述量子点层粘接于所述石墨烯层,所述石墨烯层粘接于所述衬底。
在金属与半导体(即量子点层)的混合纳米结构中,半导体对这种场增益的充分利用是提高器件光电转换效率的关键,并且能够显著增强器件的光探测性能。
本发明的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本发明的实践了解到。
附图说明
下面结合附图给出本发明较佳实施例,以详细说明本发明的实施方案。
图1是本发明实施例的红外探测器的结构图;
图2是本发明一种实施例的制备红外探测器的方法的示意图;
图3是本发明另一种实施例的制备红外探测器的方法的流程图;
图4是本发明另一种实施例的制备红外探测器的方法的流程图;
图5是本发明另一种实施例的制备红外探测器的方法的流程图;
图6是本发明另一种实施例的制备红外探测器的方法的流程图。
具体实施方式
本部分将详细描述本发明的具体实施例,本发明之较佳实施例在附图中示出,附图的作用在于用图形补充说明书文字部分的描述,使人能够直观地、形象地理解本发明的每个技术特征和整体技术方案,但其不能理解为对本发明保护范围的限制。
在本发明的描述中,需要理解的是,涉及到方位描述,例如上、下、前、后、左、右等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。
本发明的描述中,除非另有明确的限定,设置、安装、连接等词语应做广义理解,所属技术领域技术人员可以结合技术方案的具体内容合理确定上述词语在本发明中的具体含义。
下面结合附图,对本发明实施例作进一步阐述。
如图1所示,图1是本发明实施例的红外探测器的结构图。
一方面,参照图1,本发明实施例提供了一种红外探测器,包括:从下至上依次设置的衬底100、石墨烯层110、量子点层120以及叉指电极130;量子点层120包括由硫化铅形成的内核121和由金形成的壳层122,所述壳层122设置于所述内核121的表面,叉指电极130镀接在壳层122表面。
相比于传统技术中的红外探测器,本实施例在叉指电极130与石墨烯层110之间设置有量子点层120,其包括由硫化铅形成的内核121和由金形成的壳层122,壳层122包裹于内核121表面,可以提高红外探测器对红外光的吸收效率和范围。
相比于传统技术中的红外探测器,本实施例在叉指电极与石墨烯层110之间设置有量子点层120,其包括由硫化铅形成的内核和由金形成的壳层,所述壳层包裹于所述内核表面,其中,金属纳米结构产生的局域表面等离激元共振可以增强金属附近的局域电磁场,邻近的半导体可以受益于这种场增益,导致半导体光吸收增强,进而产生更多的光生载流子,此外还有散射效应,热载流子转移和共振能量转移等机理,都对光电转换有贡献。在金属金与硫化铅(即量子点层120)的混合纳米结构中,硫化铅对这种场增益的充分利用是提高器件光电转换效率的关键,并且能够显著增强器件的光探测性能,即,通过设置量子点层120能够提高红外探测器对红外光的吸收效率和范围。
可选地,在本发明的一个实施例中,衬底100由砷化镓或铟镓砷单晶组成。用砷化镓制成的半导体器件具有高频、高温、低温性能好、噪声小、抗辐射能力强等优点,铟镓砷单晶制成的红外探测器具有响应时间短、室温工作、结构简单紧凑等优点。
可选地,在本发明的一个实施例中,量子点层120的层数为1至5层,可根据需求设置相应的层数,以满足不同的探测精度。
可选地,在本发明的一个实施例中,内核121的半径为5至50nm,壳层122的厚度为0.1至2nm,硫化铅中引入贵金属纳米结构,由于其表面等离激元,能够显著增强器件的光探测性能。
可选地,在本发明的一个实施例中,还包括设置于衬底100表面的超薄铜网格和纳米线阵列,用于划分预定的切割纹路作为生长区域。
如图2所示,图2是本发明实施例的制备红外探测器的方法的流程图。
另一方面,参照图2,本发明实施例提供了一种制备红外探测器的方法,应用于红外探测器,红外探测器包括衬底100、石墨烯层110、量子点层120以及叉指电极130,量子点层120包括内核121和壳层122,其特征在于,方法包括:
S100、在衬底100上沉积石墨烯层110;
S200、在石墨烯层110的表面喷涂内核121,在内核外表面喷涂壳层122,从而得到量子点层120;
S300、在量子点层上蒸镀叉指电极130。
相比于传统技术中的红外探测器,本实施例在叉指电极与石墨烯层之间喷涂有量子点层,在内核与壳层(即量子点层)的混合纳米结构中,内核对这种场增益的充分利用是提高器件光电转换效率的关键,能够显著增强器件的光探测性能,并且在所述衬底上沉积石墨烯层,由于石墨烯与叉指电极之间的倾向便于形成良好的小电阻欧姆接触,因此能够提高对于光生载流子的提取效率,通过上述两方面的配合作用,因此能够大大提升红外探测器的灵敏度。石墨烯层结合量子点层能够进一步提高红外探测器的光响应能力,即,通过设置量子点层和石墨烯层能够提高红外探测器对红外光的吸收效率和范围。
如图3所示,图3是本发明实施例的制备及去除纳米线阵列的流程图。
参照图3,可选地,在本发明的一个实施例中,其特征在于,方法还包括:
S400、在衬底100的表面刻蚀、沉积纳米线阵列;
S500、去除衬底100的纳米线阵列。
在上述实施例中,纳米线阵列是由众多的一维硅纳米线垂直于基底排列而成的,纳米线阵列与硅纳米线之间的关系如同整片森林与单棵树木一样,它除了具有硅纳米线的特性外,还表现出集合体的优异性能:纳米线阵列独特的“森林式”结构,使其具有优异的减反射特性,在宽波段、宽入射角范围都能保持很高的光吸收率,显著高于目前普遍使用的硅薄膜。
如图4所示,图4是本发明实施例的制备纳米线阵列的流程图。
参照图4,可选地,在本发明的一个实施例中,在衬底100的表面刻蚀、沉积纳米线阵列,其步骤包括:
S410、在衬底100上旋涂光刻胶;
S420、将具有光刻胶的衬底100曝光,以获得纳米线阵列的生长区域;
S430、基于脉冲激光沉积的方式,在生长区域获得纳米线阵列。
在上述实施例中,“自上而下”制备有序纳米线阵列的主要方法是化学刻蚀法,在常温常压、金属纳米粒子的催化作用下,利用刻蚀剂刻蚀硅片,简单、快速地制备出大面积、高取向的纳米线阵列且不受硅片晶型和晶向的限制。同时基于纳米线阵列,进行激光沉积,划分预定的切割纹路以获得生长区域。
在一实施例中,可以在室温下对生长区域进行激光沉积,以获得纳米线阵列,而不需要在特殊的温度环境下进行激光沉积,可节省一定的生产成本,简化生产流程。
可选地,在本发明的一个实施例中,在衬底100以及铜网格或纳米线阵列上沉积石墨烯层110,其特征在于:基于原子层沉积的方式,以纳米线阵列为模板在衬底100上生长石墨烯层110。
在上述实施例中,采用沉积的方式能够使石墨烯层稳定地设置在纳米线阵列上方,从而基于石墨烯层与纳米线阵列所配合构建下的异质结,能够加速光生载流子的分离,提高载流子的运输效率,石墨烯具有超快载流子动力学特性,能够实现光子或等离子体到电流或电压的快速转换,石墨烯/GaAs红外探测器表现出良好的探测效率和高效选择性。
可选地,在本发明的一个实施例中,一半到四分之一的石墨烯层110是生长在纳米线阵列上,其余是直接生长在衬底100上,以使石墨烯生长在预定的切割纹路上,实现光子或等离子体到电流或电压的快速转换。
如图5所示,图5是本发明实施例的去除纳米线阵列的流程图;
参照图5,可选地,在本发明的一个实施例中,去除衬底100的纳米线阵列,其特征在于:
S510、将纳米线阵列腐蚀;
S520、将石墨烯层110全部粘接在衬底100上。
在上述实施例中,通过去除衬底100的纳米线阵列,以使石墨烯生长在预定的切割纹路上,实现光子或等离子体到电流或电压的快速转换。
如图6所示,图6是本发明实施例的制备量子点层的流程图。
参照图6,可选地,在本发明的一个实施例中,在石墨烯层110的表面喷涂量子点层120,其步骤包括:
S210、使用旋涂设备,在石墨烯层110上旋涂硫化铅量子点;
S220、充入保护气体充入保护气体将硫化铅量子点烘干;
S230、使用喷金仪溅射金靶材,以获得所述量子点层;
S240、退火以使所述量子点层粘接于所述石墨烯层,所述石墨烯层粘接于所述衬底。
在上述实施例中,在内核与壳层(即量子点层)的混合纳米结构中,内核对这种场增益的充分利用是提高器件光电转换效率的关键,能够显著增强器件的光探测性能,并且在所述衬底上沉积石墨烯层,由于石墨烯与叉指电极之间的倾向便于形成良好的小电阻欧姆接触,因此能够提高对于光生载流子的提取效率,通过上述两方面的配合作用,因此能够大大提升红外探测器的灵敏度。石墨烯层结合量子点层能够进一步提高红外探测器的光响应能力,即,通过设置量子点层和石墨烯层能够提高红外探测器对红外光的吸收效率和范围。
以上内容对本发明的较佳实施例和基本原理作了详细论述,但本发明并不局限于上述实施方式,熟悉本领域的技术人员应该了解在不违背本发明精神的前提下还会有各种等同变形和替换,这些等同变形和替换都落入要求保护的本发明范围内。
Claims (12)
1.一种红外探测器,其特征在于,包括:从下至上依次设置的衬底、石墨烯层、量子点层以及叉指电极;所述量子点层包括由硫化铅形成的内核和由金形成的壳层,所述壳层设置于所述内核的表面,所述叉指电极镀接在所述壳层表面。
2.根据权利要求1所述的一种红外探测器,其特征在于:所述衬底由砷化镓或铟镓砷单晶组成。
3.根据权利要求1所述的一种红外探测器,其特征在于:所述量子点层的层数为1至5层。
4.根据权利要求3所述的一种红外探测器,其特征在于:所述内核的半径为5至50nm,所述壳层的厚度为0.1至2nm。
5.根据权利要求1所述的一种红外探测器,其特征在于:还包括设置于所述衬底表面的纳米线阵列。
6.一种制备红外探测器的方法,应用于红外探测器,红外探测器包括衬底、石墨烯层、量子点层以及叉指电极,所述量子点层包括内核和壳层,其特征在于,所述方法包括:
在所述衬底上沉积所述石墨烯层;
在所述石墨烯层的表面喷涂内核,在所述内核外表面喷涂所述壳层,从而得到所述量子点层;
在所述量子点层上蒸镀所述叉指电极。
7.根据权利要求6所述的一种制备红外探测器的方法,其特征在于,所述方法还包括:
在所述衬底的表面刻蚀、沉积所述纳米线阵列;
去除所述衬底的所述纳米线阵列。
8.根据权利要求7所述的一种制备红外探测器的方法,在所述衬底的表面刻蚀、沉积所述纳米线阵列,其特征在于:
在所述衬底上旋涂光刻胶;
将具有光刻胶的所述衬底曝光,以获得所述纳米线阵列的生长区域;
基于脉冲激光沉积的方式,在生长区域获得所述纳米线阵列。
9.根据权利要求6所述的一种制备红外探测器的方法,在所述衬底以及所述纳米线阵列上沉积所述石墨烯层,其特征在于:基于原子层沉积的方式,以所述纳米线阵列为模板在所述衬底上生长所述石墨烯层。
10.根据权利要求9所述的一种制备红外探测器的方法,其特征在于:一半到四分之一的所述石墨烯层是生长在所述纳米线阵列上,其余是直接生长在所述衬底上。
11.根据权利要求7所述的一种制备红外探测器的方法,去除所述衬底的所述纳米线阵列,其特征在于:
将所述纳米线阵列腐蚀;
将所述石墨烯层全部粘接在所述衬底上。
12.根据权利要求6所述的一种制备红外探测器的方法,在所述石墨烯层的表面喷涂所述量子点层,其特征在于:
采用旋涂设备,在所述石墨烯层上旋涂硫化铅量子点;
充入保护气体将硫化铅量子点烘干;
使用喷金仪溅射金靶材,以获得所述量子点层;
退火以使所述量子点层粘接于所述石墨烯层,所述石墨烯层粘接于所述衬底。
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