CN112068214A

CN112068214A - Infrared sensor

Info

Publication number: CN112068214A
Application number: CN202010951308.XA
Authority: CN
Inventors: 杨晓翔
Original assignee: Shanghai Qiqu Mechanical And Electrical Technology Co ltd
Current assignee: Weisu Technology Service Jiangsu Co ltd
Priority date: 2020-09-11
Filing date: 2020-09-11
Publication date: 2020-12-11

Abstract

The invention provides an infrared sensor, and relates to the technical field of infrared sensors. The device comprises a shell and a refrigeration silicon chip, wherein the top of the shell is connected with a protective cover through a hinge, an optical anti-fog mirror is fixed inside the protective cover, a filling core body is clamped and pressed inside the shell under the protective cover, the refrigeration silicon chip is installed inside the filling core body through a clamping groove, the refrigeration silicon chip comprises a cold end body and a hot end body inside the refrigeration silicon chip, the cold end body is wrapped inside the hot end body, and the device can efficiently cool a detector by arranging the refrigeration silicon chip, the cold end body, the hot end body and a heat dissipation fan, so that the sensitivity of the detector is prevented from being reduced by high temperature generated by long-time work; through setting up the electrically conductive clamp of fast connecting pipe box, pipeline and output line for infrared sensor both can be quick installation use in multiple equipment, also can fixed mounting on the circuit board, increased infrared sensor fixed mode's variety, be favorable to dismantling the change and remove the use.

Description

Infrared sensor

Technical Field

The invention relates to the technical field of infrared sensors, in particular to an infrared sensor.

Background

The infrared sensor is a sensor which can sense the infrared ray radiated by a target and can measure by utilizing the physical property of the infrared ray, any object in the universe can generate infrared radiation as long as the temperature of the object exceeds zero, the radiation can be refracted and reflected as the fact is the same as visible light, the infrared detector is widely regarded by utilizing the unique superiority of the infrared detector, and the infrared detector is widely applied in the military and civil fields, and the infrared detector is used for guidance, fire control tracking, warning, target detection, weapon thermal sight, ship navigation and the like in the military; in the civil field, the method is widely applied to industrial equipment monitoring, safety monitoring, disaster relief, remote sensing, traffic management, medical diagnosis technology and the like.

The optical detection element of the existing infrared sensor is mostly a sensitive element, when receiving and converting infrared rays for a long time, the temperature change is fast, the sensitivity of the detection element is influenced, secondly, the infrared sensor is mostly packaged on a circuit board of the device in a welding mode, the installation mode is fixed and limited, and the infrared sensor is not convenient to detach, replace and move for use.

Disclosure of Invention

Technical problem to be solved

In view of the deficiencies of the prior art, the present invention provides an infrared sensor to solve the problems set forth in the background art.

(II) technical scheme

In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides an infrared sensor, includes casing and refrigeration silicon chip, there is the visor casing top through hinge connection, the inside optical anti-fog mirror that is fixed with of visor, be in under the visor the inside card of casing is pressed and is filled the core, it installs through the draw-in groove to fill the core inside refrigeration silicon chip, the inside cold end body and the hot end body of including of refrigeration silicon chip, the cold end body parcel is in the hot end is internal, the hot end body with fill the core contact.

Preferably, the filling core body is made of a high polymer material with insulating, heat-preserving and pressure-resisting properties, the refrigeration silicon wafer is of an arc-shaped structure, a metal pipe cap is installed inside the cold end body, and the metal pipe cap penetrates through the shell and is embedded in the filling core body.

Preferably, the top end of the metal pipe cap is clamped and pressed with an optical filter, the bottom of the metal pipe cap is welded with a pipe seat, the top of the pipe seat is clamped and pressed inside the metal pipe cap with a packaging top plate, and the top of the packaging top plate is electrically connected with a sensitive detection element.

Preferably, the bottom of the top plate is electrically connected with a pin, the pin penetrates through the tube seat to be installed in a matched mode, and a heat dissipation fan is fixed on one side wall of the outer portion of the shell through a screw.

Preferably, an air outlet pipeline is formed on the periphery of the heat end body in the filling core body, and the heat dissipation fan is communicated with the air outlet pipeline through a pipeline.

Preferably, the bottom of the pin is inserted with a quick connection pipe sleeve, a pipeline conductive clamp is fixedly clamped with the pin in the quick connection pipe sleeve, a packaging bottom plate is fixedly mounted at the bottom in the quick connection pipe sleeve, the structure and the effect of the packaging top plate and the packaging bottom plate are the same, and the bottom of the packaging bottom plate is electrically connected with an output line.

The invention provides an infrared sensor, which has the following beneficial effects:

1. the device can efficiently cool the detector by arranging the refrigeration silicon chip, the cold end body, the hot end body and the heat dissipation fan, so that the sensitivity of the detector is prevented from being reduced by high temperature generated by long-time work;

2. the device connects pipe box, pipeline electrically conductive clamp and output line soon through setting up for infrared sensor both can be quick installation use in multiple equipment, also can fixed mounting on the circuit board, increased infrared sensor fixed mode's variety, be favorable to dismantling to change and remove the use.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the internal structure of the filling core and the cap in the present application;

FIG. 3 is a front cross-sectional view of a quick connect sleeve according to the present invention;

fig. 4 is a top sectional view of the filling core and the heat dissipating fan in the present invention.

In the figure: 1. a housing; 2. a metal pipe cap; 3. a pin; 4. a protective cover; 5. an optical filter; 6. filling the core body; 7. a tube holder; 8. a sensitive detection element; 9. packaging the top plate; 10. refrigerating a silicon wafer; 11. a heat dissipation fan; 12. a hot end body; 13. a cold end body; 14. a quick connection pipe sleeve; 15. a pipeline conductive clip; 16. packaging the bottom plate; 17. an output line; 18. an air outlet pipeline.

Detailed Description

The embodiment of the invention provides an infrared sensor, which comprises a shell 1 and a refrigeration silicon chip 10, wherein the top of the shell 1 is connected with a protective cover 4 through a hinge, an optical anti-fog mirror is fixed inside the protective cover 4, a filling core body 6 is clamped and pressed inside the shell 1 under the protective cover 4, the refrigeration silicon chip 10 is installed inside the filling core body 6 through a clamping groove, the refrigeration silicon chip 10 comprises a cold end body 13 and a hot end body 12, the cold end body 13 is wrapped inside the hot end body 12, and the hot end body 12 is in contact with the filling core body 6, as shown in figures 1-4.

The implementation mode is specifically as follows: the protective cover 4 is used to protect the safety and cleanness of the objective lens in the optical element of the infrared sensor, and avoid the disadvantage of receiving infrared rays.

As shown in fig. 1, fig. 2 and fig. 4, the filling core 6 is made of a high polymer material with insulation, heat preservation and pressure resistance properties, the refrigeration silicon chip 10 is of a circular arc-shaped structure, a metal pipe cap 2 is installed inside the cold end 13, the metal pipe cap 2 penetrates through the shell 1 and is embedded in the filling core 6, the optical filter 5 is clamped and pressed at the top end of the metal pipe cap 2, a pipe seat 7 is welded at the bottom of the metal pipe cap 2, a packaging top plate 9 is clamped and pressed inside the metal pipe cap 2 at the top of the pipe seat 7, the top of the packaging top plate 9 is electrically connected with a sensitive detection element 8, a pin 3 is electrically connected at the bottom of the packaging top plate 9, the pin 3 penetrates through the pipe seat 7 to be installed.

The implementation mode is specifically as follows: the filter 5 is designed to mainly receive infrared rays, and other rays are filtered out, and the package top plate 9 is provided with common components such as high-resistance FETs.

As shown in fig. 3 and 4, an air outlet pipeline 18 is formed at the periphery of the thermal terminal body 12 inside the filling core body 6, the heat dissipation fan 11 is communicated with the air outlet pipeline 18 through a pipeline, a quick connection pipe sleeve 14 is inserted at the bottom of the pin 3, a pipeline conductive clamp 15 is fixed inside the quick connection pipe sleeve 14 and clamped and pressed with the pin 3, a package bottom plate 16 is fixedly installed at the bottom inside the quick connection pipe sleeve 14, the package top plate 9 and the package bottom plate 16 have the same structure and function, and an output line 17 is electrically connected at the bottom of the package bottom plate 16.

The implementation mode is specifically as follows: after the air current in the pipeline 18 of giving vent to anger is heated by the heat conduction of hot end body 12, pumped to the outside by heat dissipation fan 11, realize the heat exchange, cool down hot end body 12, comparatively convenient and fast when quick-connect pipe box 14 is installed, can be used to any equipment that needs to use infrared sensor, package substrate 16 is the same with the bottom plate structure when common pin 3 lug weld, but package substrate 16 of here design only need through connect pipe box 14 inside electrically conductive passageway and the pipeline on the passageway wall electrically conductive clamp 15 conduction signal can.

The working principle is as follows: when the device is used, the protective lens on the protective cover 4 is cleaned, then the protective lens is fixedly installed with the shell 1 through a screw, then the pin 3 is inserted into the corresponding jack on the quick connection pipe sleeve 14, the pipeline conductive clamp 15 in the jack provides a withdrawing-proof clamping force for the pin 3 on one hand and provides a signal transmission effect on the other hand, infrared rays enter the optical filter 5 through the protective lens, after unnecessary light is filtered, only the infrared rays are left, enter the optical filter and are converted into corresponding electric signals through the sensitive detection element 8, the electric signals are sent into the encapsulation top plate 9 and are transmitted onto the pin 3, the pin 3 is sent into the encapsulation bottom plate 16 and is sent into display equipment from an output line 17 for display, in addition, the pin 3 can also be fixed without the quick connection pipe sleeve 14, the pin 3 is directly welded on the position of the encapsulation pin 3 on the corresponding circuit board, and can be normally used, the design of these two kinds of mounting means has increased the variety of the fixed mode of infrared sensor, be favorable to dismantling to change and remove the use, and refrigeration silicon chip 10 is in the refrigerated time, the cold junction body 13 takes place the heat exchange with tubular metal resonator cap 2, cool down to inside sensitive detecting element 8, keep an efficient operating condition, avoid high temperature to reduce sensitive detecting element 8's sensitivity, hot end body 12 gives the heat transfer for gas on every side, and be pumped to the outside by heat dissipation fan 11, realize refrigeration silicon chip 10's repeated refrigeration effect.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. An infrared sensor comprises a shell (1) and a refrigeration silicon chip (10), and is characterized in that: the optical anti-fog mirror is characterized in that the top of the shell (1) is connected with a protective cover (4) through a hinge, an optical anti-fog mirror is fixed inside the protective cover (4), a filling core body (6) is clamped and pressed inside the shell (1) under the protective cover (4), the filling core body (6) is installed inside a refrigeration silicon wafer (10) through a clamping groove, the refrigeration silicon wafer (10) comprises a cold end body (13) and a hot end body (12) inside, the cold end body (13) is wrapped inside the hot end body (12), and the hot end body (12) is in contact with the filling core body (6).

2. An infrared sensor according to claim 1, characterized in that: the filling core body (6) is made of high polymer materials with insulating, heat-preserving and pressure-resisting properties, the refrigeration silicon wafer (10) is of an arc-shaped structure, a metal pipe cap (2) is installed inside the cold end body (13), and the metal pipe cap (2) penetrates through the shell (1) and is embedded in the filling core body (6).

3. An infrared sensor according to claim 2, characterized in that: the optical filter (5) is clamped and pressed at the top end of the metal pipe cap (2), a pipe seat (7) is welded at the bottom of the metal pipe cap (2), a packaging top plate (9) is clamped and pressed inside the metal pipe cap (2) at the top of the pipe seat (7), and a sensitive detection element (8) is electrically connected to the top of the packaging top plate (9).

4. An infrared sensor according to claim 3, characterized in that: the packaging structure is characterized in that a pin (3) is electrically connected to the bottom of the packaging top plate (9), the pin (3) penetrates through the tube seat (7) to be installed in a matched mode, and a heat dissipation fan (11) is fixed to one side wall of the outer portion of the shell (1) through a screw.

5. An infrared sensor according to claim 4, characterized in that: the periphery of the heat end body (12) is formed with an air outlet pipeline (18) in the filling core body (6), and the heat dissipation fan (11) is communicated with the air outlet pipeline (18) through a pipeline.

6. An infrared sensor according to claim 5, characterized in that: the bottom of the pin (3) is spliced with a quick connection pipe sleeve (14), a pipeline conductive clamp (15) is fixedly clamped and pressed in the quick connection pipe sleeve (14) and the pin (3), a packaging bottom plate (16) is fixedly mounted at the bottom in the quick connection pipe sleeve (14), the structure and the effect of the packaging top plate (9) and the packaging bottom plate (16) are the same, and the bottom of the packaging bottom plate (16) is electrically connected with an output line (17).