CN112068209B - Mine network hybrid electric method monitoring system and method - Google Patents

Mine network hybrid electric method monitoring system and method Download PDF

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Publication number
CN112068209B
CN112068209B CN202010897449.8A CN202010897449A CN112068209B CN 112068209 B CN112068209 B CN 112068209B CN 202010897449 A CN202010897449 A CN 202010897449A CN 112068209 B CN112068209 B CN 112068209B
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resistor
pin
capacitor
optocoupler
power supply
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CN112068209A (en
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郭立全
常雷
马克勤
岳喜亮
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Anhui Fuhuai Mining Science & Technology Co ltd
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Anhui Fuhuai Mining Science & Technology Co ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V3/00—Electric or magnetic prospecting or detecting; Measuring magnetic field characteristics of the earth, e.g. declination, deviation
    • G01V3/08—Electric or magnetic prospecting or detecting; Measuring magnetic field characteristics of the earth, e.g. declination, deviation operating with magnetic or electric fields produced or modified by objects or geological structures or by detecting devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

The invention discloses a mine network hybrid electric method monitoring system and method, comprising a monitoring substation, a plurality of first electric method controllers, a plurality of second electric method controllers, a plurality of third electric method controllers, a plurality of fourth electric method controllers and a plurality of electrodes, wherein the plurality of first electric method controllers are sequentially connected in series, the plurality of second electric method controllers are sequentially connected in series, the non-series end of the first electric method controller positioned at the head end is connected with one non-series end of the plurality of second electric method controllers, the non-series end of the first electric method controller positioned at the tail end is connected with one non-series end of the plurality of third electric method controllers, the non-series end of the first electric method controller positioned at the tail end is also connected with the monitoring substation through the fourth electric method controllers, and each first electric method controller is connected with a plurality of electrodes through an electric method big wire; the invention has the advantages that: the equipment failure rate is reduced, and the cost and the price of the product are reduced.

Description

Mine network hybrid electric method monitoring system and method
Technical Field
The invention relates to the technical field of mine physical exploration, in particular to a mine network hybrid electric method monitoring system and method.
Background
Along with the gradual exhaustion of shallow coal resources, coal mining tends to develop deeply, and deep mining is influenced by 'three-high-one disturbance', so that mining conditions are complicated in a shallow part. In order to ensure the green, safe and efficient production of the mine, the dynamic development characteristics of the geological disaster of the mine need to be comprehensively mastered.
At present, the physical detection technology of the mine geological abnormal body mainly adopts a centralized or distributed electrical method detector to carry out one-time detection work. The defects mainly include the following points: 1) The centralized electrical method detector has the advantages that as all electrode switching modules are designed inside the detector, the volume of the detector is overlarge, and inconvenience is brought to field operators. Meanwhile, as the number of the electrode switching modules is certain, the one-time detection distance is shorter, and if a longer working surface is to be detected, the operation is completed in a mode of carrying out station for multiple times. The working efficiency is extremely low due to the fact that the electrodes are moved for many times, arranged for many times and data are acquired for many times. 2) The main difference between the distributed electrical method detector and the centralized electrical method detector is that the distributed electrical method detector separates the electrode switching module from the interior of the detector, and the function of electrode switching is designed at the electrode connection position in the electrical method large line. The design method solves the defects of short detection distance and large volume of the centralized electrical detector. However, since a circuit motherboard is disposed at each large wire electrode interface, the failure rate of the large wire by the electrical method is significantly improved. Each large wire is provided with tens to twenty circuit boards, if one circuit board cannot work normally, the whole large wire cannot be used normally. And after the fault occurs, the staff is difficult to maintain for the second time, so that the cost and the price of the product are greatly increased.
Chinese patent publication No. CN209690530U discloses an intelligent electric method monitoring device, which comprises a monitoring host, and further comprises a plurality of electric method controllers connected in series in sequence, wherein both ends of each electric method controller are connected with electrode converters, and the plurality of electric method controllers connected in series in sequence are connected with the monitoring host in series; the connection is realized through monitoring cables, metal electrodes are arranged on the monitoring cables at intervals, and each metal electrode is inserted into a corresponding underground monitoring point respectively; the plurality of electric controllers and the monitoring host are longitudinally arranged, and electrode converters connected with two ends of each electric controller are transversely arranged; the electric method controller is connected with the monitoring host in a communication way through the communication circuit; the utility model has the advantages of being capable of arranging monitoring cables transversely and longitudinally at the same time and reducing the workload, but belongs to distributed electrical detection, and each large wire electrode interface is provided with a circuit main board, so that the failure rate of the large wire of the electrical method is obviously improved, and the cost and price of the product are increased.
Disclosure of Invention
The technical problem to be solved by the utility model is that the electrical method monitoring system in the prior art has the problems of high electrical method large line fault rate and high product cost and price.
The invention solves the technical problems by the following technical means: the mine network hybrid electric method monitoring system is characterized by comprising a monitoring substation, a plurality of first electric method controllers, a plurality of second electric method controllers, a plurality of third electric method controllers, a plurality of fourth electric method controllers and a plurality of electrodes, wherein the plurality of first electric method controllers are sequentially connected in series, the plurality of second electric method controllers are sequentially connected in series, the non-series end of the first electric method controller positioned at the head end is connected with one non-series end of the plurality of second electric method controllers, the non-series end of the first electric method controller positioned at the tail end is connected with one non-series end of the plurality of third electric method controllers, the non-series end of the first electric method controller positioned at the tail end is also connected with the monitoring substation through the fourth electric method controllers, and each first electric method controller is connected with a plurality of electrodes through an electric method large line.
The electrode switching function of the invention is integrated in the electric method controller and the monitoring substation equipment, each equipment controls a plurality of electrodes, and if the geological monitoring range is required to be enlarged, the electric method controller or the electrode converter equipment can be added for realizing. Because the electrode switching function is integrated in the electric method controller and the monitoring substation equipment, the electric method large line is internally provided with no electric main board, the defect that the electric fault probability of the distributed electric method detector is increased due to the increase of the electric main board is avoided, the equipment price is reduced, the electrode switching function is integrated in the single-machine equipment, the secondary maintenance is more convenient, and meanwhile, the product cost is greatly reduced.
Further, the arrangement direction of the first electrical controller is perpendicular to the arrangement direction of the second electrical controller, the third electrical controller and the fourth electrical controller.
Further, the first electric method controller to the fourth electric method controller comprise a first control circuit, the monitoring substation comprises a second control circuit, the first control circuit comprises a relay module, a control switch module, a first MCU, a power module, an LED module and an RS485 module, the control switch module, the power module, the LED module and the RS485 module are all connected with the first MCU, and the relay module is connected with the control switch module; the second control circuit comprises an instrument amplifier, an MN notch module, an AD module, an H-bridge inversion module, a logic control module, a high-voltage switching module, an MN signal conditioning module, a second MCU and a Bluetooth module, wherein the second MCU is connected with the H-bridge inversion module through the high-voltage switching module and the logic control module in sequence, the second MCU is connected with the relay module through the H-bridge inversion module, the relay module is connected with the second MCU through the instrument amplifier, the MN notch module and the AD module in sequence, the first MCU is connected with the second MCU through the RS485 module, and the MN signal conditioning module and the Bluetooth module are respectively connected with the second MCU.
Further, the control switch modules are provided with a plurality of control switch sub-circuits, each control switch module comprises four groups of identical control switch sub-circuits, one control switch sub-circuit comprises a resistor R98, a resistor R99 and a triode Q22, one end of the resistor R98 is connected with a thirty-th pin of the first MCU, the other end of the resistor R98 is connected with one end of the resistor R99 and a base electrode of the triode Q22, and a collector electrode of the triode Q22 and the other end of the resistor R99 are grounded;
the relay module has a plurality of, and every relay module includes four groups of the same relay subcircuits, and one of them relay subcircuit includes resistance R161 and opto-coupler Q84, and the one end of resistance R161 connects +5V power, and the other end of resistance R161 is connected with opto-coupler Q84's second pin, and opto-coupler Q84's first pin and fourth pin all are connected with triode Q22's collecting electrode, and opto-coupler Q84's fifth pin and sixth pin all are connected with the electrode, and opto-coupler Q84's eighth pin is connected with H bridge contravariant module.
Further, the power supply module comprises a DC/DC conversion circuit, a voltage stabilizing circuit and a voltage reducing circuit which are sequentially connected, the DC/DC conversion circuit comprises a fuse F3, a diode D15, a diode D16, a polar capacitor C49 and a capacitor C48, one end of the fuse F3 is connected with an external power supply, the other end of the fuse F3 is connected with the positive electrode of the polar capacitor C49 and one end of the capacitor C48 through the diode D15 and the diode D16, and the negative electrode of the polar capacitor C49 and the other end of the capacitor C48 are grounded;
The voltage stabilizing circuit comprises a voltage stabilizing diode D17, a resistor R62 to a resistor R67 which are sequentially numbered, a capacitor C44 to a capacitor C41 which are sequentially numbered, a chip U19, a diode D6, an inductor L4 and a voltage stabilizing diode D14, wherein a cathode of the voltage stabilizing diode D17, an anode of the capacitor C45, one end of the capacitor C40, one end of the resistor R62 and a second pin of the chip U19 are all connected with one end of the capacitor C48, the other end of the resistor R62 is respectively connected with one end of the resistor R63 and a third pin of the chip U19, one end of the resistor R64 and one end of the capacitor C42 are all connected with a sixth pin of the chip U19, one end of the resistor R64 is connected with one end of the capacitor C43, one end of the capacitor C41 is connected with a fourth pin of the chip U19, one end of the capacitor C44 is connected with a first pin of the chip U19, one end of the other end of the capacitor C44, one end of the inductor L4 and a cathode of the diode D6 are all connected with an eighth pin of the chip U19, one end of the resistor R65, one end of the anode of the capacitor C46, one end of the capacitor C47 and the anode of the capacitor C47 and the other end of the resistor D14 are all connected with the other end of the resistor R67 through the resistor R67; the anode of the zener diode D17, the cathode of the capacitor C45, one end of the capacitor C40, the other end of the resistor R63, the other ends of the capacitors C42 to C41, the seventh pin of the chip U19, the anode of the diode D6, the other end of the resistor R67, the cathode of the capacitor C46, the cathode of the capacitor C47 and the anode of the zener diode D14 are all grounded;
The step-down circuit comprises a chip U20 and capacitors C37 to C40 which are numbered sequentially, wherein the anode of the capacitor C51, one end of the capacitor C50 and a third pin of the chip U20 are all connected with a cathode of a zener diode D14, the cathode of the zener diode D14 is used as a +5V power supply output end, the anode of the capacitor C52 and one end of the capacitor C53 are all connected with a second pin of the chip U20, one end of the capacitor C53 is used as a +3.3V power supply output end, and the cathode of the capacitor C51, the other end of the capacitor C50, a first pin of the chip U20, the cathode of the capacitor C52 and the other end of the capacitor C53 are all grounded.
Still further, the LED module includes resistance R96, resistance R97, triode Q20, triode Q21, chip LED, resistance R92, resistance R93, resistance R94 and resistance R95, the one end of resistance R96 and the one end of resistance R97 all are connected with +5V power, the other end of resistance R96 is connected with the first pin of chip LED and the collecting electrode of triode Q20, the other end of resistance R97 is connected with the third pin of chip LED and the collecting electrode of triode Q21, the one end of resistance R92 is connected with the eighty pin of first MCU, the one end of resistance R94 and the base of triode Q20 all are connected with the other end of resistance R92, the one end of resistance R93 and the twenty-fourth pin of first MCU are connected, the one end of resistance R95 and the base of triode Q21 all are connected with the other end of resistance R93, the other end of resistance R94, the emitter of triode Q20, the second pin of chip LED, the emitter of triode Q21 and the other end of resistance R95 all are grounded.
Further, the MN notch module includes a notch circuit and a low-pass filter circuit that are sequentially connected, where the notch circuit includes a resistor R1, a chip U33, a resistor R36, and a resistor R37, one end of the resistor R1 is connected to an output end of the instrumentation amplifier, the other end of the resistor R1 is connected to a first pin of the chip U33, a fifth pin of the chip U33 is connected to a power +5AVCC, a second pin of the chip U33 is connected to a power-5 AVCC, one end of the resistor R36 is connected to a sixth pin of the chip U33, the other end of the resistor R36 is connected to a seventh pin of the chip U33, one end of the resistor R37 is connected to a third pin of the chip U33, and the other end of the resistor R37 and the other end of the chip U33 are both grounded;
the low-pass filter circuit comprises a first-stage filter sub-circuit, a second-stage filter sub-circuit and a third-stage filter sub-circuit, wherein the first-stage filter sub-circuit comprises a resistor R191, a resistor R192, an amplifier U34-A, a capacitor C213, a capacitor C220, a capacitor C215, a capacitor C218, a capacitor C222 and a capacitor C223, one end of the resistor R191 is connected with a seventh pin of the chip U33, the other end of the resistor R191 is respectively connected with one end of the resistor R192 and one end of the capacitor C213, the other end of the resistor R192 is connected with one end of the capacitor C220 and the same-phase end of the amplifier U34-A, the other end of the capacitor C220 is grounded, the other end of the capacitor C213 is connected with the output end of the amplifier U34-A and the inverting end of the amplifier U34-A, the positive electrode of the capacitor C215 and one end of the capacitor C218 are connected with the positive end of the power supply of the amplifier U34-A, the negative electrode of the capacitor C223 and one end of the capacitor C222 are connected with the negative electrode of the power supply of the amplifier U34-A, and the other end of the capacitor C215 and the other end of the capacitor C218 and the capacitor C223 are grounded;
The secondary filter sub-circuit comprises a resistor R193, a resistor R194, an amplifier U34-B, a capacitor C212 and a capacitor C219, wherein one end of the resistor R193 is connected with the output end of the amplifier U34-A, the other end of the resistor R193 is respectively connected with one end of the resistor R194 and one end of the capacitor C212, the other end of the resistor R194 is connected with one end of the capacitor C219 and the same-phase end of the amplifier U34-B, the other end of the capacitor C219 is grounded, the other end of the capacitor C212 is connected with the output end of the amplifier U34-B and the opposite-phase end of the amplifier U34-B, the positive end of the power supply of the amplifier U34-B is connected with a power supply +5VAVCC, and the negative end of the power supply of the amplifier U34-B is connected with the power supply-5 VAVCC;
the three-stage filter sub-circuit comprises a resistor R195, a resistor R196, an amplifier U40, a capacitor C211 and a capacitor C221, wherein one end of the resistor R195 is connected with the output end of the amplifier U34-B, the other end of the resistor R195 is respectively connected with one end of the resistor R196 and one end of the capacitor C211, the other end of the resistor R196 is connected with one end of the capacitor C221 and the same-phase end of the amplifier U40, the other end of the capacitor C221 is grounded, the other end of the capacitor C211 is connected with the output end of the amplifier U40 and the opposite-phase end of the amplifier U40, the positive end of the power supply of the amplifier U40 is connected with the power supply +5VAVCC, the negative end of the power supply of the amplifier U40 is connected with the power supply-5 VAVCC, and the output end of the amplifier U40 is connected with the AD module.
Still further, the H-bridge inverter module includes a first to fourth pulse emission isolation circuits with the same circuit structure, a diode D1, a diode D2, and a resistor R53, where an anode of the diode D1 is connected to a power source hv+, a cathode of the diode D1 is connected to the first pulse emission isolation circuit and the second pulse emission isolation circuit, a cathode of the diode D2 is connected to the power source HV-, an anode of the diode D2 is connected to a third pulse emission isolation circuit and a fourth pulse emission isolation circuit, the first pulse emission isolation circuit is connected to the third pulse emission isolation circuit, the second pulse emission isolation circuit is connected to the fourth pulse emission isolation circuit, one end of the resistor R53 is connected to a connection line of the first pulse emission isolation circuit and the third pulse emission isolation circuit, and another end of the resistor R53 is connected to an eighth pin of an optocoupler in a relay sub-circuit, and a connection line of the second pulse emission isolation circuit and the fourth pulse emission isolation circuit is connected to an eighth pin of an optocoupler in the relay sub-circuit;
the first pulse emission isolation circuit comprises a resistor R42, a resistor R43, a diode Q2, a resistor R41 and an optocoupler U8, one end of the resistor R42 is connected with a ninety-nine pin of the second MCU, the other end of the resistor R42 is respectively connected with one end of the resistor R43 and a base electrode of a triode Q2, the other end of the resistor R43 and an emitting electrode of the triode Q3 are grounded, the emitting electrode of the triode Q2 is connected with a second pin of the optocoupler U8, one end of the resistor R41 is connected with a +5V power supply, the other end of the resistor R41 is connected with a first pin of the optocoupler U8, a fourth pin of the optocoupler U8 is connected with a cathode of the diode D1, and a third pin of the optocoupler U8 is connected with a fourth pin of the optocoupler in the third pulse emission isolation circuit.
Still further, the high-voltage switching module includes a resistor R58, an optocoupler U17, a resistor R57, a resistor R56, a resistor R61, an optocoupler U18, an optocoupler U14, a resistor R59, and a resistor R60, wherein one end of the resistor R58 is connected to a +5v power supply, the other end of the resistor R58 is connected to a first pin of the optocoupler U17, a second pin of the optocoupler U17 is connected to a third pin of the optocoupler U14, one end of the resistor R57 is connected to a first hundred twenty-seventh pin of the second MCU, one end of the resistor R56 and the first pin of the optocoupler U14 are connected to DGND, the other end of the resistor R56 and the other end of the resistor R57 are connected to DGND, one end of the resistor R61 is connected to a +5v power supply, the other end of the resistor R61 is connected to a first pin of the optocoupler U18, the second pin of the optocoupler U18 is connected to a fourth pin of the optocoupler U14, one end of the fourth pin of the optocoupler U17 is connected to a fourth pin of the optocoupler U18, one end of the fourth pin of the optocoupler U18 is connected to a first hundred-seventh pin of the second MCU, one end of the resistor R56 and the other end of the resistor R60 is connected to the first hundred-th pin of the optocoupler U14.
Further, the logic control module includes a field effect transistor Q7X, a field effect transistor Q9X, a field effect transistor Q1X, an optocoupler Q2X, an optocoupler Q3X, an analog switch Q5X, sequentially numbered capacitors C1X to C5X, a capacitor C36X, sequentially numbered resistors R1X to R13X, a resistor R15X, a resistor R16X, and a resistor R44X, wherein a fifth pin to an eighth pin of the field effect transistor Q7X are all connected to a third pin of the optocoupler U18, a first pin to a third pin of the field effect transistor Q7X are all connected to one end of the resistor R13X, and the other end of the resistor R13X is connected to a fourth pin of the field effect transistor Q7X and a fourth pin of the analog switch Q5X; the fifth pin to the eighth pin of the field effect tube Q1X are connected with one end of a resistor R13X and a power supply VCC1, the first pin to the third pin of the field effect tube Q1X, one end of a resistor R2X, one end of a capacitor C2X and the positive electrode of the capacitor C1X are connected together, the positive electrode of the capacitor C1X is connected with the power supply VCC, the negative electrode of the capacitor C1X and the other end of the capacitor C2X are grounded, the positive electrode of the capacitor C1X is used as a power supply HV+ interface, and the negative electrode of the capacitor C1X is used as an interface of a power supply HV-; the other end of the resistor R2X and the fourth pin of the field effect transistor Q1X are connected with the third pin of the optocoupler Q2X; one end of the resistor R1X is connected with a seventy-eighth pin of the second MCU, the other end of the resistor R1X and one end of the resistor R3X are both connected with a second pin of the optocoupler Q2X, and the other end of the resistor R3X and a first pin of the optocoupler Q2X are both grounded; one end of a resistor R4X is connected with a power supply VCC, the other end of the resistor R4X is connected with a fourth pin of an optocoupler Q2X, one end of a capacitor C3X and a tenth pin of an analog switch Q5X, the other end of the capacitor C3X is grounded, a sixth pin of the optocoupler Q2X is connected with one end of a resistor R5X and one end of a resistor R6X, the other end of the resistor R5X is connected with an eighth pin of the optocoupler in a relay sub-circuit, and a fifth pin of the optocoupler Q2X and the other end of the resistor R6X are grounded; one end of the resistor R8X is connected with an eighth pin of an optocoupler in the relay sub-circuit, the other end of the resistor R8X and one end of the resistor R9X are both connected with a second pin of the optocoupler Q3X, the other end of the resistor R9X and a first pin of the optocoupler Q3X are both grounded, one end of the resistor R7X is connected with a power supply VCC, the other end of the resistor R7X is connected with a third pin of the optocoupler Q3X, one end of the capacitor C4X and a ninth pin of the analog switch Q5X, and the other end of the capacitor C4X is grounded; one end of a resistor R10X is connected with a power supply VCC, the other end of the resistor R10X is connected with a fourth pin of an optocoupler Q3X, one end of a capacitor C5X and a sixth pin of an analog switch Q5X, the other end of the capacitor C5X is grounded, the sixth pin of the optocoupler Q3X is connected with one end of a resistor R11X and one end of a resistor R12X, the other end of the resistor R11X is connected with an eighth pin of the optocoupler in the relay sub-circuit, and the fifth pin of the optocoupler Q3X and the other end of the resistor R12X are grounded; the first pin of the field effect tube Q9X is connected with one end of a resistor R15X and one end of a resistor R13X, the other end of the resistor R15X is connected with the fourth pin of the field effect tube Q9X and the fifth pin of the analog switch Q5X, and the fifth pin to the eighth pin of the field effect tube Q9X are connected with the third pin of the optocoupler U17; the first pin of the analog switch Q5X is grounded through a resistor R16X, the sixteenth pin of the analog switch Q5X is grounded through a resistor R44X and a capacitor C36X, and the connection line of the resistor R44X and the capacitor C36X is connected to the power supply VCC1.
Further, the MN signal conditioning module includes a resistor R150, a resistor R151, a resistor R156, a resistor R158, a resistor R159, a resistor R160, a triode Q3, a triode Q4, and an optocoupler U30, where a fifth pin of the optocoupler U30 is connected to an eighth pin of the optocoupler in one relay sub-circuit, an eighth pin of the optocoupler U30 is connected to an eighth pin of the optocoupler in another relay sub-circuit, both a sixth pin and a seventh pin of the optocoupler U30 are grounded, one end of the resistor R150 and one end of the resistor R151 are both connected to a power supply +5.5vcc, the other end of the resistor R150 is connected to a third pin of the optocoupler U30, and the other end of the resistor R151 is connected to a first pin of the optocoupler U30; one end of the resistor R156 is connected with a first hundred twenty five pin of the second MCU, the other end of the resistor R156 is connected with one end of the resistor R158 and the base electrode of the triode Q3, the other end of the resistor R158 and the emitter electrode of the triode Q3 are grounded, and the collector electrode of the triode Q3 is connected with a second pin of the optocoupler U30; one end of the resistor R159 is connected with the first hundred twenty six pins of the second MCU, the other end of the resistor R159 is connected with one end of the resistor R160 and the base electrode of the triode Q4, the other end of the resistor R160 and the emitting electrode of the triode Q4 are grounded, and the collecting electrode of the triode Q4 is connected with the fourth pin of the optocoupler U30.
Still further, the bluetooth module includes chip U35, electric capacity C225, bluetooth antenna E2, resistance R198, LED lamp LED1, triode Q5 and serial number's resistance R200 to resistance R204, the first pin of chip U35 connects the one end of electric capacity C225, the other end ground connection of electric capacity C225, the second pin of chip U35, fourth pin and fifth pin all connect the other end of electric capacity C225, the other termination power +3.3v of electric capacity C225, the eighteenth pin of chip U35 connects the one end of resistance R201, the one end of resistance R201's the other termination resistance R204 and the one end of resistance R203, the other end ground connection of resistance R203, the other end termination power +3.3v of resistance R35, the one end of base connection resistance R200 of chip U35 and the twenty-ninth pin of second MCU, the twenty-eighth pin of chip U35 connects the one end of chip hundred pins of chip U35 and the twenty-eighth pin of chip U35 connects the one end of chip U35 and the twenty-eighth pin of chip U35.
The invention also provides a method for the mine network hybrid electric method monitoring system, which comprises the following steps: the monitoring substation generates a transmitting signal, the transmitting signal is transmitted to the monitoring area through an electric method large line, a plurality of first electric method controllers, a plurality of second electric method controllers, a plurality of third electric method controllers, a plurality of fourth electric method controllers and a plurality of electrodes, and the first electric method controllers, the plurality of second electric method controllers, the plurality of third electric method controllers and the plurality of fourth electric method controllers return voltage signals to the monitoring substation, and the monitoring substation calculates the resistivity through the transmitting signal and the returned voltage signals so as to realize electric method monitoring.
The invention has the advantages that:
(1) The electrode switching function of the invention is integrated in the electric method controller and the monitoring substation equipment, each equipment controls a plurality of electrodes, and if the geological monitoring range is required to be enlarged, the electric method controller or the electrode converter equipment can be added for realizing. Because the electrode switching function is integrated in the electric method controller and the monitoring substation equipment, the electric method large line is internally provided with no electric main board, the defect that the electric fault probability of the distributed electric method detector is increased due to the increase of the electric main board is avoided, the equipment price is reduced, the electrode switching function is integrated in the single-machine equipment, the secondary maintenance is more convenient, and meanwhile, the product cost is greatly reduced.
(2) The electrode switching function of the invention is integrated in the electric method controller and the monitoring substation equipment, each equipment controls a plurality of electrodes, and if the geological monitoring range is required to be enlarged, the electric method controller or the electrode converter equipment can be added for realizing. Therefore, the staff can flexibly configure the number of the monitoring electrodes according to the field condition, and the defects of larger volume and short one-time working detection distance of the conventional centralized electric method instrument are overcome.
(3) The power supply module comprises a power supply module, a self-recovery fuse F3, a DC/DC conversion circuit, a voltage stabilizing circuit, a voltage monitoring system and a voltage monitoring system.
(4) The MN notch module is designed, 50HZ interference signals in the acquisition signals can be filtered after the acquisition signals contain the interference signals and pass through the notch circuit, the suppression of the interference signals can reach-80 dB, the acquisition signals enter the low-pass filter circuit after passing through the notch circuit, the low-pass filter circuit comprises three stages of sub-circuits, the first stage and the first stage are used for filtering high-frequency interference signals (such as high-frequency signals of 100Hz, 150Hz and 200 Hz), the acquisition signals are filtered by the low-pass filter circuit and then are output through a port to obtain purer detection signals, detection interference is reduced, and the detection result is accurate.
(5) And designing an H-bridge inversion module, wherein the first to fourth pulse transmitting isolation circuits receive PWM waveforms, and when the first and fourth pulse transmitting isolation circuits are at a high level, the second and third pulse transmitting isolation circuits are at a low level, the other end of the resistor R53 is conducted with the power supply HV+, and the eighth pin of the optocoupler in the other relay sub-circuit is conducted with the power supply HV-. On the contrary, when the first pulse transmitting isolation circuit and the fourth pulse transmitting isolation circuit are at low level, the second pulse transmitting isolation circuit and the third pulse transmitting isolation circuit are at high level, the other end of the resistor R53 is conducted with the power supply HV, the eighth pin of the optocoupler in the other relay sub-circuit is conducted with the power supply HV+, so that square wave signal output with high voltage peak value can be generated between the other end of the resistor R53 and the eighth pin of the optocoupler in the other relay sub-circuit, the pulse transmitting isolation circuit is adopted to completely isolate the low voltage control end from the high voltage output end, and meanwhile, output control of low voltage control and high voltage is completed, signal isolation and high-low voltage isolation are realized, and interference in the process of transmitting signals or receiving signals is avoided.
(6) The high-voltage switching module and the logic control module are designed, the logic control module provides two paths of power supplies, the high-voltage switching module controls and gates the two paths of power supplies, meanwhile, isolation between a control end and the high-voltage power supply and isolation between the control end and the low-voltage power supply are completed through an optocoupler, the anti-interference capability is high, the work is stable, the high-voltage power supply is switched to the high-voltage power supply through a gear switching circuit when high-voltage power supply is needed, the low-voltage power supply is switched to the low-voltage power supply through the gear switching circuit when low-voltage power supply is needed, the high-voltage power supply and the low-voltage power supply can be simultaneously switched and gated when different modules are respectively controlled, the power supply is not needed to be independently supplied through different power supplies, the number of devices is reduced, the chip size is reduced, and the cost is reduced.
Drawings
FIG. 1 is a schematic diagram of a system for monitoring a mine network hybrid electrical method in accordance with an embodiment of the present invention;
FIG. 2 is an electrical block diagram of a mine network hybrid electrical monitoring system according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a control switch module in a mine network hybrid electrical monitoring system according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a relay module of a mine network hybrid electrical monitoring system according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a DC/DC conversion circuit in a mine network hybrid electrical monitoring system according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a voltage stabilizing circuit in a mine network hybrid electrical monitoring system according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a step-down circuit in a mine network hybrid electrical monitoring system according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of an LED module in a mine network hybrid electrical monitoring system according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of a trap circuit in a hybrid electrical monitoring system for mine networks according to an embodiment of the present invention;
FIG. 10 is a schematic diagram of a low pass filter circuit in a mine network hybrid electrical monitoring system according to an embodiment of the present invention;
FIG. 11 is a schematic diagram of an H-bridge inverter module in a mine network hybrid electrical monitoring system according to an embodiment of the present invention;
FIG. 12 is a schematic diagram of a high voltage switching module in a mine network hybrid electrical monitoring system according to an embodiment of the present invention;
FIG. 13 is a schematic diagram of a logic control module in a hybrid electrical monitoring system for mine network according to an embodiment of the present invention;
fig. 14 is a schematic diagram of an MN signal conditioning module in a mine network hybrid electrical monitoring system according to an embodiment of the present invention;
Fig. 15 is a schematic diagram of a bluetooth module in a mine network hybrid electrical monitoring system according to an embodiment of the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions in the embodiments of the present invention will be clearly and completely described in the following in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1, the mine network hybrid electric monitoring system comprises a monitoring substation 1, a plurality of first electric controllers 2, a plurality of second electric controllers 3, a plurality of third electric controllers 4, a plurality of fourth electric controllers 5 and a plurality of electrodes 6, wherein the plurality of first electric controllers 2 are sequentially connected in series, the plurality of second electric controllers 3 are sequentially connected in series, the plurality of third electric controllers 4 are sequentially connected in series, the non-series end of the first electric controller 2 positioned at the head end is connected with one non-series end of the plurality of second electric controllers 3, the non-series end of the first electric controller 2 positioned at the tail end is connected with one non-series end of the plurality of third electric controllers 4, the non-series end of the first electric controller 2 positioned at the tail end is also connected with the monitoring substation 1 through the fourth electric controller 5, and each first electric controller 2 is connected with the plurality of electrodes 6 through an electric wire. The arrangement direction of the first electrical controller 2 is perpendicular to the arrangement direction of the second electrical controller 3, the third electrical controller 4 and the fourth electrical controller 5. The monitoring substation 1 transmits data to the host computer 6.
As shown in fig. 2, the first to fourth electric controllers 2 to 5 each include a first control circuit, the monitoring substation 1 includes a second control circuit, the first control circuit includes a relay module 7, a control switch module 8, a first MCU 9, a power supply module 10, an LED module 11, and an RS485 module 12, the control switch module 8, the power supply module 10, the LED module 11, and the RS485 module 12 are all connected to the first MCU 9, and the relay module 7 is connected to the control switch module 8; the second control circuit comprises an instrument amplifier 13, an MN notch module 14, an AD module 15, an H-bridge inversion module 16, a logic control module 17, a high-voltage switching module 18, an MN signal conditioning module 19, a second MCU 20 and a Bluetooth module 21, wherein the second MCU 20 is connected with the H-bridge inversion module 16 sequentially through the high-voltage switching module 18 and the logic control module 17, the second MCU 20 is connected with the relay module 7 through the H-bridge inversion module 16, the relay module 7 is connected with the second MCU 20 sequentially through the instrument amplifier 13, the MN notch module 14 and the AD module 15, the first MCU 9 is connected with the second MCU 20 through the RS485 module 12, and the MN signal conditioning module 19 and the Bluetooth module 21 are respectively connected with the second MCU 20. The model of the first MCU 9 is STM32F103VE17. The model of the second MCU 20 is STM32F407ZET6.
As shown in fig. 3, the control switch modules 8 have a plurality of control switch modules 8, each control switch module 8 includes four groups of identical control switch sub-circuits, one of which includes a resistor R98, a resistor R99 and a triode Q22, one end of the resistor R98 is connected to the thirty-th pin of the first MCU 9, the other end of the resistor R98 is connected to one end of the resistor R99 and the base of the triode Q22, and the collector 6 of the triode Q22 and the other end of the resistor R99 are grounded;
as shown in fig. 4, the relay modules 7 have a plurality of relay sub-circuits, each relay module 7 includes four groups of identical relay sub-circuits, one relay sub-circuit includes a resistor R161 and an optocoupler Q84, one end of the resistor R161 is connected with a +5v power supply, the other end of the resistor R161 is connected with a second pin of the optocoupler Q84, a first pin and a fourth pin of the optocoupler Q84 are both connected with a collector 6 of the triode Q22, a fifth pin and a sixth pin of the optocoupler Q84 are both connected with an electrode 6, and an eighth pin of the optocoupler Q84 is connected with the H-bridge inverter module 16.
As shown in fig. 5-7, the power module 10 includes a DC/DC conversion circuit, a voltage stabilizing circuit and a voltage reducing circuit, which are sequentially connected, referring to fig. 5, the DC/DC conversion circuit includes a fuse F3, a diode D15, a diode D16, a polarity capacitor C49 and a capacitor C48, one end of the fuse F3 is connected to an external power source, the other end of the fuse F3 is connected to the positive electrode of the polarity capacitor C49 and one end of the capacitor C48 through the diode D15 and the diode D16, and the negative electrode of the polarity capacitor C49 and the other end of the capacitor C48 are grounded;
Referring to fig. 6, the voltage stabilizing circuit includes a voltage stabilizing diode D17, sequentially numbered resistors R62 to R67, sequentially numbered capacitors C44 to C41, a chip U19, a diode D6, an inductor L4, and a voltage stabilizing diode D14, wherein a cathode of the voltage stabilizing diode D17, an anode of the capacitor C45, one end of the capacitor C40, one end of the resistor R62, and a second pin of the chip U19 are all connected to one end of the capacitor C48, the other end of the resistor R62 is respectively connected to one end of the resistor R63 and a third pin of the chip U19, one end of the resistor R64 and one end of the capacitor C42 are all connected to a sixth pin of the chip U19, the other end of the resistor R64 is connected to one end of the capacitor C43, one end of the capacitor C41 is connected to a fourth pin of the chip U19, one end of the capacitor C44 is connected to a first pin of the chip U19, the other end of the capacitor C44, one end of the inductor L4, and a cathode of the diode D6 are all connected to a eighth pin of the chip U19, one end of the resistor R65, one end of the capacitor C46, one end of the positive electrode of the capacitor C47, and the other end of the resistor C14 are all connected to a fifth pin of the resistor R67, and the resistor R67 are all connected to the other end of the resistor R67; the anode of the zener diode D17, the cathode of the capacitor C45, one end of the capacitor C40, the other end of the resistor R63, the other ends of the capacitors C42 to C41, the seventh pin of the chip U19, the anode of the diode D6, the other end of the resistor R67, the cathode of the capacitor C46, the cathode of the capacitor C47, and the anode of the zener diode D14 are all grounded.
Referring to fig. 7, the step-down circuit includes a chip U20 and sequentially numbered capacitors C37 to C40, wherein the positive electrode of the capacitor C51, one end of the capacitor C50 and a third pin of the chip U20 are all connected with the cathode of the zener diode D14, the cathode of the zener diode D14 is used as the +5v power output end, the positive electrode of the capacitor C52 and one end of the capacitor C53 are all connected with the second pin of the chip U20, one end of the capacitor C53 is used as the +3.3v power output end, and the negative electrode of the capacitor C51, the other end of the capacitor C50, the first pin of the chip U20, the negative electrode of the capacitor C52 and the other end of the capacitor C53 are all grounded. The power supply input with a wider range is connected with the DC/DC conversion circuit through the self-recovery fuse F3, the DC/DC conversion circuit converts the power supply voltage into lower voltage output through the voltage stabilizing circuit and keeps the voltage stable, the voltage value output with a lower range is realized to finish gradient power supply, then the output voltage of the voltage stabilizing circuit is reduced through the voltage reducing circuit to realize lower voltage, thus the output of the voltage stabilizing circuit and the output of the voltage reducing circuit can respectively supply power to different circuits, the gradient power supply is realized, the voltage stabilizing circuit stabilizes the voltage in a reliable range, and the voltage output is kept stable, so that the application working condition of an electric method monitoring system is met.
As shown in fig. 8, the LED module 11 includes a resistor R96, a resistor R97, a transistor Q20, a transistor Q21, a chip LED, a resistor R92, a resistor R93, a resistor R94, and a resistor R95, wherein one end of the resistor R96 and one end of the resistor R97 are connected with a +5v power supply, the other end of the resistor R96 is connected with a first pin of the chip LED and a collector 6 of the transistor Q20, the other end of the resistor R97 is connected with a third pin of the chip LED and a collector 6 of the transistor Q21, one end of the resistor R92 is connected with an eighty pin of the first MCU 9, one end of the resistor R94 and a base of the transistor Q20 are connected with the other end of the resistor R92, one end of the resistor R93 is connected with a twenty-fourth pin of the first MCU 9, one end of the resistor R95 and the base of the transistor Q21 are connected with the other end of the resistor R93, and the other end of the resistor R94, an emitter of the transistor Q20, an emitter of the chip LED, and the other end of the emitter of the transistor Q21 and the other end of the resistor R95 are grounded.
As shown in fig. 9 to 10, the MN notch module 14 includes a notch circuit and a low-pass filter circuit that are sequentially connected, referring to fig. 9, the notch circuit includes a resistor R1, a chip U33, a resistor R36, and a resistor R37, one end of the resistor R1 is connected to an output end of the instrumentation amplifier 13, the other end of the resistor R1 is connected to a first pin of the chip U33, a fifth pin of the chip U33 is connected to a power +5avcc, a second pin of the chip U33 is connected to a power-5 AVCC, one end of the resistor R36 is connected to a sixth pin of the chip U33, the other end of the resistor R36 is connected to a seventh pin of the chip U33, one end of the resistor R37 is connected to a third pin of the chip U33, and the other end of the resistor R37 and the other end of the chip U33 are all grounded; because the acquisition signal contains interference signals, 50HZ interference signals in the acquisition signal can be filtered after the acquisition signal passes through the trap circuit, wherein the inhibition of the interference signals can reach-80 dB, the acquisition signal enters the low-pass filter circuit after passing through the trap circuit, the low-pass filter circuit comprises three stages of sub-circuits, the first stage and the first stage of filtering are carried out on the low-pass filter circuit, the high-frequency interference signals (such as 100Hz, 150Hz and 200 Hz) are mainly filtered by the low-pass filter circuit, the acquisition signal is filtered by the low-pass filter circuit, and then the port outputs the acquisition signal to obtain purer detection signals, so that the detection interference is reduced, and the detection result is more accurate.
Referring to fig. 10, the low-pass filter circuit includes a first-stage filter sub-circuit, a second-stage filter sub-circuit and a third-stage filter sub-circuit, where the first-stage filter sub-circuit includes a resistor R191, a resistor R192, an amplifier U34-a, a capacitor C213, a capacitor C220, a capacitor C215, a capacitor C218, a capacitor C222 and a capacitor C223, one end of the resistor R191 is connected to a seventh pin of the chip U33, the other end of the resistor R191 is connected to one end of the resistor R192 and one end of the capacitor C213, the other end of the resistor R192 is connected to one end of the capacitor C220 and the same-phase end of the amplifier U34-a, the other end of the capacitor C220 is grounded, the other end of the capacitor C213 is connected to the output end of the amplifier U34-a and the inverted-phase end of the amplifier U34-a, the positive electrode of the capacitor C215 and one end of the capacitor C218 are connected to the positive end of the power supply of the amplifier U34-a, the negative electrode of the capacitor C222 and the other end of the capacitor C222 are connected to the negative electrode of the power supply of the amplifier U34-a, and the other end of the capacitor C215 and the negative electrode of the capacitor C218 are grounded;
the secondary filter sub-circuit comprises a resistor R193, a resistor R194, an amplifier U34-B, a capacitor C212 and a capacitor C219, wherein one end of the resistor R193 is connected with the output end of the amplifier U34-A, the other end of the resistor R193 is respectively connected with one end of the resistor R194 and one end of the capacitor C212, the other end of the resistor R194 is connected with one end of the capacitor C219 and the same-phase end of the amplifier U34-B, the other end of the capacitor C219 is grounded, the other end of the capacitor C212 is connected with the output end of the amplifier U34-B and the opposite-phase end of the amplifier U34-B, the positive end of the power supply of the amplifier U34-B is connected with a power supply +5VAVCC, and the negative end of the power supply of the amplifier U34-B is connected with the power supply-5 VAVCC;
The three-stage filter sub-circuit comprises a resistor R195, a resistor R196, an amplifier U40, a capacitor C211 and a capacitor C221, wherein one end of the resistor R195 is connected with the output end of the amplifier U34-B, the other end of the resistor R195 is respectively connected with one end of the resistor R196 and one end of the capacitor C211, the other end of the resistor R196 is connected with one end of the capacitor C221 and the same-phase end of the amplifier U40, the other end of the capacitor C221 is grounded, the other end of the capacitor C211 is connected with the output end of the amplifier U40 and the opposite-phase end of the amplifier U40, the positive end of the power supply of the amplifier U40 is connected with the power supply +5VAVCC, the negative end of the power supply of the amplifier U40 is connected with the power supply-5 VAVCC, and the output end of the amplifier U40 is connected with the AD module 15.
As shown in fig. 11, the H-bridge inverter module 16 includes a first to fourth pulse emission isolation circuits with the same circuit structure, a diode D1, a diode D2, and a resistor R53, where an anode of the diode D1 is connected to a power source hv+, a cathode of the diode D1 is connected to the first pulse emission isolation circuit and the second pulse emission isolation circuit, a cathode of the diode D2 is connected to the power source HV-, an anode of the diode D2 is connected to a third pulse emission isolation circuit and the fourth pulse emission isolation circuit, the first pulse emission isolation circuit is connected to the third pulse emission isolation circuit, the second pulse emission isolation circuit is connected to the fourth pulse emission isolation circuit, one end of the resistor R53 is connected to a connection line of the first pulse emission isolation circuit and the third pulse emission isolation circuit, and another end of the resistor R53 is connected to an eighth pin of an optocoupler in a relay sub-circuit, and a connection line of the second pulse emission isolation circuit and the fourth pulse emission isolation circuit is connected to an eighth pin of an optocoupler in another relay sub-circuit;
The first pulse emission isolation circuit comprises a resistor R42, a resistor R43, a diode Q2, a resistor R41 and an optocoupler U8, one end of the resistor R42 is connected with a ninety-nine pin of the second MCU 20, the other end of the resistor R42 is respectively connected with one end of the resistor R43 and a base electrode of the triode Q2, the other end of the resistor R43 and an emitting electrode of the triode Q3 are grounded, the emitting electrode of the triode Q2 is connected with a second pin of the optocoupler U8, one end of the resistor R41 is connected with a +5V power supply, the other end of the resistor R41 is connected with a first pin of the optocoupler U8, a fourth pin of the optocoupler U8 is connected with a cathode of the diode D1, and a third pin of the optocoupler U8 is connected with a fourth pin of the optocoupler in the third pulse emission isolation circuit.
The first pulse transmitting isolation circuit to the fourth pulse transmitting isolation circuit receive PWM waveforms, when the first pulse transmitting isolation circuit and the fourth pulse transmitting isolation circuit are in high level, the second pulse transmitting isolation circuit and the third pulse transmitting isolation circuit are in low level, the other end of the resistor R53 is conducted with the power supply HV+, and the eighth pin of the optocoupler in the relay sub-circuit is conducted with the power supply HV-. On the contrary, when the first pulse transmitting isolation circuit and the fourth pulse transmitting isolation circuit are at low level, the second pulse transmitting isolation circuit and the third pulse transmitting isolation circuit are at high level, the other end of the resistor R53 is conducted with the power supply HV, the eighth pin of the optocoupler in the other relay sub-circuit is conducted with the power supply HV+, so that square wave signal output with high voltage peak value can be generated between the other end of the resistor R53 and the eighth pin of the optocoupler in the other relay sub-circuit, the pulse transmitting isolation circuit is adopted to completely isolate the low voltage control end from the high voltage output end, and meanwhile, output control of low voltage control and high voltage is completed, signal isolation and high-low voltage isolation are realized, and interference in the process of transmitting signals or receiving signals is avoided.
As shown IN fig. 12, the high-voltage switching module 18 includes a resistor R58, an optocoupler U17, a resistor R57, a resistor R56, a resistor R61, an optocoupler U18, an optocoupler U14, a resistor R59, and a resistor R60, wherein one end of the resistor R58 is connected to a +5v power supply, the other end of the resistor R58 is connected to a first pin of the optocoupler U17, a second pin of the optocoupler U17 is connected to a third pin of the optocoupler U14, a fourth pin of the optocoupler U17 is externally connected to a power supply pwr_in+, one end of the resistor R57 is connected to a first twenty-seventh pin of the second MCU 20, one end of the resistor R56 and the first pin of the optocoupler U14 are all connected to DGND, one end of the second pin of the optocoupler U14, the other end of the resistor R56 and the other end of the resistor R57 are connected to +5v power supply, the other end of the resistor R61 is connected to the first pin of the optocoupler U18, the second pin of the optocoupler U18 is connected to a fourth pin of the optocoupler U14, and the other end of the fourth pin of the optocoupler U18 is connected to the fourth pin of the optocoupler U18 is connected to the second pin of the output pin of the optocoupler U14, and the other end of the fourth pin of the optocoupler 18 is connected to the resistor 60 is connected to the other end of the resistor 60 is connected to the resistor g, and the other end of the resistor is connected to the resistor h resistor is connected to the resistor b 20.
As shown in fig. 13, the logic control module 17 includes a field effect transistor Q7X, a field effect transistor Q9X, a field effect transistor Q1X, an optocoupler Q2X, an optocoupler Q3X, an analog switch Q5X, sequentially numbered capacitors C1X to C5X, a capacitor C36X, sequentially numbered resistors R1X to R13X, a resistor R15X, a resistor R16X, and a resistor R44X, wherein a fifth pin to an eighth pin of the field effect transistor Q7X are all connected with a third pin of the optocoupler U18, a first pin to a third pin of the field effect transistor Q7X are all connected with one end of the resistor R13X, and the other end of the resistor R13X is connected with a fourth pin of the field effect transistor Q7X and a fourth pin of the analog switch Q5X; the fifth pin to the eighth pin of the field effect tube Q1X are connected with one end of a resistor R13X and a power supply VCC1, the first pin to the third pin of the field effect tube Q1X, one end of a resistor R2X, one end of a capacitor C2X and the positive electrode of the capacitor C1X are connected together, the positive electrode of the capacitor C1X is connected with the power supply VCC, the negative electrode of the capacitor C1X and the other end of the capacitor C2X are grounded, the positive electrode of the capacitor C1X is used as a power supply HV+ interface, and the negative electrode of the capacitor C1X is used as an interface of a power supply HV-; the other end of the resistor R2X and the fourth pin of the field effect transistor Q1X are connected with the third pin of the optocoupler Q2X; one end of the resistor R1X is connected with a seventy-eighth pin of the second MCU 20, the other end of the resistor R1X and one end of the resistor R3X are both connected with a second pin of the optocoupler Q2X, and the other end of the resistor R3X and a first pin of the optocoupler Q2X are both grounded; one end of a resistor R4X is connected with a power supply VCC, the other end of the resistor R4X is connected with a fourth pin of an optocoupler Q2X, one end of a capacitor C3X and a tenth pin of an analog switch Q5X, the other end of the capacitor C3X is grounded, a sixth pin of the optocoupler Q2X is connected with one end of a resistor R5X and one end of a resistor R6X, the other end of the resistor R5X is connected with an eighth pin of the optocoupler in a relay sub-circuit, and a fifth pin of the optocoupler Q2X and the other end of the resistor R6X are grounded; one end of the resistor R8X is connected with an eighth pin of an optocoupler in the relay sub-circuit, the other end of the resistor R8X and one end of the resistor R9X are both connected with a second pin of the optocoupler Q3X, the other end of the resistor R9X and a first pin of the optocoupler Q3X are both grounded, one end of the resistor R7X is connected with a power supply VCC, the other end of the resistor R7X is connected with a third pin of the optocoupler Q3X, one end of the capacitor C4X and a ninth pin of the analog switch Q5X, and the other end of the capacitor C4X is grounded; one end of a resistor R10X is connected with a power supply VCC, the other end of the resistor R10X is connected with a fourth pin of an optocoupler Q3X, one end of a capacitor C5X and a sixth pin of an analog switch Q5X, the other end of the capacitor C5X is grounded, the sixth pin of the optocoupler Q3X is connected with one end of a resistor R11X and one end of a resistor R12X, the other end of the resistor R11X is connected with an eighth pin of the optocoupler in the relay sub-circuit, and the fifth pin of the optocoupler Q3X and the other end of the resistor R12X are grounded; the first pin of the field effect tube Q9X is connected with one end of a resistor R15X and one end of a resistor R13X, the other end of the resistor R15X is connected with the fourth pin of the field effect tube Q9X and the fifth pin of the analog switch Q5X, and the fifth pin to the eighth pin of the field effect tube Q9X are connected with the third pin of the optocoupler U17; the first pin of the analog switch Q5X is grounded through a resistor R16X, the sixteenth pin of the analog switch Q5X is grounded through a resistor R44X and a capacitor C36X, and the connection line of the resistor R44X and the capacitor C36X is connected to the power supply VCC1.
As shown in fig. 14, the MN signal conditioning module 19 includes a resistor R150, a resistor R151, a resistor R156, a resistor R158, a resistor R159, a resistor R160, a triode Q3, a triode Q4, and an optocoupler U30, where a fifth pin of the optocoupler U30 is connected to an eighth pin of the optocoupler in one relay sub-circuit, an eighth pin of the optocoupler U30 is connected to an eighth pin of the optocoupler in another relay sub-circuit, both a sixth pin and a seventh pin of the optocoupler U30 are grounded, one end of the resistor R150 and one end of the resistor R151 are both connected to a power supply +5.5vcc, the other end of the resistor R150 is connected to a third pin of the optocoupler U30, and the other end of the resistor R151 is connected to the first pin of the optocoupler U30; one end of the resistor R156 is connected with a first hundred twenty five pin of the second MCU 20, the other end of the resistor R156 is connected with one end of the resistor R158 and the base electrode of the triode Q3, the other end of the resistor R158 and the emitter electrode of the triode Q3 are grounded, and the collector electrode 6 of the triode Q3 is connected with a second pin of the optocoupler U30; one end of the resistor R159 is connected with the first hundred twenty six pins of the second MCU 20, the other end of the resistor R159 is connected with one end of the resistor R160 and the base electrode of the triode Q4, the other end of the resistor R160 and the emitting electrode of the triode Q4 are grounded, and the collecting electrode 6 of the triode Q4 is connected with the fourth pin of the optocoupler U30.
As shown in fig. 15, the bluetooth module 21 includes a chip U35, a capacitor C225, a bluetooth antenna E2, a resistor R198, an LED lamp LED1, a transistor Q5, and resistors R200 to R204 sequentially numbered, where a first pin of the chip U35 is connected to one end of the capacitor C225, the other end of the capacitor C225 is grounded, a second pin, a fourth pin, and a fifth pin of the chip U35 are all connected to the other end of the capacitor C225, the other end of the capacitor C225 is connected to +3.3v, an eighteenth pin of the chip U35 is connected to one end of the resistor R201, the other end of the resistor R201 is connected to one end of the resistor R204, the other end of the resistor R204 is connected to ground, the other end of the resistor R203 is connected to +3.3v, the other end of the resistor R202 is connected to +3.3v, the base of the transistor Q5 is connected to one end of the resistor R200 and the twenty-ninth pin of the second MCU 20, the other end of the chip U35 is connected to the other end of the resistor C225, the other end of the twenty-eighth pin of the chip U35 is connected to the first pin of the chip U35, the twenty-eighth pin of the chip U35 is connected to the twenty-eighth pin of the MCU 35, and the twenty-eighth pin of the chip is connected to the twenty-eighth pin of the chip 35 is connected to the first pin of the MCU 35.
The invention also provides a method for the mine network hybrid electric method monitoring system, which comprises the following steps: the monitoring substation 1 generates a transmitting signal, the transmitting signal is transmitted to a monitoring area through an electric method large line, a plurality of first electric method controllers 2, a plurality of second electric method controllers 3, a plurality of third electric method controllers 4, a plurality of fourth electric method controllers 5 and a plurality of electrodes 6, the first electric method controllers 2, the plurality of second electric method controllers 3, the plurality of third electric method controllers 4 and the plurality of fourth electric method controllers 5 return voltage signals to the monitoring substation 1, and the monitoring substation 1 calculates resistivity through the transmitting signal and the returned voltage signals to realize electric method monitoring.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (6)

1. The mine network hybrid electric monitoring system is characterized by comprising a monitoring substation, a plurality of first electric controllers, a plurality of second electric controllers, a plurality of third electric controllers, a plurality of fourth electric controllers and a plurality of electrodes, wherein the plurality of first electric controllers are sequentially connected in series, the plurality of second electric controllers are sequentially connected in series, the non-series end of the first electric controller positioned at the head end is sequentially connected with one non-series end of the plurality of second electric controllers, the non-series end of the first electric controller positioned at the tail end is connected with one non-series end of the plurality of third electric controllers, the non-series end of the first electric controller positioned at the tail end is also connected with the monitoring substation through the fourth electric controller, each first electric controller is connected with a plurality of electrodes through an electric wire, and the arrangement direction of the first electric controller is perpendicular to the arrangement direction of the second electric controller, the third electric controller and the fourth electric controller; the first electric method controller comprises a first control circuit, the monitoring substation comprises a second control circuit, the first control circuit comprises a relay module, a control switch module, a first MCU, a power module, an LED module and an RS485 module, the control switch module, the power module, the LED module and the RS485 module are all connected with the first MCU, and the relay module is connected with the control switch module; the second control circuit comprises an instrument amplifier, an MN notch module, an AD module, an H-bridge inversion module, a logic control module, a high-voltage switching module, an MN signal conditioning module, a second MCU and a Bluetooth module, wherein the second MCU is connected with the H-bridge inversion module through the high-voltage switching module and the logic control module in sequence, the second MCU is connected with the relay module through the H-bridge inversion module, the relay module is connected with the second MCU through the instrument amplifier, the MN notch module and the AD module in sequence, the first MCU is connected with the second MCU through the RS485 module, and the MN signal conditioning module and the Bluetooth module are respectively connected with the second MCU; the control switch modules are in a plurality, each control switch module comprises four groups of identical control switch subcircuits, one control switch subcircuit comprises a resistor R98, a resistor R99 and a triode Q22, one end of the resistor R98 is connected with a thirty-th pin of the first MCU, the other end of the resistor R98 is connected with one end of the resistor R99 and a base electrode of the triode Q22, and a collector electrode of the triode Q22 and the other end of the resistor R99 are grounded;
The relay modules are in a plurality, each relay module comprises four groups of identical relay sub-circuits, one relay sub-circuit comprises a resistor R161 and an optocoupler Q84, one end of the resistor R161 is connected with a +5V power supply, the other end of the resistor R161 is connected with a second pin of the optocoupler Q84, the first pin and the fourth pin of the optocoupler Q84 are connected with the collector electrode of the triode Q22, the fifth pin and the sixth pin of the optocoupler Q84 are connected with the electrode, and the eighth pin of the optocoupler Q84 is connected with the H bridge inversion module;
the MN notch module comprises a notch circuit and a low-pass filter circuit which are sequentially connected, the notch circuit comprises a resistor R1, a chip U33, a resistor R36 and a resistor R37, one end of the resistor R1 is connected with the output end of the instrument amplifier, the other end of the resistor R1 is connected with a first pin of the chip U33, a fifth pin of the chip U33 is connected with a power supply +5AVCC, a second pin of the chip U33 is connected with a power supply-5 AVCC, one end of the resistor R36 is connected with a sixth pin of the chip U33, the other end of the resistor R36 is connected with a seventh pin of the chip U33, one end of the resistor R37 is connected with a third pin of the chip U33, and the other end of the resistor R37 and the other end of the chip U33 are grounded;
the low-pass filter circuit comprises a first-stage filter sub-circuit, a second-stage filter sub-circuit and a third-stage filter sub-circuit, wherein the first-stage filter sub-circuit comprises a resistor R191, a resistor R192, an amplifier U34-A, a capacitor C213, a capacitor C220, a capacitor C215, a capacitor C218, a capacitor C222 and a capacitor C223, one end of the resistor R191 is connected with a seventh pin of the chip U33, the other end of the resistor R191 is respectively connected with one end of the resistor R192 and one end of the capacitor C213, the other end of the resistor R192 is connected with one end of the capacitor C220 and the same-phase end of the amplifier U34-A, the other end of the capacitor C220 is grounded, the other end of the capacitor C213 is connected with the output end of the amplifier U34-A and the inverting end of the amplifier U34-A, the positive electrode of the capacitor C215 and one end of the capacitor C218 are connected with the positive end of the power supply of the amplifier U34-A, the negative electrode of the capacitor C223 and one end of the capacitor C222 are connected with the negative electrode of the power supply of the amplifier U34-A, and the other end of the capacitor C215 and the other end of the capacitor C218 and the capacitor C223 are grounded;
The secondary filter sub-circuit comprises a resistor R193, a resistor R194, an amplifier U34-B, a capacitor C212 and a capacitor C219, wherein one end of the resistor R193 is connected with the output end of the amplifier U34-A, the other end of the resistor R193 is respectively connected with one end of the resistor R194 and one end of the capacitor C212, the other end of the resistor R194 is connected with one end of the capacitor C219 and the same-phase end of the amplifier U34-B, the other end of the capacitor C219 is grounded, the other end of the capacitor C212 is connected with the output end of the amplifier U34-B and the opposite-phase end of the amplifier U34-B, the positive end of the power supply of the amplifier U34-B is connected with a power supply +5VAVCC, and the negative end of the power supply of the amplifier U34-B is connected with the power supply-5 VAVCC;
the three-stage filter sub-circuit comprises a resistor R195, a resistor R196, an amplifier U40, a capacitor C211 and a capacitor C221, wherein one end of the resistor R195 is connected with the output end of the amplifier U34-B, the other end of the resistor R195 is respectively connected with one end of the resistor R196 and one end of the capacitor C211, the other end of the resistor R196 is connected with one end of the capacitor C221 and the same-phase end of the amplifier U40, the other end of the capacitor C221 is grounded, the other end of the capacitor C211 is connected with the output end of the amplifier U40 and the opposite-phase end of the amplifier U40, the positive end of the power supply of the amplifier U40 is connected with a power supply +5VAVCC, the negative end of the power supply of the amplifier U40 is connected with a power supply-5 VAVCC, and the output end of the amplifier U40 is connected with the AD module;
The H bridge inversion module comprises first to fourth pulse emission isolation circuits with the same circuit structure, a diode D1, a diode D2 and a resistor R53, wherein the anode of the diode D1 is connected with a power supply HV+, the cathode of the diode D1 is respectively connected with the first pulse emission isolation circuit and the second pulse emission isolation circuit, the cathode of the diode D2 is connected with the power supply HV-, the anode of the diode D2 is respectively connected with a third pulse emission isolation circuit and the fourth pulse emission isolation circuit, the first pulse emission isolation circuit is connected with the third pulse emission isolation circuit, the second pulse emission isolation circuit is connected with the fourth pulse emission isolation circuit, one end of the resistor R53 is connected to a connecting line of the first pulse emission isolation circuit and the third pulse emission isolation circuit, the other end of the resistor R53 is connected with an eighth pin of an optical coupler in a relay sub-circuit, and the second pulse emission isolation circuit is connected with an eighth pin of an optical coupler in a connecting line of another relay sub-circuit;
the first pulse emission isolation circuit comprises a resistor R42, a resistor R43, a diode Q2, a resistor R41 and an optocoupler U8, wherein one end of the resistor R42 is connected with a ninety-nine pin of the second MCU, the other end of the resistor R42 is respectively connected with one end of the resistor R43 and a base electrode of a triode Q2, the other end of the resistor R43 and an emitting electrode of the triode Q3 are grounded, the emitting electrode of the triode Q2 is connected with a second pin of the optocoupler U8, one end of the resistor R41 is connected with a +5V power supply, the other end of the resistor R41 is connected with a first pin of the optocoupler U8, a fourth pin of the optocoupler U8 is connected with a cathode of the diode D1, and a third pin of the optocoupler U8 is connected with a fourth pin of the optocoupler in the third pulse emission isolation circuit;
The high-voltage switching module comprises a resistor R58, an optocoupler U17, a resistor R57, a resistor R56, a resistor R61, an optocoupler U18, an optocoupler U14, a resistor R59 and a resistor R60, wherein one end of the resistor R58 is connected with a +5V power supply, the other end of the resistor R58 is connected with a first pin of the optocoupler U17, a second pin of the optocoupler U17 is connected with a third pin of the optocoupler U14, a fourth pin of the optocoupler U17 is externally connected with a power supply PWR_IN+, one end of the resistor R57 is connected with a first hundred and twenty-seventh pin of a second MCU, one end of the resistor R56 and the first pin of the optocoupler U14 are grounded DGND, one end of the resistor R14, the other end of the resistor R56 and the other end of the resistor R57 are connected with a +5V power supply, the other end of the resistor R61 is connected with a first pin of the optocoupler U18, the second pin of the optocoupler U18 is connected with a fourth pin of the optocoupler U14, one end of the fourth pin of the optocoupler U18 is externally connected with a fourth pin of the optocoupler PWR_IN+, one end of the fourth pin of the optocoupler U18 is externally connected with a first pin of the power supply PWR_IN+, and the other end of the resistor R60 is connected with the other end of the resistor DGND 60, and the other end of the resistor is connected with the resistor DGND 60 is connected with the resistor U14.
2. The mine network hybrid electric method monitoring system according to claim 1, wherein the power supply module comprises a DC/DC conversion circuit, a voltage stabilizing circuit and a voltage reducing circuit which are sequentially connected, the DC/DC conversion circuit comprises a fuse F3, a diode D15, a diode D16, a polar capacitor C49 and a capacitor C48, one end of the fuse F3 is connected with an external power supply, the other end of the fuse F3 is connected with the positive electrode of the polar capacitor C49 and one end of the capacitor C48 through the diode D15 and the diode D16, and the negative electrode of the polar capacitor C49 and the other end of the capacitor C48 are grounded;
The voltage stabilizing circuit comprises a voltage stabilizing diode D17, a resistor R62 to a resistor R67 which are sequentially numbered, a capacitor C44 to a capacitor C41 which are sequentially numbered, a chip U19, a diode D6, an inductor L4 and a voltage stabilizing diode D14, wherein a cathode of the voltage stabilizing diode D17, an anode of the capacitor C45, one end of the capacitor C40, one end of the resistor R62 and a second pin of the chip U19 are all connected with one end of the capacitor C48, the other end of the resistor R62 is respectively connected with one end of the resistor R63 and a third pin of the chip U19, one end of the resistor R64 and one end of the capacitor C42 are all connected with a sixth pin of the chip U19, one end of the resistor R64 is connected with one end of the capacitor C43, one end of the capacitor C41 is connected with a fourth pin of the chip U19, one end of the capacitor C44 is connected with a first pin of the chip U19, one end of the other end of the capacitor C44, one end of the inductor L4 and a cathode of the diode D6 are all connected with an eighth pin of the chip U19, one end of the resistor R65, one end of the anode of the capacitor C46, one end of the capacitor C47 and the anode of the capacitor C47 and the other end of the resistor D14 are all connected with the other end of the resistor R67 through the resistor R67; the anode of the zener diode D17, the cathode of the capacitor C45, one end of the capacitor C40, the other end of the resistor R63, the other ends of the capacitors C42 to C41, the seventh pin of the chip U19, the anode of the diode D6, the other end of the resistor R67, the cathode of the capacitor C46, the cathode of the capacitor C47 and the anode of the zener diode D14 are all grounded;
The step-down circuit comprises a chip U20 and capacitors C50 to C53 which are numbered sequentially, wherein the anode of the capacitor C51, one end of the capacitor C50 and a third pin of the chip U20 are all connected with a cathode of a zener diode D14, the cathode of the zener diode D14 is used as a +5V power supply output end, the anode of the capacitor C52 and one end of the capacitor C53 are all connected with a second pin of the chip U20, one end of the capacitor C53 is used as a +3.3V power supply output end, and the cathode of the capacitor C51, the other end of the capacitor C50, a first pin of the chip U20, the cathode of the capacitor C52 and the other end of the capacitor C53 are all grounded.
3. The mine network hybrid electrical method monitoring system of claim 1, wherein the LED module comprises a resistor R96, a resistor R97, a triode Q20, a triode Q21, a chip LED, a resistor R92, a resistor R93, a resistor R94 and a resistor R95, wherein one end of the resistor R96 and one end of the resistor R97 are connected with a +5v power supply, the other end of the resistor R96 is connected with a first pin of the chip LED and a collector of the triode Q20, the other end of the resistor R97 is connected with a third pin of the chip LED and a collector of the triode Q21, one end of the resistor R92 is connected with an eighty pin of the first MCU, one end of the resistor R94 and a base of the triode Q20 are connected with the other end of the resistor R92, one end of the resistor R95 and the base of the triode Q21 are connected with the other end of the resistor R93, and the other end of the resistor R94, an emitter of the triode Q20, a second pin of the chip LED, the other end of the triode Q21 and the emitter of the resistor R95 are grounded.
4. The mine network hybrid electrical method monitoring system of claim 1, wherein the logic control module comprises a field effect transistor Q7X, a field effect transistor Q9X, a field effect transistor Q1X, an optocoupler Q2X, an optocoupler Q3X, an analog switch Q5X, sequentially numbered capacitors C1X to C5X, a capacitor C36X, sequentially numbered resistors R1X to R13X, a resistor R15X, a resistor R16X and a resistor R44X, wherein a fifth pin to an eighth pin of the field effect transistor Q7X are all connected with a third pin of the optocoupler U18, a first pin to a third pin of the field effect transistor Q7X are all connected with one end of the resistor R13X, and the other end of the resistor R13X is connected with a fourth pin of the field effect transistor Q7X and a fourth pin of the analog switch Q5X; the fifth pin to the eighth pin of the field effect tube Q1X are connected with one end of a resistor R13X and a power supply VCC1, the first pin to the third pin of the field effect tube Q1X, one end of a resistor R2X, one end of a capacitor C2X and the positive electrode of the capacitor C1X are connected together, the positive electrode of the capacitor C1X is connected with the power supply VCC, the negative electrode of the capacitor C1X and the other end of the capacitor C2X are grounded, the positive electrode of the capacitor C1X is used as a power supply HV+ interface, and the negative electrode of the capacitor C1X is used as an interface of a power supply HV-; the other end of the resistor R2X and the fourth pin of the field effect transistor Q1X are connected with the third pin of the optocoupler Q2X; one end of the resistor R1X is connected with a seventy-eighth pin of the second MCU, the other end of the resistor R1X and one end of the resistor R3X are both connected with a second pin of the optocoupler Q2X, and the other end of the resistor R3X and a first pin of the optocoupler Q2X are both grounded; one end of a resistor R4X is connected with a power supply VCC, the other end of the resistor R4X is connected with a fourth pin of an optocoupler Q2X, one end of a capacitor C3X and a tenth pin of an analog switch Q5X, the other end of the capacitor C3X is grounded, a sixth pin of the optocoupler Q2X is connected with one end of a resistor R5X and one end of a resistor R6X, the other end of the resistor R5X is connected with an eighth pin of the optocoupler in a relay sub-circuit, and a fifth pin of the optocoupler Q2X and the other end of the resistor R6X are grounded; one end of the resistor R8X is connected with an eighth pin of an optocoupler in the relay sub-circuit, the other end of the resistor R8X and one end of the resistor R9X are both connected with a second pin of the optocoupler Q3X, the other end of the resistor R9X and a first pin of the optocoupler Q3X are both grounded, one end of the resistor R7X is connected with a power supply VCC, the other end of the resistor R7X is connected with a third pin of the optocoupler Q3X, one end of the capacitor C4X and a ninth pin of the analog switch Q5X, and the other end of the capacitor C4X is grounded; one end of a resistor R10X is connected with a power supply VCC, the other end of the resistor R10X is connected with a fourth pin of an optocoupler Q3X, one end of a capacitor C5X and a sixth pin of an analog switch Q5X, the other end of the capacitor C5X is grounded, the sixth pin of the optocoupler Q3X is connected with one end of a resistor R11X and one end of a resistor R12X, the other end of the resistor R11X is connected with an eighth pin of the optocoupler in the relay sub-circuit, and the fifth pin of the optocoupler Q3X and the other end of the resistor R12X are grounded; the first pin of the field effect tube Q9X is connected with one end of a resistor R15X and one end of a resistor R13X, the other end of the resistor R15X is connected with the fourth pin of the field effect tube Q9X and the fifth pin of the analog switch Q5X, and the fifth pin to the eighth pin of the field effect tube Q9X are connected with the third pin of the optocoupler U17; the first pin of the analog switch Q5X is grounded through a resistor R16X, the sixteenth pin of the analog switch Q5X is grounded through a resistor R44X and a capacitor C36X, and the connection line of the resistor R44X and the capacitor C36X is connected to the power supply VCC1.
5. The mine network hybrid electrical method monitoring system of claim 1, wherein the MN signal conditioning module comprises a resistor R150, a resistor R151, a resistor R156, a resistor R158, a resistor R159, a resistor R160, a triode Q3, a triode Q4 and an optocoupler U30, wherein a fifth pin of the optocoupler U30 is connected to an eighth pin of the optocoupler in one relay sub-circuit, an eighth pin of the optocoupler U30 is connected to an eighth pin of the optocoupler in the other relay sub-circuit, a sixth pin and a seventh pin of the optocoupler U30 are both grounded, one end of the resistor R150 and one end of the resistor R151 are both connected to a power supply +5.5VCC, the other end of the resistor R150 is connected to a third pin of the optocoupler U30, and the other end of the resistor R151 is connected to a first pin of the optocoupler U30; one end of the resistor R156 is connected with a first hundred twenty five pin of the second MCU, the other end of the resistor R156 is connected with one end of the resistor R158 and the base electrode of the triode Q3, the other end of the resistor R158 and the emitter electrode of the triode Q3 are grounded, and the collector electrode of the triode Q3 is connected with a second pin of the optocoupler U30; one end of the resistor R159 is connected with the first hundred twenty six pins of the second MCU, the other end of the resistor R159 is connected with one end of the resistor R160 and the base electrode of the triode Q4, the other end of the resistor R160 and the emitting electrode of the triode Q4 are grounded, and the collecting electrode of the triode Q4 is connected with the fourth pin of the optocoupler U30.
6. A method of a mine network hybrid electrical monitoring system in accordance with any one of claims 1-5, wherein the method comprises: the monitoring substation generates a transmitting signal, the transmitting signal is transmitted to the monitoring area through an electric method large line, a plurality of first electric method controllers, a plurality of second electric method controllers, a plurality of third electric method controllers, a plurality of fourth electric method controllers and a plurality of electrodes, and the first electric method controllers, the plurality of second electric method controllers, the plurality of third electric method controllers and the plurality of fourth electric method controllers return voltage signals to the monitoring substation, and the monitoring substation calculates the resistivity through the transmitting signal and the returned voltage signals so as to realize electric method monitoring.
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