CN112054017A - Display panel, preparation method and display device - Google Patents
Display panel, preparation method and display device Download PDFInfo
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- CN112054017A CN112054017A CN202010917515.3A CN202010917515A CN112054017A CN 112054017 A CN112054017 A CN 112054017A CN 202010917515 A CN202010917515 A CN 202010917515A CN 112054017 A CN112054017 A CN 112054017A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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Abstract
The embodiment of the invention discloses a display panel, a preparation method and a display device. The display panel includes: the array substrate comprises a pixel driving circuit, and the pixel driving circuit is used for driving the micro light-emitting diode to emit light; the light shielding layer is positioned on one side of the fingerprint identification unit, which is far away from the array substrate; the shading layer is provided with a first through hole and a second through hole, the first through hole is overlapped with the micro light-emitting diode, and the second through hole exposes the fingerprint identification unit. The technical scheme provided by the embodiment of the invention can reduce the thickness of the display panel and realize the thinning of the display panel.
Description
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a display panel, a preparation method and a display device.
Background
With the development of display technology, Micro-LED (Micro light emitting diode) display panels have become a research hotspot in the display field by virtue of the advantages of high brightness, good light emitting efficiency, easy realization of transparent display, and the like.
At present, in order to enrich the functions of a Micro-LED display panel, a fingerprint identification module is usually arranged on the backlight side of the Micro-LED display panel so as to realize the fingerprint identification function, but the thickness of the display panel with the fingerprint identification function is thicker and the display panel is not attractive.
Disclosure of Invention
The invention provides a display panel, a preparation method and a display device, which are used for reducing the thickness of the display panel.
In a first aspect, an embodiment of the present invention provides a display panel, including:
the array substrate comprises a pixel driving circuit, and the pixel driving circuit is used for driving the micro light-emitting diode to emit light;
the light shielding layer is positioned on one side of the fingerprint identification unit, which is far away from the array substrate;
the light shielding layer is provided with a first through hole and a second through hole, the first through hole is overlapped with the micro light-emitting diode, and the second through hole exposes the fingerprint identification unit.
In a second aspect, an embodiment of the present invention further provides a display device, which includes the display panel described in the first aspect.
In a third aspect, an embodiment of the present invention further provides a method for manufacturing a display panel, including:
preparing an array substrate;
forming a fingerprint identification unit;
transferring the micro light emitting diode to the array substrate and forming a light shielding layer;
the array substrate comprises a pixel driving circuit, and the pixel driving circuit is used for driving the micro light-emitting diode to emit light;
the micro light-emitting diode and the fingerprint identification unit are positioned on one side of the array substrate; the light shielding layer is positioned on one side of the fingerprint identification unit, which is far away from the array substrate;
the light shielding layer is provided with a first through hole and a second through hole, the first through hole is overlapped with the micro light-emitting diode, and the second through hole exposes the fingerprint identification unit.
According to the display panel provided by the embodiment of the invention, the fingerprint identification unit and the micro light-emitting diode are arranged on the same side of the array substrate, so that the fingerprint identification unit is integrated in the display panel instead of being hung outside the display panel. The problem of among the prior art because the fingerprint identification module is external leads to thickness thicker outside display panel is solved, the effect of attenuate display panel thickness is realized.
Drawings
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view along AA' of FIG. 1;
FIG. 3 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
FIG. 4 is a cross-sectional view taken along direction CC' of FIG. 3;
FIG. 5 is another cross-sectional view taken along direction CC' of FIG. 3;
FIG. 6 is a further cross-sectional view taken along direction CC' of FIG. 3;
FIG. 7 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
FIG. 8 is a cross-sectional view taken along direction DD' in FIG. 7;
FIG. 9 is a cross-sectional view taken along direction BB' in FIG. 1;
FIG. 10 is another cross-sectional view taken along direction BB' in FIG. 1;
FIG. 11 is a further cross-sectional view taken along direction BB' in FIG. 1;
FIG. 12 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 13 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 14 is a schematic structural diagram of an array substrate after being formed according to an embodiment of the present invention;
FIG. 15 is a schematic structural diagram illustrating a fingerprint identification unit being transported to an array substrate according to an embodiment of the present invention;
fig. 16 is a schematic structural diagram of another array substrate formed according to an embodiment of the present invention;
FIG. 17 is a schematic structural diagram illustrating another example of transferring a fingerprint identification unit to an array substrate according to an embodiment of the present invention;
fig. 18 is a schematic structural diagram of another array substrate formed according to an embodiment of the present invention;
FIG. 19 is a schematic diagram of a fingerprint identification unit formed by deposition according to an embodiment of the present invention;
fig. 20 is a schematic structural diagram of a transport type light emitting diode according to an embodiment of the present invention;
fig. 21 is a schematic structural diagram of a light-shielding layer formed according to an embodiment of the present invention;
FIG. 22 is a schematic structural diagram of a first via and a second via after formation according to an embodiment of the present invention
Fig. 23 is a schematic structural diagram of a light-shielding layer formed according to an embodiment of the present invention;
fig. 24 is a schematic structural diagram of another structure after forming a first via and a second via according to an embodiment of the present invention;
FIG. 25 is a schematic diagram of another transport type LED according to the present invention;
fig. 26 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
In view of the problems mentioned in the background, an embodiment of the present invention provides a display panel including:
the array substrate comprises a pixel driving circuit, and the pixel driving circuit is used for driving the micro light-emitting diode to emit light;
the light shielding layer is positioned on one side of the fingerprint identification unit, which is far away from the array substrate;
the shading layer is provided with a first through hole and a second through hole, the first through hole is overlapped with the micro light-emitting diode, and the second through hole exposes the fingerprint identification unit.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without any creative work belong to the protection scope of the present invention.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention. Referring to fig. 1, the display panel includes: the array substrate 10 comprises an array substrate 10, and a micro light emitting diode 20 and a fingerprint identification unit 30 which are arranged on one side of the array substrate 10, wherein the array substrate 10 comprises a pixel driving circuit 110, and the pixel driving circuit 110 is used for driving the micro light emitting diode 20 to emit light; a light shielding layer 40 positioned on one side of the fingerprint identification unit 30 far away from the array substrate 10; the light shielding layer 40 is provided with a first through hole 410 and a second through hole 420, the first through hole 410 overlaps with the micro light emitting diode 20, and the second through hole 420 exposes the fingerprint recognition unit 30.
Specifically, the micro light emitting diode 20 refers to a light emitting diode with a size less than 100 micrometers, and the specific structure thereof is various, and can be set by those skilled in the art according to the actual situation, and is not limited herein. Alternatively, the micro light emitting diode 20 includes a stack 210, a first electrode 220, and a second electrode 230, where the stack 210 includes a first type semiconductor, an active layer, and a second type semiconductor stacked, and the active layer is located between the first type semiconductor and the second type semiconductor. In the stacking direction of the first type semiconductor, the active layer and the second type semiconductor, the first electrode 220 and the second electrode 230 are located on the same side of the stack 210 (as shown in fig. 2), or the first electrode 220 is located on the side of the first type semiconductor facing away from the active layer and the second electrode 230 is located on the side of the second type semiconductor facing away from the active layer. For convenience of description, the first electrode 220 and the second electrode 230 will be described below as being located on the same side of the stack 210. The density of the micro light emitting diodes 20 can be set by one skilled in the art according to the pixel density requirement of the display panel, and is not limited herein. Illustratively, the distance between adjacent micro light emitting diodes 20 may be between 50um and 70 um.
Specifically, the pixel driving circuit 110 is electrically connected to the micro light emitting diode 20 for generating a driving current to drive the micro light emitting diode 20 to emit light. The specific implementation form of the pixel driving circuit 110 is various, and can be set by those skilled in the art according to practical situations, and is not limited herein. Illustratively, the pixel drive circuit 110 may comprise a "2T 1C" or "7T 1C" type pixel drive circuit.
Specifically, the fingerprint identification unit 30 is used for performing fingerprint identification, light emitted by the micro light emitting diode 20 is reflected to the fingerprint identification unit 30 by the finger after being irradiated to the finger, and the fingerprint identification unit 30 can identify fingerprint ridges and fingerprint valleys according to the light intensity of the reflected light. The components specifically included in the fingerprint identification unit 30 will be described in detail below, but are not limited thereto. It should be noted that fig. 1 only shows the fingerprint identification unit 30 disposed on the full screen to realize full screen fingerprint identification by way of example, but the present application is not limited thereto, and for example, in other embodiments, the fingerprint identification unit 30 may be disposed in a fingerprint identification area with a size smaller than that of the display area. Moreover, the fingerprint identification units 30 are arranged at a density that can be set by those skilled in the art according to practical situations, and are not limited herein, and for example, the distance between two adjacent fingerprint identification units 30 may be between 3mm and 4 mm.
Specifically, the light shielding layer 40 is used for shielding light, and a material thereof can be set by a person skilled in the art according to practical situations, and is not limited herein, and for example, the material of the light shielding layer 40 may be black resin. The light shielding layer 40 is provided with a first through hole 410, and an orthogonal projection of the first through hole 410 on the array substrate 10 overlaps with an orthogonal projection of the micro light emitting diode 20 on the array substrate 10, so that at least a part of the first through hole 410 is exposed out of the micro light emitting diode 20, and further at least a part of light emitted by the micro light emitting diode 20 can be received by human eyes. It should be noted that, fig. 1 only illustrates that each micro light emitting diode 20 corresponds to one first through hole 410, but the present application is not limited thereto, and a person skilled in the art may set the number of the first through holes 410 corresponding to each micro light emitting diode 20 according to practical situations.
Specifically, the light shielding layer 40 is further provided with a second through hole 420, an orthogonal projection of the second through hole 420 on the array substrate 10 overlaps with an orthogonal projection of the fingerprint identification unit 30 on the array substrate 10, so that at least a part of the second through hole 420 is exposed out of the fingerprint identification unit 30, and further, light reflected back by a finger can be received by the fingerprint identification unit 30, it can be understood that the second through hole 420 also plays a role in collimation, and crosstalk of optical signals between two adjacent fingerprint identification units 30 can be prevented. It should be noted that, fig. 1 only illustrates that each fingerprint identification unit 30 corresponds to one second through hole 420, but the present application is not limited thereto, and a person skilled in the art may set the number of second through holes 420 corresponding to each fingerprint identification unit 30 according to practical situations.
It can be understood that, for the array substrate 10, except the corresponding positions of the first through hole 410 and the second through hole 420, other positions are all covered by the light shielding layer 40, and the light shielding layer 40 can absorb external light, so as to prevent the metal layer (the metal layer is used to form the pixel driving circuit 110, the anode, the cathode, and the like) in the array substrate 10 from reflecting the external light, so that the contrast of the display panel can be improved, and further the display quality can be improved.
According to the display panel provided by the embodiment of the invention, the fingerprint identification unit and the micro light-emitting diode are arranged on the same side of the array substrate, so that the fingerprint identification unit is integrated in the display panel instead of being hung outside the display panel. The problem of among the prior art because the fingerprint identification module is external leads to thickness thicker outside display panel is solved, the effect of attenuate display panel thickness is realized.
Specifically, there are various specific implementations of the first through hole 410 overlapping with the micro light emitting diode 20, and the following description is made for a typical example, but not limiting the present application.
Fig. 2 is a cross-sectional view along AA' in fig. 1. Referring to fig. 2, optionally, the micro light emitting diode 20 is located between the light shielding layer 40 and the array substrate 10, and the first through hole 410 exposes the micro light emitting diode 20.
Specifically, after the array substrate 10 is prepared, the micro light emitting diode 20 may be transported, then the light shielding layer 40 is formed on a side of the micro light emitting diode 20 away from the array substrate 10, and finally the light shielding layer 40 is provided with the first through hole 410 and the second through hole 420. It can be understood that, the micro light emitting diode 20 is transported before the light shielding layer 40 is formed, so that the transportation of the micro light emitting diode 20 is not limited or blocked by the light shielding layer 40, and the transportation of the micro light emitting diode 20 is relatively free, which is beneficial to reducing the transportation difficulty of the micro light emitting diode 20.
With continued reference to fig. 2, optionally, the array substrate 10 includes a first connection terminal 120, and the micro light emitting diode 20 is electrically connected to the first connection terminal 120; the light shielding layer 40 covers the first connection terminal 120, and the first through hole 410 exposes a portion of an upper light emitting surface 211 of the micro light emitting diode 20, wherein the upper light emitting surface 211 is a light emitting surface of the micro light emitting diode 20 on a side away from the array substrate 10.
Specifically, the micro light emitting diode 20 includes an upper light emitting surface 211 and a side light emitting surface 212 which are connected to each other, and thus, the micro light emitting diode 20 can emit light in all directions. The light emitted from the exposed upper light emitting surface 211 can be received by human eyes by opening the first through hole 410 on the light shielding layer 40 to expose part of the upper light emitting surface 211; meanwhile, the light shielding layer 40 covers the side light emitting surface 212 to absorb the light emitted from the side light emitting surface 212, so that the interference of the light emitted from the side light emitting surface 212 to the adjacent light emitting diode can be avoided, and the interference of the light emitted from the side light emitting surface 212 directly irradiating the fingerprint identification unit 30 can be avoided, thereby improving the fingerprint identification precision.
Fig. 3 is a schematic structural diagram of another display panel according to an embodiment of the present invention. Fig. 4 is a cross-sectional view taken along direction CC' of fig. 3. Fig. 5 is another cross-sectional view taken along direction CC' in fig. 3. Referring to fig. 3-5, optionally, the micro light emitting diode 20 is at least partially embedded in the first via 410.
Specifically, after the array substrate 10 is manufactured, the light shielding layer 40 may be formed first, the first through hole 410 and the second through hole 420 are formed in the light shielding layer 40, and finally the micro light emitting diode 20 is transferred so that the micro light emitting diode 20 is embedded in the first through hole 410. Therefore, the upper light emitting surface 211 of the micro light emitting diode 20 is easily exposed, which is beneficial to improving the light utilization rate of the micro light emitting diode 20. Moreover, the degree of embedding the micro light emitting diodes 20 into the first through holes 410 can be flexibly set, for example, the micro light emitting diodes 20 can be partially embedded into the first through holes 410, that is, the distance between the plane of the surface of the micro light emitting diodes 20 far away from the array substrate 10 and the array substrate 10 is greater than the distance between the plane of the surface of the light shielding layer 40 far away from the array substrate 10 and the array substrate 10; it is also possible to provide that the micro-leds 20 are completely embedded in the first through-hole 410 (as shown in fig. 4, 5 and subsequent fig. 6 and 8).
It should be noted that fig. 3 exemplarily shows that 8 second through holes 420 are opened directly above each fingerprint identification unit 30, but the present application is not limited thereto, and a person skilled in the art may set the number of second through holes 420 opened directly above each fingerprint identification unit 30 and the size of each second through hole 420 according to practical situations. Also, fig. 1 and 3 illustrate one fingerprint identification unit 30 corresponding to three micro light emitting diodes 20, but the present application is not limited thereto, and a person skilled in the art may set the distribution density of the fingerprint identification unit 30 according to practical situations, for example, in other embodiments, one fingerprint identification unit 30 corresponding to one micro light emitting diode 20 may also be set. It should be noted that fig. 1 and 3 illustrate the fingerprint identification unit 30 disposed between two adjacent rows of micro light emitting diodes 20, but the present application is not limited thereto, for example, in other embodiments, while the fingerprint identification unit 30 is disposed between two adjacent rows of micro light emitting diodes 20, the fingerprint identification unit 30 may also be disposed between two adjacent columns of micro light emitting diodes 20.
With continued reference to fig. 4 and 5, optionally, the array substrate 10 includes a first connection terminal 120, and the micro light emitting diode 20 is electrically connected to the first connection terminal 120; the first through hole 410 at least partially exposes the first connection terminal 120.
Specifically, the first through hole 410 may partially expose the first connection terminal 120, as shown in fig. 4; the first through hole 410 may also fully expose the first terminal, as shown in fig. 5, and one skilled in the art may set the degree of the first through hole 410 exposing the first connection terminal 120 according to practical situations. The micro light emitting diode 20 is electrically connected to the pixel driving circuit 110 by being connected to a portion of the first connection terminal 120 exposed.
With continued reference to fig. 4 and 5, optionally, the vertical projection of the micro light emitting diode 20 on the array substrate 10 falls within the area of the array substrate 10 exposed by the first through hole 410. Thus, the structure of the first through hole 410 is simplified, which is beneficial to reducing the difficulty of forming the first through hole 410.
Fig. 6 is a further cross-sectional view taken along direction CC of fig. 3. Referring to fig. 6, optionally, the first through hole 410 includes two first sub-through holes that are communicated with each other, the two first sub-through holes are separated by the light shielding layer 40, and the arrangement direction is parallel to the plane of the array substrate 10; the first sub-via hole at least partially exposes the first connection terminal 120; the first electrode 220 and the second electrode 230 of the micro light emitting diode 20 are completely embedded into the first sub-through hole, and the stacked body 210 of the micro light emitting diode 20 is overlapped on the light shielding layer 40 between the two first sub-through holes. Thus, the light shielding layer 40 between the two first sub-through holes can provide a supporting function for the micro light emitting diode 20, which is beneficial to improving the installation stability of the micro light emitting diode 20, and further improving the shock resistance of the display panel.
Fig. 7 is a schematic structural diagram of another display panel according to an embodiment of the present invention. Fig. 8 is a sectional view taken along direction DD' in fig. 7. Referring to fig. 7 and 8, optionally, the first through hole 410 includes a second sub through hole 411 and a third sub through hole 412 which are communicated with each other and stacked in a step shape, the third sub through hole 412 is located on a side of the second sub through hole 411 facing away from the array substrate 10, and an opening of the third sub through hole 412 is larger than an opening of the second sub through hole 411; the first electrode 220 and the second electrode 230 of the micro light emitting diode 20 are embedded in the second sub-via 411, and the stacked body 210 of the micro light emitting diode 20 is overlapped on the interface of the second sub-via 411 and the third sub-via 412, and is at least partially embedded in the third sub-via 413. Thus, the interface between the second sub-via 411 and the third sub-via 412 can provide a supporting function for the micro light emitting diode 20, which is beneficial to improving the mounting stability of the micro light emitting diode 20, and further improving the shock resistance of the display panel.
With continued reference to fig. 4-6 and 8, optionally, the micro light emitting diode 20 is located in the first through hole 410, and a distance H between a plane of the upper light emitting surface 211 of the micro light emitting diode 20 and the array substrate 10 is smaller than a distance H between a plane of the surface of the light shielding layer 40 away from the array substrate 10 and the array substrate 10.
Specifically, the light shielding layer 40 can absorb light emitted from the side light emitting surfaces 212 of the micro light emitting diodes 20, thereby preventing crosstalk between adjacent micro light emitting diodes 20 and interference with fingerprint recognition. It can be understood that, on one hand, the light shielding layer 40 can play a role of preventing crosstalk between adjacent micro light emitting diodes 20, and on the other hand, the light shielding layer 40 can also play a role of bearing the second through holes 420 having a collimating function, that is, one layer of the light shielding layer 40 plays a dual role, and compared with the case that one layer of the light shielding layer is arranged to prevent crosstalk between adjacent micro light emitting diodes 20, and another layer of the light shielding layer is additionally arranged to bear the second through holes 420, the solution of the embodiment of the present invention is beneficial to reducing the total number of layers in the display panel, thereby realizing the thinning of the display panel. It should be noted that specific values of H and H can be set by those skilled in the art according to practical situations, and are not limited herein.
With continued reference to fig. 4-6 and 8, optionally, the array substrate 10 includes a first connection terminal 120, the first connection terminal 120 includes a first connection electrode 121 and a second connection electrode 122; the micro light emitting diode 20 comprises a stacked body 210, a first electrode 220 and a second electrode 230, wherein the stacked body 210 comprises a first type semiconductor, an active layer and a second type semiconductor which are stacked, the active layer is positioned between the first type semiconductor and the second type semiconductor, and the first electrode 220 and the second electrode 230 are positioned on the same side of the stacked body 210 in the stacking direction of the first type semiconductor, the active layer and the second type semiconductor; the first electrode 220 is connected to the first connection electrode 121, and the second electrode 230 is connected to the second connection electrode 122.
Specifically, the materials of the first connection electrode 121 and the second connection electrode 122 may be set by those skilled in the art according to practical situations, and are not limited herein. For example, the material of the first connection electrode 121 and the second connection electrode 122 may be copper, titanium, indium tin oxide, or other conductive materials.
It can be understood that, by transporting the micro light emitting diode 20 in a flip-chip manner, the connection of the first electrode 220 and the first connection electrode 121 and the connection of the second electrode 230 and the second connection electrode 122 can be simultaneously completed, thereby increasing the transport speed of the micro light emitting diode 20.
Specifically, there are various specific implementation forms of the fingerprint identification unit 30, and the following description is given with reference to a typical example, but not to limit the present application.
Fig. 9 is a cross-sectional view taken along direction BB' in fig. 1. Referring to fig. 9, the array substrate 10 may optionally include a second connection terminal 140; the fingerprint identification unit 30 comprises an optical sensor 310 and a fingerprint identification driving circuit 130, wherein the fingerprint identification driving circuit 130 is used for driving the optical sensor 310; the fingerprint recognition unit 30 is electrically connected to the array substrate 10 through the second connection terminal 140.
Specifically, the second connection terminal 140 includes at least one third connection electrode 141, the fingerprint identification unit 30 includes at least one third electrode 320, the third electrodes 320 and the third connection electrodes 141 are connected in a one-to-one correspondence, and the number of the third electrodes 320 and the third connection electrodes 141 may be set by a person skilled in the art according to a specific implementation form of the fingerprint identification driving circuit 130, which is not limited herein. The array substrate 10 provides signals, such as a fingerprint identification power voltage, a fingerprint identification scanning signal, etc., required for normal operation of the fingerprint identification driving unit 30 to the fingerprint identification driving unit 30 through the third connecting electrode 141, and the fingerprint identification driving unit 30 further sends a fingerprint identification signal carrying fingerprint information to the array substrate 10 through the third connecting electrode 141.
Fig. 10 is another cross-sectional view taken along direction BB' in fig. 1. Referring to fig. 10, the array substrate 10 may optionally include a second connection terminal 140 and a fingerprint recognition driving circuit 130; the fingerprint recognition unit 30 includes an optical sensor 310, and the optical sensor 310 is connected to the fingerprint recognition driving circuit 130 through the second connection terminal 140.
Specifically, the second connection terminal 140 includes at least one third connection electrode 141, the fingerprint identification unit 30 (i.e., the optical sensor 310) includes at least one electrode, the electrodes in the optical sensor 310 and the third connection electrodes 141 are connected in a one-to-one correspondence, and the number of the electrodes in the optical sensor 310 and the third connection electrodes 141 may be set by those skilled in the art according to a specific implementation form of the optical sensor 310, which is not limited herein, while the specific type of the optical sensor 310 may be selected by those skilled in the art according to practical situations, which is also not limited herein. Illustratively, when the optical sensor 310 is a photodiode, the optical sensor 310 includes a sensing structure for implementing optical sensing, a fourth electrode and a fifth electrode, the second connection terminal 140 includes two third connection electrodes 141, the fourth electrode is connected to one of the third electrodes 141, and the fifth electrode is connected to the other third electrode 141 to implement electrical connection between the optical sensor 310 and the fingerprint recognition driving circuit 130.
It is understood that by integrating the fingerprint identification driving circuit 130 in the array substrate 10, at least one of the film layers forming the fingerprint identification driving circuit 130 may be disposed at the same layer as at least one of the film layers forming the pixel driving circuit 110, for example, the transistors in the fingerprint identification driving circuit 130 may be disposed at the same layer as the transistors in the pixel driving circuit 110, and/or the capacitors in the fingerprint identification driving circuit 130 may be disposed at the same layer as the capacitors in the pixel driving circuit 110. Therefore, the total number of the film layers of the display panel can be reduced, the display panel is thinned, the preparation steps of the display panel can be simplified, and the cost is reduced.
Fig. 11 is a further sectional view in the direction BB' of fig. 1. Referring to fig. 11, optionally, the array substrate 10 includes a fingerprint identification driving circuit 130; the fingerprint recognition unit 30 includes an optical sensor 310, and the optical sensor 310 is connected to the fingerprint recognition driving circuit 130 through a via hole.
Specifically, after the array substrate 10 is prepared, the optical sensor 310 is formed on one side of the array substrate 10 by deposition, the electrodes in the optical sensor 310 are connected to the fingerprint identification driving circuit 130 through the via holes, the number of the electrodes in the optical sensor 310 can be set by those skilled in the art according to the specific implementation form of the optical sensor 310, and is not limited herein, and the specific type of the optical sensor 310 can be selected by those skilled in the art according to the actual situation, and is not limited herein. Illustratively, when the optical sensor 310 is a photodiode, the optical sensor 310 includes a sensing structure, a fourth electrode and a fifth electrode, and the fourth electrode and the fifth electrode are connected to the fingerprint recognition driving circuit 130 through a via hole.
It can be understood that the fingerprint identification unit 30 is directly deposited on the array substrate 10, and the operation process of transferring the fingerprint identification unit 30 to the array substrate 10 can be omitted, thereby simplifying the manufacturing process of the display panel.
It should be noted that, although fig. 9 and fig. 10 are simplified for convenience of illustration, the optical sensor 310 does not show the specific film layer arrangement relationship of the sensing structure 311, the fourth electrode 312 and the fifth electrode 313 in the optical sensor 310, and the specific film layer arrangement relationship of each part in the optical sensor 310 may exemplarily refer to fig. 19 which will be described later, specifically, the sensing structure 311 may be located between the fourth electrode 312 and the fifth electrode 313, and the fourth electrode 312 includes a portion extending along the stacking direction of the sensing structure 311, the fourth electrode 312 and the fifth electrode 313, so that the connection portion of the fourth electrode 312 and the third connection electrode 141 and the connection portion of the fifth electrode 313 and the third connection electrode 141 are located on the same side of the sensing structure 311, but is not limited thereto, and those skilled in the art may arrange the sensing structure 311, the fifth electrode 313 and the optical sensor 310 according to the actual situation, The specific film layers of the fourth electrode 312 and the fifth electrode 313 are disposed in relation.
Optionally, the fingerprint recognition unit 30 includes at least one transistor, and the transistor includes a TFT transistor or a CMOS transistor.
Specifically, when the transistor is a TFT transistor, glass may be used as the substrate, and the material of the channel layer of the transistor may be Low Temperature Polysilicon (LTPS), amorphous Silicon (a-si), or other materials known to those skilled in the art, which is not limited herein. Since the transistors in the pixel driving circuit 110 are generally TFT transistors, when the fingerprint identification driving circuit 130 is integrated in the array substrate 10, the transistors in the pixel driving circuit 110 and the fingerprint identification driving circuit 130 can be simultaneously manufactured through the same process.
Alternatively, the fingerprint identification driving circuit may be integrated in the fingerprint identification unit 30 and transferred onto the array substrate 10. When the transistor is a CMOS transistor, silicon may be used as a substrate, and the fingerprint identification driving circuit 130 is preferably integrated in the fingerprint identification unit 30 and transferred to the array substrate 10, which is advantageous for improving the fingerprint identification precision due to the fact that the density of the fingerprint identification unit 30 can be made higher in view of the manufacturing process of the CMOS transistor.
On the basis of the above technical solution, fig. 12 is a schematic structural diagram of another display panel provided in an embodiment of the present invention. Referring to fig. 12, optionally, the array substrate 10 further includes a display scan line SCANX and a display power line VX; the display scan line SCANX is used to provide a display scan signal to the pixel driving circuit 110, and the display power line VX is used to provide a display power voltage to the pixel driving circuit 110; at least one display scanning line SCANX is multiplexed into a fingerprint identification scanning line SCANZ, is electrically connected with the fingerprint identification driving circuit and is used for providing a fingerprint identification scanning signal for the fingerprint identification circuit; and/or; at least one shows that power cord VX is multiplexing to fingerprint identification power cord VZ, is connected with fingerprint identification drive circuit electricity for provide fingerprint identification mains voltage to fingerprint identification circuit.
Specifically, the display scan line SCANX is used to provide a display scan signal to the pixel driving circuit 110, when the display scan signal is valid, the switching transistor in the pixel driving circuit 110 is turned on, and a data voltage input from the outside can be written into the pixel driving circuit 110, so that the pixel driving circuit 110 generates a driving current according to the data voltage to drive the micro light emitting diode 20 to emit light. The display power line VX is used to provide a power voltage to the pixel driving circuit 110, i.e., to power the pixel driving circuit 110 so that it operates normally. The scan line SCANZ is used to provide a scan signal for fingerprint identification to the fingerprint identification driving circuit, and when the scan signal is valid, the fingerprint identification driving circuit drives the optical sensor 310 to convert the optical signal carrying the fingerprint signal into an electrical signal. The fingerprint identification power line VZ is used for providing power voltage for the fingerprint identification driving circuit, namely supplying power for the fingerprint identification driving circuit so as to enable the fingerprint identification driving circuit to work normally.
Specifically, select which to show that power cord VX is multiplexing to be fingerprint identification power cord VZ and select which to show that scanning line SCANX is multiplexing to be fingerprint identification scanning line SCANZ, and the skilled person can set up according to actual conditions, does not limit here. It can be understood that the display power line VX is multiplexed into the fingerprint identification power line VZ and/or the display scan line SCANX is multiplexed into the fingerprint identification scan line SCANZ, which can reduce the number of signal lines in the array substrate 10, and is beneficial to increase the gap between adjacent signal lines and reduce the risk of short circuit.
It should be noted that the array substrate 10 further includes other signal lines electrically connected to the pixel driving circuit 110 and other signal lines electrically connected to the fingerprint identification driving circuit, which can be configured according to the prior art in the art and are not described herein again.
Optionally, the plane of the upper light emitting surface 211 of the micro light emitting diode 20 is located on the side of the plane of the light sensing surface of the optical sensor 310 facing away from the array substrate 10.
In this way, when the fingerprint identification unit 30 is first transferred to the array substrate 10, the fingerprint identification unit 30 will not obstruct the accurate transportation of the following micro light emitting diodes 20, for example, when the micro light emitting diodes 20 are transferred in a flip-chip manner, the transfer substrate (usually a planar substrate) for transferring the micro light emitting diodes 20 needs to be pressed down finally, so that the micro light emitting diodes 20 are in close contact with the first connection terminals 120 on the array substrate 10, and since the fingerprint identification unit 30 is shorter, the fingerprint identification unit 30 will not obstruct the transfer substrate from being pressed down. In addition, the closer the light-sensing surface of the optical sensor 310 is to the array substrate 10, the greater the distance between the light-sensing surface of the optical sensor 310 and the finger, and as can be seen from the relationship between the object distance and the image distance, the greater the distance between the light-sensing surface of the optical sensor 310 and the finger, the greater the resolution of the optical sensor 310, which is beneficial to reducing the distribution density of the fingerprint identification unit 30, and further reducing the cost.
Based on the above inventive concept, the embodiment of the invention also provides a preparation method of the display panel. Fig. 13 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention. Referring to fig. 13, the method specifically includes the following steps:
and S110, preparing the array substrate.
The array substrate comprises a pixel driving circuit, and the pixel driving circuit is used for driving the micro light-emitting diode to emit light.
And S120, forming a fingerprint identification unit.
S130, transferring the micro light-emitting diode to the array substrate and forming a light shielding layer.
The micro light-emitting diode and the fingerprint identification unit are positioned on one side of the array substrate; the light shielding layer is positioned on one side of the fingerprint identification unit, which is far away from the array substrate; the shading layer is provided with a first through hole and a second through hole, the first through hole is overlapped with the micro light-emitting diode, and the second through hole exposes the fingerprint identification unit.
Optionally, forming the fingerprint recognition unit includes: and transferring the fingerprint identification unit to the array substrate.
For example, fig. 14 is a schematic structural diagram after an array substrate is formed according to an embodiment of the present invention. Fig. 15 is a schematic structural diagram of a fingerprint identification unit transferred to an array substrate according to an embodiment of the present invention. Referring to fig. 14 and 15, optionally, the array substrate 10 includes a second connection terminal 140; the fingerprint identification unit 30 comprises an optical sensor 310 and a fingerprint identification driving circuit 130, wherein the fingerprint identification driving circuit 130 is used for driving the optical sensor 310; the fingerprint recognition unit 30 is electrically connected to the array substrate 10 through the second connection terminal 140. For a specific implementation of the fingerprint identification unit 30 electrically connected to the array substrate 10 through the second connection terminal 140, reference is made to the related description above, and details are not repeated here. Specifically, the forming of the array substrate 10 may specifically include: an active layer 101, a first insulating layer, a gate metal layer 102, a second insulating layer, a source-drain metal layer 103, a third insulating layer, and a connection terminal layer 104 are sequentially formed on a substrate, so that a thin film transistor in the pixel driving circuit 110 has a top gate structure. The formation manner of each film layer in the array substrate 10 may be physical vapor deposition, chemical vapor deposition, inkjet printing, or other film forming methods known to those skilled in the art, and the material and the preparation process of each film layer in the array substrate 10 are not limited herein. It should be noted that fig. 14 only exemplarily shows that the transistors in the pixel driving circuit 110 are in a top-gate structure, but the present invention is not limited thereto, and for example, the transistors in the pixel driving circuit 110 may be in a bottom-gate structure in other embodiments. It should be noted that fig. 14 only shows that the signal lines for providing signals to the fingerprint identification driving unit in the array substrate 10 are located in the source-drain metal layer 103, but the present invention is not limited thereto, and for example, in other embodiments, the signal lines for providing signals to the fingerprint identification driving unit may also be located in the gate metal layer 101 or other additional separately disposed metal film layers.
For example, fig. 16 is a schematic structural diagram of another array substrate formed according to an embodiment of the present invention. Fig. 17 is a schematic structural diagram of another example of transferring a fingerprint identification unit to an array substrate according to the present invention. Referring to fig. 16 and 17, the array substrate 10 may optionally include a second connection terminal 140 and a fingerprint recognition driving circuit; the fingerprint recognition unit 30 includes an optical sensor 310, and the optical sensor 310 is connected to the fingerprint recognition driving circuit through the second connection terminal 140. For the specific implementation of the optical sensor 310 connected to the fingerprint identification driving circuit through the second connection terminal 140, reference is made to the above description, and details are not repeated here.
Optionally, forming the fingerprint recognition unit includes: and depositing a fingerprint identification unit on one side of the array substrate.
For example, fig. 18 is a schematic structural diagram of another array substrate formed according to an embodiment of the present invention. FIG. 19 is a schematic diagram of a fingerprint identification unit deposited according to an embodiment of the present invention. Referring to fig. 18 and 19, optionally, the array substrate 10 includes a fingerprint recognition driving circuit; the fingerprint recognition unit 30 includes an optical sensor 310, and the optical sensor 310 is connected to a fingerprint recognition driving circuit through a via hole. For a specific implementation of the optical sensor 310 connected to the fingerprint identification driving circuit through the via hole, reference is made to the related description above, and details are not repeated here. Specifically, the formation manner of each film layer in the fingerprint identification unit 30 may be physical vapor deposition, chemical vapor deposition, inkjet printing, or other film forming methods known to those skilled in the art, and here, the material and the preparation process of each film layer in the fingerprint identification unit 30 are not limited. The fourth electrode 312 in the optical sensor 310 is exemplarily shown in fig. 18 to be located at the connection terminal layer 104, but the present application is not limited thereto, and in other embodiments, the fourth electrode 312 may be located at a separately and additionally disposed metal film layer.
Optionally, the transferring the micro light emitting diode to the array substrate and the forming the light shielding layer include:
s131, transferring the micro light emitting diode to the array substrate.
Fig. 20 is a schematic structural diagram of a transport light emitting diode according to an embodiment of the present invention.
And S132, forming a light shielding layer on one side of the micro light-emitting diode, which is far away from the array substrate.
For example, fig. 21 is a schematic structural diagram of a light shielding layer 40 formed according to an embodiment of the present invention.
And S133, forming a first through hole and a second through hole on the light shielding layer so that the first through hole exposes the micro light-emitting diode.
For example, fig. 22 is a schematic structural diagram after forming a first through hole and a second through hole according to an embodiment of the present invention.
It should be noted that the case of the display panel formed by "forming the light shielding layer after transporting the micro light emitting diodes" is not limited to the one shown in fig. 22, and for example, the arrangement form of the micro light emitting diodes in the display panel formed in this way may also be as shown in fig. 4 to 6 or 8, and the arrangement form of the fingerprint identification unit in the display panel formed in this way may also be as shown in fig. 10 and 11.
Optionally, the transferring the micro light emitting diode to the array substrate and the forming the light shielding layer include:
and S134, forming a light shielding layer on one side of the fingerprint identification unit, which is far away from the array substrate.
For example, fig. 23 is a schematic structural diagram after a light shielding layer is formed according to an embodiment of the present invention.
And S135, forming a first through hole and a second through hole in the light shielding layer.
Illustratively, fig. 24 is a schematic structural diagram of another structure after forming a first through hole and a second through hole according to an embodiment of the present invention.
S136, transporting the micro light-emitting diode to the array substrate, so that the micro light-emitting diode is at least partially embedded into the first through hole.
Exemplarily, fig. 25 is a schematic structural diagram of another transport type light emitting diode provided in the embodiment of the present invention.
It should be noted that the case of the display panel formed by "forming the light shielding layer first and then transferring the micro light emitting diodes" is not limited to the one shown in fig. 25, and for example, the arrangement form of the micro light emitting diodes in the display panel formed in this way may be as shown in fig. 2, fig. 5, fig. 6, or fig. 8, and the arrangement form of the fingerprint identification unit in the display panel formed in this way may be as shown in fig. 9 and fig. 11.
Based on the above inventive concept, the embodiment of the invention also provides a display device. The display device comprises the display panel according to any of the embodiments of the present invention. Therefore, the display device has the advantages of the display panel provided by the embodiment of the invention, and the same points can be understood by referring to the above description, which is not repeated herein.
For example, fig. 26 is a schematic structural diagram of a display device according to an embodiment of the present invention. As shown in fig. 26, a display device 200 according to an embodiment of the present invention includes the display panel 100 according to an embodiment of the present invention. The display device 200 may be exemplified by any electronic device with a display function, such as a touch display screen, a mobile phone, a tablet computer, a notebook computer, or a television.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (18)
1. A display panel, comprising:
the array substrate comprises a pixel driving circuit, and the pixel driving circuit is used for driving the micro light-emitting diode to emit light;
the light shielding layer is positioned on one side of the fingerprint identification unit, which is far away from the array substrate;
the light shielding layer is provided with a first through hole and a second through hole, the first through hole is overlapped with the micro light-emitting diode, and the second through hole exposes the fingerprint identification unit.
2. The display panel of claim 1, wherein the micro light emitting diodes are located between the light shielding layer and the array substrate, and the first through holes expose the micro light emitting diodes.
3. The display panel according to claim 2, wherein the array substrate includes a first connection terminal, and the micro light emitting diode is electrically connected to the first connection terminal;
the light shielding layer covers the first connecting terminal, and the first through hole exposes a partial upper light emitting surface of the micro light emitting diode, wherein the upper light emitting surface is a light emitting surface deviating from one side of the array substrate in the micro light emitting diode.
4. The display panel of claim 1, wherein the micro light emitting diodes are at least partially embedded in the first through holes.
5. The display panel according to claim 4, wherein the array substrate comprises a first connection terminal, and the micro light emitting diode is electrically connected to the first connection terminal; the first through hole at least partially exposes the first connection terminal.
6. The display panel according to claim 5, wherein the micro light emitting diodes are located in the first through holes, and a distance between a plane where upper light emitting surfaces of the micro light emitting diodes are located and the array substrate is smaller than a distance between a plane where a surface of the light shielding layer away from the array substrate is located and the array substrate; the upper light-emitting surface is a light-emitting surface on one side of the micro light-emitting diode, which deviates from the array substrate.
7. The display panel according to claim 1, wherein the array substrate includes a first connection terminal including a first connection electrode and a second connection electrode;
the micro light-emitting diode comprises a laminated body, a first electrode and a second electrode, wherein the laminated body comprises a first type semiconductor, an active layer and a second type semiconductor which are arranged in a laminated mode, the active layer is located between the first type semiconductor and the second type semiconductor, and the first electrode and the second electrode are located on the same side of the laminated body in the laminating direction of the first type semiconductor, the active layer and the second type semiconductor;
the first electrode is connected with the first connecting electrode, and the second electrode is connected with the second connecting electrode.
8. The display panel according to claim 1, wherein the array substrate includes a second connection terminal; the fingerprint identification unit comprises an optical sensor and a fingerprint identification driving circuit, and the fingerprint identification driving circuit is used for driving the optical sensor;
the fingerprint identification unit is electrically connected with the array substrate through the second connecting terminal.
9. The display panel according to claim 1, wherein the array substrate includes a second connection terminal and a fingerprint recognition driving circuit; the fingerprint identification unit comprises an optical sensor, and the optical sensor is connected with the fingerprint identification driving circuit through the second connecting terminal.
10. The display panel of claim 1, wherein the array substrate comprises a first fingerprint identification driving circuit; the fingerprint identification unit comprises an optical sensor, and the optical sensor is connected with the fingerprint identification driving circuit through a through hole.
11. The display panel of claim 1, wherein the fingerprint identification unit comprises at least one transistor, the transistor comprising a TFT transistor or a CMOS transistor.
12. The display panel according to any one of claims 8 to 10, wherein the array substrate further comprises a display scan line and a display power line; the display scanning line is used for providing a display scanning signal for the pixel driving circuit, and the display power line is used for providing a display power voltage for the pixel driving circuit;
at least one display scanning line is multiplexed into a fingerprint identification scanning line, is electrically connected with the fingerprint identification driving circuit and is used for providing a fingerprint identification scanning signal for the fingerprint identification circuit; and/or;
at least one the display power cord is multiplexed to the fingerprint identification power cord, with fingerprint identification drive circuit electricity is connected for to fingerprint identification circuit provides fingerprint identification mains voltage.
13. A display device characterized by comprising the display panel according to any one of claims 1 to 12.
14. A method for manufacturing a display panel, comprising:
preparing an array substrate;
forming a fingerprint identification unit;
transferring the micro light emitting diode to the array substrate and forming a light shielding layer;
the array substrate comprises a pixel driving circuit, and the pixel driving circuit is used for driving the micro light-emitting diode to emit light;
the micro light-emitting diode and the fingerprint identification unit are positioned on one side of the array substrate; the light shielding layer is positioned on one side of the fingerprint identification unit, which is far away from the array substrate;
the light shielding layer is provided with a first through hole and a second through hole, the first through hole is overlapped with the micro light-emitting diode, and the second through hole exposes the fingerprint identification unit.
15. The method of claim 14, wherein the forming the fingerprint recognition unit comprises: and transferring the fingerprint identification unit to the array substrate.
16. The method of claim 14, wherein the forming the fingerprint recognition unit comprises: and depositing the fingerprint identification unit on one side of the array substrate.
17. The method of claim 14, wherein the transporting the micro light emitting diodes to the array substrate and forming the light shielding layer comprises:
transporting the micro light emitting diode to the array substrate;
forming a light shielding layer on one side of the micro light-emitting diode, which is far away from the array substrate;
and forming the first through hole and the second through hole on the light shielding layer so that the first through hole exposes the micro light-emitting diode.
18. The method of claim 14, wherein the transporting the micro light emitting diodes to the array substrate and forming the light shielding layer comprises:
forming a light shielding layer on one side of the fingerprint identification unit, which is far away from the array substrate;
the light shielding layer is provided with the first through hole and the second through hole;
and transferring the micro light-emitting diode to the array substrate so that the micro light-emitting diode is at least partially embedded into the first through hole.
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