CN112051682B - Display device and manufacturing method thereof - Google Patents

Display device and manufacturing method thereof Download PDF

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Publication number
CN112051682B
CN112051682B CN202011027415.XA CN202011027415A CN112051682B CN 112051682 B CN112051682 B CN 112051682B CN 202011027415 A CN202011027415 A CN 202011027415A CN 112051682 B CN112051682 B CN 112051682B
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China
Prior art keywords
array substrate
driving unit
heat transfer
display panel
display device
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CN202011027415.XA
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Chinese (zh)
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CN112051682A (en
Inventor
万年青
苏志丹
熊冠中
赵剑
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Tianma Microelectronics Co Ltd
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Tianma Microelectronics Co Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment

Abstract

The invention discloses a display device and a manufacturing method thereof, the display device is provided with a display area and a non-display area arranged at the peripheral side of the display area, the display device comprises: the display panel comprises an array substrate, wherein the array substrate comprises a first surface and a second surface which are sequentially arranged along the light emergent direction of the display panel; the driving unit is positioned in a non-display area of the array substrate; the middle frame assembly comprises a supporting plate and a connecting glue layer which are connected with each other, the supporting plate is positioned on the side where the first surface of the array substrate is located, and the connecting glue layer is connected between the supporting plate and the first surface of the array substrate; the heat conduction assembly is thermally connected with the driving unit and comprises a first heat transfer piece, and the first heat transfer piece is located between the first surface of the array substrate and the connecting glue layer. The display device provided by the invention can heat the connection adhesive layer, improves the buffer performance of the connection adhesive layer in various environments, and improves the stability and the display effect of the display panel in various environments.

Description

Display device and manufacturing method thereof
Technical Field
The invention relates to the technical field of display, in particular to a display device and a manufacturing method thereof.
Background
With the development of display devices, the display devices are applied to different occasions, and therefore, high requirements are put on the display stability of the display devices.
The display panel is usually connected to the middle frame by adhesive, and the adhesive has a buffer property to protect the display panel. In different situations, for example, under different temperature environments, the shrinkage performance of the adhesive is different, and when the hardness of the adhesive is greater, the adhesive cannot have a good buffering performance, and at this time, the stress generated when other components in the display device shrink can be transmitted to the display panel, which affects the display effect of the display panel.
Disclosure of Invention
The invention provides a display device and a manufacturing method thereof, which can heat a connection adhesive layer, improve the buffer performance of the connection adhesive layer in various environments, and improve the stability and the display effect of a display panel in various environments.
In one aspect, embodiments of the present invention provide a display device having a display area and a non-display area disposed at an outer circumferential side of the display area, the display device including a display panel, a driving unit, a middle frame assembly, and a heat conductive assembly. The display panel comprises an array substrate, wherein the array substrate comprises a first surface and a second surface which are sequentially arranged along the light emergent direction of the display panel; the driving unit is positioned in a non-display area of the array substrate; the middle frame assembly comprises a supporting plate and a connecting adhesive layer which are connected with each other, the supporting plate is located on the side where the first surface of the array substrate is located, and the connecting adhesive layer is connected between the supporting plate and the first surface of the array substrate; the heat conduction assembly is thermally connected with the driving unit and comprises a first heat transfer piece, and the first heat transfer piece is located between the first surface of the array substrate and the connecting glue layer.
On the other hand, the embodiment of the invention also provides a preparation method of the display device, which comprises the following steps:
providing an array substrate, and forming a heat conduction assembly on the array substrate, wherein the array substrate comprises a first surface and a second surface which are sequentially arranged along the light emergent direction of the display device, the heat conduction assembly comprises a first heat transfer piece, and the first heat transfer piece is positioned on the first surface of the array substrate;
arranging a driving unit on the array substrate, wherein the driving unit is thermally connected with the heat conduction assembly;
connecting the array substrate to a support plate of the middle frame assembly by using a connecting adhesive layer;
the first heat transfer piece is located between the connection adhesive layer and the first surface of the array substrate.
According to the display device and the manufacturing method thereof, the display device comprises the display panel, the driving unit, the middle frame assembly and the heat conducting assembly, wherein the driving unit can provide driving signals for the display panel, so that the display panel can emit light for display. The center subassembly includes interconnect's backup pad and connection glue film, is connected display panel and backup pad through connecting the glue film to make the center subassembly protect display panel. The heat conduction assembly is thermally connected with the driving unit, so that heat generated by the driving unit during working can be transferred to the heat conduction assembly, further, the heat conduction assembly comprises a first heat transfer piece, the first heat transfer piece is positioned between the array substrate and the connecting glue layer, so that the heat generated by the driving unit during working can be transferred to the connecting glue layer through the first heat transfer piece to heat the connecting glue layer, the situation that the contraction performance of the connecting glue layer is poor and gradually hardened when the display device is applied to various occasions, such as a low-temperature environment, is effectively prevented, the connecting glue layer can better protect the display panel, the contraction stress of structures such as a support plate and the like is prevented from being directly transferred to the display panel to influence the display panel, and the display device provided by the embodiment of the invention can improve the service performance and the stability of the display device under different occasions by arranging the heat conduction assembly, and improve the display effect of the display device.
Furthermore, the heat conducting assembly can better transfer the heat of the driving unit, and the influence on the performance of the driving unit due to poor heat dissipation performance of the driving unit is prevented.
Drawings
Other features, objects and advantages of the invention will become apparent from the following detailed description of non-limiting embodiments thereof, when read in conjunction with the accompanying drawings, in which like reference characters designate the same or similar parts throughout the figures thereof, and which are not to scale.
Fig. 1 is a top view of a display device provided in one embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of one of the display devices shown in FIG. 1 taken along the direction B-B;
fig. 3 is a top view of an array substrate according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of the alternative display device shown in FIG. 1 taken along the direction B-B;
FIG. 5 is a schematic cross-sectional view of still another display device shown in FIG. 1 taken along the direction B-B;
FIG. 6 is a schematic cross-sectional view of still another display device shown in FIG. 1 taken along the direction B-B;
fig. 7 is a top view of a display device according to another embodiment of the present invention;
FIG. 8 is a schematic cross-sectional view of the alternative display device shown in FIG. 7 taken along the direction C-C;
fig. 9 is a top view of a display device according to yet another embodiment of the invention;
fig. 10 is a flowchart illustrating a method for manufacturing a display device according to an embodiment of the invention.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of another like element in a process, method, article, or apparatus that comprises the element.
It will be understood that when a layer, region or layer is referred to as being "on" or "over" another layer, region or layer in describing the structure of the component, it can be directly on the other layer, region or layer or intervening layers or regions may also be present. Also, if the component is turned over, one layer or region may be "under" or "beneath" another layer or region.
Features and exemplary embodiments of various aspects of the present invention will be described in detail below. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
In display devices such as mobile phones, tablet computers, and vehicle-mounted display screens, a display panel is generally connected to a center frame assembly through an adhesive, for example, the display panel is connected to a center frame through foam rubber, so that the center frame fixes and protects the display panel. When the display device is applied to various occasions, for example, to different temperature environments, the hardness of the adhesive glue varies to different degrees, as shown in table 1, the hardness of the foam glue varies under different temperature environments, and gradually decreases with increasing temperature, and gradually increases with decreasing temperature.
TABLE 1
Temperature of -20℃ 25℃ 75℃
Hardness (G') 9369 100 59
As shown in table 1, when the display device is applied to a low temperature environment, the shrinkage degree of the adhesive becomes poor, so that the adhesive hardens and cannot play a role of buffer protection, and at this time, the stress generated by the middle adhesive frame in the shrinkage process is easily and directly transmitted to the display panel, which causes the degradation of the black state uniformity of the display panel and the problem of display unevenness (Mura) such as light leakage.
In order to solve the above problems, embodiments of the present invention provide a display device 1000 and a method for manufacturing the display device. The display device 1000 and the method for manufacturing the display device according to the embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
Referring to fig. 1 and 2 together, fig. 1 is a top view of a display device according to an embodiment of the present invention, and fig. 2 is a schematic cross-sectional view of the display device shown in fig. 1 along a direction B-B. An embodiment of the present invention provides a display device 1000, and the display device 1000 has a display area AA and a non-display area NA disposed at an outer circumferential side of the display area AA. The display device 1000 includes a display panel 100, a driving unit 200, a middle frame assembly 300, and a heat conductive assembly 400.
The Display panel 100 of the embodiment of the invention may be an Organic Light-Emitting Diode (OLED) Display panel or a Liquid Crystal Display (LCD) panel.
As shown in fig. 2, the display panel 100 includes an array substrate 110, and the array substrate 110 includes a first surface S1 and a second surface S2 sequentially arranged along a light emitting direction of the display panel 100. Specifically, the array substrate 110 further includes a substrate 111 and a device layer 112 located on the substrate 111, the device layer 112 may include a plurality of pixel circuits T and a wiring layer, the pixel circuits T are used for driving each pixel PX in the display panel 100 to perform light emitting display, the pixel circuits T may be Thin Film Transistors (TFTs), specifically, the pixel circuits T may include a gate layer located on the substrate 111 and a source drain layer located on a side of the gate layer away from the substrate 111, and by setting a reasonable pixel circuit T, light emission of each pixel PX may be accurately and effectively controlled. The wiring layer includes a plurality of signal lines, for example, the wiring layer may include a scan line Gate, a data line Date, and a power supply line, and each signal line in the wiring layer is connected to the pixel circuit T to control each sub-pixel PX on the display panel 100 to emit light for display. Alternatively, the first surface S1 may be a surface of the substrate 111 on a side facing away from the device layer 112, and the second surface S2 may be a surface of the device layer 112 on a side facing away from the substrate 111.
The driving unit 200 is located in the non-display area NA of the array substrate 110, the driving unit 200 may be an Integrated Circuit (IC) chip, and the driving unit 200 is connected to the signal line on the array substrate 110 to control each pixel PX of the display panel 100 to emit light for display. The middle frame assembly 300 includes a supporting plate 310 and a connecting adhesive layer 330, which are connected to each other, the supporting plate 310 is located on the side of the first surface S1 of the array substrate 110, that is, the supporting plate 310 is located on the side of the substrate 111 away from the device layer 112, and the connecting adhesive layer 330 is connected between the supporting plate 310 and the first surface S1 of the array substrate 110. The heat conductive member 400 is thermally connected to the driving unit 200, and the heat conductive member 400 includes a first heat transfer member 410, and the first heat transfer member 410 is located between the first surface S1 of the array substrate 110 and the connection adhesive layer 330. The thermal connection between the heat conducting assembly 400 and the driving unit 200 means that the heat conducting assembly 400 can transfer heat to the driving unit 200, and when the driving unit 200 generates heat during operation, the heat can be transferred to the connection adhesive layer 330 contacting the heat conducting assembly 400 through the heat conducting assembly 400 to heat the connection adhesive layer 330, so as to maintain the connection adhesive layer 330 to have good shrinkage performance.
According to the display device 1000 of the embodiment of the invention, as the heat conducting assembly 400 is thermally connected with the driving unit 200, heat generated by the driving unit 200 during operation is transferred to the connecting adhesive layer 330 through the heat conducting assembly 400 to heat the connecting adhesive layer 330, so that the heat generated by the driving unit 200 is utilized, and the situation that the contraction performance of the connecting adhesive layer 330 is deteriorated and gradually hardened when the display device 1000 is applied to various occasions, for example, applied to a low-temperature environment, is effectively prevented, so that the connecting adhesive layer 330 can maintain good buffer performance in the low-temperature environment, the display panel 100 is better protected, the stability of the display device 1000 is improved, and the situation that the display panel 100 is displayed unevenly is improved. Meanwhile, the heat conducting assembly 400 can better transfer the heat of the driving unit 200, and the influence of the poor heat dissipation performance of the driving unit 200 on the performance of the driving unit 200 is prevented. When the display device 1000 is the vehicle-mounted display device 1000, the service environment of the vehicle-mounted display device 1000 is severe, for example, the ambient temperature is lower, and by providing the heat conducting assembly 400 according to the embodiment of the invention, the vehicle-mounted display device 1000 can have a better display effect in a low-temperature environment.
Referring to fig. 2, since the embodiment of the invention utilizes heat generated by the driving unit 200, in order to improve the utilization efficiency of the heat and prevent the heat from being more lost on the heat conducting element 400, in some embodiments, an orthogonal projection of the driving unit 200 on the display panel 100 at least partially overlaps an orthogonal projection of the first heat transfer element 410 on the display panel 100, and an orthogonal projection of the first heat transfer element 410 on the display panel 100 at least partially overlaps an orthogonal projection of the connection adhesive layer 330 on the display panel 100. Through the above arrangement, the transmission path of the heat generated by the driving unit 200 during operation is short, and the heat is prevented from being lost more in the air or on the heat conducting assembly 400, so that the utilization efficiency of the heat is improved, the connecting adhesive layer 330 is better heated, and the connecting adhesive layer 330 has better buffering performance. In a specific implementation, the orthographic projection of the driving unit 200 on the display panel 100 may cover the orthographic projection of the first heat transfer element 410 on the display panel 100, and the orthographic projection of the first heat transfer element 410 on the display panel 100 may cover the orthographic projection of the connection adhesive layer 330 on the display panel 100, so as to effectively reduce a heat transmission path, and reduce an area of the first heat transfer element 410 to reduce heat dissipation.
In order to stably connect the display panel 100 to the support plate 310 of the middle frame assembly 300, the connection adhesive layer 330 extends along the entire circumference of the display panel 100, so that the display panel 100 is stably connected to the support plate 310 in all directions, based on this, referring to fig. 3, fig. 3 is a top view of the array substrate according to an embodiment of the present invention, in order to better heat the connection adhesive layer 330, in some embodiments, an orthogonal projection of the first heat transfer element 410 on the display panel 100 surrounds an outer circumferential side of the display area AA, and an orthogonal projection of the first heat transfer element 410 on the display panel 100 includes an inner contour and an outer contour, at this time, the orthogonal projection of the first heat transfer element 410 on the display panel 100 is in a ring structure, which can reduce an area of the first heat transfer element 410, thereby effectively reducing heat loss on the first heat transfer element 410. Optionally, the distance between the inner contour and the outer contour is 1 mm to 2 mm. Through the structural parameter of reasonable setting first heat transfer piece 410, can effectively reduce the loss that the heat produced when transmitting via first heat transfer piece 410 to make more heat transfer to connection glue film 330, with heating connection glue film 330.
Alternatively, the position of the driving unit 200 on the array substrate 110 may be selected according to user requirements, for example, the driving unit 200 may be disposed on the first surface S1 side or the second surface S2 side of the array substrate 110, and when the driving unit 200 is disposed on the second surface S2 side of the array substrate 110 and the first heat transfer member 410 is disposed on the first surface S1 of the array substrate 110, in order to reduce excessive loss when heat generated by the driving unit 200 is transferred in the thickness direction of the array substrate 110, in some embodiments, referring to fig. 2, the driving unit 200 is disposed on the second surface S2 of the array substrate 110, the array substrate 110 includes a first opening 113 penetrating through the first surface S1 and the second surface S2, the first opening 113 is disposed in the non-display area NA, the heat conduction assembly 400 further includes a second heat transfer member 420 disposed in contact with and thermally connected to the first heat transfer member 410, and the second heat transfer member 420 fills the first opening 113 to thermally connect the heat conduction assembly 400 and the driving unit 200. Through the above arrangement, the second heat transfer element 420 can better transfer heat generated by the driving unit 200 to the first heat transfer element 410, and then the first heat transfer element 410 transfers the heat to the connection adhesive layer 330 to heat the connection adhesive layer 330. It can be understood that the first opening 113, the pixel circuit T on the array substrate 110 and the signal lines are disposed in an avoiding manner, so as to prevent poor display or display failure of the display panel 100.
Based on this, when the driving unit 200 is located on the second surface S2 of the array substrate 110, and the array substrate 110 includes the first opening 113 penetrating through the first surface S1 and the second surface S2, at least a portion of the orthographic projection of the first opening 113 on the display panel 100 may overlap with the orthographic projection of the driving unit 200 on the display panel 100, and at this time, at least a portion of the orthographic projection of the second heat transfer member 420 filled into the first opening 113 on the display panel 100 overlaps with the orthographic projection of the driving unit 200 on the display panel 100, so as to reduce the transmission path of heat, and improve the heat transfer efficiency and the utilization rate of heat.
In a specific implementation, since the driving unit 200 generates more heat in the middle region during operation, and the edge region of the driving unit 200 may be provided with pins to connect the driving unit 200 with the signal lines on the array substrate 110, at this time, the orthographic projection of the first opening 113 on the display panel 100 may be located in the middle region of the orthographic projection of the driving unit 200 on the display panel 100, so that the second heat transfer member 420 filled in the first opening 113 can better transfer the heat generated by the driving unit 200.
Because second heat transfer member 420 need fill to first opening 113 in, in order to prevent that second heat transfer member 420 from causing the damage to the membranous layer structure on array substrate 110 when the preparation, second heat transfer member 420 can use the silver thick liquid preparation, the silver thick liquid can be liquid in normal atmospheric temperature environment, be convenient for fill to first opening 113 in, consequently, second heat transfer member 420's material can include silver, the preparation of second heat transfer member 420 not only is convenient for through the material that rationally sets up second heat transfer member 420, and has better heat conductivility, and can reduce display device 1000's cost.
Alternatively, referring to fig. 4, fig. 4 is a schematic cross-sectional view of the display device shown in fig. 1 along a direction B-B, when the driving unit 200 is located on the second surface S2 of the array substrate 110, the heat conducting assembly 400 may further include a third heat transfer element 430 disposed in contact with the first heat transfer element 410 and thermally connected to the first heat transfer element, the array substrate 110 further includes a side surface located between the first surface S1 and the second surface S2, and at least a portion of the third heat transfer element 430 extends to the side surface to thermally connect the first heat transfer element 410 and the driving unit 200. At this time, the heat generated by the driving unit 200 is transferred to the connection adhesive layer 330 along the side surface of the array substrate 110 to heat the connection adhesive layer 330, so that the connection adhesive layer 330 maintains a good buffering performance.
Referring to fig. 5, fig. 5 is a schematic cross-sectional view of the display device shown in fig. 1 along the direction B-B. In some embodiments, the driving unit 200 is located at the first surface S1 side of the array substrate 110, and the driving unit 200 is thermally connected to the first heat transfer element 410, and at this time, the driving unit 200 and the first heat transfer element 410 are located at the first surface S1 side of the array substrate 110, so that heat generated by the driving unit 200 can be directly transferred to the first heat transfer element 410, and heat loss is effectively reduced. In specific implementation, the driving unit 200 may be bound to the first surface S1 side of the array substrate 110 through a Flexible circuit board (FPC), or a trace structure may be disposed on a side surface of the array substrate 110, so that the driving unit 200 located on the first surface S1 side is connected to the signal line on the array substrate 110.
As shown in fig. 5, when the display panel 100 is a liquid crystal display panel, the display panel 100 further includes a color film substrate 120 disposed opposite to the array substrate 110, and a display medium layer disposed between the array substrate 110 and the color film substrate 120, where the display medium layer may be a liquid crystal layer, and the display of the liquid crystal display panel 100 is implemented by controlling the deflection of liquid crystal molecules in the liquid crystal layer. In order to realize the light emitting display of the liquid crystal display panel 100, the display device 1000 further includes a backlight module 500, the backlight module 500 is located at a side of the support plate 310 away from the display panel 100, wherein the support plate 310 includes a second opening 311 penetrating through the support plate 310 along a thickness direction of the support plate 310, and an outline of an orthographic projection of the second opening 311 on the display panel 100 is located at an outer periphery side of the display area AA. Through the above arrangement, the supporting plate 310 can be prevented from shielding the light emitted by the backlight module 500, so that the light emitted by the backlight module 500 can better enter the display panel 100, and the display brightness of the display panel 100 is improved.
Referring to fig. 6, fig. 6 is a schematic cross-sectional view of the display device shown in fig. 1 along the direction B-B. When the display panel 100 is an organic light emitting diode display panel, the display panel 100 includes an organic light emitting device layer 140 on the second surface S2 of the array substrate 110 and an encapsulation layer (not shown) covering the organic light emitting device layer 140. The organic light emitting element layer 140 includes a first electrode, an organic light emitting structure on the first electrode, and a second electrode on a side of the organic light emitting structure away from the first electrode, wherein one of the first electrode and the second electrode is an anode, and the other is a cathode, the organic light emitting structure includes an electron injection layer, an electron transport layer, a hole injection layer, a hole transport layer, and a light emitting layer, and the electrons and the holes are combined in the light emitting layer to emit light, thereby realizing the display of the display panel 100. Further, when the display panel 100 is an organic light emitting diode display panel, the driving unit 200 may also be disposed on the first surface S1 side or the second surface S2 side of the array substrate 110, and similarly, the heat conducting assembly 400 may also be disposed in the display device 1000 to heat the connection adhesive layer, where the disposing manner and the structure of the heat conducting assembly 400 are similar to those in fig. 2 to fig. 5, and are not repeated.
Referring to fig. 7 to 9 together, fig. 7 is a top view of a display device according to another embodiment of the present invention, fig. 8 is a schematic cross-sectional view of the display device shown in fig. 7 along a direction C-C, and fig. 9 is a top view of the display device according to yet another embodiment of the present invention. In some embodiments, the non-display area NA includes first and second sub-areas NA1 and NA2 oppositely disposed in the first direction X, and third and fourth sub-areas NA3 and NA4 oppositely disposed in the second direction Y, the first direction X crossing the second direction Y, the array substrate 110 further includes scan lines Gate extending in the first direction X and data lines Date extending in the second direction Y, and the driving unit 200 includes at least any one of a first driving unit (Gate IC) 210 and a second driving unit (Source IC) 220. The first driving unit 210 is used for driving the scan lines Gate, and the first driving unit 210 is located in at least one of the first and second sub-sections NA1 and NA2. The second driving unit 220 is for driving the data line Date, and the second driving unit 220 is located in at least one of the third and fourth sub-sections NA3 and NA 4. In order to better heat the connection adhesive layer 330, optionally, the heat conduction assembly 400 may be thermally connected to the first driving unit 210 and the second driving unit 220, respectively, so that more heat is transferred to the connection adhesive layer 330 to improve the buffer performance of the connection adhesive layer 330, thereby better protecting the display panel 100. It is understood that the first driving unit 210 and the second driving unit 220 may be integrated into a driving chip, the driving chip may be located in the first sub-area NA1, the first direction X may be a row direction of the display panel 100, the second direction Y may be a column direction of the display panel 100, and the first direction X and the second direction Y are perpendicular to each other.
In a specific implementation, as shown in fig. 7, the number of the first driving units 210 may be one, and the first driving units 210 may be located in the first sub-area NA1 or the second sub-area NA2. The number of the first driving units 210 may be two, as shown in fig. 9, one of the first driving units 210 may be located in the first sub-area NA1, and the other first driving unit 210 may be located in the second sub-area NA2, so as to implement double-sided driving of the display panel 100, reduce the routing load of the scan lines Gate, and improve the display uniformity of the display panel 100. Likewise, the number of the second drive units 220 may be one, or two, or even more, and the second drive units 220 may be located in at least one of the third sub-area NA3 and the fourth sub-area NA 4. By reasonably arranging the first driving unit 210 and the second driving unit 220, the embodiment of the invention can effectively reduce the cost of the driving unit 200 compared with a driving chip with high integration while stably and accurately controlling the light emitting display of the display panel 100.
When the driving unit 200 includes both the first driving unit 210 and the second driving unit 220, the first driving unit 210 and the second driving unit 220 may be both located on the second surface S2 of the array substrate 110, optionally, the array substrate 110 includes at least two first openings 113 penetrating the first surface S1 and the second surface S2, the at least two first openings 113 are respectively disposed corresponding to the first driving unit 210 and the second driving unit 220, the heat conduction assembly 400 further includes at least two second heat transfer members 420 thermally connected to the first heat transfer members 410, and the second heat transfer members 420 fill the first openings 113 to thermally connect the heat conduction assembly 400 to the first driving unit 210 and the second driving unit 220, respectively.
Alternatively, when the driving unit 200 includes the first driving unit 210 and the second driving unit 220, and the first driving unit 210 and the second driving unit 220 may both be located on the second surface S2 of the array substrate 110, the heat conductive assembly 400 may further include at least two third heat transfer members 430 extending along the side surface of the array substrate 110, and heat generated by the driving unit 200 is transferred from the side surface of the array substrate 100 to the first heat transfer member 410 through the third heat transfer members 430 and is transferred to the connection adhesive layer 330 via the first heat transfer member 410.
Alternatively, the heat generated by the first driving unit 210 may be transferred to the connection adhesive layer 330 through the second heat transfer element 420 filled in the first opening 113, and the heat generated by the second driving unit 220 may be transferred to the connection adhesive layer 330 through the third heat transfer element 430 extending to the side surface of the array substrate 110, which is not limited in the embodiment of the invention as long as the heat generated by the driving unit 200 can be transferred to the connection adhesive layer 330 through the heat conductive assembly 400.
When the driving unit 200 includes the first driving unit 210 and the second driving unit 220, the array substrate 110 further includes a connecting line 150 connected between adjacent driving units 200, the connecting line 150 can be located in a sub-region where the adjacent driving unit 200 is located, and the connecting line 150 extends along the extending direction of the non-display region NA, as shown in fig. 7, when the first driving unit 210 is located in the first sub-region NA1 and the second driving unit 220 is located in the fourth sub-region NA4, the connecting line 150 extends in the first sub-region NA1 and the fourth sub-region NA4 and extends along the extending direction of the first sub-region NA1 and the fourth sub-region NA 4. Based on this, at least a partial number of the first openings 113 include a first sub-opening 1131 and a second sub-opening 1132 that are communicated with each other, the orthographic projection of the first sub-opening 1131 on the display panel 100 is located inside the orthographic projection of the driving unit 200 on the display panel 100, optionally, the orthographic projection of the first sub-opening 1131 on the display panel 100 is located in a middle area of the orthographic projection of the driving unit 200 on the display panel 100, and the orthographic projection of the second sub-opening 1132 on the display panel 100 and the orthographic projection of the connecting line 150 on the display panel 100 are respectively located on opposite sides of the orthographic projection of the driving unit 200 on the display panel 100. Through the arrangement, the arrangement structure of the connecting line 150 can be simplified, the first opening 113 and the connecting line 150 can be arranged away from each other, and the first opening 113 is prevented from breaking the connecting line 150 to influence the display of the display panel 100.
In order to increase the contact area between the second heat transfer member 420 and the driving unit 200 to more effectively transfer the heat generated by the driving unit 200, in some embodiments, the extension length of the second sub-opening 1132 is greater than the extension length of the first sub-opening 1131 along the direction from the display area AA to the non-display area NA, and at this time, the first opening 113 is T-shaped along the direction parallel to the plane of the display panel 100, so that the second heat transfer member 420 filled in the first opening 113 is T-shaped along the direction parallel to the plane of the display panel 100 to better transfer the heat.
As shown in fig. 8, in order to properly arrange the material of the first heat transfer element 410 to improve the heat transfer efficiency, in some embodiments, the array substrate 110 further includes a metal conductive layer M located between the first surface S1 and the second surface S2, the metal conductive layer M may be a Gate layer, a source drain layer, or a scan line Gate or a data line Date in a wiring layer in the pixel circuit T, and since the metal conductive layer M is made of a metal that is a heat conductor, the material of the first heat transfer element 410 may be the same as the material of at least a portion of the metal conductive layer M in order to simplify the manufacturing process of the display device 1000 and reduce the cost. Optionally, the material of the first heat transfer element 410 comprises aluminum. By reasonably arranging the material of the first heat transfer member 410, the manufacturing process of the display device 1000 can be simplified while heat is well transferred.
As shown in fig. 9, as the pixel PX density (PPI) of the display panel 100 is increased, the number of data lines Date disposed on the array substrate 110 is gradually increased, in order to reasonably set the driving capability of the second driving units 220, in some embodiments, the number of the second driving units 220 is at least two, the two second driving units 220 are electrically connected to each other, the display area AA includes at least two sub-display areas, and the second driving units 220 are disposed in one-to-one correspondence with the sub-display areas. With the above arrangement, the second driving unit 220 can stably drive the data lines Date in the corresponding sub display regions, thereby achieving stable display of the display panel 100 while reducing the cost of using the second driving unit 220 with a reduced high integration.
Referring to fig. 2, 4 to 6, in order to stably connect the display panel 100 to the middle frame assembly 300, in some embodiments, the middle frame assembly 300 further includes a side plate 320, the side plate 320 is erected on the supporting plate 310, and the side plate 320 is disposed at an outer peripheral side of the display panel 100 at an interval. With the above arrangement, a gap is formed between the side plate 320 and the side surface of the display panel 100, and damage to the display panel 100 due to assembly errors or manufacturing errors of other components can be prevented.
In summary, according to the display device 1000 of the embodiment of the invention, the display device 1000 includes the display panel 100, the driving unit 200, the middle frame assembly 300 and the heat conducting assembly 400, and the driving unit 200 can provide a driving signal to the display panel 100, so that the display panel 100 can emit light for displaying. The middle frame assembly 300 includes a support plate 310 and a connection adhesive layer 330 connected to each other, and the display panel 100 is connected to the support plate 310 through the connection adhesive layer 330, so that the middle frame assembly 300 can protect the display panel 100. The heat conducting assembly 400 is thermally connected to the driving unit 200, so that heat generated by the driving unit 200 during operation can be transferred to the heat conducting assembly 400, further, the heat conducting assembly 400 includes a first heat transfer member 410, the first heat transfer member 410 is located between the array substrate 110 and the connection adhesive layer 330, so that heat generated by the driving unit 200 during operation can be transferred to the connection adhesive layer 330 through the first heat transfer member 410 to heat the connection adhesive layer 330, thereby effectively preventing the situation that the contraction performance of the connection adhesive layer 330 is deteriorated and gradually hardened when the display device 1000 is applied to various fields, for example, in a low-temperature environment, so that the connection adhesive layer 330 can better protect the display panel 100, and preventing contraction stress of the structures such as the supporting plate 310 from being directly transferred to the display panel 100 to affect the display panel 100, and the display device 1000 according to the embodiment of the present invention can improve the service performance of the display device 1000 and the stability under different fields by providing the heat conducting assembly 400, thereby improving the display effect of the display device 1000.
Further, by providing the heat conducting assembly 400, the heat of the driving unit 200 can be better transferred, and the performance of the driving unit 200 is prevented from being affected by the poor heat dissipation performance of the driving unit 200.
On the other hand, an embodiment of the present invention further provides a method for manufacturing a display device, including:
s110, providing an array substrate 110, and forming a heat conducting element 400 on the array substrate 110;
the array substrate 110 includes a first surface S1 and a second surface S2 sequentially arranged along a light emitting direction of the display device 1000, the heat conducting assembly 400 includes a first heat transfer element 410, and the first heat transfer element 410 is located on the first surface S1 of the array substrate 110. Specifically, in step S110, at least a portion of the array substrate 100 may be provided, for example, the substrate 111 in the array substrate 110 is provided, the first heat transfer element 410 is formed on one surface (the first surface S1) of the substrate 111 in the thickness direction, and then the pixel circuit, the wiring layer, and other structures are formed on the other surface of the substrate 111 in the thickness direction. Alternatively, in step S110, the substrate 111 may be provided, the pixel circuit is fabricated on the substrate 111, for example, the gate layer of the pixel circuit is fabricated on the upper surface of the substrate 111, then the substrate 111 is turned over by 180 degrees, and the first heat transfer element 410 of the heat conducting assembly 400 is fabricated on the lower surface of the substrate 111. Still alternatively, in step S110, the array substrate 110 including the pixel circuits and the wiring may be provided, and then the first heat transfer element 410 is fabricated on the first surface S1 of the array substrate 110. In the manufacturing process, the first heat transfer member 410 may be manufactured on the first surface S1 of the array substrate 110 by using an evaporation method, and the specific manufacturing sequence and manufacturing process of the first heat transfer member 410 are not limited in the present invention.
S120, disposing the driving unit 200 on the array substrate 110, wherein the driving unit 200 is thermally connected to the heat conducting assembly 400;
specifically, the driving unit 200 may be disposed on the first surface S1 side or the second surface S2 side of the array substrate 110, and the driving unit 200 may also be connected to the signal lines on the array substrate 110 through the FPC, so that the driving unit 200 controls each pixel PX on the display panel 100 to emit light for display through the signal lines.
S130, connecting the array substrate 110 to the supporting plate 310 of the middle frame assembly 300 by using the connecting adhesive layer 330;
in some embodiments, the middle frame assembly 300 includes a side plate 320 standing on the support plate 310, and when the array substrate 110 is attached to the support plate 310 of the middle frame assembly 300 by the adhesive layer 330, a predetermined gap may be provided between the side surface of the array substrate 110 and the side plate 320 to prevent the display panel 100 from being damaged. Alternatively, the connection adhesive layer 330 may be foam adhesive to protect the display panel 100.
The first heat transfer element 410 is located between the connection glue layer 330 and the first surface S1 of the array substrate 110.
According to the display device 1000 manufactured by the manufacturing method of the display device provided by the embodiment of the invention, as the heat conducting assembly 400 is thermally connected with the driving unit 200, heat generated by the driving unit 200 during operation is transferred to the connecting adhesive layer 330 through the heat conducting assembly 400 to heat the connecting adhesive layer 330, so that the heat generated by the driving unit 200 is utilized, and the situation that when the display device 1000 is applied to various occasions, for example, applied to a low-temperature environment, the shrinkage performance of the connecting adhesive layer 330 is deteriorated and gradually hardened is effectively prevented, so that the connecting adhesive layer 330 can also keep better buffer performance in the low-temperature environment, the display panel 100 is better protected, the stability of the display device 1000 is improved, and the situation that the display panel 100 is displayed unevenly is improved. Meanwhile, the heat conducting assembly 400 can better transfer the heat of the driving unit 200, and the influence of the poor heat dissipation performance of the driving unit 200 on the performance of the driving unit 200 is prevented.
In some embodiments, the step S110 of providing the array substrate 110, and the forming the heat conducting element 400 on the array substrate 110 includes: providing a substrate 111; forming a metal conductive layer M on one side of the substrate 111; and forming a first heat transfer member 410 on the other side of the substrate 111, the material of the first heat transfer member 410 being the same as the material of at least a part of the metal conductive layer M. Since the metal conductive layer M is made of a metal which is a heat conductor, the manufacturing process of the display device 1000 can be simplified and the cost can be reduced by the above arrangement. Optionally, the material of the first heat transfer element 410 comprises aluminum. By reasonably arranging the material of the first heat transfer member 410, the manufacturing process of the display device 1000 can be simplified while heat is well transferred.
Optionally, after the driving unit 200 is located on the second surface S2 of the array substrate 110 and the heat conducting element 400 is formed on the array substrate 110, the manufacturing method of the display device includes: forming a first opening 113 on the array substrate 110, the first opening 113 penetrating the first surface S1 and the second surface S2; and a second heat transfer member 420 is formed in the first opening 113, the second heat transfer member 420 being thermally connected to the driving unit 200 and the first heat transfer member 410, respectively. Through the above arrangement, the second heat transfer element 420 can better transfer heat generated by the driving unit 200 to the first heat transfer element 410, and then the first heat transfer element 410 transfers the heat to the connection adhesive layer 330 to heat the connection adhesive layer 330.
In some embodiments, forming the second heat transfer element 420 within the first opening 113 includes: dripping silver paste into the first opening 113; and drying the silver paste to form the second heat transfer member 420. Because second heat transfer member 420 need fill to first opening 113 in, in order to prevent that second heat transfer member 420 from causing the damage to the membranous layer structure on array substrate 110 when the preparation, use silver thick liquid preparation second heat transfer member 420, silver thick liquid can be liquid in normal atmospheric temperature environment, be convenient for fill to first opening 113 in, the preparation of the second heat transfer member 420 of not only being convenient for, and have better heat conductivility moreover, and can reduce display device 1000's cost.
When the display panel 100 is a liquid crystal display panel, and the step of forming the heat conducting assembly 400 on the array substrate 110 is performed, the method for manufacturing the display device includes: providing a color film substrate 120; and sandwiching the display medium layer 130 between the color filter substrate 120 and the second surface S2 of the array substrate 110 to form the display panel 100.
When the display panel 100 is an organic light emitting diode display panel, in some embodiments, after the heat conducting assembly 400 is formed on the array substrate 110, the manufacturing method of the display device includes: an organic light emitting element layer 140 is formed on the second surface S2 side of the array substrate 110 to form the display panel 100. Through the above arrangement, the film layer of the organic light emitting device layer 140 can be prevented from being damaged by the manufacturing of the heat conducting assembly 400, and the display of the display panel 100 can be prevented from being affected. Thereby improving the stability of the display device 1000.
In accordance with the above embodiments of the present invention, these embodiments are not exhaustive and do not limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention and various embodiments with various modifications as are suited to the particular use contemplated. The invention is limited only by the claims and their full scope and equivalents.

Claims (22)

1. A display device characterized in that the display device has a display area and a non-display area provided on an outer peripheral side of the display area, the display device comprising:
the display panel comprises an array substrate, wherein the array substrate comprises a first surface and a second surface which are sequentially arranged along the light emergent direction of the display panel;
the driving unit is positioned in a non-display area of the array substrate;
the middle frame assembly comprises a supporting plate and a connecting adhesive layer which are connected with each other, the supporting plate is positioned on the side of the first surface of the array substrate, and the connecting adhesive layer is connected between the supporting plate and the first surface of the array substrate;
the heat conduction assembly is thermally connected with the driving unit and comprises a first heat transfer piece, and the first heat transfer piece is located between the first surface of the array substrate and the connecting glue layer.
2. The display device according to claim 1, wherein an orthographic projection of the driving unit on the display panel at least partially overlaps with an orthographic projection of the first heat transfer member on the display panel,
the orthographic projection of the first heat transfer piece on the display panel is at least partially overlapped with the orthographic projection of the connecting glue layer on the display panel.
3. The display device according to claim 2, wherein an orthographic projection of the first heat transfer member on the display panel surrounds an outer peripheral side of the display area,
the orthographic projection of the first heat transfer piece on the display panel comprises an inner contour and an outer contour, and the distance between the inner contour and the outer contour is 1-2 mm.
4. The display device according to claim 1, wherein the array substrate further comprises a metal conductive layer between the first surface and the second surface, and a material of the first heat transfer member is the same as a material of at least a part of the metal conductive layer.
5. The display device according to claim 4, wherein a material of the first heat transfer member includes aluminum.
6. The display device according to claim 1, wherein the driving unit is located at a second surface of the array substrate, the array substrate includes a first opening penetrating the first surface and the second surface, the first opening is located at the non-display region, the heat conductive member further includes a second heat transfer member disposed in contact with the first heat transfer member and thermally connected to each other, the second heat transfer member fills the first opening to thermally connect the heat conductive member to the driving unit;
or, the driving unit is located on the second surface of the array substrate, the heat conducting assembly further includes a third heat transfer element disposed in contact with the first heat transfer element and thermally connected to each other, the array substrate further includes a side surface located between the first surface and the second surface, and at least a portion of the third heat transfer element extends to the side surface to thermally connect the heat conducting assembly with the driving unit.
7. The display device according to claim 6, wherein the driving unit is located on a second surface of the array substrate, the array substrate comprises a first opening penetrating through the first surface and the second surface, and at least a part of an orthogonal projection of the first opening on the display panel overlaps with an orthogonal projection of the driving unit on the display panel.
8. The display device according to claim 6, wherein a material of the second heat transfer member includes silver.
9. The display device according to claim 1, wherein the driving unit is located on a first surface of the array substrate, and the driving unit is thermally connected to the first heat transfer member.
10. The display device according to any one of claims 1 to 9, wherein the non-display region includes a first sub-region and a second sub-region disposed opposite to each other in a first direction, a third sub-region and a fourth sub-region disposed opposite to each other in a second direction, the first direction crossing the second direction, the array substrate further includes a scan line extending in the first direction and a data line extending in the second direction,
the drive unit includes at least any one of:
a first driving unit for driving the scan lines, the first driving unit being located at least one of the first sub-area and the second sub-area;
a second driving unit for driving the data line, the second driving unit being located at least one of the third sub-area and the fourth sub-area,
the heat conduction assembly is thermally connected with the first driving unit and the second driving unit respectively.
11. The display device according to claim 10, wherein the first driving unit and the second driving unit are both located on a second surface of the array substrate, the array substrate includes at least two first openings penetrating the first surface and the second surface, the at least two first openings are respectively disposed corresponding to the first driving unit and the second driving unit,
the heat conductive assembly further includes at least two second heat transfer members thermally connected to each other with the first heat transfer member, the second heat transfer members filling the first opening to thermally connect the heat conductive assembly with the first driving unit and the second driving unit, respectively.
12. The display device according to claim 11, wherein the array substrate further comprises a connecting line connected between adjacent driving units, the connecting line is located in a sub-region where the adjacent driving unit is located, and the connecting line extends along an extending direction of the non-display region;
at least a part of the first openings comprise a first sub opening and a second sub opening which are communicated with each other, the orthographic projection of the first sub opening on the display panel is positioned inside the orthographic projection of the driving unit on the display panel, and the orthographic projection of the second sub opening on the display panel and the orthographic projection of the connecting line on the display panel are respectively positioned on the opposite sides of the orthographic projection of the driving unit on the display panel.
13. The display device according to claim 12, wherein an extension length of the second sub opening is greater than an extension length of the first sub opening in a direction from the display area to the non-display area.
14. The display device according to claim 13, wherein the number of the second driving units is at least two, the display region comprises at least two sub-display regions, and the second driving units are arranged in one-to-one correspondence with the sub-display regions.
15. The display device according to any one of claims 1 to 9, wherein the middle frame assembly further comprises:
and the side plates are vertically arranged on the supporting plate, and are arranged on the outer peripheral side of the display panel at intervals.
16. The display device according to any one of claims 1 to 9, further comprising:
a backlight module arranged at one side of the support plate departing from the display panel,
wherein the support plate comprises a second opening penetrating through the support plate along the thickness direction of the support plate, and the outline of the orthographic projection of the second opening on the display panel is positioned on the outer periphery side of the display area.
17. A method for manufacturing a display device, comprising:
providing an array substrate, and forming a heat conduction assembly on the array substrate, wherein the array substrate comprises a first surface and a second surface which are sequentially arranged along the light emergent direction of the display device, the heat conduction assembly comprises a first heat transfer piece, and the first heat transfer piece is positioned on the first surface of the array substrate;
arranging a driving unit on the array substrate, wherein the driving unit is thermally connected with the heat conduction assembly;
connecting the array substrate to a support plate of the middle frame assembly by using a connecting adhesive layer;
the first heat transfer piece is located between the connection glue layer and the first surface of the array substrate.
18. The method of claim 17, wherein after the forming the thermal conductive member on the array substrate, the method comprises:
providing a color film substrate;
and clamping a display medium layer between the color film substrate and the second surface of the array substrate to form a display panel.
19. The method of claim 18, wherein the providing an array substrate and the forming a thermal conductive element on the array substrate comprises:
providing a substrate;
forming a metal conductive layer on one side of the substrate;
and forming a first heat transfer piece on the other side of the substrate, wherein the material of the first heat transfer piece is the same as that of at least part of the metal conductive layer.
20. The method of claim 17, wherein the driving unit is disposed on the second surface of the array substrate, and after the heat conducting member is formed on the array substrate, the method comprises:
forming a first opening on the array substrate, wherein the first opening penetrates through the first surface and the second surface;
a second heat transfer member is formed in the first opening, the second heat transfer member being thermally connected to the driving unit and the first heat transfer member, respectively.
21. The method of manufacturing a display device according to claim 20, wherein forming a second heat transfer member in the first opening includes:
dripping silver paste into the first opening;
and drying the silver paste to form a second heat transfer element.
22. The method of claim 17, wherein after the forming the thermal conductive element on the array substrate, the method comprises:
and forming an organic light-emitting element layer on the second surface side of the array substrate to form a display panel.
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