CN112051461A - Interconnect system with high current and low leakage capability - Google Patents

Interconnect system with high current and low leakage capability Download PDF

Info

Publication number
CN112051461A
CN112051461A CN202010504644.XA CN202010504644A CN112051461A CN 112051461 A CN112051461 A CN 112051461A CN 202010504644 A CN202010504644 A CN 202010504644A CN 112051461 A CN112051461 A CN 112051461A
Authority
CN
China
Prior art keywords
test
cable
measurement instrument
switch
shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010504644.XA
Other languages
Chinese (zh)
Inventor
G·索波列夫斯基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Keithley Instruments LLC
Original Assignee
Keithley Instruments LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/886,229 external-priority patent/US11927605B2/en
Application filed by Keithley Instruments LLC filed Critical Keithley Instruments LLC
Publication of CN112051461A publication Critical patent/CN112051461A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/20Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
    • G01R1/206Switches for connection of measuring instruments or electric motors to measuring loads
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/20Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
    • G01R1/24Transmission-line, e.g. waveguide, measuring sections, e.g. slotted section
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/18Screening arrangements against electric or magnetic fields, e.g. against earth's field

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

The invention relates to an interconnection system with high current and low leakage capacity. The present disclosure relates to systems and methods related to test and measurement systems, and in particular to an interconnection system between a test and measurement instrument, such as a Source Measurement Unit (SMU), and a Device Under Test (DUT). The test and measurement instrument switch matrix comprising: a first cable comprising a central conductor and a shield connected to a first output of the test and measurement instrument; a second cable comprising a central conductor and a shield connected to a second output of the test and measurement instrument; a third cable comprising a central conductor connected to the device under test and a shielding; and a fourth cable comprising a center conductor connected to the device under test and a shielding layer connected to the device under test.

Description

Interconnect system with high current and low leakage capability
Priority
The present disclosure claims the benefit of U.S. provisional application No. 62/858,291 entitled "interconnecting SYSTEM WITH HIGH CURRENT AND LOW LEAKAGE CAPABILITY," filed 6/2019, which is hereby incorporated by reference in its entirety.
Technical Field
The present disclosure relates to systems and methods related to test and measurement systems, and in particular to an interconnection system between a test and measurement instrument, such as a Source Measurement Unit (SMU), and a Device Under Test (DUT).
Background
The test and measurement system is designed to receive and test signals from the DUT. In some test and measurement systems, such as those that include SMUs, the test and measurement system also sends signals to the DUT to test the response of the DUT. In some systems, switching devices are employed to switch between different inputs and outputs of the test and measurement system and the DUT.
Typically, triaxial cable is used in such systems. However, triaxial cables are often subject to relatively high center conductor resistance, especially in high voltage applications. In high voltage applications, the result is a very limited maximum current through the switching device.
Embodiments of the present disclosure address these and other deficiencies of the prior art.
Drawings
Aspects, features and advantages of embodiments of the present disclosure will become apparent from the following description of the embodiments with reference to the accompanying drawings, in which:
FIG. 1 is a block diagram of an example test system according to some embodiments of the present disclosure;
FIG. 2 is a diagram of the example switch matrix of FIG. 1, in accordance with some embodiments of the present disclosure;
FIG. 3 is a diagram of another example switch matrix of FIG. 1, in accordance with some embodiments of the present disclosure;
fig. 4 is a diagram of yet another example switch matrix of fig. 1, according to some embodiments of the present disclosure.
Detailed Description
Conventional switch matrices in test and measurement systems use multiple cables, typically triaxial cables, to connect the DUT to the test and measurement instrument. For example, to connect SMUs to DUTs, the switch matrix may include at least one HI apply (force) cable and one LO apply cable, and at least one HI sense cable and one LO sense cable. The application cable sends signals to the DUT, while the sense cable conveys measurements from the DUT to the test and measurement instrument.
Triaxial cables include a center conductor and an inner conductive jacket or shield coaxial with and surrounding the center conductor. The inner conductive shield layer may be referred to as a shield layer. The guard signal is routed through the guard layer along with the applied and sensed signals through the center conductor to minimize error currents in the wiring and any switches present in the system. The triaxial cable also includes an outer conductive shield, shell, or jacket coaxial with and surrounding both the center conductor and the shield. However, triaxial cables often suffer from relatively high center conductor resistance, especially if the triaxial cable is used in high voltage applications. In these cases, the maximum current through the triaxial cable is very limited and such switching devices cannot be effectively used in high current applications.
FIG. 1 illustrates an example block diagram of an example test system 100, the example test system 100 including a switch matrix 102 connected to a DUT 104 and a test and measurement instrument 106. The switch matrix 102 is configured to switch test signals between the test and measurement instrument 106 and the DUT 104. Switch matrix 102 may include one or more drivers 108 to control the switches in switch matrix 102. The one or more drivers 108 may include one or more controllers or processors. The switch matrix 102 may also include a memory 110 for storing instructions to be executed by the one or more drivers and/or processors 108. In some embodiments, instructions for the one or more drivers 108 are transmitted from the test and measurement instrument 106.
As will be appreciated by those skilled in the art, although switch matrix 102 is shown separate from test and measurement instrument 106, in some embodiments, switch matrix 102 may be included as a component of test and measurement instrument 106.
Fig. 2 illustrates an example switch matrix, which may be used as switch matrix 102, in accordance with some embodiments of the present disclosure. The switch matrix is shown in FIG. 2 as being connected to a test and measurement instrument 200 (such as an SMU) and a DUT 202. For ease of illustration, the switch matrix of fig. 2 does not depict various other components of the switch matrix, such as one or more processors, drivers, memory, and so forth.
As will be appreciated by those skilled in the art, the switch matrix may include paths for the HI and LO signals, as well as apply and sense paths. The switch matrix includes a plurality of application cables 204, 206, 208, 210 and a plurality of sense cables 212, 214, 216, 218. Each of the cables includes a center conductor 220 and a protective layer 222, which protective layer 222 may also be referred to as an inner shield layer. Voltage and/or current is sent from the test and measurement instrument 200 to the DUT 202 through the application cables 204, 206, 208, 210, while voltage and/or current from the DUT 202 is sent to the test and measurement instrument 200 for measurement through the sense cables 212, 214, 216, and 218.
The HI signal from test and measurement instrument 200 may be routed to the DUT through center conductor 220 of application cables 204 and 206. A switch 224 may be provided between the cables 204 and 206. The center conductor 220 of the application cable 206 is connected to the DUT 202. The center conductor 220 of the application cable 204 is connected to the test and measurement instrument 200.
The HI signal from DUT 202 may be routed through center conductor 220 of sense cables 212 and 214 to test and measurement instrument 200. A switch 226 may be provided between sensing cables 212 and 214. The center conductor 220 of the sense cable 214 is connected to the DUT 202. The center conductor 220 of the sensing cable 212 is connected to the test and measurement instrument 200.
The LO signals from the test and measurement instrument 200 may be routed to the DUT 202 through the center conductors 220 of the application cables 208 and 210. A switch 228 may be provided between the application cables 208 and 210. The center conductor 220 of the application cable 210 is connected to the DUT 202. The center conductor 220 of the application cable 208 is connected to the test and measurement instrument 200.
The LO signals from the DUT 202 may be routed through the center conductors 220 of the sense cables 216 and 218 to the test and measurement instrument 200. A switch 230 may be provided between sensing cables 216 and 218. The center conductor 220 of the sense cable 218 is connected to the DUT 202. The center conductor 220 of the sensing cable 216 is connected to the test and measurement instrument 200.
Switches 232, 234, 236, and 238 may also be provided between the HI apply cable pairs 204 and 206, HI sense cable pairs 212 and 214, LO sense cable pairs 216 and 218, and LO apply cable pairs 208 and 210, respectively, to connect the shielding 222 of each of these cable pairs. Shield 222 of cables 204 and 212 are connected to each other and shield 222 of cables 206 and 214 are connected to each other. The shield 222 of cables 216 and 208 are connected to each other and the shield 222 of cables 208 and 210 are connected to each other.
However, unlike conventional switch matrices, individual guard signals are not sent to the guard layer 222 of each of the application and sense cables 204, 206, 208, 210, 212, 214, 216, and 218. Instead, shield 222 of each of application cable 204 and sensing cable 212 is shorted or electrically connected to center conductor 220 of application cable 204 so that a HI application signal is transmitted to the DUT through shields 222 of cables 204 and 212. The shielding 222 of each of the application cable 208 and the sense cable 216 is shorted to the center conductor 220 of the application cable 208 so that the LO application signal is sent to the DUT through the shielding 222 of the cables 208 and 216. The shield 222 of the cables 206, 210, 214, and 218 are each connected to a respective center conductor 220 of the cables 206, 210, 214, and 218 and to the DUT 202.
Furthermore, as illustrated in FIG. 2, the outer shields 240 of each of the cables 204, 206, 208, 210, 212, 214, 216, and 218 are connected together at the LO output of the test and measurement instrument 200, and also at a location in close proximity to the DUT 202. Connecting the outer shield 240 of each of the cables 204, 206, 208, 210, 212, 214, 216, and 218 in this manner may allow maintaining a low overall connection inductance and enable high speed, high current pulses.
The switch matrix of fig. 2 provides a much lower path resistance through shield layer 222 and thus greater current carrying capacity than a conventional switch matrix with a separate shield signal. Further, although not shown in fig. 2, additional cables may be provided in the system that do not have shielding 222 shorted to center conductor 220 and these paths may still provide complete low leakage capability.
Fig. 3 illustrates another example of a switch matrix, which may be used as the switch matrix 102 of fig. 1, in accordance with some embodiments of the present disclosure. Also, for ease of discussion, various other components of the switch matrix of fig. 3 (as illustrated in fig. 1) are not depicted in fig. 3. Further, components included in the switch matrix of fig. 3 discussed above with respect to fig. 2 are given the same reference numerals and are not discussed in further detail with respect to fig. 3.
In the switch matrix of FIG. 3, a switch 300 may be provided for the HI guard signal, and switch 300 may be switched into guard layer 222 of application cable 204 and sense cable 212. Further, another switch 302 may be provided between the HI signal of test and measurement instrument 200 and shield 222 of application cable 204 and sensing cable 212. Similarly, a switch 304 may be provided for the LO protection signal, which switch 304 may be switched into the protection layer 222 of the application cable 208 and the sense cable 216. Further, a switch 306 may be provided between the LO signal of the test and measurement instrument 200 and the shielding 222 of the application cable 208 and the sense cable 216.
Shield 222 of cables 206 and 214 are connected to each other and shield 222 of cables 210 and 218 are connected to each other. A switch 308 may be provided to connect the shield 222 of the cables 206 and 214 to the DUT 202, and a switch 310 may be provided to connect the shield 222 of the cables 214 and 218 to the DUT 202.
Switches 312 and 314 may also be provided on the test and measurement instrument 200 side of the switch matrix to switch in the sense signals from the sense cables 212 and 216.
With these switches, the switch matrix of fig. 3 can provide both high current with remote sensing and low current with guardpath capability. When higher currents are being used, the guard signal may be switched off and the applied signal from test and measurement instrument 202 may be switched into guard layer 222.
Fig. 4 illustrates yet another example of a switch matrix, which may be used as the switch matrix 102 of fig. 1, in accordance with some embodiments of the present disclosure. Also, for ease of discussion, various other components of the switch matrix of fig. 4 (as illustrated in fig. 1) are not depicted in fig. 4. Further, components included in the switch matrix of fig. 4 discussed above with respect to fig. 2 and 3 are given the same reference numerals and are not discussed in further detail with respect to fig. 4.
In the switch matrix of FIG. 4, cables 204, 206, 208, and 210 can be used as both application cables and sensing cables. Additional switches 400 and 402 may be added to switch the HI and LO signals from test and measurement instrument 200 into center conductors 220 of cables 204 and 208.
With the switch matrix of fig. 4, both high current measurements, telemetric measurements can be made, and through the same path, low leakage capability can be achieved while maintaining compatibility with existing infrastructure. Eliminating dedicated sensing paths reduces the system cost of the switch matrix while also reducing size and improving reliability due to fewer components in the switch matrix.
In each of the switch matrices of FIGS. 2-4, connecting the shielding directly to the HI or LO outputs of test and measurement instrument 200 allows higher currents to pass through the switch matrix and perform telemetry measurements of DUT 202, which conventional switch matrices using triaxial cables cannot do (assuming triaxial cables have small, high-resistance center conductors). The one or more drivers 108 of the switch matrix may operate the various switches of the switch matrix of fig. 2-4 to allow for the transmission of applied and sense signals between the test and measurement instrument 200 and the DUT 202. In some embodiments, the memory 110 stores instructions for one or more drivers 108, while in other embodiments, instructions may be sent from the test and measurement instrument 200.
For example, in the switch matrix of fig. 3 and 4, the test and measurement instrument 200 may include instructions for driving one or more drivers 108, as discussed above. When the current exceeds the threshold, test and measurement instrument 200 may instruct the switch to connect shield 222 of cables 204, 208, 212, and/or 216 to the HI or LO applied signal from the test and measurement instrument.
Further, while the switches 300, 302, 304, 306, 312, 314, 400, and 402 are shown as part of the switch matrix of FIGS. 3 and 4, in some embodiments, these switches may be included directly in the test and measurement instrument 200 and driven by one or more processors and/or drivers in the test and measurement instrument 200.
In some embodiments, the outer shields 240 of each of the cables 204, 206, 208, 210, 212, 214, 216, and 218 are connected together by switches at the LO output of the test and measurement instrument 200, as will be understood by those skilled in the art. For example, when only a DC high current is required, the outer shield 240 may not be connected to the LO output of the test and measurement instrument 200.
Aspects of the disclosure may operate on specially constructed hardware, firmware, digital signal processors, or specially programmed computers including processors operating according to programmed instructions. The term "controller" or "processor" as used herein is intended to include microprocessors, microcomputers, Application Specific Integrated Circuits (ASICs), and dedicated hardware controllers. One or more aspects of the disclosure may be embodied in computer-usable data and computer-executable instructions, such as in one or more program modules, executed by one or more computers (including monitoring modules) or other devices. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform particular tasks or implement particular abstract data types when executed by a processor in a computer or other device. The computer executable instructions may be stored on a computer readable storage medium such as a hard disk, optical disk, removable storage media, solid state memory, Random Access Memory (RAM), and the like. As will be appreciated by one skilled in the art, the functionality of the program modules may be combined or distributed as desired in various aspects. Further, the functionality may be embodied in whole or in part in firmware or hardware equivalents such as integrated circuits and FPGAs. Particular data structures may be used to more effectively implement one or more aspects of the present disclosure, and such data structures are contemplated within the scope of computer-executable instructions and computer-usable data described herein.
In some cases, the disclosed aspects may be implemented in hardware, firmware, software, or any combination thereof. The disclosed aspects may also be implemented as instructions carried by or stored on one or more computer-readable storage media, which may be read and executed by one or more processors. Such instructions may be referred to as a computer program product. As discussed herein, computer-readable media refers to any media that can be accessed by a computing device. By way of example, and not limitation, computer readable media may comprise computer storage media and communication media.
Computer storage media refers to any media that can be used to store computer-readable information. By way of example, and not limitation, computer storage media may include RAM, ROM, electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disc read-only memory (CD-ROM), Digital Video Disc (DVD) or other optical disc storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, and any other volatile or non-volatile, removable or non-removable media implemented in any technology. Computer storage media excludes signals per se and transitory forms of signal transmission.
Communication media refers to any media that may be used for the communication of computer-readable information. By way of example, and not limitation, communication media may include coaxial cables, fiber optic cables, air, or any other medium suitable for communication of electrical, optical, Radio Frequency (RF), infrared, acoustic, or other types of signals.
Examples of the invention
Illustrative examples of the techniques disclosed herein are provided below. Embodiments of the techniques may include any one or more of the examples described below, as well as any combination of these examples.
Example 1 is a test and measurement instrument switch matrix comprising: a first cable comprising a central conductor and a shield connected to a first output of the test and measurement instrument; a second cable comprising a central conductor and a shield connected to a second output of the test and measurement instrument; a third cable comprising a central conductor connected to the device under test and a shielding; and a fourth cable comprising a center conductor connected to the device under test and a shielding layer connected to the device under test.
Example 2 is the test and measurement instrument switch matrix of example 1, wherein the outer shielding layers of each of the first, second, third, and fourth cables are connected to each other and to a second output of the test and measurement instrument.
Example 3 is the test and measurement instrument switch matrix of any one of examples 1 and 3, further comprising: a fifth cable comprising a shielding and a center conductor connected to the first input of the test and measurement instrument; a sixth cable comprising a shielding and a center conductor connected to a second input of the test and measurement instrument; a seventh cable comprising a center conductor and a shield connected to the device under test; and an eighth cable comprising a center conductor connected to the device under test and a shielding connected to the device under test and to the shielding of the fourth cable.
Example 4 is the test and measurement instrument switch matrix of example 3, wherein the shield layer of the fifth cable is connected to the first output of the test and measurement instrument.
Example 5 is the test and measurement instrument switch matrix of example 4, further comprising a first switch connecting the shield layer of the fifth cable to a first output of the test and measurement instrument.
Example 6 is the test and measurement instrument switch matrix of example 5, further comprising a second switch to connect the shielding of the first cable and the shielding of the fifth cable to the first shielding signal.
Example 7 is the test and measurement instrument switch matrix of example 6, further comprising a third switch to connect a shield layer of the second cable and a shield layer of the sixth cable to the second shield signal.
Example 8 is the test and measurement instrument switch matrix of any one of examples 1 to 7, further comprising a first switch to connect the shield layer of the first cable to the first output; a second switch to connect the protection layer of the first cable to the first protection signal; a third switch to connect the shield of the second cable to the second output; and a fourth switch to connect the shielding layer of the second cable to the second shielding signal.
Example 9 is the test and measurement instrument switch matrix of any one of examples 1 to 8, further comprising a first switch to connect the center conductor of the first cable to a first output of the test and measurement instrument; and a second switch to connect the center conductor of the second cable to a second output of the test and measurement instrument.
Example 10 is the test and measurement instrument switch matrix of example 9, further comprising a third switch to connect the center conductor of the first cable to a first input of the test and measurement instrument; and a fourth switch to connect the center conductor of the second cable to a second input of the test and measurement instrument.
Example 11 is the test and measurement instrument switch matrix of any of examples 1 to 10, further comprising a first switch to connect the shielding of the third cable to the device under test; and a second switch to connect the shielding of the fourth cable to the device under test.
Example 12 is the test and measurement instrument switch matrix of any one of examples 1 to 11, wherein each of the first, second, third, and fourth wires is a triaxial wire.
Example 13 is a test and measurement system, comprising: the test and measurement switch matrix of example 1; and a test and measurement instrument connected to the test and measurement switch matrix, the test and measurement instrument including a first switch to connect the shield of the first cable to the first output; a second switch to connect the protection layer of the first cable to the first protection signal; a third switch to connect the shield of the second cable to the second output; and a fourth switch to connect the shielding layer of the second cable to the second shielding signal.
Example 14 is the test and measurement system of example 13, wherein the test and measurement instrument further comprises: a fourth switch to connect the center conductor of the first cable to a first output of the test and measurement instrument; and a fifth switch to connect the center conductor of the second cable to a second output of the test and measurement instrument.
Example 15 is the test and measurement system of example 14, wherein the test and measurement instrument further comprises: a sixth switch to connect the center conductor of the first cable to a first input of the test and measurement instrument; and a seventh switch to connect the center conductor of the second cable to a second input of the test and measurement instrument.
Example 16 is the test and measurement system of any one of examples 13 to 15, wherein the test and measurement instrument further comprises one or more processors configured to: when the current of the first output or the second output exceeds a threshold value, the shield layer of the first cable is connected to the first output by the first switch, and the shield layer of the second cable is connected to the second output by the third switch.
Example 17 is a method for operating a switch matrix connected to a test and measurement instrument and a device under test, the method comprising transmitting a first output of the test and measurement instrument to the device under test through a center conductor and a shield of a first cable; and transmitting a second output of the test and measurement instrument to the device under test through the center conductor and the shielding of the second cable.
Example 18 is the method of example 17, further comprising switching a shield layer of the first cable to transmit the first shield signal.
Example 19 is the method of example 18, wherein switching the shield layer of the first cable to transmit the first shield signal comprises: switching a shielding layer of the first cable to transmit a first shielding signal when the current of the first output is below a threshold.
Example 20 is the method of any one of examples 17 to 19, further comprising switching a center conductor of the first cable to a first input of a test and measurement instrument; and switching the center conductor of the second cable to a second input of the test and measurement instrument.
The previously described versions of the disclosed subject matter have many advantages that are described or are apparent to one of ordinary skill. Even so, these advantages or features are not required in all versions of the disclosed apparatus, systems or methods.
Additionally, this written description addresses specific features. It is to be understood that the disclosure in this specification includes all possible combinations of those specific features. Where a particular feature is disclosed in the context of a particular aspect or example, that feature may also be used, to the extent possible, in the context of other aspects and examples.
Further, when a method having two or more defined steps or operations is referred to in this application, the defined steps or operations may be performed in any order or simultaneously, unless the context excludes those possibilities.
While specific examples of the invention have been illustrated and described for purposes of illustration, it will be appreciated that various modifications may be made without deviating from the spirit and scope of the invention. Accordingly, the invention is not to be restricted except in light of the attached claims.

Claims (20)

1. A test and measurement instrument switch matrix comprising:
a first cable comprising a central conductor and a shield connected to a first output of the test and measurement instrument;
a second cable comprising a central conductor and a shielding connected to a second output of the test and measurement instrument;
a third cable comprising a central conductor connected to the device under test and a shielding; and
a fourth cable comprising a center conductor connected to the device under test and a shielding layer connected to the device under test.
2. The test and measurement instrument switch matrix of claim 1, wherein the outer shield of each of the first, second, third, and fourth cables are connected to each other and to the second output of the test and measurement instrument.
3. The test and measurement instrument switch matrix of claim 1, further comprising:
a fifth cable comprising a shielding and a center conductor connected to the first input of the test and measurement instrument;
a sixth cable comprising a shielding and a center conductor connected to a second input of the test and measurement instrument;
a seventh cable comprising a center conductor and a shield connected to the device under test; and
an eighth cable comprising a center conductor connected to the device under test and a shielding connected to the device under test and to the shielding of the fourth cable.
4. The test and measurement instrument switch matrix of claim 3, wherein the shield of the fifth cable is connected to the first output of the test and measurement instrument.
5. The test and measurement instrument switch matrix of claim 4, further comprising: a first switch to connect the shield of the fifth cable to a first output of the test and measurement instrument.
6. The test and measurement instrument switch matrix of claim 5, further comprising: a second switch to connect the shield layer of the first cable and the shield layer of the fifth cable to the first shield signal.
7. The test and measurement instrument switch matrix of claim 6, further comprising: a third switch to connect the shield layer of the second cable and the shield layer of the sixth cable to the second shield signal.
8. The test and measurement instrument switch matrix of claim 1, further comprising:
a first switch to connect the shield of the first cable to the first output;
a second switch to connect the protection layer of the first cable to the first protection signal;
a third switch to connect the shield of the second cable to the second output; and
a fourth switch to connect the shield layer of the second cable to the second shield signal.
9. The test and measurement instrument switch matrix of claim 1, further comprising:
a first switch to connect the center conductor of the first cable to a first output of the test and measurement instrument; and
a second switch to connect the center conductor of the second cable to a second output of the test and measurement instrument.
10. The test and measurement instrument switch matrix of claim 9, further comprising:
a third switch to connect the center conductor of the first cable to a first input of the test and measurement instrument; and
a fourth switch to connect the center conductor of the second cable to a second input of the test and measurement instrument.
11. The test and measurement instrument switch matrix of claim 1, further comprising:
a first switch to connect the shield of the third cable to the device under test; and
a second switch to connect the shield of the fourth cable to the device under test.
12. The test and measurement instrument switch matrix of claim 1, wherein each of the first, second, third, and fourth cables is a triaxial cable.
13. A test and measurement system comprising:
the test and measurement switch matrix of claim 1; and
a test and measurement instrument connected to a test and measurement switch matrix, the test and measurement instrument comprising:
a first switch to connect the shield of the first cable to the first output;
a second switch to connect the protection layer of the first cable to the first protection signal;
a third switch to connect the shield of the second cable to the second output; and
a fourth switch to connect the shield layer of the second cable to the second shield signal.
14. The test and measurement system of claim 13, wherein the test and measurement instrument further comprises:
a fourth switch to connect the center conductor of the first cable to a first output of the test and measurement instrument; and
a fifth switch to connect the center conductor of the second cable to a second output of the test and measurement instrument.
15. The test and measurement system of claim 14, wherein the test and measurement instrument further comprises:
a sixth switch to connect the center conductor of the first cable to a first input of the test and measurement instrument; and
a seventh switch to connect the center conductor of the second cable to a second input of the test and measurement instrument.
16. The test and measurement system of claim 13, wherein the test and measurement instrument further comprises one or more processors configured to: when the current of the first output or the second output exceeds a threshold value, the shield layer of the first cable is connected to the first output by the first switch, and the shield layer of the second cable is connected to the second output by the third switch.
17. A method for operating a switch matrix connected to a test and measurement instrument and a device under test, the method comprising:
transmitting a first output of the test and measurement instrument to the device under test through the center conductor and the shielding of the first cable; and
the second output of the test and measurement instrument is transmitted to the device under test through the center conductor and the shielding of the second cable.
18. The method of claim 17, further comprising switching a shield layer of the first cable to transmit the first shield signal.
19. The method of claim 18, wherein switching the shield layer of the first cable to transmit the first shield signal comprises: when the current of the first output is lower than the threshold value, the protection layer of the first cable is switched to transmit a first protection signal.
20. The method of claim 17, further comprising:
switching a center conductor of a first cable to a first input of a test and measurement instrument; and
the center conductor of the second cable is switched to a second input of the test and measurement instrument.
CN202010504644.XA 2019-06-06 2020-06-05 Interconnect system with high current and low leakage capability Pending CN112051461A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201962858291P 2019-06-06 2019-06-06
US62/858291 2019-06-06
US16/886,229 US11927605B2 (en) 2019-06-06 2020-05-28 Interconnect system with high current and low leakage capability
US16/886229 2020-05-28

Publications (1)

Publication Number Publication Date
CN112051461A true CN112051461A (en) 2020-12-08

Family

ID=73459780

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010504644.XA Pending CN112051461A (en) 2019-06-06 2020-06-05 Interconnect system with high current and low leakage capability

Country Status (2)

Country Link
CN (1) CN112051461A (en)
DE (1) DE102020114786A1 (en)

Also Published As

Publication number Publication date
DE102020114786A1 (en) 2020-12-10

Similar Documents

Publication Publication Date Title
US7388366B2 (en) Test system connection system with triaxial cables
JP2006329995A (en) Channel switching circuit
US11604219B2 (en) Automatic test equipement having fiber optic connections to remote servers
US11927605B2 (en) Interconnect system with high current and low leakage capability
KR101743027B1 (en) Break Out Box
US11959937B2 (en) Triaxial power and control systems and methods
CN112051461A (en) Interconnect system with high current and low leakage capability
US8410804B1 (en) Measurement system with high frequency ground switch
US9615760B2 (en) Multiple bipolar sampling
EP3761466A1 (en) Cable assist device, and submarine cable assist system
US10498113B2 (en) Methods and devices for automatic communication addressing of load center breakers
JP2007529748A (en) Electrical connector for semiconductor device test fixture and test assembly
CN105510757B (en) Three-axis DC-AC connection system
US20040237013A1 (en) Apparatus and method for sensing emulator cable orientation while providing signal drive capability
US10884067B2 (en) Modification of test measurement signals for protective devices for electric power networks
US9176189B2 (en) Connection system and simulator using such a connection system
EP0309802A2 (en) Interface circuit for connecting test instrumentation
KR102296971B1 (en) Quality measuring device, measuring method thereof and recording medium thereof
US10823780B1 (en) Testing an integrated circuit receiver in a package using a varying analog voltage
US11143716B2 (en) High-voltage power source device and notification method
CN211149270U (en) Debugging circuit
CN112924771A (en) Triaxial power and control system and method
JP5297562B2 (en) Probe station with improved interconnection
KR20180134177A (en) Semiconductor Test System and Test Method
US6269114B1 (en) Monitor particularly suited for Naval Tactical Data System (NTDS) interfaces types A and B

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination