CN112048747B - Surface source black body and preparation method thereof - Google Patents
Surface source black body and preparation method thereof Download PDFInfo
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- CN112048747B CN112048747B CN202010782453.XA CN202010782453A CN112048747B CN 112048747 B CN112048747 B CN 112048747B CN 202010782453 A CN202010782453 A CN 202010782453A CN 112048747 B CN112048747 B CN 112048747B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 116
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 52
- 230000003647 oxidation Effects 0.000 claims abstract description 40
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 40
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 31
- 239000010407 anodic oxide Substances 0.000 claims abstract description 21
- 238000012986 modification Methods 0.000 claims abstract description 21
- 230000004048 modification Effects 0.000 claims abstract description 21
- 235000019270 ammonium chloride Nutrition 0.000 claims abstract description 19
- 238000004140 cleaning Methods 0.000 claims abstract description 13
- 238000004040 coloring Methods 0.000 claims abstract description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 34
- 238000005452 bending Methods 0.000 claims description 24
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 17
- 238000007743 anodising Methods 0.000 claims description 17
- 238000004381 surface treatment Methods 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 15
- 230000003746 surface roughness Effects 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- 238000005260 corrosion Methods 0.000 claims description 8
- 230000007797 corrosion Effects 0.000 claims description 8
- 239000003112 inhibitor Substances 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 18
- 238000002048 anodisation reaction Methods 0.000 description 11
- 239000003086 colorant Substances 0.000 description 7
- 238000005459 micromachining Methods 0.000 description 5
- 238000005488 sandblasting Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 238000002791 soaking Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 238000005422 blasting Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002103 nanocoating Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/12—Anodising more than once, e.g. in different baths
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
- C25D11/08—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing inorganic acids
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/24—Chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/26—Anodisation of refractory metals or alloys based thereon
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/52—Radiation pyrometry, e.g. infrared or optical thermometry using comparison with reference sources, e.g. disappearing-filament pyrometer
- G01J5/53—Reference sources, e.g. standard lamps; Black bodies
Abstract
The application relates to the field of blackbodies and discloses a surface source blackbody and a preparation method thereof. The preparation method of the surface source black body comprises the following steps: providing a substrate, carrying out first anodic oxidation treatment on the substrate, and removing an anodic oxide film on the surface of the substrate after the first anodic oxidation treatment; performing second anodic oxidation treatment on the substrate without the anodic oxide film, wherein the modification treatment solution used in the second anodic oxidation treatment process is a solution containing sulfuric acid and ammonium chloride; and sequentially cleaning and coloring the substrate subjected to the second anodic oxidation treatment to obtain the surface source black body. The surface source black body has the advantages of low cost, simple processing technology and high emissivity.
Description
Technical Field
The application relates to the field of blackbodies, in particular to a surface source blackbody and a preparation method thereof.
Background
The surface source black body is used as a standard radiation source of an infrared spectrum section and is widely applied to calibration of an infrared remote sensor and a thermal imager. With the development of infrared technology, the application of the infrared technology is more and more extensive, and the temperature range is further expanded.
The emissivity of the traditional surface source black body is generally between 0.95 and 0.97, and in order to improve the emissivity of the surface source black body, the surface source black body is improved by two ways at present. One method is to improve the emissivity of the surface source black body by preparing the carbon nano coating, and the method is realized by growing the carbon nano tubes on the surface of the substrate in a vacuum environment, and the emissivity of the prepared surface source black body can reach over 0.99. The second method is to process a cone structure on the surface of the substrate, but because the cone structure has a gap, the thermal resistance of the surface source black body can be increased, thereby reducing the emissivity of the surface source black body.
Disclosure of Invention
The application discloses a surface source black body and a preparation method thereof.
In order to achieve the purpose, the application provides the following technical scheme:
a preparation method of a surface source black body comprises the following steps:
providing a substrate, carrying out first anodic oxidation treatment on the substrate, and removing an anodic oxide film on the surface of the substrate after the first anodic oxidation treatment;
and carrying out second anodic oxidation treatment on the substrate with the anodic oxide film removed, wherein the modification treatment liquid used in the second anodic oxidation treatment process is a solution containing sulfuric acid and ammonium chloride.
Further, the preparation method further comprises the following steps: and sequentially cleaning and coloring the substrate subjected to the second anodic oxidation treatment to obtain the surface source black body.
Furthermore, in the modification treatment liquid, the concentration of the sulfuric acid is 150-260g/L, and the concentration of the ammonium chloride is 0.3-1.5 g/L.
Further, the production method may further include a step of subjecting the substrate to a surface treatment before the first anodizing treatment; and after the surface treatment is carried out on the substrate, the surface roughness of the substrate is 3-50 microns.
Further, the surface treatment includes laser micro-machining treatment, shot blasting treatment, or sand blasting treatment.
Further, the treatment liquid used in the first anodic oxidation treatment is a sulfuric acid solution, and the concentration of the sulfuric acid solution is 150-170 g/L.
Further, in the step of removing the anodic oxide film on the surface of the substrate, the used film remover is a solution containing phosphoric acid and an aluminum corrosion inhibitor.
A surface source black body is obtained by the preparation method.
Further, the substrate is provided with refraction holes extending from the surface of the substrate to the interior of the substrate, and the refraction holes are blind holes;
from the surface of the substrate to the inner direction of the substrate, a first refraction hole and a second refraction hole which are sequentially arranged exist in the refraction holes, and the aperture of the first refraction hole is larger than that of the second refraction hole.
Further, the substrate is provided with refraction holes extending from the surface of the substrate to the interior of the substrate, and the refraction holes are blind holes;
the bending holes are from the surface of the substrate to the inner direction of the substrate, the first bending holes, the second bending holes and the third bending holes are sequentially arranged in the bending holes, and the apertures of the first bending holes, the second bending holes and the third bending holes are sequentially reduced.
Further, the emissivity of the surface source black body is greater than or equal to 0.98.
By adopting the technical scheme of the application, the beneficial effects are as follows:
in the preparation method, after the first anodization treatment is performed on the substrate, the second anodization treatment is performed, wherein the modification treatment solution used in the second anodization treatment process is a solution containing sulfuric acid and ammonium chloride. After the first anodizing treatment is performed on the substrate, a certain refraction hole can be formed on the surface of the substrate, and then after the first anodizing treatment is performed by using a treatment solution containing sulfuric acid and ammonium chloride, the formed refraction hole can be subjected to secondary processing to form a smaller refraction hole in the refraction hole, so that the finally formed refraction hole has a three-dimensional structure of large hole sleeves and small holes. The structure can refract and absorb incident light for multiple times and reduce reflection, so that the emissivity of the surface source black body obtained by coloring the substrate can reach over 0.98. The anodic oxidation process used by the preparation method is stable and reliable, the processing is simple, and the emissivity of the prepared surface source black body is high.
Drawings
FIG. 1 is a sectional micrograph of a planar blackbody of example 1 of the present application at a magnification of 100;
fig. 2 is a sectional micrograph of the planar blackbody of example 1 of the present application at 600 times.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: in the present application, all embodiments and preferred methods mentioned herein can be combined with each other to form new solutions, if not specifically stated. In the present application, all the technical features mentioned herein as well as preferred features may be combined with each other to form new technical solutions, if not specifically stated. In the present application, percentages (%) or parts refer to percent by weight or parts by weight relative to the composition, unless otherwise specified. In the present application, the components referred to or the preferred components thereof may be combined with each other to form new embodiments, if not specifically stated. In this application, unless otherwise stated, the numerical range "a-b" represents a shorthand representation of any combination of real numbers between a and b, where a and b are both real numbers. For example, a numerical range of "6 to 22" means that all real numbers between "6 to 22" have been listed herein, and "6 to 22" is simply a shorthand representation of the combination of these values. The "ranges" disclosed herein may be in the form of lower limits and upper limits, and may be one or more lower limits and one or more upper limits, respectively. In the present application, the individual reactions or process steps may be performed sequentially or in sequence, unless otherwise indicated. Preferably, the reaction processes herein are carried out sequentially.
Unless otherwise defined, technical and scientific terms used herein have the same meaning as is familiar to those skilled in the art. In addition, any methods or materials similar or equivalent to those described herein can also be used in the present application.
In a first aspect, the present application provides a method for preparing a surface source black body, including the following steps:
providing a substrate, carrying out first anodic oxidation treatment on the substrate, and removing an anodic oxide film on the surface of the substrate after the first anodic oxidation treatment;
and carrying out second anodic oxidation treatment on the substrate with the anodic oxide film removed, wherein the modification treatment liquid used in the second anodic oxidation treatment process is a solution containing sulfuric acid and ammonium chloride.
In an embodiment of the application, the preparation method further includes sequentially cleaning and coloring the substrate subjected to the second anodic oxidation treatment to obtain the surface source black body.
In the preparation method of the embodiment of the application, after the first anodization treatment is performed on the substrate, the second anodization treatment is performed, wherein the modification treatment solution used in the second anodization treatment process is a solution containing sulfuric acid and ammonium chloride. After the first anodizing treatment is performed on the substrate, a certain refraction hole can be formed on the surface of the substrate, and then after the first anodizing treatment is performed by using a treatment solution containing sulfuric acid and ammonium chloride, the formed refraction hole can be subjected to secondary processing to form a smaller refraction hole in the refraction hole, so that the finally formed refraction hole has a three-dimensional structure of large hole sleeves and small holes. The structure can refract and absorb incident light for multiple times and reduce reflection, so that the emissivity of the surface source black body obtained by coloring the substrate can reach over 0.98. The anodic oxidation process used by the preparation method is stable and reliable, the processing is simple, and the emissivity of the prepared surface source black body is high.
The substrate includes, but is not limited to, an aluminum plate, an aluminum alloy plate, or a titanium alloy plate.
In one embodiment of the present application, the concentration of the sulfuric acid in the modification treatment solution is 150-260g/L, and the concentration of the ammonium chloride is 0.3-1.5 g/L.
Typical, but not limiting, concentrations of sulfuric acid in the modifying treatment solution may be, for example, 150g/L, 160g/L, 170g/L, 180g/L, 190g/L, 200g/L, 210g/L, 220g/L, 230g/L, 240g/L, 250g/L, or 260 g/L.
Typical, but non-limiting, concentrations of ammonium chloride in the modifying treatment solution can be, for example, 0.3g/L, 0.4g/L, 0.5g/L, 0.6g/L, 0.7g/L, 0.8g/L, 0.9g/L, 1.0g/L, 1.1g/L, 1.2g/L, 1.3g/L, 1.4g/L, or 1.5 g/L.
By selecting the modified treatment fluid with a specific proportion, the refraction hole can be further etched on the basis of the first anodic oxidation treatment, so that deeper and smaller refraction holes are formed.
In one embodiment of the present application, before the first anodizing treatment, the method further includes: a step of performing surface treatment on the substrate; and after the surface treatment is carried out on the substrate, the surface roughness of the substrate is 3-50 microns. In a further embodiment, the substrate has a surface roughness of 3-30 microns after the substrate is surface treated.
The surface treatment is carried out on the substrate, the roughness of the surface of the substrate can be increased, a first refraction hole is formed, after the surface-treated substrate is subjected to the first anodic oxidation treatment, a second refraction hole can be formed in the hole of the first refraction hole, and then a third refraction hole can be formed in the hole of the second refraction hole after the second anodic oxidation treatment is carried out, so that the formed refraction hole has a three-order hole structure. The structure is more favorable for the refraction and absorption of light rays, thereby further improving the emissivity of the surface source black body.
The surface roughness of the substrate after the surface treatment may be, for example, typically but not limited to, 3 microns, 5 microns, 8 microns, 10 microns, 12 microns, 14 microns, 16 microns, 18 microns, 20 microns, 22 microns, 24 microns, 26 microns, 28 microns, 30 microns, 32 microns, 35 microns, 38 microns, 40 microns, 45 microns, or 50 microns.
Wherein the surface treatment includes, but is not limited to, laser micro-machining, shot blasting, or sand blasting. The roughness of the substrate can be in the range of 3-50 microns, further in the range of 3-30 microns, and further in the range of 5-25 microns by surface treatment. The emissivity of the resulting planar blackbody can be further improved when the roughness of the substrate surface is in the range of 5-25 microns, for example 10-25 microns.
In an embodiment of the present application, the treatment liquid used in the first anodic oxidation treatment is a sulfuric acid solution, and the concentration of the sulfuric acid solution is 150-.
By using the treatment liquid, oxidation treatment can be performed on the substrate, and the surface of the substrate can be etched to form the perforations.
In one embodiment of the present application, the stripping agent used in removing the anodic oxide film on the substrate surface is a solution containing phosphoric acid and an aluminum corrosion inhibitor. The aluminum corrosion inhibitor may be, for example, chromic anhydride. Wherein, in the film remover, the volume concentration of phosphoric acid is 3-8%, and the concentration of the aluminum corrosion inhibitor is 2-10 g/L. In the process of removing the oxide film, the temperature is controlled between 55 ℃ and 80 ℃ for 5min to 15 min.
The concentration of phosphoric acid in the stripping agent may be, for example, 3%, 4%, 5%, 6%, 7% or 8% by volume, which is typical but not limiting. Typical, but non-limiting, concentrations of aluminum corrosion inhibitors may be, for example, 2g/L, 3g/L, 4g/L, 5g/L, 6g/L, 7g/L, 8g/L, 9g/L, or 10 g/L.
By selecting the film remover with specific concentration, the removal of the anodic oxide film can be facilitated, and meanwhile, the substrate can not be damaged, so that the second anodic oxidation treatment can be conveniently carried out on the substrate.
In one embodiment of the present application, after the second anodization, a cleaning solution used in a cleaning process of the substrate is a phosphoric acid solution. The residual modification treatment liquid in the refraction hole can be effectively removed by adopting the phosphoric acid solution. In this embodiment, the concentration of the phosphoric acid solution may be, for example, 30 to 120 g/L. Wherein, the concentration of phosphoric acid during the cleaning process is typically but not limited to 30g/L, 40g/L, 50g/L, 60g/L, 70g/L, 80g/L, 90g/L, 100g/L, 110g/L or 120 g/L.
Wherein, in the cleaning process, the cleaning temperature can be 65-75 ℃ for example. In addition, the substrate may be cleaned a plurality of times according to the size of the perforation during the cleaning.
In one embodiment of the present application, the colorant used during the coloring process is a black colorant, such as Orye 415AN colorant, Craine MLW colorant, and the like.
In a second aspect, the present application provides a planar blackbody obtained by the preparation method of the first aspect of the present application.
The surface source black body has a three-dimensional structure with large holes and small holes. The structure can refract and absorb incident light for multiple times and reduce reflection, so that the emissivity of the surface source black body obtained by coloring the substrate can reach over 0.98.
In one embodiment of the present application, the substrate presents refraction holes extending from the substrate surface to the interior thereof, the refraction holes being blind holes; from the surface of the substrate to the inner direction of the substrate, a first refraction hole and a second refraction hole which are sequentially arranged exist in the refraction holes, and the aperture of the first refraction hole is larger than that of the second refraction hole. This structure can be obtained by subjecting the substrate to the first anodizing treatment and the second anodizing treatment in this order.
In one embodiment of the present application, the substrate presents refraction holes extending from the substrate surface to the interior thereof, the refraction holes being blind holes; the bending holes are from the surface of the substrate to the inner direction of the substrate, the first bending holes, the second bending holes and the third bending holes are sequentially arranged in the bending holes, and the apertures of the first bending holes, the second bending holes and the third bending holes are sequentially reduced.
This structure can be obtained by subjecting the substrate to surface treatment, first anodizing treatment, and second anodizing treatment in this order. The refraction absorptivity of light can be further improved by increasing the number of different small holes in the refraction hole, and the emissivity of the surface source black body is further improved.
In one embodiment of the present application, the emissivity of the planar source black body is equal to or greater than 0.98.
The following will explain the present application in further detail with reference to examples and comparative examples.
Example 1
The embodiment is a surface source black body, and the preparation process thereof is as follows:
step S1) of using Al 6063 as a substrate, and performing laser micromachining or sand blasting on the substrate to make the surface roughness of the substrate 10 um;
step S2) first anodization: placing the substrate subjected to surface roughness treatment into a treatment solution for first anodic oxidation to obtain a substrate containing an anodic oxide film; wherein, the treating fluid used in the treating process is a sulfuric acid solution with the concentration of 160 g/L;
step S3) removing the anodic oxide film: removing the anodic oxide film from the substrate containing the anodic oxide film in a film remover containing phosphoric acid and an aluminum corrosion inhibitor, wherein the purpose is to form 'hole cores' on the surface by chemically corroding the oxide film;
step S4) second anodization: placing the substrate with the anode oxide film removed into an anodic oxidation tank containing modified treatment liquid, and carrying out modified anodic oxidation treatment to obtain a modified anodic oxidation substrate; wherein the modification treatment liquid used in the modification anodic oxidation treatment is a solution containing sulfuric acid and ammonium chloride, the concentration of the sulfuric acid is 200g/L, and the concentration of the ammonium chloride is 0.8 g/L;
step S5) putting the substrate subjected to the second anodic oxidation treatment into a phosphoric acid solution, soaking at 70 ℃, then cleaning, and forming a three-dimensional structure with big holes and small holes on the surface; wherein the concentration of the phosphoric acid solution is 60 g/L.
Step S6) the cleaned substrate was colored with the aoye 415AN colorant to obtain a surface source black body.
As shown in fig. 1 and 2 below, the microscope is a planar blackbody microscope. Fig. 1 is an enlarged view of 100 times, and fig. 2 is an enlarged view of 600 times.
Example 2
This example is a planar blackbody, and the manufacturing process thereof is different from that of example 1 in that, in this example, after the surface treatment, the surface roughness of the substrate is 25um, and the other manufacturing processes are the same as those of example 1.
Example 3
This embodiment is a planar blackbody, and the manufacturing process thereof is different from that of embodiment 1 in that, in this embodiment, after the surface treatment, the surface roughness of the substrate is 40um, and the other manufacturing processes are the same as those of embodiment 1.
Example 4
This embodiment is a planar blackbody, and the manufacturing process thereof is different from that of embodiment 1 in that, in this embodiment, after the surface treatment, the surface roughness of the substrate is 50um, and the other manufacturing processes are the same as those of embodiment 1.
Example 5
This comparative example is a plane source black body, and the manufacturing process thereof is different from that of example 1 in that the surface roughness of the substrate after the surface treatment is 80um in this comparative example, and the other manufacturing processes are the same as those of example 1.
Example 6
This example is a planar blackbody, and the preparation process thereof is different from that of example 1 in that the modification treatment solution used in the second anodizing treatment process in this example is different from that of example 1, and the other preparation processes are the same as those of example 1. In this example, the concentration of sulfuric acid and the concentration of ammonium chloride in the liquid for the modification treatment were 185g/L and 0.4g/L, respectively.
Example 7
This example is a planar blackbody, and the preparation process thereof is different from that of example 1 in that the modification treatment solution used in the second anodizing treatment process in this example is different from that of example 1, and the other preparation processes are the same as those of example 1. In this example, the concentration of sulfuric acid and the concentration of ammonium chloride in the liquid for the modification treatment were 240g/L and 1.3g/L, respectively.
Comparative example 1
The comparative example is a surface source black body, and the preparation process is as follows:
step S1) of using Al 6063 as a substrate, and performing laser micromachining or sand blasting on the substrate to make the surface roughness of the substrate 10 um;
step S2) anodizing: placing the substrate subjected to surface roughness treatment into a treatment solution for first anodic oxidation to obtain a substrate containing an anodic oxide film; wherein, the treating fluid used in the treating process is a sulfuric acid solution with the concentration of 160 g/L;
step S3) cleaning: putting the substrate subjected to anodic oxidation treatment into a phosphoric acid solution, soaking at 70 ℃ and then cleaning; wherein the concentration of the phosphoric acid solution is 60 g/L;
step S4) the cleaned substrate was colored with the aoye 415AN colorant to obtain a surface source black body.
Comparative example 2
The comparative example is a surface source black body, and the preparation process is as follows:
step S1) of using Al 6063 as a substrate, and performing laser micromachining or sand blasting on the substrate to make the surface roughness of the substrate 10 um;
step S2) first anodization: placing the substrate subjected to surface roughness treatment into a treatment solution for first anodic oxidation to obtain a substrate containing an anodic oxide film; wherein, the treating fluid used in the treating process is a sulfuric acid solution with the concentration of 160 g/L;
step S3) removing the anodic oxide film: removing the anodic oxide film from the substrate containing the anodic oxide film in a film remover containing phosphoric acid and an aluminum corrosion inhibitor, wherein the purpose is to form 'hole cores' on the surface by chemically corroding the oxide film;
step S4) second anodization: repeating the step of the first anodizing treatment;
step S5) putting the substrate subjected to the second anodic oxidation treatment into a phosphoric acid solution, soaking at 70 ℃, and then washing; wherein the concentration of the phosphoric acid solution is 60 g/L.
Step S6) the cleaned substrate was colored with the aoye 415AN colorant to obtain a surface source black body.
Comparative example 3
This comparative example is a plane-source black body, and its manufacturing process is different from that of example 1 in that the modification treatment liquid used in the second anodizing treatment process in this comparative example is different from that of example 1, ammonium chloride is not contained in the modification treatment liquid used in this comparative example, and the other manufacturing process is the same as that of example 1.
Emissivity tests were performed on the planar blackbodies provided in examples 1 to 7 and comparative examples 1 to 3, and the test results are shown in table 1. Wherein, the test emissivity is tested by a fire E40 comparison method.
TABLE 1
| Serial number | Emissivity |
| Example 1 | 0.982 |
| Example 2 | 0.975 |
| Example 3 | 0.972 |
| Example 4 | 0.967 |
| Example 5 | 0.961 |
| Example 6 | 0.978 |
| Example 7 | 0.973 |
| Comparative example 1 | 0.912 |
| Comparative example 2 | 0.922 |
| Comparative example 3 | 0.928 |
As can be seen from the comparative data of examples 1 to 4 and example 5, when the roughness of the substrate is greater than 50um, for example, 80um in example 5, the emissivity of the resulting planar source black body is lower than that of the planar source black bodies in examples 1 to 4.
From the comparative data of examples 1, 6 and 7, it can be seen that the emissivity of the obtained planar blackbody changes when the concentrations of sulfuric acid and ammonium chloride in the modifying treatment solution are changed.
As can be seen from the data of examples 1 to 7 and comparative examples 1 to 3, when the substrate is anodized only once, or anodized twice using the same anodizing process, or anodized a second time using a treatment solution not containing ammonium chloride, the emissivity of the resulting planar source black body is lower than that of the planar source black bodies of examples 1 to 7.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (8)
1. The preparation method of the surface source black body is characterized by comprising the following steps:
carrying out first anodic oxidation treatment on the substrate, and removing an anodic oxide film on the surface of the substrate after the first anodic oxidation treatment;
performing second anodic oxidation treatment on the substrate without the anodic oxide film, wherein the modification treatment solution used in the second anodic oxidation treatment process is a solution containing sulfuric acid and ammonium chloride; in the modification treatment liquid, the concentration of the sulfuric acid is 150-260g/L, and the concentration of the ammonium chloride is 0.3-1.5 g/L;
and sequentially cleaning and coloring the substrate subjected to the second anodic oxidation treatment to obtain the surface source black body.
2. The production method according to claim 1, further comprising a step of subjecting the substrate to a surface treatment before the first anodizing treatment;
and after the surface treatment is carried out on the substrate, the surface roughness of the substrate is 3-50 microns.
3. The preparation method according to claim 1 or 2, characterized in that the treatment liquid used in the first anodic oxidation treatment is a sulfuric acid solution, and the concentration of the sulfuric acid solution is 150-170 g/L.
4. The method according to claim 3, wherein the stripping agent used for removing the anodic oxide film on the surface of the substrate is a solution containing phosphoric acid and an aluminum corrosion inhibitor.
5. A surface-source black body obtained by the production method according to any one of claims 1 to 4.
6. The planar blackbody as claimed in claim 5, wherein said substrate has refraction holes extending from the surface of said substrate to the inside thereof, said refraction holes being blind holes;
from the surface of the substrate to the inner direction of the substrate, a first refraction hole and a second refraction hole which are sequentially arranged exist in the refraction holes, and the aperture of the first refraction hole is larger than that of the second refraction hole.
7. The planar blackbody as claimed in claim 5, wherein said substrate has refraction holes extending from the surface of said substrate to the inside thereof, said refraction holes being blind holes;
the bending holes are from the surface of the substrate to the inner direction of the substrate, the first bending holes, the second bending holes and the third bending holes are sequentially arranged in the bending holes, and the apertures of the first bending holes, the second bending holes and the third bending holes are sequentially reduced.
8. The planar blackbody according to any one of claims 5 to 7, wherein an emissivity of the planar blackbody is equal to or greater than 0.98.
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