CN112048156A - Epoxy SMC resin - Google Patents
Epoxy SMC resin Download PDFInfo
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- CN112048156A CN112048156A CN202010737253.2A CN202010737253A CN112048156A CN 112048156 A CN112048156 A CN 112048156A CN 202010737253 A CN202010737253 A CN 202010737253A CN 112048156 A CN112048156 A CN 112048156A
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- epoxy
- resin
- agent
- epoxy resin
- smc
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- 239000004593 Epoxy Substances 0.000 title claims abstract description 43
- 229920005989 resin Polymers 0.000 title claims abstract description 26
- 239000011347 resin Substances 0.000 title claims abstract description 26
- 239000003822 epoxy resin Substances 0.000 claims abstract description 23
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 23
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 15
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 11
- 239000003085 diluting agent Substances 0.000 claims abstract description 10
- 239000002562 thickening agent Substances 0.000 claims abstract description 9
- 239000000203 mixture Substances 0.000 claims abstract description 8
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 3
- 239000000945 filler Substances 0.000 claims abstract description 3
- -1 alicyclic amine Chemical class 0.000 claims description 12
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 12
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 10
- 239000004202 carbamide Substances 0.000 claims description 10
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 8
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- 150000001412 amines Chemical class 0.000 claims description 4
- 150000004982 aromatic amines Chemical class 0.000 claims description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 4
- 229920000768 polyamine Polymers 0.000 claims description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 4
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 claims description 4
- 239000000080 wetting agent Substances 0.000 claims description 4
- 125000002723 alicyclic group Chemical group 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 239000003638 chemical reducing agent Substances 0.000 claims description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 3
- 150000007524 organic acids Chemical class 0.000 claims description 3
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 2
- PISLZQACAJMAIO-UHFFFAOYSA-N 2,4-diethyl-6-methylbenzene-1,3-diamine Chemical compound CCC1=CC(C)=C(N)C(CC)=C1N PISLZQACAJMAIO-UHFFFAOYSA-N 0.000 claims description 2
- NWYDEWXSKCTWMJ-UHFFFAOYSA-N 2-methylcyclohexane-1,1-diamine Chemical compound CC1CCCCC1(N)N NWYDEWXSKCTWMJ-UHFFFAOYSA-N 0.000 claims description 2
- BKFWZZRDUKASOU-UHFFFAOYSA-N 2-n-cyclohexylpropane-1,2-diamine Chemical compound NCC(C)NC1CCCCC1 BKFWZZRDUKASOU-UHFFFAOYSA-N 0.000 claims description 2
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 claims description 2
- KOGSPLLRMRSADR-UHFFFAOYSA-N 4-(2-aminopropan-2-yl)-1-methylcyclohexan-1-amine Chemical compound CC(C)(N)C1CCC(C)(N)CC1 KOGSPLLRMRSADR-UHFFFAOYSA-N 0.000 claims description 2
- 239000005995 Aluminium silicate Substances 0.000 claims description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 2
- SVYKKECYCPFKGB-UHFFFAOYSA-N N,N-dimethylcyclohexylamine Chemical compound CN(C)C1CCCCC1 SVYKKECYCPFKGB-UHFFFAOYSA-N 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 claims description 2
- 239000004844 aliphatic epoxy resin Substances 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 235000012211 aluminium silicate Nutrition 0.000 claims description 2
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 claims description 2
- 239000002518 antifoaming agent Substances 0.000 claims description 2
- 239000000440 bentonite Substances 0.000 claims description 2
- 229910000278 bentonite Inorganic materials 0.000 claims description 2
- 235000012216 bentonite Nutrition 0.000 claims description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 2
- 235000010216 calcium carbonate Nutrition 0.000 claims description 2
- 239000007822 coupling agent Substances 0.000 claims description 2
- SSJXIUAHEKJCMH-UHFFFAOYSA-N cyclohexane-1,2-diamine Chemical compound NC1CCCCC1N SSJXIUAHEKJCMH-UHFFFAOYSA-N 0.000 claims description 2
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 2
- 239000002270 dispersing agent Substances 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 125000000524 functional group Chemical group 0.000 claims description 2
- 239000004519 grease Substances 0.000 claims description 2
- 150000002460 imidazoles Chemical class 0.000 claims description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 2
- GKQPCPXONLDCMU-CCEZHUSRSA-N lacidipine Chemical compound CCOC(=O)C1=C(C)NC(C)=C(C(=O)OCC)C1C1=CC=CC=C1\C=C\C(=O)OC(C)(C)C GKQPCPXONLDCMU-CCEZHUSRSA-N 0.000 claims description 2
- 239000006082 mold release agent Substances 0.000 claims description 2
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 239000011342 resin composition Substances 0.000 claims description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims 1
- 229960001124 trientine Drugs 0.000 claims 1
- 239000002904 solvent Substances 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 2
- 239000003677 Sheet moulding compound Substances 0.000 description 40
- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 description 12
- 238000003756 stirring Methods 0.000 description 12
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 239000003365 glass fiber Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 238000005096 rolling process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 239000002657 fibrous material Substances 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 1
- 239000011157 advanced composite material Substances 0.000 description 1
- ITZGNPZZAICLKA-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) 7-oxabicyclo[4.1.0]heptane-3,4-dicarboxylate Chemical compound C1C2OC2CC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 ITZGNPZZAICLKA-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007723 die pressing method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/02—Polyglycidyl ethers of bis-phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2471/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses an epoxy SMC resin, and relates to an epoxy resin composition suitable for SMC molding, which comprises components such as mixed epoxy resin, a diluent, an auxiliary agent, a filler, liquid epoxy resin, a curing agent, an accelerator, a thickening agent and the like. The epoxy composition does not contain solvents and other volatile substances, meets the environment-friendly requirement of low VOC of automobile part materials, has the characteristics of rapid forming at 150 ℃ for 5min and the like, and has the characteristics of high mechanical strength, good heat resistance and the like after forming.
Description
Technical Field
The invention relates to the field of epoxy resin materials, in particular to an epoxy SMC resin.
Background
The SMC die pressing process is an advanced composite material forming method, and the SMC sheet molding compound has low price and convenient use, can be quickly formed to press products with different specifications, sizes and shapes, and is more and more accepted by the market. At present, an SMC mainly takes unsaturated polyester resin as a matrix, but the unsaturated polyester resin SMC has the defects of poor temperature resistance and heat resistance, low structural strength and modulus and the like, and because a large amount of non-reactive diluent styrene is added into a system, the non-reactive diluent styrene volatilizes a large amount of pungent odor during molding, so that the physical health of a human body is influenced after the non-reactive diluent styrene is contacted for a long time, and the environment is also greatly polluted.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: the invention provides an epoxy SMC resin composition to solve the problems in the prior SMC material.
In order to solve the technical problems, the invention provides the following technical scheme:
an epoxy SMC resin, which consists of the following A, B and C components:
the component A comprises the following materials in parts by weight:
the component B comprises the following materials in parts by weight:
10-40 parts by mass of liquid epoxy resin;
4-15 parts of a curing agent;
2-8 parts of an accelerator;
the component C comprises the following materials in parts by weight:
4-10 parts of a thickening agent;
the thickener is at least one of a monoamine or polyamine having one or more primary and secondary amino groups, optionally the thickener has a molar ratio of the total primary and secondary amino groups to epoxy groups of the epoxy composition of greater than 0.05 and less than 0.3;
preferably, the thickener includes one or more of aliphatic amines, alicyclic amines and aromatic amines such as ethylenediamine, dipropylenetriamine, diethylenetriamine, triethylenetetramine, m-xylylenediamine, 1, 3-cyclohexyldimethylamine, N-aminoethylpiperazine, isophoronediamine, methylcyclohexanediamine, cyclohexylpropylenediamine, 1, 2-cyclohexanediamine, 3' -dimethyl-4, 4-diaminodicyclohexylmethane, menthanediamine, polyetheramine, diethyltoluenediamine and the like.
Preferably, the mixed epoxy resin is at least one of a liquid glycidyl ether type epoxy resin, a liquid glycidyl grease type epoxy resin, a liquid glycidyl amine type epoxy resin, a liquid aliphatic epoxy resin, a liquid alicyclic epoxy resin, a special epoxy resin, and a liquid modified epoxy resin.
Preferably, the diluent in the a component is composed of one or more than one reactive diluent containing one, two or more than one epoxy functional group.
Preferably, the auxiliary agent is at least one of a coupling agent, a viscosity reducer, a wetting agent, a dispersing agent, a defoaming agent, a leveling agent, a wetting agent, an anti-settling agent and an internal mold release agent, and the diluent is glycidyl ether or glycidyl ester.
Preferably, the filler is one or more of calcium carbonate, kaolin, bentonite, talcum powder and aluminum hydroxide.
Preferably, the curing agent is at least one of dicyandiamide, organic acid hydrazide, aromatic amine or modified amine.
Preferably, the accelerator is at least one of organic urea, modified organic urea, imidazole and modified imidazole.
The invention has the following beneficial effects:
the epoxy resin composition prepared by the invention has low initial viscosity, is beneficial to infiltrating reinforced fiber materials, adopts polyamine compounds containing amino groups to modify and thicken an epoxy resin system, greatly increases the viscosity after curing, and meets the requirement of a sheet molding compound compression molding process. The epoxy composition does not contain solvents and other volatile substances, meets the environment-friendly requirement of low VOC of automobile part materials, has the characteristics of rapid forming at 150 ℃ for 5min and the like, and has the characteristics of high mechanical strength, good heat resistance and the like after forming.
Detailed Description
The following examples are included to provide further detailed description of the present invention and to provide those skilled in the art with a more complete, concise, and exact understanding of the principles and spirit of the invention.
Example 1:
uniformly mixing 83g of bisphenol A glycidyl ether type liquid epoxy resin NPEL-128 and 6g of internal release agent, adding a mixed abrasive consisting of 17g of bisphenol A glycidyl ether type liquid epoxy resin NPEL-128, 7g of dicyandiamide and 1.5g of organic urea, uniformly stirring, finally adding 4.4g of alicyclic amine, and uniformly stirring to obtain epoxy SMC resin paste; and (3) impregnating 25mm disordered chopped glass fibers with the prepared epoxy SMC resin paste, rolling by an SMC sheet machine, and curing in a drying room at 35 ℃ for 20 hours to obtain the epoxy sheet molding compound.
The physical properties of the epoxy SMC resin paste and the mechanical properties of the epoxy sheet molding compound are tested, and the specific properties are shown in the table I and the table II (the experimental data of the following examples are also shown in the table I and the table II).
Example 2
Uniformly mixing 78g of bisphenol A glycidyl ether type liquid epoxy resin NPEL-128, 5g of alicyclic glycidyl ester epoxy resin TDE-85 and 6g of internal release agent, adding a mixed abrasive consisting of 17g of bisphenol A glycidyl ether type liquid epoxy resin NPEL-128, 7g of dicyandiamide and 1.5g of organic urea, uniformly stirring, finally adding 5g of alicyclic amine, and uniformly stirring to obtain epoxy SMC resin paste; and (3) impregnating 25mm disordered chopped glass fibers with the prepared epoxy SMC resin paste, rolling by an SMC sheet machine, and curing in a drying room at 35 ℃ for 20 hours to obtain the epoxy sheet molding compound.
Example 3
Uniformly mixing 81g of bisphenol A glycidyl ether type liquid epoxy resin NPEL-128, 2g of alicyclic epoxy resin TTA-21 and 6g of internal release agent, adding a mixed abrasive consisting of 17g of bisphenol A glycidyl ether type liquid epoxy resin NPEL-128, 7g of dicyandiamide and 1.5g of organic urea, uniformly stirring, finally adding 5g of alicyclic amine, and uniformly stirring to obtain epoxy SMC resin paste; and (3) impregnating 25mm disordered chopped glass fibers with the prepared epoxy SMC resin paste, rolling by an SMC sheet machine, and curing in a drying room at 35 ℃ for 20 hours to obtain the epoxy sheet molding compound.
Example 4
Uniformly mixing 75g of bisphenol A glycidyl ether type liquid epoxy resin NPEL-128, 5g of trimethylolpropane triglycidyl ether XY-636 and 6g of internal release agent, adding a mixed abrasive consisting of 20g of bisphenol A glycidyl ether type liquid epoxy resin NPEL-128, 6.5g of dicyandiamide, 2g of organic acid hydrazide and 1.5g of organic urea, uniformly stirring, finally adding 5g of alicyclic amine, and uniformly stirring to obtain epoxy SMC resin paste; and (3) impregnating 25mm disordered chopped glass fibers with the prepared epoxy SMC resin paste, rolling by an SMC sheet machine, and curing for 15 hours in a drying room at 40 ℃ to obtain the epoxy sheet molding compound.
Example 5
Uniformly mixing 78g of bisphenol A glycidyl ether type liquid epoxy resin NPEL-128 and 6g of an internal release agent, adding a mixed abrasive consisting of 22g of bisphenol A glycidyl ether type liquid epoxy resin NPEL-128, 6g of dicyandiamide, 2g of organic urea and 1g of imidazole, uniformly stirring, finally adding 3g of alicyclic amine and 4g of polyether amine, and uniformly stirring to obtain epoxy SMC resin paste; and (3) impregnating 25mm disordered chopped glass fibers with the prepared epoxy SMC resin paste, rolling by an SMC sheet machine, and curing in a drying room at 35 ℃ for 20 hours to obtain the epoxy sheet molding compound.
Example 6
Uniformly mixing 78g of bisphenol A glycidyl ether type liquid epoxy resin NPEL-128, 150g of calcium carbonate, 6g of internal release agent and 1.5g of viscosity reducer, adding a mixed abrasive consisting of 22g of bisphenol A glycidyl ether type liquid epoxy resin NPEL-128, 6g of dicyandiamide, 2g of organic urea and 1g of imidazole, uniformly stirring, finally adding 6g of alicyclic amine, and uniformly stirring to obtain epoxy SMC resin paste; and (3) impregnating 25mm disordered chopped glass fibers with the prepared epoxy SMC resin paste, rolling by an SMC sheet machine, and curing in a drying room at 35 ℃ for 20 hours to obtain the epoxy sheet molding compound.
TABLE 1 epoxy SMC resin paste physical and mechanical Properties
TABLE 2 mechanical Properties of epoxy sheet Molding Compounds
| Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | Example 6 | |
| Tensile Strength (MPa) | 226.81 | 272.28 | 234.3 | 244.6 | 218.83 | 163.22 |
| Tensile modulus (GPa) | 15.95 | 14.84 | 14.96 | 14.92 | 13.66 | 13.31 |
| Flexural Strength (MPa) | 334.39 | 400.02 | 342.5 | 362.25 | 322.65 | 242.3 |
| Flexural modulus (GPa) | 12.75 | 12.41 | 12.88 | 12.36 | 12.11 | 12.16 |
| Non-gap strength (KJ/square meter) | 121 | 118 | 118 | 110 | 114 | 81 |
In conclusion, the epoxy resin composition prepared by the invention has low initial viscosity, is beneficial to infiltrating reinforced fiber materials, adopts the polyamine compound containing amino groups to modify and thicken an epoxy resin system, greatly increases the viscosity after curing, and meets the requirement of a sheet molding compound compression molding process. The epoxy composition does not contain solvents and other volatile substances, meets the environment-friendly requirement of low VOC of automobile part materials, has the characteristics of rapid forming at 150 ℃ for 5min and the like, and has the characteristics of high mechanical strength, good heat resistance and the like after forming.
The above embodiments are only for illustrating the technical idea of the present invention, and the protection scope of the present invention cannot be limited thereby, and any modification made on the basis of the technical scheme according to the technical idea proposed by the present invention falls within the protection scope of the present invention; the technology not related to the invention can be realized by the prior art.
Claims (8)
1. An epoxy SMC resin, which is characterized by consisting of the following A, B and C:
the component A comprises the following materials in parts by weight:
the component B comprises the following materials in parts by weight:
10-40 parts by mass of liquid epoxy resin;
4-15 parts of a curing agent;
2-8 parts of an accelerator;
the component C comprises the following materials in parts by weight:
4-10 parts of a thickening agent;
the thickener is at least one of a monoamine or polyamine having one or more primary and secondary amino groups, optionally the thickener has a molar ratio of the total primary and secondary amino groups to epoxy groups of the epoxy composition of greater than 0.05 and less than 0.3.
2. An epoxy SMC resin as claimed in claim 1 wherein: the thickening agent comprises one or more of aliphatic amine, alicyclic amine and aromatic amine such as ethylenediamine, dipropylenetriamine, diethylenetriamine, triethylene tetramine, m-xylylenediamine, 1, 3-cyclohexyldimethylamine, N-aminoethyl piperazine, isophorone diamine, methylcyclohexanediamine, cyclohexylpropylenediamine, 1, 2-cyclohexanediamine, 3' -dimethyl-4, 4-diaminodicyclohexylmethane, menthane diamine, polyether amine, diethyl toluenediamine and the like.
3. An epoxy SMC resin as claimed in claim 1 wherein: the mixed epoxy resin is at least one of liquid glycidyl ether type epoxy resin, liquid glycidyl grease type epoxy resin, liquid glycidyl amine type epoxy resin, liquid aliphatic epoxy resin, liquid alicyclic epoxy resin, special epoxy resin and liquid modified epoxy resin.
4. An epoxy SMC resin as claimed in claim 1 wherein: the diluent in the component A is composed of one or more than one reactive diluent containing at least one epoxy functional group.
5. An epoxy SMC resin as claimed in claim 4 wherein: the auxiliary agent is at least one of a coupling agent, a viscosity reducer, a wetting agent, a dispersing agent, a defoaming agent, a flatting agent, a wetting agent, an anti-settling agent and an internal mold release agent, and the diluent is glycidyl ether or glycidyl esters.
6. An epoxy SMC resin composition according to claim 1 wherein: the filler is one or more of calcium carbonate, kaolin, bentonite, talcum powder and aluminum hydroxide.
7. An epoxy SMC resin as claimed in claim 1 wherein: the curing agent is at least one of dicyandiamide, organic acid hydrazide, aromatic amine or modified amine.
8. An epoxy SMC resin as claimed in claim 1 wherein: the accelerant is at least one of organic urea, modified organic urea, imidazole and modified imidazole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010737253.2A CN112048156A (en) | 2020-07-28 | 2020-07-28 | Epoxy SMC resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN108603009A (en) * | 2016-02-29 | 2018-09-28 | 三菱化学株式会社 | Composition epoxy resin, moulding material and fibre reinforced composites |
| CN111073218A (en) * | 2019-12-31 | 2020-04-28 | 艾达索高新材料芜湖有限公司 | Environment-friendly flame-retardant chopped carbon fiber mat prepreg and preparation method thereof |
| CN112011153A (en) * | 2020-07-22 | 2020-12-01 | 艾达索高新材料芜湖有限公司 | Epoxy SMC resin composition and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108603009A (en) * | 2016-02-29 | 2018-09-28 | 三菱化学株式会社 | Composition epoxy resin, moulding material and fibre reinforced composites |
| CN108410130A (en) * | 2018-02-08 | 2018-08-17 | 芜湖天道绿色新材料有限公司 | A kind of sheet molding compound cured epoxy composition and preparation method thereof |
| CN111073218A (en) * | 2019-12-31 | 2020-04-28 | 艾达索高新材料芜湖有限公司 | Environment-friendly flame-retardant chopped carbon fiber mat prepreg and preparation method thereof |
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