CN112046069A - Modal-drive-based spider-web type hot press platform balancing device and balancing method thereof - Google Patents

Modal-drive-based spider-web type hot press platform balancing device and balancing method thereof Download PDF

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CN112046069A
CN112046069A CN202010861611.0A CN202010861611A CN112046069A CN 112046069 A CN112046069 A CN 112046069A CN 202010861611 A CN202010861611 A CN 202010861611A CN 112046069 A CN112046069 A CN 112046069A
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platform
balancing
hot press
spider
data
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CN112046069B (en
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王俊尧
陈星宇
刘欢
王彦博
孙功臣
李云鹏
孙琪
侯琪
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Northeast Electric Power University
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Northeast Dianli University
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/007—Means for maintaining the press table, the press platen or the press ram against tilting or deflection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10—Complex mathematical operations
    • G06F17/11—Complex mathematical operations for solving equations, e.g. nonlinear equations, general mathematical optimization problems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/10—Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0887—Laminated structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/12—Specific details about materials

Abstract

The invention provides a platform balancing device and a balancing method of a spider-web type hot press based on modal driving. The balancing module comprises a spider-web structure device, a piezoelectric ceramic piece, a fixed block and a modal driving device. And the platform is trimmed by displacement adjustment of the mode-driven spider-web structure. The platform observation module comprises a laser ranging device. And signal processing is carried out through four groups of laser sensors so as to monitor the position of the platform in real time. And judging whether the platform is trimmed or not through processing the four groups of data. The platform alignment device designed by the invention can carry out accurate balancing under the micron level condition, and the balancing device can be simplified by adopting a mode driving mode without a stopping device in the traditional sense. The complexity of the mechanical structure is greatly reduced. Has the advantages of small volume, high working precision and simple structure device. The method is suitable for the requirement of the platform balancing on the micron level.

Description

Modal-drive-based spider-web type hot press platform balancing device and balancing method thereof
Technical Field
The invention relates to the field of balancing of a hot press platform, in particular to a platform balancing device and a balancing method before the hot press platform works. Belongs to the technical field of micro-assembly and micro-operation.
Background
In modern industrial production, the hot press itself is an indispensable part. Different from the traditional industrial production, the hot press also gradually plays an important role in the field of microfluidic chip production, and has developed into a new research field crossing the disciplines of biology, chemistry, medicine, fluid, electronics, materials, machinery and the like due to the great potential of the microfluidic chip technology in the fields of biology, chemistry, medicine and the like. An important fabrication method of the microfluidic chip is a hot pressing method. The most important of these is the high performance hot press. The production capacity of the hot press determines the yield of the microfluidic chip, and the technical level of the hot press also determines the quality of the microfluidic chip to a great extent. The production quality of the microfluidic chip is closely related to the technical level of the hot press. In this regard, the performance requirements of hot presses are constantly increasing. The new microfluidic chip standards put higher demands on chip quality. In order to ensure the manufacturing quality, as for the hot press, on one hand: the optimal hot pressing process curve and process parameters are required to be adopted in the process, and the product quality is controlled; in another aspect: the hot press apparatus itself is required to satisfy requirements such as thickness tolerance of the product, uniformity of heat transfer, etc. in terms of structure and performance, and to ensure the quality of the pressed product.
The current mainstream method for manufacturing chips by using a hot press is a hot die method, and the hot die method mainly comprises the steps of manufacturing a substrate and a cover plate, and bonding the substrate and the cover plate by hot pressing for example to form a chip with a closed channel. In the existing microfluidic chip hot-press bonding process, pressure is applied to the upper surface and the lower surface of a chip through a hard pressing plate such as a metal plate or a ceramic plate. Because absolute balancing of the upper surface and the lower surface of the existing hard pressing plate is difficult to achieve, pressure applied to the upper surface and the lower surface of the chip is uneven, and collapse or overlarge deformation of an internal microstructure of the chip is caused. Due to the rapid change of the temperature and the existence of the microstructure, the chip may slightly warp, and the uneven thickness of the chip or the generation of the slight warp may cause uneven pressure applied on the upper and lower surfaces of the chip by the pressurization method, which may cause uneven chip bonding, and after the temperature reaches the softening point of the plastic, the microstructure inside the chip may collapse to a greater extent or deform too much to cause blockage, so that the obtained chip may not be used.
Based on the technical problems, the invention provides a cobweb-type hot press platform balancing device based on modal driving and a balancing method thereof, and designs a set of cobweb-type hot press platform balancing device which comprises a balancing module for realizing hot press platform balancing and a monitoring module for monitoring the state of a hot press platform, wherein the two modules are assembled through a fixing plate, so that the balancing device can be completely attached to a lower platform of a hot press, and the monitoring device can be correctly positioned in the installation process. And guarantee is provided for platform balancing. And the piezoelectric ceramic is adopted as a driving part of the spider-web structure, so that the structure can be designed simply, and the self-locking performance is strong. A micrometer scale trim can be achieved.
Disclosure of Invention
The invention aims to provide a set of modal-drive-based platform balancing device of a cobweb type hot press and a balancing method thereof.
In order to achieve the purpose, the invention adopts the following scheme: a cobweb type hot press platform balancing device based on mode driving and a balancing method thereof. It comprises trim modules 1, 11 arranged at the lower part of a hot press platform 2. And a monitoring module 10 disposed therewith. The balancing module comprises a balancing device 8 with a spider-web structure, six groups of piezoelectric ceramic groups 6 and 7 and six groups of T-shaped fixing blocks 5. The method is characterized in that the cobweb-shaped device 8 can generate displacement through the piezoelectric effect to push the hot press platform to generate micron-level motion, and high-precision leveling is realized. The monitoring module comprises four groups of laser sensors 3 and a fixing and displacement device 4. The method is characterized in that the precise positioning of the platform position of the hot press can be realized through a corresponding algorithm, and the precise control of the balancing module during working is realized. Wherein, the spider-web structure adopts an integral aluminum material, the piezoelectric ceramic adopts a meta-niobate piezoelectric ceramic material, and the T-shaped fixing block adopts a traditional steel material. The sensor fixing and displacement device is made of aluminum alloy materials.
Further, the spider-web device 8 is preferably a six-set beam structure, which can enlarge the contact area and realize accurate displacement in multiple positions during the trimming process. When the device is put into operation, the different excitations of the different sets of piezoelectric ceramics can be controlled more precisely by means of the spider-web structure. The angle adjustment of the platform is realized.
Further, preferably, the observation method used by the observation device is a four-point position method. The device comprises four groups of laser sensors, position data of four observation points on the platform can be obtained in real time through four groups of observation devices, the obtained data can be compared in real time by adopting a four-point position determination formula, and whole-process monitoring and balancing data guidance before balancing, during balancing and after balancing are realized.
Further, as the piezoelectric ceramics are preferably adopted by the driving part related to the device, through the interaction of six groups of piezoelectric ceramics, the precise adjustment of the platform can be realized, and the structural complexity of the whole balancing device is reduced. And simultaneously can keep excellent self-locking performance.
The model-driven cobweb type hot press platform balancing device and the balancing method thereof are characterized in that the alignment method comprises the following steps:
the method comprises the following steps of confirming the positions of sensors in four groups of monitoring devices, respectively measuring the distance of observation points preset on a platform of the hot press after the correct positions of the sensors are confirmed, and obtaining the position angle of the observation points of the corresponding platform according to a preset coordinate system and data measured by the sensors. Four sets of position angles need to be measured. The formula of position angle is as follows
Figure RE-GDA0002676642910000031
Wherein the content of the first and second substances,
Figure BDA0002648333260000032
is an azimuth angle between two points, SABIs the distance between two points, Δ yABIs the x-axis distance Deltax between two pointsABIs the y-axis distance between two points, (x)B,yB)，(xA,yA) Coordinates of the respective sensor with the predetermined point.
The second step is that: and after the position angle is confirmed, the specific positions of the monitoring point and the observed point are obtained according to the measured data and a preset coordinate system. Four groups of data are collected and calculated respectively, wherein coordinates of all points are different, but the same algorithm is adopted. The distance formula is as follows
Figure BDA0002648333260000033
Wherein (x)B,yB)，(xA,yA) Coordinates of the respective sensor with the predetermined point.
The third step: with the data obtained, when the four sets of data collected are not identical, the platform needs to be trimmed. The spider-web leveling device is initially energized, with a total of six sets of piezo ceramic modules secured to the beam of the device. According to the formula provided by the text, the displacement of each direction of the platform can be accurately controlled.
Figure RE-GDA0002676642910000034
Wherein: l is the total displacement of the balancing device, Δ L0Is the elongation displacement amount, K, of the piezoelectric ceramic at no loadTIs the stiffness coefficient, K, of the piezoceramicRIs the stiffness coefficient of the external load.
The fourth step: and in the balancing process, processing is continuously carried out according to the data obtained by monitoring and calculation. And finally four groups of data are equal by exciting the piezoelectric ceramic groups at different positions. The accurate balancing of the hot press platform is achieved.
The invention has the beneficial effects that:
the hot press platform balancing device with the cobweb-shaped structure has the advantages of small size, strong operability and high balancing precision, and is suitable for balancing a hot press platform for manufacturing a micro-nano flow control chip by adopting a hot die method. Specifically, the precise lifting of the hot press platform can be realized, the ascending or descending action of the corresponding part of the beam structure can be precisely controlled, and the position of the hot press platform can be precisely monitored.
Drawings
The invention is further described with reference to the following figures and detailed description:
FIG. 1 is a schematic view of the balancing process of the hot press platform of the present invention through four sets of monitoring mechanisms;
FIG. 2 is a schematic view of an integral trim apparatus;
FIG. 3 is a schematic structural view of a trim module;
FIG. 4 is a schematic view of the assembly of the balancing device with the lower platen of the press;
FIG. 5 is a schematic view of a monitoring module configuration;
the device comprises a base, a hot press, a platform, a laser sensor, a fixed slide way, 5, a T-shaped fixed block, 6, piezoelectric ceramics, 7, the piezoelectric ceramics, 8, a spider-web type balancing device, 9, a monitoring structure mounting position, 10, a monitoring device supporting structure, and 11, the spider-web type balancing device.
Detailed Description
The invention comprises a balancing module and a monitoring module, and the balancing module is a cobweb-shaped structure balancing module of a hot press platform as shown in the figure. The figure shows a monitoring module for a press platform. The balancing module comprises a spider-web structure, a piezoelectric ceramic piece and a T-shaped fixing device, and is characterized in that the lifting or descending of the hot press platform is realized. The monitoring module comprises a laser sensor and an electromagnetic push rod and is characterized in that the sensor can be monitored and moved in parallel. The balancing module and the monitoring module are connected by a fixing device, a spider-web-shaped structural part in the device part is made of an integral aluminum material, piezoelectric ceramic is made of a meta-niobate piezoelectric ceramic material, and a T-shaped fixing block is made of a traditional steel material. The whole monitoring module is made of titanium alloy material.
The hot press balancing part spider web structure adopts a two-ring structure, an inner ring and an outer ring are of a parallel hexahedral structure, six groups of piezoelectric ceramic groups are respectively installed on outermost side beams, the motion of the spider web structure under a hot press platform is realized by means of the excitation effect of the piezoelectric ceramic, the platform is pushed to be balanced, when the balancing process is carried out, the precise balancing of the platform can be realized by the interaction of the six beams, and after the balancing is finished, the device can be self-locked due to the fact that the piezoelectric ceramic is adopted as a driving device for directly driving the spider web structure to have strong self-locking performance.
The sensor part of the monitoring part is connected with the screw rod, when the monitoring part works, the four groups of sensors respectively observe observation points on the platform, can guide the displacement of the spider-web structure, and complete accurate platform balancing.
The monitoring method adopts the following principle: by the four-point balancing method, a coordinate system in an image space is established, real-time marking is carried out on each position, data collected by a laser sensor are used, intersection points of a plurality of curves in the space are used as parameters in a linear equation and are mapped to be straight lines in the image space, and therefore the parameter equation of the straight lines is given, and whether the platform is balanced or not can be detected.
The model-driven cobweb type hot press platform balancing device and the balancing method thereof are characterized in that the alignment method comprises the following steps:
the first step is to confirm the positions of the sensors in the four groups of monitoring devices A, B, C and D, respectively measure the distance of the observation points preset on the platform of the hot press after the correct positions of the sensors are determined, and obtain the position angles of the observation points of the corresponding platform according to the preset coordinate system and the data measured by the sensors. Four sets of position angles need to be measured. The formula of position angle is as follows
Figure RE-GDA0002676642910000051
Wherein the content of the first and second substances,
Figure BDA0002648333260000052
is an azimuth angle between two points, SABIs the distance between two points, Δ yABIs the x-axis distance Deltax between two pointsABIs the y-axis distance between two points, (x)B,yB)，(xA,yA) Coordinates of the respective sensor with the predetermined point. Calculating four groups of data according to a position angle formula
Figure RE-GDA0002676642910000053
Figure RE-GDA0002676642910000054
A, B, C, D, E, F, J and H are coordinates of preset observation points on the laser sensor and the hot press platform respectively.
The second step is that: and after the four groups of position angles are confirmed, the specific positions of the monitoring point and the observed point are obtained according to the measured data and a preset coordinate system. Four groups of data are collected and calculated respectively, wherein coordinates of all points are different, but the same algorithm is adopted. The distance formula is as follows
Figure BDA0002648333260000061
Wherein (x)B,yB)，(xA,yA) Coordinates of the respective sensor with the predetermined point. Obtaining four groups of distance formulas according to different groups of data
Figure BDA0002648333260000062
Figure BDA0002648333260000063
A, B, C, D, E, F, J and H are coordinates of preset observation points on the laser sensor and the hot press platform respectively.
The third step: with the data obtained, when the four sets of data collected are not identical, the platform needs to be trimmed. And (3) starting to excite the spider-web type leveling device, wherein six groups of piezoelectric ceramic modules are symmetrically fixed on the outer side beam of the spider-web structure. According to the formula provided by the text, the displacement of each direction of the platform can be accurately controlled.
Figure RE-GDA0002676642910000064
Wherein: l is the total displacement of the balancing device, Δ L0Is the elongation displacement amount, K, of the piezoelectric ceramic at no loadTIs the stiffness coefficient, K, of the piezoceramicRIs the stiffness coefficient of the external load.
The fourth step: and in the balancing process, processing is continuously carried out according to the data obtained by monitoring and calculation. And finally four groups of data are equal by exciting the piezoelectric ceramic groups at different positions. The accurate balancing of the hot press platform is achieved.

Claims (4)

1. The platform balancing device of the spider-web type hot press based on modal driving comprises a spider-web type balancing module of a balancing platform and a platform monitoring module. The balancing module comprises a spider-web type main body structure, six groups of piezoelectric ceramics, a modal driving module and six groups of fixing modules, and is characterized in that the precise balancing of the hot press platform is realized. The monitoring module comprises four groups of laser ranging sensors and is characterized in that data guidance in the balancing process can be carried out by observing the state of the platform in real time. The balancing module and the monitoring module are respectively fixed on a lower platform of the hot press, the balancing module is fixed at the bottom of the platform in an adhesion mode, and the monitoring module main body is fixed at four corners of the platform and is of a columnar structure. The structural materials are all light aluminum-titanium alloy.
2. The mode-driven spider web hot press balancing module according to claim 1, wherein the main balancing driving member is an integral spider web bionic structure, and a pair of piezoelectric ceramic plates are mounted on six opposite beams thereof by the piezoelectric effect. Through different excitations of the piezoelectric ceramic group, the all-directional movement of the six beam structures is realized, and in the all-directional movement process of each beam structure, the platform can be balanced integrally due to the interaction of the six beam structures.
3. The monitoring module for a modal-based actuated spider web hot press platform according to claim 1, wherein the four sets of sensors are operated individually to enable corresponding displacement during measurement by laser ranging sensors mounted on four columns protruding from the platform when the trim set is started. And obtaining data by measuring the distance of the alignment point arranged on the hot press platform. The uploaded data are processed to judge the specific position of the hot press platform, and the working state of the balancing module is further guided in real time through the data. And finishing the balancing of the whole platform.
4. A platform balancing method of a spider-web type hot press based on modal driving is characterized by comprising the following steps:
the first step is as follows: the specific position of the platform is monitored. And processing the data uploaded by the four groups of sensors to judge whether the platform needs to be trimmed, and in a theoretical situation, when the four groups of data are different, trimming the platform. Each group of monitoring devices can obtain two parts of data, namely displacement angle and observation point distance. The data were obtained as follows
Figure RE-FDA0002676642900000011
Figure RE-FDA0002676642900000012
Wherein the content of the first and second substances,
Figure RE-FDA0002676642900000021
is an azimuth angle between two points, SABIs the distance between two points, Δ yABIs the x-axis distance Deltax between two pointsABIs the y-axis distance between two points, (x)B,yB)，(xA,yA) Coordinates of the respective sensor with the predetermined point. Four sets of data were acquired for analysis-guided trim.
The second step is that: and the balancing device performs balancing. The spider-web structure beam is displaced by controlling the piezoelectric ceramic on the spider-web structure, and data is given in real time by the laser sensor, so that the displacement of the beam at the corresponding position is realized. And (5) balancing the hot press platform. The general formula for beam displacement is as follows:
Figure RE-FDA0002676642900000022
wherein: l is the total displacement of the balancing device, Δ L0Is the elongation displacement amount, K, of the piezoelectric ceramic at no loadTIs the stiffness coefficient, K, of the piezoelectric ceramicRIs the stiffness coefficient of the external load.
The third step: and after the balancing, carrying out data measurement again to judge whether the balancing is successful. If the data still has abnormity, the second step processing is still needed.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000317781A (en) * 1998-06-18 2000-11-21 Yoshiaki Nagaura Piezo electric element and its machining method
JP2006237395A (en) * 2005-02-25 2006-09-07 Toshiba Mach Co Ltd Transfer device
CN1820933A (en) * 2005-12-26 2006-08-23 西北工业大学 Super plasticity extruding and forming device for micro parts
CN102543217A (en) * 2012-01-20 2012-07-04 澳门大学 Macro-micro driven bidimensional integrated micro positioning platform
TWM460089U (en) * 2013-01-31 2013-08-21 Univ Nat Formosa Nano piezoelectric adjusting device
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