CN112020215B - PCB bonding pad with low cost and compatible production test and research and development debugging interface - Google Patents
PCB bonding pad with low cost and compatible production test and research and development debugging interface Download PDFInfo
- Publication number
- CN112020215B CN112020215B CN202010997855.1A CN202010997855A CN112020215B CN 112020215 B CN112020215 B CN 112020215B CN 202010997855 A CN202010997855 A CN 202010997855A CN 112020215 B CN112020215 B CN 112020215B
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- radio frequency
- frequency signal
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- pad
- bonding pad
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- 238000012360 testing method Methods 0.000 title claims abstract description 85
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 62
- 238000012827 research and development Methods 0.000 title abstract description 11
- 238000003466 welding Methods 0.000 claims description 42
- 238000011161 development Methods 0.000 claims description 12
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
Abstract
The invention provides a PCB bonding pad which has low cost and is compatible with production test and research and development debugging interfaces, comprising a radio frequency debugging connector bonding pad, wherein bonding pads on the radio frequency debugging connector bonding pad are correspondingly arranged with bonding pads used on the radio frequency debugging connector, and the radio frequency debugging connector bonding pad comprises a grounding bonding pad, a radio frequency signal input bonding pad and a radio frequency signal output bonding pad; the PCB bonding pad also comprises a production radio frequency test point which can be connected with the production test head, the production radio frequency test point comprises a shielding grounding contact and a radio frequency signal test point shared by the production radio frequency test point and the radio frequency signal input bonding pad, the shielding grounding contact is arranged around the radio frequency signal test point, and the shielding grounding contact is provided with a radio frequency signal input and output wiring notch, and the other periphery is arranged for completely shielding the radio frequency signal of the radio frequency signal test point. The invention is compatible with the radio frequency debugging test head and the production test head for debugging and testing, and saves the cost.
Description
Technical Field
The present invention relates to a soldering structure for electronic components, and more particularly, to a PCB pad compatible with a production test and development debug interface at low cost.
Background
On one hand, electronic products are more and more complex, components are more and more, and on the other hand, users have more and more rigorous requirements on volume appearance, small size, light weight and thinness of the electronic products. Such contradiction promotes strict design restrictions on the size of the circuit board, and requires little energy. On the one hand, the requirements of users are met, and on the other hand, the cost is controlled, and the area of the circuit board is directly related to the price.
For a long time, because of the complexity of the rf system, a great deal of hardware parameter debugging and component parameter modification are performed during the development stage. And the requirements for the debugging environment in the radio frequency debugging of the high-pass frequency of more than 2GHz are very high. The unscientific contact, connection and shielding directly leads to difficulties in debugging and the exertion of the final radio frequency performance. Therefore, in the radio frequency system above 1GHz, a device is specially designed for debugging and testing. The added device causes the increase of the area of the circuit board on the one hand and the increase of the cost on the other hand, but the function is single, and the device basically fails after the research and the development and the debugging are finished. Because the circuit is connected in series in the circuit, the circuit cannot be directly removed, otherwise, the circuit is opened, and the signal is not passed.
In addition, since the production test points are in a ring structure (determined by the RF test head, as shown in fig. 2 and 3), the RF signal is located in the middle of the ring, and the RF line must be connected through the Via hole, but the loss of the RF signal is increased due to the Via hole connection, which results in degradation of the RF signal quality.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides the PCB bonding pad which has low cost and is compatible with the production test and research and development debugging interfaces, and the relation between the research and development debugging interface, the production interface and the cost interface is optimized in design.
The invention comprises a radio frequency debugging connector bonding pad, wherein welding spots on the radio frequency debugging connector bonding pad are correspondingly arranged with welding spots used on a radio frequency debugging connector, the radio frequency debugging connector bonding pad comprises four grounding welding spots G1-G4, a radio frequency signal input bonding pad S1 and a radio frequency signal output bonding pad S3 which are arranged in a scattered way, wherein,
the connecting wires of the four grounding welding spots form a square, the grounding welding spots G1 and G2 are arranged on the upper part, the grounding welding spots G3 and G4 are arranged on the lower part, the radio frequency signal input welding pad S1 and the radio frequency signal output welding pad S3 are arranged on the longitudinal headquarters of the square, wherein the radio frequency signal input welding pad S1 is arranged below the central connecting wire of the grounding welding spots G3 and G4, and the radio frequency signal output welding pad S3 is arranged above the central connecting wire of the grounding welding spots G1 and G2;
the PCB pad further includes a production radio frequency test point connectable to the production test head, the production radio frequency test point including a shield ground contact and a radio frequency signal test point, wherein,
the rf signal test point is shared with the rf signal input pad S1 of the rf debug connector pad,
the shielding grounding contact is arranged around the radio frequency signal test point, and the shielding grounding contact is provided with a radio frequency signal input/output wiring notch and the whole shielding of other periphery to the radio frequency signal of the radio frequency signal test point.
According to the invention, the number of the shielding grounding contacts is 6, wherein the first shielding grounding contact and the second shielding grounding contact are shared with grounding welding spots G3 and G4 of the radio frequency debugging connector bonding pad, the third shielding grounding contact and the fourth shielding grounding contact are arranged in the square and are arranged on two sides of the longitudinal central axis, the fifth shielding grounding contact and the sixth shielding grounding contact are arranged on the lower half part of the radio frequency signal testing point, and a radio frequency signal input wiring notch is arranged between the fifth shielding grounding contact and the sixth shielding grounding contact.
According to the invention, the fifth shielding grounding contact and the sixth shielding grounding contact are symmetrically arranged at two sides of the radio frequency signal test point, the upper parts of the fifth shielding grounding contact and the sixth shielding grounding contact are provided with steps, the first shielding grounding contact and the second shielding grounding contact are arranged above the steps and are arranged with gaps with the fifth shielding grounding contact or the sixth shielding grounding contact, and the tops of the fifth shielding grounding contact and the sixth shielding grounding contact at least extend to the X-axis extension line of the lower edge line of the third shielding grounding contact and the fourth shielding grounding contact.
According to the invention, the PCB bonding pad further comprises a production process bonding pad S2, wherein the production process bonding pad S2 is arranged in the shielding grounding contact in a surrounding manner and is arranged at intervals with the radio frequency signal test point, and the production process bonding pad S2 is connected with the radio frequency signal output bonding pad S3 through a radio frequency signal output wiring N2.
According to the invention, a radio frequency signal input wiring N1 is arranged on one side of the radio frequency signal test point, which is close to the radio frequency signal input wiring notch.
The invention is further improved, the grounding welding spots G1-G4 and the shielding grounding contacts G5-G8 are enclosed to form a shielding protection circuit of the circuit, so that the radio frequency signals on the radio frequency signal input wiring N1, the radio frequency signal output wiring N2, the radio frequency signal input bonding pad S1, the production process bonding pad S2 and the radio frequency signal output bonding pad S3 can be ensured not to be interfered or leaked.
According to the invention, the radio frequency signal input wiring N1, the radio frequency signal input bonding pad S1, the production process bonding pad S2, the radio frequency signal output wiring N2 and the radio frequency signal output bonding pad S3 are sequentially arranged in the longitudinal middle of the PCB bonding pad, and the grounding welding spots G1-G4 and the shielding grounding contacts G5-G8 are symmetrically arranged on two sides of the longitudinal central axis of the PCB bonding pad.
The invention is further improved, and the RF deviation of the PCB pad production test is less than 0.2dBm.
The invention is further improved, and the distance between the radio frequency signal input wiring N1 and the radio frequency signal output wiring N2 meets the RF performance loss of <0.2dBm.
According to the invention, the radio frequency debugging connector can be communicated with the radio frequency signal input pads S1 and S3 in a natural state, and when the radio frequency debugging connector is connected in a debugging state, one side of the middle terminal of the radio frequency debugging connector is connected with an instrument, and the other side of the middle terminal of the radio frequency debugging connector is connected with the radio frequency signal input pad S1 and disconnected with the radio frequency signal input pad S3.
Compared with the prior art, the invention has the beneficial effects that: the radio frequency debugging test head and the production test head for compatible debugging and testing respectively meet different requirements of production and research and development tests, a special device is not needed for debugging and testing, a debugging connector for research and development is reduced, and cost is saved; the compact layout saves PCB wiring area and further saves cost.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic diagram of a production test head;
FIG. 3 is a schematic diagram of a test point structure of a production test head.
Detailed Description
The invention will be described in further detail with reference to the drawings and examples.
As shown in fig. 1, the present invention includes a radio frequency debug connector pad, the solder points on the radio frequency debug connector pad are arranged corresponding to the solder points on the radio frequency debug connector, the radio frequency debug connector pad includes four ground solder points G1-G4 and a radio frequency signal input pad S1 and a radio frequency signal output pad S3 which are arranged in a scattered manner, wherein,
the square is formed by connecting four grounding welding spots, four grounding welding spots G1 are arranged in a central symmetry or longitudinal axisymmetry mode, the grounding welding spot G2 is arranged on the left upper portion, the grounding welding spot G3 is arranged on the left lower portion, the grounding welding spot G4 is arranged on the right lower portion, the radio frequency signal input welding spot S1 and the radio frequency signal output welding spot S3 are arranged in the longitudinal middle of the square, the radio frequency signal input welding spot S1 is arranged below the central connecting line of the grounding welding spots G3 and G4, and the radio frequency signal output welding spot S3 is arranged above the central connecting line of the grounding welding spots G1 and G2.
The radio frequency debugging connector pad is used for debugging equipment after being connected with the radio frequency debugging connector during research and development, and debugging hardware parameters and modifying component parameters. After the research and development and the debugging are completed, the material is not required to be welded during production.
The radio frequency debugging connector is characterized in that: it can communicate the radio frequency signal input pad S1 and the radio frequency signal output pad S3 in a natural state. When the debugging is connected, the middle terminal is connected with the instrument on one side and the radio frequency signal input pad S1 on the other side, and the radio frequency signal output pad S3 is disconnected. The arrangement of this example can meet the above requirements.
The example PCB pad further includes a production radio frequency test point connectable to the production test head, the production radio frequency test point including a shield ground contact and a radio frequency signal test point, wherein,
the rf signal test point is shared with the rf signal input pad S1 of the rf debug connector pad,
the shielding grounding contact is arranged around the radio frequency signal test point, and the shielding grounding contact is provided with a radio frequency signal input/output wiring notch and the whole shielding of other periphery to the radio frequency signal of the radio frequency signal test point.
Specifically, the number of the shielding ground contacts in this example is 6, where the first shielding ground contact and the second shielding ground contact are shared with the ground pads G3 and G4 of the radio frequency debug connector pad, the third shielding ground contact G6 and the fourth shielding ground contact G5 are disposed inside the square and symmetrically disposed on two sides of the longitudinal central axis, where the third shielding ground contact G6 is disposed between the ground pads G1 and G3, and the fourth shielding ground contact G5 is disposed between the ground pads G2 and G4, for shielding an area between the ground pads G3 and G4, so as to prevent radio frequency signals in this area from being disturbed or leaked.
The fifth shielding ground contact G7 and the sixth shielding ground contact G8 of this example are disposed at the lower half part of the radio frequency signal test point, that is, the radio frequency signal input pad S1, and a radio frequency signal input wiring notch is disposed between the fifth shielding ground contact G7 and the sixth shielding ground contact G8.
As a preferred embodiment of the present invention, the fifth shielding ground contact G7 and the sixth shielding ground contact G8 of this embodiment are both in a circular arc shape matching with the lower half of the test point of the production test head and are symmetrically disposed at two sides of the radio frequency signal test point, preferably, the upper parts of the fifth shielding ground contact G7 and the sixth shielding ground contact G8 are provided with steps disposed toward the direction of the radio frequency signal test point, the first shielding ground contact is disposed on the steps of the sixth shielding ground contact G8 and is provided with a gap with the sixth shielding ground contact G8, and the second shielding ground contact is disposed on the steps of the fifth shielding ground contact G7 and is provided with a gap with the fifth shielding ground contact G7.
The tops of the fifth shielding ground contact G7 and the sixth shielding ground contact G8 extend at least to the X-axis extension line of the lower edge line of the third shielding ground contact G6 and the fourth shielding ground contact G5. And the third shielding ground contact G6 and the fourth shielding ground contact G5 are enclosed, so that the production test point can be well isolated, and radio frequency signals of the production test point are prevented from being interfered or leaked.
Because the influence of the antenna matching network must be disconnected during production test, the radio frequency signal test point can only reach the radio frequency signal input pad S1, in this example, a radio frequency signal input wire N1 is disposed on one side of the radio frequency signal input pad S1, which is close to the radio frequency signal input wire notch, and a radio frequency signal output wire N2 is disposed on the other side of the radio frequency signal output pad S3, which is opposite to the radio frequency signal input pad S1. In order to facilitate the signal of the radio frequency signal input wiring N1 to smoothly reach the radio frequency signal output wiring N2, in this example, a production process pad S2 is further disposed on the PCB pad, the production process pad S2 is disposed inside the shielding ground contact, and is disposed at intervals with the radio frequency signal test point, and the production process pad S2 is connected with the radio frequency signal output pad S3 through the radio frequency signal output wiring N2.
Since the rf signal is manually input to the bonding pad S1 and the manufacturing process bonding pad S2 to be soldered are connected after the test is completed. The distance between the rf signal input pad S1 and the production process pad S2 in this example should not be too large or too small. Too large can lead to manual tin attachment difficulties and too small can lead to RF signal spatial coupling affecting test performance. Preferably, in order to reduce line loss and ensure radio frequency performance, the distance between the radio frequency signal input wire N1 and the radio frequency signal output wire N2 in this example is short enough, so that the RF performance loss between N1 and N2 in the present invention is less than 0.2dBm.
As shown in fig. 2, the grounding pads G1-G4 and the shielding grounding contacts G5-G8 of this embodiment enclose a shielding protection circuit that forms a circuit, so as to ensure that radio frequency signals on the radio frequency signal input wiring N1, the radio frequency signal output wiring N2, the radio frequency signal input pad S1, the production process pad S2, and the radio frequency signal output pad S3 are not interfered or leaked. Therefore, the RF deviation of the PCB pad during production test is less than 0.2dBm, and the production test requirement is met.
The radio frequency signal input wiring N1, the radio frequency signal input bonding pad S1, the production process bonding pad S2, the radio frequency signal output wiring N2 and the radio frequency signal output bonding pad S3 are sequentially arranged in the middle of the longitudinal direction of the PCB bonding pad, and the grounding welding spots G1-G4 and the shielding grounding contacts G5-G8 are symmetrically arranged on two sides of the longitudinal central axis of the PCB bonding pad.
According to the invention, the radio frequency debugging test head and the production test head for compatible debugging and testing respectively meet different requirements of production, research and development tests, a special device is not needed for debugging and testing, the debugging connector for research and development is reduced, and the cost is saved; the compact layout saves PCB wiring area and further saves cost.
The above embodiments are preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, which includes but is not limited to the embodiments, and equivalent modifications according to the present invention are within the scope of the present invention.
Claims (9)
1. A low cost and compatible production test and development debug interface PCB pad, characterized by: comprises a radio frequency debugging connector bonding pad, wherein welding spots on the radio frequency debugging connector bonding pad are correspondingly arranged with welding spots used on the radio frequency debugging connector, the radio frequency debugging connector bonding pad comprises four grounding welding spots G1-G4, a radio frequency signal input bonding pad S1 and a radio frequency signal output bonding pad S3 which are arranged in a scattered way,
the connecting wires of the four grounding welding spots form a square, the grounding welding spots G1 and G2 are arranged on the upper part, the grounding welding spots G3 and G4 are arranged on the lower part, the radio frequency signal input welding pad S1 and the radio frequency signal output welding pad S3 are arranged in the middle of the longitudinal direction of the square, wherein the radio frequency signal input welding pad S1 is arranged below the central connecting wire of the grounding welding spots G3 and G4, and the radio frequency signal output welding pad S3 is arranged above the central connecting wire of the grounding welding spots G1 and G2;
the PCB pad further includes a production radio frequency test point connectable to the production test head, the production radio frequency test point including a shield ground contact and a radio frequency signal test point, wherein,
the rf signal test point is shared with the rf signal input pad S1 of the rf debug connector pad,
the shielding grounding contact is arranged around the radio frequency signal test point, the shielding grounding contact is provided with a notch of a radio frequency signal input and output wiring, the other periphery is arranged for fully shielding the radio frequency signal of the radio frequency signal test point,
the number of the shielding ground contacts is 6, wherein the first shielding ground contact and the second shielding ground contact are shared with ground welding spots G3 and G4 of the radio frequency debugging connector bonding pad, the third shielding ground contact and the fourth shielding ground contact are arranged in the square and are arranged on two sides of the longitudinal central axis, the fifth shielding ground contact and the sixth shielding ground contact are arranged on the lower half part of the radio frequency signal testing point, and a radio frequency signal input wiring notch is arranged between the fifth shielding ground contact and the sixth shielding ground contact.
2. The low cost and compatible production test and development debug interface PCB pad of claim 1, wherein: the fifth shielding grounding contact and the sixth shielding grounding contact are symmetrically arranged on two sides of the radio frequency signal test point, steps are arranged on the upper parts of the fifth shielding grounding contact and the sixth shielding grounding contact, the first shielding grounding contact and the second shielding grounding contact are arranged above the steps and are arranged with the fifth shielding grounding contact or the sixth shielding grounding contact in a clearance mode, and the tops of the fifth shielding grounding contact and the sixth shielding grounding contact at least extend to the X-axis extension line of the lower edge line of the third shielding grounding contact and the lower edge line of the fourth shielding grounding contact.
3. The low cost and compatible production test and development debug interface PCB pad of claim 1, wherein: the PCB bonding pad further comprises a production process bonding pad S2, the production process bonding pad S2 is arranged in the shielding grounding contact in a surrounding mode and is arranged at intervals with the radio frequency signal test points, and the production process bonding pad S2 is connected with the radio frequency signal output bonding pad S3 through a radio frequency signal output wiring N2.
4. A low cost and compatible production test and development debug interface PCB pad as in claim 3 wherein: and one side of the radio frequency signal test point, which is close to the radio frequency signal input wiring notch, is provided with a radio frequency signal input wiring N1.
5. The low cost and compatible production test and development debug interface PCB pad of claim 4, wherein: the grounding welding spots G1-G4 and the shielding grounding contacts G5-G8 are enclosed to form a shielding protection circuit of the circuit, so that the radio frequency signals on the radio frequency signal input wiring N1, the radio frequency signal output wiring N2, the radio frequency signal input bonding pad S1, the production process bonding pad S2 and the radio frequency signal output bonding pad S3 are ensured not to be interfered or leaked.
6. The low cost and compatible production test and development debug interface PCB pad of claim 5, wherein: the radio frequency signal input wiring N1, the radio frequency signal input bonding pad S1, the production process bonding pad S2, the radio frequency signal output wiring N2 and the radio frequency signal output bonding pad S3 are sequentially arranged in the middle of the longitudinal direction of the PCB bonding pad, and the grounding welding spots G1-G4 and the shielding grounding contacts G5-G8 are symmetrically arranged on two sides of the longitudinal central axis of the PCB bonding pad.
7. The low cost and compatible production test and development debug interface PCB pad of claim 6, wherein: the RF bias at the PCB pad production test is <0.2dBm.
8. The low cost and compatible production test and development debug interface PCB pad of claim 7, wherein: the space between the radio frequency signal input wire N1 and the radio frequency signal output wire N2 meets the RF performance loss of <0.2dBm.
9. The low cost and compatible production test and development debug interface PCB pad of any of claims 1-6, wherein: the radio frequency debugging connector is connected with the radio frequency signal input pads S1 and S3 in a natural state, and when the radio frequency debugging connector is connected in a debugging state, one side of the middle terminal of the radio frequency debugging connector is connected with an instrument, and the other side of the middle terminal of the radio frequency debugging connector is connected with the radio frequency signal input pad S1 and disconnected with the radio frequency signal input pad S3.
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| CN202010997855.1A CN112020215B (en) | 2020-09-21 | 2020-09-21 | PCB bonding pad with low cost and compatible production test and research and development debugging interface |
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| CN202010997855.1A CN112020215B (en) | 2020-09-21 | 2020-09-21 | PCB bonding pad with low cost and compatible production test and research and development debugging interface |
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| CN112020215A CN112020215A (en) | 2020-12-01 |
| CN112020215B true CN112020215B (en) | 2024-03-19 |
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| CN213126635U (en) * | 2020-09-21 | 2021-05-04 | 深圳市迅锐通信有限公司 | Low-cost PCB pad of compatible production test and research and development debugging interface |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9837325B2 (en) * | 2015-06-16 | 2017-12-05 | Peregrine Semiconductor Corporation | Electrically testable microwave integrated circuit packaging |
| US10515924B2 (en) * | 2017-03-10 | 2019-12-24 | Skyworks Solutions, Inc. | Radio frequency modules |
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2020
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| Publication number | Priority date | Publication date | Assignee | Title |
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| EP0607481A1 (en) * | 1993-01-19 | 1994-07-27 | Electronic Development, Inc. | Apparatus and method for electromagnetical field susceptibility testing |
| CN201839519U (en) * | 2010-09-24 | 2011-05-18 | 比亚迪股份有限公司 | Radio-frequency circuit board and terminal equipment |
| CN205864852U (en) * | 2016-06-23 | 2017-01-04 | 群光电子(苏州)有限公司 | Motor solder joint ruggedized construction on a kind of substrate |
| CN106841997A (en) * | 2017-03-20 | 2017-06-13 | 上海与德科技有限公司 | Radio frequency testing encapsulating structure and radio frequency test method |
| CN111123079A (en) * | 2020-01-16 | 2020-05-08 | 普联技术有限公司 | Radio frequency testing and calibrating device and radio frequency testing and calibrating method |
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| CN112020215A (en) | 2020-12-01 |
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