CN112019954B

CN112019954B - Loudspeaker and manufacturing method thereof

Info

Publication number: CN112019954B
Application number: CN202010664491.5A
Authority: CN
Inventors: 程诗阳; 朱国; 吴健兴; 但强; 李杨
Original assignee: Ruisheng Technology Nanjing Co Ltd
Current assignee: Ruisheng Technology Nanjing Co Ltd
Priority date: 2020-07-10
Filing date: 2020-07-10
Publication date: 2021-06-15
Anticipated expiration: 2040-07-10
Also published as: WO2022007233A1; CN112019954A

Abstract

The invention provides a loudspeaker and a preparation method thereof, wherein the loudspeaker comprises a substrate with a cavity, a driver attached to one side of a vibration layer far away from the cavity, a piston connecting rod mechanism accommodated in the cavity and a guide reed, wherein the driver is used for receiving an electric signal to drive the vibration layer to vibrate, the piston connecting rod mechanism comprises a piston arranged at an interval with the vibration layer and a connecting rod for connecting the piston with the vibration layer, a gap is formed between the piston and a side wall at an interval, the guide reed is clamped and fixed between the connecting rod and the piston, and the periphery of the guide reed is connected with the side wall. Compared with the related art, the loudspeaker has better acoustic performance.

Description

Loudspeaker and manufacturing method thereof

[ technical field ] A method for producing a semiconductor device

The invention relates to the field of electroacoustic conversion, in particular to a loudspeaker and a preparation method thereof.

[ background of the invention ]

And the loudspeaker is used for converting the vibration signal into an electric signal.

In the related art, a pistonic loudspeaker includes a substrate having a cavity, a driver formed on the substrate, and a piston rod mechanism accommodated in the cavity; the driver is used for receiving an electric signal to drive the vibration layer to vibrate, the substrate comprises a vibration layer and a side wall surrounding a cavity with the vibration layer, the piston connecting rod mechanism comprises a connecting rod fixed to one side, close to the cavity, of the vibration layer and a piston fixed to one end, far away from the vibration layer, of the connecting rod, the piston and the side wall form a gap at intervals, the driver receives the electric signal to vibrate and transmit the electric signal to the piston through the vibration layer and the connecting rod in sequence, and the piston moves along the axis direction of the connecting rod to generate sound to achieve electro-acoustic conversion.

However, in the related art speaker, the piston is only connected to the connecting rod, and when the piston moves along the axial direction of the connecting rod, the piston is not constrained in a direction other than the axial direction, and thus an unstable vibration mode is easily induced, thereby affecting the sound effect, and at the same time, the unstable constraint structure of the piston also leads to a failure more easily when a drop occurs.

Therefore, there is a need to provide a new speaker to solve the above technical problems.

[ summary of the invention ]

The invention aims to provide a loudspeaker with better acoustic performance.

In order to achieve the above object, the present invention provides a speaker, comprising:

the vibration isolator comprises a substrate and a vibration isolation layer, wherein the substrate comprises a side wall surrounding a cavity and the vibration isolation layer supported at one end of the side wall;

the driver is attached to one side, far away from the cavity, of the vibration layer and used for receiving an electric signal to drive the vibration layer to vibrate;

the piston connecting rod mechanism is accommodated in the cavity and comprises a piston which is arranged at an interval with the vibration layer and is used for vibrating and sounding and a connecting rod which connects the piston with the vibration layer, and a gap is formed between the piston and the side wall at an interval; and the number of the first and second groups,

and the guide reed is clamped and fixed between the connecting rod and the piston, and the periphery of the guide reed is connected to the side wall.

Preferably, the side walls include a first side wall and a second side wall which are stacked along a vibration direction of the vibration layer and are bonded and fixed by bonding metal, the vibration layer is disposed at an end of the first side wall far away from the second side wall, the guide spring is located between the first side wall and the second side wall, and the guide spring is formed by patterning the bonding metal.

Preferably, the guide spring is at least partially spaced from the piston.

Preferably, the guide spring comprises a first portion fixedly connected with the connecting rod, a second portion wound at intervals on the first portion and connected with the side wall, and a first connecting arm connected with the first portion and the second portion, wherein the first connecting arm comprises at least two parts and is arranged at intervals.

Preferably, the first connecting arms include three and are arranged at equal intervals.

Preferably, the first connecting arm is in a Z-shaped structure, a snake-shaped structure, an arc-shaped structure or an I-shaped structure.

Preferably, the speaker further includes a sub-driver formed on a side of the piston adjacent to the guide spring, the sub-driver being located between two adjacent first connecting arms.

Preferably, the vibration layer includes a first through hole penetrating therethrough, and the first through hole communicates with the cavity.

Preferably, the driver includes a second through hole penetrating therethrough and disposed corresponding to the first through hole, and the second through hole communicates with the cavity through the first through hole.

Preferably, the orthographic projection of the driver to the vibration layer along the vibration direction of the vibration layer completely falls within the range of the vibration layer.

Preferably, the gap is less than or equal to 0.1 mm.

Preferably, the first through holes include at least two, the drivers include at least two, and each driver is disposed between two adjacent first through holes.

The invention also provides a preparation method of the loudspeaker, which comprises the following steps:

step S1, forming the driver: preparing a first silicon wafer, wherein the first silicon wafer comprises a first layer, a second layer, a third layer, a fourth layer and a fifth layer which are sequentially stacked from bottom to top, the first layer, the third layer and the fifth layer are made of silicon dioxide materials, the second layer and the fourth layer are made of silicon materials, and a driver material is deposited on one side, far away from the fourth layer, of the fifth layer to form the driver;

step S2, forming the first via and the second via: etching the driver, the fifth layer, and the fourth layer to form the first via and the second via;

step S3, forming the link and the cavity: depositing a bond metal on a side of the first layer remote from the second layer to form a bond metal layer, etching the bond metal layer, the first layer, and the second layer to form the tie bar and the cavity, and partially exposing the third layer to the cavity;

step S4, preparing a second silicon wafer: preparing a second silicon wafer comprising a sixth layer made of a silicon material and a seventh layer formed on the sixth layer, the seventh layer being made of a silicon dioxide material, depositing a bonding metal on a side of the seventh layer remote from the sixth layer to form the guide spring;

step S5, the first silicon wafer and the second silicon wafer are bonded together: the bonding metal layer and the guide reed are fixed through a bonding process so that the first silicon wafer and the second silicon wafer are combined together;

step S6, forming the piston and the gap: etching the piston and the void on the side of the sixth layer remote from the seventh layer and partially exposing the seventh layer to the void;

step S7, releasing the restraint of the guide reed and the piston: removing the seventh layer exposed to the gap by a release process so that the guide reed can be normally validated.

Compared with the prior art, in the loudspeaker, the guide reed is clamped and fixed between the connecting rod and the piston, and the periphery of the guide reed is connected to the side wall; the constraint of the piston on the plane of the piston is increased, the movement of the piston except along the axial line direction of the connecting rod is limited, the unstable vibration mode is avoided when the loudspeaker works, and the acoustic performance is improved; meanwhile, the restraint of the piston plane increases the reliability and the drop resistance of the loudspeaker.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:

FIG. 1 is a schematic perspective view of a speaker according to the present invention;

fig. 2 is an exploded view of a portion of a speaker according to the present invention;

FIG. 3 is a sectional view taken along line A-A of FIG. 1;

FIG. 4 is another cross-sectional view of FIG. 1;

fig. 5 is a schematic structural view of a speaker guide spring according to the present invention;

FIG. 6 is a schematic view of another speaker according to the present invention;

FIG. 7 is a schematic structural diagram of another speaker according to the present invention;

FIG. 8 is a flow chart of the speaker of the present invention;

fig. 9 is a schematic structural diagram in a manufacturing process of the speaker of the present invention.

[ detailed description ] embodiments

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example one

Referring to fig. 1-5, the present invention provides a speaker 100, which includes a substrate 1, a driver 2, a piston rod mechanism 3, and a guide spring 4.

The substrate 1 comprises a side wall 12 enclosing a cavity 10 and a vibration layer 11 supported at one end of the side wall 12; specifically, the side wall 12 includes a first side wall 1a and a second side wall 1b that are stacked in the vibration direction of the vibration layer 11 and fixed by bonding metal bonding, as shown in fig. 2, but is not limited thereto. The cross section of the cavity 10 can be in any shape such as a circle, a triangle, a polygon and the like, the piston 32 is arranged corresponding to the shape of the cavity 10, and in the embodiment, the cross section of the cavity 10 and the cross section of the piston 32 are both in a circle; as shown in fig. 7, the cavity 10e has a rectangular shape.

The driver 2 is attached to one side of the vibration layer 11, which is far away from the cavity 10, and is used for receiving an electric signal to drive the vibration layer 11 to vibrate, specifically, the vibration layer 11 is arranged at one end of the first side wall 1a, which is far away from the second side wall 1 b. In this embodiment, the driver 2 is a piezoelectric driver, and has a sandwich structure, that is, includes at least one layer of electrode material and at least one layer of piezoelectric material, and of course, the driver 2 may also adopt an electrostatic driver or an electromagnetic driver.

Specifically, the orthographic projection of the driver 2 to the vibration layer 11 along the vibration direction of the vibration layer 11 completely falls within the range of the vibration layer 11.

The vibration layer 11 comprises a first through hole 11w penetrating through the vibration layer, and the first through hole 11w is communicated with the cavity 10; the driver 2 comprises a second through hole 2w which penetrates through the driver and is arranged corresponding to the first through hole 11w, and the second through hole 2w is communicated with the cavity 10 through the first through hole 11 w. Driver 2 and vibration layer 11 all are hollow out construction so that cavity 10 and external intercommunication pressure release promptly, and it does not cover the central zone of cavity 10, forms the cantilever, has promoted the flexibility of the drive structure that vibration layer 11 and driver are constituteed, does benefit to the displacement amplitude that promotes whole speaker, is favorable to speaker 100 to produce high acoustic pressure, improves speaker 100's acoustic performance.

In this embodiment, the driver 2 includes a fifth portion 21, a sixth portion 22 wound around the fifth portion 21 and spaced apart from the fifth portion 21, and a third connecting arm 23 connected to the fifth portion 21 and the sixth portion 22, wherein the third connecting arm 23 includes a plurality of connecting arms spaced apart from each other to form a second through hole 2 w. Correspondingly, the vibration layer 11 includes a third portion 111 fixedly connected to the connecting rod 31, a fourth portion 112 wound around the third portion 111 and spaced from the third portion 111, and a second connecting arm 113 connected to the third portion 111 and the fourth portion 112, where the second connecting arm 113 is spaced to form a first through hole 11w, and the fourth portion 112 is supported and fixed on the side wall 12. The number of the second connecting arms 113 is matched with that of the third connecting arms 23, and the second connecting arms and the third connecting arms are correspondingly arranged, the fifth portion 21 is fixedly overlapped with the third portion 111, and the sixth portion 22 is fixedly overlapped with the fourth portion 112.

Preferably, the second connecting arm 113 and the third connecting arm 23 are equally spaced.

The piston-link mechanism 3 is accommodated in the cavity 10, and includes a piston 32 disposed at an interval from the vibration layer 11 and used for generating vibration sound and a connecting rod 31 connecting the piston 32 with the vibration layer 11, preferably, the piston 32 and the connecting rod 31 are both disposed at the center of the cavity 10, although the number of the connecting rods 31 may also include a plurality of connecting rods 31, and the plurality of connecting rods 31 are symmetrically disposed about the center of the cavity 10; the piston 32 is spaced from the side wall 12 to form a gap 30. Preferably, the gap 30 is less than or equal to 0.1mm, and the piston 32 can move along the axial direction of the connecting rod 31 under the driving of the driver 2, and at the same time, the whole space is small, and the volume of the loudspeaker 100 is further reduced.

The guide reed 4 is sandwiched and fixed between the connecting rod 31 and the piston 32, the periphery of the guide reed 4 is connected to the side wall 12, and the piston 32 is fixed to the connecting rod 31 through the guide reed 4. The arrangement of the guide reed 4 increases the restriction of the piston 32 on the plane thereof, limits the movement of the piston 32 except along the axial direction of the connecting rod 31, avoids the unstable vibration mode generated when the loudspeaker 100 works, and improves the acoustic performance; at the same time, the restraint of the plane of the piston 32 increases the reliability and the drop resistance of the loudspeaker.

Preferably, the guide reed 4 is located between the first side wall 1a and the second side wall 1b, the guide reed 4 is a layer, and the guide reed 4 is formed by patterning the bonding metal, that is, in the process flow, when the first side wall 1a and the second side wall 1b are fixed by the bonding metal bonding process, the bonding metal is patterned to form the guide reed 4 synchronously without any additional process, without increasing the overall process difficulty or affecting the process controllability, and the effect of optimizing the performance is achieved while saving the cost.

Specifically, the guide reed 4 is at least partially spaced from the piston 32, i.e., the movement of the piston 32 in the axial direction of the connecting rod 31 is not limited while ensuring the planar constraint of the piston 32.

In this embodiment, the guide spring 4 includes a first portion 41 fixedly connected to the connecting rod 31, a second portion 42 connected to the side wall 12 and disposed at an interval around the first portion 41, and a first connecting arm 43 connected to the first portion 41 and the second portion 42, wherein the first connecting arm 43 includes at least two parts and is disposed at an interval, and preferably, the first connecting arm 43 is disposed symmetrically with respect to the first portion 41 and the connecting rod 31. Specifically, the first connecting arms 43 include four first connecting arms 43a and are arranged at equal intervals, but it is not limited thereto, and as shown in fig. 5a, the guide spring 4a includes three first connecting arms 43a and is arranged at equal intervals, and as shown in fig. 5b, the guide spring 4b includes eight first connecting arms 43b and is arranged at equal intervals. As shown in fig. 5c, in the guide spring 4c, the first connecting arm 43c has a zigzag structure; of course, the shape is not limited thereto, and as in fig. 5a, the first connecting arm 43a has an elongated shape; or in the shape of a snake-shaped structure, an arc-shaped structure, an I-shaped structure and the like, or in the superposition combination of different shapes, so as to meet the rigidity matching of the whole guide reed 4.

Referring to fig. 8 and 9, the present embodiment further provides a method for manufacturing a speaker 100, including the following steps:

step S1, forming the driver 2: as shown in fig. 9a, a first silicon wafer 400 is prepared, wherein the first silicon wafer 400 comprises a first layer 4001, a second layer 4002, a third layer 4003, a fourth layer 4004 and a fifth layer 4005 which are sequentially stacked from bottom to top, the first layer 4001, the third layer 4003 and the fifth layer 4005 are made of silicon dioxide material, the second layer 4002 and the fourth layer 4004 are made of silicon material, and a driver material is deposited on a side of the fifth layer 4005 far from the fourth layer 4004 to form the driver 2.

Step S2, forming the first via hole 11w and the second via hole 2 w: as shown in fig. 9b, the driver 2, the fifth layer 4005 and the fourth layer 4004 are etched to form the first via hole 11w and the second via hole 2 w;

step S3, forming the link 31 and the cavity 10: depositing a bonding metal on a side of the first layer 4001 remote from the second layer 4002 to form a bonding metal layer 4d, etching the bonding metal layer 4d, the first layer 4001, and the second layer 4002 to form the tie bar 31 and the cavity 10, and partially exposing the third layer 4003 to the cavity 10, as shown in fig. 9 c;

step S4, preparing a second silicon wafer 500: as shown in fig. 9d, a second silicon wafer 500 is prepared, the second silicon wafer 500 includes a sixth layer 5001 and a seventh layer 5002 formed on the sixth layer 5001, the sixth layer 5001 is made of silicon material, the seventh layer 5002 is made of silicon dioxide material, and a bonding metal is deposited on a side of the seventh layer 5002 away from the sixth layer 5001 to form the guide spring 4.

Step S5, the first silicon wafer 400 and the second silicon wafer 500 are bonded together: as shown in fig. 9e, the bonding metal layer 4d and the guide spring 4 are fixed by a bonding process to bond the first silicon wafer 400 and the second silicon wafer 500 together.

Step S6, forming the piston 32 and the gap 30: as shown in fig. 9f, the piston 32 and the gap 30 are etched on the side of the sixth layer 5001 away from the seventh layer 5002, and the seventh layer 5002 is partially exposed to the gap 30.

Step S7, releasing the restraint of the guide reed 4 and the piston 32: as shown in fig. 9g, the seventh layer 5002 exposed to the gap 30 is removed by a release process so that the guide reed 4 can be normally worked.

Example two

The present embodiment provides a speaker 200, as shown in fig. 6, which is substantially the same as the speaker 100 of the first embodiment except that the guide spring 4d includes two layers; when the first side wall 11a and the second side wall 11b are bonded by the bonding metal, the bonding metal thereof includes two layers, and the naturally obtained guide spring 4d also includes two layers; that is, when the speaker 200 requires high structural rigidity, the bonding metal may include a plurality of layers, and the formed guide spring 4d may also include a plurality of layers. That is, the present invention does not limit the number of layers of the bonding metal and the guide spring 4, and is determined by the whole process flow and the whole structure rigidity.

EXAMPLE III

The present embodiment provides a speaker 300, which is substantially the same as the speaker 100 in the first embodiment with reference to fig. 7, and the difference therebetween is that the drivers 4e include two drivers, and each driver 4e is disposed between two adjacent first through holes 111 w. Namely, the drivers 4e are respectively arranged on the fourth portions 112e at intervals, although the number of the drivers 4e is not limited thereto; the driver 4e at this time may not be configured as a hollow structure, and it may be configured as a hollow structure integrally with the driving structure formed by the vibration layer, so that the cavity 10e communicates with the outside to release the pressure. The loudspeaker 300 further comprises a sub-driver 5e formed on the side of the piston 32e close to the guide reed 4e, i.e. forming a compound loudspeaker; the sub-driver 5e is located between two adjacent first connecting arms 43e, although the number of the drivers 4e and the sub-drivers 5e is not limited thereto, and the number thereof can be adjusted according to actual situations; the sub-driver 5e is provided to allow the speaker 300 to generate various vibrations.

While the foregoing is directed to embodiments of the present invention, it will be understood by those skilled in the art that various changes may be made without departing from the spirit and scope of the invention.

Claims

1. A loudspeaker, characterized in that the loudspeaker comprises:

2. The loudspeaker of claim 1, wherein the side walls include a first side wall and a second side wall stacked in a vibration direction of the vibration layer and fixed by bonding with a bonding metal, the vibration layer is disposed at an end of the first side wall away from the second side wall, the guide spring is located between the first side wall and the second side wall, and the guide spring is formed by patterning the bonding metal.

3. The loudspeaker of claim 1, wherein said guide reed is at least partially spaced from said piston.

4. The speaker of claim 1, wherein said guide spring comprises a first portion fixedly connected to said link, a second portion spaced apart from said first portion and connected to said side wall, and a first connecting arm connected to said first portion and said second portion, said first connecting arm comprising at least two arms spaced apart from each other.

5. A loudspeaker according to claim 4, wherein the first connecting arms comprise three and are arranged at equal distances from each other.

6. The loudspeaker of claim 4, wherein the first connecting arm has a zigzag configuration, a serpentine configuration, an arcuate configuration, or an I-shaped configuration.

7. The speaker of claim 4, further comprising a sub-driver formed on a side of said piston adjacent to said guide reed, said sub-driver being located between adjacent two of said first connecting arms.

8. The loudspeaker of claim 1, wherein the vibration layer includes a first through hole therethrough, the first through hole communicating with the cavity.

9. The loudspeaker of claim 8, wherein the driver includes a second through hole extending therethrough and disposed in correspondence with the first through hole, the second through hole communicating with the cavity through the first through hole.

10. A loudspeaker according to claim 1, wherein the orthographic projection of the driver onto the vibration layer along the vibration direction of the vibration layer falls entirely within the vibration layer.

11. A loudspeaker according to claim 1, wherein the gap is less than or equal to 0.1 mm.

12. The speaker of claim 8, wherein said first through holes comprise at least two, and said drivers comprise at least two, each of said drivers being disposed between two adjacent ones of said first through holes.

13. A method of manufacturing a loudspeaker according to any one of claims 1 to 12, comprising the steps of:

step S4, preparing a second silicon wafer: preparing a second silicon wafer comprising a sixth layer made of a silicon material and a seventh layer formed on the sixth layer, the seventh layer being made of a silicon dioxide material, depositing a bonding metal on a side of the seventh layer away from the sixth layer and patterning to form the guide spring;

step S6, forming the piston and the air gap: etching the piston and the void on the side of the sixth layer remote from the seventh layer and partially exposing the seventh layer to the void;