CN112018502B

CN112018502B - Communication equipment shell assembly, communication equipment and manufacturing method

Info

Publication number: CN112018502B
Application number: CN201910459041.XA
Authority: CN
Inventors: 董力; 刘栋; 徐长念
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2019-05-29
Filing date: 2019-05-29
Publication date: 2022-04-12
Anticipated expiration: 2039-05-29
Also published as: CN112018502A

Abstract

The embodiment of the application provides a communication equipment shell assembly, communication equipment and a manufacturing method, relates to the technical field of communication equipment, can flexibly set positions, facilitates the internal layout of the communication equipment, and meets the antenna requirements. The communication equipment shell assembly comprises a shell, wherein the shell comprises a frame surrounding the peripheral edge of a display screen assembly, a tubular conductor is formed along the frame, a gap penetrating through the conductor is formed in the conductor along the extending direction of the conductor, the side wall of the conductor is disconnected by the gap, and when the conductor is electrified, a resonance effect is generated at the gap. The communication equipment shell assembly provided by the embodiment of the application can be used for installing internal parts of communication equipment and carrying out communication as an antenna.

Description

Communication equipment shell assembly, communication equipment and manufacturing method

Technical Field

The application relates to the technical field of communication equipment, in particular to a communication equipment shell assembly, communication equipment and a manufacturing method.

Background

In order to implement a communication function, a communication device needs an internal antenna structure to receive or transmit a signal. For example, a mobile phone usually employs a metal plastic integral molding process to manufacture a housing, and an exposed metal frame or a rear cover is used to construct an antenna.

Generally, existing handsets will usually have antennas disposed in both the top and bottom regions of the handset. The existing mobile phone antenna is generally a strip antenna arranged along the length direction or the width direction of the mobile phone, and the antenna needs to occupy a larger plane space and is not beneficial to the layout of other parts in the mobile phone. Nowadays, the demand of communication equipment for antennas increases, the frequency band increases, and more antennas are needed to support the corresponding functions. The available space in the mobile phone is basically saturated by the conventional layout mode, and more antennas cannot be arranged in the length direction or the width direction of the mobile phone, so that the requirements of more antennas cannot be met.

Disclosure of Invention

The embodiment of the application provides a communication equipment shell assembly, communication equipment and a manufacturing method, the position can be flexibly set, the internal layout of the communication equipment is convenient, and the antenna requirement is met.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:

in a first aspect, an embodiment of the present application provides a communication device housing assembly, which includes a housing, the housing includes a frame surrounding a peripheral edge of a display screen assembly, a tubular conductor is formed along the frame, a gap penetrating through the conductor is formed in the conductor along an extending direction of the conductor, the gap disconnects a side wall of the conductor, and when the conductor is powered on, a resonance effect is generated at the gap.

The embodiment of the application provides a communication equipment housing assembly, including the casing, the casing includes the frame around the border around the display screen subassembly, and the border is formed with pipy conductor, and is equipped with the gap that runs through it along its extending direction on the conductor, and the gap is with the lateral wall disconnection of conductor, and when the conductor circular telegram, gap department produces the electromagnetic resonance effect, and then forms a brand-new gap antenna. Compared with the prior art, the antenna structure does not need a large plane space, can be distributed at the positions of traditional mobile phone antennas such as the top and the bottom of a mobile phone, and can also be distributed on metal frames at the left side and the right side of the mobile phone with a narrow plane space. Therefore, the position can be flexibly set, the internal layout of the communication equipment is convenient, and the antenna requirement is met.

With reference to the first aspect, in a first optional implementation manner of the first aspect, a groove is formed in the frame, an opening of the groove penetrates through the housing along a length direction of the groove, an insulating medium is filled in the groove, a conductive layer is disposed on a surface of the insulating medium located at the opening of the groove, a side wall of the groove is made of a conductive material, and the groove and the conductive layer form the tubular conductor; the gap is formed on the conductive layer, or the gap is formed on the side wall of the groove, or the gap is formed between the conductive layer and the side wall of the groove. For convenience of manufacture, a groove can be manufactured firstly, then the groove is filled with an insulating medium, and finally a conducting layer is arranged on the surface of the insulating medium, so that the conducting layer and the groove jointly form a conductor. The position of the gap can be flexibly set according to actual requirements. With reference to the first optional implementation manner of the first aspect, in a second optional implementation manner of the first aspect, the conductive layer is fabricated by any one of printing, electroplating, electroless plating, vacuum plating, metal powder stacking, curing, and pasting a metal film.

With reference to the first or second optional implementation manner of the first aspect, in a third optional implementation manner of the first aspect, the opening of the groove faces perpendicular to a plane where the display screen assembly is located. The opening of the recess may be oriented in a variety of ways, for example, towards the top or bottom of the housing, towards the lateral exterior of the housing, or towards the lateral interior of the housing. If the opening of recess if the outside of casing, can influence communications facilities's outward appearance, if the inboard of casing, be unfavorable for the setting in gap, simultaneously, side processing is more difficult, consequently, and is optional, the opening orientation of recess and display screen subassembly place plane are perpendicular, promptly, the opening of recess is towards the top or the below of casing, can set up display screen subassembly and back of the body lid isotructure in the top or the below of casing generally, consequently does not influence outward appearance and structural strength, and convenient processing.

With reference to the first to third optional implementation manners of the first aspect, in a fourth optional implementation manner of the first aspect, the housing includes a front frame, a middle frame, and a back plate, the front frame is used to fix the display screen assembly, the back plate covers a back surface of the communication device, the middle frame is located between the front frame and the back plate, the front frame and the back plate are respectively fixed to two sides of the middle frame, the back plate is made of an insulating material, the middle frame is made of a conductive material, the frame is composed of a portion of the front frame, an edge of the middle frame, and a portion of the back plate, the groove is formed on the middle frame, three sidewalls of the groove are a first sidewall and a second sidewall that are oppositely disposed, and a third sidewall that connects the first sidewall and the second sidewall, the first sidewall is close to an outside of the housing, the second sidewall is proximate the housing interior. The back plate can be a conductive metal back plate or a non-conductive non-metal back plate, the specific structural form of the communication equipment shell assembly has different settings aiming at the back plates made of different materials, and the following is a scheme example that the back plate is made of a non-conductive material.

With reference to the fourth optional implementation manner of the first aspect, in a fifth optional implementation manner of the first aspect, the opening of the groove faces the back plate, and the slit is formed in the region of the conductive layer.

With reference to the fourth optional implementation manner of the first aspect, in a sixth optional implementation manner of the first aspect, the opening of the groove faces the back plate, and the gap is formed between the conductive layer and the second sidewall.

With reference to the fourth optional implementation manner of the first aspect, in a seventh optional implementation manner of the first aspect, the opening of the groove faces the back plate, and the gap is formed between the conductive layer and the first side wall.

With reference to the fourth optional implementation manner of the first aspect, in an eighth optional implementation manner of the first aspect, the opening of the groove faces the front frame, and the gap is formed between the conductive layer and the first side wall.

With reference to the first to third optional implementation manners of the first aspect, in a ninth optional implementation manner of the first aspect, the housing includes a front frame and a back plate that are fastened and fixed to each other, the front frame is used to fix the display screen assembly, the back plate covers the back of the communication device, the back plate is made of a conductive material, the frame is composed of a part of the front frame and a part of the back plate, the groove is formed in the back plate, three side walls of the groove are a fourth side wall and a fifth side wall that are oppositely arranged, and a sixth side wall that connects the fourth side wall and the fifth side wall, the fourth side wall is close to the outside of the housing, and the fifth side wall is close to the inside of the housing. The following is an example of a scheme in which the back plate is made of a conductive material.

With reference to the ninth optional implementation manner of the first aspect, in a tenth optional implementation manner of the first aspect, the opening of the groove faces the front frame, and the slit is formed on the sixth side wall.

With reference to the ninth optional implementation manner of the first aspect, in an eleventh optional implementation manner of the first aspect, the opening of the groove faces the front frame, and the gap is formed between the sixth side wall and the fifth side wall.

With reference to the ninth optional implementation manner of the first aspect, in a twelfth optional implementation manner of the first aspect, the opening of the groove faces the front frame, and the gap is formed between the sixth side wall and the fourth side wall.

With reference to the ninth optional implementation manner of the first aspect, in a thirteenth optional implementation manner of the first aspect, the opening of the groove faces the front frame, and the gap is formed between the conductive layer and the fourth sidewall.

With reference to the first aspect and any one of the first to the thirteenth implementation manners of the first aspect, in a fourteenth implementation manner of the first aspect, an opening direction of the slit is parallel to a plane in which the housing is located. The opening direction in gap can have multiple implementation, and when the opening direction in gap and the plane parallel arrangement at casing place, reduce the area occupied in the plane at casing place when constructing the gap, be favorable to reducing the whole size of casing.

With reference to the first aspect and any one of the first to the thirteenth implementation manners of the first aspect, in a fifteenth implementation manner of the first aspect, an opening direction of the slit is disposed at a first angle with respect to a plane in which the housing is located. At the moment, the space occupied after the gap is constructed can be flexibly adjusted according to the special shape of the internal space of the communication equipment, and the layout is convenient.

With reference to the fifteenth optional implementation manner of the first aspect, in a sixteenth optional implementation manner of the first aspect, an opening direction of the slit is perpendicular to a plane where the housing is located. At this time, the space occupied in the thickness direction of the shell is reduced when the gap is constructed, which is beneficial to reducing the whole thickness of the shell.

With reference to the first aspect and any one of the first to the thirteenth implementation manners of the first aspect, in a seventeenth implementation manner of the first aspect, an opening of the gap has an extending section, and the extending section is parallel to or perpendicular to a plane in which the housing is located. The overlapping area of the conductive parts on the two sides of the gap influences the intensity of electromagnetic induction, different overlapping areas can be set as required, in order to more reasonably utilize the space, the opening of the gap can also be provided with an extension section to correspondingly increase the overlapping area, and then the intensity of the electromagnetic induction is adjusted.

With reference to the first aspect and any one of the first to seventeenth optional implementation manners of the first aspect, in an eighteenth optional implementation manner of the first aspect, the width of the gap is 0.05-5 mm.

In a second aspect, an embodiment of the present application provides a communication device, including a display screen assembly, a circuit board, and a power supply, and further including the communication device housing assembly according to any one of the above technical solutions, where the display screen assembly is fixed on the communication device housing assembly, the power supply and the circuit board are located in the communication device housing assembly, and the power supply is connected and conducted with a conductor of the communication device housing assembly through the circuit board.

The communication equipment that this application embodiment provided includes display screen subassembly, circuit board and power, owing to still include as above arbitrary technical scheme communication equipment casing subassembly, consequently, can set up the position in a flexible way, make things convenient for the inside overall arrangement of communication equipment, satisfy the antenna demand. Meanwhile, the display screen assembly is generally fixed on the communication equipment shell assembly and used for displaying information of the communication equipment and facilitating interaction with a user, the power supply and the circuit board are located in the communication equipment shell assembly, and the power supply is connected and conducted with a conductor of the communication equipment shell assembly through the circuit board to provide power for the conductor of the communication equipment shell assembly so as to drive the antenna to work.

In a third aspect, an embodiment of the present application provides a manufacturing method for manufacturing the communication device housing assembly according to any one of the above technical solutions, including:

manufacturing a pipeline-shaped conductor along the frame of the shell;

a slit is formed in the conductor to penetrate the conductor in the direction in which the conductor extends.

The manufacturing method provided by the embodiment of the application can be used for conveniently manufacturing the communication equipment shell assembly in any technical scheme, does not need a large plane space, and can be distributed on the positions of traditional mobile phone antennas such as the top and the bottom of a mobile phone and the like and also can be distributed on metal frames on the left side and the right side of the mobile phone with a narrow plane space. Therefore, the position can be flexibly set, the internal layout of the communication equipment is convenient, and the antenna requirement is met.

With reference to the third aspect, in a first optional implementation manner of the third aspect, the making a pipe-shaped conductive body along a frame of the casing includes:

forming a groove along the rim of the housing;

filling an insulating medium in the groove;

and covering a conductive layer on the surface of the insulating medium, so that the groove and the conductive layer form the pipeline-shaped conductor.

The pipe-shaped conductor can be manufactured by forging, cutting or injection molding, or a groove can be manufactured first, an insulating medium is filled in the groove, and then the surface of the insulating medium is covered with a conducting layer to form the conductor. Compared with the prior art, the scheme of manufacturing a groove is simpler to process.

With reference to the first optional implementation manner of the third aspect, in a second optional implementation manner of the third aspect, the forming a groove along the rim of the housing includes:

removing materials along the frame of the shell to form the groove;

or bending and molding the frame of the shell to form the groove.

The grooves can be formed by material removing treatment, such as cutting; or bending and forming.

With reference to the third aspect, in a third optional implementation manner of the third aspect, the making a pipe-shaped electric conductor along a frame of the housing includes:

and bending and molding the frame of the shell to form the conductor. That is, the electric conductor is integrally formed by bending.

With reference to the third aspect and any one of the first to third optional implementation manners of the third aspect, in a fourth optional implementation manner of the third aspect, the constructing, on the conductive body, a slit that penetrates through the conductive body in an extending direction of the conductive body includes:

and removing the material on the frame of the shell, and forming the gap penetrating through the conductor. When the gap is on the frame of the shell, the material can be removed at the corresponding position of the frame of the shell to construct the gap.

With reference to the first or second optional implementation manner of the third aspect, in a fifth optional implementation manner of the third aspect, the constructing, on the conductive body, a slit penetrating through the conductive body in an extending direction of the conductive body includes:

when the conductor is composed of the groove and the conducting layer on the surface of the insulating medium, and the gap is on the conducting layer, the gap penetrating through the conductor can be reserved when the conducting layer is covered on the surface of the insulating medium, so as to construct the gap.

Drawings

Fig. 1 is a schematic structural diagram of a mobile phone bezel assembly provided in the prior art;

fig. 2 is a schematic structural diagram of a mobile phone frame with a stand antenna provided thereon according to the prior art;

fig. 3 is a schematic structural diagram of a mobile phone frame with a metal frame antenna provided thereon in the prior art;

fig. 4 is a schematic structural diagram of a housing assembly of a communication device according to an embodiment of the present disclosure;

FIG. 5 is a partially enlarged schematic view of FIG. 4;

fig. 6 is a schematic perspective view of an electrical conductor of a housing assembly of a communication device according to an embodiment of the present disclosure;

FIG. 7 is a schematic side view of an electrical conductor of a housing assembly for a communication device according to an embodiment of the present disclosure;

fig. 8 is a schematic structural diagram of a housing assembly of a communication device according to an embodiment of the present invention, in which a back plate is made of an insulating material;

fig. 9 is a second schematic structural diagram of a housing assembly of a communication device according to an embodiment of the present invention, in which a back plate is made of an insulating material;

fig. 10 is a third schematic structural view illustrating a back plate of a housing assembly of a communication device according to an embodiment of the present invention being made of an insulating material;

fig. 11 is a fourth schematic structural view illustrating a back plate of a housing assembly of a communication device according to an embodiment of the present invention made of an insulating material;

fig. 12 is a schematic structural diagram of a back plate of a housing assembly of a communication device according to an embodiment of the present disclosure, the back plate being made of a conductive material;

fig. 13 is a second schematic structural diagram of a housing assembly of a communication device according to an embodiment of the present invention, in which a back plate is made of a conductive material;

fig. 14 is a third schematic structural diagram illustrating a back plate of a housing assembly of a communication device according to an embodiment of the present invention made of a conductive material;

fig. 15 is a fourth schematic structural view illustrating a back plate of a housing assembly of a communication device according to an embodiment of the present invention made of a conductive material;

fig. 16 is a schematic structural diagram illustrating an opening direction of a slit of a housing assembly of a communication device according to an embodiment of the present disclosure and a plane on which the housing is located are arranged in parallel;

fig. 17 is a second schematic structural view illustrating a gap of a housing assembly of a communication device according to an embodiment of the present invention, wherein the gap has an opening direction parallel to a plane in which the housing is located;

fig. 18 is a schematic structural diagram of a communication device housing assembly according to an embodiment of the present disclosure, in which an opening direction of a slot of the communication device housing assembly is disposed at a first angle with respect to a plane in which a housing is located;

fig. 19 is a second schematic structural view illustrating a second configuration of the communication device housing assembly according to the present invention, in which an opening direction of a slit is disposed at a first angle with respect to a plane of the housing;

fig. 20 is a schematic structural view illustrating an opening direction of a slit of a housing assembly of a communication device according to an embodiment of the present disclosure is perpendicular to a plane in which a housing is located;

fig. 21 is a second schematic structural view illustrating a gap of a housing assembly of a communication device according to an embodiment of the present invention, wherein the gap is vertically arranged with respect to a plane in which the housing is located;

fig. 22 is a schematic structural diagram illustrating an extension section provided at a gap of a housing assembly of a communication device according to an embodiment of the present disclosure;

fig. 23 is a second schematic structural view illustrating an extension section disposed at a gap of a housing assembly of a communication device according to an embodiment of the present invention;

fig. 24 is a schematic view illustrating a method for manufacturing a housing assembly of a communication device according to an embodiment of the present disclosure;

fig. 25 is a second schematic view illustrating a manufacturing method of a housing assembly of a communication device according to an embodiment of the present invention;

fig. 26 is a third schematic view illustrating a manufacturing method of a housing assembly of a communication device according to an embodiment of the present invention;

fig. 27 is a fourth schematic view of a manufacturing method of a housing assembly of a communication device according to an embodiment of the present application.

Reference numerals:

01-metal frame; 02-an antenna; 03-the main component; 04-frame of the shell; 100-a communication equipment housing assembly; 101-a housing; 1011-front frame; 1012-a back plate; 1013-middle frame; 102-an electrical conductor; 1021-an extension section; 103-a gap; 104-a groove; 1041-a first sidewall; 1042 — a second side wall; 1043-a third sidewall; 1044-a fourth sidewall; 1045-a fifth sidewall; 1046-sixth sidewall; 105-an insulating medium; 106-conductive layer.

Detailed Description

In a prior art communication device, such as a mobile phone, referring to fig. 1, a housing is usually manufactured by a metal plastic integral molding process, and an antenna is constructed by an exposed metal frame 01, which is usually disposed in two areas with the best clearance at the top and the bottom of the mobile phone. However, in the present mobile phone, technologies such as antenna combining and spatial multiplexing are added, and antennas such as 4G (4th Generation communication), WIFI (WIreless Fidelity), GPS (Global Positioning System) and the like have occupied the most suitable area for the antennas, and the space utilization of the top and bottom of the mobile phone tends to be saturated.

In addition, the structure of the conventional built-in antenna generally has two forms, as shown in fig. 2, the structure is a bracket antenna, and the antenna 02 is lifted off the ground by adopting a process of attaching a Flexible Printed Circuit Board (FPC) or a Laser Direct Structuring (LDS) or a Direct patterning system (PDS) or the like, so as to form a certain height space, and the main component 03 needs to be hollowed out and assembled independently, so that the occupied height and volume are large, and the structural strength is not favorable; as shown in fig. 3, the metal bezel antenna is formed on a bezel 04 of the housing. The metal frame antenna needs a certain clearance space, and along with the scheme requirements of a full-screen and narrow frame, the contradiction is more and more serious, and most of antennas need to be slotted on the frame to influence the structural strength.

Therefore, the antenna of the communication device in the prior art needs a larger planar space for layout, and now the antenna of the communication device has been almost full of the available space, and with the requirement of 5G (5th Generation, fifth Generation communication), the layout cannot be performed, and the antenna requirement of the communication device cannot be satisfied.

Referring to fig. 4 and 5, the present embodiment provides a communication device housing assembly 100, which includes a housing 101, the housing 101 includes a frame surrounding a peripheral edge of a display screen assembly 200, a tubular conductive body 102 is formed along the frame, a gap 103 penetrating through the conductive body 102 is formed on the conductive body 102 along an extending direction of the conductive body, a side wall of the gap 103 is broken, and when the conductive body 102 is energized, a resonance effect is generated at the gap 103.

The communication device housing assembly 100 provided by the embodiment of the application, referring to fig. 4 and 5, includes a housing 101, the housing includes a frame surrounding the peripheral edge of the display screen assembly 200, a tubular conductor 102 is formed along the frame, and a gap 103 penetrating through the conductor 102 is formed along the extending direction of the conductor, the side wall of the strong conductor of the gap 103 is disconnected, when the conductor 102 is powered on, an electromagnetic resonance effect is generated at the gap 103, and a brand new gap antenna is formed. Compared with the prior art, the antenna structure does not need a large plane space, can be distributed at the positions of traditional mobile phone antennas such as the top and the bottom of a mobile phone, and can also be distributed on metal frames at the left side and the right side of the mobile phone with a narrow plane space. Therefore, the position can be flexibly set, the internal layout of the communication equipment is convenient, and the antenna requirement is met.

Referring to fig. 4 and 5, in the communication device housing assembly 100 according to the embodiment of the present invention, the conductor 102 and the slot 103 form a slot antenna, and the structural principle thereof can be referred to fig. 6 and 7, that is, the conductor 102 is in a pipe shape and has the slot 103, and after the conductor 102 is energized, electromagnetic resonance can be generated at the slot 103, thereby realizing the function of the antenna.

The tubular conductor 102 is formed along the rim of the housing 101 and may be implemented in various ways, for example, by being integrally formed by forging, cutting or injection molding. Alternatively, referring to fig. 5, the conductor 102 may be formed by first forming a groove 104, filling the groove 104 with an insulating medium 105, and then covering the surface of the insulating medium 105 with a conductive layer 106. In comparison, the solution of first forming a groove 104 is simpler to manufacture. Therefore, referring to fig. 5, for convenience of manufacture, a groove 104 is formed in a frame of the housing 101, an opening of the groove 104 penetrates through the housing 101 along a length direction thereof, the groove 104 is filled with an insulating medium 105, a conductive layer 106 is disposed on a surface of the insulating medium 105 at the opening of the groove 104, a sidewall of the groove 104 is made of a conductive material, and the groove 104 and the conductive layer 106 form the tubular conductor 102. Thus, a groove 104 is first formed, the groove 104 is filled with an insulating medium 105, and finally a conductive layer 106 is formed on the surface of the insulating medium 105, so that the conductive layer 106 and the groove 104 together form the conductive body 102.

In the case of the shape of the groove 104, the depth of the groove 104 is the depth direction, the width of the groove is the width direction, the length of the groove is the length direction, and the opening of the groove 104 penetrating the housing 101 in the length direction means the length direction of the groove itself.

The conductive layer 106 may be fabricated by any one of printing, electroplating, electroless plating, vacuum plating, metal powder deposition curing, and attaching a metal thin film.

Meanwhile, the position of the gap 103 can be flexibly set according to actual needs. For example, the slit 103 is formed in a region of the conductive layer 106, or the slit 103 is formed on a sidewall of the groove 104, or the slit 103 is formed between the conductive layer 106 and the sidewall of the groove 104. The position of the slot 103 needs to consider various factors, for example, the slot 103 is as close as possible to the outside of the housing 101 of the communication device and is not blocked by other components, so as not to affect the performance of the antenna; and carrying out adaptive adjustment according to different layouts of the internal structure of the communication equipment.

Housing 101 of a communication device referring to fig. 8, the opening orientation of the recess 104 may be selected variously, for example, towards the top or bottom of the housing 101, towards the lateral exterior of the housing 101, or towards the lateral interior of the housing 101. The opening of the recess 104, if facing the lateral outside of the housing 101, affects the appearance and structural strength of the communication device; if the opening faces the lateral inside of the housing 101, the gap 103 is not easy to be arranged, and the housing 101 is generally flat and is vertically processed during manufacturing, and the opening of the groove 104 faces the lateral outside of the housing 101 or the lateral inside of the housing 101, the horizontal processing, i.e., the side processing, is required, and the side processing is difficult. Therefore, optionally, the opening of the groove 104 faces perpendicular to the plane of the display screen assembly 200, so that the opening of the groove 104 faces above or below the housing 101, and the display screen assembly 200 and the back cover are generally disposed above or below the housing 101, thereby not affecting the appearance and structural strength and facilitating the processing.

Generally, as shown in fig. 8, the housing 101 includes a front frame 1011 for fixing the display screen assembly 200 on the front surface of the communication device and a back plate 1012 covering the back surface of the communication device. The back plate 1012 may be a conductive metal back plate or a non-conductive back plate, and the specific structural form of the communication device housing assembly 100 has different configurations for back plates 1012 made of different materials. When the back plate 1012 is made of an insulating material, as shown in fig. 8, the housing includes a front frame 1011 for fixing the display screen assembly 200, a middle frame 1013 and a back plate 1012, the front frame 1011 is disposed on the back surface of the communication device, the back plate 1012 covers the front frame 1011, the middle frame 1013 is disposed between the front frame 1011 and the back plate 1012, the front frame 1011 and the back plate 1012 are respectively fixed on two sides of the middle frame 1013, the middle frame 1013 is made of a conductive material, the frame is composed of a portion of the front frame 1011, an edge of the middle frame 1013 and a portion of the back plate 1012, the recess 104 is formed on the middle frame 1013, three sidewalls of the recess 104 are a first sidewall 1041 and a second sidewall 1042 which are oppositely disposed, and a third sidewall 1043 connecting the first sidewall 1041 and the second sidewall 1042, the first sidewall 1041 is close to the outside of the housing 101, and the second sidewall 1042 is close to the inside of the housing 101. The directions of the inside of the housing 101 and the outside of the housing 101 described above can be referred to as directions indicated in fig. 8. The specific setting mode comprises the following steps:

as shown in fig. 8, the recess 104 opens towards the back plate 1012 and the slot 103 is formed in the conductive layer 106 area.

As shown in fig. 9, the recess 104 opens toward the back plate 1012, and the slit 103 is formed between the conductive layer 106 and the second sidewall 1042.

As shown in fig. 10, the recess 104 opens toward the back plate 1012, and the gap 103 is formed between the conductive layer 106 and the first sidewall 1041.

As shown in fig. 11, the opening of the groove 104 faces the front frame 1011, and a gap 103 is formed between the conductive layer 106 and the first side wall 1041.

When the back plate 1012 is made of a conductive material, as shown in fig. 12, the housing 101 includes a front frame 1011 and a back plate 1012 fastened and fixed to each other, the front frame 1011 is used to fix the display screen assembly 200, the back plate 1012 covers the back of the communication device, the frame is composed of a portion of the front frame 1011 and a portion of the back plate 1012, the groove 104 is formed on the back plate 1012, three sidewalls of the groove 104 are a fourth sidewall 1044 and a fifth sidewall 1045 which are oppositely arranged, and a sixth sidewall 1046 which connects the fourth sidewall 1044 and the fifth sidewall 1045, the fourth sidewall 1044 is close to the outside of the housing 101, and the fifth sidewall 1045 is close to the inside of the housing 101. The directions of the inside of the housing 101 and the outside of the housing 101 described above can be referred to as directions indicated in fig. 12. The following is an example of a scheme in which the back plate 1012 is made of a conductive material.

As shown in fig. 12, the opening of the groove 104 faces the front frame 1011, and the slit 103 is formed on the sixth side wall 1046.

As shown in fig. 13, the opening of the groove 104 faces the front frame 1011, and a gap 103 is formed between the sixth side wall 1046 and the fifth side wall 1045.

As shown in fig. 14, the opening of the groove 104 faces the front frame 1011, and a gap 103 is formed between the sixth side wall 1046 and the fourth side wall 1044.

As shown in fig. 15, the opening of the groove 104 faces the front frame 1011, and a gap 103 is formed between the conductive layer 106 and the fourth side wall 1044.

Since the groove 104 is formed on the back plate 1012, the opening of the groove 104 cannot face the back plate 1012, and optionally the opening of the groove 104 faces the front frame 1011, provided that the opening of the groove 104 faces above or below the housing 101.

The opening direction of the slit 103 may be implemented in various ways, for example, as shown in fig. 16 and 17, the opening direction of the slit 103 is arranged in parallel with the plane of the housing 101. When the opening direction of the slit 103 is parallel to the plane of the housing 101, the occupied area of the housing 101 in the plane is reduced when the slit 103 is constructed, which is beneficial to reducing the overall size of the housing 101.

As shown in fig. 18 and 19, the opening direction of the slit 103 is set at a first angle to the plane of the housing 101. At this time, the space occupied by the gap 103 after construction can be flexibly adjusted according to the special shape of the internal space of the communication equipment, and the layout is convenient.

As shown in fig. 20 and 21, the opening direction of the slit 103 is arranged perpendicular to the plane of the housing 101. In this case, the gap 103 is formed to reduce the space occupied in the thickness direction of the housing 101, which is advantageous for reducing the overall thickness of the housing 101.

For convenience of understanding, a three-dimensional coordinate system is established by taking three coordinate axes of the length direction, the width direction and the thickness direction of the casing 101 as three coordinate axes, specifically, an X axis is taken along the length direction of the casing 101, a Y axis is taken along the width direction of the casing 101, and a Z axis is taken along the thickness direction of the casing 101. As shown in fig. 16 and 17, the opening direction of the slit 103 is parallel to the plane of the housing 101, and the end portions of the conductors 102 on both sides of the slit 103 are shown as having overlapping portions in the projection on the X axis and not overlapping in the projection on the Z axis; as shown in fig. 18 and 19, the opening direction of the slit 103 and the plane where the housing 101 is located are at a first angle, and are not perpendicular, and the first angle is represented as that the end portions of the conductors 102 at the two sides of the slit 103 have overlapping portions in the projections on the X axis and the Z axis, wherein the first angle can be flexibly adjusted according to the actual structural requirement, and the range of the first angle is optionally 0 to 90 degrees; as shown in fig. 20 and 21, the opening direction of the slit 103 is perpendicular to the plane of the housing 101, and the end portions of the conductors 102 on both sides of the slit 103 are shown, and the projections on the X axis do not overlap, and the projections on the Z axis overlap.

The overlapping area of the conductive parts at the two sides of the gap 103 influences the intensity of electromagnetic induction, different overlapping areas can be set as required, and in order to more reasonably utilize the space, the opening of the gap 103 can also be provided with an extension section 1021 to correspondingly increase the overlapping area, so that the intensity of the electromagnetic induction can be adjusted. As shown in fig. 22 and 23, the opening of the slit 103 has an extending section 1021, and the extending section 1021 is parallel to or perpendicular to the plane of the casing 101.

Optionally, the width of the gap 103 is 0.05-5 mm. The width of the gap 103 is 0.05-5 mm, so that when the conductor 102 is electrified, the gap 103 generates an electromagnetic resonance effect, and an antenna function is realized.

In a second aspect, an embodiment of the present application provides a communication device, which includes a display screen assembly 200, a circuit board, a power supply, and a communication device housing assembly 100 according to any of the above technical solutions, where the display screen assembly 200 is fixed on the communication device housing assembly 100, the power supply and the circuit board are located in the communication device housing assembly 100, and the power supply is connected and conducted with the conductor 102 of the communication device housing assembly 100 through the circuit board.

The communication equipment provided by the embodiment of the application comprises a display screen assembly 200, a circuit board and a power supply, and further comprises the communication equipment shell assembly 100 according to any one of the technical schemes, so that the position can be flexibly set, the internal layout of the communication equipment is facilitated, and the antenna requirement is met. Meanwhile, the display screen assembly 200 is generally fixed on the communication device housing assembly 100 for displaying information of the communication device, facilitating interaction with a user, the power supply and the circuit board are located in the communication device housing assembly 100, and the power supply is connected and conducted with the conductor 102 of the communication device housing assembly 100 through the circuit board, so as to provide power for the conductor 102 of the communication device housing assembly 100 to drive the antenna to work.

In a third aspect, an embodiment of the present application provides a manufacturing method for manufacturing a communication device housing assembly according to any one of the above technical solutions, including:

a pipe-shaped conductor 102 is manufactured along the frame of the shell 101;

a slit 103 is formed in the conductive body 102 so as to penetrate the conductive body 102 in the extending direction of the conductive body 102.

The manufacturing method provided by the embodiment of the application can be conveniently manufactured, and as the communication equipment shell assembly 100 of any technical scheme does not need a large plane space, the communication equipment shell assembly can be distributed at the positions of traditional mobile phone antennas such as the top and the bottom of a mobile phone, and can also be distributed on metal frames on the left side and the right side of the mobile phone with a narrow plane space. Therefore, the position can be flexibly set, the internal layout of the communication equipment is convenient, and the antenna requirement is met.

With reference to the third aspect, in a first optional implementation manner of the third aspect, making the conductive body 102 in a pipe shape along a frame of the casing 101 includes:

a groove 104 is formed along the rim of the case 101;

filling an insulating medium 105 in the groove 104;

the surface of the insulating medium 105 is covered with the conductive layer 106, and the groove 104 and the conductive layer 106 form the pipe-like conductor 102.

The pipe-shaped conductor 102 may be formed by forging, cutting, or injection molding, or the conductor 102 may be formed by first forming a groove 104, filling the groove 104 with an insulating medium 105, and then covering the surface of the insulating medium 105 with a conductive layer 106. In comparison, the solution of first forming a groove 104 is simpler to manufacture.

With reference to the first optional implementation manner of the third aspect, in a second optional implementation manner of the third aspect, the forming the groove 104 along the rim of the casing 101 includes:

removing materials along the frame of the shell 101 to form a groove 104;

or, the frame of the housing 101 is bent to form the groove 104.

The formation of the groove 104 may be by a material removal process, such as machining; or bending and forming.

With reference to the third aspect, in a third optional implementation manner of the third aspect, making the pipe-shaped conductive body 102 along the frame of the casing 101 includes:

the frame of the case 101 is bent to form the conductor 102. That is, the conductor 102 is integrally formed by bending.

With reference to the third aspect and any one of the first to third optional implementation manners of the third aspect, in a fourth optional implementation manner of the third aspect, constructing a slit 103 on the conductive body 102, the slit penetrating through the conductive body 102 along an extending direction of the conductive body 102, includes:

the frame of the housing 101 is subjected to a stripping process to form a slit 103 penetrating the conductor 102. When the gap 103 is on the frame of the casing 101, the gap 103 can be constructed by removing material from the corresponding position of the frame of the casing 101.

With reference to the first or second optional implementation manner of the third aspect, in a fifth optional implementation manner of the third aspect, constructing a slit 103 on the conductive body 102, the slit penetrating through the conductive body 102 along the extending direction of the conductive body 102, includes:

when the conductive body 102 is composed of the groove 104 and the conductive layer 106 on the surface of the insulating medium 105, and the gap 103 is in the conductive layer, the gap 103 penetrating through the conductive body 102 may be reserved when the conductive layer 106 is covered on the surface of the insulating medium 105 to construct the gap 103.

For example, specific manufacturing steps of the manufacturing method provided in the embodiment of the present application may refer to fig. 24, which are original shapes of the housing 101; referring to fig. 25, the casing 101 is subjected to material removal processing to obtain a groove 104; referring to fig. 26, an insulating dielectric 105 is filled in the groove 104; referring to fig. 27, a conductive layer 106 is formed on the surface of an insulating medium to form a conductive body 102, and a slot 103 is formed to realize a slot antenna structure.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A communication equipment shell assembly is characterized by comprising a shell, wherein the shell comprises a frame surrounding the peripheral edge of a display screen assembly, a tubular conductor is formed along the frame, a gap penetrating through the conductor is formed in the conductor along the extending direction of the conductor, the gap cuts off the side wall of the conductor, and when the conductor is electrified, an electromagnetic resonance effect is generated at the gap;

a groove is formed in the frame, an opening of the groove penetrates through the shell along the length direction of the groove, an insulating medium is filled in the groove, a conducting layer is arranged on the surface of the insulating medium at the opening of the groove, the side wall of the groove is made of a conducting material, and the groove and the conducting layer form a tubular conductor.

2. The communication equipment housing assembly of claim 1 wherein the gap is formed on the conductive layer, or the gap is formed on a sidewall of the recess, or the gap is formed between the conductive layer and the sidewall of the recess.

3. The communications device housing assembly of claim 2, wherein the recess opens perpendicular to a plane in which the display screen assembly is located.

4. The communication device housing assembly of claim 2 or 3, wherein the housing comprises a front frame, a middle frame, and a back plate, the front frame is used for fixing the display screen assembly, the back plate is covered on the back surface of the communication equipment, the middle frame is positioned between the front frame and the back plate, the front frame and the back plate are respectively fixed at two sides of the middle frame, the back plate is made of an insulating material, the middle frame is made of a conductive material, the frame is composed of a part of the front frame, the edge of the middle frame and a part of the back plate, the groove is formed on the middle frame, three side walls of the groove are a first side wall and a second side wall which are oppositely arranged, and a third sidewall connecting the first sidewall and the second sidewall, the first sidewall being adjacent the housing exterior and the second sidewall being adjacent the housing interior.

5. The communications device housing assembly of claim 4, wherein the opening of the recess faces the back plate, the slot being formed in the conductive layer.

6. The communications device housing assembly of claim 4, wherein the opening of the recess is oriented toward the back plate, the gap being formed between the conductive layer and the second sidewall.

7. The communications device housing assembly of claim 4, wherein the opening of the recess is toward the back plate, the gap being formed between the conductive layer and the first sidewall.

8. The communications device housing assembly of claim 4, wherein the opening of the recess faces the front frame, the gap being formed between the conductive layer and the first sidewall.

9. The communication device housing assembly according to claim 2 or 3, wherein the housing includes a front frame and a back plate fastened to each other, the front frame is used to fix the display screen assembly, the back plate covers the back surface of the communication device, the back plate is made of a conductive material, the frame is composed of a portion of the front frame and a portion of the back plate, the groove is formed on the back plate, three side walls of the groove are a fourth side wall and a fifth side wall which are oppositely arranged, and a sixth side wall which connects the fourth side wall and the fifth side wall, the fourth side wall is close to the outside of the housing, and the fifth side wall is close to the inside of the housing.

10. The communications equipment housing assembly of claim 9 wherein the opening of the recess is toward the front frame, the slot being formed in the sixth side wall.

11. The communications equipment housing assembly of claim 9 wherein the opening of the recess is toward the front frame, the gap being formed between the sixth sidewall and the fifth sidewall.

12. The communications equipment housing assembly of claim 9 wherein the opening of the recess is toward the front frame, the gap being formed between the sixth side wall and the fourth side wall.

13. The communications device housing assembly of claim 9, wherein the opening of the recess faces the front frame, and the gap is formed between the conductive layer and the fourth sidewall.

14. The communication equipment housing assembly according to any one of claims 1 to 3, wherein the opening direction of the slit is parallel to the plane of the housing, or the opening direction of the slit is at a first angle to the plane of the housing.

15. The communication device housing assembly of claim 4, wherein the opening direction of the slit is parallel to the plane of the housing, or the opening direction of the slit is at a first angle to the plane of the housing.

16. The communication equipment housing assembly according to any one of claims 5 to 8, wherein the opening direction of the slit is parallel to the plane of the housing, or the opening direction of the slit is at a first angle to the plane of the housing.

17. The communication device housing assembly of claim 9, wherein the opening direction of the slit is parallel to the plane of the housing, or the opening direction of the slit is at a first angle to the plane of the housing.

18. The communication equipment housing assembly according to any one of claims 10 to 13, wherein the opening direction of the slit is parallel to the plane of the housing, or the opening direction of the slit is at a first angle to the plane of the housing.

19. The communications device housing assembly of claim 14, wherein the slot is oriented perpendicular to a plane in which the housing is disposed.

20. The communication equipment housing assembly of any one of claims 1 to 3 wherein the gap has a width of 0.05 to 5 mm.

21. A communication device comprises a display screen assembly, a circuit board and a power supply, and is characterized by further comprising the communication device shell assembly of any one of claims 1-17, wherein the display screen assembly is fixed on the communication device shell assembly, the power supply and the circuit board are located in the communication device shell assembly, and the power supply is connected and conducted with a conductor of the communication device shell assembly through the circuit board.

22. A method of manufacturing the communication equipment housing assembly of any one of claims 1 to 20, comprising:

manufacturing a pipeline-shaped conductor along the frame of the shell;

constructing a gap on the conductor, wherein the gap penetrates through the conductor along the extending direction of the conductor;

wherein, the electric conductor of the frame preparation pipeline form along the casing includes:

forming a groove along the rim of the housing;

filling an insulating medium in the groove;

23. The method of manufacturing of claim 22, wherein the forming a groove along a rim of the housing comprises:

removing materials along the frame of the shell to form the groove;

or bending and molding the frame of the shell to form the groove.

24. The method of manufacturing of claim 22, wherein the forming of the conduit-like conductor along the rim of the housing comprises:

and bending and molding the frame of the shell to form the conductor.

25. The manufacturing method according to any one of claims 22 to 24, wherein the forming of the slit in the conductor, which penetrates the conductor in the extending direction of the conductor, includes:

and removing the material on the frame of the shell, and forming the gap penetrating through the conductor.

26. The manufacturing method according to claim 22 or 23, wherein the step of forming a slit in the conductor, the slit penetrating the conductor in an extending direction of the conductor, comprises:

and when the surface of the insulating medium is covered with the conducting layer, the gap penetrating through the conductor is reserved.