CN112016458A

CN112016458A - Ultrasonic wave receiving and dispatching structure, fingerprint identification module, display panel and display module

Info

Publication number: CN112016458A
Application number: CN202010880991.2A
Authority: CN
Inventors: 崔钊; 张锋; 刘文渠; 吕志军; 董立文; 宋晓欣; 孟德天; 王利波; 侯东飞; 黄海涛; 姚琪
Original assignee: BOE Technology Group Co Ltd
Current assignee: BOE Technology Group Co Ltd
Priority date: 2020-08-27
Filing date: 2020-08-27
Publication date: 2020-12-01

Abstract

The embodiment of the application provides an ultrasonic wave receiving and dispatching structure, fingerprint identification module, display panel and display module assembly. This ultrasonic wave receiving and dispatching structure includes: the piezoelectric transducer comprises a first conductive structure, a piezoelectric structure and a second conductive structure which are sequentially stacked; one of the first conductive structure and the second conductive structure is used for forming a gate structure of the driving device structure and/or is used for being arranged at the same layer with the gate structure of the driving device structure. On one hand, the thickness of a film layer which needs to be penetrated by ultrasonic waves in the ultrasonic wave transmitting and/or receiving stage can be reduced, so that the energy loss in the ultrasonic wave transmission process is reduced; on the other hand, the electric signal formed by the ultrasonic wave reflected by the valleys and ridges of the fingerprint can directly act on the grid of the driving device structure, the obtained signal strength is stronger, and the sensitivity and accuracy of fingerprint identification can be effectively improved.

Description

Ultrasonic wave receiving and dispatching structure, fingerprint identification module, display panel and display module

Technical Field

The application relates to the technical field of display, particularly, this application relates to an ultrasonic wave receiving and dispatching structure, fingerprint identification module, display panel and display module assembly.

Background

Fingerprint recognition, a technology for recognizing human biometrics, has been increasingly applied to more display products in recent years, providing more convenience for the implementation of human-computer interaction (user and display product) functions, and also protecting the privacy of users to a greater extent.

The existing fingerprint identification technology is divided into the following steps according to the working principle: optical fingerprint identification, capacitive fingerprint identification and ultrasonic fingerprint identification. When the finger of the user contains oil stains or stains, the accuracy and speed of fingerprint identification by adopting an optical fingerprint identification or capacitive fingerprint identification technology can be greatly reduced, and the fingerprint identification by adopting an ultrasonic fingerprint identification technology cannot be influenced by the oil stains or the stains on the finger.

But the existing ultrasonic fingerprint identification product has the defect that the sensitivity or the accuracy is difficult to improve.

Disclosure of Invention

This application provides an ultrasonic wave receiving and dispatching structure, fingerprint identification module, display panel and display module assembly to the shortcoming of current mode for it is difficult to the technical problem that improves to solve prior art and have sensitivity or the rate of accuracy of ultrasonic wave fingerprint identification product.

In a first aspect, an embodiment of the present application provides an ultrasound transceiving structure, including: the piezoelectric transducer comprises a first conductive structure, a piezoelectric structure and a second conductive structure which are sequentially stacked;

one of the first conductive structure and the second conductive structure is used for forming a gate structure of the driving device structure and/or is used for being arranged at the same layer with the gate structure of the driving device structure.

In a second aspect, an embodiment of the present application provides a fingerprint identification module, including: a first substrate, a first driver device structure, and an ultrasonic transceiving structure as provided in the first aspect;

the first driving device structure comprises a first active structure, a first grid structure and a first source drain structure which are sequentially stacked;

the first active structure is positioned on one side of the first substrate;

the first conductive structure of the ultrasonic transceiving structure forms at least part of the first grid structure and/or is arranged on the same layer as the first grid structure;

the second conductive structure of the ultrasonic receiving and transmitting structure is positioned on one side of the first source drain structure close to the first grid structure, or the second conductive structure and the first source drain structure are arranged on the same layer;

one side of the first substrate, which is far away from the first active structure, is used for being attached to one side of the display module.

In a third aspect, an embodiment of the present application provides a display panel, including: a display module and a fingerprint identification module as provided in the second aspect;

one side of the display film group is attached to one side, away from the first active structure, of the first substrate of the fingerprint identification module.

In a fourth aspect, an embodiment of the present application provides a display module, including: a substrate, a display driving device structure, a pixel structure, and an ultrasonic wave transceiving structure as provided in the first aspect;

the display driving device structure comprises an active structure, a grid structure and a source drain structure which are sequentially stacked;

the active structure is positioned on one side of the substrate;

the first conductive structure of the ultrasonic transceiving structure forms at least part of a grid structure and/or is arranged on the same layer as the grid structure;

the second conductive structure of the ultrasonic receiving and transmitting structure is positioned on one side of the source drain structure close to the grid structure, or the second conductive structure and the source drain structure are arranged on the same layer;

the pixel structure is positioned on one side of the source drain structure far away from the grid structure.

In a fifth aspect, an embodiment of the present application provides a method for manufacturing a fingerprint identification module, including:

manufacturing a first active structure on one side of a first substrate;

depositing a first insulating layer on the first substrate and one side of the first active structure;

manufacturing a first conductive structure on the first insulating layer, and enabling the first conductive structure to form at least part of a first grid structure;

depositing a second insulating layer on the first insulating layer and the first conductive structure;

manufacturing a piezoelectric structure on the second insulating layer;

depositing a third insulating layer on the second insulating layer and the piezoelectric structure;

manufacturing a second conductive structure on the third insulating layer;

depositing a fourth insulating layer on the third insulating layer and the second conductive structure;

and manufacturing a first source drain structure on the fourth insulating layer.

In a sixth aspect, an embodiment of the present application provides a method for manufacturing a fingerprint identification module, including:

manufacturing a first active structure on one side of a first substrate;

manufacturing a piezoelectric structure on the second insulating layer;

manufacturing a second conductive structure and a first source drain structure on the third insulating layer;

and depositing a fourth insulating layer on the third insulating layer, the second conductive structure and the first source drain structure.

In a seventh aspect, an embodiment of the present application provides a method for manufacturing a display module, including:

manufacturing an active structure on one side of a substrate;

depositing a first insulating layer on one side of the substrate and the active structure;

manufacturing a first conductive structure on the first insulating layer, and enabling the first conductive layer to form at least part of a grid structure;

manufacturing a piezoelectric structure on the second insulating layer;

manufacturing a second conductive structure on the third insulating layer;

manufacturing a source drain electrode structure on the fourth insulating layer;

depositing a flat layer on the fourth insulating layer and the source-drain structure;

and manufacturing a pixel structure on the flat layer.

In an eighth aspect, an embodiment of the present application provides a method for manufacturing a display module, including:

manufacturing an active structure on one side of a substrate;

manufacturing a piezoelectric structure on the second insulating layer;

manufacturing a second conductive structure and a source drain electrode structure on the third insulating layer;

depositing a flat layer on the third insulating layer, the second conductive structure and the source drain structure;

and manufacturing a pixel structure on the flat layer.

The beneficial technological effect that the ultrasonic wave receiving and dispatching structure that this application embodiment provided brought includes: in the sequentially stacked first conductive structure, the piezoelectric structure and the second conductive structure, the first conductive structure and the second conductive structure can be respectively used as a driving channel and a sensing channel for bearing touch signals, and the piezoelectric structure can realize the transmission and/or reception of ultrasonic waves; one of the first conductive structure and the second conductive structure is used for forming a grid structure of the driving device structure and/or is arranged on the same layer as the grid structure of the driving device structure, so that at least part of the ultrasonic transceiving structure can be integrated into the driving device structure of the ultrasonic fingerprint identification product, and the thickness of a film layer through which ultrasonic waves need to penetrate in the ultrasonic wave transmitting and/or receiving stage can be reduced, and the energy loss in the ultrasonic wave transmission process is reduced; on the other hand, the electric signal formed by the ultrasonic wave reflected by the valleys and ridges of the fingerprint can directly act on the grid of the driving device structure, the obtained signal strength is stronger, and the sensitivity and accuracy of fingerprint identification can be effectively improved.

The fingerprint identification module that this application embodiment provided and preparation method, the beneficial technological effect that display panel brought includes: the ultrasonic receiving and transmitting structure is integrated into a first driving device structure of the fingerprint identification module, specifically, a first conductive structure is formed into a first grid structure (and/or arranged at the same layer as the first grid structure) of at least part of the first driving device structure, a piezoelectric structure is designed between the first grid structure and a first source drain structure of the first driving device structure, and a second conductive structure is arranged at one side (or arranged at the same layer as the first source drain structure) of the first source drain structure of the first driving device structure, which is close to the first grid structure, so that the thickness of a film layer through which ultrasonic waves need to penetrate in the ultrasonic transmitting and/or receiving stage can be reduced on one hand, and the energy loss in the ultrasonic transmission process is reduced; on the other hand, an electric signal formed by ultrasonic waves reflected by valleys and ridges of the fingerprint can directly act on the grid electrode of the first driving device structure, the obtained signal strength is stronger, and the sensitivity and the accuracy of fingerprint identification can be effectively improved; on the other hand, can be favorable to realizing the attenuate of fingerprint identification module.

The display module and the preparation method thereof provided by the embodiment of the application have the following beneficial technical effects: the ultrasonic receiving and transmitting structure is integrated into a driving device structure of a display module, specifically, a first conductive structure is formed into a grid structure (and/or arranged at the same layer as the grid structure) of at least part of the display driving device structure, a piezoelectric structure is designed between the grid structure and a source drain structure of the display driving device structure, and a second conductive structure is arranged at one side (or arranged at the same layer as the source drain structure) of the source drain structure of the display driving device structure, which is close to the grid structure, so that the thickness of a film layer through which ultrasonic waves need to penetrate in the ultrasonic transmitting and/or receiving stage can be reduced on one hand, and the energy loss in the ultrasonic transmission process is reduced; on the other hand, an electric signal formed by ultrasonic waves reflected by valleys and ridges of the fingerprint can directly act on a grid electrode of a display driving device structure, the obtained signal strength is stronger, and the sensitivity and the accuracy of fingerprint identification can be effectively improved; on the other hand, the thinning of the display module can be favorably realized.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The described and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of an ultrasonic transceiver structure according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a fingerprint identification module according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of another fingerprint identification module according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of a display module according to an embodiment of the present disclosure;

fig. 6 is a schematic flowchart illustrating a manufacturing method of a fingerprint identification module according to an embodiment of the present disclosure;

fig. 7 is a schematic flowchart illustrating a method for manufacturing a fingerprint identification module according to an embodiment of the present disclosure;

fig. 8 is a schematic flowchart illustrating a manufacturing method of another fingerprint identification module according to an embodiment of the present disclosure;

fig. 9 is a schematic flowchart of a method for manufacturing a fingerprint identification module according to another embodiment of the present disclosure;

fig. 10 is a schematic flowchart illustrating a manufacturing method of a display module according to an embodiment of the present disclosure;

fig. 11 is a schematic flowchart illustrating a method for manufacturing a display module according to an embodiment of the present disclosure;

fig. 12 is a schematic flow chart illustrating a manufacturing method of another display module according to an embodiment of the present disclosure.

In the figure:

100-an ultrasonic transceiver structure; 101-an ultrasonic emission structure; 102-an ultrasonic receiving structure;

110-a first conductive structure;

120-a piezoelectric structure;

130-a second conductive structure;

200-fingerprint identification module;

210-a first substrate;

220 — a first drive device structure; 221-a first active structure; 222-a first gate structure; 223-a first source drain structure;

230-a first buffer layer; 240-a first isolation layer; 250-a reflective layer; 260-a first insulating layer;

300 a-a display module;

310 a-a second substrate;

320 a-a second drive device structure; 321 a-a second active structure; 322 a-a second gate structure; 323 a-a second source drain structure;

330 a-pixel structure; 340 a-a second buffer layer; 350 a-a second isolation layer; 360 a-second insulating layer;

300 b-a display module; 301 b-display area; 302 b-non-display area;

310 b-a substrate;

320 b-display driver device structure; 321 b-an active structure; 322 b-gate structure; 323 b-source drain structure;

330 b-pixel structure;

340 b-a buffer layer; 350 b-an isolation layer; 360 b-an insulating layer;

400-a display panel; 410-optical glue; 500-fingerprint;

the dotted arrows in the figure indicate the propagation direction of the ultrasonic waves.

Detailed Description

Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.

The terms referred to in this application will first be introduced and explained:

ultrasonic wave: the frequency range of sound that can be heard by the human ear is 20Hz (hertz) to 20KHz (kilohertz), waves with a frequency lower than 20Hz are called infrasonic waves, waves with a frequency higher than 20KHz are called ultrasonic waves, and the frequency is the number of vibrations completed within 1s (second).

Piezoelectric material: the material is a functional material capable of realizing the interconversion between mechanical signals and electrical signals, mainly comprises materials such as quartz crystals, piezoelectric ceramics, organic PVDF (polyvinylidene fluoride) piezoelectric films, aluminum nitride and the like, and has positive piezoelectric effect and reverse piezoelectric effect. When a certain force is applied on the piezoelectric material, positive and negative charges in direct proportion to the magnitude of the applied force appear on the surface of the material, and the phenomenon is the positive piezoelectric effect of the material; when a certain voltage is applied to the piezoelectric material, the piezoelectric material is deformed to generate vibration, and the like, which is an inverse piezoelectric effect of the piezoelectric material.

The inventors of the present application have studied and found that ultrasonic waves have high frequency and short wavelength, and thus have good directivity and penetration along a straight line. The ultrasonic fingerprint identification mainly comprises the following steps: the driving channel (Tx) excites the piezoelectric material to deform after receiving the electric signal so as to send out ultrasonic waves; ultrasonic waves are transmitted to valleys and ridges of the fingers and then reflected, and the reflected ultrasonic signals are different in intensity; the reflected ultrasonic wave excites the piezoelectric material again to convert the mechanical signal into an electric signal in a sensing channel (Rx), and then the electric signal is sensed by a driving device (such as a TFT array) and imaged, so that fingerprint identification is realized.

In the existing ultrasonic fingerprint identification product, a special driving device structure is usually configured for an ultrasonic receiving and transmitting structure, so that the defects that the thickness of a film layer is large, the energy loss in the ultrasonic transmission process is large, and the sensitivity or the accuracy of the ultrasonic fingerprint identification product is difficult to improve exist. Especially, adopt ultrasonic wave fingerprint identification technique's display product, fingerprint identification module is located display module's below usually, and fingerprint identification module and display module do not share the drive device structure moreover, therefore rete thickness that the ultrasonic wave need pass has further been increaseed to rete thickness, has increased ultrasonic wave transmission in-process energy loss.

The application provides an ultrasonic wave receiving and dispatching structure, fingerprint identification module, display panel and display module assembly aims at solving prior art as above technical problem.

The following describes the technical solutions of the present application and how to solve the technical problems in detail with specific embodiments.

An embodiment of the present application provides an ultrasonic wave transceiving structure 100, a schematic structural diagram of the ultrasonic wave transceiving structure 100 is shown in fig. 1, and the ultrasonic wave transceiving structure includes: the first conductive structure 110, the piezoelectric structure 120, and the second conductive structure 130 are sequentially stacked.

One of the first conductive structure 110 and the second conductive structure 130 is used to form a gate structure of a driving device structure and/or is used to be disposed at the same layer as the gate structure of the driving device structure.

In the present embodiment, the ultrasonic wave transceiving structure 100 employs the first conductive structure 110, the piezoelectric structure 120, and the second conductive structure 130, which are sequentially stacked. The first conductive structure 110 and the second conductive structure 130 can be used as a driving channel and a sensing channel for carrying a touch signal, respectively. The piezoelectric structure 120 may enable transmission and/or reception of ultrasonic waves.

One of the first conductive structure 110 and the second conductive structure 130, which is used to form a gate structure of the driving device structure and/or is disposed on the same layer as the gate structure of the driving device structure, may enable at least a portion of the ultrasonic transceiver structure 100 to be integrated into the driving device structure of the ultrasonic fingerprint identification product. On one hand, the thickness of a film layer which needs to be penetrated by the ultrasonic wave in the ultrasonic wave transmitting and/or receiving stage can be reduced, so that the energy loss in the ultrasonic wave transmission process is reduced; on the other hand, the electric signal formed by the ultrasonic wave reflected by the valleys and ridges of the fingerprint 500 can directly act on the gate of the driving device structure, the obtained signal strength is stronger, and the sensitivity and accuracy of fingerprint identification can be effectively improved.

In some possible embodiments, the other of the first conductive structure 110 and the second conductive structure 130 is configured to be disposed at the same layer as the source and drain structures of the driving device structure.

In this embodiment, the other one of the first conductive structure 110 and the second conductive structure 130 is disposed on the same layer as the source/drain structure of the driving device structure, which is beneficial to thinning a film layer, reducing energy loss during an ultrasonic wave propagation process, and simplifying a manufacturing process.

Based on the same inventive concept, the embodiment of the present application provides a fingerprint identification module 200, and the schematic structural diagram of the fingerprint identification module 200 is as shown in fig. 2 or fig. 3, and includes: a first substrate 210, a first driver device structure 220, and any of the ultrasonic transceiver structures 100 as provided in the previous embodiments.

The first driving device structure 220 includes a first active structure 221, a first gate structure 222, and a first source-drain structure 223, which are sequentially stacked.

The first active structure 221 is located at one side of the first substrate 210.

The first conductive structure 110 of the ultrasound transceiver structure 100 forms at least a portion of the first gate structure 222 and/or is disposed on the same layer as the first gate structure 222.

The second conductive structure 130 of the ultrasonic transceiver structure 100 is located on one side of the first source-drain structure 223 close to the first gate structure 222, or the second conductive structure 130 and the first source-drain structure 223 are disposed on the same layer.

The side of the first substrate 210 away from the first active structure 221 is used for being attached to one side of the display module 300 a.

In this embodiment, the fingerprint identification module 200 integrates the ultrasonic transceiver structure 100 into the first driver structure 220 of the fingerprint identification module 200, specifically, the first conductive structure 110 forms at least part of the first gate structure 222 of the first driver structure 220 (and/or is disposed on the same layer as the first gate structure 222), the piezoelectric structure 120 is designed between the first gate structure 222 and the first source/drain structure 223 of the first driver structure 220, and the second conductive structure 130 is disposed on one side of the first source/drain structure 223 of the first driver structure 220, which is close to the first gate structure 222 (or is disposed on the same layer as the first source/drain structure 223).

The fingerprint identification module 200 provided by this embodiment adopts the above scheme, which can reduce the thickness of the film layer through which the ultrasonic wave needs to penetrate in the ultrasonic wave transmitting and/or receiving stage, thereby reducing the energy loss in the ultrasonic wave propagation process; on the other hand, the electric signal formed by the ultrasonic wave reflected by the valleys and ridges of the fingerprint 500 can directly act on the gate of the first driving device structure 220, the obtained signal strength is stronger, and the sensitivity and accuracy of fingerprint identification can be effectively improved; in another aspect, the thinning of the fingerprint identification module 200 may be facilitated.

The fingerprint identification principle of the fingerprint identification module 200 provided in this embodiment is as follows:

in the transmitting stage of the ultrasonic wave, the second conductive structure 130 may be used as a Tx (driving channel) electrode, and a certain voltage is applied, at this time, the voltage of the first conductive structure 110 (the first gate structure 222) is 0V (volt), a certain potential difference is formed between the second conductive structure 130 and the first conductive structure 110, and the piezoelectric structure 120 deforms and starts to vibrate to emit the ultrasonic wave.

After the ultrasonic wave meets the valleys and ridges of the finger and is reflected, the ultrasonic wave is applied to the piezoelectric structure 120, the voltage of the second conductive structure 130 is 0V, the first conductive structure 110 is not grounded, the first conductive structure 110 can be used as an Rx (sensing channel) electrode at the time, an electric signal generated by the piezoelectric structure 120 is detected, and then fingerprint imaging is performed through an APS (Advanced Photo System) circuit, so that fingerprint identification is performed.

In some possible embodiments, the fingerprint identification module 200 further includes at least one of a first buffer layer 230, a first isolation layer 240, a reflective layer 250, and a first insulating layer 260.

In this embodiment, the first buffer layer 230 can reduce the impact that the fingerprint identification module 200 may be subjected to, and protect the film layers. The first isolation layer 240 can prevent water or oxygen from penetrating through the first substrate 210 and immersing into the fingerprint identification module 200, which affects the performance of the first driving device structure 220 and the light emitting characteristics of the pixel structure 330 a. The first insulating layer 260 may block the conductive film layer that does not need electrical connection.

In the case that the fingerprint identification module 200 further includes the first buffer layer 230, optionally, the first buffer layer 230 is located between the first substrate 210 and the first active structure 221.

In the case that the fingerprint identification module 200 further includes the first isolation layer 240, optionally, the first isolation layer 240 is located between the first substrate 210 and the first active structure 221.

In the case that the fingerprint identification module 200 further includes the reflective layer 250, optionally, the reflective layer 250 is located on a side of the first source-drain structure 223 far away from the piezoelectric structure 120 of the ultrasonic transceiver structure 100.

In a case that the fingerprint identification module 200 further includes the first insulating layer 260, optionally, the first insulating layer 260 is disposed at least one of between the first substrate 210 and the first gate structure 222, between the first gate structure 222 and the piezoelectric structure 120, between the piezoelectric structure 120 and the second conductive structure 130, between the second conductive structure 130 and the first source/drain structure 223, and a side of the first source/drain structure 223 far away from the second conductive structure 130.

Alternatively, the first insulating layer 260 may use a silicon nitride material.

Based on the same inventive concept, the embodiment of the present application provides a display panel 400, and a schematic structural diagram of the display panel 400 is shown in fig. 4, and the display panel 400 includes: a display module 300a, and any one of the fingerprint recognition modules 200 as provided in the previous embodiments.

One side of the display film assembly is attached to a side of the first substrate 210 of the fingerprint identification module 200 away from the first active structure 221.

In this embodiment, the display panel 400 includes the display module 300a and any one of the fingerprint recognition modules 200 provided in the foregoing embodiments, and not only can display a picture, but also can realize fingerprint recognition, and can associate fingerprint recognition with picture display.

Since the display panel 400 provided by the present embodiment adopts any of the fingerprint recognition modules 200 provided by the previous embodiments, the implementation principles thereof are similar, and are not described herein again.

In some possible embodiments, as shown in fig. 3, the display module 300a includes a second substrate 310a, a second driving device structure 320a, and a pixel structure 330a, which are sequentially stacked.

The second driving device structure 320a includes a second active structure 321a, a second gate structure 322a, and a second source-drain structure 323a, which are sequentially stacked.

The pixel structure 330a is located on a side of the second source-drain structure 323a away from the second gate structure.

The second substrate 310a is located on a side of the second active structure 321a away from the second gate structure 322 a.

The side of the second substrate 310a away from the second active structure 321a is attached to the first substrate 210 of the fingerprint identification module 200.

In the embodiment, the second substrate 310a of the display module 300a can be easily attached to the first substrate 210 of the fingerprint identification module 200, which can simplify the assembly process of the display panel 400. The pixel structure 330a of the display module 300a is used for displaying a frame, and the second driving device structure 320a is used for driving the pixel structure 330a to display a designated frame.

In this embodiment, the second driving device structure 320a of the display module 300a is independent from the first driving device structure 220 of the fingerprint identification module 200.

Alternatively, the pixel structure 330a may include: the backlight source, the liquid crystal box and the color film layer are sequentially stacked. The first substrate 210 of the fingerprint identification module 200 is located on a side of the backlight source away from the liquid crystal cell. That is, the pixel structure 330a may be a Display structure of an LCD (Liquid Crystal Display).

Alternatively, the pixel structure 330a may include: an anode layer, a luminous layer, a cathode layer and a color film layer are sequentially stacked. The first substrate 210 of the fingerprint identification module 200 is located at a side of the anode layer away from the light emitting layer. That is, the pixel structure 330a may adopt a display structure such as an LED (Light Emitting Diode), a Micro-LED (Micro Light Emitting Diode), or an OLED (Organic Light-Emitting Diode).

Based on the same inventive concept, the embodiment of the present application provides a display module 300b, and a schematic structural diagram of the display module 300b is shown in fig. 5, including: a substrate 310b, a display driving device structure 320b, a pixel structure 330b, and any one of the ultrasonic wave transceiving structures 100 as provided in the previous embodiments.

The display driving device structure 320b includes an active structure 321b, a gate structure 322b, and a source-drain structure 323b, which are sequentially stacked.

The active structure 321b is located at one side of the substrate 310 b.

The first conductive structure 110 of the ultrasound transceiver structure 100 forms at least a portion of the gate structure 322b and/or is disposed on the same layer as the gate structure 322 b.

The second conductive structure 130 of the ultrasonic transceiver structure 100 is located on one side of the source-drain structure 323b close to the gate structure 322b, or the second conductive structure 130 and the source-drain structure 323b are disposed on the same layer.

Pixel structure 330b is located on a side of source drain structure 323b away from gate structure 322 b.

In this embodiment, the display module 300b integrates the ultrasonic transceiver structure 100 into the driving device structure of the display module 300b, specifically, the first conductive structure 110 forms at least part of the gate structure 322b of the display driving device structure 320b (and/or is disposed on the same layer as the gate structure 322b), the piezoelectric structure 120 is designed between the gate structure 322b and the source/drain structure 323b of the display driving device structure 320b, and the second conductive structure 130 is disposed on one side of the source/drain structure 323b of the display driving device structure 320b, which is close to the gate structure 322b (or is disposed on the same layer as the source/drain structure 323 b).

By adopting the above scheme, the display module 300b provided by the embodiment can reduce the thickness of a film layer through which the ultrasonic wave needs to penetrate in the ultrasonic wave transmitting and/or receiving stage, thereby reducing the energy loss in the ultrasonic wave transmission process; on the other hand, the electric signal formed by the ultrasonic wave reflected by the valleys and ridges of the fingerprint 500 can directly act on the gate of the display driving device structure 320b, the obtained signal strength is stronger, and the sensitivity and accuracy of fingerprint identification can be effectively improved; in another aspect, the display module 300b may be thinned.

In some possible embodiments, the ultrasound transceiving structure 100 corresponds to a spacing region between two adjacent pixel structures 330b of the pixel structures 330 b.

In this embodiment, the ultrasonic transceiver structure 100 corresponds to the space between two adjacent pixel structures 330b of the pixel structure 330b, that is, the ultrasonic transceiver structure 100 is disposed in the non-display area 302b of the display module 300b, so that the integration and integration of the fingerprint identification function and the display engineering can be increased, and the area of the fingerprint 500 can be controlled in design and process.

In some possible embodiments, the ultrasound transceiving structure 100 comprises: an ultrasonic wave transmitting structure 101 and an ultrasonic wave receiving structure 102.

The first conductive structure 110 of the ultrasonic wave emitting structure 101 is disposed at the same layer as the gate structure 322b of the display driving device structure 320 b.

The first conductive structure 110 of the ultrasonic wave receiving structure 102 forms at least part of the gate structure 322 b.

In the present embodiment, the ultrasound transceiver structure 100 includes two sub-structures, which can facilitate the transmission and reception of ultrasound waves to be performed separately. Specifically, the ultrasonic wave transmitting structure 101 performs an ultrasonic wave transmitting operation, and the ultrasonic wave receiving structure 102 performs an ultrasonic wave receiving operation, that is, neither of the sub-structures needs a time-sharing operation.

The fingerprint recognition principle of the display module 300b provided in this embodiment is as follows:

in the transmitting phase of the ultrasonic wave, the first conductive structure 110 in the ultrasonic wave transmitting structure 101 serves as a Tx (drive channel) electrode, a certain voltage is applied, at this time, the voltage of the second conductive structure 130 in the ultrasonic wave transmitting structure 101 is 0V (volt), a certain potential difference is formed between the second conductive structure 130 of the ultrasonic wave transmitting structure 101 and the first conductive structure 110, and the piezoelectric structure 120 in the ultrasonic wave transmitting structure 101 deforms to start vibrating to emit the ultrasonic wave.

After the ultrasonic waves meet valleys and ridges of a finger and are reflected back, the ultrasonic waves are applied to the piezoelectric structure 120 of the ultrasonic wave receiving structure 102, the voltage of the second conductive structure 130 of the ultrasonic wave receiving structure 102 is 0V, the first conductive structure 110 (the gate structure 322b) of the ultrasonic wave receiving structure 102 is not grounded, the first conductive structure 110 (the gate structure 322b) of the ultrasonic wave receiving structure 102 serves as an Rx (sensing channel) electrode, electric signals generated by the piezoelectric structure 120 of the ultrasonic wave receiving structure 102 are detected, and fingerprint imaging is performed through an APS circuit, so that fingerprint identification is performed.

In some possible embodiments, the second conductive structure 130 of the ultrasonic wave transmitting structure 101 is disposed in the same layer as the second conductive structure 130 of the ultrasonic wave receiving structure 102.

In this embodiment, the second conductive structures 130 of the ultrasonic wave emitting structure 101 and the ultrasonic wave receiving structure 102 are disposed on the same layer, which can simplify the manufacturing process and is also beneficial to thinning the display module 300 b.

In some possible embodiments, the piezoelectric structure 120 of the ultrasound transmitting structure 101 is disposed in a same layer as the piezoelectric structure 120 of the ultrasound receiving structure 102.

In this embodiment, the piezoelectric structures 120 of the ultrasonic wave emitting structure 101 and the ultrasonic wave receiving structure 102 are all disposed in the same layer, which can simplify the manufacturing process and is also beneficial to thinning the display module 300 b.

In some possible embodiments, as shown in fig. 5, the display module 300b further includes at least one of a buffer layer 340b, an isolation layer 350b, and an insulating layer 360 b.

In this embodiment, the buffer layer 340b can reduce the impact that the display module 300b may be subjected to, and protect the films. The isolation layer 350b can prevent water or oxygen from entering the display module 300b from the bottom of the substrate 310b, which affects the performance of the display driver device structure 320b and the light emitting characteristics of the pixel structure 330 b. The insulating layer 360b may block the conductive film layer that does not need electrical connection.

In the case that the display module 300b further includes the buffer layer 340b, optionally, the buffer layer 340b is located between the substrate 310b and the active structure 321 b.

In the case that the display module 300b further includes the isolation layer 350b, optionally, the isolation layer 350b is located between the substrate 310b and the active structure 321 b.

In the case that the display module 300b further includes the insulating layer 360b, optionally, the insulating layer 360b is disposed at least one of between the substrate 310b and the gate structure 322b, between the gate structure 322b and the piezoelectric structure 120 of the ultrasonic transceiver structure 100, between the piezoelectric structure 120 and the second conductive structure 130, between the second conductive structure 130 and the source/drain structure 323b, and between the source/drain structure 323b and the pixel structure 330 b.

Based on the same inventive concept, the embodiment of the present application provides a method for manufacturing a fingerprint identification module, where a schematic flow diagram of the method is shown in fig. 6, and the method includes the following steps S101 to S109:

s101: a first active structure is fabricated on one side of a first substrate.

S102: a first insulating layer is deposited on the first substrate and on one side of the first active structure.

S103: and manufacturing a first conductive structure on the first insulating layer, and enabling the first conductive structure to form at least part of the first grid structure.

S104: a second insulating layer is deposited over the first insulating layer and the first conductive structure.

S105: and manufacturing a piezoelectric structure on the second insulating layer.

S106: a third insulating layer is deposited over the second insulating layer and the piezoelectric structure.

S107: and manufacturing a second conductive structure on the third insulating layer.

S108: a fourth insulating layer is deposited over the third insulating layer and the second conductive structure.

S109: and manufacturing a first source drain structure on the fourth insulating layer.

The fingerprint identification module is integrated with an ultrasonic receiving and transmitting structure into a first driving device structure of the fingerprint identification module, and specifically, a first conductive structure is formed into a first gate structure (and/or arranged on the same layer as the first gate structure) of at least part of the first driving device structure, a piezoelectric structure is designed between the first gate structure and a first source drain structure of the first driving device structure, and a second conductive structure is arranged on one side of the first source drain structure of the first driving device structure, which is close to the first gate structure (or arranged on the same layer as the first source drain structure).

The fingerprint identification module obtained by the preparation method of the fingerprint identification module provided by the embodiment can realize ultrasonic fingerprint identification, and the sensitivity and accuracy of fingerprint identification are higher.

The embodiment of the application provides a method for expanding a preparation method of a fingerprint identification module, a flow schematic diagram of the method is shown in fig. 7, and the method comprises the following steps of S201-S211:

s201: at least one of a first buffer layer and a first isolation layer is deposited on one side of the first substrate.

Alternatively, the step may be performed by depositing the first buffer layer and the first isolation layer on one side of the first substrate by a PECVD (Plasma Enhanced Chemical Vapor Deposition) apparatus. Therefore, water or oxygen can be prevented from penetrating through the first substrate and immersing into the fingerprint identification module, and the performance of the first driving device structure and the light-emitting characteristic of the pixel structure are influenced.

Optionally, before this step, a PI (polyimide film) organic film of a certain thickness may be coated on the glass substrate by a PI coating apparatus to form a PI flexible first substrate.

S202: a first active structure is fabricated on one side of a first substrate.

Optionally, in this step, a first active layer with a certain thickness may be deposited by a PECVD apparatus, and patterned by photolithography and etching processes to obtain the first active structure.

S203: a first insulating layer is deposited on the first substrate and on one side of the first active structure.

Alternatively, this step may be performed by depositing a thickness of an inorganic layer material (e.g., silicon oxide or silicon nitride, etc.) as the first insulating layer by a PECVD apparatus.

S204: and manufacturing a first conductive structure on the first insulating layer, and enabling the first conductive structure to form at least part of the first grid structure.

Optionally, in this step, a metal layer with a certain thickness may be deposited by a Sputter (sputtering) device to serve as the first gate layer, and patterning is performed by photolithography and etching processes to obtain the first gate structure.

S205: a second insulating layer is deposited over the first insulating layer and the first conductive structure.

Alternatively, the step may be performed by depositing a certain thickness of silicon nitride as the second insulating layer by PECVD equipment.

S206: and manufacturing a piezoelectric structure on the second insulating layer.

Optionally, the piezoelectric material is mainly divided into an inorganic piezoelectric material and an organic piezoelectric material, the inorganic piezoelectric material may be selected from materials such as aluminum nitride, and the organic piezoelectric material may be selected from materials such as PVDF (polyvinylidene fluoride) polymer.

For inorganic piezoelectric materials, the step can be implemented by depositing a film through PECVD equipment, and then realizing the patterning through photoetching and etching processes to obtain the piezoelectric structure.

For organic piezoelectric materials such as PVDF solution systems, the Coating may be performed by Spin Coating, and then the patterning may be performed by Hard Mask to obtain the piezoelectric structure. The hard mask is primarily used in a multiple lithography process where multiple photoresist images are first transferred to the hard mask and then the final pattern is etched through the hard mask and transferred to the layer of piezoelectric material.

For the organic piezoelectric material, the step can also be realized by directly coating the patterned PVDF by Slot Die equipment, and then carrying out polarization process treatment on the piezoelectric material layer to make the piezoelectric material layer have certain piezoelectric performance.

S207: a third insulating layer is deposited over the second insulating layer and the piezoelectric structure.

Alternatively, the step may be performed by depositing a certain thickness of silicon nitride as the third insulating layer by PECVD equipment.

S208: and manufacturing a second conductive structure on the third insulating layer.

Optionally, in this step, metal with a certain thickness may be deposited by a Sputter device to serve as the second conductive layer, and patterning is achieved by photolithography and etching processes to obtain the second conductive structure. The second conductive structure may function as Tx (drive channel).

S209: a fourth insulating layer is deposited over the third insulating layer and the second conductive structure.

Optionally, in this step, an interlayer insulating layer with a certain thickness may be deposited by PECVD equipment, and patterning may be achieved by photolithography and etching processes, so as to obtain a fourth insulating layer.

In addition, preparation is made for manufacturing the first source/drain structure in the next step, and the step may further include manufacturing a via hole for electrically connecting the first source/drain structure and the first active structure, and specifically may include: and simultaneously carrying out patterning etching on the fourth insulating layer, the third insulating layer and the second insulating layer to form the via hole.

S210: and manufacturing a first source drain structure on the fourth insulating layer.

Optionally, in this step, a metal with a certain thickness, such as Ti (titanium)/Al (aluminum)/Ti, may be deposited by a Sputter device, and patterning may be achieved by photolithography and etching processes, so as to obtain the first source/drain structure.

S211: depositing a flat layer on the fourth insulating layer and the first source drain electrode structure; a reflective layer is deposited on the planarization layer.

Alternatively, this step may form a planarization layer by Coating Resin material, and realize its patterning by photolithography and etching processes.

Alternatively, this step may print Ag (silver) paste of a certain thickness as a reflective layer on the planarization layer by a screen printing process. The function of the Ag paste reflecting layer is to reflect the ultrasonic signals transmitted to the lower part to the upper part of the screen.

Optionally, in this step, an epoxy resin with a certain thickness may be printed on the reflective layer by a screen printing process to serve as an insulating layer, so as to protect the device.

Based on the same inventive concept, the embodiment of the present application provides another method for manufacturing a fingerprint identification module, where a schematic flow diagram of the manufacturing method is shown in fig. 8, and the method includes the following steps S301 to S308:

s301: a first active structure is fabricated on one side of a first substrate.

S302: a first insulating layer is deposited on the first substrate and on one side of the first active structure.

S303: and manufacturing a first conductive structure on the first insulating layer, and enabling the first conductive structure to form at least part of the first grid structure.

S304: a second insulating layer is deposited over the first insulating layer and the first conductive structure.

S305: and manufacturing a piezoelectric structure on the second insulating layer.

S306: a third insulating layer is deposited over the second insulating layer and the piezoelectric structure.

S307: and manufacturing a second conductive structure and a first source drain structure on the third insulating layer.

S308: and depositing a fourth insulating layer on the third insulating layer, the second conductive structure and the first source drain structure.

The principle and the beneficial effect of the preparation method of another kind of fingerprint identification module that this embodiment provided are the same with the preparation method of aforementioned fingerprint identification module basically, and the difference lies in: after depositing a third insulating layer on the second insulating layer and the piezoelectric structure, manufacturing a second conductive structure and a first source drain structure on the third insulating layer, and depositing a fourth insulating layer on the third insulating layer, the second conductive structure and the first source drain structure. That is, in this embodiment, the second conductive structure and the first source/drain structure are fabricated on the same layer, which is beneficial to thinning the fabricated fingerprint identification module, and the fabrication process is simplified.

The embodiment of the application provides another method for expanding a manufacturing method of a fingerprint identification module, and a flow chart of the method is shown in fig. 9, and the method comprises the following steps of S401 to S410:

s401: at least one of a first buffer layer and a first isolation layer is deposited on one side of the first substrate.

S402: a first active structure is fabricated on one side of a first substrate.

S403: a first insulating layer is deposited on the first substrate and on one side of the first active structure.

S404: and manufacturing a first conductive structure on the first insulating layer, and enabling the first conductive structure to form at least part of the first grid structure.

S405: a second insulating layer is deposited over the first insulating layer and the first conductive structure.

S406: and manufacturing a piezoelectric structure on the second insulating layer.

S407: a third insulating layer is deposited over the second insulating layer and the piezoelectric structure.

S408: and manufacturing a second conductive structure and a first source drain structure on the third insulating layer.

S409: and depositing a fourth insulating layer on the third insulating layer, the second conductive structure and the first source drain structure.

S410: a reflective layer is deposited on the fourth insulating layer.

The principle and the effective effect of the method for preparing another fingerprint identification module provided by this embodiment are basically the same as those of the method for preparing another fingerprint identification module, and the difference is that: at least one of a first buffer layer and a first isolation layer is deposited on one side of the first substrate before the first active structure is fabricated on the one side of the first substrate. The fingerprint identification module that makes like this can reduce inside water or oxygen pass through first basement and dip in the fingerprint identification module, influences the performance of first drive device structure and the light emitting characteristic of pixel structure.

Based on the same inventive concept, the embodiment of the present application provides a method for manufacturing a display module, a schematic flow diagram of the method is shown in fig. 10, and the method includes the following steps S501 to S511:

s501: an active structure is fabricated on one side of the substrate.

S502: a first insulating layer is deposited on one side of the substrate and the active structure.

S503: and manufacturing a first conductive structure on the first insulating layer, and enabling the first conductive layer to form at least part of the grid structure.

S504: a second insulating layer is deposited over the first insulating layer and the first conductive structure.

S505: and manufacturing a piezoelectric structure on the second insulating layer.

S506: a third insulating layer is deposited over the second insulating layer and the piezoelectric structure.

S507: and manufacturing a second conductive structure on the third insulating layer.

S508: a fourth insulating layer is deposited over the third insulating layer and the second conductive structure.

S509: and manufacturing a source drain electrode structure on the fourth insulating layer.

S510: and depositing a flat layer on the fourth insulating layer and the source and drain electrode structure.

S511: and manufacturing a pixel structure on the flat layer.

In the manufacturing method of the display module provided by this embodiment, the ultrasonic transceiver structure is integrated into the driver structure of the display module, and specifically, the first conductive structure is formed into a gate structure (and/or arranged on the same layer as the gate structure) of at least part of the display driver structure, the piezoelectric structure is designed between the gate structure and the source/drain structure of the display driver structure, and the second conductive structure is arranged on one side of the source/drain structure of the display driver structure, which is close to the gate structure (or arranged on the same layer as the source/drain structure).

By adopting the display module obtained by the preparation method of the display module provided by the embodiment, on one hand, the thickness of a film layer through which ultrasonic waves need to penetrate in the ultrasonic wave transmitting and/or receiving stage can be reduced, so that the energy loss in the ultrasonic wave transmission process is reduced; on the other hand, an electric signal formed by ultrasonic waves reflected by valleys and ridges of the fingerprint can directly act on a grid electrode of a display driving device structure, the obtained signal strength is stronger, and the sensitivity and the accuracy of fingerprint identification can be effectively improved; on the other hand, the thinning of the display module can be favorably realized.

The embodiment of the application provides a method for expanding a manufacturing method of a display module, a flow diagram of the method is shown in fig. 11, and the method comprises the following steps S601-S612:

s601: at least one of a buffer layer and an isolation layer is deposited on one side of the substrate.

Optionally, a deposition buffer layer and an isolation layer with a certain thickness may be deposited by PECVD equipment, and the deposition buffer layer and the isolation layer are provided to prevent water and oxygen from penetrating through the substrate and entering the inside of the display module, which affects the performance of the driving device structure and the light emitting characteristics of the pixel structure.

Alternatively, prior to this step, a PI organic film of a certain thickness may be coated on a glass substrate by a PI Coater (polyimide film coating) apparatus to form a PI flexible substrate.

S602: an active structure is fabricated on one side of the substrate.

Alternatively, an active layer with a certain thickness may be deposited by a PECVD apparatus and patterned by photolithography and etching processes to obtain an active structure.

In this step, an active structure is fabricated on one side of the substrate, comprising: and manufacturing an active structure on a region of one side of the substrate corresponding to a part of the first conductive structure.

S603: a first insulating layer is deposited on one side of the substrate and the active structure.

Alternatively, a certain thickness of silicon oxide may be deposited as the first insulating layer by a PECVD apparatus at this step.

S604: and manufacturing a first conductive structure on the first insulating layer, and enabling the first conductive layer to form at least part of the grid structure.

Optionally, in this step, a metal layer with a certain thickness may be deposited by a Sputter device to serve as the gate layer, and patterning is implemented by photolithography and etching processes to obtain the gate structure.

Optionally, in this step, a first conductive structure is fabricated on the first insulating layer, including: and manufacturing a first conductive structure in an interval area between two adjacent pixel structures of the first insulating layer corresponding to the pixel structures. Promptly, set up ultrasonic wave transceiver structure in the non-display area of display module assembly, can increase fingerprint identification function and demonstration integration and the integration of engineering like this, can also control the region and the area size of fingerprint in design and technology.

Optionally, the gate layer metal obtained by the step may be divided into three parts, one part is used as the gate of the display region display driving device structure of the display module, the other part is used as the Rx electrode of the ultrasonic wave transmitting structure, and the other part is used as the Rx electrode of the ultrasonic wave receiving structure. Correspondingly, the piezoelectric structure fabricated in the subsequent step S606 may also be divided into three parts, and the second conductive structure fabricated in the step S608 may also be divided into three parts.

S605: a second insulating layer is deposited over the first insulating layer and the first conductive structure.

Alternatively, a certain thickness of silicon nitride may be deposited as the second insulating layer by PECVD equipment at this step.

S606: and manufacturing a piezoelectric structure on the second insulating layer.

Alternatively, this step may adopt the same manner as S206 above, and is not described herein again.

In this step, a piezoelectric structure is fabricated on the second insulating layer, including: and manufacturing a piezoelectric structure in an interval area between two adjacent pixel structures of the second insulating layer corresponding to the pixel structures.

S607: a third insulating layer is deposited over the second insulating layer and the piezoelectric structure.

Alternatively, a certain thickness of silicon nitride may be deposited as the third insulating layer by PECVD in this step.

S608: and manufacturing a second conductive structure on the third insulating layer.

Optionally, in this step, metal with a certain thickness may be deposited by a Sputter device to serve as the second conductive layer, and patterning is implemented by photolithography and etching processes to obtain the second conductive structure.

In this step, a second conductive structure is fabricated on the third insulating layer, including: and manufacturing a second conductive structure in an interval area between two adjacent pixel structures of the third insulating layer corresponding to the pixel structures.

S609: a fourth insulating layer is deposited over the third insulating layer and the second conductive structure.

In addition, preparation is made for manufacturing the first source/drain electrode structure in the next step, and the step may further include manufacturing a via hole for electrically connecting the source/drain electrode structure and the active structure, and specifically may include: and simultaneously carrying out patterning etching on the fourth insulating layer, the third insulating layer and the second insulating layer to form the via hole.

S610: and manufacturing a source drain electrode structure on the fourth insulating layer.

Optionally, in this step, a metal with a certain thickness, such as Ti (titanium)/Al (aluminum)/Ti, may be deposited by a Sputter device, and patterning may be achieved by photolithography and etching processes, so as to obtain a source/drain structure.

In this step, a source-drain structure is fabricated on the fourth insulating layer, including: and manufacturing a source drain electrode structure in a region of the fourth insulating layer corresponding to the active structure.

S611: and depositing a flat layer on the fourth insulating layer and the source and drain electrode structure.

Alternatively, the step may form a planarization layer from the Coating Resin material and pattern it by photolithography and etching processes.

S612: and manufacturing a pixel structure on the flat layer.

Based on the same inventive concept, the embodiment of the present application provides another method for manufacturing a display module, and the schematic flow chart of the manufacturing method is shown in fig. 12, and the method includes the following steps S701 to S709:

s701: an active structure is fabricated on one side of the substrate.

S702: a first insulating layer is deposited on one side of the substrate and the active structure.

S703: manufacturing a first conductive structure on the first insulating layer, and enabling the first conductive layer to form at least part of a grid structure;

s704: a second insulating layer is deposited over the first insulating layer and the first conductive structure.

S705: and manufacturing a piezoelectric structure on the second insulating layer.

S706: a third insulating layer is deposited over the second insulating layer and the piezoelectric structure.

S707: and manufacturing a second conductive structure and a source drain structure on the third insulating layer.

S708: and depositing a flat layer on the third insulating layer, the second conductive structure and the source and drain electrode structure.

S709: and manufacturing a pixel structure on the flat layer.

The principle and the beneficial effects of the method for manufacturing another display module provided by this embodiment are substantially the same as those of the method for manufacturing a display module, and the differences are as follows: and after depositing a third insulating layer on the second insulating layer and the piezoelectric structure, manufacturing a second conductive structure and a source-drain electrode structure on the third insulating layer, and depositing a flat layer on the third insulating layer, the second conductive structure and the source-drain electrode structure. That is, in this embodiment, the second conductive structure and the source/drain structure are fabricated in the same layer, which is beneficial to thinning the fabricated display module, and the fabrication process is simplified.

By applying the embodiment of the application, at least the following beneficial effects can be realized:

1. the ultrasonic wave transceiving structure adopts a first conductive structure, a piezoelectric structure and a second conductive structure which are sequentially stacked. The first conductive structure and the second conductive structure can be used as a driving channel and a sensing channel for bearing touch signals respectively. The piezoelectric structure may enable transmission and/or reception of ultrasonic waves.

2. In the ultrasonic transceiving structure, one of the first conductive structure and the second conductive structure is used for forming a gate structure of the driving device structure and/or is arranged on the same layer as the gate structure of the driving device structure, so that at least part of the ultrasonic transceiving structure can be integrated into the driving device structure of the ultrasonic fingerprint identification product. On one hand, the thickness of a film layer which needs to be penetrated by the ultrasonic wave in the ultrasonic wave transmitting and/or receiving stage can be reduced, so that the energy loss in the ultrasonic wave transmission process is reduced; on the other hand, the electric signal formed by the ultrasonic wave reflected by the valleys and ridges of the fingerprint can directly act on the grid of the driving device structure, the obtained signal strength is stronger, and the sensitivity and accuracy of fingerprint identification can be effectively improved.

3. With the integrated fingerprint identification module to fingerprint identification module, or display panel of ultrasonic wave receiving and dispatching structure, can realize fingerprint identification module or display panel's attenuate to can effectively improve ultrasonic wave fingerprint identification's sensitivity and rate of accuracy.

4. With ultrasonic wave receiving and dispatching structure integration to display module assembly in, can realize display module assembly's attenuate to can effectively improve ultrasonic fingerprint identification's sensitivity and rate of accuracy.

5. In the display module assembly, ultrasonic wave receiving and dispatching structure corresponds the interval region between two adjacent pixel structures of pixel structure, promptly, sets up ultrasonic wave receiving and dispatching structure in the non-display area of display module assembly, can increase fingerprint identification function and integration and the integration that shows the engineering like this, can also control the region and the area size of fingerprint in design and technology.

6. The ultrasonic wave transmitting and receiving structure includes: an ultrasonic wave transmitting structure and an ultrasonic wave receiving structure. The ultrasonic wave transmitting and receiving device can be used for realizing the separate execution of the transmission and the reception of the ultrasonic wave. Specifically, the ultrasonic wave transmitting structure executes the transmitting action of the ultrasonic wave, and the ultrasonic wave receiving structure executes the receiving action of the ultrasonic wave, namely, any sub-structure does not need time-sharing action.

7. The respective second conductive structures of the ultrasonic transmitting structure and the ultrasonic receiving structure are arranged on the same layer, so that the preparation process can be simplified, and the thinning of the display module is facilitated.

8. The respective piezoelectric structures of the ultrasonic transmitting structure and the ultrasonic receiving structure are arranged on the same layer, so that the preparation process can be simplified, and the thinning of the display module is facilitated.

Those of skill in the art will appreciate that the various operations, methods, steps in the processes, acts, or solutions discussed in this application can be interchanged, modified, combined, or eliminated. Further, other steps, measures, or schemes in various operations, methods, or flows that have been discussed in this application can be alternated, altered, rearranged, broken down, combined, or deleted. Further, steps, measures, schemes in the prior art having various operations, methods, procedures disclosed in the present application may also be alternated, modified, rearranged, decomposed, combined, or deleted.

In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.

The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the terms in this application will be understood in a particular context to those of ordinary skill in the art.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

It should be understood that, although the steps in the flowcharts of the figures are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and may be performed in other orders unless explicitly stated herein. Moreover, at least a portion of the steps in the flow chart of the figure may include multiple sub-steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, which are not necessarily performed in sequence, but may be performed alternately or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.

Claims

1. An ultrasonic wave transmitting/receiving structure, comprising: the piezoelectric transducer comprises a first conductive structure, a piezoelectric structure and a second conductive structure which are sequentially stacked;

one of the first conductive structure and the second conductive structure is used for forming a gate structure of the driving device structure and/or is arranged on the same layer as the gate structure of the driving device structure.

2. The structure of claim 1, wherein the other of the first conductive structure and the second conductive structure is configured to be disposed in the same layer as a source/drain structure of a driver device structure.

3. The utility model provides a fingerprint identification module which characterized in that includes: a first substrate, a first driver device structure, and an ultrasonic transceiver structure according to claim 1 or 2;

the first active structure is positioned on one side of the first substrate;

the second conductive structure of the ultrasonic transceiver structure is positioned on one side of the first source-drain structure close to the first gate structure, or the second conductive structure and the first source-drain structure are arranged on the same layer;

4. The fingerprint identification module of claim 3, further comprising at least one of a first buffer layer, a first isolation layer, a reflective layer, and a first insulating layer;

the first buffer layer is positioned between the first substrate and the first active structure;

the first isolation layer is positioned between the first substrate and the first active structure;

the reflecting layer is positioned on one side of the first source drain structure far away from the piezoelectric structure of the ultrasonic receiving and transmitting structure;

and arranging the first insulating layer at least one of the first substrate and the first grid structure, the first grid structure and the piezoelectric structure, the piezoelectric structure and the second conductive structure, the second conductive structure and the first source drain structure and one side of the first source drain structure far away from the second conductive structure.

5. A display panel, comprising: a display module and the fingerprint recognition module of claim 3 or 4;

6. The display panel according to claim 5, wherein the display module comprises a second substrate, a second driving device structure and a pixel structure which are sequentially stacked;

the second driving device structure comprises a second active structure, a second grid structure and a second source drain structure which are sequentially stacked;

the pixel structure is positioned on one side of the second source drain structure far away from the second gate structure;

the second substrate is positioned on one side of the second active structure far away from the second gate structure;

one side of the second substrate, which is far away from the second active structure, is attached to the first substrate of the fingerprint identification module.

7. A display module, comprising: a substrate, a display driving device structure, a pixel structure, and the ultrasonic wave transceiving structure according to claim 1 or 2;

the active structure is positioned on one side of the substrate;

the first conductive structure of the ultrasonic transceiving structure forms at least part of the grid structure and/or is arranged on the same layer as the grid structure;

the second conductive structure of the ultrasonic transceiving structure is positioned on one side of the source drain structure close to the grid structure, or the second conductive structure and the source drain structure are arranged on the same layer;

8. The display module according to claim 7, wherein the ultrasonic transceiver structure corresponds to a spacing region between two adjacent pixel structures of the pixel structures.

9. The display module according to claim 7 or 8, wherein the ultrasonic transceiver structure comprises: an ultrasonic transmitting structure and an ultrasonic receiving structure;

the first conductive structure of the ultrasonic wave emitting structure and the grid electrode structure of the display driving device structure are arranged on the same layer;

the first conductive structure of the ultrasonic wave receiving structure forms at least part of the gate structure.

10. The display module according to claim 9, wherein the second conductive structure of the ultrasonic wave emitting structure and the second conductive structure of the ultrasonic wave receiving structure are disposed in the same layer;

the piezoelectric structure of the ultrasonic wave transmitting structure and the piezoelectric structure of the ultrasonic wave receiving structure are arranged on the same layer.

11. The display module according to claim 7 or 8, wherein the display module further comprises at least one of a buffer layer, an isolation layer, and an insulating layer;

the buffer layer is positioned between the substrate and the active structure;

the isolation layer is positioned between the substrate and the active structure;

the insulating layer is arranged at least one of the position between the substrate and the grid structure, the position between the grid structure and the piezoelectric structure of the ultrasonic transceiving structure, the position between the piezoelectric structure and the second conductive structure, the position between the second conductive structure and the source drain structure and the position between the source drain structure and the pixel structure.

12. The preparation method of the fingerprint identification module is characterized by comprising the following steps of:

manufacturing a first active structure on one side of a first substrate;

depositing a first insulating layer on one side of the first substrate and the first active structure;

manufacturing a piezoelectric structure on the second insulating layer;

manufacturing a second conductive structure on the third insulating layer;

and manufacturing a first source drain electrode structure on the fourth insulating layer.

13. The method of claim 12, wherein before fabricating the first active structure on the first substrate, the method comprises: depositing at least one of a first buffer layer and a first isolation layer on one side of the first substrate;

and/or after the first source-drain structure is manufactured on the fourth insulating layer, the method comprises the following steps: depositing a flat layer on the fourth insulating layer and the first source drain electrode structure; depositing a reflective layer on the planarization layer.

14. The preparation method of the fingerprint identification module is characterized by comprising the following steps of:

manufacturing a first active structure on one side of a first substrate;

manufacturing a piezoelectric structure on the second insulating layer;

and depositing a fourth insulating layer on the third insulating layer, the second conductive structure and the first source drain electrode structure.

15. A preparation method of a display module is characterized by comprising the following steps:

manufacturing an active structure on one side of a substrate;

manufacturing a piezoelectric structure on the second insulating layer;

manufacturing a second conductive structure on the third insulating layer;

depositing a flat layer on the fourth insulating layer and the source and drain electrode structure;

and manufacturing a pixel structure on the flat layer.

16. The method according to claim 15, wherein the fabricating a first conductive structure on the first insulating layer comprises: manufacturing the first conductive structure in an interval area between two adjacent pixel structures of the first insulating layer corresponding to the pixel structures;

the manufacturing of the piezoelectric structure on the second insulating layer includes: manufacturing the piezoelectric structure in a spacing area between two adjacent pixel structures of the second insulating layer corresponding to the pixel structures;

the fabricating a second conductive structure on the third insulating layer includes: and manufacturing the second conductive structure in an interval area between two adjacent pixel structures of the third insulating layer corresponding to the pixel structures.

17. A method according to claim 15 or 16, wherein the fabricating an active structure on one side of the substrate comprises: manufacturing the active structure in a region of one side of the substrate corresponding to a part of the first conductive structure;

the manufacturing of the source-drain structure on the fourth insulating layer includes: and manufacturing the source and drain electrode structure in the region of the fourth insulating layer corresponding to the active structure.

18. The method of claim 15, wherein before the fabricating the active structure on one side of the substrate, the method comprises: at least one of a buffer layer and an isolation layer is deposited on one side of the substrate.

19. A preparation method of a display module is characterized by comprising the following steps:

manufacturing an active structure on one side of a substrate;

manufacturing a piezoelectric structure on the second insulating layer;

and manufacturing a pixel structure on the flat layer.