CN112011818A - Multi-row vertical electroplating mechanical equipment - Google Patents
Multi-row vertical electroplating mechanical equipment Download PDFInfo
- Publication number
- CN112011818A CN112011818A CN202010835315.3A CN202010835315A CN112011818A CN 112011818 A CN112011818 A CN 112011818A CN 202010835315 A CN202010835315 A CN 202010835315A CN 112011818 A CN112011818 A CN 112011818A
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- electroplating
- column
- barrel
- block
- thick bamboo
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a multi-row vertical electroplating mechanical device which structurally comprises a base, a conveying belt, a positioning column and a positioning plate, wherein the conveying belt is connected to the inner wall of the base through a bolt, the positioning column is arranged right above the conveying belt, and the bottom of the positioning plate is welded to the top end of the positioning column. Place the circuit board and remove under the reference column at the conveyer belt, the electroplating barrel drives the locating plate downstream, thereby it is stable to carry out the centre gripping to the electroplating barrel, avoid electroplating post level to rock, the electroplating post is electroplated to the circuit board when being convenient for, pull down a lift section of thick bamboo makes a lift section of thick bamboo break away from with the locating plate, be convenient for clear up and maintain a lift section of thick bamboo, push away splint when electroplating the post moves down to both sides and make splint extrusion spring, make splint centre gripping electroplating post all the time, make the scraper blade scrape the electroplating post end when electroplating post rebound and wipe away, make and scrape the piece and will remain the cladding material of electroplating the toe portion and scrape, avoid remaining cladding material and circuit board friction in electroplating the toe portion and lead.
Description
Technical Field
The invention relates to the field of electroplating, in particular to a multi-column vertical electroplating mechanical device.
Background
Electroplating is a process of plating a layer of other metals or alloys on the surface of a metal by utilizing the electrolysis principle, thereby preventing the metal from being oxidized and corroded, improving the wear resistance, the conductivity and the corrosion resistance of the metal, and when a circuit board is electroplated, multi-column type vertical electroplating is adopted, so that the circuit board is electroplated in a vertical one-by-one arrangement mode.
At present, when a circuit board is electroplated, because metal on the circuit board is subjected to chemical reaction by electrolysis to form a plating layer to cover the circuit board, the plating layer after partial reaction is adhered to the bottom of an electroplating column because of untimely solidification, the plating layer at the bottom of the electroplating column rubs with the circuit board when the next circuit board is electroplated, so that the surface of the circuit board is abraded.
Disclosure of Invention
The invention provides a multi-column vertical electroplating mechanical device, aiming at the defect that when a circuit board is electroplated, because metal on the circuit board is subjected to chemical reaction to form a coating to cover the circuit board and part of the reacted coating is adhered to the bottom of an electroplating column because the coating is not solidified in time, the coating at the bottom of the electroplating column is rubbed with the circuit board when the next circuit board is electroplated, so that the surface of the circuit board is abraded.
The invention is realized by the following technical scheme: the utility model provides a multiseriate formula is electroplated mechanical equipment perpendicularly, its structure includes base, conveyer belt, reference column, locating plate, the conveyer belt passes through bolted connection in the inner wall of the base, the reference column is installed directly over the conveyer belt, the welding of locating plate bottom is on the reference column top, the reference column includes electroplating barrel, spacing ring, holding ring, inside the electroplating barrel runs through the reference column perpendicularly, the spacing ring nestification is in the electroplating barrel surface, and the spacing ring outside passes through welded connection in the reference column inner wall, the holding ring nestification is in the electroplating barrel outside, and passes through welded connection in the reference column inner wall in the holding ring outside, the reference column has five, and the inside fretwork bottom of reference column is equipped with the opening to the.
Furthermore, the electroplating barrel comprises an electroplating column, a positioning plate, an installation block and a lifting barrel, wherein the electroplating column vertically penetrates through the electroplating barrel, the positioning plate is fixedly embedded on the outer surface of the electroplating barrel, the installation block is arranged between the electroplating barrel and the positioning plate, the lifting barrel and the electroplating barrel are of an integrated structure, the electroplating column is cylindrical, the outer side of the positioning plate is arc-shaped, and the surface of the lifting barrel is folded.
Furthermore, the installation piece comprises fixed block, pivot, fixture block, the fixed block inlays admittedly in a lift section of thick bamboo upper surface, the pivot is passed through the bolt and is installed in the fixed block upper left corner, the fixture block inlays admittedly inside the locating plate, and the fixture block lower left corner installs in the pivot upper surface through the cooperation, and the fixture block bottom is hugged closely directly over being located the fixed block simultaneously, fixed block and fixture block are the magnetic block, and the fixture block cross section is trapezoidal.
Further say, the lift section of thick bamboo includes rubber strip, guide block, electroplates the head, the rubber strip inlays to be located inside the lift section of thick bamboo, the guide block inlays to be fixed in a lift section of thick bamboo inner wall, and the guide block inboard hugs closely in the electroplating post outside, electroplate the head through welded connection in lift section of thick bamboo bottom and nested in the guide block surface, the guide block inboard is the arc to electroplate the head side and regard as falling trapezoidal.
Further say that, electroplate the head including changeing piece, splint, spring, scraper blade, change the piece and connect in electroplating first inner wall through movable block, splint pass through bolted connection in changeing the piece surface, welded connection is passed through in splint bottom to spring one end, and the spring other end through inlaying solid connection in electroplating first inner wall, the scraper blade passes through welded connection in splint end, splint have two and spring to the elasticity of spring is greater than the gravity of splint.
Further say that, the scraper blade is including scraping piece, limiting plate, support ball, scrape the piece and pass through welded connection in scraper blade surface, the limiting plate inlays in the scraper blade inner wall, support ball welding between two limiting plates, it is the sharp cubic arc of surface to scrape the piece, and the limiting plate has two arcs to be circular-arcly to the limiting plate has elasticity.
Further say, the support ball includes cushion chamber, dead lever, stopper, the cushion chamber inlays and locates the support ball inner wall, the dead lever welds the inner wall about the cushion chamber perpendicularly, the stopper nestification is in the dead lever surface, the inside fretwork of cushion chamber, and the stopper has three to the stopper can remove on the dead lever surface.
Advantageous effects
Compared with the prior art, the multi-row vertical electroplating mechanical equipment has the following advantages:
1. the invention has the beneficial effects that: place the circuit board and remove to the reference column under at the conveyer belt, the electroplating barrel drives the locating plate and moves down to it is stable to carry out the centre gripping to the electroplating barrel, avoids electroplating the post level and rock, and the electroplating post is electroplated the circuit board in the time of being convenient for, and a lower pull-down section of thick bamboo makes a section of thick bamboo that goes up and down break away from with the locating plate, is convenient for clear up and maintains a section of thick bamboo.
2. The invention has the beneficial effects that: when the electroplating column moves down, the clamping plates are pushed to both sides to push the clamping plates to extrude the spring, so that the clamping plates always clamp the electroplating column, the tail end of the electroplating column is scraped by the scraper when the electroplating column moves upwards, the coating remained at the bottom of the electroplating column is scraped by the scraping block, and the surface of the circuit board is prevented from being abraded due to the friction between the coating remained at the bottom of the electroplating column and the circuit board.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic structural diagram of a multi-column vertical electroplating machine according to the present invention.
Fig. 2 is an enlarged schematic view of the positioning post of the present invention.
FIG. 3 is an enlarged view of the interior of the plating barrel according to the present invention.
Fig. 4 is a front enlarged structural schematic view of the mounting block of the present invention.
Fig. 5 is an enlarged view of the inside of the elevating cylinder according to the present invention.
FIG. 6 is an enlarged view of the plating head according to the present invention.
FIG. 7 is an enlarged front view of the squeegee according to the present invention.
Fig. 8 is an enlarged view of the interior of the support ball of the present invention.
In the figure: the device comprises a base 1, a conveying belt 2, a positioning column 3, a positioning plate 4, an electroplating barrel 31, a limiting ring 32, a positioning ring 33, an electroplating column 311, a positioning plate 312, a mounting block 313, a lifting barrel 314, a fixing block a1, a rotating shaft a2, a clamping block a3, a rubber strip b1, a guide block b2, an electroplating head b3, a rotating block b31, a clamping plate b32, a spring b33, a scraping plate b34, a scraping block z1, a limiting plate z2, a supporting ball z3, a buffer cavity z31, a fixing rod z32 and a limiting block z 33.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the following description and the accompanying drawings further illustrate the preferred embodiments of the invention.
Please refer to fig. 1-8:
example 1:
the invention provides a multi-row vertical electroplating mechanical device which structurally comprises a base 1, a conveying belt 2, a positioning column 3 and a positioning plate 4, the conveying belt 2 is connected with the inner wall of the base 1 through a bolt, the positioning column 3 is arranged right above the conveying belt 2, the bottom of the positioning plate 4 is welded at the top end of the positioning column 3, the positioning column 3 comprises an electroplating barrel 31, a limiting ring 32 and a positioning ring 33, the electroplating cylinder 31 vertically penetrates through the positioning column 3, the limiting ring 32 is nested on the outer surface of the electroplating cylinder 31, the outer side of the limiting ring 32 is connected to the inner wall of the positioning column 3 by welding, the positioning ring 33 is nested at the outer side of the electroplating cylinder 31, the outer side of the positioning ring 33 is connected with the inner wall of the positioning column 3 by welding, five positioning columns 3 are arranged, the hollow bottom of the positioning column 3 is provided with an opening, and the electroplating barrel 31 can be stretched up and down, which is beneficial to electroplating the circuit board on the conveyer belt 2.
In the figure, the electroplating barrel 31 comprises an electroplating column 311, a positioning plate 312, an installation block 313 and a lifting barrel 314, the electroplating column 311 vertically penetrates through the electroplating barrel 31, the positioning plate 312 is embedded on the outer surface of the electroplating barrel 31, the installation block 313 is arranged between the electroplating barrel 31 and the positioning plate 312, the lifting barrel 314 and the electroplating barrel 31 are of an integrated structure, the electroplating column 311 is cylindrical, the outer side of the positioning plate 312 is arc-shaped, the surface of the lifting barrel 314 is folded, and the electroplating column 311 cannot horizontally shake through the positioning of the positioning plate 312 when the electroplating barrel 31 vertically stretches out and draws back.
In the drawing, the mounting block 313 is composed of a fixing block a1, a rotating shaft a2 and a fixture block a3, the fixing block a1 is embedded in the upper surface of the lifting cylinder 314, the rotating shaft a2 is installed in the upper left corner of the fixing block a1 through a bolt, the fixture block a3 is embedded in the positioning plate 312, the lower left corner of the fixture block a3 is installed on the upper surface of the rotating shaft a2 through matching, meanwhile, the bottom of the fixture block a3 is tightly attached to the position right above the fixing block a1, the fixing block a1 and the fixture block a3 are magnetic blocks, and the cross section of the fixture block a3 is trapezoidal, so that the positioning plate 312 and the lifting cylinder 314 are always attached under the suction force of the fixing block a1 and the fixture block a3, and the.
The specific principle of the embodiment is as follows: the circuit board is placed on the conveyer belt 2, the circuit board is enabled to move under the transportation of the conveyer belt 2 to be under the positioning column 3, then the electroplating barrel 31 in the positioning column 3 moves downwards, the positioning plate 312 on the surface of the electroplating barrel 31 moves downwards, the electroplating barrel 31 is stably clamped, the horizontal shaking of the electroplating column 311 when the electroplating barrel 31 stretches up and down is avoided, meanwhile, the lifting barrel 314 moves along with the positioning column 3 under the magnetic force of the fixing block a1 and the fixture block a3 at the connecting part of the positioning plate 312 and the lifting barrel 314, the electroplating column 311 electroplates the circuit board when being convenient, the lifting barrel 314 is pulled downwards to enable the fixing block a1 on the surface of the lifting barrel 314 to move downwards to enable the rotating shaft a2 to rotate, and the fixture block a3 is embedded and fixed in the positioning plate 312, so that the lifting barrel 314 is separated from.
Example 2:
in the figure, the electroplating barrel 31 comprises an electroplating column 311, a positioning plate 312, an installation block 313 and a lifting barrel 314, the electroplating column 311 vertically penetrates through the electroplating barrel 31, the positioning plate 312 is embedded on the outer surface of the electroplating barrel 31, the installation block 313 is arranged between the electroplating barrel 31 and the positioning plate 312, the lifting barrel 314 and the electroplating barrel 31 are of an integrated structure, the electroplating column 311 is cylindrical, the outer side of the positioning plate 312 is arc-shaped, the surface of the lifting barrel 314 is folded, and the electroplating column 311 cannot horizontally shake through the positioning of the positioning plate 312 when the electroplating barrel 31 vertically stretches out and draws back.
In the figure, lift section of thick bamboo 314 includes rubber strip b1, guide block b2, electroplates head b3, inside lift section of thick bamboo 314 was located to rubber strip b1 inlays, guide block b2 inlays and fixes in lift section of thick bamboo 314 inner wall, and guide block b2 is inboard hugs closely in the electroplating post 311 outside, electroplate head b3 through welded connection in lift section of thick bamboo 314 bottom and nested in guide block b2 surface, guide block b2 is inboard to electroplate head b3 looks sideways at and be down trapezoidal, do benefit to electroplating post 311 and electroplate post 311 from top to bottom steady movement in lift section of thick bamboo 314, be convenient for electroplate post 311 and electroplate the circuit board.
In the figure, the plating head b3 comprises a rotating block b31, a clamping plate b32, a spring b33 and a scraper b34, the rotating block b31 is connected to the inner wall of the plating head b3 through movable clamping, the clamping plate b32 is connected to the surface of the rotating block b31 through bolts, one end of the spring b33 is connected to the bottom of the clamping plate b32 through welding, the other end of the spring b33 is connected to the inner wall of the plating head b3 through embedding, the scraper b34 is connected to the tail end of the clamping plate b32 through welding, the clamping plate b32 has two pieces, the spring b33 has two pieces, the elastic force of the spring b33 is greater than the gravity of the clamping plate b32, the clamping plate b32 is always clamped inwards under the elastic force of the clamping plate b32, and the scraper b34 scrapes the coating remained at.
In the figure, scraper blade b34 includes scraping piece z1, limiting plate z2, support ball z3, scrape piece z1 and pass through welded connection in scraper blade b34 surface, limiting plate z2 inlays in scraper blade b34 inner wall, support ball z3 welds between two limiting plates z2, scrape piece z1 and be the sharp cubic arc board of surface, and limiting plate z2 has two arcs and is circular-arc, and limiting plate z2 has elasticity, is favorable to scraping the cladding material that remains in electroplating post 311 bottom through scraping piece z 1.
In the drawing, the supporting ball z3 includes a buffer cavity z31, a fixing rod z32 and a limiting block z33, the buffer cavity z31 is embedded in the inner wall of the supporting ball z3, the fixing rod z32 is vertically welded to the upper and lower inner walls of the buffer cavity z31, the limiting block z33 is embedded in the outer surface of the fixing rod z32, the buffer cavity z31 is hollow, the limiting block z33 is provided with three blocks, the limiting block z33 can move on the surface of the fixing rod z32, and the scraping block z1 is provided with outward thrust when the scraping plate b34 scrapes the electroplating column 311.
The specific principle of the embodiment is as follows: when the plating column 311 moves downwards, the guide block b2 positions the plating column 311 at the center of the lifting cylinder 314, so that the plating column 311 passes through the plating head b3 to plate the circuit board, at this time, the plating column 311 pushes the clamping plate b32 downwards to open the clamping plate b32 outwards to press the spring b33, under the elastic force of the spring b33, the clamping plate b32 always clamps the plating column 311, when the plating column 311 moves upwards, the scraper b34 at the bottom of the clamping plate b32 scrapes the tail end of the plating column 311, so that the scraping block z1 on the surface of the scraper b34 scrapes the plating layer at the bottom of the plating column 311, and the plating layer at the bottom of the plating column 311 is prevented from rubbing with the circuit board to cause the surface of the circuit board to be worn.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
Claims (5)
1. The utility model provides a multiseriate formula is electroplated mechanical equipment perpendicularly, its structure includes base (1), conveyer belt (2), reference column (3), locating plate (4), bolted connection is passed through in base (1) inner wall in conveyer belt (2), install directly over conveyer belt (2) reference column (3), locating plate (4) bottom welding is on reference column (3) top, its characterized in that:
reference column (3) are including electroplating barrel (31), spacing ring (32), holding ring (33), inside electroplating barrel (31) run through reference column (3) perpendicularly, spacing ring (32) nestification is in electroplating barrel (31) surface, and passes through welded connection in reference column (3) inner wall in the spacing ring (32) outside, holding ring (33) nestification is in electroplating barrel (31) outside, and passes through welded connection in reference column (3) inner wall in the holding ring (33) outside.
2. The multi-column vertical plating mechanical apparatus according to claim 1, wherein: the electroplating barrel (31) comprises an electroplating column (311), a positioning plate (312), an installation block (313) and a lifting barrel (314), wherein the electroplating column (311) vertically penetrates through the electroplating barrel (31), the positioning plate (312) is embedded on the outer surface of the electroplating barrel (31), the installation block (313) is arranged between the electroplating barrel (31) and the positioning plate (312), and the lifting barrel (314) and the electroplating barrel (31) are of an integrated structure.
3. The multi-column vertical plating mechanical apparatus according to claim 2, wherein: the installation piece (313) comprises fixed block (a1), pivot (a2), fixture block (a3), fixed block (a1) are embedded in a lift section of thick bamboo (314) upper surface, pivot (a2) pass through the bolt and install in fixed block (a1) upper left corner, fixture block (a3) are embedded and are fixed inside locating plate (312), and fixture block (a3) lower left corner is installed in pivot (a2) upper surface through the cooperation, and fixture block (a3) bottom is hugged closely and is located fixed block (a1) directly over simultaneously.
4. The multi-column vertical plating mechanical apparatus according to claim 2, wherein: the lift section of thick bamboo (314) include rubber strip (b1), guide block (b2), electroplate head (b3), rubber strip (b1) are inlayed and are located lift section of thick bamboo (314) inside, guide block (b2) are inlayed and are adorned in lift section of thick bamboo (314) inner wall, and guide block (b2) inboard hug closely in electroplating post (311) outside, electroplate head (b3) through welded connection in lift section of thick bamboo (314) bottom and nest in guide block (b2) surface.
5. The multi-column vertical plating mechanical apparatus according to claim 4, wherein: electroplating head (b3) including commentaries on classics piece (b31), splint (b32), spring (b33), scraper blade (b34), commentaries on classics piece (b31) are connected in electroplating head (b3) inner wall through the activity block, splint (b32) pass through bolted connection in commentaries on classics piece (b31) surface, spring (b33) one end is through welded connection in splint (b32) bottom, and spring (b33) other end is through inlaying the solid connection in electroplating head (b3) inner wall, scraper blade (b34) is through welded connection in splint (b32) end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010835315.3A CN112011818A (en) | 2020-08-19 | 2020-08-19 | Multi-row vertical electroplating mechanical equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010835315.3A CN112011818A (en) | 2020-08-19 | 2020-08-19 | Multi-row vertical electroplating mechanical equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112011818A true CN112011818A (en) | 2020-12-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010835315.3A Withdrawn CN112011818A (en) | 2020-08-19 | 2020-08-19 | Multi-row vertical electroplating mechanical equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN112011818A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113481556A (en) * | 2021-07-30 | 2021-10-08 | 杨桂昌 | Local electroplating process |
| CN114622255A (en) * | 2022-03-12 | 2022-06-14 | 张荣光 | Electroplating equipment for open-circuit short-circuit test board of chip |
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| CN201068474Y (en) * | 2007-07-05 | 2008-06-04 | 陈惠宗 | Multiple row type perpendicular electric-plating mechanical equipment |
| CN201545930U (en) * | 2009-09-16 | 2010-08-11 | 深圳市深联电路有限公司 | Improved electroplated thin plate frame for electroplated automatic line |
| CN201801626U (en) * | 2010-09-01 | 2011-04-20 | 深南电路有限公司 | Vertical plating line plating equipment and clamp thereof |
| CN203021668U (en) * | 2013-01-29 | 2013-06-26 | 惠州中京电子科技股份有限公司 | PCB vertical electroplating auxiliary jig |
| CN206173464U (en) * | 2016-11-07 | 2017-05-17 | 广东科翔电子科技有限公司 | Fixed frame is electroplated to PCB sheet metal |
| CN207176108U (en) * | 2017-08-24 | 2018-04-03 | 深圳市天益通光电有限公司 | The clamping and conveying device that a kind of circuit board is vertically electroplated |
-
2020
- 2020-08-19 CN CN202010835315.3A patent/CN112011818A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201068474Y (en) * | 2007-07-05 | 2008-06-04 | 陈惠宗 | Multiple row type perpendicular electric-plating mechanical equipment |
| CN201545930U (en) * | 2009-09-16 | 2010-08-11 | 深圳市深联电路有限公司 | Improved electroplated thin plate frame for electroplated automatic line |
| CN201801626U (en) * | 2010-09-01 | 2011-04-20 | 深南电路有限公司 | Vertical plating line plating equipment and clamp thereof |
| CN203021668U (en) * | 2013-01-29 | 2013-06-26 | 惠州中京电子科技股份有限公司 | PCB vertical electroplating auxiliary jig |
| CN206173464U (en) * | 2016-11-07 | 2017-05-17 | 广东科翔电子科技有限公司 | Fixed frame is electroplated to PCB sheet metal |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113481556A (en) * | 2021-07-30 | 2021-10-08 | 杨桂昌 | Local electroplating process |
| CN114622255A (en) * | 2022-03-12 | 2022-06-14 | 张荣光 | Electroplating equipment for open-circuit short-circuit test board of chip |
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Application publication date: 20201201 |