CN112011281A - Water-resistant film, solar cell module and preparation method of solar cell module - Google Patents
Water-resistant film, solar cell module and preparation method of solar cell module Download PDFInfo
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- CN112011281A CN112011281A CN201910472777.0A CN201910472777A CN112011281A CN 112011281 A CN112011281 A CN 112011281A CN 201910472777 A CN201910472777 A CN 201910472777A CN 112011281 A CN112011281 A CN 112011281A
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- 238000002360 preparation method Methods 0.000 title abstract description 18
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- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
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- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
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- C09J2427/00—Presence of halogenated polymer
- C09J2427/006—Presence of halogenated polymer in the substrate
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Computer Hardware Design (AREA)
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Abstract
The invention discloses a water-blocking film, a solar cell module and a preparation method of the solar cell module. Wherein, the water blocking film includes the resistant layer of waiting, first pressure sensitive adhesive layer, inorganic barrier layer, stratum basale, the second pressure sensitive adhesive layer of range upon range of setting in proper order. The solar cell module comprises a solar cell chip and the water-blocking film, wherein the water-blocking film is attached to one surface of the solar cell chip. The preparation method of the solar cell module comprises the following steps: providing a substrate layer, wherein the substrate layer is provided with a first surface and a second surface which are oppositely arranged; preparing an inorganic barrier layer on a first side of the substrate layer; preparing a first pressure-sensitive adhesive layer on the inorganic barrier layer; attaching a weather-resistant layer on the first pressure-sensitive adhesive layer; preparing a second pressure-sensitive adhesive layer on the second side of the substrate layer; and adhering the second pressure-sensitive adhesive layer to a solar cell chip. Compared with the prior art, the water-resistant film and the solar cell module have the advantages of light weight and simple preparation process.
Description
Technical Field
The invention relates to the technical field of solar energy, in particular to a water blocking film, a solar cell module and a preparation method of the solar cell module.
Background
In recent years, as the traditional energy problem is highlighted, new energy is rapidly developed, and especially, solar energy is taken as one of the energy sources which are seriously developed. At present, the traditional solar power generation technology is a crystalline silicon battery technology, but the crystalline silicon solar technology has some defects, mainly the photoelectric conversion efficiency of the crystalline silicon solar technology is close to the theoretical limit, the rising space is not large, and in addition, the brittle characteristic of a silicon material also prevents the crystalline silicon solar technology from being changed into a flexible material to be applied to the application fields of buildings, flexibility and the like on a large scale. The thin-film solar has the advantage of light weight, is convenient for flexible application, can be well combined with a light roof and a wall surface, and the development of the thin-film solar is increasingly emphasized by the industry.
The core materials in the solar cell are very sensitive to water vapor, and are exposed in the atmospheric environment and easy to generate the attenuation of the electric efficiency, so that the water-blocking packaging structure is very important for protecting the solar cell. The existing conventional water-blocking materials comprise glass, organic films and the like, but the former is very limited in application because of being heavy and incapable of realizing bending, and the latter is not very good in water-blocking effect because the organic materials have limited water-blocking capability to the water-blocking property. In addition, most of the existing solar cell modules need to be prepared by adopting a laminating process, and the water blocking film is attached to the solar cell, so that the process is relatively complex.
Disclosure of Invention
In order to solve the problems of heavy water-blocking material of the solar cell and relatively complex preparation process of the solar cell module, the invention provides a water-blocking film, a solar cell module and a preparation method of the solar cell module. Wherein, the water blocking film includes the resistant layer of waiting, first pressure sensitive adhesive layer, inorganic barrier layer, stratum basale, the second pressure sensitive adhesive layer of range upon range of setting in proper order. The solar cell module comprises a solar cell chip and the water-blocking film, wherein the water-blocking film is attached to one surface of the solar cell chip. The preparation method of the solar cell module comprises the following steps: providing a substrate layer, wherein the substrate layer is provided with a first surface and a second surface which are oppositely arranged; preparing an inorganic barrier layer on a first side of the substrate layer; preparing a first pressure-sensitive adhesive layer on the inorganic barrier layer; attaching a weather-resistant layer on the first pressure-sensitive adhesive layer; preparing a second pressure-sensitive adhesive layer on the second side of the substrate layer; and adhering the second pressure-sensitive adhesive layer to a solar cell chip.
Compared with the prior art, the water-blocking film has the advantages of light weight and simple preparation process, and the solar cell module and the preparation method of the solar cell module at least comprise the advantages of light weight and simple preparation process of the water-blocking film.
Drawings
The accompanying drawings are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and not to limit the invention.
FIG. 1 is a schematic view of a water-blocking film according to an embodiment of the present invention;
FIG. 2 is a schematic view of a water-blocking film according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a solar cell module according to an embodiment of the invention.
Fig. 4 is a flowchart illustrating a method for manufacturing a solar cell module according to an embodiment of the invention.
Reference numerals: 00-a solar cell chip, 1-a weather-resistant layer, 2-a first pressure-sensitive adhesive layer, 3-an inorganic barrier layer, 4-a substrate layer, 5-a second pressure-sensitive adhesive layer and 6-a release layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.
As shown in fig. 1, the water blocking film provided by the embodiment of the present invention includes a weather-resistant layer 1, a first pressure-sensitive adhesive layer 2, an inorganic barrier layer 3, a substrate layer 4, and a second pressure-sensitive adhesive layer 5, which are sequentially stacked.
The weather-resistant layer 1 plays a role in protecting other functional layers and solar cell chips, so the weather-resistant layer 1 needs to have high weather resistance and ultraviolet aging resistance, the selected materials can comprise polyvinyl fluoride, ethylene-tetrafluoroethylene copolymer, polyethylene terephthalate and other materials, different types of materials can be selected according to different application fields of products, the thickness is generally 20 micrometers-200 micrometers, and the thickness can be 20 micrometers, 50 micrometers, 80 micrometers, 100 micrometers, 120 micrometers and 150 micrometers, for example.
Pressure sensitive adhesive (pressure sensitive adhesive) is a short name of pressure sensitive adhesive, and can replace traditional POE, EVA and other adhesive films to play a role in adhering various functional layers aiming at specific products. The first pressure sensitive adhesive layer 2 is adhered with the weather-resistant layer 1 and the inorganic barrier layer 3, and the second pressure sensitive adhesive layer 5 is adhered with the substrate layer 4. Pressure sensitive adhesives commonly used fall into the following categories: natural rubber pressure-sensitive adhesives, resin pressure-sensitive adhesives, and silica gel pressure-sensitive adhesives. The acrylic pressure-sensitive adhesive is one of resin pressure-sensitive adhesives, has good weather resistance, high light transmittance and small influence on photoelectric conversion of a battery product, and is more suitable for packaging or water blocking processes of solar batteries. The first pressure-sensitive adhesive layer 2 and the second pressure-sensitive adhesive layer 5 may be selected from the same material or from different materials. The thickness of the first pressure sensitive adhesive layer 2 is typically 5 micrometers to 20 micrometers, and may be, for example, 5 micrometers, 8 micrometers, 10 micrometers, 12 micrometers, 15 micrometers, 20 micrometers. The thickness of the second pressure sensitive adhesive layer 5 is typically 5 micrometers to 20 micrometers, and may be, for example, 5 micrometers, 8 micrometers, 10 micrometers, 12 micrometers, 15 micrometers, 20 micrometers.
The substrate layer 4 is used for supporting and has a first surface and a second surface opposite to each other, the first surface and the second surface can be two planes parallel to each other, the shape of the substrate layer 4 can be rectangular, circular, etc., and no special limitation is made on the shape and size of the substrate layer 4. The base layer 4 may be a flexible or rigid transparent material, for example, a polymer material such as PET (polyethylene terephthalate), or other materials such as glass. The thickness of the substrate layer 4 is typically 100 microns to 200 microns and may be, for example, 100 microns, 110 microns, 125 microns, 140 microns, 160 microns, 180 microns, 200 microns.
The inorganic barrier layer 3 is prepared on the substrate 4 by deposition, sputtering and other modes, so as to form a unified body with the substrate 4, and the inorganic barrier layer is mainly used for blocking external water vapor, thereby playing a role in protecting the solar cell chip. The inorganic barrier layer 3 is a transparent and insulating material, and may be silicon nitride, aluminum oxide, silicon dioxide, silicon oxynitride, or the like, and silicon oxynitride is preferable. The thickness is generally 50 nm-1000 nm, wherein the material of silicon nitride, silicon dioxide, silicon oxynitride and the like is preferably 500 nm, and the material of aluminum oxide is preferably 50 nm. The material is not limited to the above as long as it is water-repellent, light-transmissive, and insulating.
Further, as shown in fig. 2, the water blocking film further includes a release layer 6, the release layer 6 is disposed on a side of the second pressure sensitive adhesive layer 5 away from the substrate layer 4 and can be used for protecting the second pressure sensitive adhesive layer 5, and the release layer 6 can be a transparent material, for example, PET, PE (polyethylene), PP (polypropylene), and the like can be used, which is not listed here. From type layer 6 can bond with 5 detachably of second pressure sensitive adhesive layer, when hindering the water film for the solar cell installation, can get rid of type layer 6, before the installation, then can remain from type layer 6 for protect second pressure sensitive adhesive layer 5, prevent that second pressure sensitive adhesive layer 5 from damaging. The release layer 6 can be release paper, and can also be other films which can be adhered and detached.
The invention also provides a solar cell module, as shown in fig. 3, the solar cell module comprises a solar cell chip and the water-blocking film, and the water-blocking film is attached to one surface of the solar cell chip. Namely, the solar cell module comprises a weather-resistant layer 1, a first pressure-sensitive adhesive layer 2, an inorganic barrier layer 3, a substrate layer 4, a second pressure-sensitive adhesive layer 5 and a solar cell chip 00 which are sequentially stacked. The second pressure-sensitive adhesive layer 5 is attached to the base layer 4 and the solar cell chip 00, so that the water-resistant film is bonded with the solar cell chip to protect the solar cell chip.
Further, the solar cell module may further include a third pressure sensitive adhesive layer and a bottom plate sequentially disposed on the other surface of the solar cell chip 00. Namely, the third pressure-sensitive adhesive layer and the bottom plate are sequentially arranged on the other side of the solar cell chip 00 bonded with the second pressure-sensitive adhesive layer 5. The third pressure-sensitive adhesive layer may be selected from the same material as the first pressure-sensitive adhesive layer 2 or the second pressure-sensitive adhesive layer 5, or may be selected from a different material. The thickness of the third pressure sensitive adhesive layer is typically 5 microns to 20 microns and may be, for example, 5 microns, 8 microns, 10 microns, 12 microns, 15 microns, 20 microns. The bottom plate is generally made of chemical fiber rubberized fabric.
As shown in fig. 4, the method for manufacturing a solar cell module according to the present invention includes:
step S01: providing a substrate layer, wherein the substrate layer is provided with a first surface and a second surface which are oppositely arranged.
Step S02: an inorganic barrier layer is prepared on a first side of the substrate layer.
The inorganic thin film may be prepared using conventional techniques, such as plasma enhanced chemical vapor deposition equipment (PECVD).
Step S03: a first pressure sensitive adhesive layer is prepared on the inorganic barrier layer.
Can prepare the knife coating machine in advance to place the pressure sensitive adhesive material who prepares in knife coating machine pan feeding cavity for glue material is even spits out, simultaneously through rotatory gyro wheel, makes the stratum basale that has prepared inorganic barrier layer evenly advance with 1 m/min's speed, and glue can be even coats on above-mentioned inorganic barrier layer, thereby prepares first pressure sensitive adhesive layer of completion.
Step S04: and attaching a weather-resistant layer on the first pressure-sensitive adhesive layer.
When the step is finished, the surface of the pressure-sensitive adhesive material is ensured to be clean as much as possible, one end of the weather-resistant layer is contacted with one end of the first pressure-sensitive adhesive layer in a clean environment, the whole weather-resistant layer is attached by adopting rollers to roll in sequence.
Step S05: a second pressure sensitive adhesive layer is prepared on the second side of the base layer.
The preparation method is the process of preparing the first pressure-sensitive adhesive layer as in the above S03, but the adaptability of the process parameters can be adjusted according to the material and thickness of the pressure-sensitive adhesive layer.
After the step S05 and before the step S06, optionally, a release layer is disposed on a surface of the second pressure-sensitive adhesive layer away from the substrate layer, that is, the release layer is attached to the surface of the second pressure-sensitive adhesive layer, so as to protect the water blocking film formed in the above step. The prepared water-resistant film can also be collected into coils, so that the transportation and the processing are convenient. Before the water-blocking film is attached to the solar cell chip, that is, before step S06, the release layer may be torn off.
Step S06: and adhering the second pressure-sensitive adhesive layer to a solar cell chip.
When the step is finished, the surface of the pressure-sensitive adhesive material is ensured to be clean as much as possible, one end of the solar cell chip is contacted and pressed with one end of the second pressure-sensitive adhesive layer in a clean environment, and the whole solar cell chip is attached by adopting the rollers to roll in sequence.
After step S06, a third pressure sensitive adhesive layer and a back sheet may be further provided on the other side of the solar cell chip. The third pressure-sensitive adhesive may be set by referring to the setting method of the first pressure-sensitive adhesive and the second pressure-sensitive adhesive, and the bottom plate and the third pressure-sensitive adhesive may be set by means of adhesion, specifically, the first pressure-sensitive adhesive and the second pressure-sensitive adhesive may be adhered to other functional layers, which is not described herein again.
The solar cell module and the preparation method thereof have the following advantages:
(1) the solar cell module adopts the pressure-sensitive adhesive layer to replace the traditional POE or EVA adhesive, so that the thickness and the weight of the module are greatly reduced, and the thickness can be reduced by 40 percent to the maximum.
(2) The solar cell module adopts the pressure-sensitive adhesive layer to replace the traditional POE or EVA adhesive, so that the cost of the module is greatly reduced by 60 percent at most.
(3) The preparation method can eliminate or reduce the lamination process, thereby saving the process time and reducing the process cost.
Example 1
As shown in fig. 1, the water-blocking film comprises a weather-resistant layer 1, a first pressure-sensitive adhesive layer 2, an inorganic barrier layer 3, a substrate layer 4 and a second pressure-sensitive adhesive layer 5 which are sequentially stacked. Wherein, the weather-resistant layer 1 is ethylene-tetrafluoroethylene copolymer, the thickness is 50 microns, the first pressure sensitive adhesive layer 2 is acrylic pressure sensitive adhesive, the thickness is 10 microns, the inorganic barrier layer 3 is silicon nitride, the thickness is 450 nanometers, the second pressure sensitive adhesive layer 5 is acrylic pressure sensitive adhesive, the thickness is 10 microns. The base layer 4 is of PET material and has a thickness of 125 microns and has opposite first and second faces which may be two planar faces parallel to each other, the base layer 4 being rectangular in shape. The inorganic barrier layer 3 is deposited on the first side of the substrate layer 4, and the first pressure sensitive adhesive layer 2 is coated on the inorganic barrier layer 3 and bonds the weather-resistant layer 1 and the inorganic barrier layer 3. A second pressure sensitive adhesive layer 5 is coated on the second side of the substrate layer 4.
Example 2
As shown in fig. 2, the water-blocking film includes a weather-resistant layer 1, a first pressure-sensitive adhesive layer 2, an inorganic barrier layer 3, a substrate layer 4, a second pressure-sensitive adhesive layer 5, and a release layer 6, which are sequentially stacked. Wherein, resistant layer 1 of waiting is polyvinyl fluoride, and thickness is 100 microns, and first pressure sensitive adhesive layer 2 is acrylic pressure sensitive adhesive, and thickness is 15 microns, and inorganic barrier layer 3 is aluminium oxide, and thickness is 50 nanometers, and second pressure sensitive adhesive layer 5 is acrylic pressure sensitive adhesive, and thickness is 15 microns, and thickness is 20 microns. The base layer 4 is of PET material and has a thickness of 100 microns and has opposite first and second faces which may be two planes parallel to each other, the shape of the base layer 4 being rectangular. The inorganic barrier layer 3 is deposited on the first side of the substrate layer 4, and the first pressure sensitive adhesive layer 2 is coated on the inorganic barrier layer 3 and bonds the weather-resistant layer 1 and the inorganic barrier layer 3. A second pressure sensitive adhesive layer 5 is coated on the second side of the substrate layer 4. From the one side of type layer 6 setting keeping away from stratum basale 4 at second pressure sensitive adhesive layer 5, from type layer 6 for PET material from type paper, bond with 5 detachably of second pressure sensitive adhesive layer, when the water film is hindered in solar cell installation, can get rid of type layer 6, before the installation, then can remain from type layer 6 for protect second pressure sensitive adhesive layer 5, prevent that second pressure sensitive adhesive layer 5 from damaging.
Example 3
As shown in fig. 3, the solar cell module includes a weather-resistant layer 1, a first pressure-sensitive adhesive layer 2, an inorganic barrier layer 3, a substrate layer 4, a second pressure-sensitive adhesive layer 5, and a solar cell chip 00, which are sequentially stacked. The second pressure-sensitive adhesive layer 5 is attached to the base layer 4 and the solar cell chip 00, so that the water-resistant film is bonded with the solar cell chip to protect the solar cell chip. Wherein, resistant layer 1 of waiting is for the polyethylene glycol terephthalate, and thickness is 200 microns, and first pressure sensitive adhesive layer 2 is acrylic pressure sensitive adhesive, and thickness is 5 microns, and inorganic barrier layer 3 is silica, and thickness is 800 nanometers, and second pressure sensitive adhesive layer 5 is acrylic pressure sensitive adhesive, and thickness is 12 microns. The base layer 4 is of PET material and has a thickness of 150 microns and has opposite first and second faces which may be two planar faces parallel to each other, the base layer 4 being rectangular in shape. The inorganic barrier layer 3 is deposited on the first side of the substrate layer 4, and the first pressure sensitive adhesive layer 2 is coated on the inorganic barrier layer 3 and bonds the weather-resistant layer 1 and the inorganic barrier layer 3. A second pressure sensitive adhesive layer 5 is coated on the second side of the substrate layer 4. The solar cell chip 00 may be any type of solar cell chip, such as copper indium gallium selenide, cadmium telluride, gallium arsenide, etc., without limitation.
Example 4
In the solar cell module described in embodiment 3, a third pressure-sensitive adhesive layer and a base sheet are provided in this order on the other surface of the solar cell chip 00. Namely, the third pressure-sensitive adhesive layer and the bottom plate are sequentially arranged on the other side of the solar cell chip 00 bonded with the second pressure-sensitive adhesive layer 5. The third pressure-sensitive adhesive layer is acrylic pressure-sensitive adhesive and has the thickness of 8 microns. The bottom plate is made of chemical fiber rubberized fabric material.
Example 5
As shown in fig. 4, the method for manufacturing a solar cell module includes:
step S01: a PET substrate layer is provided having oppositely disposed first and second faces.
Step S02: a silicon nitride inorganic barrier layer is prepared on a first side of the substrate layer.
And preparing the silicon nitride film by adopting Plasma Enhanced Chemical Vapor Deposition (PECVD) equipment. Wherein, the power frequency is 13MHz, hydrogen, nitrogen and silane are adopted, the gas is directly introduced into the cavity, the silane amount is 0.7sccm, the nitrogen is 90sccm, the hydrogen is 15sccm, the temperature is controlled at 160 ℃, the gas pressure is 400Pa, and the radio frequency power is 120 w. And cleaning the prepared material by deionized water, and finishing the preparation of the inorganic layer. The thickness is controlled to be 450 nm.
Step S03: a first pressure sensitive adhesive layer is prepared on the inorganic barrier layer.
Prepare the knife coater in advance to place the pressure sensitive adhesive material who prepares in knife coater pan feeding cavity, set pressure is 0.46Mpa, adjusts cavity discharge gate ejection of compact degree of consistency, makes even the spitting out of glue material, and through rotatory gyro wheel, the PET stratum basale that the deposit has silicon nitride evenly gos forward with 1 m/min's speed, thereby glue can be even coat to the PET stratum basale on, thereby first pressure sensitive adhesive layer is accomplished in preparation.
Step S04: and attaching a weather-resistant layer on the first pressure-sensitive adhesive layer.
When the step is finished, the surface of the pressure-sensitive adhesive material is ensured to be clean as much as possible, one end of the weather-resistant layer is contacted with one end of the first pressure-sensitive adhesive layer in a clean environment, the whole weather-resistant layer is attached by adopting rollers to roll in sequence.
Step S05: a second pressure sensitive adhesive layer is prepared on the second side of the base layer.
Prepare the knife coater in advance to place the pressure sensitive adhesive material who prepares in knife coater pan feeding cavity, set pressure is 0.46Mpa, adjusts cavity discharge gate ejection of compact degree of consistency, makes even the spitting out of glue material, through rotatory gyro wheel, the PET stratum basale through above-mentioned step evenly gos forward with 1 m/min's speed, thereby glue can be even coat to the another side on PET stratum basale, thereby preparation accomplishes second pressure sensitive adhesive layer.
Keep away from at second pressure sensitive adhesive layer the one side of stratum basale sets up from the type layer, is about to the attached type layer of type layer in second pressure sensitive adhesive layer's surface to the membrane that blocks water that forms above-mentioned step is protected. Before the water-blocking film is attached to the solar cell chip, that is, before step S06, the release layer may be torn off.
Step S06: and adhering the second pressure-sensitive adhesive layer to a solar cell chip.
When the step is finished, the surface of the pressure-sensitive adhesive material is ensured to be clean as much as possible, one end of the solar cell chip is contacted and pressed with one end of the second pressure-sensitive adhesive layer in a clean environment, and the whole solar cell chip is attached by adopting the rollers to roll in sequence.
It is to be understood that the use of "upper," "lower," "first side," "second side" herein is merely for convenience in describing the invention and for simplicity in description, and is not intended to indicate or imply that the referenced device or element must be in a particular orientation, constructed and operated in a particular orientation, and is therefore not to be considered limiting.
Although the embodiments of the present invention have been described above, the above description is only for the convenience of understanding the present invention, and is not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. The water blocking film is characterized by comprising a weather-resistant layer, a first pressure-sensitive adhesive layer, an inorganic barrier layer, a substrate layer and a second pressure-sensitive adhesive layer which are sequentially stacked.
2. The water-blocking film according to claim 1, further comprising a release layer disposed on a surface of the second pressure-sensitive adhesive layer away from the substrate layer.
3. The water-blocking film of claim 1, wherein the first and second pressure-sensitive adhesive layers comprise acrylic pressure-sensitive adhesives.
4. The water-blocking film of claim 1, wherein the first pressure-sensitive adhesive layer has a thickness of 5-20 microns and the second pressure-sensitive adhesive layer has a thickness of 5-20 microns.
5. The water-blocking film of claim 1, wherein the weatherable layer comprises one of polyvinyl fluoride, ethylene-tetrafluoroethylene copolymer, and polyethylene terephthalate.
6. The water-blocking film of claim 1, wherein the inorganic barrier layer comprises one of silicon nitride, silicon dioxide, aluminum oxide, silicon oxynitride.
7. A solar cell module comprising a solar cell chip and the water-blocking film according to claim 1, wherein the water-blocking film is bonded to one surface of the solar cell chip.
8. The solar cell module as claimed in claim 7, wherein the other surface of the solar cell chip is provided with a third pressure sensitive adhesive layer and a base plate in this order.
9. The solar cell assembly of claim 8 wherein the third pressure sensitive adhesive layer comprises an acrylic pressure sensitive adhesive having a thickness of 5 microns to 20 microns.
10. A method for manufacturing a solar cell module according to claim 7, comprising:
providing a substrate layer, wherein the substrate layer is provided with a first surface and a second surface which are oppositely arranged;
preparing an inorganic barrier layer on a first side of the substrate layer;
preparing a first pressure-sensitive adhesive layer on the inorganic barrier layer;
attaching a weather-resistant layer on the first pressure-sensitive adhesive layer;
preparing a second pressure-sensitive adhesive layer on the second side of the substrate layer;
and adhering the second pressure-sensitive adhesive layer to a solar cell chip.
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Application publication date: 20201201 |