CN112002680B - Packaging structure for integrated circuit design - Google Patents
Packaging structure for integrated circuit design Download PDFInfo
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- CN112002680B CN112002680B CN202010888977.7A CN202010888977A CN112002680B CN 112002680 B CN112002680 B CN 112002680B CN 202010888977 A CN202010888977 A CN 202010888977A CN 112002680 B CN112002680 B CN 112002680B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
The invention discloses a packaging structure for integrated circuit design, which comprises a butt joint substrate, an integrated circuit butt joint plate and a clamping mechanism, wherein the butt joint substrate is in a rectangular plate-shaped structure, the upper end surface of the butt joint substrate is provided with a clamping groove, the center of the clamping groove of the butt joint substrate is provided with a butt joint plate mounting groove matched with the integrated circuit butt joint plate, the butt joint substrate is clamped and limited at the periphery of the integrated circuit butt joint plate through the butt joint plate mounting groove, the integrated circuit butt joint plate is in a rectangular plate-shaped structure, the upper end surface of the integrated circuit butt joint plate is provided with pins for butt joint of an integrated circuit, four corners of the butt joint substrate are provided with substrate chamfers, and one sides of the four groups of substrate chamfers facing the integrated circuit butt joint plate are respectively matched with the clamping mechanism. This packaging structure for integrated circuit design, rational in infrastructure, easy convenient realization is fixed to integrated circuit's encapsulation, and the suitability is strong, has higher practical value.
Description
Technical Field
The invention belongs to the technical field of integrated circuits, and particularly relates to a packaging structure for integrated circuit design.
Background
An integrated circuit is a microelectronic device or component. The transistor, the resistor, the capacitor, the inductor and other elements and wires required in a circuit are interconnected together by adopting a certain process, are manufactured on a small or a plurality of small semiconductor wafers or medium substrates, and are then packaged in a tube shell to form a micro structure with the required circuit function; all the elements are structurally integrated, so that the electronic elements are greatly miniaturized, low in power consumption, intelligent and high in reliability. It is denoted by the letter "IC" in the circuit. The integrated circuit inventors are the Jack-Kerr ratio (germanium (Ge) -based integrated circuits) and the Robert-Noisy (silicon (Si) -based integrated circuits). Most applications in the semiconductor industry today are silicon-based integrated circuits.
In the installation process of the integrated circuit, in order to ensure the installation stability of the integrated circuit, the packaging structure for the integrated circuit needs to be designed and considered, the existing packaging structure cannot adapt to the integrated circuit boards with different sizes, the butt joint cannot be conveniently and fast realized during the butt joint, and the practicability is poor.
Disclosure of Invention
The present invention is directed to a package structure for integrated circuit design, so as to solve the problems of the prior art.
In order to achieve the purpose, the invention provides the following technical scheme: a packaging structure for integrated circuit design comprises a butt joint substrate, an integrated circuit butt joint plate and a clamping mechanism, wherein the butt joint substrate is in a rectangular plate structure, and a clamping groove is formed in the upper end face of the butt joint substrate;
the integrated circuit butt joint plate is of a rectangular plate structure, pins for butting the integrated circuit are constructed on the upper end face of the integrated circuit butt joint plate, substrate chamfers are constructed at four corners of the butt joint substrate, and clamping mechanisms are matched with one sides of the four groups of substrate chamfers facing the integrated circuit butt joint plate;
fixture includes the spacing integrated circuit's of butt L type butt joint splint, L type butt joint splint and butt joint base plate sliding fit, and L type butt joint splint are constructed the plane that has a set of butt joint direction slide bar towards one side of base plate chamfer, the direction slide bar runs through the base plate chamfer and extends outside the butt joint base plate, direction slide bar overcoat is equipped with a set of spring, the both ends of spring articulate base plate chamfer and L type butt joint splint respectively, and wherein, L type butt joint splint are along the axle center direction displacement of direction slide bar under the spring force effect.
Preferably, one side that centre gripping groove was kept away from to the base plate chamfer of butt joint base plate four corners structure is provided with a set of spacing otic placode, spacing otic placode is curved even board structure for the tip structure, and the top of spacing otic placode is seted up and is supplied screw complex screw cooperation groove.
Preferably, one side of the L-shaped docking plate facing the ic docking plate is provided with a set of L-shaped engaging grooves, an upper engaging edge is formed above the engaging groove, a lower engaging edge is formed below the engaging groove, and the bottom of the engaging groove is flush with the upper end surface of the ic docking plate.
Preferably, the slider is constructed to the position bottom of buckling of L type butt joint splint, set up the slide of adaptation slider on the centre gripping groove, the slide extends to the base plate chamfer direction that corresponds from the one corner of butt joint plate mounting groove.
Preferably, the base plate chamfer is provided with a through hole matched with the guide sliding rod, and a sliding sleeve matched with the guide sliding rod in a sliding manner is arranged in the through hole.
Preferably, the last lock edgewise corner position of L type butt joint splint constructs a set of butt joint arc board, and is provided with a set of butt joint bolt on the butt joint arc board, the bottom of butt joint bolt includes the screw thread axle of a set of threaded connection butt joint arc board, the bottom of screw thread axle is attached with the rubber pad of a set of butt joint integrated circuit.
The invention has the technical effects and advantages that: the packaging structure for integrated circuit design benefits from the sliding fit of the L-shaped butt joint clamping plates and the butt joint base plate, and after the integrated circuit is in butt joint with the integrated circuit butt joint plates, the multiple groups of L-shaped butt joint clamping plates can be abutted against the four corners of the limiting integrated circuit under the elastic action of the springs, so that convenient and fast fixation is realized; the position of the L-shaped butt joint clamping plate can be adjusted along the axis direction of the guide sliding rod, and the L-shaped butt joint clamping plate is suitable for integrated circuit structures with the same scaling but different areas and has strong applicability; the butt bolt of threaded connection installation on the L type butt joint splint can be twisted off and make the upper end of rubber pad butt integrated circuit, realizes that the secondary is fixed, further guarantees integrated circuit's stability.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural diagram of a docking substrate according to the present invention;
FIG. 3 is a schematic structural view of a clamping mechanism according to the present invention;
FIG. 4 is an enlarged schematic view of the structure of FIG. 1 at A according to the present invention;
fig. 5 is an enlarged view of the structure shown at B in fig. 3 according to the present invention.
In the figure: 1 butt joint substrate, 101 clamping grooves, 102 substrate chamfer angles, 2 integrated circuit butt joint plates, 201 butt joint plate mounting grooves, 3 clamping mechanisms, 4L-shaped butt joint clamping plates, 401 clamping grooves, 402 upper clamping edges, 403 lower clamping edges, 404 butt joint arc plates, 5 sliding blocks, 501 sliding ways, 6 guide sliding rods, 601 sliding sleeves, 7 springs, 8 limiting lug plates, 801 screw matching grooves, 9 butt joint bolts, 901 threaded shafts and 902 rubber pads.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Unless otherwise indicated, all references to up, down, left, right, front, back, inner and outer directions herein are to be interpreted as referring to up, down, left, right, front, back, inner and outer directions in the drawings to which the invention is directed.
The invention provides a packaging structure for integrated circuit design as shown in fig. 1-5, which comprises a butt joint substrate 1, an integrated circuit butt joint plate 2 and a clamping mechanism 3, wherein the butt joint substrate 1 is in a rectangular plate-shaped structure, and the upper end surface of the butt joint substrate 1 is provided with a clamping groove 101;
the center of the clamping groove 101 of the butt joint substrate 1 is provided with a butt joint plate mounting groove 201 adaptive to the integrated circuit butt joint plate 2, the butt joint substrate 1 is clamped and limited at the periphery of the integrated circuit butt joint plate 2 through the butt joint plate mounting groove 201, in the specific implementation, the upper end surface of the integrated circuit butt joint plate 2 is constructed with a pin structure adaptive to a bottom pin of a dust collecting circuit, the pin structure is adaptive to the integrated circuit matched currently, the integrated circuit butt joint plate 2 is of a rectangular plate structure, the upper end surface of the integrated circuit butt joint plate 2 is constructed with pins for butting the integrated circuit, four corners of the butt joint substrate 1 are constructed with substrate chamfers 102, and one sides of the four groups of substrate chamfers 102 facing the integrated circuit butt joint plate 2 are all matched with a clamping mechanism 3;
the clamping mechanism 3 comprises an L-shaped butt joint clamping plate 4 for butting a limit integrated circuit, the L-shaped butt joint clamping plate 4 is in sliding fit with a butt joint substrate 1, the L-shaped butt joint clamping plate 4 is in sliding fit with the butt joint substrate 1, after the integrated circuit is butted with the integrated circuit butt joint plate 2, a plurality of groups of L-shaped butt joint clamping plates 4 can be butted with four corners of the limit integrated circuit under the elastic action of springs 7 so as to be convenient to fix, one side of the L-shaped butt joint clamping plate 4 facing a substrate chamfer 102 is provided with a group of planes for butting guide sliding rods 6, the guide sliding rods 6 penetrate through the substrate chamfer 102 and extend out of the butt joint substrate 1, a group of springs 7 are sleeved outside the guide sliding rods 6, two ends of each spring 7 are respectively hinged with the substrate chamfer 102 and the L-shaped butt joint clamping plate 4, wherein the L-shaped butt joint clamping plate 4 displaces along the axis direction of the guide sliding rods 6 under the elastic action of the springs 7, the position of the L-shaped butt joint clamping plate 4 can be adjusted along the axis direction of the guide sliding rod 6, and the L-shaped butt joint clamping plate is suitable for integrated circuit structures with the same scaling but different areas and is high in applicability.
Specifically, one side of the substrate chamfer 102 away from the clamping groove 101 of the substrate 1 four-corner structure is provided with a group of limiting lug plates 8, the limiting lug plates 8 are of arc-shaped connecting plate structures for the end structure, and screw matching grooves 801 for matching screws are formed above the limiting lug plates 8.
Specifically, a set of L-shaped engaging grooves 401 is formed in one side of the L-shaped docking plate 4 facing the ic docking plate 2, an upper engaging edge 402 is formed above the engaging groove 401, a lower engaging edge 403 is formed below the engaging groove 401, and the bottom end of the engaging groove 401 is flush with the upper end surface of the ic docking plate 2.
Specifically, slider 5 is constructed to the position bottom of buckling of L type butt joint splint 4, set up the slide 501 of adaptation slider 5 on the centre gripping groove 101, slide 501 extends to corresponding base plate chamfer 102 direction from the one corner of butt joint plate mounting groove 201.
Specifically, a through hole adapted to the guide sliding rod 6 is formed in the base plate chamfer 102, and a sliding sleeve 601 slidably fitting the guide sliding rod 6 is installed in the through hole.
Specifically, a set of butt joint arc plates 404 is constructed at the corner position of an upper buckling edge 402 of the L-shaped butt joint clamping plate 4, a set of butt joint bolts 9 is arranged on the butt joint arc plates 404, the bottom ends of the butt joint bolts 9 comprise threaded shafts 901 of a set of threaded connection butt joint arc plates 404, rubber pads 902 of a set of butt joint integrated circuits are attached to the bottom ends of the threaded shafts 901, the butt joint bolts 9 installed in a threaded connection mode on the L-shaped butt joint clamping plate 4 can be screwed down to enable the rubber pads 902 to butt against the upper ends of the integrated circuits, secondary fixation is achieved, and stability of the integrated circuits is further guaranteed.
The working principle of the packaging structure for integrated circuit design is that when the packaging structure is used, only the butt joint substrate 1 and the integrated circuit butt joint plate 2 are butt-jointed and installed, so that the integrated circuit butt joint plate 2 is embedded into the butt joint plate installation groove 201 of the butt joint substrate 1, the limit lug plates 8 arranged at the four corners of the butt joint substrate 1 are connected through screws, the butt joint substrate 1 is limited, force is applied to push away the four groups of L-shaped butt joint clamping plates 4 at the moment, the integrated circuit is butt-jointed with the integrated circuit butt joint plate 2, when the L-shaped butt joint clamping plates 4 are loosened, the four groups of L-shaped butt joint clamping plates 4 move to the integrated circuit installation position under the action of the elastic force of the peripheral spring 7 of the guide slide bar 6, the clamping grooves 401 of the four groups of L-shaped butt joint clamping plates 4 are clamped at the four corners of the integrated circuit, at the moment, only the screw driver is needed to screw the butt joint bolts 9, so that the screw shaft 901 is in threaded connection fit with the butt joint arc plate 404 until the screw shaft 901 is in butt joint with the surface of the integrated circuit, this packaging structure for integrated circuit design, rational in infrastructure, easy convenient realization is fixed to integrated circuit's encapsulation, and the suitability is strong, has higher practical value.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (6)
1. A packaging structure for integrated circuit design comprises a butt joint substrate (1), an integrated circuit butt joint plate (2) and a clamping mechanism (3), wherein the butt joint substrate (1) is of a rectangular plate-shaped structure, and a clamping groove (101) is formed in the upper end face of the butt joint substrate (1);
the method is characterized in that: a butt joint plate mounting groove (201) matched with the integrated circuit butt joint plate (2) is formed in the center of a clamping groove (101) of the butt joint substrate (1), the butt joint substrate (1) is clamped and limited on the periphery of the integrated circuit butt joint plate (2) through the butt joint plate mounting groove (201), the integrated circuit butt joint plate (2) is of a rectangular plate-shaped structure, pins for butt joint of integrated circuits are constructed on the upper end face of the integrated circuit butt joint plate (2), substrate chamfers (102) are constructed at four corners of the butt joint substrate (1), and clamping mechanisms (3) are matched with one sides, facing the integrated circuit butt joint plate (2), of the four groups of substrate chamfers (102);
fixture (3) including the L type butt joint splint (4) of the spacing integrated circuit of butt, L type butt joint splint (4) and butt joint base plate (1) sliding fit, and L type butt joint splint (4) are constructed the plane of a set of butt joint direction slide bar (6) towards one side of base plate chamfer (102), outside direction slide bar (6) run through base plate chamfer (102) and extend butt joint base plate (1), direction slide bar (6) overcoat is equipped with a set of spring (7), the both ends of spring (7) articulate base plate chamfer (102) and L type butt joint splint (4) respectively, and wherein, L type butt joint splint (4) are along the axle center direction displacement of direction slide bar (6) under spring (7) elastic action.
2. The package structure of claim 1, wherein: one side that centre gripping groove (101) was kept away from in butt joint base plate (1) four corners structure's base plate chamfer (102) is provided with a set of spacing otic placode (8), spacing otic placode (8) are curved even board structure for the tip structure, and the top of spacing otic placode (8) is seted up and is supplied screw complex screw cooperation groove (801).
3. The package structure of claim 1, wherein: l type butt joint splint (4) are seted up a set of block groove (401) that are the L type towards one side of integrated circuit butt joint board (2), the top in block groove (401) is constructed lock edgewise (402), and the below in block groove (401) is constructed lock edgewise (403) down, the bottom in block groove (401) flushes with the up end of integrated circuit butt joint board (2).
4. The package structure of claim 3, wherein: the utility model discloses a base plate chamfer angle (102) direction extension that L type butt joint splint (4) buckle position bottom and be constructed with slider (5), set up slide (501) of adaptation slider (5) on centre gripping groove (101), slide (501) extend to corresponding base plate chamfer angle (102) direction from the one corner of butt joint plate mounting groove (201).
5. The package structure of claim 1, wherein: the base plate chamfer (102) is provided with a through hole matched with the guide sliding rod (6), and a sliding sleeve (601) matched with the guide sliding rod (6) in a sliding mode is arranged in the through hole.
6. The package structure of claim 1, wherein: a group of butt joint arc plates (404) are constructed at the corner positions of the upper buckling edge (402) of the L-shaped butt joint clamping plate (4), a group of butt joint bolts (9) are arranged on the butt joint arc plates (404), the bottom ends of the butt joint bolts (9) comprise a group of threaded shafts (901) which are in threaded connection with the butt joint arc plates (404), and a group of rubber pads (902) of butt joint integrated circuits are attached to the bottom ends of the threaded shafts (901).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010888977.7A CN112002680B (en) | 2020-08-28 | 2020-08-28 | Packaging structure for integrated circuit design |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010888977.7A CN112002680B (en) | 2020-08-28 | 2020-08-28 | Packaging structure for integrated circuit design |
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| CN112002680A CN112002680A (en) | 2020-11-27 |
| CN112002680B true CN112002680B (en) | 2022-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010888977.7A Active CN112002680B (en) | 2020-08-28 | 2020-08-28 | Packaging structure for integrated circuit design |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115084050B (en) * | 2022-07-25 | 2022-11-11 | 成都汉芯国科集成技术有限公司 | Broadband radio frequency system-level sip packaging structure adopting BGA interface |
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| CN112002680A (en) | 2020-11-27 |
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Effective date of registration: 20220316 Address after: 518000 a3702, Xinhao Yidu, No. 7018, CaiTian Road, Lianhua Yicun community, Huafu street, Futian District, Shenzhen, Guangdong Applicant after: Shenzhen Jiechi Electronics Co.,Ltd. Address before: 331409 Room 502, unit 2, no.97-14, Yuxia Avenue, Shuibian Town, Xiajiang County, Ji'an City, Jiangxi Province Applicant before: Chen Yuzhen |
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