CN112000209A - Microcomputer thermal management system - Google Patents

Microcomputer thermal management system Download PDF

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Publication number
CN112000209A
CN112000209A CN202010901396.2A CN202010901396A CN112000209A CN 112000209 A CN112000209 A CN 112000209A CN 202010901396 A CN202010901396 A CN 202010901396A CN 112000209 A CN112000209 A CN 112000209A
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CN
China
Prior art keywords
driving
gear
fan frame
swing
support
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CN202010901396.2A
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Chinese (zh)
Inventor
隋心怡
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Individual
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Individual
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Priority to CN202010901396.2A priority Critical patent/CN112000209A/en
Publication of CN112000209A publication Critical patent/CN112000209A/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/206Cooling means comprising thermal management

Abstract

The invention discloses a microcomputer thermal management system, which comprises a dispersion module, a refrigeration module, a drive module and a case. According to the invention, the refrigeration module is arranged, so that lower temperature can be provided for the device, the temperature in the case can be controlled more accurately, the low temperature generated by the refrigeration module is dispersed into the air through the dispersion module, so that the computer hardware is cooled by using the air, the air outside the case is sent to the inner side of the case through the driving module, and when the air flow flows through the cold piece, the cold air near the cold piece is taken away, so that the whole temperature in the case is reduced.

Description

Microcomputer thermal management system
Technical Field
The invention relates to the technical field of digital instruments, in particular to a microcomputer thermal management system.
Background
The chassis typically includes a housing, brackets, various switches on the panel, indicator lights, etc. The shell is made of steel plates and plastics in a combined mode, is high in hardness and mainly plays a role in protecting elements inside the case. The bracket is mainly used for fixing the mainboard, the power supply and various drivers. There are many types of chassis. AT present, AT, ATX, Micro ATX and the latest BTX-AT chassis are widely named as BaBy AT, and are mainly applied to early machines which can only support the installation of AT mainboards. The ATX chassis is currently the most common chassis, supporting most types of motherboards today. The Micro ATX chassis is built on the basis of the AT chassis, and is smaller than the ATX chassis in size in order to further save desktop space. However, in the prior art, various chassis are pressed by heat of computer hardware during heat dissipation, and the heat productivity of the hardware cannot be controlled.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a microcomputer thermal management system, which solves the problem that the heat of computer hardware is suppressed when various chassis are radiated at present, and the heat productivity of the hardware cannot be controlled.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a microcomputer heat management system, includes dispersion module, refrigeration module, drive module and quick-witted case, dispersion module include cold piece, gangbar, swinging arms support, swing motor, swing drive gear, cold piece support and swing driving gear, there is cold piece the front side of machine incasement wall through cold piece support swing joint, the cold piece is twenty to through gangbar swing joint between the twenty cold pieces.
The refrigeration module comprises a cooling fin, a diode, a radiating fin, a radiating fan and a radiating fan support, wherein the cooling fin is fixedly connected to the top end of the cooling fin support, the diode is fixedly connected to the upper surface of the cooling fin, the radiating fin is fixedly connected to the upper surface of the diode, the radiating fan is arranged above the radiating fin, and the radiating fan is rotatably connected with the case through the radiating fan support.
The driving module comprises a front panel, a front panel bracket, a bottom fan frame, a bottom driven belt wheel, a linkage driving belt, a middle driven belt wheel pressing sheet, a middle fan frame, a middle driven belt wheel, a middle fan frame, a top driven belt wheel, a driving belt, an air inlet fan, a driving belt wheel bracket, a driving driven gear, a driving motor, a driving lateral gear, a driving motor bracket and a dustproof shell, the front of the case is fixedly connected with a front panel through a front panel bracket, the opposite surfaces of the front panel and the cold plate are sequentially provided with a top fan frame, a middle fan frame and a bottom fan frame from top to bottom, the top fan frame, the middle fan frame and the bottom fan frame are fixedly connected with the groove in the front side of the case, and the insides of the top fan frame, the middle fan frame and the bottom fan frame are respectively connected with an air inlet fan in a rotating mode through the top fan frame, the middle fan frame and the bottom fan frame.
Preferably, the bottom swing joint of gangbar has the swinging arms, and the side fixedly connected with swing drive gear of swinging arms, swing drive gear's surface gear connection have the swing driving gear, and the side of swing driving gear is provided with swing motor, swing motor's output shaft and swing driving gear fixed connection, swing motor passes through swing motor support fixed connection with the quick-witted case, the swinging arms passes through the swinging arms support rotation with the quick-witted case and is connected.
Preferably, a groove is formed in the position where the upper surface of the case interferes with the cooling fin, heat-conducting silicone grease is smeared between the cooling fin and the opposite surface of the diode, and heat-conducting silicone grease is smeared between the opposite surfaces of the diode and the radiating fin.
Preferably, the side of top air inlet fan is through connecting axle fixedly connected with top driven pulley, the side of middle part air inlet fan is through connecting axle fixedly connected with middle part driven pulley, the side of bottom air inlet fan is through connecting axle fixedly connected with bottom driven pulley.
Preferably, the top driven pulley, the middle driven pulley and the bottom driven pulley are rotatably connected through a linkage transmission belt, two sides of the middle driven pulley are slidably connected with a middle driven pulley pressing sheet, and the middle driven pulley pressing sheet is fixedly connected with the middle fan frame.
Preferably, the top of the top driven pulley is rotatably connected with a driving pulley through a driving transmission belt, the side of the driving pulley is fixedly connected with a driving driven gear through a connecting shaft, and the driving pulley and the driving driven gear are rotatably connected with the case through a driving pulley support.
Preferably, the lower surface gear of the driving driven gear is connected with a driving side gear, the driving side gear is rotatably connected with the upper surface of the case, a driving motor is arranged above the driving side gear, an output shaft of the driving motor is fixedly connected with the driving side gear, and the driving motor is fixedly connected with the case through a driving motor support.
Preferably, dustproof shells are arranged on the outer sides of the driving belt wheel, the driving belt wheel support, the driving driven gear, the driving motor, the driving lateral gear and the driving motor support, and the dustproof shells are fixedly connected with the upper surface of the case.
Compared with the prior art, the invention provides a microcomputer thermal management system, which has the following beneficial effects: according to the invention, the refrigeration module is arranged, so that lower temperature can be provided for the device, the temperature in the case can be controlled more accurately, the low temperature generated by the refrigeration module is dispersed into the air through the dispersion module, so that the computer hardware is cooled by using the air, the air outside the case is sent to the inner side of the case through the driving module, and when the air flow flows through the cold piece, the cold air near the cold piece is taken away, so that the whole temperature in the case is reduced.
Drawings
FIG. 1 is a schematic view of the structure of the present invention.
FIG. 2 is a schematic diagram of a dispersed module structure according to the present invention.
FIG. 3 is a schematic view of the present invention.
Fig. 4 is a schematic structural diagram of a driving module according to the present invention.
FIG. 5 is a schematic view of the present invention.
Fig. 6 is a schematic structural diagram of a refrigeration module according to the present invention.
Fig. 7 is a schematic structural diagram of a driving module according to the present invention.
In the figure: 1-a dispersion module; 101-cold piece; 102-a linkage bar; 103-a swing lever; 104-a sway bar support; 105-a swing motor mount; 106-a swing motor; 107-oscillating drive gear; 108-cold plate holder; 109-a swing drive gear; 2-a refrigeration module; 201-cooling dispersing tablets; 202-a diode; 203-a heat sink; 204-a heat dissipation fan; 205-radiator fan support; 3-a drive module; 301-front panel; 302-front panel bracket; 303-bottom fan frame; 304-bottom fan frame; 305-a bottom driven pulley; 306-a linkage belt; 307-pressing by a middle driven belt wheel; 308-middle fan frame; 309-middle driven pulley; 310-middle fan frame; 311-top fan frame; 312-top fan frame; 313-top driven pulley; 314-active drive belt; 315-supply fan; 316-a drive pulley; 317-driving pulley support; 318-driving driven gear; 319-drive motor; 320-drive side gear; 321-a drive motor support; 322-dust-proof housing; 4-case.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, fig. 6, and fig. 7, the present invention provides a technical solution: a heat management system of a microcomputer comprises a dispersion module 1, a refrigeration module 2, a driving module 3 and a case 4, as shown in figures 1 and 2, wherein the dispersion module 1 comprises cold plates 101, a linkage rod 102, a swing rod 103, a swing rod support 104, a swing motor support 105, a swing motor 106, a swing driving gear 107, a cold plate support 108 and a swing driving gear 109, the front side of the inner wall of the case 4 is movably connected with the cold plates 101 through the cold plate support 108, the number of the cold plates 101 is twenty, twenty cold plates 101 are movably connected through the linkage rod 102, the bottom end of the linkage rod 102 is movably connected with the swing rod 103, the side surface of the swing rod 103 is fixedly connected with the swing driving gear 107, the outer surface gear of the swing driving gear 107 is connected with the swing driving gear 109, the swing motor 106 is arranged on the side of the swing driving gear 109, the output shaft of the swing motor 106 is fixedly, the swing motor 106 is fixedly connected with the case 4 through a swing motor bracket 105, and the swing lever 103 is rotatably connected with the case 4 through a swing lever bracket 104.
Fig. 6 is a structural diagram of a refrigeration module of the present invention, wherein the refrigeration module 2 includes a cooling fin 201, a diode 202, a heat sink 203, a heat sink 204, and a heat sink support 205, the top end of the cooling fin support 108 is fixedly connected with the cooling fin 201, the upper surface of the cooling fin 201 is fixedly connected with the diode 202, the upper surface of the diode 202 is fixedly connected with the heat sink 203, the heat sink 203 is disposed above the heat sink 204, the heat sink 204 is rotatably connected with the chassis 4 through the heat sink support 205, a groove is disposed at a position where the upper surface of the chassis 4 interferes with the cooling fin 201, heat-conducting silicone grease is coated between the opposite surfaces of the cooling fin 201 and the diode 202, and heat-conducting silicone grease is coated between the opposite surfaces of the diode 202 and the heat sink 203.
As shown in fig. 4 and fig. 7, which are structural diagrams of the driving module of the present invention, the driving module 3 includes a front panel 301, a front panel support 302, a bottom fan frame 303, a bottom fan frame 304, a bottom driven pulley 305, a linkage transmission belt 306, a middle driven pulley press sheet 307, a middle fan frame 308, a middle driven pulley 309, a middle fan frame 310, a top fan frame 311, a top fan frame 312, a top driven pulley 313, a driving transmission belt 314, an air inlet fan 315, a driving pulley 316, a driving pulley support 317, a driving driven gear 318, a driving motor 319, a driving lateral gear 320, a driving motor support 321, and a dust-proof housing 322, the front of the chassis 4 is fixedly connected with the front panel 301 through the front panel support 302, the front panel 301 and the cold plate 101 are sequentially provided with the top fan frame 312, the middle fan frame 310, and the bottom fan frame 303 from top to bottom, the top fan frame 312, the middle fan frame 310, and the bottom fan frame 303 are all fixedly connected, the interior of the top fan frame 312, the interior of the middle fan frame 310 and the interior of the bottom fan frame 303 are respectively rotatably connected with an air inlet fan 315 through a top fan frame 311, the interior of the middle fan frame 308 and the interior of the bottom fan frame 304 through a middle fan frame 308, the interior of the bottom fan frame 304 through a top fan frame 311, the interior of the top fan frame 308 through a middle fan frame 313 and the interior of the bottom fan frame 304 through a connecting shaft, the side of the top air inlet fan 315 through a connecting shaft fixedly connected with a top driven pulley 313, the side of the middle air inlet fan 315 through a connecting shaft fixedly connected with a middle driven pulley 309, the side of the bottom air inlet fan 315 through a connecting shaft fixedly connected with a bottom driven pulley 305, the top driven pulley 313, the middle driven pulley 309 and the bottom driven pulley 305 through a linkage transmission belt 306 rotatably connected, the two sides of the middle driven pulley 309 through a, the driving belt wheel 316 and the driving driven gear 318 are rotatably connected with the chassis 4 through a driving belt wheel support 317, a driving side gear 320 is connected with a lower surface gear of the driving driven gear 318, the driving side gear 320 is rotatably connected with an upper surface of the chassis 4, a driving motor 319 is arranged above the driving side gear 320, an output shaft of the driving motor 319 is fixedly connected with the driving side gear 320, the driving motor 319 is fixedly connected with the chassis 4 through a driving motor support 321, a dustproof shell 322 is arranged on the outer sides of the driving belt wheel 316, the driving belt wheel support 317, the driving driven gear 318, the driving motor 319, the driving side gear 320 and the driving motor support 321, and the dustproof shell 322 is fixedly connected with the upper surface of the chassis 4.
When the computer accessory is used, a user firstly installs the computer accessory in the device, when the computer accessory is heated in work, the diode 202 is started, the refrigerating surface of the diode 202 heats the cooling fins 201, at the moment, the low temperature is transmitted to each cooling fin 101 through the cooling fin bracket 108, the air around the cooling fins 101 is in a low-temperature state, at the moment, the cooling fan 204 rotates to blow air to the surface of the cooling fins 203, the heating surface of the diode 202 is cooled, the diode 202 is prevented from being damaged due to high temperature, meanwhile, the driving motor 319 is started, the output shaft of the driving motor 319 rotates with the driving lateral gear 320, the driving lateral gear 320 rotates to drive the driving driven gear 318 to rotate, the driving driven gear 318 rotates to drive the driving belt pulley 316 to rotate, the driving belt 316 rotates to drive the top driven belt pulley 313 to rotate through the driving belt 314, the rotation of top driven pulley 313 will drive middle part driven pulley 309 and bottom driven pulley 305 to rotate together through linkage drive belt 306, at this moment top driven pulley 313, middle part driven pulley 309 and bottom driven pulley 305 rotate and will drive three air inlet fan 315 and rotate, air inlet fan 315 rotates and will send the air in the machine case 4 outside into the inboard of machine case 4, at this moment the air current will pass cold plate 101, will take away the cold air near cold plate 101 when the air current flows through cold plate 101, thereby carry out whole cooling to the inside of machine case 4.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (8)

1. The utility model provides a microcomputer thermal management system, includes dispersion module (1), refrigeration module (2), drive module (3) and quick-witted case (4), its characterized in that: the dispersing module (1) comprises cold pieces (101), a linkage rod (102), a swing rod (103), a swing rod support (104), a swing motor support (105), a swing motor (106), a swing driving gear (107), cold piece supports (108) and a swing driving gear (109), wherein the front side of the inner wall of the case (4) is movably connected with the cold pieces (101) through the cold piece supports (108), the number of the cold pieces (101) is twenty, and the twenty cold pieces (101) are movably connected through the linkage rod (102);
the refrigeration module (2) comprises a cooling fin 201, a diode (202), a radiating fin (203), a radiating fan (204) and a radiating fan support (205), wherein the top end of the cooling fin support (108) is fixedly connected with the cooling fin (201), the upper surface of the cooling fin (201) is fixedly connected with the diode (202), the upper surface of the diode (202) is fixedly connected with the radiating fin (20), the radiating fan (204) is arranged above the radiating fin (203), and the radiating fan (204) is rotatably connected with the case (4) through the radiating fan support (205);
the driving module (3) comprises a front panel (301), a front panel support (302), a bottom fan frame (303), a bottom fan frame (304), a bottom driven pulley (05), a linkage transmission belt (306), a middle driven pulley pressing sheet (307), a middle fan frame (308), a middle driven pulley (309), a middle fan frame (310), a top fan frame (311), a top fan frame (312), a top driven pulley (313), a driving transmission belt (314), an air inlet fan (315), a driving pulley (316), a driving pulley support (317), a driving driven gear (318), a driving motor (319), a driving lateral gear (320), a driving motor support (321) and a dustproof shell (322), wherein the front of the case (4) is fixedly connected with the front panel (301) through the front panel support (302), and the opposite surface of the front panel (301) and the cold plate (101) is provided with the top fan frame (312) and the dustproof shell (322) from the bottom in sequence, The fan comprises a middle fan frame (310) and a bottom fan frame (303), wherein the top fan frame (312), the middle fan frame (310) and the bottom fan frame (303) are fixedly connected with a slot on the front side of the case (4), and the insides of the top fan frame (312), the middle fan frame (310) and the bottom fan frame (303) are respectively and rotatably connected with an air inlet fan (315) through a top fan frame (311), a middle fan frame (308) and a bottom fan frame (304).
2. The microcomputer thermal management system of claim 1, wherein: the bottom swing joint of gangbar (102) has swinging arms (103), and the side fixedly connected with swing drive gear (107) of swinging arms (103), the surface gear connection of swing drive gear (107) has swing driving gear (109), and the side of swing driving gear (109) is provided with swing motor (106), the output shaft and swing driving gear (109) fixed connection of swing motor (106), swing motor (106) and quick-witted case (4) are through swing motor support (105) fixed connection, swing arms (103) are connected through swinging arms support (104) rotation with quick-witted case (4).
3. The microcomputer thermal management system of claim 1, wherein: a groove is formed in the position where the upper surface of the case (4) is interfered with the cooling dissipation sheet (201), heat-conducting silicone grease is smeared between the cooling dissipation sheet (201) and the opposite surface of the diode (202), and heat-conducting silicone grease is smeared between the opposite surfaces of the diode (202) and the radiating fin (203).
4. The microcomputer thermal management system of claim 1, wherein: connecting axle fixedly connected with top driven pulley (313) is passed through to side of top air inlet fan (315), connecting axle fixedly connected with middle part driven pulley (309) is passed through to side of middle part air inlet fan (315), connecting axle fixedly connected with bottom driven pulley (305) is passed through to side of bottom air inlet fan (315).
5. The microcomputer thermal management system of claim 4, wherein: the top driven belt wheel (313), the middle driven belt wheel (309) and the bottom driven belt wheel (305) are rotationally connected through a linkage transmission belt (306), two sides of the middle driven belt wheel (309) are slidably connected with a middle driven belt wheel pressing sheet (307), and the middle driven belt wheel pressing sheet (307) is fixedly connected with a middle fan frame (310).
6. The microcomputer thermal management system of claim 1, wherein: the top driven pulley (313) is rotatably connected with a driving pulley (316) through a driving transmission belt (314), a driving driven gear (318) is fixedly connected to the side of the driving pulley (316) through a connecting shaft, and the driving pulley (316) and the driving driven gear (318) are rotatably connected with the chassis (4) through a driving pulley support (317).
7. The microcomputer thermal management system of claim 1, wherein: the lower surface gear of drive driven gear (318) is connected with drive side gear (32), and drive side gear (320) is connected with the upper surface rotation of quick-witted case (4), the top of drive side gear (320) is provided with driving motor (319), and the output shaft of driving motor (319) and drive side gear (320) fixed connection, driving motor (319) and quick-witted case (4) are through driving motor support (321) fixed connection.
8. The microcomputer thermal management system of claim 1, wherein: and a dustproof shell (32) is arranged on the outer sides of the driving belt wheel (316), the driving belt wheel support (317), the driving driven gear (318), the driving motor (319), the driving side gear (320) and the driving motor support (321), and the dustproof shell (322) is fixedly connected with the upper surface of the case (4).
CN202010901396.2A 2020-08-31 2020-08-31 Microcomputer thermal management system Withdrawn CN112000209A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010901396.2A CN112000209A (en) 2020-08-31 2020-08-31 Microcomputer thermal management system

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Application Number Priority Date Filing Date Title
CN202010901396.2A CN112000209A (en) 2020-08-31 2020-08-31 Microcomputer thermal management system

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CN112000209A true CN112000209A (en) 2020-11-27

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CN202010901396.2A Withdrawn CN112000209A (en) 2020-08-31 2020-08-31 Microcomputer thermal management system

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112631052A (en) * 2021-01-20 2021-04-09 范聪洁 Optical equipment heating protection system
CN112716088A (en) * 2021-01-25 2021-04-30 任晓民 Head protection initiative heat preservation system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112631052A (en) * 2021-01-20 2021-04-09 范聪洁 Optical equipment heating protection system
CN112716088A (en) * 2021-01-25 2021-04-30 任晓民 Head protection initiative heat preservation system
CN112716088B (en) * 2021-01-25 2023-10-20 河北安泰富源安全设备制造有限公司 Head protection initiative heat preservation system

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