CN112000203A

CN112000203A - Double-cooling self-cooling computer mainframe

Info

Publication number: CN112000203A
Application number: CN202010848908.3A
Authority: CN
Inventors: 阮少伟
Original assignee: Xuzhou University of Technology
Current assignee: Xuzhou University of Technology
Priority date: 2020-08-21
Filing date: 2020-08-21
Publication date: 2020-11-27

Abstract

The invention discloses a double-cooling self-cooling computer mainframe box in the technical field of computer cabinets, which comprises a cabinet, wherein a heat-conducting plate is uniformly and fixedly arranged on the bottom wall of an inner cavity of the cabinet, the top end of the heat-conducting plate penetrates through the top wall of the cabinet, a water-cooling pipeline is arranged on the outer wall of the heat-conducting plate and is positioned in the inner cavity of the cabinet, a heat-radiating air duct is screwed on the top wall of the cabinet, the top wall of the heat-conducting plate is contacted with the top wall of the inner cavity of the heat-radiating air duct, dust blocking plates are screwed on the left outer wall and the right outer wall of the heat-radiating air duct, two groups of air distribution plates and a fan are respectively clamped in the inner cavity of the heat-radiating air duct, the two.

Description

Double-cooling self-cooling computer mainframe

Technical Field

The invention discloses a double-cooling self-cooling computer mainframe box, and particularly relates to the technical field of computer cabinets.

Background

The machine case of computer is as a part in the computer accessory, its main function that plays is to place and fix each computer spare, play a bearing and guard action, simultaneously along with the development of computer equipment, its calorific capacity is also bigger and bigger, if the heat dissipation that the machine case can not be quick, can make the work efficiency of computer step down, make the ageing speed of its hardware accelerate simultaneously, present traditional machine case all adopts the forced air cooling heat dissipation, the radiating effect is not good, it is worse in high temperature environment simultaneously, and the dust in the easy adsorption environment of machine case, the condition of the incasement short circuit has been caused easily to the time of having a specified duration.

Disclosure of Invention

The present invention is directed to a dual-cooling self-cooling computer mainframe to solve the problems of the prior art.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a two cooling are from cooling formula computer mainframe box, includes quick-witted case, the even fixed mounting of inner chamber diapire of machine case has the heat-conducting plate, the roof of quick-witted case is run through on the top of heat-conducting plate, the outer wall of heat-conducting plate is provided with the water-cooling pipeline, the water-cooling pipeline is located the inner chamber of machine case, the roof spiro union of machine case has the heat dissipation wind channel, the roof of heat-conducting plate and the contact of the inner chamber roof in heat dissipation wind channel, the equal spiro union of outer wall has the dust board about the heat dissipation wind channel, the inner chamber in heat dissipation wind channel joint respectively has two sets of gas distribution boards and fan, and is two sets of the gas distribution board is.

Preferably, the cross section of the air distribution hole is in a circular truncated cone shape.

Preferably, the large holes of the left and right groups of the air distribution holes face outwards.

Preferably, the air distribution holes are positioned between the heat conducting plates.

Preferably, a sealing gasket is arranged between the heat dissipation air duct and the dust baffle.

Compared with the prior art, the invention has the beneficial effects that:

1) the device is provided with a heat conducting plate and a water cooling pipeline, wherein the heat conducting plate penetrates through the top wall of a case, after the water cooling pipeline exchanges heat with high-temperature air in the case, the water cooling pipeline exchanges heat with the heat conducting plate, the heat conducting plate exchanges heat with air outside the case, the brief introduction of the water cooling pipeline and the air outside the case are realized, and dust is prevented from entering an inner cavity of the case;

2) this device sets up the heat dissipation wind channel, the dust board, the gas distribution board, gas distribution hole and fan, through starting two sets of fans, make the hot-air in heat dissipation wind channel inner chamber from the one end fan suction in heat dissipation wind channel, external cold air is inhaled by the fan from the other end in heat dissipation wind channel, realize the circulation of air in heat dissipation wind channel inner chamber, external cold air carries out the heat transfer with the heat-conducting plate when through with heat dissipation wind channel, the radiating efficiency of heat-conducting plate is improved, the device simple structure, high durability and convenient use, effectively improve quick-witted incasement radiating efficiency, effectively avoid the dust to get into quick-witted.

Drawings

FIG. 1 is a schematic front sectional view of a dual cooling self-cooling computer mainframe box according to the present invention;

FIG. 2 is a right side view of the dust shield of the present invention;

FIG. 3 is a right sectional view of the dual cooling self-cooling computer mainframe box according to the present invention;

FIG. 4 is a schematic front cross-sectional view of the left gas panel of the present invention;

FIG. 5 is a schematic front sectional view of the right gas distribution plate of the present invention.

In the figure: 100 chassis, 200 heat conducting plates, 210 water cooling pipelines, 300 heat radiating air ducts, 310 dust baffles, 320 air distribution plates, 321 air distribution holes and 330 fans.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The present invention provides a dual-cooling self-cooling computer mainframe box, which effectively improves the heat dissipation efficiency in the computer mainframe box and effectively prevents dust from entering the computer mainframe box, please refer to fig. 1 and 3, including a computer case 100;

referring to fig. 1 and fig. 3 again, the bottom wall of the inner cavity of the chassis 100 is uniformly and fixedly installed with a heat conducting plate 200, the top end of the heat conducting plate 200 penetrates through the top wall of the chassis 100, the outer wall of the heat conducting plate 200 is provided with a water cooling pipeline 210, the water cooling pipeline 210 is located in the inner cavity of the chassis 100, and the heat conducting plate 100 is used for exchanging heat with the air in the inner cavity of the chassis 100 and the water cooling pipeline 210;

referring to fig. 1, 2 and 3, a heat dissipating air duct 300 is screwed to the top wall of the chassis 100, the top wall of the heat conducting plate 200 contacts with the top wall of the inner cavity of the heat dissipating air duct 300, dust baffles 310 are screwed to the left and right outer walls of the heat dissipating air duct 300, two sets of air distribution plates 320 and fans 330 are respectively fastened to the inner cavity of the heat dissipating air duct 300, the two sets of air distribution plates 320 are located inside the fans 330, air distribution holes 321 are formed in the outer walls of the air distribution plates 320, the dust baffles 310 are used for filtering air entering the inner cavity of the heat dissipating air duct 300, the air distribution plates 320 are used for uniformly distributing the air entering the inner cavity of the heat dissipating air duct 300 between the heat conducting plates 200, and the fans 300 are used for sucking in;

referring to fig. 4 and 5, the cross section of the air distribution hole 321 is a circular truncated cone;

referring to fig. 4 and 5 again, the large holes of the left and right air distribution holes 321 face outward, so as to increase the flow rate of air in the inner cavity of the heat dissipation air duct 300;

referring to fig. 3, the air distribution holes 321 are located between the heat conducting plates 200, and the outside air fully exchanges heat with the heat conducting plates 200 before entering the heat conducting plates 200 through the air distribution holes 321;

referring to fig. 1, a sealing gasket is disposed between the heat dissipation air duct 300 and the dust guard plate 310, and the sealing gasket improves the sealing property between the heat dissipation air duct 300 and the dust guard plate 310.

While the invention has been described above with reference to certain embodiments, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the various features of the various embodiments of the invention disclosed may be used in any combination whatsoever without structural conflict, and the failure to exhaustively describe such combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims

1. A dual-cooling self-cooling computer mainframe box, comprising a case (100), characterized in that: the even fixed mounting of inner chamber diapire of quick-witted case (100) has heat-conducting plate (200), the roof of quick-witted case (100) is run through on the top of heat-conducting plate (200), the outer wall of heat-conducting plate (200) is provided with water-cooling pipeline (210), water-cooling pipeline (210) are located the inner chamber of quick-witted case (100), the roof spiro union of quick-witted case (100) has heat dissipation wind channel (300), the roof of heat-conducting plate (200) and the inner chamber roof contact of heat dissipation wind channel (300), the equal spiro union of outer wall has dust board (310) about heat dissipation wind channel (300), the inner chamber difference joint of heat dissipation wind channel (300) has two sets of gas distribution plate (320) and fan (330), and is two sets of gas distribution plate (320) are located the inside of fan (330), gas distribution plate (320)'s outer wall is.

2. The dual cooling self-cooling computer mainframe of claim 1 wherein: the cross section of the air distribution hole (321) is in a circular truncated cone shape.

3. The dual cooling self-cooling computer mainframe of claim 1 wherein: the big holes of the left and right air distribution holes (321) face outwards.

4. The dual cooling self-cooling computer mainframe of claim 1 wherein: the air distribution holes (321) are positioned between the heat conducting plates (200).

5. The dual cooling self-cooling computer mainframe of claim 1 wherein: and a sealing gasket is arranged between the heat dissipation air duct (300) and the dust baffle plate (310).