CN111993477A

CN111993477A - Wafer sample manufacturing device

Info

Publication number: CN111993477A
Application number: CN202010960698.7A
Authority: CN
Inventors: 吴文栋; 涂欣; 尹香槟; 丁金森; 辛明亮; 笪菁; 唐元亮; 邓健怡
Original assignee: Guangzhou Special Pressure Equipment Inspection and Research Institute
Current assignee: Guangzhou Special Pressure Equipment Inspection and Research Institute
Priority date: 2020-09-14
Filing date: 2020-09-14
Publication date: 2020-11-27

Abstract

The invention discloses a wafer sample manufacturing device which comprises a machine table, a fixing mechanism and a cutting mechanism, wherein the fixing mechanism is arranged on the machine table and used for fixing a to-be-sampled piece; the cutting mechanism is arranged on the machine platform and comprises a first circular cutter and a second planar cutter, the first circular cutter can move in the first direction to be used for cutting the column of the to-be-sampled part, and the second planar cutter can move in the second direction to be used for slicing the to-be-sampled part after the operation of the to-be-sampled column. This disk sample making devices, during the system appearance, will treat that the sample piece (like the sample strip) fixes through fixed establishment, then, starts cutting mechanism, makes first circular cutter treat and take a sample the room and cut the post operation, obtains the column sample, then, makes second plane cutter carry out the section operation (the sample piece or the appearance section of predetermineeing thickness) to the column sample, finally obtains the sample, and the experience requirement to operating personnel is low, convenient operation, and the sampling precision is high.

Description

Wafer sample manufacturing device

Technical Field

The invention relates to the technical field of test sampling equipment, in particular to a wafer sample manufacturing device.

Background

In the product performance test of polyethylene pipes, the oxidation induction time and the oxidation induction temperature are one of the basic performance indexes. The oxidation induction temperature (dynamic OIT) is a temperature at which the sample starts an autocatalytic oxidation reaction in a prescribed temperature change program, and is an index for evaluating the thermal degradation resistance of the sample material in molding, storage, welding and use, and is generally measured by a differential scanning calorimeter. The oxidation induction time is determined using the standard "plastic Differential Scanning Calorimetry (DSC) sixth section: the determination of the oxidation induction time (isothermal OIT) and the oxidation induction temperature (dynamic OIT) (GB/T19466.6-2009) and the polyethylene pipe and pipe thermal stability test method (GB/T17391-1998), wherein the standard GB/T19466.6-2009 is adopted for the determination of the oxidation induction temperature. Wherein, the current polyethylene gas pipe adopts GB/T19466.6-2009, and the polyethylene gas pipe and the valve adopt GB/T17391-1998.

The test sample of the polyethylene pipe is generally a small round piece, and the thickness (or quality) and the sampling position of the sample can be different according to different standards. In general, the sample thickness is specified to be 0.65 mm. + -. 0.10mm (or the sample mass is specified to be 15 mg. + -. 2mg or 15 mg. + -. 0.5mg), the sampling position is specified to be PE tubing which is sampled from the inner and outer surfaces of the tubing, respectively, and the valve standard of the PE tubing is sampled after removing the 0.2mm scale layer. The basic requirements for sample preparation are: regular shape, cylindrical shape, flat and smooth slice surface, and sample thickness or quality meeting corresponding standards. The crucible used in the detection instrument is generally about 5mm to 6mm in diameter, so that the sampling thickness and the wafer diameter are small, and the requirements on sample clamping, fixing and slicing are extremely high.

The common sampling tool is a small or simple cutter, and sampling is performed by manual cutting. However, the sampling mode is easy to cause the conditions of uneven sample thickness and irregular section, and has extremely high requirements on operators; moreover, the PE material has certain hardness, the cutting force is difficult to control, and the operation is inconvenient.

Disclosure of Invention

Accordingly, there is a need for a wafer sample preparation apparatus; the wafer sample manufacturing device is high in sampling precision and convenient to operate.

The technical scheme is as follows:

one embodiment provides a wafer sample preparation apparatus comprising:

a machine platform;

the fixing mechanism is arranged on the machine table and used for fixing a to-be-sampled piece; and

the cutting mechanism is arranged on the machine table and comprises a first circular cutter and a second plane cutter, the first circular cutter can move in a first direction to be used for column cutting operation of the piece to be sampled, the second plane cutter can move in a second direction to be used for slicing operation of the piece to be sampled after column cutting operation, and the second direction is perpendicular to the first direction.

Above-mentioned disk sample making devices, during the system appearance, will treat the sample (like the sample strip, can follow the arbitrary cubic sample strip of surely getting about 15mm of length width on tubulose or the panel) and fix through fixed establishment, then, start cutting mechanism, make first circular cutter treat and take a sample between carry out the column cutting operation and obtain cylindric sample strip, then make the second plane cutter according to predetermineeing the section thick track and carry out the section operation to the cylindric sample strip of surely getting, finally obtain the sample, it is low to operating personnel's experience requirement, convenient operation, and the sampling precision is high.

The technical solution is further explained below:

in one embodiment, the cutting mechanism further includes a first driving member, and the first driving member is disposed on the machine platform and can drive the first circular cutter to move along the first direction, so as to perform a column cutting operation on the to-be-sampled workpiece.

In one embodiment, the first circular cutter comprises a first cutter bar and a first blade, one end of the first cutter bar is in transmission connection with the first driving piece, and the first blade is arranged at the other end of the first cutter bar.

In one embodiment, the cutting mechanism further comprises a protective cover fixed on the machine table, and the first driving member is fixed on the machine table and located in the protective cover.

In one embodiment, the cutting mechanism further includes a bracket and a second driving member, the bracket is fixed on the machine table, the second driving member is fixed on the bracket, the second driving member is in transmission connection with the second plane cutter, and the second driving member can drive the second plane cutter to move along the second direction, so that the second plane cutter performs slicing operation on the to-be-sampled piece.

In one embodiment, the cutters of the second plane cutter are arranged in a wedge-shaped plane.

In one embodiment, the fixing mechanism includes a base, a supporting plate, a pressing plate and a first adjusting rod, the base is disposed on the machine platform, the supporting plate is fixedly connected to the base, the pressing plate is fixed to one end of the first adjusting rod, and the first adjusting rod is telescopically engaged with the base, so that the pressing plate moves toward the supporting plate, and the pressing plate and the supporting plate form a clamping portion for fixing the to-be-sampled member.

In one embodiment, the fixing mechanism further comprises a fixing plate, the fixing plate and the supporting plate are respectively fixed on two opposite sides of the base, the first adjusting rod is provided with a first threaded portion, and the first adjusting rod is in threaded connection with the fixing plate through the first threaded portion;

the supporting plate is fixed on one side, located on the first round cutter, of the base, and a notch is formed in the supporting plate, so that the first round cutter can cut the column of the to-be-sampled part.

In one embodiment, the base is in sliding fit with the machine table, the wafer sample manufacturing device further comprises a distance adjusting mechanism, the distance adjusting mechanism comprises a second adjusting rod, one end of the second adjusting rod is connected with the base, the second adjusting rod is also in telescopic fit with the machine table, and the second adjusting rod moves telescopically and drives the base to move along the first direction;

the distance adjusting mechanism further comprises a measuring component, and the measuring component is arranged on the machine table and used for measuring the moving position of the base.

In one embodiment, the disc sample preparation device further comprises a sample box, the sample box is positioned between the support plate and the first circular cutter, and the sample box is detachably fixed on the support plate and used for receiving a sample.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention.

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a first perspective view of an apparatus for manufacturing a wafer sample according to an embodiment;

FIG. 2 is a second perspective view of the device for manufacturing a wafer sample of the embodiment of FIG. 1;

FIG. 3 is a third perspective view of the device for manufacturing a wafer sample of the embodiment of FIG. 1;

FIG. 4 is a fourth perspective view of the device for manufacturing a wafer sample in the embodiment of FIG. 1;

FIG. 5 is a schematic view of the protective cover and the first circular cutter of the embodiment of FIG. 1;

fig. 6 is a schematic view of the overall structure of the support plate in the embodiment of fig. 1.

Reference is made to the accompanying drawings in which:

100. a machine platform; 200. a cutting mechanism; 210. a first circular cutter; 220. a second plane cutter; (ii) a 230. A protective cover; 240. a support; 300. a fixing mechanism; 310. a base; 320. a support plate; 321. a recess; 330. pressing a plate; 340. a first adjusting lever; 350. a fixing plate; 410. a second adjusting lever; 500. and (4) a sample box.

Detailed Description

Embodiments of the present invention are described in detail below with reference to the accompanying drawings:

in order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Referring to fig. 1 to 4, one embodiment provides a wafer sample manufacturing apparatus, which includes a machine 100, a fixing mechanism 300, and a cutting mechanism 200.

In one embodiment, referring to fig. 1 to 4, the machine 100 is a table-shaped sampling table, which may be a rectangular sampling table, for providing a mounting support for the fixing mechanism 300 and the cutting mechanism 200, and providing an operation platform.

In one embodiment, referring to fig. 1 to 4, the fixing mechanism 300 is disposed on the machine 100 and is used for fixing a sample to be sampled.

The fixing mechanism 300 is disposed on the machine 100, and is mainly used for fixing the to-be-sampled member on the machine 100 by clamping or the like, and facilitating subsequent sample cutting operation by fixing (e.g., positioning) or the like.

The sample to be sampled may be a sample strip, such as a rectangular spline. The rectangular sample strips are fixed and then subjected to subsequent sample cutting operation. The sample to be sampled may be a rectangular strip having a length and width of 5mm to 50mm and a height of 10mm to 20 mm.

In one embodiment, referring to fig. 1 to 4, the cutting mechanism 200 is disposed on the machine 100, the cutting mechanism 200 includes a first circular cutter 210 and a second planar cutter 220, the first circular cutter 210 is movable along a first direction for performing a column cutting operation on the to-be-sampled workpiece, and the second planar cutter 220 is movable along a second direction for performing a slicing operation on the to-be-sampled workpiece after the column cutting operation, the second direction is perpendicular to the first direction.

When the oxidation induction time performance index of polyethylene pipes is detected, a sample is generally required to be a sheet (also can be understood as a section) with a certain thickness, so that the sampling operation comprises two steps, wherein one step is to cut the polyethylene pipe into sections, and then the sections are taken out to finally obtain a finished product.

Therefore, at the time of the sample cutting operation, the column cutting operation is first performed by the first circular cutter 210 to obtain a columnar sample, and then the columnar sample is cut (sliced) by the second flat cutter 220 to obtain a sheet-like or segment-like sample. The first circular cutter 210 and the second planar cutter 220 can be automatically controlled by a matched controller (such as a PLC) and can continuously and automatically operate, the contact time of the first circular cutter 210 and a to-be-sampled piece is extremely short, the generated heat is extremely small, and the performance influence on the to-be-sampled piece is small, so that the performance influence on subsequently obtained samples is reduced, and the reliability of a detection result is improved.

It should be noted that the column cutting operation here may be to form a column strip capable of being separated from the to-be-sampled piece inside the to-be-sampled piece, and when the second plane cutter 220 is used for slicing, the second plane cutter 220 cuts off or cuts the to-be-sampled piece at a certain position by a certain depth, so that the column strip is separated from the original to-be-sampled piece to form a sample, which is not described in detail.

The sample is generally a sheet-like structure, the thickness of the sample is generally 0.65mm + -0.10 mm, and the mass of the sample can be generally 15mg + -2 mg or 15mg + -0.5 mg.

This disk sample making devices, during the system appearance, will treat the sample (like the sample strip, can follow the arbitrary cubic sample strip of cutting about 15mm of length width on tubulose or the panel) and fix through fixed establishment 300, then, start cutting mechanism 200, make first circular cutter 210 treat and take a sample between carry out the column cutting operation, obtain the column sample, then, make second plane cutter 220 carry out the section operation (the sample piece or the appearance section of predetermineeing thickness) to the column sample, finally obtain the sample, it is low to operating personnel's experience requirement, high operation convenience, and the sampling precision.

In an embodiment, referring to fig. 1, fig. 4 and fig. 5, the cutting mechanism 200 further includes a first driving member, which is disposed on the machine 100 and can drive the first circular cutter 210 to move along the first direction, so as to perform a column cutting operation on the to-be-sampled workpiece.

In one embodiment, referring to fig. 5, the first circular cutter 210 includes a first cutter bar and a first blade, one end of the first cutter bar is in transmission connection with the first driving member, and the first blade is disposed at the other end of the first cutter bar.

The first cutter rod may be a cylindrical rod, and the first cutter blade is fixed on the end surface of the first cutter rod. It can be understood that: the first cutter bar rotates under the driving action of the first driving piece and advances towards the to-be-sampled piece, so that the first blade marks a cylindrical groove on the to-be-sampled piece, and a cylindrical structure is formed on the to-be-sampled piece.

Optionally, the first blade is a circular blade.

In one embodiment, referring to fig. 1 to 5, the cutting mechanism 200 further includes a protective cover 230, the protective cover 230 is fixed on the machine 100, and the first driving member is fixed on the machine 100 and located in the protective cover 230.

The protective cover 230 protects the first driving member and prevents an operator from being injured by an accident.

Of course, when the arrangement is specific, the corresponding circuit structure can be arranged in the protection cover 230, and when the arrangement is not in operation, the first circular cutter 210 can be retracted into the protection cover 230 under the driving action of the first driving member.

In an embodiment, referring to fig. 1 to 4, the cutting mechanism 200 further includes a support 240 and a second driving member, the support 240 is fixed on the machine 100, the second driving member is fixed on the support 240, the second driving member is in transmission connection with the second plane cutter 220, and the second driving member can drive the second plane cutter 220 to move along the second direction, so that the second plane cutter 220 slices the sample.

In the embodiment shown in fig. 1, 2 and 4, the support 240 is disposed on the machine 100, the support 240 is used for mounting a second driving member, the second driving member may be a hydraulic push rod, a pneumatic push rod or an electric push rod capable of outputting telescopic power, the second plane cutter 220 is in transmission connection with the second driving member, and when the second driving member is started, the second plane cutter 220 is driven to move along a second direction, so as to slice a to-be-sampled piece after a slicing column operation.

It should be noted that the slicing operation herein may be understood as cutting a position corresponding to a columnar structure formed on the to-be-sampled member after the slicing operation, so that the columnar structure can be separated from the to-be-sampled member.

In one embodiment, referring to fig. 1 to 4, the first direction and the second direction are perpendicular to each other, and the cutting tool of the second plane cutting tool 220 is disposed in a wedge-shaped plane.

As shown in fig. 1, a sample to be sampled is fixed on the fixing mechanism 300, the first circular cutter 210 is driven by the first driving member and the second driving member to move towards the sample to be sampled on the right side, and an annular groove with a certain depth is scribed on the sample to be sampled, so that a cylindrical structure is formed on the sample to be sampled (the material of the sample to be sampled still exists on the periphery of the cylindrical structure and is not cut away), then the second planar cutter 220 moves from the upper side to the lower side, and cuts the region of the sample to be sampled corresponding to the cylindrical structure, and after cutting, the cylindrical structure is separated from the sample to be sampled (meanwhile, the part of the sample to be sampled on the periphery of the cylindrical structure is cut away as well), so as to obtain a sample.

In the embodiment shown in fig. 1, the side of the second flat cutter 220 is arranged in a wedge-shaped plane, and the arrangement in the wedge-shaped plane causes the second flat cutter 220 to have an inclined surface facing away from the fixing mechanism 300, so that after the second flat cutter 220 is cut, the cut sample and the part to be sampled which is cut along with the cut sample are both moved to the left, and at this time, the sample box 500 may be arranged at the left side, so that the sample enters the sample box 500.

In one embodiment, referring to fig. 1 to 4, the fixing mechanism 300 includes a base 310, a supporting plate 320, a pressing plate 330 and a first adjusting rod 340, the base 310 is disposed on the machine platform 100, the supporting plate 320 is fixedly connected to the base 310, the pressing plate 330 is fixed to one end of the first adjusting rod 340, and the first adjusting rod 340 is telescopically engaged with the base 310, so that the pressing plate 330 moves toward the supporting plate 320, and the pressing plate 330 and the supporting plate 320 form a clamping portion for fixing the to-be-sampled member.

In the embodiment shown in fig. 1, the supporting plate 320 is fixed to the left side of the base 310, the first adjusting lever 340 is telescopically engaged with the base 310, and when the first adjusting lever 340 moves to the left side, the pressing plate 330 is pushed to move towards the supporting plate 320, so that a clamping portion is formed between the pressing plate 330 and the supporting plate 320, and the member to be sampled is fixed to the base 310.

In one embodiment, referring to fig. 1 to 4, the fixing mechanism 300 further includes a fixing plate 350, the fixing plate 350 and the supporting plate 320 are respectively fixed on two opposite sides of the base 310, the first adjusting rod 340 is provided with a first threaded portion, and the first adjusting rod 340 is screwed with the fixing plate 350 through the first threaded portion.

In the embodiment shown in fig. 1, the supporting plate 320 and the fixing plate 350 are respectively fixed on the left and right sides of the base 310, the first adjusting lever 340 is screwed with the fixing plate 350, when the first adjusting lever 340 rotates, the first adjusting lever 340 can move left and right, and when moving towards the left side of the first adjusting lever 340 towards the left side, the pressing plate 330 arranged at the left end of the first adjusting lever 340 is driven to move towards the supporting plate 320, so that the pressing plate 330 and the supporting plate 320 cooperate to form a clamping portion.

In one embodiment, referring to fig. 4, a first adjusting handle is disposed at the other end of the first adjusting lever 340, and the first adjusting handle facilitates the operator to rotate the first adjusting lever 340.

In one embodiment, referring to fig. 1 and 6, the supporting plate 320 is fixed on one side of the base 310 on the first circular cutter 210, and the supporting plate 320 is provided with a notch 321, so that the first circular cutter 210 performs a column cutting operation on the to-be-sampled workpiece.

In the embodiment shown in fig. 1, the support plate 320 is fixed to the left side of the base 310, and the left side of the support plate 320 is a side corresponding to the first circular cutter 210. The support plate 320 is provided at the middle thereof with a recess 321 such that the support plate 320 is formed in a concave structure as shown in fig. 6.

The supporting plate 320 has a concave structure (having a notch 321), on one hand, it is convenient to pass the first circular cutter 210 on the left side to perform a column cutting operation on a sample to be sampled, and on the other hand, after the second plane cutter 220 performs a slicing operation (sectioning), the cut-off sample and the like can fall toward the left side, and thus can fall into the sample box 500 further disposed on the left side.

So configured, the notch 321 on the one hand enables the first driving member to pass through and perform a column cutting operation on the to-be-sampled member, and on the other hand, also provides a support for the to-be-sampled member.

In one embodiment, referring to fig. 1 to 4, the base 310 is slidably engaged with the machine 100, the wafer sample manufacturing apparatus further includes a distance adjustment mechanism, the distance adjustment mechanism includes a second adjustment rod 410, one end of the second adjustment rod 410 is connected to the base 310, the second adjustment rod 410 is further telescopically engaged with the machine 100, and the second adjustment rod 410 telescopically moves and drives the base 310 to move along the first direction.

After the sample to be sampled is fixed by the fixing mechanism 300, the position of the sample to be sampled may be adjusted by the second adjusting lever 410 to correspond to the positions of the first circular cutter 210 and the second plane cutter 220.

Specifically, after the sample to be sampled is fixed on the fixing mechanism 300, the second adjusting rod 410 adjusts the base 310 to move the base 310 along the first direction, the sample to be sampled knife moves towards the first circular cutter 210, and finally the left end of the sample to be sampled and the position of the second plane cutter 220 are set as required, and after the first circular cutter 210 cuts the column, the second plane cutter 220 directly moves downwards to cut, and the sampling operation can be completed.

In one embodiment, the second adjusting rod 410 is a screw rod, the screw rod is screwed with the base, and when the second adjusting rod 410 rotates, the second adjusting rod 410 moves along the first direction, so that the base 310 moves in the first direction, the position of the base 310 is adjusted, and thus the position of the whole fixing mechanism 300 is moved, and finally the position of the sample to be sampled (sample strip) is adjusted.

Further, as shown in fig. 1 to 4, the other end of the second adjustment lever 410 is provided with a second adjustment handle, so that an operator can perform a rotation operation on the second adjustment lever 410.

In one embodiment, the distance adjusting mechanism further comprises a measuring component, which is disposed on the machine 100 and is used for measuring the moving position of the base 310.

Further, the measuring assembly includes a micrometer, the micrometer can be fixed on the base platform and corresponds to the position of the base 310, when the second adjusting rod 410 adjusts the base 310, the displacement of the base 310 can be reflected by the micrometer, so as to provide the basis for the operator to adjust.

Furthermore, the micrometer is a digital micrometer, and the resolution of the micrometer is 0.001 mm.

In one embodiment, referring to fig. 4, the disc sample manufacturing apparatus further includes a sample box 500, the sample box 500 is located between the support plate 320 and the first circular cutter 210, and the sample box 500 is detachably fixed on the support plate 320 and is used for receiving a sample.

In the embodiment shown in fig. 4, a sample box 500 is further provided between the first circular cutter 210 and the support plate 320 so as to collect a sample after a slicing operation; the sample cartridge 500 is removably secured to facilitate removal of the sample.

Sample box 500 is equipped with the notch that corresponds with notch 321 of backup pad 320, and the cell body position that the notch corresponds is equipped with the inclined plane that corresponds with second wedge portion 322 to realize the seamless butt joint of sample box 500 and backup pad 320, make the sample after the cutting drop into sample box 500 smoothly, no longer describe repeatedly.

This disk sample making devices, sampling operation is simple, and the thickness accessible second of sample is adjusted pole 410 and is independently adjusted, satisfies the sample demand of different thickness.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A wafer sample manufacturing apparatus, comprising:

a machine platform;

2. The device for manufacturing a wafer sample as claimed in claim 1, wherein the cutting mechanism further comprises a first driving member, the first driving member is disposed on the machine platform and can drive the first circular cutter to move along the first direction, so as to perform a column cutting operation on the to-be-sampled member.

3. The device for manufacturing the disc sample as claimed in claim 2, wherein the first circular cutter comprises a first cutter bar and a first blade, one end of the first cutter bar is in transmission connection with the first driving member, and the first blade is arranged at the other end of the first cutter bar.

4. The device for manufacturing a disc sample according to claim 2, wherein the cutting mechanism further comprises a protective cover fixed on the machine table, and the first driving member is fixed on the machine table and located in the protective cover.

5. The device for manufacturing the disc sample as claimed in claim 2, wherein the cutting mechanism further comprises a bracket and a second driving member, the bracket is fixed on the machine table, the second driving member is fixed on the bracket, the second driving member is in transmission connection with the second plane cutter, and the second driving member can drive the second plane cutter to move along the second direction, so that the second plane cutter performs slicing operation on the to-be-sampled piece.

6. The device for manufacturing a disc sample according to claim 5, wherein the cutter of the second flat cutter is provided in a wedge-shaped plane shape.

7. The wafer sample preparation device according to any one of claims 1 to 6, wherein the fixing mechanism comprises a base, a support plate, a pressing plate and a first adjusting rod, the base is arranged on the machine platform, the support plate is fixedly connected with the base, the pressing plate is fixed at one end of the first adjusting rod, and the first adjusting rod is telescopically matched with the base so as to enable the pressing plate to move towards the support plate and enable the pressing plate and the support plate to form a clamping part for fixing the to-be-sampled member.

8. The wafer sample preparation device as claimed in claim 7, wherein the fixing mechanism further comprises a fixing plate, the fixing plate and the supporting plate are respectively fixed on two opposite sides of the base, the first adjusting rod is provided with a first threaded portion, and the first adjusting rod is in threaded connection with the fixing plate through the first threaded portion;

9. The wafer sample manufacturing device as claimed in claim 8, wherein the base is slidably engaged with the machine table, the wafer sample manufacturing device further comprises a distance adjusting mechanism, the distance adjusting mechanism comprises a second adjusting rod, one end of the second adjusting rod is connected with the base, the second adjusting rod is further telescopically engaged with the machine table, and the second adjusting rod telescopically moves and drives the base to move along the first direction;

10. The disc specimen preparation device as set forth in claim 8, further comprising a sample cartridge disposed between the support plate and the first circular cutter, the sample cartridge being detachably fixed to the support plate and adapted to receive a sample.