CN111981954B - Ultra-high precision micro-polishing depth scale and preparation process thereof - Google Patents
Ultra-high precision micro-polishing depth scale and preparation process thereof Download PDFInfo
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- CN111981954B CN111981954B CN202010826232.8A CN202010826232A CN111981954B CN 111981954 B CN111981954 B CN 111981954B CN 202010826232 A CN202010826232 A CN 202010826232A CN 111981954 B CN111981954 B CN 111981954B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/18—Measuring arrangements characterised by the use of mechanical techniques for measuring depth
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B3/00—Measuring instruments characterised by the use of mechanical techniques
- G01B3/02—Rulers with scales or marks for direct reading
- G01B3/04—Rulers with scales or marks for direct reading rigid
Abstract
The ultra-high precision microscopic grinding depth scale provided by the invention can be used for measuring the grinding depth of a microscopic sample and processing a thin plate with ultra-high double-sided parallelism. The measuring precision of the ultra-high precision micro-polishing depth scale can reach the nanometer level. The structure of the micro-grinding depth scale mainly comprises three parts: a scale plate; an upper baffle plate; and a lower baffle plate. The angle theta of the scale plate is an included angle between the inclined plane and the bottom surface of the scale, the cot theta is the amplification factor when the inclined plane is measured, and the amplification factor can be designed according to requirements. The inclined plane of the ultra-high precision micro-polishing depth scale is provided with a solid coating or a cladding so as to meet the requirement of ultra-high precision measurement. When more than three scale inclined planes are adopted for measurement, the measurement error caused by the inclined angle after polishing can be reduced, and the accurate polishing depth of any point on the surface of a sample after polishing can be measured.
Description
Technical Field
The invention relates to a microscopic detection technology of materials and the field of microscopic analysis of solid materials such as metallurgy, metal materials, non-metal materials, semiconductors and the like.
Background
When a metallographic sample is polished, particularly for a sample embedded with resin, the precise thickness of the polished sample cannot be known, so that it is difficult to determine the depth position below the surface of the microstructure such as a metallographic structure and a defect observed under a microscope.
The thickness difference before and after polishing is directly measured by methods such as a vernier caliper, a screw micrometer and the like, and the precision of the calculated polishing depth is limited. The patent of the utility model discloses a through the supplementary indirect measurement of steel ball grinding degree of depth, it calculates comparatively loaded down with trivial details, and the initial calculation precision of grinding the stage is great with the camber relation of steel ball, consequently, has higher requirement to the circularity of steel ball when small-size is measured. When the wear resistance of the measured material and the steel ball is inconsistent, the measurement precision is also influenced. In addition, there are methods of ion polishing, glow spectroscopy, etc. to obtain sample information at a specific depth, but such methods are costly and complicated to operate.
Disclosure of Invention
The invention aims to provide an ultrahigh-precision microscopic polishing depth scale and a manufacturing process thereof.
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
the utility model provides a micro-polishing degree of depth scale of ultrahigh precision which characterized in that: the measuring device comprises an upper baffle (1), a lower baffle (2), a scale plate (3) and an inclined plane plate (4), wherein the scale plate (3) is one or more, the scale plate is clamped between the upper baffle (1) and the lower baffle (2), one or more inclined planes are arranged on the scale plate (3), the roughness of the inclined planes is reduced, the measuring precision is improved, the inclined planes are smooth mirror surfaces, and the roughness of the inclined planes is lower than 0.1 mu m; the smooth inclined plane is provided with a micro mark, the angle theta of the inclined plane is the included angle between the inclined plane and the bottom surface of the scale, and the cot theta is the magnification factor when the inclined plane is measured; if cot θ = 10, the magnification is 10 times. The upper baffle (1) and the lower baffle (2) are mainly used for shielding the embedding material and protecting the scale plate (3).
The inclined plane of the scale plate (3) is provided with a solid coating or a plating layer, and the surface roughness of the smooth inclined plane of the scale plate before coating is lower than 0.1 mu m; the solid coating or plating layer is used for protecting the inclined plane from being damaged during storage, transportation and use; the coating or the plating layer is used for eliminating arcs at the intersection of the bottom and the smooth inclined plane during grinding and polishing, so that the measurement precision is improved; the coating or plating provides a reference point for the indicia during the measurement.
The main manufacturing process flow of the ultra-high precision micro-polishing depth scale is as follows: providing raw materials → processing a scale plate, an upper baffle and a lower baffle → polishing a bevel → coating and plating a bevel → processing a mark → assembling → polishing a bottom surface → packaging.
The structural member of the ultra-high precision micro-polishing depth scale is made of metal, plastic, glass or other materials. The wear rate of the material is consistent with the type of the detected material or is close to the wear rate of the detected material, so that the detection precision is improved. If the ultra-high precision micro-polishing depth scale for detecting the steel material is stainless steel.
The surface roughness of the bottom surface of the scale plate (3), namely the side of the scale plate with the inclined surface, is lower than 1.8 mu m, and the reduction of the roughness of the side is favorable for improving the measurement precision.
And adjusting the size of the theta to obtain the micro-polishing depth scales with different magnification factors.
The size of the ultra-high precision micro-grinding depth scale is selected to be convenient for embedding, sample preparation, polishing and measurement; for a metallographic sample with the diameter of 30mm, the bottom surface of the scale is 20mm long; the scale plate, the upper baffle (1) and the lower baffle (2) are sheets with the thickness of 1 mm; the height of the scale is 5 mm.
The upper baffle (1) and the lower baffle (2) can be provided with sample clamping, vertical feet and other auxiliary structures. The upper baffle and the lower baffle do not change the metering function of the scale plate, namely the scale plate without the upper baffle (1) and the lower baffle (2) can be independently used for detecting the polishing depth.
When more than three scale plate inclined planes are adopted for measurement, the error caused by the inclination angle after polishing is reduced, and the accurate polishing depth of any point on the surface of the sample after polishing is measured.
The thickness of the solid coating or plating layer on the inclined surface of the scale plate (3) and the wear rate of the coating or plating layer material meet the requirement of eliminating arc transition caused by grinding of the smooth inclined surface and the bottom surface of the scale plate, so that the arc transition migrates to the coating or plating layer.
The process flow sequence can be adjusted to adapt to batch production, such as: providing raw materials → bevel polishing → bevel coating → marking process → processing scale plate, upper baffle and lower baffle → assembling → bottom surface polishing → packaging.
After metallographic phase grinding and polishing, the method directly and simply reads data of the ultra-high precision microscopic grinding depth scale through equipment such as a microscope, a scanning electron microscope and the like, so as to obtain the ground depth of the tested sample. Under strict process conditions, the multi-scale combined measurement is realized, and the measurement precision of the ultra-high precision micro-polishing depth scale can reach the nanometer level. The ultra-high precision micro-polishing depth scale overcomes the difficulty that the polishing depth of the existing metallographic phase can not be directly read, breaks through the precision limitation of the existing detection technology, can be widely applied to the analysis field of metal, nonmetal and semiconductor materials, and even can be used for ultra-high precision part processing. The invention can provide the micro-polishing depth scale with different precision requirements and different magnification factors, and has low application cost and simple and convenient operation.
Drawings
FIG. 1 is a schematic view of a scale plate mounting structure of the present invention.
FIG. 2 is a side view of the scale plate of the present invention.
Fig. 3 is a top view of fig. 2.
Fig. 4 is a sectional view taken along the line a in fig. 2.
FIG. 5 is an angle labeled view of the scale plate.
Fig. 6 is a schematic view of the sanding depth calculation.
Fig. 7 is a schematic view of a scale with a clamping function.
FIG. 8 is a schematic diagram of the calculation of the polishing depth at any point measured by three scale plates.
Fig. 9 shows three scales measuring the sanding depth at any point.
FIG. 10 is a chart of an experiment without a plating scale.
FIG. 11 is a chart of an experiment with a plating scale.
FIG. 12 is a graph of measurement results/. mu.m.
Detailed Description
The invention will be further described with reference to the accompanying drawings, in which preferred embodiments of the invention are: the invention provides an ultra-high precision micro-polishing depth scale which mainly comprises three parts: a scale plate; an upper baffle plate; and a lower baffle plate. Wherein:
(1) and (4) combining modes.
The scale plate, the upper baffle plate and the lower baffle plate can be combined together in a metal welding, riveting, gluing or clamping mode and the like.
(2) A scale board.
The scale plate is clamped between the upper baffle and the lower baffle and is a core component of the micro-polishing depth scale.
The scale plate presents one or more discontinuous slopes. When there is only one bevel, the measurement of the sanding depth is limited to this single bevel. When the scale plate is provided with a plurality of inclined planes, a certain inclined plane can be conveniently found under a microscopic view field for measurement. The average polishing depth can be obtained by measuring data of a plurality of inclined planes, and the measurement precision is improved.
Whether the sample is uniformly polished can be evaluated by detecting the results of the plurality of inclined planes. Under the condition that the sample polishing depth is not uniform, the inclination angle between the sample polishing front surface and the sample polishing rear surface can be calculated by measuring more than three scale plate inclined planes, so that the polishing depth of any position of the sample after polishing can be measured.
An ultra-high precision micro-sanding depth scale at least comprises a scale plate. When the sample is embedded, a plurality of scale plates without guard plates or a plurality of micro-grinding depth scales with guard plates can be used for replacing the multi-bevel measurement requirement.
And the angle theta is the angle between the inclined plane and the bottom surface of the scale, and the cot theta is the magnification factor. As shown in fig. 2 and 3, when cot θ = 10, the magnification is 10 times. Therefore, by adjusting the size of the theta, micro-sanding depth scales with different magnifications and precisions can be obtained.
There are two ways to obtain the sanding depth: firstly, the absolute value of the numerical difference of the micro-scale before and after polishing is directly read to obtain the polishing depth of the sample, if the absolute value of the numerical difference is divided by the magnification factor, the absolute value of the numerical difference is divided by the magnification factor to obtain the polishing depth, and the precision mainly depends on the self-precision of the scale, the precision and the processing condition of the scale, the deformation of the scale material inlaying and the like. Secondly, the measurement is carried out by a ruler of a microscope, and the absolute value Delta of the reduction of the projection length of the inclined plane at the bottom due to grinding is firstly measuredL，△LDividing by the magnification cot theta to obtain the thickness delta of the ruler removed by polishinghWhen the surface of the sample to be measured and the bottom surface of the scale are in the same plane before and after polishing, deltahCan be regarded as the testedThe difference in depth before and after sample polishing, and therefore this method requires the microscope scale to have sufficient measurement accuracy.
As shown in FIG. 6, when the measured plane of the microscope scale ST and BC is parallel, the projection BC of the inclined plane of the microscope grinding depth scale AB on the bottom surface is equal to the length of the microscope scale EF, and the coating thickness on the inclined plane is not related. The optical microscope with the camera can adopt the depth of field fusion technology to shoot pictures, and conveniently measure the L0And L1Length of, through L0Minus L1The BC length is calculated. The marking point O is selected such that the marking is not destroyed after grinding. Therefore, even if the point O is not on the smooth slope BP or the plating layer, the measurement of BC length is not affected.
When the inclined plane of the scale plate is not coated or plated, the inclined plane is provided with a micro mark for measuring and calculating the polishing depth. The measurement precision can be improved by reducing the roughness of the inclined plane, and for a general metallographic sample, the inclined plane is a smooth mirror surface before the mark is added, and the roughness of the inclined plane is lower than 0.1 mu m. For samples with higher requirements on measurement accuracy, the roughness of the bevel should be reduced as much as possible, e.g. less than 0.01 μm. In addition, the marking mode of the inclined plane is proper, and when the marking is adopted, the depth of the scribed line is uniform, and is not too deep, so that the position of the measuring end point at the top end of the inclined plane can be conveniently selected.
For a sample with lower measurement precision requirement, an inclined surface scale with larger angle theta can be selected, if the angle theta is 45 degrees, the thickness result is directly read, and the inclination is not required to be divided by a magnification factor, and the roughness of the inclined surface can not be strictly required.
For samples with higher measurement precision requirements, an ultrahigh precision micro-polishing depth scale with a solid coating or a plating layer on the inclined surface of a scale plate can be selected. As shown in fig. 6, the inclined plane on which the ABP is located is a smooth inclined plane, and reducing the surface roughness of the smooth inclined plane of the scale plate before coating is beneficial to improving the measurement precision of the scale plate, generally, the surface roughness of the inclined plane of the scale plate before coating should be lower than 0.1 μm. The solid coating or plating on the bevel of the scale plate serves to protect the bevel from damage during storage, transportation, and use. After the ruler without the coating or the cladding is polished, arc transition often occurs at the intersection of the inclined plane where the AB is located and the bottom surface where the BC is located, so that a measuring point is not convenient to select, and measuring accuracy is affected. The scale with the solid coating or plating on the smooth slope at AB eliminates the arc that would appear at the intersection of the bottom and the smooth slope during burnishing and polishing, which would appear on the coating or plating, as shown by curve OQB. At the moment, the selected measuring points can be the point A and the point B of the intersection line of the coating or the plating layer and the smooth inclined plane instead of fuzzy areas between the point Q and the point B and between the point R and the point A, and the measuring accuracy is improved by the ruler with the coating or the plating layer; the coating or plating may provide a reference mark, such as a ruler, for the measurement. In order to improve the measurement accuracy, the measurement should be performed by means of the scale of the microscope, rather than directly reading the data of the scale plate for calculation, and the scale of the microscope should have sufficient accuracy.
(3) And an upper baffle plate. The upper baffle is mainly used for shielding the embedding material and protecting the scale plate. When the scale plate without the baffle is inlaid, the inlaid material can fill the inclined plane, so that the inclined plane cannot select a reference point in measurement. After the baffle is added, the bottom of the scale plate is downward attached to the sample preparation platform, and the inlaid material cannot enter the inclined plane space.
The baffle can prevent the inclined plane from being collided and scratched in the transportation, storage and use processes, and has a protection effect.
The baffle can add the foot of centre gripping sample function, or add the supporting legs that are used for making the scale board perpendicular to system appearance platform. As shown in fig. 7, the baffle is bent into a clip having the functions of holding the sample and vertically supporting. The gripping structure may be designed in other shapes, not limited to fig. 7, such as a freely extensible roll wound into a roll. But the plane of the bottom surface of the clamping arm is perpendicular to the scale plate, so that the scale plate can be perpendicular to the sample preparation platform when freely placed on the sample preparation platform, and the function of a vertical foot is achieved. The final purpose is to ensure that the included angle between the inclined plane and the sample preparation platform meets the design requirements. Otherwise, the included angle between the inclined plane and the sample preparation platform may be reduced or increased, and the measurement accuracy is affected.
(4) And a lower baffle plate. The function is the same as that of the upper baffle. The upper baffle and the lower baffle do not change the metering function of the scale plate, namely the scale plate without the upper baffle and the lower baffle can be independently used for detecting the polishing depth.
To explain the measurement principle of the present invention, it is first assumed that the measured point and the scale bottom surface before and after grinding are in the same plane. The following is a description in two ways.
(1) The sample surfaces before and after grinding were assumed to be parallel to each other. As shown in fig. 4, an included angle between the inclined plane and the bottom edge is ═ θ, AU, BC and OD are parallel to each other, and the microscope scale ST is parallel to BC, AC ×, BC, OG × ST, BE ×) ST. Then:
namely:
and AC is the grinding depth delta h of the sample. It can be seen that the length of the AC is independent of the coating thickness in the calculation.
(2) It is assumed that the planes before and after sanding are not parallel. And a plurality of scale plates are adopted for cooperative detection during measurement, and the polishing thickness at any position is determined. As shown in fig. 6, a schematic diagram of measuring the polishing depth of any point for 3 scale plates is shown, and the number of the scale plates is further increased to obtain an average value, so that the accuracy can be improved. The following description will be given by taking 3 scale plates as an example. During measurement, the uppermost marked point of the microscope view field is marked as A, the lower left marked point is marked as C, the right marked point is marked as B, and the points A, B, C form an acute triangle. The measured point H is located within Δ ABC.
Firstly, calculating the polishing depth of each scale. And setting the polished plane A 'B' C 'to be unparallel to the polished plane ABC, wherein the points A', B 'and C' are respectively mark points at the junction of the inclined plane and the bottom surface of each ruler plate after polishing. AA ', BB', CC 'and HH' are all perpendicular to plane ABC.
The polishing depth of each scale was determined by the method (1) above, and each was AA' = z1, BB′=z2And CC' = z3。
Second, the distance between the points is measured. The distances projected by the polished points a ', B', C 'and the measured point H' on the bottom surface of the scale are measured directly by using a microscope without conversion, and are AB = C, AC = B, BC = a, AH = d, BH = e, and CH = f, respectively.
And thirdly, solving the coordinates of each point. Let point A be the origin, point C lie above the x-axis, and the y-axis lies within plane ABC.
The coordinates of the A' point are then (0, 0, z)1) And the coordinates of the point C' are (b, 0, z)3）。
Respectively calculating the distance y from the point B and the point H to the x axis by adopting a Helen-Qin Jiu Shao formula2，y4Namely:
then, the x-axis coordinate value x of the point B, H is respectively calculated according to the Pythagorean theorem2，x4The following are:
thus, the coordinates of point B' can be determined as:
the coordinates of point H' are:
where z is an unknown number.
And fourthly, solving an equation of the plane A ' B ' C '.
And step five, substituting the coordinates of H' to solve the z.
z is the polishing depth delta h of any point of the tested sample. If A 'B' C 'forms a right-angled triangle, the angle B' A 'C' is a right angle. Or a ' B ' C ' constitutes an approximate right triangle, then:
the sanding depth calculation formula can be simplified as follows:
if H is outside Δ ABC or point A, B, C forms an obtuse triangle, then the sign of the coordinate values should be considered.
The structural material type of the ultra-high precision micro-polishing depth scale can be metal, plastic, glass or other materials. The material can have enough dimensional stability when being embedded, and particularly, in hot embedding, structural glue, a coating or plating layer on a slope, a structural material and the like can not be greatly deformed or melted. When the scale plate and the baffle are consistent with the type of the detected material or are close to the wear rate of the detected material, the detection precision is improved. If compare in the sample of being surveyed, the material of micro-polishing depth scale is too wear-resisting or not wear-resisting, all can lead to measuring great deviation because scale and sample wear rate are inconsistent, consequently to measuring the required height of precision, should select for use the micro-polishing depth scale of suitable material preparation. For example, the ultra-high precision micro-polishing depth scale for detecting steel materials is made of stainless steel, but cannot be made of plastic, glass and the like.
Similarly, the bevel coating or plating material, thickness should be appropriate. When the coating or the plating layer is obviously lower than the micro-polishing depth scale, the arc transition length can be influenced, so that the transition arc can be extended to a smooth inclined plane; when the coating or plating is significantly higher than the micro-sanding depth scale, the height of the intersection of the bevel and the bottom surface is affected. When the mark is on the surface of the coating, the thickness of the coating or the coating is not too thick, and the mark on the coating is not polished and removed. When the mark is in the coating or plating layer, such as the mark line and the mark surface are perpendicular to the bottom surface, the mark is consumed as the coating or plating layer material is consumed during grinding and polishing, but the position of the mark exposed after grinding and polishing can be kept unchanged relative to the inclined surface, so that the coating material can fill the cavity in which the inclined surface is located, and the position of the coating or plating layer in which the mark is located can be consumed during grinding and polishing.
The bottom surface of the depth scale, namely the side of the scale plate with the inclined plane, is polished in a microscopic mode with ultrahigh precision, the surface roughness of the bottom surface is lower than 1.8 mu m, and the reduction of the side roughness is beneficial to improvement of the measurement precision. Too much roughness of the bottom surface may cause blurring of the intersection line of the slope and the bottom surface, resulting in difficulty in selecting an initial reference point. The ultra-high precision micro-grinding depth scale can cause certain loss to the bottom surface in the storage and transportation process, the bottom surface of the ultra-high precision micro-grinding depth scale can be checked or preliminarily polished before sample inlaying, and the force is kept small and even when manual polishing is carried out.
The size of the ultra-high precision micro-grinding depth scale is selected to facilitate sample inlaying, sample preparation, polishing and measurement. For example, for a metallographic sample with a diameter of 30mm, the bottom surface of the ruler is 20mm long; the scale plate, the upper baffle and the lower baffle are 1mm thin sheets; the height of the scale is 5 mm. As shown in fig. 2, a micro-grinding depth scale designed at 10 times magnification can be used for general metallographic specimen mounting.
The ultra-high precision micro-polishing depth scale belongs to a precision measuring tool, and needs to pay attention to environmental conditions and sample preparation conditions in storage, transportation and use. The air humidity should be low to prevent corrosion. The storage temperature is controlled according to the characteristics of the scale material, and cold inlaying is recommended for samples with higher precision requirements. Protective measures are required to be taken in the transportation process so as to prevent collision, scratch and the like. The prepared sample is not suitable for beating. In addition, when a sample is corroded by the corrosive agent, attention needs to be paid to identifying whether the material of the ultra-high precision micro-polishing depth scale is easy to corrode, particularly after a coating material is damaged, circular arc transition possibly occurs at the junction of a polished smooth inclined plane and a ground surface again, and measuring precision is affected.
The invention provides a manufacturing process of the following ultra-high precision micro-polishing depth scale, wherein the first manufacturing process flow scheme is as follows:
(1) materials for manufacturing the scale plate, the upper apron and the lower apron are provided. Such as steel, with a thickness of 1 mm.
(2) And preparing a scale plate, an upper baffle and a lower baffle. The processing method comprises milling, laser cutting, plasma cutting, linear cutting and the like.
(3) And grinding and polishing the inclined plane of the scale plate. The method comprises the following steps of (1) carrying out primary grinding by using fine sand paper, wherein the sand paper used for the last grinding is higher than 1200 meshes; polishing by using carborundum with the particle size less than 3 mu m; and finally, finely polishing to a mirror surface until the roughness of the inclined surface is less than 0.1 mu m.
(4) And coating the inclined surface of the scale plate. The method comprises the following steps: coating high-temperature-resistant thermoplastic (resistant to temperature of more than 170 ℃), and baking and forming. The method 2 comprises the following steps: and (4) electroplating a metal coating. The slope coating of the scale plate and the post-treatment of the coating or the plating layer are selected processes, and the slope coating treatment can be omitted according to the measurement with low precision requirement.
(5) And removing the redundant coating or plating of the scale plate.
(6) And (4) slope identification processing and baffle identification processing.
(7) And (6) assembling. The method comprises the following steps: high temperature resistant glue (temperature resistant more than 170 ℃) is adopted for bonding. The method 2 comprises the following steps: metal filling or resistance welding.
(8) And polishing the bottom surface of the scale.
(9) And (6) fine processing and packaging.
In order to adapt to mass production, the invention provides the following manufacturing process of the ultra-high precision micro-polishing depth scale, and the second manufacturing process flow scheme is as follows:
(1) a flat strip for manufacturing a scale plate, an upper apron and a lower apron is provided. Such as stainless steel strip, with a thickness of 1 mm.
(2) And grinding and polishing the inclined plane of the scale plate. The method comprises the following steps of (1) carrying out primary grinding by using fine sand paper, wherein the sand paper used for the last grinding is higher than 1200 meshes; polishing by using carborundum with the particle size less than 3 mu m; and finally, finely polishing to a mirror surface until the roughness of the inclined surface is less than 0.1 mu m.
(3) And coating the inclined surface of the scale plate. The method comprises the following steps: and (3) coating high-temperature-resistant glue (resistant to temperature of more than 170 ℃). The method 2 comprises the following steps: and (4) electroplating a metal coating. The slope coating of the scale plate and the post-treatment of the coating or the plating layer are selected processes, and the slope coating treatment can be omitted according to the measurement with low precision requirement.
(4) And removing the redundant coating or plating of the scale plate.
(5) And (4) slope identification processing and baffle identification processing.
(6) And preparing a scale plate, an upper baffle and a lower baffle. The processing method comprises milling, laser cutting, plasma cutting, linear cutting and the like.
(7) And (6) assembling. The method comprises the following steps: high temperature resistant glue (temperature resistant more than 170 ℃) is adopted for bonding. The method 2 comprises the following steps: metal filling or resistance welding.
(8) And polishing the bottom surface of the scale.
(9) And (6) fine processing and packaging.
The manufacturing process of the second scheme is that the grinding and polishing process is arranged before the scale plate, the upper baffle and the lower baffle are processed, so that the batch polishing and coating process is adapted. Due to the limitation of the processing technology, in the assembly of the part (7), a closed baffle needs to be added at the end part of the inclined surface of the scale plate, and the baffle and the scale plate are positioned on the same plane but are not part of the scale plate. The main purpose is to make all baffles, inclined planes and sample preparation platforms enclose a closed space all the time, and prevent the embedding materials from entering the space and influencing the marking.
The micro-polishing depth scale with general measurement accuracy requirements does not need to be subjected to inclined surface coating treatment, and the assembling mode can be clamping, gluing and the like. The coating treatment and the assembling mode of the inclined surface are not limited to the above modes, but the design precision requirement of the scale needs to be met.
For convenience of manufacture, the process sequence of coating, polishing and the like can be changed, such as:
(1) providing raw materials → processing a scale plate, an upper baffle and a lower baffle → polishing a bevel → coating and plating a bevel → processing a mark → assembling → polishing a bottom surface → packaging.
(2) Providing raw materials → processing the scale plate, the upper baffle and the lower baffle → polishing the inclined plane → assembling → coating → marking processing → polishing the bottom surface → packaging.
(3) Providing raw materials → bevel polishing → bevel coating → marking process → processing scale plate, upper baffle and lower baffle → assembling → bottom surface polishing → packaging.
The application of the micro-polishing depth scale without a coating on the inclined surface.
The method has the general precision requirement, and detects the internal defects of the steel materials, such as massive oxides and cracks.
Firstly, experimental materials: non-plating scale experiment (see FIG. 10)
Second, the experimental procedure
1. A mosaic sample was prepared. And intercepting the defect sample of the hot-rolled steel plate, downwards arranging the defect surface of the hot-rolled steel plate and the bottom surface of the micro-polishing depth scale, and placing the hot-rolled steel plate into an embedding platform for embedding.
2. The first measurement. Placing the prepared sample under a microscope, and measuring the inclined plane and the bottom surface vertex of the micro-polishing depth scale plate toDistance of any reference point a on the slope. And is recorded as L0And measuring L0=500μm。
3. And (6) grinding and polishing. And grinding and polishing the prepared sample by using sand paper and polishing paper.
4. And (6) measuring for the second time. And (3) placing the polished sample under a microscope, observing the defects, and measuring the distances from the inclined plane and the bottom surface vertex of the micro-grinding depth scale plate to a reference point A on the inclined plane. And is recorded as L1Measured L1=303μm。
5. And calculating the grinding depth. The sanding depth of the sample was about:
application of ultra-high precision micro-polishing depth scale with coating on inclined surface
(1) Experimental materials: the test with a coated scale (see FIG. 11);
(2) experimental procedure
1. A mosaic sample was prepared. And wire cutting or high-precision sample preparation is carried out, so that the bending deformation of the sample is prevented.
2. And (3) placing the defect surface of the sample and the bottom surfaces of the 3 ultrahigh-precision micro-polishing depth scales downwards into an embedding platform for embedding. The sample preparation platform before sample embedding is kept to be a clean, flat and smooth plane. The scale 1 and the scale 3 are in the same straight line position, and the scale 2 is perpendicular to the scale 1, and the vertex of the inclined plane of the scale 1 is ensured to be positioned on the straight line of the scale 2. As shown in fig. 9.
3. The first measurement. The prepared sample is placed under a scanning electron microscope, the distances from the intersection line of the inclined plane and the bottom surface of the 3 ultrahigh-precision micro-polishing depth scales to any reference point on the inclined plane are measured respectively, and the distances are recorded in a table 3.
4. And (5) grinding and polishing for the second time. The prepared sample was finely polished.
5. And (6) measuring for the second time. And (5) placing the polished sample under a scanning electron microscope to observe defects. Measuring the distance: respectively measuring the distance from the intersection line of the inclined plane and the bottom surface of the 3 ultrahigh-precision micro-polishing depth scales to any reference point on the inclined plane, and recording the distance in a table 3; and measuring the distance from the measured point H' to the intersection line of the inclined plane and the bottom surface of the scale 1 and the scale 3, and recording the distance in the table 3. Measuring the distance between the intersection lines of the inclined plane and the bottom surface of the scale 1, the scale 2 and the scale 3, and recording the distance in the table 3.
Measurement results/. mu.m (see FIG. 12)
Note: h 'is located within the triangle A' B 'C', the sign of each parameter is positive, and e can be detected without.
And calculating the grinding depth. The visual scale 1 and the scale 2 are perpendicular to each other and are calculated by a simplified calculation formula. The sanding depth of the sample was about:
the calculated sanding depth z was then 6.64 μm.
Manufacturing an ultrahigh-precision micro-polishing depth scale:
1. low-alloy high-strength steel is selected as a material, and the thickness is 1 mm.
2. And preparing a scale plate, an upper baffle and a lower baffle by linear cutting.
3. Polishing the inclined surface: adopting 1500-mesh sand paper for primary grinding; polishing by using carborundum of 1 mu m; fine polishing to a mirror surface, and the roughness of the inclined surface is less than 0.01 mu m.
4. And electroplating a zinc layer on the inclined surface of the scale plate.
5. And (4) slope identification processing and baffle identification processing.
6. And (3) coating high-temperature-resistant glue (resistant to temperature of more than 170 ℃) on the scale plate, the upper baffle and the lower baffle, and fixing the scale plate, the upper baffle and the lower baffle.
7. And polishing the bottom surface of the scale after cooling.
8. And (6) fine processing and packaging.
Claims (8)
1. The utility model provides a micro-polishing degree of depth scale of ultrahigh precision which characterized in that: the ruler comprises an upper baffle (1), a lower baffle (2) and a ruler plate (3), wherein the ruler plate (3) is one or more, the ruler plate is clamped between the upper baffle (1) and the lower baffle (2), one or more inclined planes are arranged on the ruler plate (3), the inclined planes are smooth mirror surfaces, and the roughness of the inclined planes is lower than 0.1 mu m; the smooth inclined plane is provided with a micro mark, the angle theta of the inclined plane is the included angle between the inclined plane and the bottom surface of the scale, and the cot theta is the magnification factor when the inclined plane is measured; the upper baffle (1) and the lower baffle (2) are used for protecting the scale plate (3);
the inclined plane of the scale plate (3) is provided with a solid coating or a plating layer, and the surface roughness of the smooth inclined plane of the scale plate before coating is lower than 0.1 mu m; the solid coating or plating layer is used for protecting the inclined plane from being damaged during storage, transportation and use; the coating or the plating layer is used for eliminating arcs at the intersection of the bottom and the smooth inclined plane during grinding and polishing, so that the measurement precision is improved; providing a marked reference point for measurement on the coating or plating;
the main manufacturing process flow of the ultra-high precision micro-polishing depth scale is as follows: providing raw materials → processing a scale plate, an upper baffle and a lower baffle → polishing a bevel → coating and plating a bevel → processing a mark → assembling → polishing a bottom surface → packaging.
2. The ultra-high precision micro-sanding depth scale of claim 1, wherein: the parts of the ultra-high precision micro-polishing depth scale are made of metal, plastic or glass, and the types of the materials are consistent with the types of the detected materials or are close to the wear rate of the detected materials, so that the detection precision is improved.
3. The ultra-high precision micro-sanding depth scale of claim 1, wherein: the surface roughness of the bottom surface of the scale plate (3), namely the side of the scale plate with the inclined surface, is lower than 1.8 mu m, and the reduction of the roughness of the side is favorable for improving the measurement precision.
4. The ultra-high precision micro-sanding depth scale of claim 1, wherein: and adjusting the size of the theta to obtain the micro-polishing depth scales with different magnification factors.
5. The ultra-high precision micro-sanding depth scale of claim 1, wherein: the size of the ultra-high precision micro-grinding depth scale is selected to be convenient for embedding, sample preparation, polishing and measurement; for a metallographic sample with the diameter of 30mm, the bottom surface of the scale is 20mm long; the scale plate, the upper baffle (1) and the lower baffle (2) are sheets with the thickness of 1 mm; the height of the scale is 5 mm.
6. The ultra-high precision micro-sanding depth scale of claim 1, wherein: the upper baffle (1) and the lower baffle (2) are provided with sample clamping and vertical feet.
7. The ultra-high precision micro-sanding depth scale of claim 1, wherein: when more than three scale plate inclined planes are adopted for measurement, the error caused by the inclination angle after polishing is reduced, and the accurate polishing depth of any point on the surface of the sample after polishing is measured.
8. The ultra-high precision micro-sanding depth scale of claim 1, wherein: the thickness of the solid coating or plating layer on the inclined surface of the scale plate (3) and the wear rate of the coating or plating layer material meet the requirement of eliminating arc transition caused by grinding of the smooth inclined surface and the bottom surface of the scale plate, so that the arc transition migrates to the coating or plating layer.
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