CN111978539B - Polyimide film for OLED flexible substrate and preparation method thereof - Google Patents
Polyimide film for OLED flexible substrate and preparation method thereof Download PDFInfo
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- CN111978539B CN111978539B CN202010742947.5A CN202010742947A CN111978539B CN 111978539 B CN111978539 B CN 111978539B CN 202010742947 A CN202010742947 A CN 202010742947A CN 111978539 B CN111978539 B CN 111978539B
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- 229920001721 polyimide Polymers 0.000 title claims abstract description 54
- 239000000758 substrate Substances 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 230000009477 glass transition Effects 0.000 claims abstract description 7
- 239000000178 monomer Substances 0.000 claims description 37
- 150000004985 diamines Chemical class 0.000 claims description 24
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 11
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 11
- 125000003368 amide group Chemical group 0.000 claims description 11
- 125000003785 benzimidazolyl group Chemical group N1=C(NC2=C1C=CC=C2)* 0.000 claims description 11
- QCILMAMLEHOLRX-UHFFFAOYSA-N 2-(3-aminophenyl)-3h-benzimidazol-5-amine Chemical compound NC1=CC=CC(C=2NC3=CC(N)=CC=C3N=2)=C1 QCILMAMLEHOLRX-UHFFFAOYSA-N 0.000 claims description 9
- 229920005575 poly(amic acid) Polymers 0.000 claims description 8
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 8
- 238000006068 polycondensation reaction Methods 0.000 claims description 7
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 239000003960 organic solvent Substances 0.000 claims description 5
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- XAFOTXWPFVZQAZ-UHFFFAOYSA-N 2-(4-aminophenyl)-3h-benzimidazol-5-amine Chemical compound C1=CC(N)=CC=C1C1=NC2=CC=C(N)C=C2N1 XAFOTXWPFVZQAZ-UHFFFAOYSA-N 0.000 claims description 3
- WOSVXXBNNCUXMT-UHFFFAOYSA-N cyclopentane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)C1C(O)=O WOSVXXBNNCUXMT-UHFFFAOYSA-N 0.000 claims description 3
- 230000035484 reaction time Effects 0.000 claims description 3
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 claims description 2
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 claims description 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 2
- 239000011261 inert gas Substances 0.000 claims description 2
- LJMPOXUWPWEILS-UHFFFAOYSA-N 3a,4,4a,7a,8,8a-hexahydrofuro[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1C2C(=O)OC(=O)C2CC2C(=O)OC(=O)C21 LJMPOXUWPWEILS-UHFFFAOYSA-N 0.000 claims 1
- XPAQFJJCWGSXGJ-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1 XPAQFJJCWGSXGJ-UHFFFAOYSA-N 0.000 claims 1
- 150000008064 anhydrides Chemical class 0.000 claims 1
- 238000011056 performance test Methods 0.000 description 11
- YDYSEBSNAKCEQU-UHFFFAOYSA-N 2,3-diamino-n-phenylbenzamide Chemical group NC1=CC=CC(C(=O)NC=2C=CC=CC=2)=C1N YDYSEBSNAKCEQU-UHFFFAOYSA-N 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 238000001035 drying Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- LFBALUPVVFCEPA-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C(C(O)=O)=C1 LFBALUPVVFCEPA-UHFFFAOYSA-N 0.000 description 1
- CQMIJLIXKMKFQW-UHFFFAOYSA-N 4-phenylbenzene-1,2,3,5-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C(O)=O)=C1C1=CC=CC=C1 CQMIJLIXKMKFQW-UHFFFAOYSA-N 0.000 description 1
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 description 1
- ZPAKUZKMGJJMAA-UHFFFAOYSA-N Cyclohexane-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)CC1C(O)=O ZPAKUZKMGJJMAA-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- CURBACXRQKTCKZ-UHFFFAOYSA-N cyclobutane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1C(C(O)=O)C(C(O)=O)C1C(O)=O CURBACXRQKTCKZ-UHFFFAOYSA-N 0.000 description 1
- -1 hexafluoroisopropylidene Chemical group 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1085—Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
The invention provides a polyimide film for an OLED flexible substrate and a preparation method thereof, wherein the glass transition temperature of the polyimide film is more than 400 ℃, and the linear thermal expansion coefficient is less than 15 ppm/K.
Description
Technical Field
The invention relates to the technical field of optical materials, in particular to a polyimide film for an OLED flexible substrate and a preparation method thereof.
Background
The polyimide film for the OLED flexible substrate is required to have excellent high-temperature resistance, strong dimensional stability, high modulus and thermal expansion coefficient smaller than or equal to that of an inorganic quartz glass material. However, the polyimide material at the present stage is difficult to achieve the combination of higher glass transition temperature and lower linear expansion coefficient, and the application of the polyimide material in the OLED flexible substrate is limited.
Disclosure of Invention
Based on the technical problems in the prior art, the invention provides a polyimide film for an OLED flexible substrate and a preparation method thereof, wherein the polyimide film has a glass transition temperature of more than 400 ℃ and a linear thermal expansion coefficient of less than 15 ppm/K.
The polyimide film for the OLED flexible substrate comprises diamine monomers and tetracarboxylic dianhydride monomers, wherein the diamine monomers at least comprise a diamine monomer containing a benzimidazole group structure and a diamine monomer containing an amide group structure.
Preferably, the molar ratio of the diamine monomer containing the benzimidazole group structure to the diamine monomer containing the amide group structure is 2-4: 1.
Preferably, the tetracarboxylic dianhydride monomer is 4, 4' - (hexafluoroisopropylidene) diphthalic anhydride
4, 4' -oxydiphthalic anhydride
3, 3', 4, 4' -biphenyltetracarboxylic acid dianhydride
1, 2, 3, 4-cyclobutanetetracarboxylic dianhydride
1, 2, 4, 5-cyclopentanetetracarboxylic dianhydride
1, 2, 4, 5-Cyclohexanetetracarboxylic dianhydride
One or a combination of more of the same.
Preferably, the diamine monomer containing the benzimidazole group structure is 2- (3-aminophenyl) -5-aminobenzimidazole
Or 2- (4-aminophenyl) -5-aminobenzimidazole
Preferably, the diamine monomer containing an amide group structure is diaminobenzanilide
Preferably, the polyimide film has a glass transition temperature of 400 ℃ or higher and a linear thermal expansion coefficient of 15ppm/K or lower.
The invention also provides a preparation method of the polyimide film for the OLED flexible substrate, which comprises the following steps:
s1, dissolving a diamine monomer containing a benzimidazole group and a diamine monomer containing an amide group in an organic solvent, and adding a tetracarboxylic dianhydride monomer to perform polycondensation reaction to obtain a polyamic acid solution;
and S2, coating the polyamic acid solution obtained in the step S1 with a film, and carrying out imidization reaction to obtain the polyimide film.
Preferably, in step S1, the polycondensation reaction is performed under the protection of inert gas, the temperature of the polycondensation reaction is 0-25 ℃, the reaction time is 5-10h, and the organic solvent is one or a combination of N-methylpyrrolidone, dimethyl sulfoxide, N-dimethylformamide or N, N-dimethylacetamide.
Preferably, in step S2, the imidization reaction temperature is 80-400 ℃ and the time is 3-10 h.
In the invention, a diamine monomer containing a benzimidazole group and a diamine monomer containing an amido group react with a tetracarboxylic dianhydride monomer to obtain the polyimide film. The benzimidazole group and amide group structures contained in the polyimide film can provide a plurality of hydrogen bond binding sites, so that a large amount of hydrogen bond actions are formed in the polyimide film or among molecules, regular arrangement and compact accumulation of polymer chains are realized, and the polyimide film with high heat resistance and low thermal expansion coefficient can be obtained.
The action process of hydrogen bonds in the polyimide film is shown as follows:
Detailed Description
Hereinafter, the technical solution of the present invention will be described in detail by specific examples, but these examples should be explicitly proposed for illustration, but should not be construed as limiting the scope of the present invention.
Example 1
A preparation method of a polyimide film for an OLED flexible substrate comprises the following steps:
s1, pouring 40mmol of 3, 3', 4, 4' -biphenyltetracarboxylic dianhydride into a N, N-dimethylacetamide solution dissolved with 30mmol of 2- (3-aminophenyl) -5-aminobenzimidazole and 10mmol of diaminobenzanilide under the protection of nitrogen, and stirring for reacting for 8 hours at room temperature to obtain a polyamic acid solution with the solid content of 10 wt%;
s2, coating the obtained polyamic acid solution on a glass plate, placing the glass plate in a drying box, heating to 80 ℃, drying for 1h, heating to 200 ℃, drying for 2h, taking out the glass plate after the temperature is reduced to 25 ℃, transferring the glass plate to a tube furnace, heating to 150 ℃, heating for 1h, heating to 350 ℃, heating for 1.5h, heating to 400 ℃, heating for 0.5h, cooling to 25 ℃, taking out, placing in water for demoulding, then placing the film in a drying box at 100 ℃ for drying and removing water to obtain the polyimide film, and controlling the thickness of the polyimide film to be 50 mu m.
The results of the performance test on the polyimide film are shown in table 1.
Example 2
A polyimide film for an OLED flexible substrate, which was prepared in the same manner as in example 1, except that in step S1, 40mmol of 4, 4' - (hexafluoroisopropylidene) diphthalic anhydride monomer was poured into a solution of 30mmol of 2- (3-aminophenyl) -5-aminobenzimidazole and 10mmol of diaminobenzanilide in N, N-dimethylacetamide, and the results of the performance test on the polyimide film thus obtained were also shown in Table 1.
Example 3
A polyimide film for an OLED flexible substrate, which was prepared in the same manner as in example 1, except that 40mmol of 4, 4' -oxydiphthalic anhydride monomer was poured into a solution of 30mmol of 2- (3-aminophenyl) -5-aminobenzimidazole and 10mmol of diaminobenzanilide dissolved in N, N-dimethylacetamide in step S1, and the results of the performance test on the polyimide film thus obtained were also shown in table 1.
Example 4
A polyimide film for an OLED flexible substrate, which was prepared in the same manner as in example 1, except that 40mmol of 1, 2, 3, 4-cyclobutanetetracarboxylic dianhydride monomer was poured into a solution of 30mmol of 2- (3-aminophenyl) -5-aminobenzimidazole and 10mmol of diaminobenzanilide in N, N-dimethylacetamide dissolved in step S1, and the results of the performance test on the polyimide film thus obtained were also shown in table 1.
Example 5
A polyimide film for an OLED flexible substrate, which was prepared in the same manner as in example 1, except that in step S1, 40mmol of 1, 2, 4, 5-cyclopentanetetracarboxylic dianhydride monomer was poured into a solution of 30mmol of 2- (3-aminophenyl) -5-aminobenzimidazole and 10mmol of diaminobenzanilide in N, N-dimethylacetamide, and the results of the performance test on the polyimide film thus obtained were also shown in Table 1.
Example 6
A polyimide film for an OLED flexible substrate, which was prepared in the same manner as in example 1, except that 40mmol of 4, 4' -biphenyltetracarboxylic dianhydride monomer was poured into a solution of 30mmol of 2- (4-aminophenyl) -5-aminobenzimidazole and 10mmol of diaminobenzanilide dissolved in N, N-dimethylacetamide in step S1, and the results of the performance test on the polyimide film thus obtained were also shown in table 1.
Comparative example 1
A polyimide film was prepared in the same manner as in example 1, except that 40mmol of 3, 3', 4, 4' -biphenyltetracarboxylic dianhydride was poured into a solution of 30mmol of p-phenylenediamine and 10mmol of 2, 2 '-bis (trifluoromethyl) -4, 4' -diaminobis-N, N-dimethylacetamide dissolved therein in step S1, and the results of the performance test on the polyimide film thus obtained were also shown in table 1.
Comparative example 2
A polyimide film was prepared in the same manner as in example 1, except that 40mmol of 3, 3', 4, 4' -biphenyltetracarboxylic dianhydride was poured into a solution of 40mmol of 2- (3-aminophenyl) -5-aminobenzimidazole in N, N-dimethylacetamide dissolved therein in step S1, and the results of the performance test on the polyimide film thus obtained were also shown in table 1.
Comparative example 3
A polyimide film was produced in the same manner as in example 1, except that 40mmol of 3, 3', 4, 4' -biphenyltetracarboxylic dianhydride was poured into a solution of diaminobenzanilide dissolved in 40mmol of N, N-dimethylacetamide in step S1, and the results of the performance test on the polyimide film thus obtained were also shown in table 1.
Comparative example 4
A polyimide film was produced in the same manner as in example 1, except that in step S1, 40mmol of 3, 3', 4, 4' -biphenyltetracarboxylic dianhydride was poured into a solution of 10mmol of 2- (3-aminophenyl) -5-aminobenzimidazole and 30mmol of diaminobenzanilide in N, N-dimethylacetamide, and the results of the performance test on the polyimide film thus obtained were also shown in table 1.
The polyimide films obtained in examples 1 to 6 and comparative examples 1 to 4 were subjected to the performance tests shown in the following methods, and the results are shown in Table 1.
Coefficient of linear thermal expansion: a thermal mechanical analyzer was used to apply a 50mN load under a nitrogen atmosphere, and the temperature was measured at a temperature rise rate of 10 ℃/min to obtain an average value.
Glass transition temperature: DSC measurement was performed at a temperature rise rate of 10 ℃/min under a nitrogen atmosphere using a differential scanning calorimeter, and the glass transition temperature was determined.
Mechanical properties: measured by a universal material tester according to GB/T1040.3-2006.
TABLE 1 test results of polyimide films obtained in examples 1 to 6 and comparative examples 1 to 3
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. The polyimide film for the OLED flexible substrate is characterized in that the polyimide film is prepared from diamine monomers and tetracarboxylic dianhydride monomers, wherein the diamine monomers at least comprise a diamine monomer containing a benzimidazole group and a diamine monomer containing an amido group;
the diamine monomer containing benzimidazole group is 2- (3-aminophenyl) -5-aminobenzimidazole or 2- (4-aminophenyl) -5-aminobenzimidazole, and the diamine monomer containing amide group is 4, 4' -diaminobenzanilide;
the molar ratio of the diamine monomer containing the benzimidazole group to the diamine monomer containing the amide group is 2-4: 1;
the method for preparing the polyimide film for the OLED flexible substrate comprises the following steps:
s1, dissolving a diamine monomer containing a benzimidazole group and a diamine monomer containing an amide group in an organic solvent, and adding a tetracarboxylic dianhydride monomer to perform a polycondensation reaction to obtain a polyamic acid solution;
and S2, coating the polyamic acid solution obtained in the step S1 with a film, and carrying out imidization reaction to obtain the polyimide film.
2. The polyimide film for an OLED flexible substrate according to claim 1, wherein the tetracarboxylic dianhydride monomer is one or more selected from the group consisting of 3, 3', 4, 4' -biphenyltetracarboxylic dianhydride, 4, 4'- (hexafluoroisopropylene) diphthalic anhydride, 4, 4' -oxydiphthalic anhydride, 1, 2, 3, 4-cyclobutanetetracarboxylic dianhydride, 1, 2, 4, 5-cyclopentanetetracarboxylic dianhydride, and 1, 2, 4, 5-cyclohexanetetracarboxylic dianhydride.
3. The polyimide film for the OLED flexible substrate according to claim 1 or 2, wherein the polyimide film has a glass transition temperature of 400 ℃ or higher and a linear thermal expansion coefficient of 15ppm/K or lower.
4. The preparation method of the polyimide film for the OLED flexible substrate according to claim 1 or 2, comprising the following steps:
s1, dissolving a diamine monomer containing a benzimidazole group and a diamine monomer containing an amide group in an organic solvent, and adding a tetracarboxylic dianhydride monomer to perform a polycondensation reaction to obtain a polyamic acid solution;
and S2, coating the polyamic acid solution obtained in the step S1 with a film, and carrying out imidization reaction to obtain the polyimide film.
5. The method for preparing the polyimide film for the OLED flexible substrate according to claim 4, wherein in the step S1, the polycondensation reaction is performed under the protection of inert gas, the temperature of the polycondensation reaction is 0-25 ℃, the reaction time is 5-10h, and the organic solvent is one or more of N-methylpyrrolidone, dimethyl sulfoxide, N-dimethylformamide or N, N-dimethylacetamide.
6. The method for preparing a polyimide film for an OLED flexible substrate according to claim 4 or 5, wherein the imidization reaction temperature is 80-400 ℃ and the imidization reaction time is 3-10h in step S2.
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| CN202010742947.5A CN111978539B (en) | 2020-07-29 | 2020-07-29 | Polyimide film for OLED flexible substrate and preparation method thereof |
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| CN111978539B true CN111978539B (en) | 2022-08-12 |
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