CN111977608A - Driving-adhesion integrated composite structure and preparation method thereof - Google Patents
Driving-adhesion integrated composite structure and preparation method thereof Download PDFInfo
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- CN111977608A CN111977608A CN202010903326.0A CN202010903326A CN111977608A CN 111977608 A CN111977608 A CN 111977608A CN 202010903326 A CN202010903326 A CN 202010903326A CN 111977608 A CN111977608 A CN 111977608A
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- 239000002131 composite material Substances 0.000 title claims abstract description 35
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 10
- 230000008569 process Effects 0.000 claims abstract description 10
- 229920000831 ionic polymer Polymers 0.000 claims abstract description 7
- 239000002905 metal composite material Substances 0.000 claims abstract description 7
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 12
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 12
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 9
- 239000002390 adhesive tape Substances 0.000 claims description 9
- 210000004379 membrane Anatomy 0.000 claims description 9
- 239000012528 membrane Substances 0.000 claims description 9
- -1 polydimethylsiloxane Polymers 0.000 claims description 9
- 229920002379 silicone rubber Polymers 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000005266 casting Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 239000003522 acrylic cement Substances 0.000 claims description 4
- 210000002469 basement membrane Anatomy 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000004945 silicone rubber Substances 0.000 claims description 4
- 238000004528 spin coating Methods 0.000 claims description 4
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 3
- 229920000557 Nafion® Polymers 0.000 claims description 3
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 3
- XKUTVNLXHINPAP-UHFFFAOYSA-N azane platinum Chemical compound N.[Pt] XKUTVNLXHINPAP-UHFFFAOYSA-N 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 claims description 3
- 238000006722 reduction reaction Methods 0.000 claims description 3
- 238000007788 roughening Methods 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- 229920001651 Cyanoacrylate Polymers 0.000 claims description 2
- 239000004830 Super Glue Substances 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 239000003638 chemical reducing agent Substances 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 238000012545 processing Methods 0.000 claims description 2
- 238000003795 desorption Methods 0.000 abstract description 12
- 238000013461 design Methods 0.000 abstract description 4
- 230000009471 action Effects 0.000 abstract description 3
- ISRUGXGCCGIOQO-UHFFFAOYSA-N Rhoden Chemical compound CNC(=O)OC1=CC=CC=C1OC(C)C ISRUGXGCCGIOQO-UHFFFAOYSA-N 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005411 Van der Waals force Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- UQSQSQZYBQSBJZ-UHFFFAOYSA-N fluorosulfonic acid Chemical compound OS(F)(=O)=O UQSQSQZYBQSBJZ-UHFFFAOYSA-N 0.000 description 1
- 239000003014 ion exchange membrane Substances 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
- B81B1/006—Microdevices formed as a single homogeneous piece, i.e. wherein the mechanical function is obtained by the use of the device, e.g. cutters
- B81B1/008—Microtips
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00111—Tips, pillars, i.e. raised structures
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00206—Processes for functionalising a surface, e.g. provide the surface with specific mechanical, chemical or biological properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00214—Processes for the simultaneaous manufacturing of a network or an array of similar microstructural devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/092—Forming composite materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/098—Forming organic materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
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- Computer Hardware Design (AREA)
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Abstract
The invention discloses a driving-adhesion integrated composite structure and a preparation method thereof, wherein the driving-adhesion integrated composite structure comprises an electric driving structure and a dry adhesion structure; the electric driving structure is made of an ionic polymer metal composite material and can be deformed under the driving of voltage; the dry adhesion structure is an array consisting of a plurality of wedge-shaped structures; the dry adhesion structure is adhered to one end of the electric drive structure. The characteristic that the IPMC can deform under the control of voltage is utilized to connect a dry adhesion structure, so that the controllable adhesion and desorption of the adhesion material under the driving action are realized. The design of the wedge-shaped array structure reduces the force requirement in the desorption process and realizes the organic unification of driving and controllable adhesion.
Description
Technical Field
The invention relates to the field of functional materials, in particular to a driving-adhesion integrated composite structure and a preparation method thereof.
Background
Compared with wet adhesion, vacuum adsorption, magnetic adsorption, electrostatic adsorption and other technologies, the dry adhesion technology has the characteristics of strong adaptability to the appearance of a target surface, no damage and pollution caused by contact, no influence of a vacuum environment and the like, and in addition, the dry adhesion technology can be repeatedly used because the adhesion effect is generated by Van der Waals force. At present, researchers widely apply the dry adhesion technology to the foot end design of the wall-climbing robot, the pick-up and transportation in a vacuum environment, the medical diagnosis by attaching to the skin of a human body, and the like. In the application process of the dry adhesion material, how to realize controllable adhesion and desorption on a target surface is an important aspect of dry adhesion research. The isotropic vertical array structure researched by researchers at home and abroad shows isotropic adhesive strength, and controllable desorption cannot be realized; anisotropic structures with tilted arrays enable controlled desorption, but require a mechanical structure to exert a guiding force that deforms the tilted array in the direction of increasing adhesion.
Disclosure of Invention
The invention aims to solve the technical problem of how to realize controllable desorption by dry adhesion, and provides a driving-adhesion integrated composite structure and a preparation method.
In order to achieve the above object, the present invention provides a driving-adhesion integrated composite structure, including an electric driving structure and a dry adhesion structure; the electric driving structure is made of an ionic polymer metal composite material and can be deformed under the driving of voltage; the dry adhesion structure is an array consisting of a plurality of wedge-shaped structures; the dry adhesion structure is adhered to one end of the electric drive structure.
Preferably, the wedge-shaped structures are uniformly arranged.
Preferably, the wedge-shaped structures are of micron-scale.
Preferably, the dry-adhered structure is made of polydimethylsiloxane material.
Preferably, the dry adhesion structure is adhered to one end of the electric driving structure by a double-sided adhesive tape.
Preferably, one side of the double-sided adhesive tape is acrylic adhesive and is connected with the electric driving structure; the other side is special silicon rubber which is connected with the dry adhesion structure.
The invention also provides a preparation method of the driving-adhesion integrated composite structure, which comprises the following steps:
step 1, preparing an electric driving structure;
and 3, connecting the electric driving structure prepared in the step 1 with the dry adhesion structure prepared in the step 2 to prepare the driving-adhesion integrated composite structure.
Preferably, step 1 comprises:
step 1.1, mixing a Nafion solution and N, N-dimethylformamide according to a volume ratio of 4:1 to obtain a membrane casting solution, preparing a base membrane by adopting a solution casting method, and roughening the surface of the base membrane;
step 1.2, soaking the roughened basement membrane in platinum ammonia solution for more than 12 hours;
and step 1.3, plating metal Pt electrodes on two sides of the base film by adopting a chemical reduction plating method to obtain the electric drive structure.
Preferably, step 2 comprises:
step 2.1, processing by adopting a photoetching process to obtain an array reverse structure die consisting of the wedge-shaped structures;
step 2.2, coating a layer of micrometer-sized polydimethylsiloxane in thickness on the reverse structure die by adopting a spin coating method;
and 2.3, curing and demolding the polydimethylsiloxane coated in the step 2.2 to obtain the dry adhesion structure.
Preferably, step 3 comprises:
step 3.1, connecting one side of the dry adhesion structure prepared in the step 2 to the double-sided silicone rubber;
step 3.2, coating acrylic glue on the other side of the silicon rubber double-sided adhesive tape in the step 3.1;
and 3.3, connecting the dry adhesion structure coated with the super glue prepared in the step 3.2 to one end of the electric drive structure prepared in the step 1 to obtain the drive-adhesion integrated composite structure.
The beneficial effects of the invention include:
(1) the characteristic that the IPMC can deform under the control of voltage is utilized to connect the dry adhesion material, so that the controllable adhesion and desorption of the adhesion material under the driving action are realized.
(2) The design of the wedge-shaped array structure reduces the force requirement in the desorption process and realizes the organic unification of driving and controllable adhesion.
Drawings
Fig. 1 is a schematic view of a driving-adhesion integrated composite structure according to the present invention.
FIG. 2 is a schematic diagram of a dry adhesion structure with micro-scale slanted arrays according to the present invention.
Fig. 3 is a schematic diagram of the electrical drive configuration of the present invention.
FIG. 4-1 is a schematic diagram of the inverse structure of the micron-scale slanted array prepared by the present invention.
FIG. 4-2 is a schematic view of spin coating a PDMS layer on an inverse structure according to the present invention.
FIG. 4-3 is a schematic view of PDMS array obtained after curing and demolding.
Fig. 5-1 is a schematic view of the driving-adhesion integrated composite structure of the present invention when no driving voltage is applied.
Fig. 5-2 is a schematic diagram of the deformation of the driving-adhesion integrated composite structure of the present invention when the driving-adhesion integrated composite structure is driven by a dc voltage to adhere to a target surface.
Fig. 5-3 are schematic deformation diagrams of the driving-adhering integrated composite structure of the present invention for desorbing the target surface under the driving of the reverse dc voltage.
Description of the drawings: 1-electric drive structure, 2-dry adhesion structure, 3-double faced adhesive tape, 4-base film, 5-Pt electrode, 6-inverse structure mold, 7-electrode plate and 8-target surface.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An Ionic Polymer Metal Composite (IPMC) is an Ionic electroactive driving material, a noble metal electrode is deposited on the surface of an ion exchange membrane (used as a basement membrane), and deformation and bending are generated by voltage driving. Therefore, the invention combines the dry adhesion material and the ionic polymer metal composite material, and the prepared driving-adhesion integrated composite structure can overcome the defect of the anisotropic structure with the inclined array and has wide application prospect.
As shown in fig. 1, the present invention provides a drive-adhesion integrated composite structure including an electrically driven structure 1 and a dry adhesion structure 2. The electric driving structure 1 is made of an ionic polymer metal composite material, namely IPMC, and the material can generate displacement deformation under the control of voltage. The dry adhesion structure 2 is made of Polydimethylsiloxane (PDMS), which has high adhesion and easy desorption characteristics and low surface energy. The dry adhesion structure 2 is connected to one end of the electric drive structure 1 through a double-sided adhesive tape 3. The two sides of the double-sided adhesive 3 are different in adhesive, and one side of the double-sided adhesive is acrylic adhesive and is connected with the electric driving structure 1; the other side is special silicon rubber which is connected with the dry adhesion structure 2 with low surface energy.
As shown in fig. 2, the dry adhesion structures 2 are an array formed by uniformly arranging wedge-shaped structures, and the wedge-shaped structures are in a micron-scale.
A method of making a drive-attach integrated composite structure, comprising:
step 1: the electrically driven structure 1 was prepared. Mixing Nafion (perfluorosulfonic acid) solution and N, N-dimethylformamide according to the volume ratio of 4:1 to obtain membrane casting solution, preparing a base membrane 4 by adopting a solution casting method, and roughening the surface of the base membrane 4 so as to better plate a metal platinum electrode; soaking the roughened basement membrane 4 in platinum ammonia solution for more than 12 hours; and plating Pt electrodes 5 on two sides of the base film by adopting an electroless reduction plating method to obtain the electrically driven structure 1 shown in figure 3.
Step 2: a dry adhesive structure 2 is prepared. As shown in fig. 4-1, a reverse structure mold 6 of an array composed of wedge-shaped structures is obtained by adopting a photoetching process; as shown in fig. 4-2, a micrometer-sized layer of polydimethylsiloxane is coated on the inverse structure mold 6 by a spin coating method; the coated polydimethylsiloxane was cured and demolded to yield the dry-adhered structure 2, as shown in fig. 4-3.
And step 3: preparing the driving-adhesion integrated composite structure. Connecting one side of the dry adhesion structure 2 prepared in the step 2 to the double-sided silicone rubber; the other side of the silicone rubber double faced adhesive tape is coated with acrylic adhesive tape and then connected to one end of the electric drive structure 1, so that the drive-adhesion integrated composite structure shown in fig. 1 can be obtained.
The use method of the driving-adhesion integrated composite structure prepared by the invention comprises the following steps: as shown in fig. 5-1, the end of the electrically driven structure 1 is clamped by the electrode sheet 7, and when the voltage is 0, the electrically driven structure 1 is not deformed, and the dry adhesion structure 2 has no adhesion to the target surface 8. As shown in fig. 5-2, when a direct current is applied, the electric driving structure 1 is driven by a voltage to deform and bend, so as to generate a driving force, and drive the dry adhesion structure 2 to contact the target surface 8, so that the contact manner between the wedge-shaped structure and the target surface is changed from the original point contact to the surface contact, thereby generating an adhesion effect and realizing controllable adhesion. As shown in fig. 5-3, when a reverse direct current is applied, the electric driving structure 1 is bent in the opposite direction to drive the dry adhesion structure 2 to peel off the target surface 8, the contact mode of the wedge-shaped structure and the target surface is changed from the original surface contact into point contact, and finally the target surface is peeled off, so that the controllable desorption is realized. This process is similar to the process of peeling off an adhesive tape, which is not easily removed in the normal direction when the tape is stuck flat on an object, but is easily removed by tearing in the tangential direction in the opposite direction.
In summary, the invention provides a driving-adhesion integrated composite structure and a preparation method thereof, the driving-adhesion integrated composite structure utilizes the characteristic that an IPMC (ionic polymer metal composite) can deform under the control of voltage to connect a dry adhesion structure, so that the controllable adhesion and desorption of an adhesion material under the driving action are realized, and meanwhile, the design of a wedge-shaped array structure reduces the force requirement of the desorption process, and the organic unification of driving and controllable adhesion is realized. The preparation method provided by the invention has the advantages of simple process, easy operation and wide application prospect.
While the present invention has been described in detail with reference to the preferred embodiments, it should be understood that the above description should not be taken as limiting the invention. Various modifications and alterations to this invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be determined from the following claims.
Claims (10)
1. A drive-adhesion integrated composite structure is characterized by comprising an electric drive structure and a dry adhesion structure; the electric driving structure is made of an ionic polymer metal composite material and can be deformed under the driving of voltage; the dry adhesion structure is an array consisting of a plurality of wedge-shaped structures; the dry adhesion structure is adhered to one end of the electric drive structure.
2. The drive-adhesion integrated composite structure of claim 1, wherein the wedge structures are uniformly arranged.
3. The driver-adhesive integrated composite structure of claim 1, wherein the wedge-shaped structures are micro-scale.
4. The integrated drive-adhesion composite structure of claim 1, wherein the dry adhesion structure is a polydimethylsiloxane material.
5. The drive-adhesion integrated composite structure of claim 1, wherein the dry adhesion structure is bonded to one end of the electrically driven structure by double sided adhesive.
6. The drive-adhere integrated composite structure of claim 5, wherein one side of the double-sided adhesive tape is acrylic adhesive, which is connected to the electric drive structure; the other side is special silicon rubber which is connected with the dry adhesion structure.
7. A method for preparing a driver-adhesive integrated composite structure according to claim 1, comprising:
step 1, preparing an electric driving structure;
step 2, preparing a dry adhesion structure;
and 3, connecting the electric driving structure prepared in the step 1 with the dry adhesion structure prepared in the step 2 to prepare the driving-adhesion integrated composite structure.
8. The method of manufacturing a drive-adhere integrated composite structure according to claim 7, wherein the step 1 comprises:
step 1.1, mixing a Nafion solution and N, N-dimethylformamide according to a volume ratio of 4:1 to obtain a membrane casting solution, preparing a base membrane by adopting a solution casting method, and roughening the surface of the base membrane;
step 1.2, soaking the roughened basement membrane in platinum ammonia solution for more than 12 hours;
and step 1.3, plating metal Pt electrodes on two sides of the base film by adopting a chemical reduction plating method to obtain the electric drive structure.
9. The method of manufacturing a drive-adhere integrated composite structure according to claim 7, wherein the step 2 comprises:
step 2.1, processing by adopting a photoetching process to obtain an array reverse structure die consisting of the wedge-shaped structures;
step 2.2, coating a layer of micrometer-sized polydimethylsiloxane in thickness on the reverse structure die by adopting a spin coating method;
and 2.3, curing and demolding the polydimethylsiloxane coated in the step 2.2 to obtain the dry adhesion structure.
10. The method of manufacturing a drive-adhere integrated composite structure according to claim 7, wherein the step 3 comprises:
step 3.1, connecting one side of the dry adhesion structure prepared in the step 2 to the double-sided silicone rubber;
step 3.2, coating acrylic glue on the other side of the silicon rubber double-sided adhesive tape in the step 3.1;
and 3.3, connecting the dry adhesion structure coated with the super glue prepared in the step 3.2 to one end of the electric drive structure prepared in the step 1 to obtain the drive-adhesion integrated composite structure.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112727876A (en) * | 2020-12-23 | 2021-04-30 | 南京航空航天大学 | Controllable-strength adhesion device and control method thereof |
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2020
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| CN106784295A (en) * | 2016-11-18 | 2017-05-31 | 南京航空航天大学 | A kind of multi-pore channel IPMC electro-active materials based on foam metal and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112727876A (en) * | 2020-12-23 | 2021-04-30 | 南京航空航天大学 | Controllable-strength adhesion device and control method thereof |
| CN112727876B (en) * | 2020-12-23 | 2022-03-11 | 南京航空航天大学 | Controllable-strength adhesion device and control method thereof |
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