CN111975604A - Mechanical polishing device for integrated circuit production - Google Patents
Mechanical polishing device for integrated circuit production Download PDFInfo
- Publication number
- CN111975604A CN111975604A CN202010822307.5A CN202010822307A CN111975604A CN 111975604 A CN111975604 A CN 111975604A CN 202010822307 A CN202010822307 A CN 202010822307A CN 111975604 A CN111975604 A CN 111975604A
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- Prior art keywords
- plate
- spring
- polishing
- block
- rod
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/007—Weight compensation; Temperature compensation; Vibration damping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
- F16F15/08—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with rubber springs ; with springs made of rubber and metal
Abstract
The invention discloses a mechanical polishing device for integrated circuit production, wherein both ends of the top surface of a workbench are provided with moving grooves, one end inside the moving grooves is provided with a moving electric push rod, one end of the moving electric push rod is provided with a moving block, two adjacent moving blocks are respectively arranged at both ends of the bottom surface of a moving plate through screws, one end of a limiting plate is welded at the position outside a driving rod, a moving spring is welded at one end of the limiting plate, one end of the moving spring is movably arranged at one end of a protective box, one end of the driving rod is arranged at one end of the moving plate, a clamping plate is arranged at the position of one end of the moving plate through screws, and one end of the clamping plate is bonded with a protective rubber plate. The integrated circuit board does not shake, and the polishing effect is indirectly improved.
Description
Technical Field
The invention relates to the technical field of integrated circuit production, in particular to a mechanical polishing device for integrated circuit production.
Background
The integrated circuit board is a carrier for loading the integrated circuit, but the integrated circuit board is also taken on, and the integrated circuit board is mainly made of resin, so the integrated circuit board is generally green, and is a vital part for polishing the integrated circuit board in the processing process of the integrated circuit board.
At present to integrated circuit board polishing in-process, after the staff finishes integrated circuit board one side polishing, need take off the back with integrated circuit board from the device, assemble again, to its another side polishing, not only can lead to polishing inefficiency like this, can make staff intensity of labour big simultaneously, dismantle integrated circuit and clamping process, also can cause the condition emergence of pressing from both sides the wound to the staff.
Disclosure of Invention
The invention provides a mechanical polishing device for integrated circuit production, which can effectively solve the problems that in the prior art, in the polishing process of an integrated circuit board in the market, after a worker polishes one surface of the integrated circuit board, the integrated circuit board needs to be taken off from the device, assembled and polished on the other surface, so that the polishing efficiency is low, the labor intensity of the worker is high, and the worker is injured by clamping in the process of disassembling and clamping the integrated circuit.
In order to achieve the purpose, the invention provides the following technical scheme: the polishing device comprises a polishing box body and a workbench arranged at the bottom end of the polishing box body, wherein a rotary clamping stabilizing assembly is arranged at the top end of the workbench, and comprises a moving groove, a movable electric push rod, a moving block, a moving plate, a protection box, a rotary motor, a rotating shaft, a driving gear, a semi-ring gear, a driving rod, a limiting plate, a moving spring, a clamping plate, a protection rubber plate, a sliding groove, a supporting spring, a sliding block and a supporting rod;
moving grooves are formed in two ends of the top surface of the workbench, a moving electric push rod is mounted at one end in each moving groove, a moving block is mounted at one end of each moving electric push rod, and two adjacent moving blocks are mounted at two ends of the bottom surface of each moving plate through screws respectively;
the protection box is mounted at each of two ends of the workbench through a screw, a rotating motor is fixedly mounted at one end of the protection box, a rotating shaft is fixedly connected to an output shaft of the rotating motor, driving gears are fixedly sleeved in the protection box at the outer sides of the two ends of the rotating shaft, the top end of each driving gear is meshed with a semi-ring gear, the middle of each semi-ring gear is movably sleeved on the outer side of each driving rod, a limiting plate is welded at one end of each driving rod, a moving spring is welded at the position, located at the outer side of each driving rod, of one end of each limiting plate, one end of each moving spring is movably mounted at one end of the protection box, a clamping plate is mounted at the position;
sliding grooves are formed in two ends of one side of the movable plate, supporting springs are welded on the bottom surfaces of the sliding grooves, sliding blocks are welded on the top surfaces of the supporting springs, located in the sliding grooves, and the two adjacent sliding blocks are mounted at two ends of one side of the supporting rod through screws respectively;
the input ends of the movable electric push rod and the rotating motor are electrically connected with the output end of an external power supply.
Compared with the prior art, the invention has the beneficial effects that: the invention has scientific and reasonable structure and safe and convenient use:
1. the cooperation through rotatory centre gripping stabilizing assembly is used, be convenient for carry out the centre gripping to integrated circuit board, in the centre gripping process, use through the removal spring, make movable plate and grip block remain attached state throughout, make the centre gripping more stable, guarantee in polishing process, integrated circuit board does not rock, the effect of polishing is improved to the indirectness, through the rotating electrical machines, the cooperation of drive gear and semi-ring gear is used, can be after integrated circuit board one side polishing, it is rotatory to integrated circuit board, can directly process the integrated circuit board another side, reduce staff's intensity of labour and improvement staff's factor of safety on the one hand, on the other hand, can improve the efficiency of polishing again, reduce the time of polishing, improve the productivity effect of enterprise.
2. Through the use of clearance cooling subassembly, after the polishing, can be timely to the clearance of polishing piece polished surface, improve the effect of polishing, make the feeling on integrated circuit board surface after the polishing better, play a radiating action to the polishing piece simultaneously, reduce the loss of polishing piece, prolong the life-span of polishing piece, avoid the frequent change polishing piece of staff, cooperation sealing rubber pole uses, can blow off the air of storing in the cooling tube inside in the twinkling of an eye through the louvre, be equivalent to the effect of a highly compressed air gun, make the effect of clearance and cooling better, and clear up at the polishing in-process, the staff of being convenient for observes, and can play the supporting role to the position outside of polishing, improve the effect of polishing, it is more stable when making to polish.
3. Through the use of the sealing feeding component, the integrated circuit board can be conveniently fed by workers without bending down to stretch into the polishing box body for placing, the labor intensity of the workers is reduced, the surface of the integrated circuit is cleaned in the feeding process, the influence of accumulated dust on polishing is avoided, the polishing quality is indirectly improved, meanwhile, after the feeding is finished, the polishing box body can be sealed, the sealing performance of the polishing box body is ensured, the problem that the dust splashes out in the polishing process to influence the workers and the surrounding environment is solved,
4. through the use of ejection of compact buffering subassembly, the integrated circuit board ejection of compact and the collection of being convenient for, need not the staff and collect integrated circuit board after taking out from the polishing box manually, reduce staff's intensity of labour and the efficiency that improves the collection, simultaneously through buffering rubber pole, buffer spring, the cooperation of rotating spring and reset block is used, can be in the collection process, there is a cushioning effect to integrated circuit board, can be so that integrated circuit board puts into the collection frame gradually, form guard action to integrated circuit board, avoid in the collection process, integrated circuit board appears the problem of damage.
5. Through the use of collecting the compression subassembly, can collect the dust in the polishing process, avoid the phenomenon that the dust splashes about to appear in the polishing process, cause the influence to the precision of polishing, simultaneously in the collection process for the dust is to the middle part gathering and compress the dust, reduces the occupation space of dust, reaches the mesh that need not to frequently clear up the dust, directly improves the utilization ratio in space.
In summary, the following steps: through the matched use of the sealed feeding assembly and the discharging buffer assembly, the feeding and discharging of the integrated circuit board are facilitated, the production efficiency is improved, the labor intensity of workers can be reduced, the safety factor of the workers can be improved, and meanwhile, the polishing box body can be sealed in the polishing process, so that the phenomenon that dust generated in the polishing process splashes is avoided;
through the cooperation use of clearance cooling subassembly and collection compression subassembly, be convenient for dispel the heat to polished wafer and integrated circuit board, can prolong the life-span of polished wafer again when making things convenient for the staff to collect integrated circuit board, can collect and compress the dust that the polishing produced again simultaneously in the polishing process, reduce the influence of the production dust of polishing process to surrounding environment.
Through clearance cooling subassembly and rotatory centre gripping stabilizing assembly for integrated circuit board when polishing is more stable, and is difficult for rocking, thereby makes the effect of polishing better, thereby improves the precision of polishing, makes more high-efficient, safety and the stability of polishing.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention.
In the drawings:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the cylinder mounting structure of the present invention;
FIG. 3 is a schematic view of the structure of the electric push rod of the present invention;
FIG. 4 is a schematic view of the table structure of the present invention;
FIG. 5 is a schematic view of the rotating clamp stabilizing assembly of the present invention;
FIG. 6 is a schematic view of the cleaning and cooling assembly of the present invention;
fig. 7 is a schematic view illustrating an installation structure of a radiating pipe according to the present invention;
FIG. 8 is a schematic structural view of a sealed feed assembly of the present invention;
FIG. 9 is a schematic view of the mounting structure of the fixing plate of the present invention;
FIG. 10 is a schematic view of the collection compression assembly of the present invention;
fig. 11 is a schematic view of a reset plate mounting structure of the present invention;
FIG. 12 is a schematic view of a collection tube configuration of the present invention;
FIG. 13 is a schematic view of a 15-tube suction structure according to the present invention;
reference numbers in the figures: 1. polishing the box body; 2. a cylinder; 3. mounting blocks; 4. driving the electric push rod; 5. polishing the motor; 6. mounting a plate; 7. polishing the sheet; 8. a work table; 9. a moving motor; 10. moving the screw rod;
11. rotating the clamping stabilizing assembly; 1101. a moving groove; 1102. moving the electric push rod; 1103. a moving block; 1104. moving the plate; 1105. a protection box; 1106. a rotating electric machine; 1107. a rotating shaft; 1108. driving the gear; 1109. a half-ring gear; 1110. driving the rod; 1111. a limiting plate; 1112. a movable spring; 1113. a clamping plate; 1114. a protective rubber sheet; 1115. a sliding groove; 1116. a support spring; 1117. a slider; 1118. a support bar;
12. cleaning the cooling assembly; 1201. a heat dissipation fan; 1202. a radiating pipe; 1203. heat dissipation holes; 1204. a rotating ring; 1205. a connecting frame; 1206. a sealing rubber rod; 1207. a connecting spring; 1208. a circular plate; 1209. pressing the column; 1210. a pressure lever; 1211. cleaning cloth; 1212. fixing the spring; 1213. a limiting plate; 1214. a T-shaped rod;
13. sealing the feed assembly; 1301. a protection plate; 1302. a feed port; 1303. moving the electric telescopic rod; 1304. a feeding plate; 1305. a driving groove; 1306. driving the block; 1307. a clamping rod; 1308. rotating the block; 1309. a rotating plate; 1310. a clamping plate; 1311. cleaning the spring; 1312. cleaning the plate;
14. a discharge buffer assembly; 1401. a discharge hole; 1402. a discharge plate; 1403. a driving spring; 1404. a fixing plate; 1405. a rotating plate; 1406. a return spring; 1407. a collection frame; 1408. an inclination angle; 1409. a buffer tank; 1410. a buffer spring; 1411. a slider; 1412. a reset plate; 1413. a rotating spring; 1414. a buffer rubber rod; 1415. a reset block;
15. collecting the compression assembly; 1501. a dust collection frame; 1502. an air suction fan; 1503. a collection pipe; 1504. installing a spring; 1505. compressing the block; 1506. a horizontal compression plate; 1507. a circular arc plate; 1508. ash falling holes; 1509. rotating the compression plate; 1510. compressing the groove.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Example (b): as shown in FIGS. 1-13, the invention provides a technical scheme, a mechanical polishing device for integrated circuit production, comprising a polishing box body 1, wherein one end of the top of the interior of the polishing box body 1 is provided with an air cylinder 2, one end of the air cylinder 2 is fixedly provided with an installation block 3, the bottom end of the installation block 3 is provided with a driving electric push rod 4, the bottom end of the driving electric push rod 4 is provided with a polishing motor 5, the output shaft of the polishing motor 5 is fixedly connected with an installation plate 6, the bottom end of the installation plate 6 is provided with a polishing sheet 7, the bottom surface of the interior of the polishing box body 1 is movably provided with a workbench 8, the bottom surface of the interior of the polishing box body 1 is fixedly provided with a moving motor 9 at one end of the workbench 8, the output shaft, the input ends of the polishing motor 5 and the moving motor 9 are electrically connected with the output end of an external power supply;
the top end of the workbench 8 is provided with a rotary clamping stabilizing component 11, and the rotary clamping stabilizing component 11 comprises a moving groove 1101, a movable electric push rod 1102, a moving block 1103, a moving plate 1104, a protection box 1105, a rotary motor 1106, a rotating shaft 1107, a driving gear 1108, a half-ring gear 1109, a driving rod 1110, a limiting plate 1111, a moving spring 1112, a clamping plate 1113, a protective rubber plate 1114, a sliding groove 1115, a supporting spring 1116, a sliding block 1117 and a supporting rod 1118;
both ends of the two sides of the top surface of the workbench 8 are provided with moving grooves 1101, one end inside the moving grooves 1101 is provided with a moving electric push rod 1102, one end of the moving electric push rod 1102 is provided with moving blocks 1103, and two adjacent moving blocks 1103 are respectively installed at both ends of the bottom surface of the moving plate 1104 through screws;
the two ends of the workbench 8 are both provided with a protection box 1105 through screws, one end of the protection box 1105 is fixedly provided with a rotating motor 1106, an output shaft of the rotating motor 1106 is fixedly connected with a rotating shaft 1107, the outer sides of the two ends of the rotating shaft 1107 are positioned in the protection box 1105 and are fixedly sleeved with a driving gear 1108, the top end of the driving gear 1108 is engaged with a semi-ring gear 1109, the middle part of the semi-ring gear 1109 is movably sleeved on the outer side of a driving rod 1110, one end of a moving plate 1104 is contacted with one end of a clamping plate 1113, one end of the rotating shaft 1107 is welded with a semi-circular plate, the position of the moving plate 1104 corresponding to the rotating shaft 1107 is provided with a corresponding hole, the diameter of the corresponding hole is larger than the sum of the radius of the rotating shaft 1107 and the semi-circular plate, one end of a moving spring 1112 is welded with a, a limiting plate 1111 is welded at one end of the driving rod 1110, a moving spring 1112 is welded at one end of the limiting plate 1111, which is located at the outer side of the driving rod 1110, one end of the moving spring 1112 is movably installed at one end of the protection box 1105, a clamping plate 1113 is installed at one end of the driving rod 1110, which is located at one end of the moving plate 1104, by a screw, and a protective rubber plate 1114 is bonded at one end of the clamping plate 1113;
the two ends of one side of the moving plate 1104 are both provided with sliding grooves 1115, the bottom surface inside the sliding grooves 1115 is welded with a support spring 1116, the top surface of the support spring 1116 is positioned inside the sliding grooves 1115 and is welded with a sliding block 1117, the top surface of the installation block 3 is provided with a T-shaped block through a screw, a T-shaped groove is formed in the position, corresponding to the T-shaped block, of the inner side portion of the polishing box body 1, the cross sections of the sliding grooves 1115 and the sliding block 1117 are both T-shaped, the inner diameter of the sliding grooves 1115 is larger than the outer diameter of the sliding block 1117, so that the polishing motor 5 can move more stably in the polishing process, the polishing effect is improved, meanwhile, the support;
the input ends of the movable electric push rod 1102 and the rotating motor 1106 are electrically connected with the output end of an external power supply.
A cleaning and cooling assembly 12 is arranged at one end of the polishing box body 1 close to the mounting plate 6, and the cleaning and cooling assembly 12 comprises a heat dissipation fan 1201, a heat dissipation pipe 1202, a heat dissipation hole 1203, a rotating ring 1204, a connecting frame 1205, a sealing rubber rod 1206, a connecting spring 1207, a circular plate 1208, a compression column 1209, a compression bar 1210, a cleaning cloth 1211, a fixed spring 1212, a limiting plate 1213 and a T-shaped rod 1214;
the top of the interior of the polishing box body 1 is provided with a heat radiation fan 1201 at the bottom end of the cylinder 2, one end of the heat radiation fan 1201 is fixedly connected with a heat radiation pipe 1202, the bottom end of the heat radiation pipe 1202 is provided with a heat radiation hole 1203 at one side of the polishing sheet 7, a rotating ring 1204 is movably arranged in the interior of the mounting plate 6, the bottom end of the heat radiation pipe 1202 is movably arranged at the outer side of the rotating ring 1204, the polishing motor 5 is connected with one end of the rotating ring 1204 through a connecting frame 1205, one end of the heat radiation pipe 1202 is fixedly connected with a limiting rod, one end of the limiting rod is provided with a limiting block through a screw, the inner wall of the polishing box body 1 is provided with a limiting groove at the position corresponding to the limiting block, the longitudinal sections of the limiting block and the limiting groove are both T-shaped, the bottom surface and, a sealing rubber rod 1206 is bonded at one end of the connecting frame 1205 corresponding to the position of the heat dissipation hole 1203;
connecting springs 1207 are welded on two sides of the top end of the rotating ring 1204, a circular plate 1208 is welded on the top end of each connecting spring 1207, a pressure post 1209 is installed on the bottom surface of each circular plate 1208, which is positioned inside each connecting spring 1207, through a screw, a pressure rod 1210 is welded on the bottom surface of each pressure post 1209, and cleaning cloth 1211 is adhered on the bottom surface of each pressure rod 1210;
one end of one pressing column 1209 is welded with a fixing spring 1212, one end of the fixing spring 1212 is welded with a limiting plate 1213, one end of the limiting plate 1213 is positioned inside the fixing spring 1212 and welded with a T-shaped rod 1214, the T-shaped rod 1214 penetrates through the pressing column 1209, and the input end of the heat dissipation fan 1201 is electrically connected with the output end of the external power supply.
A sealing feeding assembly 13 is installed at one end of the polishing box body 1, and the sealing feeding assembly 13 comprises a protection plate 1301, a feeding hole 1302, a movable electric telescopic rod 1303, a feeding plate 1304, a driving groove 1305, a driving block 1306, a clamping rod 1307, a rotating block 1308, a rotating plate 1309, a clamping plate 1310, a cleaning spring 1311 and a cleaning plate 1312;
one end of a polishing box body 1 is provided with a protection plate 1301 through a screw, one end of the protection plate 1301 is provided with a feeding hole 1302, one end of the outer side of the polishing box body 1 is provided with a movable electric telescopic rod 1303, one end of the movable electric telescopic rod 1303 is installed on the bottom surface of a feeding plate 1304, the feeding plate 1304 is positioned in the feeding hole 1302, the bottom surface of the feeding plate 1304 is provided with a driving groove 1305, the inside of the driving groove 1305 is connected with a driving block 1306 in a sliding mode, one end of the driving block 1306 is bonded with a rubber block, the bottom surface of the driving block 1306 is provided with a clamping rod 1307 through a screw, one end of the clamping rod 1307 is provided with a rotating block 1308 through a rotating shaft, one end of the feeding plate;
even welding of feed plate 1304 top surface has clearance spring 1311, clearance spring 1311 welds respectively in clearance board 1312 four corners position department, and clearance board 1312 is the slope form, contained angle between feed plate 1304 top surface and the polishing box 1 bottom surface is 30, the internal diameter that drives groove 1305 equals with drive piece 1306 external diameter, contained angle between clearance board 1312 top surface and the polishing box 1 bottom surface is 55, conveniently send the circuit board into polishing box 1, simultaneously can be to the better clearance in circuit board surface, the input of removal electric telescopic handle 1303 is connected with external power supply output electrical property
A discharging buffer assembly 14 is arranged at one end of the polishing box body 1 far away from the protection plate 1301, and the discharging buffer assembly 14 comprises a discharging hole 1401, a discharging plate 1402, a driving spring 1403, a fixing plate 1404, a rotating plate 1405, a return spring 1406, a collection frame 1407, an inclination angle 1408, a buffer groove 1409, a buffer spring 1410, a slide block 1411, a return plate 1412, a rotating spring 1413, a buffer rubber rod 1414 and a return block 1415;
one end of the polishing box body 1 is provided with a discharge hole 1401, one end of the discharge hole 1401 is hinged with a discharge plate 1402, the bottom end of the discharge plate 1402 is connected with the bottom surface of the discharge hole 1401 through a driving spring 1403, one end of the top surface of the discharge hole 1401 is provided with a fixing plate 1404 through a screw, one end of the fixing plate 1404 is hinged with a rotating plate 1405, one end of the rotating plate 1405 is uniformly welded with a return spring 1406, and one end of each of a plurality of return springs 1406 is welded on;
a collecting frame 1407 is arranged at the bottom end of one side of the discharging plate 1402 at one end of the polishing box body 1, an inclined angle 1408 is processed at one end of the top surface of the collecting frame 1407, buffer grooves 1409 are respectively arranged at two ends of the inner side of the collecting frame 1407, ball grooves are arranged at the top surface of the supporting rod 1118, and the inside even movable mounting in ball groove has the ball, the shape of play flitch 1402 longitudinal section is the slope form, the width of dashpot 1409 bottom surface is greater than the width of slider 1411 bottom surface, integrated circuit board after the polishing of being convenient for removes, conveniently put into dashpot 1409 with reset plate 1412 inside, dashpot 1409 bottom surface welding has buffer spring 1410, buffer spring 1410 top surface is in dashpot 1409 internal weld has slider 1411, slider 1411 one end articulates there is reset plate 1412, reset plate 1412 one end is connected with slider 1411 one end through rotating spring 1413, reset plate 1412 top surface bonds there is buffering rubber pole 1414, the welding of dashpot 1409 bottom surface one end has reset block 1415.
A collecting and compressing assembly 15 is arranged at one end inside the polishing box body 1, and the collecting and compressing assembly 15 comprises an ash collecting frame 1501, a suction fan 1502, a collecting pipe 1503, a mounting spring 1504, a compressing block 1505, a horizontal compressing plate 1506, an arc plate 1507, an ash falling hole 1508, a rotary compressing plate 1509 and a compressing groove 1510;
an ash collection frame 1501 is arranged at one end of the interior of the polishing box body 1, which is close to the top end of the movable plate 1104, through screws, a suction fan 1502 is arranged on the top surface of the ash collection frame 1501, four collection pipes 1503 are uniformly connected on the top surface of the suction fan 1502 in a penetrating manner, and one ends of the four collection pipes 1503 are all arranged at four corners of the rotating ring 1204 through screws;
receive grey frame 1501 inside both ends and all seted up compression groove 1510, compression groove 1510 bottom surface welding has installation spring 1504, installation spring 1504 top is in compression groove 1510 internal weld and has compression piece 1505, two compression pieces 1505 are respectively through mounting screw in horizontal compression board 1506 both ends, horizontal compression board 1506 top surface middle part both ends all have circular arc board 1507 through mounting screw, ash falling hole 1508 has evenly been seted up at horizontal compression board 1506 top surface both ends, horizontal compression board 1506 bottom surface both ends all articulate has rotation compression board 1509, the input of induced-draft fan 1502 is connected with external power supply output end electric property.
The working principle and the using process of the invention are as follows: the worker opens the movable electric telescopic rod 1303 to drive the feeding plate 1304 to move, the driving groove 1305 is driven to move along with the movement of the feeding plate 1304, after the driving groove 1305 is contacted with the driving block 1306, the driving block 1306 is driven to move, so that the clamping rod 1307 is driven to move, after the clamping plate 1310 at the bottom end of the clamping rod 1307 is moved to be contacted with the inner wall of the protection plate 1301, the rubber block can be compressed along with the movement of the feeding plate 1304 at the moment, the clamping rod 1307 is fixed in position, the rotating plate 1309 is driven to move upwards along with the upward movement of the feeding plate 1304, the rotating block 1308 rotates due to the fixed position of the rotating block 1308, the rotating plate 1309 is driven to rotate, and then the worker puts the integrated circuit board on the feeding plate 1304, and one end of the integrated circuit board is contacted with;
when the integrated circuit board is placed on the feeding plate 1304, the integrated circuit board slides down along the feeding plate 1304 and contacts with the cleaning plate 1312 to clean dust on the surface of the integrated circuit board, and meanwhile, when the integrated circuit board contacts with one end of the cleaning plate 1312, the cleaning spring 1311 at one end stretches to enable the cleaning plate 1312 to rotate and drive the cleaning spring 1311 at the other end to compress, so that the contact area between the cleaning plate 1312 and the surface of the integrated circuit board is increased, and the dust on the surface of the integrated circuit board is better cleaned;
after dust cleaning is finished, a worker starts the movable electric telescopic rod 1303, so that the feeding plate 1304 moves to the interior of the polishing box body 1, the rotating plate 1309 can gradually rotate along with the movement of the feeding plate 1304 and the compression of the rubber block, and the integrated circuit board slides down and falls on the supporting rod 1118, so that the worker can conveniently feed the integrated circuit board, and the feeding time is saved;
after the material loading is ended, open once more and remove electric telescopic handle 1303, drive rotor plate 1309 and remove for rotor plate 1309 is airtight with feed port 1302, makes things convenient for the staff material loading next time, prevents simultaneously that in the course of working, the dust from the feed port 1302 spill, causes the influence to the staff, also makes things convenient for the staff to use next time simultaneously.
After the integrated circuit board is placed on the supporting rod 1118, the movable electric push rod 1102 is started to drive the moving block 1103 to move in the moving groove 1101, the moving plate 1104 is driven by the movement of the moving block 1103, the clamping plates 1113 are pushed to move, the clamping plates 1113 on the two sides move towards the middle, and the integrated circuit board is fixed;
after the integrated circuit board is fixed, firstly, the electric push rod 4 is started to drive the polishing motor 5 and the polishing sheet 7 to move, so that the bottom surface of the polishing sheet 7 is contacted with the top surface of the integrated circuit board, then the polishing motor 5 is started to drive the mounting plate 6 and the polishing sheet 7 to rotate, the surface of the integrated circuit board is polished, in the polishing process, the air cylinder 2 and the moving motor 9 are started, the moving screw rod 10 is driven to rotate through the rotation of the output shaft of the moving motor 9, the workbench 8 is driven to move back and forth, meanwhile, the polishing sheet 7 is driven to move back and forth under the driving of the air cylinder 2, and the surface of the integrated circuit board is polished through the movement of the workbench 8 and the movement of the;
after polishing of one surface of the integrated circuit board is finished, the electric push rod 4 is started to drive the electric push rod 4, so that after the polishing sheet 7 rises, the rotating motor 1106 is started to drive the rotating shaft 1107 to rotate, the driving gear 1108 is driven to rotate, the semi-ring gear 1109 is driven to rotate through rotation of the driving gear 1108, the driving rod 1110 is driven to rotate, the clamping plates 1113 are driven to rotate through rotation of the driving rod 1110, the integrated circuit board clamped between the two clamping plates 1113 is driven to rotate, the integrated circuit board is rotated 180 degrees, the other surface of the integrated circuit board is polished, manual rotation of workers is not needed, polishing efficiency is improved, and polishing time is saved;
in the clamping process, the protective rubber plate 1114 can prevent the clamping plate 1113 from damaging the clamped position of the integrated circuit board and causing the problem of damage of the integrated circuit board, in the rotating process of the clamping plate 1113, at the moment, the clamping plate 1113 extrudes the support rod 1118 to compress the support spring 1116, so as to drive the sliding block 1117 to compress in the sliding groove 1115, so as to facilitate the rotation of the clamping plate 1113, when the clamping plate 1113 rotates to the horizontal position, the support spring 1116 returns to the original position, so that the top surface of the support rod 1118 and the bottom surface of the clamping plate 1113 are contacted with each other again, the bottom surface of the integrated circuit board can be supported in the polishing process, the stability of the integrated circuit board is ensured, and the next use of the device is facilitated, after the polishing is finished, the limiting plate 1111 can be always stretched by the movable spring 1112, the limiting plate 1111 is pushed to move, the clamping plate 1113 can be driven, therefore, the clamping plate 1113 is always contacted with the moving plate 1104, the stability of the moving plate 1104 and the clamping plate 1113 is ensured, and the clamping plate 1113 is prevented from shaking;
in the polishing process, the heat dissipation fan 1201 is started, the polishing motor 5 moves downwards due to the pushing of the electric push rod 4, the mounting plate 6 is driven to move, the rotating ring 1204, the connecting frame 1205 and the sealing rubber rod 1206 are driven to move downwards at the same time, the sealing rubber rod 1206 moves downwards along with the downward movement of the sealing rubber rod 1206, the heat dissipation hole 1203 is sealed, the wind power is prevented from being dissipated, the waste of the wind power is prevented, after the polishing is finished, the sealing rubber rod 1206 moves upwards at the moment, the heat dissipation hole 1203 is opened, the air blown out through the heat dissipation hole 1203 blows towards the pressure rod 1210 at one end, the pressure rod 1210 at one end is driven to move on the polishing sheet 7, the fixing spring 1212 compresses to move the T-shaped rod 1214, the dust on the surface of the polishing sheet 7 is removed, the polishing sheet 7 can be cooled in the removing process, and the service life of the polishing sheet is;
when the polishing sheet 7 contacts the ic board, the pressing rod 1210 and the cleaning cloth 1211 also contact the ic board, and the connecting spring 1207 stretches to drive the circular plate 1208 and the pressing post 1209 to move upward, so as to achieve the purpose of polishing and cleaning, thereby facilitating the observation of the polished position by the worker.
Meanwhile, in the polishing process, the suction fan 1502 is turned on, and at the same time, the collection pipe 1503 is driven to move together with the movement of the mounting plate 6, so that the collection pipe 1503 is always positioned around the polishing sheet 7, thereby dust generated in the polishing process can be sucked into the dust collection frame 1501 to collect the dust generated in the polishing process, at the same time, the dust contacts the arc plate 1507, slides to the two ends inside the dust collection frame 1501 along the arc plate 1507 and falls down along the dust falling hole 1508, the horizontal compression plate 1506 moves downwards through the blowing of the suction fan 1502 while collecting, at the same time, the mounting spring 1504 is compressed, the compression block 1505 moves in the compression groove 1510, and along with the movement of the horizontal compression plate 1506, the rotary compression plate 1509 rotates, so that the dust falling from the dust falling hole 1508 moves to the middle, along with the continuous movement of the horizontal compression plate 1506 and the rotation of the rotary compression plate 1509, can compress the dust at middle part for more dust can be placed at the middle part, improve the inside space utilization of receipts ash frame 1501, need not the staff simultaneously and frequently clear up the dust.
After polishing, the holding plate 1113 is rotated to incline the ic board, then the movable electric push rod 1102 is turned on to loosen the holding plate 1113, at this time, the ic board slides down along the top surface of the support rod 1118 by gravity to the top surface of the discharge plate 1402 and slides out of the discharge hole 1401 to fall inside the collection frame 1407, after falling inside the collection frame 1407, the ic board contacts with the buffer rubber rod 1414 first, the buffer spring 1410 is compressed downward by the gravity of the ic board itself to drive the slider 1411 to move inside the buffer groove 1409, when the reset plate 1412 moves to the position of the reset block 1415, the rotating spring 1413 is compressed gradually to rotate the reset plate 1412, so that the reset plate 1412 is retracted into the groove 1409, and thereafter, the bottom end of the ic board does not contact with the buffer rubber rod 1414 to drop the ic board, so that the ic board is placed inside the collection frame 1407, the integrated circuit board is collected, and a buffer effect is formed on the integrated circuit board in the collecting process, so that the integrated circuit board is prevented from being damaged, and the attractiveness of the integrated circuit board is prevented from being influenced;
when integrated circuit board slided at ejection of compact board 1402, earlier with the rotor plate 1405 contact for rotor plate 1405 rotates, and reset spring 1406 is tensile, and after integrated circuit board roll-off, reset spring 1406 resumes the normal position, drives rotor plate 1405 and returns the normal position, reaches and plays the confined purpose with polishing box 1 inside, simultaneously through driving spring 1403, can make ejection of compact board 1402 rotate, makes the speed of integrated circuit board gliding faster, improves the efficiency of collecting.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A mechanical polishing device for integrated circuit production comprises a polishing box body (1) and a workbench (8) installed at the bottom end inside the polishing box body, and is characterized in that: the rotary clamping stabilizing assembly (11) is mounted at the top end of the workbench (8), and the rotary clamping stabilizing assembly (11) comprises a moving groove (1101), a moving electric push rod (1102), a moving block (1103), a moving plate (1104), a protection box (1105), a rotating motor (1106), a rotating shaft (1107), a driving gear (1108), a semi-ring gear (1109), a driving rod (1110), a limiting plate (1111), a moving spring (1112), a clamping plate (1113), a protective rubber plate (1114), a sliding groove (1115), a supporting spring (1116), a sliding block (1117) and a supporting rod (1118);
both ends of two sides of the top surface of the workbench (8) are provided with moving grooves (1101), one end inside each moving groove (1101) is provided with a moving electric push rod (1102), one end of each moving electric push rod (1102) is provided with a moving block (1103), and two adjacent moving blocks (1103) are respectively installed at both ends of the bottom surface of the moving plate (1104) through screws;
protection box (1105) is all installed through the screw at workstation (8) both ends, protection box (1105) one end fixed mounting has rotating electrical machines (1106), rotating electrical machines (1106) output shaft fixedly connected with rotation axis (1107), the rotation axis (1107) both ends outside is in inside all fixed cover of protection box (1105) and has connect drive gear (1108), it has semi-ring gear (1109) to drive gear (1108) top meshing, semi-ring gear (1109) middle part activity is cup jointed in the drive pole (1110) outside, the welding of drive pole (1110) one end has limiting plate (1111), limiting plate (1111) one end is in drive pole (1110) outside position department welding has removal spring (1112), removal spring (1112) one end movable mounting is in protection box (1105) one end, drive pole (1110) one end is in movable plate (1104) one end position department and has grip block (1113) through the screw installation, one end of the clamping plate (1113) is bonded with a protective rubber plate (1114);
two ends of one side of the moving plate (1104) are respectively provided with a sliding groove (1115), a support spring (1116) is welded on the bottom surface inside the sliding groove (1115), a sliding block (1117) is welded inside the sliding groove (1115) on the top surface of the support spring (1116), and two adjacent sliding blocks (1117) are respectively installed at two ends of one side of the support rod (1118) through screws;
the input ends of the movable electric push rod (1102) and the rotating motor (1106) are electrically connected with the output end of an external power supply.
2. The mechanical polishing device for integrated circuit production according to claim 1, wherein a cylinder (2) is installed at one end of the top inside the polishing box body (1), a mounting block (3) is fixedly installed at one end of the cylinder (2), a driving electric push rod (4) is installed at the bottom end of the mounting block (3), a polishing motor (5) is installed at the bottom end of the driving electric push rod (4), a mounting plate (6) is fixedly connected to an output shaft of the polishing motor (5), a polishing sheet (7) is installed at the bottom end of the mounting plate (6), a workbench (8) is movably installed at the bottom inside the polishing box body (1), a moving motor (9) is fixedly installed at a position of one end of the workbench (8) at the bottom inside of the polishing box body (1), a moving screw rod (10) is fixedly connected to an output shaft of the moving motor (, the movable screw rod (10) is connected with the workbench (8) through a threaded hole, and the input ends of the driving electric push rod (4), the polishing motor (5) and the movable motor (9) are electrically connected with the output end of an external power supply;
the polishing machine is characterized in that a T-shaped block is mounted on the top surface of the mounting block (3) through a screw, a T-shaped groove is formed in the position, corresponding to the T-shaped block, of the inner side edge of the polishing box body (1), the cross sections of the sliding groove (1115) and the sliding block (1117) are T-shaped, and the inner diameter of the sliding groove (1115) is larger than the outer diameter of the sliding block (1117).
3. The mechanical polishing device for integrated circuit production as recited in claim 1, wherein one end of the movable plate (1104) is in contact with one end of the clamping plate (1113), a semicircular plate is welded at one end of the rotating shaft (1107), a corresponding hole is formed in the position of the movable plate (1104) corresponding to the rotating shaft (1107), the diameter of the corresponding hole is larger than the sum of the radii of the rotating shaft (1107) and the semicircular plate, a rotating block is welded at one end of the movable spring (1112), a rotating groove is formed in the position of the protection box (1105) corresponding to the rotating block, and the rotating block is embedded and installed inside the rotating groove.
4. The mechanical polishing device for integrated circuit production as recited in claim 1, wherein a cleaning and cooling assembly (12) is installed at one end of the interior of the polishing box body (1) close to the mounting plate (6), the cleaning and cooling assembly (12) comprises a heat dissipation fan (1201), a heat dissipation pipe (1202), a heat dissipation hole (1203), a rotating ring (1204), a connecting frame (1205), a sealing rubber rod (1206), a connecting spring (1207), a circular plate (1208), a compression column (1209), a compression bar (1210), a cleaning cloth (1211), a fixing spring (1212) limiting plate (1213) and a T-shaped rod (1214);
a heat dissipation fan (1201) is installed at the position, located at the bottom end of the air cylinder (2), of the top inside the polishing box body (1), one end of the heat dissipation fan (1201) is fixedly connected with a heat dissipation pipe (1202), a heat dissipation hole (1203) is formed in the position, located at one side of the polishing sheet (7), of the bottom end of the heat dissipation pipe (1202), a rotating ring (1204) is movably installed inside the mounting plate (6), the bottom end of the heat dissipation pipe (1202) is movably installed on the outer side of the rotating ring (1204), the polishing motor (5) is connected with one end of the rotating ring (1204) through a connecting frame (1205), and a sealing rubber rod (1206) is bonded at the position, corresponding to the heat;
connecting springs (1207) are welded on two sides of the top end of the rotating ring (1204), a circular plate (1208) is welded on the top end of each connecting spring (1207), a compression column (1209) is installed on the bottom surface of each circular plate (1208) in each connecting spring (1207) through a screw, a compression rod (1210) is welded on the bottom surface of each compression column (1209), and cleaning cloth (1211) is bonded on the bottom surface of each compression rod (1210);
one compression leg (1209) one end welding has fixed spring (1212), fixed spring (1212) one end welding has limiting plate (1213), limiting plate (1213) one end is in fixed spring (1212) internal weld and has T type pole (1214), T type pole (1214) run through compression leg (1209), the input and the external power supply output electrical property of heat dissipation fan (1201) are connected.
5. The mechanical polishing device for integrated circuit production as claimed in claim 4, wherein a limiting rod is fixedly connected to one end of the heat dissipation tube (1202), a limiting block is mounted at one end of the limiting rod through a screw, a limiting groove is formed in the inner wall of the polishing box body (1) at a position corresponding to the limiting block, and the longitudinal sections of the limiting block and the limiting groove are both T-shaped;
the bottom surface and the top surface of the connecting frame (1205) are provided with mounting rings through screws, and the radiating pipe (1202) is arranged inside the two mounting rings.
6. The mechanical polishing device for integrated circuit production according to claim 1, wherein a sealed feeding assembly (13) is installed at one end of the polishing tank body (1), and the sealed feeding assembly (13) comprises a protection plate (1301), a feeding hole (1302), a movable electric telescopic rod (1303), a feeding plate (1304), a driving groove (1305), a driving block (1306), a clamping rod (1307), a rotating block (1308), a rotating plate (1309), a clamping plate (1310), a cleaning spring (1311) and a cleaning plate (1312);
one end of the polishing box body (1) is provided with a protection plate (1301) through a screw, one end of the protection plate (1301) is provided with a feeding hole (1302), one end of the outer side of the polishing box body (1) is provided with a movable electric telescopic rod (1303), one end of the movable electric telescopic rod (1303) is installed on the bottom surface of the feeding plate (1304), the feeding plate (1304) is located inside the feeding hole (1302), the bottom surface of the feeding plate (1304) is provided with a driving groove (1305), the driving groove (1305) is connected with a driving block (1306) in a sliding mode, a clamping rod (1307) is installed on the bottom surface of the driving block (1306) through a screw, one end of the clamping rod (1307) is provided with a rotating block (1308) through a rotating shaft, one end of the feeding plate (1304) is hinged with a rotating plate (1309); clamping plates (1310) are mounted at the two ends of the clamping rod (1307) through screws;
the feed plate (1304) top surface is evenly welded with clearance spring (1311), clearance spring (1311) weld respectively in clearance board (1312) four corners position department, and clearance board (1312) are the slope form, the input of removing electric telescopic handle (1303) is connected with external power supply output electrical property.
7. The mechanical polishing device for integrated circuit production according to claim 6, wherein the included angle between the top surface of the feeding plate (1305) and the bottom surface of the polishing case (1) is 30 °, the inner diameter of the driving groove (1305) is equal to the outer diameter of the driving block (1306), the included angle between the top surface of the cleaning plate (1312) and the bottom surface of the polishing case (1) is 55 °, and a rubber block is adhered to one end of the driving block (1306).
8. The mechanical polishing device for integrated circuit production according to claim 6, wherein a discharging buffer assembly (14) is installed at one end of the polishing tank body (1) far away from the protection plate (1301), and the discharging buffer assembly (14) comprises a discharging hole (1401), a discharging plate (1402), a driving spring (1403), a fixing plate (1404), a rotating plate (1405), a return spring (1406), a collecting frame (1407), an inclined angle (1408), a buffer groove (1409), a buffer spring (1410), a slide block (1411), a return plate (1412), a rotating spring (1413), a buffer rubber rod (1414) and a return block (1415);
one end of the polishing box body (1) is provided with a discharge hole (1401), one end of the discharge hole (1401) is hinged with a discharge plate (1402), the bottom end of the discharge plate (1402) is connected with the bottom surface of the discharge hole (1401) through a driving spring (1403), one end of the top surface of the discharge hole (1401) is provided with a fixed plate (1404) through a screw, one end of the fixed plate (1404) is hinged with a rotating plate (1405), one end of the rotating plate (1405) is uniformly welded with a reset spring (1406), and one ends of a plurality of reset springs (1406) are all welded on the bottom surface of the fixed plate (1404);
polishing box (1) one end is in ejection of compact board (1402) one side bottom end position department and has placed collection frame (1407), it has angle of inclination (1408) to collect frame (1407) top surface one end processing, buffer slot (1409) have all been seted up at collection frame (1407) inside both sides both ends, buffer slot (1409) bottom surface welding has buffer spring (1410), buffer spring (1410) top surface is in buffer slot (1409) inside welding has slider (1411), slider (1411) one end articulates there is reset plate (1412), reset plate (1412) one end is connected with slider (1411) one end through rotating spring (1413), reset plate (1412) top surface bonding has buffering rubber pole (1414), buffer slot (1409) bottom surface one end welding has reset block (1415).
9. The mechanical polishing device for integrated circuit production as recited in claim 8, wherein the top surface of the supporting rod (1118) is provided with a ball groove, balls are uniformly and movably mounted in the ball groove, the longitudinal section of the discharging plate (1402) is inclined, and the width of the bottom surface of the buffer groove (1409) is greater than that of the bottom surface of the slide block (1411).
10. A mechanical polishing device for IC production according to claim 4, wherein a collection compression assembly (15) is installed at one end of the interior of the polishing case (1), and the collection compression assembly (15) comprises an ash collection frame (1501), a suction fan (1502), a collection pipe (1503), a mounting spring (1504), a compression block (1505), a horizontal compression plate (1506), an arc plate (1507), an ash dropping hole (1508), a rotary compression plate (1509) and a compression groove (1510);
an ash collecting frame (1501) is arranged at a position, close to the top end of a moving plate (1104), of one end inside the polishing box body (1) through screws, an induced draft fan (1502) is arranged on the top surface of the ash collecting frame (1501), four collecting pipes (1503) are uniformly connected to the top surface of the induced draft fan (1502) in a penetrating mode, and one ends of the four collecting pipes (1503) are all arranged at four corners of a rotating ring (1204) through screws;
receive grey frame (1501) inside both ends and all seted up compression groove (1510), compression groove (1510) bottom surface welding has installation spring (1504), installation spring (1504) top is in compression groove (1510) internal weld has compression piece (1505), two compression piece (1505) are respectively through mounting screw in horizontal compression board (1506) both ends, circular arc board (1507) have all been installed through the screw in horizontal compression board (1506) top surface middle part both ends, ash falling hole (1508) have evenly been seted up at horizontal compression board (1506) top surface both ends, horizontal compression board (1506) bottom surface both ends all articulate has rotation compression board (1509), the input and the external power source output electric property of induced-draught fan (1502) are connected.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010822307.5A CN111975604B (en) | 2020-08-16 | 2020-08-16 | Mechanical polishing device for integrated circuit production |
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|---|---|---|---|
| CN202010822307.5A CN111975604B (en) | 2020-08-16 | 2020-08-16 | Mechanical polishing device for integrated circuit production |
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| CN111975604B CN111975604B (en) | 2022-04-15 |
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| CN110948312A (en) * | 2019-12-12 | 2020-04-03 | 江西诺驰科技咨询有限公司 | Polishing device for metal disc-shaped part for processing electronic product |
| CN210388746U (en) * | 2019-07-03 | 2020-04-24 | 惠州市颖强铝业有限公司 | Circular aluminum cake polishing machine |
| CN211220178U (en) * | 2019-10-22 | 2020-08-11 | 浙江东旺不锈钢实业有限公司 | Two-way burnishing machine of stainless steel |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030095794A (en) * | 2002-06-14 | 2003-12-24 | 유옥경 | Grinder for concret |
| BR0303802A (en) * | 2003-09-05 | 2005-04-12 | Paulo Roberto Della Barba | Granite / Marble Scalloped Edge Plate Fixing Device for Edge Polishing |
| CN107116435A (en) * | 2017-06-19 | 2017-09-01 | 重庆百钰顺科技有限公司 | A kind of efficient polishing grinding method and apparatus |
| CN107962485A (en) * | 2017-12-11 | 2018-04-27 | 郑州国知网络技术有限公司 | A kind of rotatable Novel grinding device |
| CN108500799A (en) * | 2018-03-19 | 2018-09-07 | 湖北乾奥建设工程有限公司 | Architectural entity fabric integrated processing device |
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| Publication number | Publication date |
|---|---|
| CN111975604B (en) | 2022-04-15 |
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