CN111968964B - LED illuminating lamp and manufacturing method thereof - Google Patents
LED illuminating lamp and manufacturing method thereof Download PDFInfo
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- CN111968964B CN111968964B CN202010343160.1A CN202010343160A CN111968964B CN 111968964 B CN111968964 B CN 111968964B CN 202010343160 A CN202010343160 A CN 202010343160A CN 111968964 B CN111968964 B CN 111968964B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Abstract
The invention provides an LED illuminating lamp and a manufacturing method thereof.A metal layer with a bending section is formed by utilizing a concave-convex part of a rigid substrate so as to be beneficial to the flexibility of the whole front structure. Most importantly, the rigid substrate of the invention is also provided with a protruding part which can ensure the height of the solder balls and the electrical insulation between the solder balls, and can electrically isolate the metal section and the light reflecting section when the metal layer is formed, and the light reflecting section is beneficial to the light front surface emergence of the LED chip, thereby improving the heat dissipation of the LED chip.
Description
Technical Field
The invention relates to the technical field of LED packaging, in particular to an LED illuminating lamp and a manufacturing method thereof.
Background
The flexible LED illuminating lamp is a variable and bendable illuminating structure, has the advantages of being bendable, convenient to install and the like, is widely applied to the field of outdoor illumination and decorative illumination, and is a hotspot for research and development in the current illumination technology.
The conventional method of the LED lighting lamp is to directly arrange LED chips on two linear metal wires, and then to weld the LED chips on the metal wires by using bonding wires. The manufacturing method realizes a simplified manufacturing process, and has certain bending performance, but the bending can cause the stress of the metal wire to be larger and the deformation to be obvious, so that the welding point of the welding wire on the metal wire is not firm, the fixed position of the LED chip can be deviated, and the reliability of electric connection and the stability of LED fixation are not facilitated.
Disclosure of Invention
In order to solve the above problems, the present invention provides a method for manufacturing an LED lighting lamp, including:
(1) providing a rigid substrate, wherein the rigid substrate comprises a first surface and a second surface which are opposite, the first surface is provided with a plurality of first areas and a plurality of second areas which are spaced from each other, and the first areas are provided with concave-convex parts in a wave shape;
(2) forming a metal layer on the first surface, wherein the metal layer comprises a plurality of spaced metal sections, and each of the plurality of metal sections comprises a bent part at the middle position and two straight line parts connecting two ends of the bent part;
(3) inversely installing a plurality of LED chips on the plurality of metal sections to form a series structure;
(4) forming a first sealing layer on the first surface, the first sealing layer sealing the metal layer and the LED chip;
(5) removing the rigid substrate;
(6) forming a second sealing layer over the first sealing layer, the first and second sealing layers sealing the metal segment and the LED chip.
Wherein the curved portion is formed by conforming to the concavo-convex portion of the first region.
Wherein the first sealing layer and the second sealing layer are the same sealing material.
Wherein the rigid substrate further includes a protrusion located at a middle position of the second region, and a side surface of the protrusion has a shape that is concave toward the protrusion, for example, a cross section of the protrusion is an inverted trapezoid.
The metal layer further comprises a light reflecting section on the protruding portion, and the width of the light reflecting section is larger than that of the metal section.
Wherein, the step (3) specifically comprises: and embedding solder balls into the linear parts on two sides of the protruding part, then placing the LED chip on the reflecting section, and refluxing to ensure that the LED chip is conducted with the metal layer through the solder balls to form a series structure.
The straight line part is insulated from the adjacent light reflecting section, and the solder ball is spaced from the protruding part by a certain distance.
Wherein, forming a third sealing layer is further included between step (3) and step (4), wherein the third sealing layer seals only the metal segment.
The first sealing layer is made of resin materials, and the second sealing layer and the third sealing layer are made of elastic materials.
The invention also provides an LED illuminating lamp which is formed by the manufacturing method of the LED illuminating lamp, wherein the LED illuminating lamp is of a bendable illuminating structure.
The metal layer with the bending section is formed by utilizing the concave-convex part of the rigid substrate, so that the flexibility of the whole front structure is facilitated. Most importantly, the rigid substrate of the invention is also provided with a protruding part which can ensure the height of the solder balls and the electrical insulation between the solder balls, and can electrically isolate the metal section and the light reflecting section when the metal layer is formed, and the light reflecting section is beneficial to the light front surface emergence of the LED chip, thereby improving the heat dissipation of the LED chip.
Drawings
Fig. 1 to 6 are schematic flow charts of a method for manufacturing an LED illumination lamp according to a first embodiment;
fig. 7 to 12 are schematic flow charts of a method for manufacturing an LED lighting lamp according to a second embodiment.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
The specific manufacturing method of the LED illuminating lamp comprises the following steps:
(1) providing a rigid substrate, wherein the rigid substrate comprises a first surface and a second surface which are opposite, the first surface is provided with a plurality of first areas and a plurality of second areas which are spaced from each other, and the first areas are provided with concave-convex parts in a wave shape;
(2) forming a metal layer on the first surface, wherein the metal layer comprises a plurality of spaced metal sections, and each of the plurality of metal sections comprises a bent part at the middle position and two straight line parts connecting two ends of the bent part;
(3) inversely installing a plurality of LED chips on the plurality of metal sections to form a series structure;
(4) forming a first sealing layer on the first surface, the first sealing layer sealing the metal layer and the LED chip;
(5) removing the rigid substrate;
(6) forming a second sealing layer over the first sealing layer, the first and second sealing layers sealing the metal segment and the LED chip.
A method for manufacturing an LED illumination lamp according to a first embodiment of the present invention will be described in detail with reference to fig. 1 to 6.
First, referring to fig. 1, a rigid substrate 10 is provided, the rigid substrate 10 including a first surface and a second surface opposite to each other, the first surface having a plurality of first regions a1 and a plurality of second regions a2 spaced apart from each other, wherein the first region a1 has a concave-convex portion 11 in a wave shape. The concave-convex portion 11 is a rounded connecting surface, which may be completely embedded in the rigid substrate 10 or partially protruded above the first surface.
The rigid substrate 10 may be stainless steel, ceramic, tempered glass, etc., and the first surface of the rigid substrate 10 may have a dissociation film (not shown). The release film facilitates peeling of the subsequent sealing layer from the rigid substrate 10. The rigid substrate 10 further includes a protruding portion 12 located at the middle of the second area a2, and a side surface of the protruding portion 12 has a shape 13 that is concave toward the protruding portion 12, for example, the protruding portion 12 has an inverted trapezoidal cross section.
Referring next to fig. 2, a metal layer is formed on the first surface, the metal layer including a plurality of spaced apart metal segments 14 and a light reflecting segment 17, each of the plurality of metal segments 14 including a curved portion 15 at a middle position and two linear portions 16 connecting both ends of the curved portion 15. The light reflecting section 17 is formed on the protrusion 12, and the width of the light reflecting section 17 is greater than that of the metal section 14.
The metal layer is formed by a deposition method, and during deposition, because the protrusion 12 has the concave shape 13, the metal section 14 of the metal layer is disconnected at the position of the concave shape 13 and is disconnected from the light reflecting section 17 for insulation, and at this time, the thickness of the metal layer is not too large, otherwise, a short circuit may be generated. In the present invention, the height of the protrusion 12 is about 2mm and the thickness of the metal layer should be in the range of 100-500 μm as determined by experiments.
The protruding part 12 can ensure the height of the solder balls and the electrical insulation between the solder balls, and can electrically isolate the metal section 14 from the light reflecting section 17 when the metal layer is formed, and the light reflecting section 17 is beneficial to the emergent of the light front surface of the LED chip, so that the heat dissipation of the LED chip is improved. The straight portions 16 are insulated from their adjacent light-reflecting segments 17, and solder balls 19 are spaced from the protruding portions 12.
Then, referring to fig. 3, solder balls 19 are implanted into the linear portions 16 on both sides of the protruding portion 12, and then the LED chip 18 is placed on the light reflecting section 17 and reflowed, so that the LED chip 18 is electrically connected to the metal layer through the solder balls 19 to form a series structure. The LED chip 10 may be a mini-LED chip, a gallium nitride LED chip or a silicon-based LED chip, and the emission wavelength thereof may be selected from 400-700 nm.
Referring to fig. 4, a first encapsulant layer 20 is formed on the first surface, the first encapsulant layer 20 encapsulating the metal layer and the LED chip 18. The first sealant layer 20 is a conventional sealant material such as PI, epoxy, etc., which is formed by injection molding, compression molding, etc.
Referring to fig. 5, the rigid substrate 10 is removed, which may be removed by a release layer.
Finally, referring to fig. 6, a second encapsulant layer 21 is formed under the first encapsulant layer 20, the first encapsulant layer 20 and the second encapsulant layer 21 encapsulating the metal layer and the plurality of LED chips 18. The first sealing layer 20 and the second sealing layer 21 are made of the same material, such as PI, epoxy resin, and the like.
According to the above manufacturing method, the present invention provides the LED lighting lamp of the first embodiment, which is a bendable LED structure. The detailed structure will not be repeated. The LED illuminating lamp has the bendable property, and when the LED illuminating lamp is bent, the bent part is stretched to realize the extension of the electric connection circuit.
A method of manufacturing an LED illumination lamp according to a second embodiment of the present invention will be described in detail with reference to fig. 7 to 12.
First, referring to fig. 7, a rigid substrate 10 is provided, the rigid substrate 10 including a first surface and a second surface opposite to each other, the first surface having a plurality of first regions a1 and a plurality of second regions a2 spaced apart from each other, wherein the first region a1 has a concave-convex portion 11 in a wave shape. The concave-convex portion 11 is a rounded connecting surface, which may be completely embedded in the rigid substrate 10 or partially protruded above the first surface.
The rigid substrate 10 may be stainless steel, ceramic, tempered glass, etc., and the first surface of the rigid substrate 10 may have a dissociation film (not shown). The release film facilitates peeling of the subsequent sealing layer from the rigid substrate 10. The rigid substrate 10 further includes a protruding portion 12 located at the middle of the second area a2, and a side surface of the protruding portion 12 has a shape 13 that is concave toward the protruding portion 12, for example, the protruding portion 12 has an inverted trapezoidal cross section.
Referring next to fig. 8, a metal layer is formed on the first surface, the metal layer including a plurality of spaced apart metal segments 14 and a light reflecting segment 17, each of the plurality of metal segments 14 including a curved portion 15 at a middle position and two linear portions 16 connecting both ends of the curved portion 15. The light reflecting section 17 is formed on the protrusion 12, and the width of the light reflecting section 17 is greater than that of the metal section 14.
The metal layer is formed by a deposition method, and during deposition, because the protrusion 12 has the concave shape 13, the metal section 14 of the metal layer is disconnected at the position of the concave shape 13 and is disconnected from the light reflecting section 17 for insulation, and at this time, the thickness of the metal layer is not too large, otherwise, a short circuit may be generated. In the present invention, the height of the protrusion 12 is about 2mm and the thickness of the metal layer should be in the range of 100-500 μm as determined by experiments. The protruding part 12 can ensure the height of the solder balls and the electrical insulation between the solder balls, and can electrically isolate the metal section 14 from the light reflecting section 17 when the metal layer is formed, and the light reflecting section 17 is beneficial to the emergent of the light front surface of the LED chip, so that the heat dissipation of the LED chip is improved.
Then, referring to fig. 9, solder balls 19 are implanted into the linear portions 16 on both sides of the protruding portion 12, and then the LED chip 18 is placed on the light reflecting section 17 and reflowed, so that the LED chip 18 is electrically connected to the metal layer through the solder balls 19 to form a series structure. The LED chip 10 may be a mini-LED chip, a gallium nitride LED chip or a silicon-based LED chip, and the emission wavelength thereof may be selected from 400-700 nm.
Referring to fig. 10, a third sealing layer 22 is formed, wherein the third sealing layer 22 seals only the metal segment 14. The third encapsulant layer 22 is formed between the LED chips 18 by a dispensing process, and covers the metal segments 14. Wherein, the third sealing layer is made of elastic materials, such as elastic plastics, vulcanized rubber and the like. Then, a first encapsulant layer 20 is formed on the first surface, the first encapsulant layer 20 encapsulating the third encapsulant layer 22, the metal layer, and the LED chip 18. The first sealant layer 20 is a conventional sealant material such as PI, epoxy, etc., which is formed by injection molding, compression molding, etc.
Referring to fig. 5, the rigid substrate 10 is removed, which may be removed by a release layer.
Finally, referring to fig. 6, a second encapsulant layer 21 is formed under the first encapsulant layer 20 and the third encapsulant layer 22, the first encapsulant layer 20, the second encapsulant layer 21, and the third encapsulant layer 22 encapsulating the metal layer and the plurality of LED chips 18. The second sealing layer 21 and the third sealing layer 22 are made of the same material and are made of elastic materials. Thus, since the bending section 14 is wrapped by the elastic material, the metal layer can be better protected from being broken to cause an open circuit when being bent.
According to the above manufacturing method, the present invention provides the LED lighting lamp of the first embodiment, which is a bendable LED structure. The detailed structure will not be repeated. The LED illuminating lamp has the bendable property, and when the LED illuminating lamp is bent, the bent part is stretched to realize the extension of the electric connection circuit.
The metal layer with the bending section is formed by utilizing the concave-convex part of the rigid substrate, so that the flexibility of the whole front structure is facilitated. Most importantly, the rigid substrate of the invention is also provided with a protruding part which can ensure the height of the solder balls and the electrical insulation between the solder balls, and can electrically isolate the metal section and the light reflecting section when the metal layer is formed, and the light reflecting section is beneficial to the light front surface emergence of the LED chip, thereby improving the heat dissipation of the LED chip.
The expressions "exemplary embodiment," "example," and the like, as used herein, do not refer to the same embodiment, but are provided to emphasize different particular features. However, the above examples and exemplary embodiments do not preclude their implementation in combination with features of other examples. For example, even in a case where a description of a specific example is not provided in another example, unless otherwise stated or contrary to the description in the other example, the description may be understood as an explanation relating to the other example.
The terminology used in the present invention is for the purpose of illustrating examples only and is not intended to be limiting of the invention. Unless the context clearly dictates otherwise, singular expressions include plural expressions.
While example embodiments have been shown and described, it will be apparent to those skilled in the art that modifications and changes may be made without departing from the scope of the invention as defined by the claims.
Claims (7)
1. A method for manufacturing an LED illuminating lamp comprises the following steps:
(1) providing a rigid substrate, wherein the rigid substrate comprises a first surface and a second surface which are opposite, the first surface is provided with a plurality of first areas and a plurality of second areas which are spaced from each other, and the first areas are provided with concave-convex parts in a wave shape; the rigid substrate further comprises a protrusion part located at the middle position of the second area, and the side surface of the protrusion part is concave towards the protrusion part;
(2) forming a metal layer on the first surface, wherein the metal layer comprises a plurality of spaced metal sections, and each of the plurality of metal sections comprises a bent part at the middle position and two straight line parts connecting two ends of the bent part; the metal layer further comprises a light reflecting section on the protruding part, and the width of the light reflecting section is larger than that of the metal section;
(3) inversely installing a plurality of LED chips on the plurality of metal sections to form a series structure; the method specifically comprises the following steps: solder balls are implanted into the linear parts on the two sides of the protruding part, then the LED chip is placed on the reflecting section and reflows, so that the LED chip is conducted with the metal layer through the solder balls to form a series structure;
(4) forming a first sealing layer on the first surface, the first sealing layer sealing the metal layer and the LED chip;
(5) removing the rigid substrate;
(6) forming a second sealing layer over the first sealing layer, the first and second sealing layers sealing the metal segment and the LED chip.
2. The method for manufacturing an LED illumination lamp according to claim 1, characterized in that:
the bent portion is formed by conforming to the concave-convex portion of the first region.
3. The method for manufacturing an LED illumination lamp according to claim 1, characterized in that:
the first sealing layer and the second sealing layer are the same sealing material.
4. The method for manufacturing an LED illumination lamp according to claim 1, characterized in that:
the straight line part is insulated from the adjacent light reflecting section, and the solder ball is spaced from the protruding part by a certain distance.
5. The method for manufacturing an LED illumination lamp according to claim 1, characterized in that:
forming a third sealing layer between step (3) and step (4), wherein the third sealing layer seals only the metal segment.
6. The method for manufacturing an LED illumination lamp according to claim 5, characterized in that:
wherein the content of the first and second substances,
the first sealing layer is made of resin materials, and the second sealing layer and the third sealing layer are made of elastic materials.
7. An LED illumination lamp formed by the method for manufacturing an LED illumination lamp according to any one of claims 1 to 6, characterized in that:
the LED illuminating lamp is of a bendable illuminating structure.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010343160.1A CN111968964B (en) | 2020-04-27 | 2020-04-27 | LED illuminating lamp and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010343160.1A CN111968964B (en) | 2020-04-27 | 2020-04-27 | LED illuminating lamp and manufacturing method thereof |
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| CN111968964A CN111968964A (en) | 2020-11-20 |
| CN111968964B true CN111968964B (en) | 2022-03-29 |
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| KR101091304B1 (en) * | 2010-01-20 | 2011-12-07 | 엘지이노텍 주식회사 | Light emitting device package and fabricating method thereof |
| CN104952864B (en) * | 2015-06-24 | 2017-06-23 | 厦门多彩光电子科技有限公司 | LED filament and its manufacture method |
| CN108922911A (en) * | 2018-07-31 | 2018-11-30 | 武汉天马微电子有限公司 | A kind of display panel and display device |
| CN110828647B (en) * | 2019-11-20 | 2020-12-18 | 深圳市乐的美光电股份有限公司 | Manufacturing method of flexible LED lamp string |
| CN111509109B (en) * | 2020-04-27 | 2021-03-12 | 江西省兆驰光电有限公司 | LED packaging equipment and use method thereof |
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