CN111961202A - Modified polyamide acid resin slurry, preparation method thereof and non-glue copper-clad plate - Google Patents

Modified polyamide acid resin slurry, preparation method thereof and non-glue copper-clad plate Download PDF

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CN111961202A
CN111961202A CN202010647429.5A CN202010647429A CN111961202A CN 111961202 A CN111961202 A CN 111961202A CN 202010647429 A CN202010647429 A CN 202010647429A CN 111961202 A CN111961202 A CN 111961202A
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dianhydride
copper
acid resin
polyamic acid
aromatic
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马鹏常
赵文华
彭绍鸿
庄雨琪
戴春桃
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Zhongshan Polytechnic
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Zhongshan Polytechnic
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1085—Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties
    • C—CHEMISTRY; METALLURGY
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/26—Silicon- containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

The invention discloses a modified polyamide acid resin slurry which has the characteristics of proper viscosity, good leveling and coating performances, strong adhesion and the like, and is wide in raw material source range, low in cost and suitable for large-scale production. The non-glue copper clad laminate prepared from the modified polyamide acid resin slurry and the copper foil has excellent dielectric property, low hygroscopicity and dimensional stability, can meet the specification requirement of a high-frequency flexible printed circuit board on the copper clad laminate, improves the quality of the circuit board, and more importantly, has larger cost advantage. In addition, the invention also discloses a preparation method of the modified polyamic acid resin slurry.

Description

Modified polyamide acid resin slurry, preparation method thereof and non-glue copper-clad plate
Technical Field
The invention relates to the technical field of high-frequency flexible communication materials and high-frequency flexible printed circuits, in particular to a modified polyamide acid resin slurry, a preparation method thereof and a non-glue copper-clad plate.
Background
Under the working condition of 5G or high frequency and high speed, the reasonable selection of the transmission line dielectric material of the circuit board, the design of parameters and the structure have decisive influence on the loss of the transmission line, the integrity and the accuracy of signal transmission require the miniaturization, the multilayering and the refinement of the transmission line dielectric material, and have the characteristics of low dielectric constant and low loss, and simultaneously require the substrate to have the characteristic of low moisture absorption. At present, the transmission medium material applied to 5G communication is mainly a Flexible Copper Clad Laminate (FCCL), the base material of which is mainly made by laminating an insulating layer formed by films such as Polyimide (PI) or polyester and a copper foil with adhesives such as epoxy resin or acrylic resin, and the commercial preparation method thereof is mainly hot press molding. However, the copper-clad plate manufactured by the method has several problems: (1) firstly, the polyamide acid resin sizing agent is prepared into a film, the price of film preparation equipment is high, and the price of a high-frequency film is higher; the existence of the adhesive reduces the flexibility, the welding resistance and the heat resistance of the product, and can cause the poor dimensional stability of the copper foil during etching; (3) the loss caused by the adhesive layer under high frequency is too large, and the dielectric property is poor; (4) environmental problems may result.
Although the copper clad laminate made of the conventional polyimide film laminated copper foil also has high heat resistance, excellent dimensional stability and excellent mechanical properties, the cost is too high, and the requirements of low dielectric constant (Dk), low dielectric loss (Df), low hygroscopicity/low Coefficient of Thermal Expansion (CTE), peel strength and the like of a circuit board substrate for high-frequency communication cannot be completely met.
In order to solve the problem, the polyamide acid resin slurry which can finally reduce the high-frequency loss of the copper-clad plate is synthesized through molecular design, a non-adhesive copper-clad process is developed, the interface loss is reduced, the size stability, the dielectric property and the bonding property are greatly improved, and the polyamide acid resin slurry is a series of key technologies which need to be broken through urgently in the industry.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide the modified polyamide acid resin slurry which has the characteristics of proper viscosity, good leveling and coating properties, strong adhesion and the like, and meanwhile, the modified polyamide acid resin slurry has wide raw material source range and low cost and is suitable for large-scale production. The non-glue copper clad laminate prepared from the modified polyamide acid resin slurry and the copper foil has excellent dielectric property, low hygroscopicity and dimensional stability, can meet the specification requirement of a high-frequency flexible printed circuit board on the copper clad laminate, improves the quality of the circuit board, and more importantly, has larger cost advantage.
The invention is realized by the following technical scheme:
a modified polyamic acid resin paste is characterized in that: the modified polyamic acid resin slurry has the following structural formula:
Figure BDA0002573664750000031
wherein the content of the first and second substances,
r is H or F;
R1is H or trifluoromethyl;
R2is composed of
Figure BDA0002573664750000032
Figure BDA0002573664750000033
Figure BDA0002573664750000034
One or more of the above;
R3is composed of
Figure BDA0002573664750000035
Figure BDA0002573664750000036
Figure BDA0002573664750000037
One or more of R4Is H or CH3；
The value range of m is 10-6000, and the value range of n is 0-6000.
In addition, the invention also provides a preparation method of the modified polyamic acid resin slurry, which is characterized by comprising the following steps: the adhesive is prepared by purifying, mixing, filtering and defoaming raw materials of aromatic diamine, aromatic dianhydride, porous silicon dioxide, an adhesion promoter and an organic solvent, wherein the mixing comprises copolymerization and blending, and the molar ratio of the aromatic diamine to the aromatic dianhydride is 1: (1-1.1).
The method for preparing a modified polyamic acid resin syrup as described above, wherein the aromatic diamine comprises a first aromatic diamine and a second aromatic diamine, the first aromatic diamine is p-phenylenediamine or 4,4' -benzidine, and the second aromatic diamine is 3,3 ' -bis (trifluoromethyl) -4, 4' -diaminobiphenyl, 2, 5-bis (trifluoromethyl) -p-phenylenediamine, 4' -bis (4-amino-2-trifluoromethylphenoxy) biphenyl, 2', 6,6 ' -tetramethyl-4, 4' -bis (4-amino-2-trifluoromethylphenoxy) biphenyl, 2' -bis [4- (4-aminophenoxy) phenyl ] propane, 1, 3-bis (4-aminophenoxy) benzene, and 2' -trifluoromethyl-2-phenylbenzimidazole One or more of azole-6, 4' -diamine, wherein the molar ratio of the first aromatic diamine to the second aromatic diamine is (1-10): (10-1);
the aromatic dianhydride comprises a first aromatic dianhydride and a second aromatic dianhydride, wherein the first aromatic dianhydride is biphenyl tetracarboxylic dianhydride and/or 2,2 '-difluoro-4, 4' biphenyl dianhydride; the second aromatic dianhydride is one or more of pyromellitic dianhydride, 3 ', 4,4' -benzophenone tetracarboxylic dianhydride, 4,4' -thioether dianhydride, diphenyl ether dianhydride and diphenyl sulfone dianhydride, and the molar ratio of the first aromatic dianhydride to the second aromatic dianhydride is (10-0): (0-10), wherein the dosage of the first aromatic dianhydride and the second aromatic dianhydride is not 0 at the same time.
The preparation method of the modified polyamic acid resin slurry is characterized in that the adhesion promoter is a silane coupling agent, and the organic solvent is N, N '-dimethylacetamide, N' -dimethylformamide, N-methylpyrrolidone or dioxane.
In addition, the invention also provides a non-glue copper clad laminate prepared from the modified polyamic acid resin slurry and a copper foil, which is characterized in that: the non-glue copper-clad plate is provided with an insulating layer, wherein the insulating layer is a polyimide film, and the polyimide film has the following structural formula:
Figure BDA0002573664750000051
wherein, R, R1、R2、R3The value range of m is 10-6000, and the value range of n is 0-6000.
The non-adhesive copper-clad plate is characterized in that the thickness of the polyimide film is 10-30 μm.
The non-adhesive copper-clad plate is characterized in that the thickness of the copper foil is 10-25 μm.
In addition, the invention also provides a preparation method of the non-adhesive copper-clad plate, which is characterized by comprising the following steps: the method comprises the following steps:
1) spreading a copper foil on a horizontal table of the tape casting coating machine;
2) uniformly mixing the modified polyamide acid resin slurry with an imidization reagent, and then coating the mixture on a copper foil in a flow casting manner;
3) and imidizing the copper foil after tape casting coating.
The preparation method of the non-adhesive copper-clad plate is characterized in that the coating speed is 200-300 mm/min.
The preparation method of the non-adhesive copper-clad plate is characterized in that the imidization is divided into three steps, wherein the temperature of the first step is 15-130 ℃, the temperature of the second step is 130-220 ℃, and the temperature of the third step is 220-280 ℃.
The technical scheme of the invention is explained in detail as follows:
the modified polyamic acid resin slurry is a precursor of a polyimide resin insulating layer, and the precursor has a structural formula shown as follows:
Figure BDA0002573664750000061
in the present invention, when n ═ 0, R is preferably H, and R1 is preferably H;
when n ≠ 0, R is preferably H or F, R1Preferably H, R2Preferably, it is
Figure BDA0002573664750000062
Figure BDA0002573664750000063
One or more of R3Preferably, it is
Figure BDA0002573664750000064
Figure BDA0002573664750000065
One or more of R4Is H or CH3。
When said R is2Preferably, it is
Figure BDA0002573664750000066
Figure BDA0002573664750000067
Figure BDA0002573664750000068
(iv) a plurality of (a); or R3 is preferably
Figure BDA0002573664750000069
Figure BDA00025736647500000610
Figure BDA0002573664750000071
Figure BDA0002573664750000072
Can be understood as R in the structure of the polyimide2In the circulation unit thereof
Figure BDA0002573664750000073
The cyclic structures of (a) may be the same or different; r3In the circulation unit thereof
Figure BDA0002573664750000074
May be the same or different.
The invention mixes the purified aromatic diamine, aromatic dianhydride, porous silicon dioxide, adhesion promoter and organic solvent, copolymerizes and blends for 12-24 hours at room temperature, filters and defoams to obtain the polyamide acid resin slurry.
In the present invention, the aromatic diamine includes a first aromatic diamine and a second aromatic diamine; the first aromatic diamine is p-phenylenediamine (PPD) or 4,4' -benzidine (DABP); the second aromatic diamine is 3,3 '-bis (trifluoromethyl) -4, 4' -diaminobiphenyl (TFMB), 2, 5-bis (trifluoromethyl) -p-phenylenediamine (2TFMPD), 4 '-bis (4-amino-2-trifluoromethylphenoxy) biphenyl (FAPB), 2', one or more of 6,6 ' -tetramethyl-4, 4' -bis (4-amino-2-trifluoromethylphenoxy) biphenyl (TMFAPB), 2' -bis [4- (4-aminophenoxy) phenyl ] propane (BAPP), 1, 3-bis (4-aminophenoxy) benzene (BAPB), and 2' -trifluoromethyl-2-phenylbenzimidazole-6, 4' -diamine (TFPBADA); when the second aromatic diamine is two or more of the above specific choices, the present invention does not have any particular limitation on the ratio of the specific substances, and the specific substances may be mixed in any ratio. In the present invention, the molar ratio of the first aromatic diamine to the second aromatic diamine is preferably (1 to 10): (10-1), more preferably (2-8): (8-2), most preferably (4-6): (6-4).
In the present invention, the aromatic dianhydrides include a first aromatic dianhydride and a second aromatic dianhydride; the first aromatic dianhydride is biphenyl tetracarboxylic dianhydride (BPDA) and/or 2,2 '-difluoro-4, 4' -biphenyl dianhydride (2 FBPDA); the second aromatic dianhydride is one or more of pyromellitic dianhydride (PMDA), 3 ', 4,4' -Benzophenone Tetracarboxylic Dianhydride (BTDA), 4,4' -Thioether Dianhydride (TDPA), diphenyl ether dianhydride (ODPA) and diphenyl Sulfone Dianhydride (SDPA); when the second aromatic dianhydride is more than two of the above specific choices, the specific material proportion is not limited in any way, and the second aromatic dianhydride can be mixed according to any proportion. In the present invention, the molar ratio of the first aromatic dianhydride to the second aromatic dianhydride is preferably (10 to 0): (0-10), and the amount of the first aromatic dianhydride and the second aromatic dianhydride is not 0 at the same time, more preferably (8-2): (2-8), most preferably (6-4): (4-6). In the present invention, the molar ratio of the aromatic diamine to the aromatic dianhydride is preferably 1: (1 to 1.1), more preferably 1: (1.02 to 1.08), most preferably 1: (1.04-1.06).
In the present invention, the structural formula of the p-phenylenediamine (PPD) is as follows:
Figure BDA0002573664750000081
the structural formula of the 2, 5-bis (trifluoromethyl) -p-phenylenediamine (2TFMPD) is shown as follows:
Figure BDA0002573664750000082
the structural formula of the 4,4' -benzidine (DABP) is shown as follows:
Figure BDA0002573664750000091
the structural formula of the 3,3 '-bis (trifluoromethyl) -4, 4' -diaminobiphenyl (TFMB) is shown as follows:
Figure BDA0002573664750000092
the structural formula of the 4,4' -bis (4-amino-2-trifluoromethylphenoxy) biphenyl is shown as follows:
Figure BDA0002573664750000093
wherein when R is4When H, specifically 4,4' -bis (4-amino-2-trifluoromethylphenoxy) biphenyl, designated FAPB; when R is4＝CH3Specifically, 2', 6,6 ' -tetramethyl-4, 4' -bis (4-amino-2-trifluoromethylphenoxy) biphenyl was designated as TMFAPB.
The structural formula of the 2,2' -bis [4- (4-aminophenoxy) phenyl ] propane (BAPP) is shown as follows:
Figure BDA0002573664750000094
the structural formula of the 1, 3-bis (4-aminophenoxy) benzene (BAPB) is shown as follows:
Figure BDA0002573664750000095
the structural formula of the 2 '-trifluoromethyl-2-phenylbenzimidazole-6, 4' -diamine (TFBIDA) is shown as follows:
Figure BDA0002573664750000096
in the present invention, the structural formula of the biphenyl tetracarboxylic dianhydride (BPDA) is as follows:
Figure BDA0002573664750000101
the structural formula of the 2,2 '-difluoro-4, 4' -biphenyl dianhydride (2FBPDA) is shown as follows:
Figure BDA0002573664750000102
the structural formula of the pyromellitic dianhydride (PMDA) is shown as follows:
Figure BDA0002573664750000103
the structural formula of the 3,3 ', 4,4' -Benzophenone Tetracarboxylic Dianhydride (BTDA) is shown as follows:
Figure BDA0002573664750000104
the structural formula of the 4,4' -Thioether Dianhydride (TDPA) is shown as follows:
Figure BDA0002573664750000105
the structural formula of the diphenyl ether dianhydride (ODPA) is shown as follows:
Figure BDA0002573664750000106
the structural formula of the diphenyl Sulfone Dianhydride (SDPA) is shown as follows:
Figure BDA0002573664750000107
in the preparation of the modified polyamic acid resin slurry, the adhesion promoter is a silane coupling agent, and the porous silica is modified by the silane coupling agent to obtain the modified silica. The mass ratio of the total mass of the aromatic diamine and the aromatic dianhydride to the modified silicon dioxide is (75-100): (0-25), preferably (80-95): (5-20).
In the present invention, the silane coupling agent is preferably 3-Aminopropyltriethoxysilane (APTES), 3-Aminopropyltrimethoxysilane (APTMS) or Octyltrimethoxysilane (OTMS), and more preferably 3-Aminopropyltrimethoxysilane (APTMS). In the present invention, the mass ratio of the total mass of the aromatic diamine and the aromatic dianhydride to the adhesion promoter is preferably (20 to 80): (1-5), more preferably (25-75): (1.5-4.5), most preferably (30-65): (2-4).
In the invention, the adhesion promoter can form a homogeneous solution with the polyamide acid resin slurry obtained by copolymerization, thereby ensuring that the polyamide acid resin slurry and the copper foil are not layered in the casting coating process and the subsequent imidization process, promoting the effective adhesion of the polyimide resin insulating layer formed by imidization and the copper foil, improving the peel strength and further obtaining the high-quality glue-free polyimide copper-clad plate.
In the present invention, the organic solvent is preferably N, N '-dimethylacetamide, N' -dimethylformamide, N-methylpyrrolidone, or dioxane, and more preferably N-methylpyrrolidone. In the present invention, the mass ratio of the total mass of the aromatic diamine, the aromatic dianhydride, and the porous silica to the organic solvent is preferably (5 to 25): (75-95), more preferably (7-20): (80-93), most preferably (8-17): (83-92).
In the present invention, the mixing comprises copolymerizing and blending:
uniformly mixing the modified porous silicon dioxide, the adhesion promoter and part of the organic solvent to obtain a first mixture;
and mixing and reacting the first mixture, aromatic diamine, aromatic dianhydride and the residual organic solvent to obtain a second mixture, namely polyamide acid resin sizing agent. In the invention, the copolymerization and blending processes are preferably carried out simultaneously, namely the aromatic diamine and the aromatic dianhydride with rigid symmetrical structures undergo copolymerization reaction to form polyamic acid resin solution, and the polyamic acid resin solution is blended and compounded with the modified silicon dioxide during polymerization to obtain the polyamic acid/silicon dioxide homogeneous slurry.
In the present invention, the copolymerization and blending are preferably carried out in a protective atmosphere; the protective atmosphere is preferably a nitrogen atmosphere or an argon atmosphere, and more preferably a nitrogen atmosphere. In the present invention, the temperature of the copolymerization and blending is preferably room temperature; the time for copolymerization and blending is preferably 8-36 h, more preferably 10-28 h, and most preferably 12-24 h.
In the invention, the dynamic viscosity of the prepared polyamide acid resin sizing agent is 3-20 Pa.s, preferably 4-15 Pa.s, and more preferably 5-10 Pa.s.
When the non-adhesive copper-clad plate is prepared, the second mixture is uniformly mixed with the imidization reagent to obtain a third mixture, and the third mixture is coated on a copper foil by a casting coating machine. In the invention, the mixing process is used for smoothly carrying out the polymerization reaction, so that the polyamic acid obtained by copolymerization and the modified silicon dioxide are fully and uniformly mixed and effectively compounded, thereby ensuring that the polyamic acid/modified silicon dioxide slurry after blending and compounding is not layered in the subsequent tape-casting coating and chemical imidization process of copper foil coating, promoting the effective adhesion of a polyimide resin insulating layer formed by imidization and a copper foil, improving the peeling strength and further obtaining the high-quality non-glue polyimide copper-clad plate.
The copper foil is 10-25um thick, the coating speed is 200-300mm/min, the imidization is carried out in a vacuum drying channel in three steps, the temperature of the first step is 15-130 ℃, the temperature of the second step is 130-220 ℃, and the temperature of the third step is 220-280 ℃. And (3) repeating the preparation steps of the single-layer copper clad laminate (the first step and the second step are chemical imidization) to obtain the polyimide single-layer copper clad laminate with the single-layer thickness of 8-30 mu m, carrying out face-to-face hot lamination on the polyimide resin layer of the single-layer copper clad laminate, and heating to 280 ℃ for imidization (the third step is hot imidization), thus obtaining the flexible copper clad laminate with the double-layer copper foil and the single-layer polyimide insulating layer. The preparation method is simple and effective, energy-saving and environment-friendly, and has low cost.
In the present invention, the imidizing agent includes a dehydrating agent and a catalyst; the dehydrating agent is preferably acetic anhydride or trifluoroacetic anhydride; the catalyst is preferably pyridine substances or triethanolamine; the pyridine substance is preferably one or more of 2-methylpyridine, 3-methylpyridine, 4-methylpyridine and 2, 4-dimethylpyridine; when the pyridine substances are more than two of the above specific choices, the specific proportion of the pyridine substances is not limited in any way, and the pyridine substances can be mixed according to any proportion. In the invention, the molar ratio of the dehydrating agent to the catalyst is preferably (4-8): (2-10), more preferably (5-7): (3-9), most preferably (5-6): (3-7). The mass ratio of the aromatic diamine to the imidizing agent is preferably (10-20): (39-100), more preferably (12-18): (42-90), most preferably (13-17): (43-85).
In the invention, the coating speed is preferably 100-400 mm/min, more preferably 150-350 mm/min, and most preferably 200-300 mm/min; the imidization temperature is preferably 10-300 ℃, more preferably 12-290 ℃, and most preferably 15-280 ℃; the imidization time is preferably 10 to 150min, more preferably 15 to 120min, and most preferably 20 to 100 min.
In the present invention, the imidization reaction is preferably carried out by: heating to 120-150 ℃ at a heating rate of 5-10 ℃/min, heating to 200-230 ℃ at a heating rate of 5-10 ℃/min, and heating to 270-300 ℃ at a heating rate of 5-10 ℃/min; more preferably: heating to 125-145 ℃ at a heating rate of 5-10 ℃/min, heating to 210-225 ℃ at a heating rate of 5-10 ℃/min, and heating to 275-290 ℃ at a heating rate of 5-10 ℃/min; most preferably: heating to 130-135 ℃ at a heating rate of 5-10 ℃/min, heating to 210-220 ℃ at a heating rate of 5-10 ℃/min, and heating to 275-280 ℃ at a heating rate of 5-10 ℃/min.
The overall thickness of the non-adhesive copper-clad plate prepared by the invention is 18-60 mu m, preferably 20-50 mu m, more preferably 25-40 mu m, and the thickness of the polyimide resin insulating layer is 10-30 mu m, preferably 15-25 mu m, more preferably 18-22 mu m.
In addition, the invention also provides the application of the polyimide copper clad laminate prepared by the preparation method in the technical fields of communication materials and high-frequency flexible printed circuits.
Compared with the prior art, the invention has the beneficial effects that:
1. the polyamide acid resin slurry disclosed by the invention has the characteristics of low dielectric constant, low hygroscopicity, geothermal expansion coefficient, high peel strength and the like in a film forming process of a subsequent message coating copper foil, is suitable for direct coating forming on the copper foil, can completely meet the coating requirement of the high-frequency copper clad laminate copper foil on the slurry, and can improve the quality of the high-frequency copper clad laminate, and the coating and laminating heat treatment processes are simple and convenient.
2. The non-glue copper-clad plate directly prepared from the polyamide acid resin slurry has excellent dielectric property, moisture absorption and dimensional stability, and particularly, the cost is 40-50% lower than that of a copper-clad plate prepared by firstly preparing the resin slurry into a film and then carrying out copper cladding, the dielectric constant of the non-glue copper-clad plate can be as low as 2.75(10GHz), the dielectric loss of the non-glue copper-clad plate can be as low as 0.005(10GHz), the thermal expansion coefficient of the non-glue copper-clad plate can be as low as 16.5 ppm/DEG C, the moisture absorption rate of the non-glue copper-clad plate can be as.
3. The preparation method is simple, the copolymerization and the blending are synchronously carried out, the process is optimized, the obtained slurry is uniformly mixed and effectively compounded, and the method has low raw material cost; in addition, the chemical imidization and the thermal imidization are synchronized in the preparation process of the copper-clad plate, so that the process is improved, the imidization time is shortened, the thermal imidization temperature is reduced, the energy is saved, the environment is protected, the overall quality of the polyimide copper-clad plate is improved, the roughness and the thermal expansion coefficient of the polyimide resin insulating layer are reduced, and the dimensional stability is also obviously improved.
Detailed Description
The present invention will be further described with reference to the following examples for facilitating understanding of those skilled in the art, and the description of the embodiments is not intended to limit the present invention.
Example 1
4,4 '-biphenyl dianhydride (11.77g), 2' -difluoro-4, 4 '-biphenyl dianhydride (3.30g), p-phenylenediamine (3.78g), 3' -bis (trifluoromethyl) -4,4 '-diaminobiphenyl (3.20g), 2' -trifluoromethyl-2-phenylbenzimidazole-6, 4-diamine (1.40g), porous silica (2.61g), 3-aminopropyltrimethoxysilane (1.74g) and N-methylpyrrolidone (228mL, 234.45g) were mixed, copolymerized and blended (room temperature, nitrogen atmosphere) for 16 hours to obtain polyamic acid resin slurry;
mixing the polyamic acid resin slurry with 4-methylpyridine (9.31g) and acetic anhydride (12.76g) at room temperature to obtain a homogeneous mixture of polyamic acid-imidizing agent; spreading a copper foil film on a horizontal table of a tape-casting coating machine, tape-casting and coating the uniform mixture of the polyamic acid-imidization reagent on a copper foil at the speed of 200 plus one meter per minute and 300mm per minute, imidizing the copper foil coated with the polyamic acid resin slurry layer, namely, raising the temperature from 15 ℃ to 130 ℃ at the rate of 5-10 per minute, maintaining for 10 minutes, then continuing raising the temperature to 220 ℃, maintaining for 10 minutes, raising the temperature to 280 ℃, maintaining for 5 minutes, and cooling to obtain the single-layer polyimide copper-clad plate.
Testing the dynamic viscosity of the polyamic acid resin sizing agent at 25 ℃, wherein the dynamic viscosity is 5.7Pa & s;
the stripped polyimide resin insulation layer (polyimide film) was tested for dielectric properties, moisture absorption properties and dimensional stability, and the test results are shown in table 1.
The polyimide copper-clad plate is tested for dielectric property, moisture absorption property, dimensional stability, thermal expansion coefficient and peel strength, and the test results are shown in table 2.
Example 2
4,4 '-biphenyl dianhydride (11.77g), 2' -difluoro-4, 4 '-biphenyl dianhydride (3.30g), p-phenylenediamine (3.24g), 3' -bis (trifluoromethyl) -4,4 '-diaminobiphenyl (4.8g), 2' -trifluoromethyl-2-phenylbenzimidazole-6, 4-diamine (1.40g), porous silica (2.72g), 3-aminopropyltrimethoxysilane (1.82g) and N-methylpyrrolidone (239mL, 245.10g) were mixed, copolymerized and blended (room temperature, nitrogen atmosphere) for 16 hours to obtain polyamic acid resin slurry;
mixing the polyamic acid resin slurry with 4-methylpyridine (9.31g) and acetic anhydride (12.76g) at room temperature to obtain a homogeneous mixture of polyamic acid-imidizing agent; spreading a copper foil film on a horizontal table of a tape-casting coating machine, tape-casting and coating the uniform mixture of the polyamic acid-imidization reagent on a copper foil at the speed of 200 plus one meter per minute and 300mm per minute, imidizing the copper foil coated with the polyamic acid resin slurry layer, namely, raising the temperature from 15 ℃ to 130 ℃ at the rate of 5-10 per minute, maintaining for 10 minutes, then continuing raising the temperature to 220 ℃, maintaining for 10 minutes, raising the temperature to 280 ℃, maintaining for 5 minutes, and cooling to obtain the single-layer polyimide copper-clad plate.
Testing the dynamic viscosity of the polyamic acid resin slurry at 25 ℃, wherein the dynamic viscosity is 5.5Pa & s;
the stripped polyimide resin insulation layer (polyimide film) was tested for dielectric properties, moisture absorption properties and dimensional stability, and the test results are shown in table 1.
The polyimide copper-clad plate is tested for dielectric property, moisture absorption property, dimensional stability, thermal expansion coefficient and peel strength, and the test results are shown in table 2.
Example 3
4,4' -biphenyl dianhydride (10.30g), 2' -difluoro-4, 4' -biphenyl dianhydride (3.30g), pyromellitic dianhydride (1.09g), p-phenylenediamine (3.24g), 2' -trifluoromethyl-2-phenylbenzimidazole-6, 4' -diamine (1.40g), 3 ' -bis (trifluoromethyl) -4, 4' -diaminobiphenyl (4.8g), porous silica (2.68g), 3-aminopropyltrimethoxysilane (1.78g) and N-methylpyrrolidone (235mL, 241.29g) were mixed, copolymerized and blended (room temperature, nitrogen atmosphere) for 16 hours to obtain a polyamic acid resin slurry;
mixing the polyamic acid resin slurry with 4-methylpyridine (9.31g) and acetic anhydride (12.76g) at room temperature to obtain a homogeneous mixture of polyamic acid-imidizing agent; spreading a copper foil film on a horizontal table of a tape-casting coating machine, tape-casting and coating the uniform mixture of the polyamic acid-imidization reagent on a copper foil at the speed of 200 plus one meter per minute and 300mm per minute, imidizing the copper foil coated with the polyamic acid resin slurry layer, namely, raising the temperature from 15 ℃ to 130 ℃ at the rate of 5-10 per minute, maintaining for 10 minutes, then continuing raising the temperature to 220 ℃, maintaining for 10 minutes, raising the temperature to 280 ℃, maintaining for 5 minutes, and cooling to obtain the single-layer polyimide copper-clad plate.
Testing the dynamic viscosity of the polyamic acid resin sizing agent at 25 ℃, wherein the dynamic viscosity is 5.7Pa & s;
the stripped polyimide resin insulation layer (polyimide film) was tested for dielectric properties, moisture absorption properties and dimensional stability, and the test results are shown in table 1.
The polyimide copper-clad plate is tested for dielectric property, moisture absorption property, dimensional stability, thermal expansion coefficient and peel strength, and the test results are shown in table 2.
Example 4
4,4' -biphenyl dianhydride (8.83g), 2' -difluoro-4, 4' -biphenyl dianhydride (3.30g), pyromellitic dianhydride (2.18g), p-phenylenediamine (3.24g), 2' -trifluoromethyl-2-phenylbenzimidazole-6, 4' -diamine (1.40g), 2' -bis (trifluoromethyl) -4, 4' -diaminobiphenyl (4.8g), porous silica (2.64g), 3-aminopropyltrimethoxysilane (1.77g) and N-methylpyrrolidone (231mL, 237.42g) were mixed, copolymerized and blended (room temperature, nitrogen atmosphere) for 16 hours to obtain a polyamic acid resin slurry;
mixing the polyamic acid resin slurry with 4-methylpyridine (9.31g) and acetic anhydride (12.76g) at room temperature to obtain a homogeneous mixture of polyamic acid-imidizing agent; spreading a copper foil film on a horizontal table of a tape-casting coating machine, tape-casting and coating the uniform mixture of the polyamic acid-imidization reagent on a copper foil at the speed of 200 plus one meter per minute and 300mm per minute, imidizing the copper foil coated with the polyamic acid resin slurry layer, namely, raising the temperature from 15 ℃ to 130 ℃ at the rate of 5-10 per minute, maintaining for 10 minutes, then continuing raising the temperature to 220 ℃, maintaining for 10 minutes, raising the temperature to 280 ℃, maintaining for 5 minutes, and cooling to obtain the single-layer polyimide copper-clad plate.
Testing the dynamic viscosity of the polyamic acid resin slurry at 25 ℃, wherein the dynamic viscosity is 5.6Pa & s;
the stripped polyimide resin insulation layer (polyimide film) was tested for dielectric properties, moisture absorption properties and dimensional stability, and the test results are shown in table 1.
The polyimide copper-clad plate is tested for dielectric property, moisture absorption property, dimensional stability, thermal expansion coefficient and peel strength, and the test results are shown in table 2.
Example 5
4,4' -biphenyl dianhydride (8.83g), 2' -difluoro-4, 4' -biphenyl dianhydride (3.30g), pyromellitic dianhydride (1.09g), 3 ', 4,4' -benzophenone tetracarboxylic dianhydride (1.61g), p-phenylenediamine (3.78g), 3 ' -bis (trifluoromethyl) -4, 4' -diaminobiphenyl (4.8g), porous silica (2.60g), 3-aminopropyltrimethoxysilane (1.74g) and N-methylpyrrolidone (228mL, 234.09g) were mixed, copolymerized and blended (room temperature, nitrogen atmosphere) for 16 hours to obtain a polyamic acid resin slurry;
mixing the polyamic acid resin slurry with 4-methylpyridine (9.31g) and acetic anhydride (12.76g) at room temperature to obtain a homogeneous mixture of polyamic acid-imidizing agent; spreading a copper foil film on a horizontal table of a tape-casting coating machine, tape-casting and coating the uniform mixture of the polyamic acid-imidization reagent on a copper foil at the speed of 200 plus one meter per minute and 300mm per minute, imidizing the copper foil coated with the polyamic acid resin slurry layer, namely, raising the temperature from 15 ℃ to 130 ℃ at the rate of 5-10 per minute, maintaining for 10 minutes, then continuing raising the temperature to 220 ℃, maintaining for 10 minutes, raising the temperature to 280 ℃, maintaining for 5 minutes, and cooling to obtain the single-layer polyimide copper-clad plate.
Testing the dynamic viscosity of the polyamic acid resin sizing agent at 25 ℃, wherein the dynamic viscosity is 5.7Pa & s;
the stripped polyimide resin insulation layer (polyimide film) was tested for dielectric properties, moisture absorption properties and dimensional stability, and the test results are shown in table 1.
The polyimide copper-clad plate is tested for dielectric property, moisture absorption property, dimensional stability, thermal expansion coefficient and peel strength, and the test results are shown in table 2.
Example 6
4,4' -biphenyl dianhydride (8.83g), 2' -difluoro-4, 4' -biphenyl dianhydride (3.30g), pyromellitic dianhydride (1.09g), 3 ', 4,4' -benzophenone tetracarboxylic dianhydride (1.61g), p-phenylenediamine (3.78g), 3 ' -bis (trifluoromethyl) -4, 4' -diaminobiphenyl (3.2g), 2' -trifluoromethyl-2-phenylbenzimidazole-6, 4' -diamine (1.40g), porous silica (2.58g), 3-aminopropyltrimethoxysilane (1.74g) and N-methylpyrrolidone (226mL, 232.11g) were mixed, copolymerized and blended (room temperature, nitrogen atmosphere) for 16 hours to obtain a polyamic acid resin slurry;
mixing the polyamic acid resin slurry with 4-methylpyridine (9.31g) and acetic anhydride (12.76g) at room temperature to obtain a homogeneous mixture of polyamic acid-imidizing agent; spreading a copper foil film on a horizontal table of a tape-casting coating machine, tape-casting and coating the uniform mixture of the polyamic acid-imidization reagent on a copper foil at the speed of 200 plus one meter per minute and 300mm per minute, imidizing the copper foil coated with the polyamic acid resin slurry layer, namely, raising the temperature from 15 ℃ to 130 ℃ at the rate of 5-10 per minute, maintaining for 10 minutes, then continuing raising the temperature to 220 ℃, maintaining for 10 minutes, raising the temperature to 280 ℃, maintaining for 5 minutes, and cooling to obtain the single-layer polyimide copper-clad plate.
Testing the dynamic viscosity of the polyamic acid resin sizing agent at 25 ℃, wherein the dynamic viscosity is 5.7Pa & s;
the stripped polyimide resin insulation layer (polyimide film) was tested for dielectric properties, moisture absorption properties and dimensional stability, and the test results are shown in table 1.
The polyimide copper-clad plate is tested for dielectric property, moisture absorption property, dimensional stability, thermal expansion coefficient and peel strength, and the test results are shown in table 2.
Example 7
4,4 '-biphenyl dianhydride (8.83g), 2' -difluoro-4, 4 '-biphenyl dianhydride (3.30g), pyromellitic dianhydride (1.09g), 4' -thioether dianhydride (1.63g), p-phenylenediamine (3.78g), 3 '-bis (trifluoromethyl) -4, 4' -diaminobiphenyl (3.2g), 2 '-trifluoromethyl-2-phenylbenzimidazole-6, 4' -diamine (1.40g), porous silica (2.58g), 3-aminopropyltrimethoxysilane (1.74g) and N-methylpyrrolidone (226mL, 232.29g) were mixed, copolymerized and blended (room temperature, nitrogen atmosphere) for 16 hours to obtain a polyamic acid resin slurry;
mixing the polyamic acid resin slurry with 4-methylpyridine (9.31g) and acetic anhydride (12.76g) at room temperature to obtain a homogeneous mixture of polyamic acid-imidizing agent; spreading a copper foil film on a horizontal table of a tape-casting coating machine, tape-casting and coating the uniform mixture of the polyamic acid-imidization reagent on a copper foil at the speed of 200 plus one meter per minute and 300mm per minute, imidizing the copper foil coated with the polyamic acid resin slurry layer, namely, raising the temperature from 15 ℃ to 130 ℃ at the rate of 5-10 per minute, maintaining for 10 minutes, then continuing raising the temperature to 220 ℃, maintaining for 10 minutes, raising the temperature to 280 ℃, maintaining for 5 minutes, and cooling to obtain the single-layer polyimide copper-clad plate.
Testing the dynamic viscosity of the polyamic acid resin slurry at 25 ℃, wherein the dynamic viscosity is 5.5Pa & s;
the stripped polyimide resin insulation layer (polyimide film) was tested for dielectric properties, moisture absorption properties and dimensional stability, and the test results are shown in table 1.
The polyimide copper-clad plate is tested for dielectric property, moisture absorption property, dimensional stability, thermal expansion coefficient and peel strength, and the test results are shown in table 2.
Example 8
4,4' -biphenyl dianhydride (11.77g), 2' -difluoro-4, 4' -biphenyl dianhydride (3.30g), p-phenylenediamine (3.78g), 3 ' -bis (trifluoromethyl) -4, 4' -diaminobiphenyl (3.2g), 2' -trifluoromethyl-2-phenylbenzimidazole-6, 4' -diamine (1.40g), porous silica (2.61g), 3-aminopropyltrimethoxysilane (1.75g) and N-methylpyrrolidone (186mL, 191.03g) were mixed, copolymerized and blended (room temperature, nitrogen atmosphere) for 16 hours to obtain polyamic acid resin slurry;
mixing the polyamic acid resin slurry with 4-methylpyridine (9.31g) and acetic anhydride (12.76g) at room temperature to obtain a homogeneous mixture of polyamic acid-imidizing agent; spreading a copper foil film on a horizontal table of a tape-casting coating machine, tape-casting and coating the uniform mixture of the polyamic acid-imidization reagent on a copper foil at the speed of 200 plus one meter per minute and 300mm per minute, imidizing the copper foil coated with the polyamic acid resin slurry layer, namely, raising the temperature from 15 ℃ to 130 ℃ at the rate of 5-10 per minute, maintaining for 10 minutes, then continuing raising the temperature to 220 ℃, maintaining for 10 minutes, raising the temperature to 280 ℃, maintaining for 5 minutes, and cooling to obtain the single-layer polyimide copper-clad plate.
Testing the dynamic viscosity of the polyamic acid resin slurry at 25 ℃, wherein the dynamic viscosity is 6.0Pa & s;
the stripped polyimide resin insulation layer (polyimide film) was tested for dielectric properties, moisture absorption properties and dimensional stability, and the test results are shown in table 1.
The polyimide copper-clad plate is tested for dielectric property, moisture absorption property, dimensional stability, thermal expansion coefficient and peel strength, and the test results are shown in table 2.
Example 9
4,4 '-Biphenyl dianhydride (8.83g), 2' -difluoro-4, 4 '-Biphenyl dianhydride (3.30g), pyromellitic dianhydride (2.18g), p-phenylenediamine (3.24g), 2' -bis (trifluoromethyl) -4,4 '-diaminobiphenyl (3.2g), 2' -trifluoromethyl-2-phenylbenzimidazole-6, 4 '-diamine (1.40g), 4' -bis (4-amino-2-trifluoromethylphenoxy) biphenyl (2.53g), porous silica (2.74g), 3-aminopropyltrimethoxysilane (1.84g) and N-methylpyrrolidone (151mL, 155.39g) were mixed, carrying out copolymerization and blending (room temperature and nitrogen atmosphere) for 16h to obtain polyamic acid resin slurry;
mixing the polyamic acid resin slurry with 4-methylpyridine (9.31g) and acetic anhydride (12.76g) at room temperature to obtain a homogeneous mixture of polyamic acid-imidizing agent; spreading a copper foil film on a horizontal table of a tape-casting coating machine, tape-casting and coating the uniform mixture of the polyamic acid-imidization reagent on a copper foil at the speed of 200 plus one meter per minute and 300mm per minute, imidizing the copper foil coated with the polyamic acid resin slurry layer, namely, raising the temperature from 15 ℃ to 130 ℃ at the rate of 5-10 per minute, maintaining for 10 minutes, then continuing raising the temperature to 220 ℃, maintaining for 10 minutes, raising the temperature to 280 ℃, maintaining for 5 minutes, and cooling to obtain the single-layer polyimide copper-clad plate.
Testing the dynamic viscosity of the polyamic acid resin slurry at 25 ℃, wherein the dynamic viscosity is 5.6Pa & s;
the stripped polyimide resin insulation layer (polyimide film) was tested for dielectric properties, moisture absorption properties and dimensional stability, and the test results are shown in table 1.
The polyimide copper-clad plate is tested for dielectric property, moisture absorption property, dimensional stability, thermal expansion coefficient and peel strength, and the test results are shown in table 2.
Example 10
Mixing 4,4 '-biphenyl dianhydride (8.83g), 2' -difluoro-4, 4 '-biphenyl dianhydride (3.30g), pyromellitic dianhydride (2.18g), p-phenylenediamine (2.70g), 3' -bis (trifluoromethyl) -4,4 '-diaminobiphenyl (4.8g), 4' -bis (4-amino-2-trifluoromethylphenoxy) biphenyl (2.53g), 2 '-trifluoromethyl-2-phenylbenzimidazole-6, 4' -diamine (1.40g), porous silica (2.86g), 3-aminopropyltrimethoxysilane (1.99g) and N-methylpyrrolidone (163mL, 162.07g), carrying out copolymerization and blending (room temperature and nitrogen atmosphere) for 16h to obtain polyamic acid resin slurry;
mixing the polyamic acid resin slurry with 4-methylpyridine (9.31g) and acetic anhydride (12.76g) at room temperature to obtain a homogeneous mixture of polyamic acid-imidizing agent; spreading a copper foil film on a horizontal table of a tape-casting coating machine, tape-casting and coating the uniform mixture of the polyamic acid-imidization reagent on a copper foil at the speed of 200 plus one meter per minute and 300mm per minute, imidizing the copper foil coated with the polyamic acid resin slurry layer, namely, raising the temperature from 15 ℃ to 130 ℃ at the rate of 5-10 per minute, maintaining for 10 minutes, then continuing raising the temperature to 220 ℃, maintaining for 10 minutes, raising the temperature to 280 ℃, maintaining for 5 minutes, and cooling to obtain the single-layer polyimide copper-clad plate.
Testing the dynamic viscosity of the polyamic acid resin sizing agent at 25 ℃, wherein the dynamic viscosity is 5.7Pa & s;
the stripped polyimide resin insulation layer (polyimide film) was tested for dielectric properties, moisture absorption properties and dimensional stability, and the test results are shown in table 1.
The polyimide copper-clad plate is tested for dielectric property, moisture absorption property, dimensional stability, thermal expansion coefficient and peel strength, and the test results are shown in table 2.
Example 11
4,4' -biphenyl dianhydride (8.83g), 2' -difluoro-4, 4' -biphenyl dianhydride (3.30g), pyromellitic dianhydride (2.18g), p-phenylenediamine (2.70g), 2, 5-bis (trifluoromethyl) -p-phenylenediamine (3.66g), 4' -bis (4-amino-2-trifluoromethylphenoxy) biphenyl (2.53g), 2' -trifluoromethyl-2-phenylbenzimidazole-6, 4' -diamine (1.40g), porous silica (2.73g), 3-aminopropyltrimethoxysilane (1.90g) and N, N ' -dimethylacetamide (239mL, 245.97g) were mixed, copolymerized and blended (room temperature, nitrogen atmosphere) for 16 hours to obtain a polyamic acid resin slurry;
mixing the polyamic acid resin slurry with 4-methylpyridine (9.31g) and acetic anhydride (12.76g) at room temperature to obtain a homogeneous mixture of polyamic acid-imidizing agent; spreading a copper foil film on a horizontal table of a tape-casting coating machine, tape-casting and coating the uniform mixture of the polyamic acid-imidization reagent on a copper foil at the speed of 200 plus one meter per minute and 300mm per minute, imidizing the copper foil coated with the polyamic acid resin slurry layer, namely, raising the temperature from 15 ℃ to 130 ℃ at the rate of 5-10 per minute, maintaining for 10 minutes, then continuing raising the temperature to 220 ℃, maintaining for 10 minutes, raising the temperature to 280 ℃, maintaining for 5 minutes, and cooling to obtain the single-layer polyimide copper-clad plate.
Testing the dynamic viscosity of the polyamic acid resin sizing agent at 25 ℃, wherein the dynamic viscosity is 5.7Pa & s;
the stripped polyimide resin insulation layer (polyimide film) was tested for dielectric properties, moisture absorption properties and dimensional stability, and the test results are shown in table 1.
The polyimide copper-clad plate is tested for dielectric property, moisture absorption property, dimensional stability, thermal expansion coefficient and peel strength, and the test results are shown in table 2.
Example 12
Taking the third mixture described in example 2, i.e., a homogeneous mixture of polyamic acid-imidizing agent; and repeating the coating step and the first and second imidization steps of the example 2 to obtain the polyimide single-layer copper-clad plate, carrying out face-to-face thermal lamination on the polyimide resin layer of the single-layer copper-clad plate, and heating to 280 ℃ at the same heating rate to imidize to obtain the flexible copper-clad plate with the double-layer copper foil and the single-layer polyimide insulating layer.
The polyimide copper-clad plate is tested for dielectric property, moisture absorption property, dimensional stability, thermal expansion coefficient and peel strength, and the test results are shown in table 2.
Example 13
Taking the third mixture described in example 6, i.e., a homogeneous mixture of polyamic acid-imidizing agent; and repeating the coating step and the first and second imidization steps of the example 6 to obtain the polyimide single-layer copper-clad plate, carrying out face-to-face thermal lamination on the polyimide resin layer of the single-layer copper-clad plate, and heating to 280 ℃ at the same heating rate to imidize to obtain the flexible copper-clad plate with the double-layer copper foil and the single-layer polyimide insulating layer.
The polyimide copper-clad plate is tested for dielectric property, moisture absorption property, dimensional stability, thermal expansion coefficient and peel strength, and the test results are shown in table 2.
Example 14
Taking a third mixture as described in example 9, i.e., a homogeneous mixture of polyamic acid-imidizing agent; the coating step of example 9 and the first and second imidization steps were repeated to obtain a polyimide single-layer copper clad laminate, the polyimide resin layers of the single-layer copper clad laminate were heat laminated face to face, and the temperature was raised to 280 ℃ at the same temperature raising rate for imidization to obtain a flexible copper clad laminate of a double-layer copper foil single-layer polyimide insulation layer.
The polyimide copper-clad plate is tested for dielectric property, moisture absorption property, dimensional stability, thermal expansion coefficient and peel strength, and the test results are shown in table 2.
Example 15
Taking the third mixture described in example 10, i.e., a homogeneous mixture of polyamic acid-imidizing agent; and repeating the coating step and the first and second imidization steps of the example 10 to obtain a polyimide single-layer copper-clad plate, performing face-to-face thermal lamination on the polyimide resin layer of the single-layer copper-clad plate, and heating to 280 ℃ at the same heating rate to perform imidization to obtain the flexible copper-clad plate with the double-layer copper foil and the single-layer polyimide insulating layer.
The polyimide copper-clad plate is tested for dielectric property, moisture absorption property, dimensional stability, thermal expansion coefficient and peel strength, and the test results are shown in table 2.
Example 16
Taking a third mixture as described in example 11, i.e., a homogeneous mixture of polyamic acid-imidizing agent; the coating step of example 11 and the first and second imidization steps were repeated to obtain a polyimide single-layer copper clad laminate, the polyimide resin layers of the single-layer copper clad laminate were heat laminated face to face, and the temperature was raised to 280 ℃ at the same temperature raising rate for imidization to obtain a flexible copper clad laminate of a double-layer copper foil single-layer polyimide insulation layer.
The polyimide copper-clad plate is tested for dielectric property, moisture absorption property, dimensional stability, thermal expansion coefficient and peel strength, and the test results are shown in table 2.
Test results and analysis
Table 1: performance parameters of polyimide films obtained by peeling in examples 1 to 11
Figure BDA0002573664750000281
Table 2: performance parameters of Cu/PI copper-clad plate obtained in examples 1-16
Figure BDA0002573664750000282
Figure BDA0002573664750000291
As can be seen from tables 1 and 2, the polyamic acid resin slurry provided by the invention has the characteristics of low dielectric constant, low hygroscopicity, geothermal expansion coefficient, high peel strength and the like in a film formed in a subsequent copper clad process, has proper viscosity, is simple and convenient in coating and laminating heat treatment processes, and is suitable for direct coating and forming on copper foil. The polyamic acid resin slurry can completely meet the coating requirement of a copper foil of a high-frequency copper-clad plate on the slurry, the quality of the high-frequency copper-clad plate can be improved, the copper-clad plate directly prepared from the polyamic acid resin slurry has excellent dielectric property, hygroscopicity and dimensional stability, particularly, the cost ratio is that the resin slurry is firstly prepared into a film, specifically, the dielectric constant can be as low as 2.75(10GHz), the dielectric loss can be as low as 0.005(10GHz), the thermal expansion coefficient can be as low as 16.5 ppm/DEG C, the moisture absorption rate can be as low as 0.2%, and the peel strength can be 1. In addition, the polyimide copper-clad plate obtained by the invention has stable size, and the size stability is as low as 0.06%. In conclusion, the glue-free copper plate obtained by the invention has excellent comprehensive performance and low preparation cost, and is suitable for industrial popularization.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (10)

1. A modified polyamic acid resin paste is characterized in that: the modified polyamic acid resin slurry has the following structural formula:
Figure FDA0002573664740000011
wherein the content of the first and second substances,
r is H or F;
R1is H or trifluoromethyl;
R2is composed of
Figure FDA0002573664740000012
Figure FDA0002573664740000013
Figure FDA0002573664740000014
One or more of the above;
R3is composed of
Figure FDA0002573664740000015
Figure FDA0002573664740000016
Figure FDA0002573664740000017
One or more of R4Is H or CH3；
The value range of m is 10-6000, and the value range of n is 0-6000.
2. A method for preparing the modified polyamic acid resin syrup according to claim 1, wherein: the adhesive is prepared by purifying, mixing, filtering and defoaming raw materials of aromatic diamine, aromatic dianhydride, porous silicon dioxide, an adhesion promoter and an organic solvent, wherein the mixing comprises copolymerization and blending, and the molar ratio of the aromatic diamine to the aromatic dianhydride is 1: (1-1.1).
3. The method of preparing a modified polyamic acid resin syrup according to claim 2, wherein said aromatic diamine comprises a first aromatic diamine and a second aromatic diamine, said first aromatic diamine is p-phenylenediamine or 4,4' -benzidine, said second aromatic diamine is 3,3 ' -bis (trifluoromethyl) -4, 4' -diaminobiphenyl, 2, 5-bis (trifluoromethyl) -p-phenylenediamine, 4' -bis (4-amino-2-trifluoromethylphenoxy) biphenyl, 2', 6,6 ' -tetramethyl-4, 4' -bis (4-amino-2-trifluoromethylphenoxy) biphenyl, 2' -bis [4- (4-aminophenoxy) phenyl ] propane, 1, 3-bis (4-aminophenoxy) benzene and 2' -trifluoromethyl-2- One or more of phenylbenzimidazole-6, 4' -diamine, wherein the molar ratio of the first aromatic diamine to the second aromatic diamine is (1-10): (10-1);
the aromatic dianhydride comprises a first aromatic dianhydride and a second aromatic dianhydride, wherein the first aromatic dianhydride is biphenyl tetracarboxylic dianhydride and/or 2,2 '-difluoro-4, 4' biphenyl dianhydride; the second aromatic dianhydride is one or more of pyromellitic dianhydride, 3 ', 4,4' -benzophenone tetracarboxylic dianhydride, 4,4' -thioether dianhydride, diphenyl ether dianhydride and diphenyl sulfone dianhydride, and the molar ratio of the first aromatic dianhydride to the second aromatic dianhydride is (10-0): (0-10), wherein the dosage of the first aromatic dianhydride and the second aromatic dianhydride is not 0 at the same time.
4. The method of claim 2, wherein the adhesion promoter is a silane coupling agent, and the organic solvent is N, N '-dimethylacetamide, N' -dimethylformamide, N-methylpyrrolidone, or dioxane.
5. A no-glue copper clad laminate prepared from the modified polyamic acid resin slurry and the copper foil in claim 1, which is characterized in that: the non-glue copper-clad plate is provided with an insulating layer, wherein the insulating layer is a polyimide film, and the polyimide film has the following structural formula:
Figure FDA0002573664740000031
wherein the content of the first and second substances,
r is H or F;
R1is H or trifluoromethyl;
R2is composed of
Figure FDA0002573664740000032
Figure FDA0002573664740000033
Figure FDA0002573664740000034
One or more of the above;
R3is composed of
Figure FDA0002573664740000035
Figure FDA0002573664740000036
Figure FDA0002573664740000041
One or more of R4Is H or CH3；
The value range of m is 10-6000, and the value range of n is 0-6000.
6. The copper-clad plate according to claim 5, wherein the thickness of the polyimide film is 10 to 30 μm.
7. The copper-clad plate without adhesive according to claim 5, wherein the thickness of the copper foil is 10 to 25 μm.
8. The preparation method of the copper-clad plate without adhesive according to claim 5, which is characterized by comprising the following steps: the method comprises the following steps:
1) spreading a copper foil on a horizontal table of the tape casting coating machine;
2) uniformly mixing the modified polyamide acid resin slurry with an imidization reagent, and then coating the mixture on a copper foil in a flow casting manner;
3) and imidizing the copper foil after tape casting coating.
9. The method for preparing the copper-clad plate without adhesive according to claim 8, wherein the coating speed is 200-300 mm/min.
10. The preparation method of the copper-clad plate without adhesive according to claim 8, wherein the imidization is carried out in three steps, wherein the temperature of the first step is 15-130 ℃, the temperature of the second step is 130-220 ℃, and the temperature of the third step is 220-280 ℃.
CN202010647429.5A 2020-07-07 2020-07-07 Modified polyamide acid resin slurry, preparation method thereof and non-glue copper-clad plate Pending CN111961202A (en)

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WO2022210109A1 (en) * 2021-03-31 2022-10-06 三菱瓦斯化学株式会社 Polyimide resin composition, polyimide precursor composition, varnish, and polyimide film
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