CN111952340A

CN111952340A - Flexible display panel, manufacturing method and electronic equipment

Info

Publication number: CN111952340A
Application number: CN202010769112.9A
Authority: CN
Inventors: 郭天福
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-08-03
Filing date: 2020-08-03
Publication date: 2020-11-17
Anticipated expiration: 2040-08-03
Also published as: CN111952340B

Abstract

The application discloses flexible display panel and manufacturing method, electronic equipment, this flexible display panel includes: the light-emitting diode comprises a base layer, a pixel definition layer, a light-emitting layer and an encapsulation layer, wherein the pixel definition layer is arranged on the base layer, at least one group of isolation columns are arranged on one side of the pixel definition layer, which is far away from the base layer, the light-emitting layer is arranged on one side of the pixel definition layer, which is far away from the base layer, and the encapsulation layer is arranged on one side of the light-emitting layer, which is far away from the base; the distance between the top of each isolation column and the base layer is larger than the distance between one end face, far away from the base layer, of the packaging layer and the base layer, the isolation columns are arranged in the non-light-emitting opening area of the pixel definition layer, and the adjacent isolation columns are arranged at intervals. In this way, the isolated column that this application set up divides into a plurality of regions with the encapsulation layer top layer, and when display panel received folding, the encapsulation layer can alleviate the stress that the encapsulation layer received effectively, can promote display panel's the performance of buckling.

Description

Flexible display panel, manufacturing method and electronic equipment

Technical Field

The present disclosure relates to the field of electronic devices, and in particular, to a flexible display panel, a manufacturing method thereof, and an electronic device.

Background

With the increasing requirements of people on electronic products, especially on display screens of electronic products, the special-shaped screens and the full-face screens gradually step into the visual field of people, and the popularity of the special-shaped screens greatly improves the screen occupation ratio. At present, the use of the flexible screen is also slowly popularized, the flexible screen can enable the display area of the electronic equipment to be adjustable, a large screen can be selected during use, and the flexible screen can be adjusted into a small screen when power is needed to be saved.

The flexible screen can generally be divided into outward folding and inward folding, and each film layer forming the display screen can be subjected to bending stress when the flexible screen is folded, and the normal use of the film layer forming the display screen can be damaged in serious cases.

Disclosure of Invention

The technical problem mainly solved by the application is to provide a flexible display panel, a manufacturing method thereof and electronic equipment, and the bending performance of a flexible screen can be improved.

In order to solve the technical problem, the application adopts a technical scheme that: there is provided a flexible display panel including: a base layer;

the pixel definition layer is arranged on the base layer, and at least one group of isolation columns are arranged on one side, far away from the base layer, of the pixel definition layer;

the light emitting layer is arranged on one side, far away from the base layer, of the pixel defining layer;

the packaging layer is arranged on one side of the light-emitting layer, which is far away from the base layer, and covers the isolation column; wherein,

the distance between the top of each isolation column and the base layer is larger than the distance between one end face, far away from the base layer, of the packaging layer and the base layer, the isolation columns are arranged in the non-light-emitting opening area of the pixel definition layer, and the adjacent isolation columns are arranged at intervals.

In order to solve the above technical problem, another technical solution adopted by the present application is: an electronic device is provided, the electronic device including: the flexible display panel is covered on the shell.

In order to solve the above technical problem, another technical solution adopted by the present application is: a manufacturing method of a flexible display panel is provided, and the manufacturing method of the flexible display panel comprises the following steps: providing a base layer;

arranging a pixel definition layer on the base layer, and arranging at least one group of isolation columns on one side of the pixel definition layer far away from the base layer;

arranging a light emitting layer on one side of the pixel defining layer away from the base layer;

arranging an encapsulation layer on one side of the light-emitting layer far away from the base layer; the distance between the top of the isolation column and the base layer is greater than the distance between one end face, far away from the base layer, of the packaging layer and the base layer, the isolation columns are arranged in the non-light-emitting opening area of the pixel definition layer, and every two adjacent isolation columns are arranged at intervals.

The beneficial effect of this application is: be different from prior art's condition, pixel definition layer surface is located to the insulated column that this application set up, and then luminous layer and packaging layer lid locate on this insulated column, and the distance between isolated column top and the basic unit is greater than the packaging layer and keeps away from a terminal surface of basic unit to the distance of basic unit, also is the insulated column and divide into a plurality of regions with the packaging layer top, and when display panel received folding, the stress that the packaging layer received can be alleviated effectively to the packaging layer, can promote display panel's bending performance.

Drawings

FIG. 1 is a schematic cross-sectional view of an embodiment of a flexible display panel according to the present invention;

FIG. 2 is a schematic cross-sectional view of another embodiment of a flexible display panel according to the present invention;

FIG. 3 is an enlarged schematic view of the structure shown at A in FIG. 2;

FIG. 4 is a schematic structural diagram of a light emitting layer of an embodiment of a flexible display panel according to the present application;

FIG. 5 is a schematic structural diagram of a surface layer of a pixel definition layer and an isolation pillar according to an embodiment of the present disclosure;

FIG. 6 is a schematic structural diagram of a surface layer of a pixel definition layer and an isolation pillar according to another embodiment of the present disclosure;

FIG. 7 is a schematic structural diagram of a surface layer of a pixel definition layer and an isolation pillar according to another embodiment of the present disclosure;

FIG. 8 is a schematic view of a state of an isolation column according to an embodiment of the present application;

FIG. 9 is a schematic view of a state of an isolation column according to another embodiment of the present application;

FIG. 10 is a schematic cross-sectional view of an isolation pillar and an encapsulation layer of an embodiment of a flexible display panel according to the present application;

FIG. 11 is an enlarged schematic view of FIG. 10 at B;

FIG. 12 is a schematic diagram of an embodiment of an electronic device;

FIG. 13 is a schematic overall structure diagram of an embodiment of an electronic device of the present application;

fig. 14 is a flowchart of a method for manufacturing a flexible display panel according to the present application.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

An embodiment of the present application provides an electronic device 90, where the electronic device 90 includes a housing 901 and a flexible display panel 902, where the flexible display panel 902 is disposed on the housing 901 in a covering manner. It will be appreciated that "electronic device 90" (or simply "terminal") as used herein includes, but is not limited to, an apparatus that is configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal", or "electronic device 90". Examples of electronic devices 90 include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A cellular phone is an electronic device 90 equipped with a cellular communication module. The following embodiments are described by taking a mobile phone as an example, but the electronic device 90 is not limited to the mobile phone.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic cross-sectional overall structure diagram of an embodiment of a flexible display panel 902 of the present application, and fig. 2 is a schematic cross-sectional structure diagram of another state of the embodiment of the flexible display panel 902 of the present application. In an embodiment of the present application, flexible display panel 902 is foldable display panel, i.e. can be applied to foldable electronic device 90, and flexible display panel 902 can be including realizing fold-in state or fold-out state, fold-in electronic device 90 and fold-out electronic device 90 in corresponding, be in fold-in state when flexible display panel 902, each rete that corresponds to form display panel also all carries out the infolding, and in the same way, when flexible display panel 902 carries out the infolding, each rete that forms display panel also all carries out the infolding. Therefore, when the flexible display panel 902 moves from the horizontal state to the bending state, each film layer forming the display panel is bent, and the bending region of the display panel is subjected to stress generated by bending. In this application, the flexible display panel 902 includes: a base layer 10, a pixel defining layer 20, a light emitting layer 30, and an encapsulation layer 40. The pixel definition layer 20 is disposed on the base layer 10, at least one set of isolation pillars 50 is disposed on a side of the pixel definition layer 20 away from the base layer 10, the light emitting layer 30 is disposed on a side of the pixel definition layer 20 away from the base layer 10, the encapsulation layer 40 is disposed on a side of the light emitting layer 30 away from the base layer 10 and covers the isolation pillars 50, a distance between tops of the isolation pillars 50 and the base layer 10 is greater than a distance between one end face of the encapsulation layer 40 away from the base layer 10 and the base layer 10, the isolation pillars 50 are disposed in a non-light emitting region of the pixel definition layer 20, and adjacent isolation pillars 50 are disposed at intervals. The isolation pillar 50 can block moisture and oxygen, and when the flexible display panel 902 is provided with the isolation pillar 50, moisture or oxygen which may be inadvertently introduced from the outside may be prevented, and the introduction may include but is not limited to: gaps existing between the flexible display panel 902 and the housing 901 of the electronic device 90, a front camera hole digging area and the like are installed, and the isolation column 50 is arranged to prevent moisture and oxygen from invading into the light emitting film layer in the flexible display panel 902.

The arrangement of the isolation pillars 50 cannot affect the normal light emission of the light emitting layer 30, so the isolation pillars 50 need to be arranged in a non-light emitting region of the light emitting layer 30, for example, when the base layer 10 is the OLED display base layer 10, the light emitting chips are arranged in a matrix, the non-light emitting region is located at a gap position between adjacent light emitting chips, and the non-light emitting regions of the light emitting chips arranged in the matrix are also arranged in a matrix, so when the isolation pillars 50 are arranged, the non-light emitting regions need to be filled and arranged around the non-light emitting regions, for example, the isolation pillars 50 are arranged in the non-light emitting regions of all the light emitting chips, and the isolation. It can be understood that the isolation pillars 50 are not required to be disposed in all the spacers of the light emitting chip, and the number of the isolation pillars 50 is set according to actual needs, and is not limited herein. In an embodiment of the present application, the adjacent isolation pillars 50 are disposed at intervals, so that when the flexible display panel 902 is bent, the top layer of the encapsulation layer 40 is divided into a plurality of regions by the isolation pillars 50, and further when the encapsulation layer 40 is bent, the stress applied to the encapsulation layer 40 is not concentrated, so that the folding performance of the whole flexible display panel 902 is improved.

Referring to fig. 3 and fig. 5, fig. 3 is an enlarged structural view of a portion a shown in fig. 2, and fig. 5 is a structural view of a surface layer of a pixel definition layer 20 and an isolation pillar 50 according to an embodiment of a flexible display panel 902 of the present application. Referring to fig. 3, the bottom end of the isolation pillar 50 is abutted to the pixel defining layer 20, i.e. the isolation pillar 50 is connected to the pixel defining layer 20. In addition, the first inorganic buffer layer 410, the organic layer 430 and the second inorganic buffer layer 420 sequentially cover the isolation pillar 50, and thus water and oxygen hardly penetrate through the isolation pillar 50 to affect the light emitting layer 30. In an embodiment of the present invention, the electronic device 90 is generally square, and the display panel is also square, and the base layer 10 may include a long side and a short side which are oppositely disposed, please refer to fig. 5 for example, but not limited to the shape of fig. 5, that is, the pixel definition layer 20 corresponds to two long sides and a short side disposed adjacent to the long sides. The spacers 50 may be disposed at intervals along the extending direction of the long side and the short side, and further may be divided into a plurality of groups, for example: the number of each group of the isolation columns 50 is 4, and the adjacent isolation columns 50 are arranged at a right angle, so that the four isolation columns 50 form a square. The extending direction of the long side may include a plurality of sets of the pillars 50 arranged in a square shape. For example, in fig. 5, 5 sets of the isolation pillars 50 are arranged in the longitudinal direction, and each set of the isolation pillars 50 includes 4 isolation pillars 50. Similarly, multiple sets of spacers 50 may also extend along the short edge, for example, as shown in fig. 5, 3 sets of spacers 50 are disposed along the short edge, and each set of spacers 50 includes 4 spacers 50. And then a plurality of groups of the isolation columns 50 are arranged in a matrix in the extending direction of the long side and the short side.

In other embodiments, each group of the isolation pillars 50 may also include 1, 2, 6, or 8, and the like, and is disposed along the extending direction of the long side or the short side of the substrate. For example, when the number of the isolation pillars 50 in each group of the isolation pillars 50 is 1, 6 and 4 isolation pillars may be respectively disposed along the extension direction of the long side or the short side of the base layer 10, and the total number of the isolation pillars 50 arranged in a matrix is 24. When the number of the isolation pillars 50 in each group of the isolation pillars 50 is 2, 3 groups and 2 groups of the isolation pillars 50 may be respectively disposed along the extension direction of the long side or the short side of the base layer 10, and the total number of the isolation pillars 50 arranged in a matrix is 24. The arrangement of the isolation pillars 50 and the number of isolation pillars 50 included in each group of isolation pillars 50 need to be determined according to the size of the base layer 10, which is not limited herein. Since the spacers 50 are disposed in the non-light emitting opening region of the pixel defining layer 20, the region where the spacers 50 can be disposed extends along the long or short side of the base layer 10, and thus the spacers 50 are also disposed in parallel with the long or short side of the base layer 10. Specifically, referring to fig. 6 and 7, when the number of each set of pillars 50 is 2, the set may extend along the long side or the short side, and when the set extends along the long side, 5 sets of pillars 50 and 4 sets of short sides may be distributed, although the number is merely illustrative and not limited herein. While extending along the short side, 3 sets of the separator 50 may be distributed, and then 9 sets of the separator 50 may be distributed along the long side. Similarly, fig. 7 is also an illustrative example, and the number of the isolation pillars 50 is not limited.

Referring to fig. 8 and 9, fig. 8 is a schematic structural diagram of a state of an isolation pillar 50 according to an embodiment of the present disclosure, and fig. 9 is a schematic structural diagram of a state of an isolation pillar 50 according to another embodiment of the present disclosure. In one embodiment of the present application, the shape of the isolation pillars 50 is an inverted trapezoid, that is, the area of the cross section of the isolation pillars 50 in a direction parallel to the substrate 10 gradually increases. In other embodiments, the shape of the isolation pillar 50 may also be "i" shaped, "T" shaped, or inverted cone, etc., which can be specifically shown in fig. 8 and 9. It should be noted that, the embodiment illustrated in this application or fig. 8 and fig. 9 is only a partial embodiment thereof, and the shape of the isolation pillar 50 is not limited, as long as the top of the isolation pillar 50 can divide the top layer of the encapsulation layer 40 into a plurality of regions, so that when the encapsulation layer 40 is bent and stressed, the arrangement of the isolation pillar 50 can relieve the stress, so as to improve the bending performance of the whole flexible display panel 902.

In an embodiment of the present application, the isolation pillar 50 may be made of a photoresist, and the shape of the isolation pillar 50 may be obtained through a photolithography process.

Referring to fig. 2 and fig. 4, fig. 4 is a schematic structural diagram of a light emitting layer 30 according to an embodiment of the present disclosure. In an embodiment of the present application, the base layer 10 includes: a glass substrate 110, a substrate 120, an active layer 130, a polysilicon layer 140, and an interlayer dielectric 150. That is, the glass substrate 110 is used as a carrier, the material of the glass substrate 110 may be a single crystal material, or a mixed material substrate such as a sapphire substrate and a silicon carbide substrate, or a material substrate such as a nitride substrate, and the base 120, the active layer 130, the polysilicon layer 140, and the interlayer dielectric 150 are sequentially disposed in a covering manner. The polysilicon layer 140 further includes: a silicon oxide layer 1410 and a silicon nitride layer 1420.

With reference to fig. 4, the light emitting layer 30 includes a hole injection layer 310, a hole transport layer 320, an organic light emitting layer 30, an electron transport layer 330, an electron injection layer 340, and a cathode layer 350. It will be appreciated that an anode layer is also provided adjacent to the hole injection layer 310. The hole injection layer 310 may be made of: CuPc, TiOPc, m-MTDATA, 2-TNATA, etc., and CuPc, TiOPc, m-MTDATA, 2-TNATA are all organic photoconductive materials. The hole transport layer 320 material may be carbazoles, organic amines, and butadiene-based compounds, for example: NPB, PVK, TPH and TAPC. The material of the electron transport layer 330 may be ZnO, or a mixture of ZnO and TiO2 may be used. The material of the electron injection layer 340 may be: yttrium fluoride, and the like. The material of cathode layer 350 may be: ag. Ai, and the like. The material of the anode layer may be: ITO, IZO, Au, Pt, Si, etc. The materials of the light-emitting layer 30 are described above as examples, and the specific material process is not limited herein.

The encapsulation layer 40 includes a first inorganic buffer layer 410 connected to the cathode layer 350, and an organic layer 430 and a second inorganic buffer layer 420 sequentially stacked on the first inorganic buffer layer 410. It should be noted that the first inorganic buffer layer 410 and the second inorganic buffer layer 420 are brittle and are not resistant to bending, so the organic layer 430 is disposed between the first inorganic buffer layer 410 and the second inorganic buffer layer 420 to improve the overall flexibility of the encapsulation layer 40, and further, the stress applied to the encapsulation layer 40 during the bending process of the flexible display panel can be satisfied. It should be noted that the terms "first", "second" and "third" in the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

With reference to fig. 2, fig. 3, fig. 10 and fig. 11, a projection of the first inorganic buffer layer 410 on the base layer 10 is overlapped with a projection of the isolation pillar 50 on the base layer 10. Specifically, referring to fig. 3, that is, the first inorganic buffer layer 410 may form an inorganic water-blocking oxygen film layer on the surface of the light-emitting layer 30 away from the base layer 10 by using an ALD (atomic layer deposition) technique, and corresponds to the first inorganic buffer layer 410, in which the first inorganic buffer layer 410 corresponds to the whole layer area of the display panel, and the first inorganic buffer layer 410, the light-emitting layer 30, the organic layer 430 and the second inorganic buffer layer 420 are stacked. It is also possible to use a mask technology to make the inorganic water-blocking oxide film layer only cover the region where the isolation pillar 50 is located, so that the isolation pillar 50 has water-blocking and oxygen-blocking properties, specifically refer to fig. 11, that is, only cover the isolation pillar 50 and the region around the isolation pillar 50, at this time, the first inorganic buffer layer 410 is surrounded by the organic layer 430, and the top portion abuts against the second inorganic buffer layer 420, it should be noted that the distance G in fig. 11 corresponds to the distance H in fig. 3.

Referring to fig. 2 and fig. 3, fig. 3 is an enlarged schematic view of a portion a shown in fig. 2. In an embodiment of the present application, a distance between an end surface of the second inorganic buffer layer 420 far away from the base layer 10 and the base layer 10 is smaller than a distance between an end surface of the isolation pillar 50 far away from the base layer 10 and the base layer 10. Reference may also be made to the distance H in fig. 3, corresponding to a height difference between the pillars 50 and the second inorganic buffer layer 420. Further, the second inorganic buffer layer 420 is divided into a plurality of buffer regions by the isolation pillars 50, which can be referred to in fig. 5 to 7. When the encapsulation layer 40 is bent, because of the isolation pillars 50, the isolation pillars 50 divide the surface layer of the second inorganic buffer layer 420 into a plurality of regions, and then the stress on the whole encapsulation layer 40 can be relieved when the second inorganic buffer layer 420 is bent, so that the flexibility of the whole flexible display panel 902 can be improved.

Further, please refer to fig. 12 and 13 together, in which fig. 12 is a schematic structural assembly diagram of an embodiment of an electronic device 90 of the present invention, fig. 13 is a schematic overall structural diagram of the embodiment of the electronic device 90 of the present application, the electronic device 90 may be a mobile phone, a tablet computer, a notebook computer, a wearable device, etc., and the embodiment illustrates a mobile phone as an example. The structure of the electronic device 90 may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940, a sensor 950, an audio circuit 960, a wifi module 970, a processor 980, a power supply 990, and the like. Wherein the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected with the processor 980; the power supply 990 is used to supply power to the entire electronic device 90.

Specifically, the RF circuit 910 is used for transmitting and receiving signals; the memory 920 is used for storing data instruction information; the input unit 930 is used for inputting information, and may specifically include a touch panel 931 and other input devices 932 such as operation keys; the display unit 940 may include a display panel 941 (corresponding to the flexible display panel 902); the sensor 950 includes an infrared sensor, a laser sensor, etc. for detecting a user approach signal, a distance signal, etc.; a speaker 961 and a microphone 962 are connected to the processor 980 through the audio circuit 960 for emitting and receiving sound signals; the wifi module 970 is used for receiving and transmitting wifi signals, and the processor 980 is used for processing data information of the electronic device 90. With regard to the related technical features of the camera head assembly, reference is made to the above description of the embodiments of the camera head assembly, and detailed description thereof will not be provided herein.

Referring to fig. 14, fig. 14 is a flowchart of a method for manufacturing a flexible display panel according to the present application. The application also provides a manufacturing method of the flexible display panel, which comprises the following steps:

s110: providing a base layer;

the base layer includes a glass substrate, a substrate, an active layer, a polysilicon layer, and an interlayer dielectric. Namely, the substrate, the active layer, the polycrystalline silicon layer and the interlayer medium are obtained on the glass substrate through evaporation of a polyimide material, CVD (chemical vapor deposition) coating deposition and a semiconductor ELA (electro-luminescent) process. And the polysilicon layer further includes: a silicon oxide layer and a silicon nitride layer. In addition, a PLN layer (planarization layer) is arranged on the side of the interlayer dielectric far away from the base layer.

S120: arranging a pixel definition layer on the base layer, and arranging at least one group of isolation columns on one side of the pixel definition layer far away from the base layer;

the pixel defining layer is arranged on one side of the planarization layer far away from the base layer, namely, the planarization layer is continuously subjected to evaporation and PVD deposition of a metal anode, and then the metal anode is coated, exposed and developed to form the pixel defining layer. And then forming the isolation column on the surface of the pixel definition layer through exposure and development. In an embodiment of the present application, the isolation pillars may be arranged in an inverted trapezoid, adjacent isolation pillars are arranged at intervals, and the distance between the isolation pillars may be greater than 150 micrometers. In other embodiments, the shape of the isolation pillar is not limited, and may be, for example, "i" shaped, "T" shaped, or inverted cone shaped.

S130: arranging a light emitting layer on one side of the pixel defining layer away from the base layer;

the light reflecting layer may include a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, an electron injection layer, and a cathode layer, which are sequentially stacked. Namely, a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, an electron injection layer and a cathode layer are formed on the basis of the pixel definition layer by evaporation. When power is supplied to a proper voltage, the positive hole and the negative charge are combined in the light-emitting layer to generate light, and the primary colors of red, green and blue are generated according to different proportions in sequence to form a basic color.

S140: arranging an encapsulation layer on one side of the light-emitting layer far away from the base layer; the distance between the top of the isolation column and the base layer is greater than the distance between one end face, far away from the base layer, of the packaging layer and the base layer, the isolation columns are arranged in the non-light-emitting opening area of the pixel definition layer, and every two adjacent isolation columns are arranged at intervals.

The encapsulation layer includes: the distance between one end face, far away from the basic unit, of the second inorganic buffer layer and the basic unit is smaller than the distance between one end face, far away from the basic unit, of the isolation column and the basic unit, and then the buffer layers divide the second inorganic buffer layer into a plurality of buffer areas. The first inorganic film layer may cover only the isolation pillar region, that is, the mask is used to make the projection of the first inorganic film layer on the base layer only include the projection of the isolation pillar on the base layer. The first inorganic film layer may cover not only the isolation pillar region, that is, the surface of the light emitting layer away from the base layer and the surface of the isolation pillar may be covered by depositing the film. The first inorganic buffer layer may be made of: al2O3, TiO2 and Zr2O3, and an inorganic water-blocking oxygen film layer is formed, and the thickness of the inorganic water-blocking oxygen film layer can be not more than 200 nm.

The first inorganic buffer layer is covered with an organic layer, the thickness of the organic layer is less than 12 microns, and the material can be acrylic, polycarbonate, silicon-based polymer and the like, which is not limited herein.

On the basis of the organic layer, the second inorganic buffer layer may be continuously covered by using low-temperature PECVD, the thickness may be 1 micrometer, and the material of the second inorganic buffer layer may be: SIN, SiON, etc., thereby making the second inorganic buffer layer have strong water and oxygen resistance. The thickness of the second inorganic buffer layer in the isolation column region needs to be thinner than that in other regions, and then when the buffer layer is bent, the second inorganic buffer layer is in a fracture state in the isolation column region, that is, the distance from the top surface of the isolation column to the base layer is greater than the distance from one end surface, far away from the base layer, of the second inorganic buffer layer to the base layer. That is, the second inorganic buffer layer is used for improving the stress that the whole encapsulated layer received, and the insulated column and the cooperation with the encapsulated layer are used for insulating water oxygen to get into the luminescent layer and then influence the flexible display panel and normally shine.

It should be noted that the terms "comprises" and "comprising," and any variations thereof, in the embodiments of the present application, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or may alternatively include other components or elements inherent to such process, method, article, or apparatus. All directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A flexible display panel, comprising:

a base layer;

2. The flexible display panel according to claim 1, wherein each group of the spacers is at least two, the base layer includes a long side and a short side that are opposite to each other, and the spacers are spaced apart from each other along an extending direction of the long side and the short side of the base layer.

3. The flexible display panel according to claim 2, wherein the number of the spacers in each group is 4, and adjacent spacers in each group are arranged at right angles.

4. The flexible display panel according to claim 3, wherein the extending direction of the adjacent spacers in each group of spacers is parallel to a long side or a short side of the base layer.

5. The flexible display panel of claim 1, wherein the base layer comprises a glass substrate, a substrate, an active layer, a polysilicon layer, and an interlayer dielectric; wherein,

the polysilicon layer includes a silicon oxide layer and a silicon nitride layer.

6. The flexible display panel of claim 1,

the light-emitting layer comprises a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, an electron injection layer and a cathode layer which are sequentially stacked.

7. The flexible display panel of claim 6, wherein the encapsulation layer comprises a first inorganic buffer layer connected to the cathode layer, and an organic layer and a second inorganic buffer layer sequentially stacked on the first inorganic buffer layer.

8. The flexible display panel of claim 7, wherein a projection of the first inorganic buffer layer on the base layer overlaps a projection of the spacers on the base layer.

9. The flexible display panel of claim 8, wherein a distance between an end of the second inorganic buffer layer away from the base layer and the base layer is smaller than a distance between an end of the spacer pillar away from the base layer and the base layer.

10. An electronic device, comprising: a housing and the flexible display panel of any one of claims 1-9, the flexible display panel being disposed over the housing.

11. A method for manufacturing a flexible display panel is characterized by comprising the following steps:

providing a base layer;