CN111952206B - Packaging hardware is used in electronic components production - Google Patents
Packaging hardware is used in electronic components production Download PDFInfo
- Publication number
- CN111952206B CN111952206B CN202010815760.3A CN202010815760A CN111952206B CN 111952206 B CN111952206 B CN 111952206B CN 202010815760 A CN202010815760 A CN 202010815760A CN 111952206 B CN111952206 B CN 111952206B
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- groove
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- hole
- electronic component
- peripheral groove
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67793—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with orientating and positioning by means of a vibratory bowl or track
Abstract
The invention discloses a packaging device for electronic component production, which comprises a bottom plate, a top plate, a first driving piece, a second driving piece and a mounting plate, wherein a plurality of support rods are fixed above the bottom plate, the top plate is fixed at the top ends of the support rods, the first driving piece is installed on one side of the top surface of the bottom plate and horizontally stretches, the second driving piece is installed on the bottom surface of the top plate and longitudinally stretches, the mounting plate is horizontally fixed at the stretching end of the second driving piece, through holes are distributed in a rectangular array manner on the mounting plate, a peripheral groove is formed in the upper end opening of each through hole, a placing groove is formed in one side of the same row of through holes and communicated with the peripheral groove corresponding to the through hole, the packaging device also comprises a lower die and an upper die, the lower die is horizontally fixed above the bottom plate, and a lower die groove corresponding to the through holes is formed in the lower die. The invention has simple structure, is convenient to arrange electronic elements orderly and quickly, puts the electronic elements into the lower die, and simultaneously closes the upper die and the lower die quickly and stably, thereby improving the packaging efficiency of the electronic elements.
Description
Technical Field
The invention relates to the field of electronic elements, in particular to a packaging device for electronic component production.
Background
Fig. 2 is a structural diagram of an electronic component, which includes a chip 111 and pins 112, where the chip 111 is partially cylindrical, and fig. 1 is a schematic diagram of the packaged electronic component, where the chip 111 is wrapped inside a package layer 110, and the pins 112 at two ends are used for connecting with an external element.
During packaging, the chip 111 shown in fig. 2 needs to be placed in a cavity of a packaging mold, a resin material is injected into the cavity, the resin material surrounds the electronic component, and the packaging is completed after the resin material is cooled and solidified. The packaging quantity is dozens or even hundreds of packages at a time for the requirement of scale production.
Before encapsulation, tens or even hundreds of electronic components shown in fig. 2 need to be placed in alignment in the cavity of the encapsulation mold. However, since the electronic components are generally small in size, which is only a few centimeters or even a few millimeters, placing the electronic components in the cavities one by one not only wastes time and labor, but also has a very high requirement on the proficiency of the operator. Each time of packaging, dozens or even hundreds of electronic elements are arranged and aligned in sequence, which consumes long time and has low efficiency. And the existing arrangement and alignment method has high requirements on the eyesight of operators and great damage to the eyesight, so that the labor intensity is high, and the production cost of enterprises is increased. For the use requirement of encapsulation, the encapsulation mould is made of stainless steel materials, and the thickness of the encapsulation mould is thick, so that the encapsulation mould is heavy. When an operator moves the packaging mold, both hands are often needed to exert force, the operation is not simple enough, and a large amount of manpower is consumed.
Disclosure of Invention
The present invention is directed to a packaging apparatus for electronic component production, which solves the above problems of the related art.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides an electron components and parts production is with packaging hardware, includes bottom plate, roof, first driving piece, second driving piece and mounting panel, the bottom plate top is fixed with many spinal branchs vaulting pole, the top at many spinal branchs vaulting pole is fixed to the roof, and top surface one side and the level at the bottom plate are installed to first driving piece and are stretched out and drawn back, and the second driving piece is installed in the bottom surface of roof and vertically stretches out and draws back.
The mounting panel level is fixed in the flexible end of second driving piece, and rectangular array distributes on the mounting panel has the through-hole, and the last port department of through-hole sets up the peripheral groove, and sets up the standing groove with one side of going through-hole, and the standing groove link up with the peripheral groove that corresponds through-hole department.
Still including lower mould and last mould, the lower mould level is fixed in the top of bottom plate, sets up the lower type groove that corresponds with the through-hole on the lower mould, go up the mould level and locate the bottom plate top, go up the mould bottom surface and distribute the last type groove that corresponds with lower type groove, the bottom mounting of going up the mould has a plurality of movable rods, the equal activity of bottom of every movable rod is pegged graft and is had the sliding seat, and sliding seat horizontal sliding connects on the bottom plate, and the installation is used for driving the vertical flexible third driving piece of movable rod in the sliding seat, and one of them sliding seat is connected with the flexible end of first driving piece.
Furthermore, the through hole is communicated with the peripheral groove, the groove bottom of the peripheral groove is obliquely arranged, and the bottom end of the peripheral groove is located at the connecting position of the through hole and the side wall of the through hole.
Furthermore, the longitudinal section of the peripheral groove is in a right-angled triangle shape, and the bevel edge of the peripheral groove is used as the bottom of the peripheral groove.
Further, a slot is seted up to the bottom level of mounting panel, and the slot internalization is inserted and is equipped with the picture peg, and the picture peg can cut off all through-holes on the mounting panel, and the outer end of picture peg stretches out slot and fixedly connected with end plate, and the end plate passes through set screw and can dismantle with the mounting panel and be connected.
Furthermore, the first driving part, the second driving part and the third driving part are all electric push rods.
Furthermore, the bottom surface edge of mounting panel sets up annular cardboard, and second driving piece drive mounting panel moves down, and the lower mould can inlay and locate between the cardboard, and each through-hole communicates with the lower type groove that corresponds.
Furthermore, a through hole is formed at the bottom of the lower groove of the lower die, so that a pin of the electronic component can penetrate through the through hole.
Further, the depth of the groove bottom of the placing groove is equal to half of the depth of the groove bottom of the peripheral groove.
Furthermore, the upper die is provided with a filling port, and the filling port is communicated with the inner part of each upper groove.
The invention has the beneficial effects that:
according to the electronic component packaging device, the mounting plate independent of the packaging mold is additionally arranged, and the mounting plate can be used for placing a plurality of electronic elements randomly placed on the mounting plate on the lower mold one by one after vibration. After the electronic elements enter the through holes, the electronic elements which cannot enter the through grooves are picked out, and whether the electronic elements falling into the through grooves are orderly arranged is sequentially checked. After the electronic elements falling into the through holes are arranged in order, the mounting plate is placed on the lower die, the inserting plate is pulled out, and the electronic elements in the through holes fall into the lower groove of the lower die.
The mounting plate can be arranged according to the use requirement, and the vibration of the mounting plate does not need to pay much labor, so that a plurality of electronic elements fall into the through holes to be arranged and aligned, the time required by arranging the electronic elements in each set of die is greatly reduced, and the labor efficiency is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention and do not constitute a limitation of the invention. In the drawings:
FIG. 1 is a diagram of a packaged electronic component according to the present invention;
FIG. 2 is a diagram of an electronic component before packaging according to the present invention;
FIG. 3 is a schematic view of the overall structure of the present invention;
FIG. 4 is a schematic top view of the lower mold of the present invention;
FIG. 5 is a schematic view of the top surface of the mounting plate of the present invention;
FIG. 6 is a cross-sectional view of a mounting plate of the present invention;
FIG. 7 is a schematic cross-sectional view of the mounting plate and lower die of the present invention as mated.
In the figure: the package layer 110, the chip 111, the pins 112, the lower mold 200, the lower mold 210, the through holes 211, the mounting plate 300, the through holes 310, the peripheral groove 311, the placement groove 312, the clamping plate 313, the insertion plate 400, the end plate 410, the fixing screws 411, the bottom plate 500, the top plate 510, the support rod 511, the first driving element 512, the second driving element 513, the fixing plate 600, the movable rod 611, the third driving element 612, the movable seat 613, and the upper mold 700.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment is as follows:
referring to fig. 1 to 7, an electronic component production packaging device includes a bottom plate 500, a top plate 510, a first driving member 512, a second driving member 513 and a mounting plate 300, wherein a plurality of support rods 511 are fixed above the bottom plate 500, the top plate 510 is fixed at the top ends of the plurality of support rods 511, the first driving member 512 is installed on one side of the top surface of the bottom plate 500 and horizontally extends and retracts, and the second driving member 513 is installed on the bottom surface of the top plate 510 and longitudinally extends and retracts.
The electronic component used for packaging in the device comprises a chip 111 and a pin 112, and finally, a packaging layer 110 is coated on the outer side of the chip 111 for use.
The flexible end at second driving piece 513 is fixed to mounting panel 300 level, make mounting panel 300 can vertically stretch out and draw back, in order to make things convenient for and lower mould 200 contact or separation, and the outside mountable vibrator of mounting panel 300, in order to make mounting panel 300 produce the vibration, make the electronic component vibration of placing in standing groove 312 fall into each peripheral groove 311, enter into through-hole 310 at last, after vibrating for a period, whether all fall into electronic component in each through-hole 310 of manual work inspection, the gap is examined and the mending is leaked, make an electronic component all insert in each through-hole, rectangular array distributes on mounting panel 300 has through-hole 310, peripheral groove 311 is seted up to the last port department of through-hole 310, and one side of same line of through-hole 310 sets up standing groove 312, standing groove 312 link up with the peripheral groove 311 that corresponds through-hole 310 department.
In a preferred embodiment of the present invention, the through hole 310 is communicated with the peripheral groove 311, the bottom of the peripheral groove 311 is inclined, and the bottom of the peripheral groove 311 is located at the connection position with the side wall of the through hole 310.
In order to enable the peripheral groove 311 to guide the electronic component into the through hole 310, the longitudinal section of the peripheral groove 311 is in a right triangle shape, and the oblique side thereof is the bottom of the peripheral groove 311.
Further, a slot is horizontally formed in the bottom end of the mounting plate 300, a plug board 400 is movably inserted in the slot, the plug board 400 can separate all through holes 310 in the mounting plate 300, the outer end of the plug board 400 extends out of the slot and is fixedly connected with an end plate 410, and the end plate 410 is detachably connected with the mounting plate 300 through a fixing screw 411.
Since one electronic component is inserted into each through hole 310 on the mounting plate in the above steps, after the end plate 410 is pulled out, the electronic component in each through hole 301 falls into the lower groove in the lower mold 200, and the pins 112 in the electronic component penetrate through the through holes 211, so that the chip body is located in the lower groove.
The die comprises a lower die 200 and an upper die 700, wherein the lower die 200 is horizontally fixed above a bottom plate 500, a lower groove 210 corresponding to a through hole 310 is formed in the lower die 200, the upper die 700 is horizontally arranged above the bottom plate 500, upper grooves corresponding to the lower groove 210 are distributed on the bottom surface of the upper die 700, the upper die 700 is fixed at the bottom of a fixing plate 600, a plurality of movable rods 611 are fixed at the bottom end of the fixing plate 600, a movable seat 613 is movably inserted into the bottom end of each movable rod 611, the movable seat 613 is horizontally and slidably connected to the bottom plate 500, a third driving piece 612 used for driving the movable rods 611 to longitudinally extend and retract is installed in the movable seat 613, and one movable seat 613 is connected with the extending end of the first driving piece 512.
In a preferred embodiment of the present disclosure, the first driving member 512, the second driving member 513 and the third driving member 612 are all electric push rods.
As a further improvement of the scheme, the bottom edge of the mounting plate 300 is provided with an annular clamping plate 313, the second driving member 513 drives the mounting plate 300 to move downwards, the lower mold 200 can be embedded between the clamping plates 313, and each through hole 310 is communicated with the corresponding lower mold groove 210.
The bottom of the lower groove 210 of the lower mold 200 is provided with a through hole 211 for the pin 112 of the electronic component to pass through.
In order to facilitate the electronic component to enter the peripheral groove 311 smoothly under vibration, the bottom depth of the placement groove 312 is equal to half of the depth of the bottom of the peripheral groove 311.
In order to facilitate the packaging operation of the electronic component, the upper die 700 is provided with a material injection port, and the material injection port is communicated with the inside of each upper groove.
After an electronic component is installed in the lower groove in each lower die 200, the second driving part 513 drives the mounting plate 300 to move upwards, then the first driving part drives the fixing plate 600 to move horizontally, so that the upper die 700 is just positioned above the lower die, then the third driving part 612 works, so that the upper die 700 is in close contact with the upper part of the lower die 200, the upper groove on the upper die 700 and the lower groove on the lower die 200 are correspondingly communicated, pins in the electronic component extend out of the upper groove, resin is injected into a cavity formed by matching each upper groove and each lower groove through a filling port, after cooling forming, the upper die and the lower die are separated, and finally each packaged electronic component is taken out.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides an electron components and parts production is with packaging hardware which characterized in that: the telescopic support comprises a bottom plate (500), a top plate (510), a first driving part (512), a second driving part (513) and a mounting plate (300), wherein a plurality of support rods (511) are fixed above the bottom plate (500), the top plate (510) is fixed at the top ends of the support rods (511), the first driving part (512) is installed on one side of the top surface of the bottom plate (500) and horizontally stretches, and the second driving part (513) is installed on the bottom surface of the top plate (510) and longitudinally stretches;
the mounting plate (300) is horizontally fixed at the telescopic end of the second driving piece (513), through holes (310) are distributed on the mounting plate (300) in a rectangular array mode, a peripheral groove (311) is formed in the upper port of each through hole (310), a placing groove (312) is formed in one side of each through hole (310) in the same row, and the placing grooves (312) are communicated with the peripheral grooves (311) corresponding to the through holes (310);
the die comprises a bottom plate (500), a lower die (200) and an upper die (700), wherein the lower die (200) is horizontally fixed above the bottom plate (500), a lower groove (210) corresponding to the through hole (310) is formed in the lower die (200), the upper die (700) is horizontally arranged above the bottom plate (500), an upper groove corresponding to the lower groove (210) is distributed on the bottom surface of the upper die (700), a plurality of movable rods (611) are fixed at the bottom end of the upper die (700), a movable seat (613) is movably inserted at the bottom end of each movable rod (611), the movable seat (613) is horizontally and slidably connected to the bottom plate (500), a third driving piece (612) used for driving the movable rods (611) to longitudinally stretch and retract is installed in the movable seat (613), and one movable seat (613) is connected with the stretching end of the first driving piece (512);
the through hole (310) is communicated with the peripheral groove (311), the groove bottom of the peripheral groove (311) is obliquely arranged, and the bottom end of the peripheral groove (311) is positioned at the connecting position of the through hole and the side wall of the through hole (310).
2. The packaging apparatus for electronic component production as claimed in claim 1, wherein: the longitudinal section of the peripheral groove (311) is in a right-angled triangle shape, and the bevel edge of the peripheral groove is used as the groove bottom of the peripheral groove (311).
3. The packaging apparatus for electronic component production as claimed in claim 2, wherein: a slot is seted up to the bottom level of mounting panel (300), and slot internalization is inserted and is equipped with picture peg (400), and picture peg (400) can cut off all through-holes (310) on mounting panel (300), and the slot is stretched out to the outer end of picture peg (400) to fixedly connected with end plate (410), and end plate (410) can be dismantled with mounting panel (300) through set screw (411) and be connected.
4. The packaging device for electronic component production according to claim 1, wherein: the first driving part (512), the second driving part (513) and the third driving part (612) are all electric push rods.
5. A packaging apparatus for electronic component production according to claim 3, wherein: the bottom surface edge of mounting panel (300) sets up annular cardboard (313), and second driving piece (513) drive mounting panel (300) move down, and lower mould (200) can inlay and locate between cardboard (313), and each through-hole (310) and the lower type groove (210) intercommunication that corresponds.
6. The packaging apparatus for electronic component production as claimed in claim 1, wherein: and a through hole (211) is formed at the bottom of a lower groove (210) of the lower die (200) for a pin (112) of the electronic component to penetrate out.
7. The packaging apparatus for electronic component production as claimed in claim 1, wherein: the depth of the bottom of the placing groove (312) is equal to half of the depth of the bottom of the peripheral groove (311).
8. A packaging apparatus for electronic component production as claimed in any one of claims 1 to 7, wherein: the upper die (700) is provided with a material injection port, and the material injection port is communicated with the inner parts of the upper grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010815760.3A CN111952206B (en) | 2020-08-14 | 2020-08-14 | Packaging hardware is used in electronic components production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010815760.3A CN111952206B (en) | 2020-08-14 | 2020-08-14 | Packaging hardware is used in electronic components production |
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| CN111952206A CN111952206A (en) | 2020-11-17 |
| CN111952206B true CN111952206B (en) | 2022-09-13 |
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| JP2006211887A (en) * | 2005-01-24 | 2006-08-10 | Mitsui High Tec Inc | Resin sealing apparatus of permanent magnet |
| JP2012138447A (en) * | 2010-12-27 | 2012-07-19 | Apic Yamada Corp | Preheater and resin sealing device with it |
| CN102903643A (en) * | 2012-07-07 | 2013-01-30 | 上海鼎虹电子有限公司 | Electronic component packaging device |
| KR20160093366A (en) * | 2015-01-29 | 2016-08-08 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor package and manufacturing method thereof |
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| CN111952206A (en) | 2020-11-17 |
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