CN111949247A

CN111949247A - Module packaging method and system

Info

Publication number: CN111949247A
Application number: CN202010826467.7A
Authority: CN
Inventors: 杨翰文; 牛珍珍; 李建平; 卢鑫悦; 武奔; 席昊艳; 黄乾; 张言涛; 戴悦; 蔡鹏�; 刘家俊; 付越; 孙洪伟
Original assignee: Beijing Yilanqunzhi Data Technology Co ltd
Current assignee: Beijing Yilanqunzhi Data Technology Co ltd
Priority date: 2020-08-17
Filing date: 2020-08-17
Publication date: 2020-11-17

Abstract

The invention provides a module packaging method and a packaging system, wherein the module packaging method comprises the following steps: the functional modules at the front end and the rear end of the package form an integral module; extracting a data layer interface and an interaction layer interface of the integral module to form a data terminal positioned on the data layer and an action terminal positioned on the interaction layer; and encapsulating the data terminal and the action terminal, and performing attribute mapping on the data layer interface, the interaction layer interface, the data terminal and the action terminal. The module packaging method can carry out black box packaging on the module independent in language development and function development, can carry out uniform full stack packaging on the front end and the rear end of the module, and can carry out uniform management and maintenance on the module in independent module installation and deployment and combined integrated deployment.

Description

Module packaging method and system

Technical Field

The invention relates to the technical field of module packaging, in particular to a module packaging method and a module packaging system.

Background

The existing module packaging mode mainly exists in the packaging of a single language or a technical system, such as a package mechanism in java, an npm package mechanism in nodejs, and the like. From the perspective of front-end and back-end layering, the existing packaging technology mainly packages a front-end module or a back-end module separately, and the packaging method and the packaging idea are often completely different.

The existing module packaging technology is packaging with codes as dimensions, and the code development specification of a module needs to be agreed before development so as to facilitate packaging; for the developed module, if the module needs to be packaged according to the specification, the module needs to be reconstructed, and the workload is large. Especially, after the front and rear end modules are respectively packaged, the joint debugging cost in the module multiplexing process is also high.

In view of the above, the present invention is particularly proposed.

Disclosure of Invention

In view of this, the present invention discloses a module packaging method and a packaging system for implementing the module packaging method, so as to implement more convenient management and maintenance of modules.

Specifically, the invention is realized by the following technical scheme:

in a first aspect, the present invention discloses a module packaging method, including:

the functional modules at the front end and the rear end of the package form an integral module;

extracting a data layer interface and an interaction layer interface of the integral module to form a data terminal positioned on the data layer and an action terminal positioned on the interaction layer;

and encapsulating the data terminal and the action terminal, and performing attribute mapping on the data layer interface, the interaction layer interface, the data terminal and the action terminal.

In a second aspect, the present invention discloses a module packaging system, comprising: the assembling unit is used for packaging the functional modules at the front end and the rear end to form an integral module;

the function forming unit is used for extracting a data layer interface and an interaction layer interface of the whole module to form a data terminal positioned on the data layer and an action terminal positioned on the interaction layer;

and the encapsulation mapping unit is used for encapsulating the data terminal and the action terminal and performing attribute mapping on the data layer interface, the interaction layer interface, the data terminal and the action terminal.

In a third aspect, the invention discloses a computer readable storage medium having stored thereon a computer program which, when executed by a processor, performs the steps of the method according to the first aspect.

In a fourth aspect, the invention discloses a computer device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing the steps of the method according to the first aspect when executing the program.

The module packaging method and the module packaging system provided by the embodiment of the invention can realize black box packaging of independent development languages and functions of the module, can uniformly package the front end and the rear end of the module in a full stack mode, and can realize the subsequent uniform management and maintenance of the module in independent installation deployment and combined integrated deployment of the module.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:

fig. 1 is a schematic flow chart illustrating a module packaging method according to an embodiment of the present invention;

FIG. 2 is a flow chart illustrating another module packaging method according to an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of a module packaging system according to an embodiment of the present invention;

FIG. 4 is a detailed operation diagram of the step S1 in the flowchart of FIG. 2;

FIG. 5 is a detailed operation diagram of the step S21 in the flowchart of FIG. 2;

FIG. 6 is a detailed operation diagram of the step S31 in the flowchart of FIG. 2;

FIG. 7 is a detailed operation diagram of the step S22 in the flowchart of FIG. 2;

FIG. 8 is a detailed operation diagram of the step S32 in the flowchart of FIG. 2;

FIG. 9 is a detailed operation diagram of the step S4 in the flowchart of FIG. 2;

fig. 10 is a schematic structural diagram of a computer device according to an embodiment of the present invention.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.

The invention discloses a module packaging method, which comprises the following steps:

The invention provides a module packaging method, which aims to solve the technical problems that the packaging method can be directly assembled into a whole stack module with uniform front and back ends, so that a large amount of workload is saved, and the calling error rate is reduced.

Fig. 1 is a schematic flow chart of a module packaging method according to an embodiment of the present invention, and referring to fig. 1, the method includes the following steps:

and S1, packaging the front and rear functional modules to form an integral module.

Firstly defining a packaged module, and then packaging front and back end codes to form an integral module, wherein the integral module contains a set of various functional modules required by a user.

And S2, extracting a data layer interface and an interaction layer interface of the whole module to form a data terminal positioned on the data layer and an action terminal positioned on the interaction layer.

In the step S2, data layer interfaces and exposable interactions are defined, and extracted to form data class terminals located in the data layer and action class terminals located in the interaction layer.

This step may be carried out in two sub-steps:

and S21, extracting the data interface of the whole module to form a data terminal positioned in the data layer.

And S22, extracting the interface of the interaction layer of the whole module to form an action terminal positioned on the interaction layer.

The operation processes of the two steps S21 and S22 are not sequentially divided.

Preferably, the data terminals include two types of terminals for receiving data and outputting data.

Preferably, the action type terminal comprises a method providing terminal and a method triggering terminal.

And S3, encapsulating the data terminal and the action terminal, and performing attribute mapping on the data layer interface, the interaction layer interface, the data terminal and the action terminal.

In the step S3, the procedure proceeds according to two substeps:

and S31, encapsulating the data terminal of the module, and mapping the data layer interface and the data terminal.

S32, the action class terminal is packaged, and the interaction method, path, and the like are mapped to the action class terminal.

The operation processes of the two steps S31 and S32 are not sequentially divided.

The optimal operation mode is carried out according to the following steps, as shown in FIG. 2:

In the method, the data layer terminal can only be connected with the data layer terminal, and the action terminal can only be connected with the action terminal.

Further, the following operation steps are included subsequently:

and S4, independent installation and deployment of the modules.

The packaging method is one link of a system required by a client, and specifically, the whole process of manufacturing the system comprises the following steps:

1) defining a universal packaging mode for minimally modifying the source code of an original module, uniformly packaging the front end and the rear end of a functional module, enabling the functional modules to be spliced with each other in a uniform interface mode, storing the packaged modules in a package management tool in the form of a mirror image and a resource description file by using a container arrangement technology, and issuing the packaged modules to a visual system design tool;

2) in a system design tool, splicing the associated function modules in a visual mode, and finally integrating a plurality of modules into a new application system;

3) setting the whole frame content of the new system, such as a system LOGO, a menu, a user mode and the like, and forming a complete and available system;

4) compiling modules in a system design tool and system frame source data to generate a configuration file required for deployment in an operation and maintenance system, publishing the configuration file to a DevOps operation and maintenance automation platform, realizing re-horizontal layering of a front end and a back end in the compiling process by utilizing a resource deployment technology and a dependence management tool in a container technology system, and performing re-arranging treatment on repeated service dependence;

5) and automatically deploying on a DevOps platform to finally obtain an operable system.

The integration step is already referred to in the previous patent documents, and will not be described in detail herein, and the encapsulation method of the present invention mainly introduces the method for encapsulating the module in step 1).

Fig. 3 is a schematic structural diagram of a packaging system disclosed in the present invention, and referring to fig. 3, the system includes:

an assembling unit 101 for packing the front and rear functional modules to form an integral module;

a function forming unit 102, configured to extract a data layer interface and an interaction layer interface of the whole module to form a data terminal located in the data layer and an action terminal located in the interaction layer;

and the encapsulation mapping unit 103 is configured to encapsulate the data class terminal and the action class terminal, and perform attribute mapping on the data layer interface, the interaction layer interface, the data class terminal, and the action class terminal.

Preferably, the system further comprises an integration unit 104, which is used for installing and deploying the whole module to realize application as a separate system.

The specific operation processes of fig. 4-9 are respectively detailed and exploded for the whole packaging method of fig. 2.

Fig. 10 is a schematic structural diagram of a computer device disclosed by the invention. Referring to fig. 10, the computer apparatus includes: an input device 63, an output device 64, a memory 62 and a processor 61; the memory 62 for storing one or more programs; when the one or more programs are executed by the one or more processors 61, the one or more processors 61 are caused to implement a method of encapsulating a module as provided in the above embodiments; the input device 63, the output device 64, the memory 62 and the processor 61 may be connected by a bus or other means, and fig. 10 illustrates the connection by the bus as an example.

The memory 62 is a computer readable and writable storage medium, and can be used for storing a software program, a computer executable program, and program instructions corresponding to a packaging method according to an embodiment of the present application; the memory 62 may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required for at least one function; the storage data area may store data created according to use of the device, and the like; further, the memory 62 may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other non-volatile solid state storage device; in some examples, the memory 62 may further include memory located remotely from the processor 61, which may be connected to the device over a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.

The input device 63 is operable to receive input numeric or character information and to generate key signal inputs relating to user settings and function control of the apparatus; the output device 64 may include a display device such as a display screen.

The processor 61 executes various functional applications of the device and data processing by executing software programs, instructions, and modules stored in the memory 62.

The computer device provided above can be used to execute the packaging method provided in the above embodiments, and has corresponding functions and advantages.

Embodiments of the present application also provide a storage medium containing computer-executable instructions, which when executed by a computer processor, are used to perform a method of encapsulating a module as provided in the above embodiments, the storage medium being any of various types of memory devices or storage devices, the storage medium including: mounting media such as CD-ROM, floppy disk, or tape devices; computer system memory or random access memory such as DRAM, DDR RAM, SRAM, EDO RAM, Lanbas (Rambus) RAM, etc.; non-volatile memory such as flash memory, magnetic media (e.g., hard disk or optical storage); registers or other similar types of memory elements, etc.; the storage medium may also include other types of memory or combinations thereof; in addition, the storage medium may be located in a first computer system in which the program is executed, or may be located in a different second computer system connected to the first computer system through a network (such as the internet); the second computer system may provide program instructions to the first computer for execution. A storage medium includes two or more storage media that may reside in different locations, such as in different computer systems connected by a network. The storage medium may store program instructions (e.g., embodied as a computer program) that are executable by one or more processors.

Of course, the storage medium provided in the embodiments of the present application contains computer-executable instructions, and the computer-executable instructions are not limited to the method for packaging a module described in the above embodiments, and may also perform related operations in a module packaging method provided in any embodiments of the present application.

Finally, it should be noted that: while this specification contains many specific implementation details, these should not be construed as limitations on the scope of any invention or of what may be claimed, but rather as descriptions of features specific to particular embodiments of particular inventions. Certain features that are described in this specification in the context of separate embodiments can also be implemented in combination in a single embodiment. In other instances, features described in connection with one embodiment may be implemented as discrete components or in any suitable subcombination. Moreover, although features may be described above as acting in certain combinations and even initially claimed as such, one or more features from a claimed combination can in some cases be excised from the combination, and the claimed combination may be directed to a subcombination or variation of a subcombination.

Similarly, while operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. In some cases, multitasking and parallel processing may be advantageous. Moreover, the separation of various system modules and components in the embodiments described above should not be understood as requiring such separation in all embodiments, and it should be understood that the described program components and systems can generally be integrated together in a single software product or packaged into multiple software products.

Thus, particular embodiments of the subject matter have been described. Other embodiments are within the scope of the following claims. In some cases, the actions recited in the claims can be performed in a different order and still achieve desirable results. Further, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some implementations, multitasking and parallel processing may be advantageous.

The above description is only exemplary of the present disclosure and should not be taken as limiting the disclosure, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present disclosure should be included in the scope of the present disclosure.

Claims

1. A method of encapsulating a module, the method comprising:

2. The method for packaging a module according to claim 1, wherein the data-class terminals include both terminals for receiving data and terminals for outputting data.

3. The method for packaging a module according to claim 1, wherein the action-type terminals include both method-providing terminals and method-triggering terminals.

4. The module packaging method according to claim 1, characterized in that, the data interface of the whole module is extracted to form the data terminal on the data layer, and then packaging and attribute mapping are performed;

and extracting the interface of the interaction layer of the whole module to form an action terminal positioned on the interaction layer, and then packaging and mapping the attributes.

5. The method for encapsulating modules according to claim 1, wherein the interface of the interaction layer of the whole module is extracted to form the action terminal located at the interaction layer, and then encapsulation and attribute mapping are performed;

and extracting a data interface of the whole module to form a data terminal positioned on the data layer, and then packaging and mapping the attributes.

6. The method of packaging a module of claim 1, further comprising the steps of: and installing and deploying the integral module to realize application as a separate system.

7. A packaging system for implementing a module package, comprising:

the assembling unit is used for packaging the functional modules at the front end and the rear end to form an integral module;

8. The packaging system of claim 7, further comprising an integration unit for installation and deployment of the monolithic module for application as a stand-alone system.

9. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method according to any one of claims 1 to 6.

10. A computer device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the steps of the method according to any of claims 1-6 are implemented when the processor executes the program.