CN111949247A - A module packaging method and packaging system - Google Patents

Abstract

The present invention provides a module encapsulation method and encapsulation system. The module encapsulation method includes: packaging the front and rear function modules to form an integral module; extracting the data layer interface and the interaction layer interface of the integral module to form an integrated module in the data layer The data type terminal and the action type terminal located in the interaction layer; encapsulate the data type terminal and the action type terminal, and do attribute mapping for the data layer interface, interaction layer interface, data type terminal, and action type terminal . The module encapsulation method of the present invention can encapsulate the modules in a black box irrespective of development language and functions, and can encapsulate the front and back ends of the modules in a unified full stack, and can manage and maintain the modules in the independent installation and deployment of the modules and the integrated deployment of the modules. .

Description

A module packaging method and packaging system

technical field

The present invention relates to the technical field of module packaging, and in particular, to a module packaging method and packaging system.

Background technique

Existing module encapsulation methods mainly exist in the encapsulation of a single language or technical system, such as the package mechanism in java and the npm package mechanism in nodejs. From the perspective of front-end and back-end layering, the existing encapsulation technologies are mainly separate encapsulation of front-end modules or back-end modules, often with completely different encapsulation methods and ideas.

Existing module encapsulation technologies are all encapsulation in the dimension of code. Before development, it is necessary to agree on the code development specification of the module for encapsulation; for the developed module, if it needs to be encapsulated according to the specification, it needs to be refactored, and the workload is very large. . Especially after the front-end and back-end modules are encapsulated separately, the cost of joint debugging in the process of module reuse is also very high.

In view of this, the present invention is proposed.

SUMMARY OF THE INVENTION

In view of this, the present invention discloses a module packaging method and a packaging system for implementing the above-mentioned module packaging method, so as to realize more convenient management and maintenance of modules.

Specifically, the present invention is achieved through the following technical solutions:

In a first aspect, the present invention discloses a module packaging method, the method comprising:

The functional modules of the front and back ends of the packaging form an overall module;

Extracting the data layer interface and the interaction layer interface of the overall module to form a data type terminal located in the data layer and an action type terminal located in the interaction layer;

The data type terminal and the action type terminal are encapsulated, and attribute mapping is performed on the data layer interface, the interaction layer interface, the data type terminal, and the action type terminal.

In a second aspect, the present invention discloses a module packaging system, comprising: an assembly unit for packaging the front and rear functional modules to form an integral module;

a function forming unit for extracting the data layer interface and the interaction layer interface of the overall module to form a data class terminal located in the data layer and an action class terminal located in the interaction layer;

The encapsulation and mapping unit is configured to encapsulate the data type terminal and the action type terminal, and perform attribute mapping for the data layer interface, interaction layer interface, data type terminal and action type terminal.

In a third aspect, the present invention discloses a computer-readable storage medium on which a computer program is stored, and when the program is executed by a processor, implements the steps of the method according to the first aspect.

In a fourth aspect, the present invention discloses a computer device, comprising a memory, a processor, and a computer program stored in the memory and running on the processor, the processor implements the program described in the first aspect when the processor executes the program steps of the method.

The module packaging method and packaging system provided by the embodiments of the present invention can realize black box packaging of modules irrespective of development language and functions, and can perform unified full-stack packaging of the front and rear ends of the modules, so as to realize subsequent independent installation of the modules. The unified management and maintenance of modules in deployment and combination integration deployment is convenient, easy to operate, and easy to implement. The packaged overall module can be used as a separate system, or it can be further deployed in combination with other modules to form a multi-functional module. This encapsulation method lays a good foundation for the subsequent realization of code-free reorganization of distributed architecture applications and systems.

Description of drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are for the purpose of illustrating preferred embodiments only and are not to be considered limiting of the invention. Also, the same components are denoted by the same reference numerals throughout the drawings. In the attached image:

1 is a schematic flowchart of a module packaging method according to an embodiment of the present invention;

2 is a schematic flowchart of another module packaging method according to an embodiment of the present invention;

3 is a schematic structural diagram of a module packaging system according to an embodiment of the present invention;

Fig. 4 is the concrete operation schematic diagram of S1 step in the process flow of Fig. 2;

Fig. 5 is the concrete operation schematic diagram of step S21 in the process flow of Fig. 2;

Fig. 6 is the concrete operation schematic diagram of step S31 in the process flow of Fig. 2;

Fig. 7 is the concrete operation schematic diagram of step S22 in the process flow of Fig. 2;

Fig. 8 is the concrete operation schematic diagram of step S32 in the flow chart of Fig. 2;

Fig. 9 is the concrete operation schematic diagram of S4 step in the process flow of Fig. 2;

FIG. 10 is a schematic structural diagram of a computer device according to an embodiment of the present invention.

Detailed ways

Exemplary embodiments will be described in detail herein, examples of which are illustrated in the accompanying drawings. Where the following description refers to the drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the illustrative examples below are not intended to represent all implementations consistent with this disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present disclosure as recited in the appended claims.

The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to limit the present disclosure. As used in this disclosure and the appended claims, the singular forms "a," "the," and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It will also be understood that the term "and/or" as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

It should be understood that although the terms first, second, third, etc. may be used in this disclosure to describe various pieces of information, such information should not be limited by these terms. These terms are only used to distinguish the same type of information from each other. For example, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information, without departing from the scope of the present disclosure. Depending on the context, the word "if" as used herein can be interpreted as "at the time of" or "when" or "in response to determining."

The invention discloses a method for encapsulating a module, the method comprising:

The functional modules of the front and back ends of the packaging form an overall module;

Extracting the data layer interface and the interaction layer interface of the overall module to form a data type terminal located in the data layer and an action type terminal located in the interaction layer;

The data type terminal and the action type terminal are encapsulated, and attribute mapping is performed on the data layer interface, the interaction layer interface, the data type terminal, and the action type terminal.

It is precisely because the encapsulation of the software in the prior art is based on the same language, so in the subsequent development process, a large amount of development work on the source code can be implemented, the workload is large, and it is easy to make mistakes. To solve the above technical problems, a module packaging method is provided. By adopting the packaging method, a full-stack module with unified front and back ends can be directly assembled, which saves a lot of work and reduces the error rate of calls.

FIG. 1 is a schematic flowchart of a method for packaging a module disclosed in an embodiment of the present invention. Referring to FIG. 1 , the method includes the following steps:

S1. The functional modules of the front and back ends of the packaging form an integral module.

First define the encapsulated module, and then package the front-end and back-end codes to form an overall module, which contains a collection of various functional modules required by the user.

S2. Extract the data layer interface and the interaction layer interface of the overall module to form a data type terminal located in the data layer and an action type terminal located in the interaction layer.

In the S2 step, the interface of the data layer and the exposed interactions are defined, and after extraction, a data class terminal located in the data layer and an action class terminal located in the interaction layer are formed.

In fact, this step can be carried out according to the following two sub-steps:

S21. Extract the data class interface of the overall module to form a data class terminal located in the data layer.

S22: Extract the interaction layer interface of the overall module to form an action class terminal located in the interaction layer.

The operation process of the two steps S21 and S22 is not divided into sequence.

Preferably, the data-type terminals include two types of terminals: terminals for receiving data and terminals for outputting data.

Preferably, the action terminals include two types of terminals: method providing terminals and method triggering terminals.

S3. Encapsulate the data type terminal and the action type terminal, and perform attribute mapping on the data layer interface, interaction layer interface, data type terminal, and action type terminal.

In this S3 step, follow two sub-steps:

S31 , encapsulate the data type terminal of the module, and map the data layer interface and the data type terminal.

S32 , encapsulate the action terminal, and map interactions such as interaction mode and path to the action terminal.

The operation process of the two steps S31 and S32 is not divided into sequence.

The optimal way of operation is as follows, as shown in Figure 2:

S1. The functional modules of the front and back ends of the packaging form an integral module.

S21. Extract the data class interface of the overall module to form a data class terminal located in the data layer.

S31 , encapsulate the data type terminal of the module, and map the data layer interface and the data type terminal.

S22: Extract the interaction layer interface of the overall module to form an action class terminal located in the interaction layer.

S32 , encapsulate the action terminal, and map interactions such as interaction mode and path to the action terminal.

In this method, data layer terminals can only be connected to data layer terminals, and action terminals can only be connected to action terminals.

Further, the follow-up also includes the following operation steps:

S4. Independent installation and deployment of modules.

In fact, the packaging method is one of the links in integrating the system required by the customer. Specifically, the entire process of making the system includes:

1) Define a general encapsulation method that minimally modifies the source code of the original module, uniformly encapsulate the front-end and back-end of the functional module, so that the functional modules can be spliced with each other in a unified interface, and the encapsulated module uses the container orchestration technology to describe the image and resources The form of file is stored in the package management tool, and the packaged module is released to the visual system design tool;

2) In the system design tool, splicing related functional modules in a visual way, and finally integrating multiple modules into a new application system;

3) Set the overall framework content of the new system, such as system LOGO, menu, user mode, etc., to form a complete and usable system;

4) Compile the modules in the system design tool and the source data of the system framework, generate the configuration files required for deployment in the operation and maintenance system, and publish them on the DevOps operation and maintenance automation platform, using the resource orchestration technology and dependencies in the container technology system Management tool, realizes the re-level layering of front and back ends during the compilation process, and performs re-arrangement and re-processing of repeated service dependencies;

5) Automatic deployment on the DevOps platform, and finally get a runnable system.

This integration step has already been involved in the previous patent documents, and will not be repeated here. The packaging method of the present invention mainly introduces the module packaging method in step 1) in detail.

FIG. 3 is a schematic structural diagram of a packaging system disclosed in the present invention. Referring to FIG. 3 , the system includes:

The assembly unit 101 is used to package the functional modules of the front and rear ends to form an integral module;

A function forming unit 102, configured to extract the data layer interface and the interaction layer interface of the overall module to form a data type terminal located in the data layer and an action type terminal located in the interaction layer;

The encapsulation mapping unit 103 is configured to encapsulate the data type terminal and the action type terminal, and perform attribute mapping on the data layer interface, interaction layer interface, data type terminal and action type terminal.

Preferably, an integration unit 104 is further included, and the integration unit is used for installing and deploying the integral module to realize application as a separate system.

The specific operation process of FIG. 4 to FIG. 9 respectively decomposes the entire packaging method of FIG. 2 in detail.

FIG. 10 is a schematic structural diagram of a computer device disclosed in the present invention. 10, the computer device includes: an input device 63, an output device 64, a memory 62, and a processor 61; the memory 62 is used to store one or more programs; when the one or more programs are The one or more processors 61 execute, so that the one or more processors 61 implement a method for encapsulating a module as provided in the above embodiment; wherein the input device 63, the output device 64, the memory 62 and the processor 61 may It is connected by a bus or in other manners, and the connection by a bus is taken as an example in FIG. 10 .

The memory 62, as a readable and writable storage medium of a computing device, can be used to store software programs, computer-executable programs, such as program instructions corresponding to a packaging method described in the embodiments of the present application; the memory 62 may mainly include a storage program area and a program instruction. A storage data area, wherein the storage program area can store an operating system, an application program required for at least one function; the storage data area can store data created according to the use of the device, etc.; in addition, the memory 62 can include high-speed random access memory, It may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other non-volatile solid state storage device; in some instances, memory 62 may further include memory located remotely from processor 61, which Remote storage can be connected to the device via a network. Examples of such networks include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

The input device 63 can be used to receive input digital or character information, and generate key signal input related to user settings and function control of the device; the output device 64 can include display devices such as a display screen.

The processor 61 executes various functional applications and data processing of the device by running software programs, instructions and modules stored in the memory 62 .

The computer device provided above can be used to execute the packaging method provided by the above embodiment, and has corresponding functions and beneficial effects.

Embodiments of the present application further provide a storage medium containing computer-executable instructions, when the computer-executable instructions are executed by a computer processor to execute a method for encapsulating a module provided by the foregoing embodiments, the storage medium is any Various types of memory devices or storage devices, including: installation media such as CD-ROM, floppy disk or tape devices; computer system memory or random access memory such as DRAM, DDR RAM, SRAM, EDO RAM, Lamba Rambus RAM, etc.; non-volatile memory, such as flash memory, magnetic media (eg, hard disk or optical storage); registers or other similar types of memory elements, etc.; storage media may also include other types of memory or combinations thereof; , the storage medium may be located in the first computer system in which the program is executed, or may be located in a second, different computer system connected to the first computer system through a network (such as the Internet); the second computer system may The program instructions are provided to the first computer for execution. A storage medium includes two or more storage media that may reside in different locations (eg, in different computer systems connected by a network). The storage medium may store program instructions (eg, embodied as a computer program) executable by one or more processors.

Of course, a storage medium containing computer-executable instructions provided by the embodiments of the present application, the computer-executable instructions of which are not limited to the method for encapsulating a module as described in the above embodiments, and can also execute the methods provided by any of the embodiments of the present application. A related operation in a module encapsulation method of .

Finally, it should be noted that although this specification contains many specific implementation details, these should not be construed as limiting the scope of any invention or what may be claimed, but rather are used primarily to describe features of specific embodiments of particular inventions. Certain features that are described in this specification in multiple embodiments can also be implemented in combination in a single embodiment. On the other hand, various features that are described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable subcombination. Furthermore, although features may function as described above in certain combinations and even be originally claimed as such, one or more features from a claimed combination may in some cases be removed from the combination and the claimed A protected combination may point to a subcombination or a variation of a subcombination.

Similarly, although operations in the figures are depicted in a particular order, this should not be construed as requiring that the operations be performed in the particular order shown or sequentially, or that all illustrated operations be performed, to achieve the desired result. In some cases, multitasking and parallel processing may be advantageous. Furthermore, the separation of various system modules and components in the above-described embodiments should not be construed as requiring such separation in all embodiments, and it should be understood that the described program components and systems may generally be integrated together in a single software product , or packaged into multiple software products.

Thus, specific embodiments of the subject matter have been described. Other embodiments are within the scope of the appended claims. In some cases, the actions recited in the claims can be performed in a different order and still achieve desirable results. Furthermore, the processes depicted in the figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some implementations, multitasking and parallel processing may be advantageous.

The above descriptions are only preferred embodiments of the present disclosure, and are not intended to limit the present disclosure. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the present disclosure. within the scope of protection.

Claims (10)

1. A method of encapsulating a module, the method comprising:

the functional modules at the front end and the rear end of the package form an integral module;

extracting a data layer interface and an interaction layer interface of the integral module to form a data terminal positioned on the data layer and an action terminal positioned on the interaction layer;

and encapsulating the data terminal and the action terminal, and performing attribute mapping on the data layer interface, the interaction layer interface, the data terminal and the action terminal.

2. The method for packaging a module according to claim 1, wherein the data-class terminals include both terminals for receiving data and terminals for outputting data.

3. The method for packaging a module according to claim 1, wherein the action-type terminals include both method-providing terminals and method-triggering terminals.

4. The module packaging method according to claim 1, characterized in that, the data interface of the whole module is extracted to form the data terminal on the data layer, and then packaging and attribute mapping are performed;

and extracting the interface of the interaction layer of the whole module to form an action terminal positioned on the interaction layer, and then packaging and mapping the attributes.

5. The method for encapsulating modules according to claim 1, wherein the interface of the interaction layer of the whole module is extracted to form the action terminal located at the interaction layer, and then encapsulation and attribute mapping are performed;

and extracting a data interface of the whole module to form a data terminal positioned on the data layer, and then packaging and mapping the attributes.

6. The method of packaging a module of claim 1, further comprising the steps of: and installing and deploying the integral module to realize application as a separate system.

7. A packaging system for implementing a module package, comprising:

the assembling unit is used for packaging the functional modules at the front end and the rear end to form an integral module;

the function forming unit is used for extracting a data layer interface and an interaction layer interface of the whole module to form a data terminal positioned on the data layer and an action terminal positioned on the interaction layer;

and the encapsulation mapping unit is used for encapsulating the data terminal and the action terminal and performing attribute mapping on the data layer interface, the interaction layer interface, the data terminal and the action terminal.

8. The packaging system of claim 7, further comprising an integration unit for installation and deployment of the monolithic module for application as a stand-alone system.

9. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method according to any one of claims 1 to 6.

10. A computer device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the steps of the method according to any of claims 1-6 are implemented when the processor executes the program.

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