CN111947370A - Heat absorption and insulation system for refrigeration and insulation box and refrigeration and insulation box - Google Patents

Abstract

A heat absorption and insulation system for a refrigerated insulation box comprising: the heat preservation body is used for containing materials needing refrigeration and heat preservation, and the opening part of the heat preservation body is provided with threads; the heat preservation cavity comprises a first heat preservation cavity and a second heat preservation cavity which are butted; the second heat preservation cavity comprises a rear cover, and the first heat preservation cavity is sealed with the opening of the heat preservation body through threads; the semiconductor refrigerator is suspended in a closed space formed by the heat insulator and the heat insulation cavity, the heat absorption and heat insulation system provided by the invention can effectively reduce the heat conduction in the material of the heat insulator and improve the sealing efficiency, and meanwhile, the refrigeration and heat insulation box has a compact integral structure, reasonable layout of all components and is convenient to carry.

Description

Heat absorption and insulation system for refrigeration and insulation box and refrigeration and insulation box

Technical Field

The invention relates to a heat absorption and insulation system for providing a special environment for stored materials, in particular to a heat absorption and insulation system for a refrigeration and insulation box.

Background

A medicament is a substance or preparation for the prophylaxis or treatment or diagnosis of diseases in humans and livestock. Most modern drugs are refrigerated drugs. Some medicines need to be stored in a low environment, such as insulin, which is a common medicament stored at a low temperature, and currently, when insulin is carried, the medicament is often inactivated due to an excessively high storage temperature, which affects the use of patients. For another example, after skin burn, some biological dressings and cytokines are generally used to spray the wound surface in clinic, so as to promote the rapid healing of the wound surface. However, the drugs containing the biological dressing and the cytokines need to be stored in a low-temperature environment to ensure the activity and the efficacy, otherwise, the drugs can lose efficacy and even generate some harmful components. In some special or emergency environments, the medicine containing the biological dressing and the cell factors needs to be carried for rescue, and due to the lack of corresponding refrigeration environments, the medicine is difficult to carry and store, so that emergency treatment is affected.

The two technical methods of the existing portable low-temperature medicine preservation are that low-temperature auxiliary materials such as ice blocks and the like and medicines are arranged in a heat preservation device body, and the other is an electronic refrigeration refrigerator which is large in size and depends on an automobile power supply or a portable power supply (a refrigerating body is arranged on the side face or the bottom of the refrigerator, and a refrigeration radiator immediately starts to heat the interior of the refrigerator once power is cut off), and the heat preservation structures adopted by the two technologies are foam interlayer heat preservation technologies, so that when the ambient temperature exceeds 20 ℃, the heat preservation effect of the temperature difference change smaller than ten degrees is only about six hours, if medicines needing to be stored at low temperature are carried, the volume of the heat preservation device is limited within a certain range due to the portability requirement, and therefore, the foam interlayer heat preservation effect is worse, and great inconvenience is brought to patients carrying. The three defects of the prior art are formed by large volume, temperature difference protection and unreasonable refrigeration/heat dissipation structure, and simultaneously the problem of high cost is solved.

Disclosure of Invention

The invention aims to provide a heat absorption and insulation system which is small in size, compact in structure and reasonable in refrigeration/heat dissipation structural layout, can be used in combination with a refrigeration and insulation box, and can be used for conveniently storing articles needing low-temperature storage.

The technical scheme adopted by the invention for solving the technical problems is as follows: a heat absorption and insulation system for a refrigerated insulation box comprising: the semiconductor refrigerator comprises a refrigerating sheet, a cold-end heat absorber and a hot-end heat radiator; the heat preservation body is used for containing materials needing refrigeration and heat preservation, and the opening part of the heat preservation body is provided with threads; the heat preservation chamber, the cold junction heat absorber with the heat preservation chamber links to each other, and hang in the heat insulator with in the airtight cavity that the heat preservation chamber formed.

Optionally, the heat preservation chamber includes first heat preservation chamber and the second heat preservation chamber of butt joint, first heat preservation chamber cavity, and the oral area be equipped with the sealed screw thread of heat preservation body oral area adaptation.

Optionally, the second insulating cavity includes a central groove and an annular groove at least partially surrounding the central groove, an opening of the central groove faces a butt joint direction with the first insulating cavity, a bottom surface of the central groove forms at least part of a rear surface of the insulating cavity, an opening direction of the annular groove is opposite to the central groove, and a bottom surface of the annular groove forms a butt joint surface of the second insulating cavity with the first insulating cavity.

Optionally, the butt joint department in first heat preservation chamber with the second heat preservation chamber is equipped with and is used for holding the holding tank of semiconductor refrigerator, the cold end heat absorber includes the link, the link with the holding tank adaptation, so that the cold end heat absorber hang in heat preservation intracavity portion.

Optionally, the heat preservation cavity further includes a receiving area, the upper surfaces of the first heat preservation cavity and the second heat preservation cavity are respectively provided with a first receiving area and a second receiving area, and the first receiving area and the second receiving area are butted to form a receiving space for receiving the semiconductor refrigerator.

Optionally, a cylinder/hole groove is formed in the second heat insulation cavity, a hole groove/cylinder is formed in a position corresponding to the first heat insulation cavity, and the first heat insulation cavity and the second heat insulation cavity are inserted into the hole groove through the cylinder and are fastened and connected with each other by matching with screws; or the joint of the second heat preservation cavity and the first heat preservation cavity is provided with an adhesive area, and the first heat preservation cavity is connected with the second heat preservation cavity through adhesive.

Optionally, still include the heat insulating mattress, the heat insulating mattress is located the refrigeration piece with the cold junction heat absorber and the refrigeration piece with between the hot junction radiator, and/or the heat insulating mattress fill in inside the ring channel, and/or the heat insulating mattress fill in inside the central slot.

Optionally, a positioning protrusion is arranged outside the first heat preservation cavity and/or the second heat preservation cavity.

The refrigeration heat-preservation box further comprises a middle base and a lower shell, wherein the lower shell and the middle base are enclosed to form a second containing cavity, the heat-preservation cavity is arranged in the second containing cavity, and the heat-preservation body is movably arranged in the second containing cavity and sealed with the heat-preservation cavity.

Optionally, the refrigeration heat preservation box further comprises a power supply cavity, a temperature sensor, a power supply interface, a power supply and a PCB circuit board, wherein the power supply is arranged in the power supply cavity and electrically connected with the refrigeration heat preservation box main body, and the temperature sensor, the power supply interface and the PCB circuit board are electrically connected respectively.

The invention has the following beneficial effects: the heat absorption and insulation system is composed of the heat insulator, the mouth part rotating thread sealing structure and the overhanging type cold end radiator, the cylinder has the advantages of relatively minimum surface area and relatively maximum volume, the heat conduction contact area between the cylinder and the outside is reduced to the maximum extent, the vacuum structure is adopted simultaneously, the heat conduction inside the material of the heat insulator is reduced, the sealing efficiency is improved, and meanwhile, the refrigerating and heat insulation box is compact in integral structure, reasonable in layout of all components and convenient to carry.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a perspective view of one embodiment of the present invention;

FIG. 2 is a schematic view of a semiconductor cooler of one embodiment of the present invention;

FIG. 3 is a schematic diagram of the internal structure of one embodiment of the present invention;

FIG. 4 is a schematic view of an upper housing of one embodiment of the present invention;

FIG. 5 is a perspective view of one embodiment of the present invention;

FIG. 6 is a schematic diagram of the internal structure of one embodiment of the present invention;

FIG. 7 is a schematic view of a thermal insulating chamber according to an embodiment of the present invention;

FIG. 8 is a schematic view of a vacuum insulation panel incorporating an embodiment of the present invention.

Fig. 9 is a schematic structural diagram of a power supply chamber according to an embodiment of the invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.

It should be noted that the terms "upper", "lower", "top", "bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and do not require that the present invention be constructed and operated in a specific orientation, and should not be construed as limiting the present invention; the terms "mounted," "disposed," "provided," "connected," and "nested" are to be construed broadly and may, for example, be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; either directly or indirectly through intervening media, or may be internal to, or in communication between, two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.

Referring to fig. 1-2, the refrigeration heat preservation box provided by the embodiment comprises an upper shell 1, a lower shell 2 and a middle base 3 connecting the upper shell (1) and the lower shell (2). The upper shell (1) and the lower shell (2) are both concave cavities which are formed by inwards concave. The upper shell (1) and the lower shell (2) are respectively provided with a first containing cavity 4 and a second containing cavity 5, and are respectively sealed with the middle base 3 through ultrasonic welding. In other embodiments, the upper and lower shells (1, 2) can also be made by adopting a detachable connection manner such as screw fastening, bolt connection and the like with the middle base 3, or other common technical processes such as welding, bonding and integral forming and the like.

The refrigeration core of the refrigeration heat preservation box provided by the implementation adopts a semiconductor refrigerator 6, and comprises a refrigeration sheet 7, a cold-end heat absorber 8, a hot-end heat radiator 9, a heat conduction pad 10 and a heat insulation pad 39. The semiconductor cooling plate 7 operates by the peltier effect, when a direct current passes through a closed circuit formed by two different conductor or semiconductor materials a and b, two contacts in the circuit, one absorbing heat and the other emitting heat. The semiconductor refrigerating plate 7 is composed of a P-type semiconductor, an N-type semiconductor, a metal conductor and an insulating ceramic plate. When the semiconductor refrigerating sheet 7 is electrified with direct current, current flows from the N-type semiconductor to the P-type semiconductor at the joint between the N-type semiconductor and the P-type semiconductor, the temperature at the joint is reduced, heat is absorbed from the outside, and the cold end is formed. At the junction between the N-type semiconductor and the P-type semiconductor, current flows from the P-type semiconductor to the N-type semiconductor, and the junction is heated and releases heat to the outside, becoming a hot terminal. The cold end is provided with a cold end heat absorber 8, and the hot end is provided with a hot end radiator 9.

The cold-end heat absorber 8 and the hot-end heat sink 9 are distributed up and down on the position relative to the semiconductor refrigeration sheet 7, and the surrounding heat insulation pad 39 is distributed around the semiconductor refrigeration sheet 7 to reduce the contact heat conduction of the cold end and the hot end as much as possible. Preferably, the cold-end heat absorber 8 and the hot-end heat absorber 9 can adopt a multi-tooth-shaped radiating fin group or a rectangular fin radiating fin, so that the processing and manufacturing cost is easy, the efficiency is high, and the radiating performance is good. The multi-tooth radiating fin group comprises a plurality of fins which are parallel to each other and have gaps, the fins are vertically arranged, and preferably, the gap between every two adjacent fins is 1 mm. The semiconductor cooler 6 can dissipate heat from the hot-side heat sink 9 under the heat dissipation flow of the heat dissipation system. The semiconductor cooler 6, regardless of the design, must dissipate heat from the hot side in a timely manner. If the heat dissipation at the hot end is not good, the refrigeration effect is greatly reduced, so that the heat dissipation at the hot end is particularly necessary to be enhanced. The traditional air natural convection heat dissipation mode has low heat transfer coefficient and unsatisfactory effect, and in order to obtain better refrigeration and heat preservation effects, the invention provides an air-cooled heat dissipation system to realize forced flow heat dissipation.

Referring to fig. 3, the air-cooled heat dissipation system provided in this embodiment preferably includes two ducted fans disposed side by side, namely a first ducted fan 12 and a second ducted fan 13, each ducted fan includes a substantially square-outside and circular-inside duct 11 and a fan (not shown in the figure) located inside the duct 11, and since the ends of the fan blades are enclosed and limited by the duct 11, the impact noise is reduced, the induced resistance is reduced, and thus a high wind efficiency can be obtained. In other embodiments, the number of ducted fans can be three or more than three when the cost allows, and the wind action is enhanced and the heat dissipation effect is accelerated by adopting more fans. In other embodiments, the distribution of the positions of the ducted fans can also adapt to the design of the main structure of the refrigeration and heat preservation box, and a vertical stacking mode and the like are adopted to form a flow channel for accelerating heat dissipation.

Preferably, a chamfer is provided at the end position of the outer edge of the duct 11, while the outer surface is designed to be rectangular or square to accommodate the installation of the inner space of the box. In other embodiments, the ducts 11 may also be of circular design, and other shapes of ducts 11 without affecting the heat dissipation of the air flow channels should also be understood as being encompassed by other equivalents of the present invention.

The first ducted fan 12 is an intake fan, an intake port 15 is formed in an end surface of the first ducted fan 12, the second ducted fan 13 is an exhaust fan, an exhaust port 14 is formed in an end surface of the second ducted fan 13, and the directions of intake and exhaust are controlled by the difference in the arrangement of the fan blades. The air suction and exhaust of the first ducted fan 12 and the second ducted fan 13 form a forced flow passage, which accelerates the flow of the air flow in the first receiving chamber 4 formed in the upper case 1, further improving the heat dissipation efficiency. In other embodiments, both ducted fans may be suction fans or exhaust fans, and it is also fully feasible to accelerate the air flow in the first cavity 4 by the wind force of the fans to accelerate the heat dissipation.

Referring to fig. 4, a plurality of heat dissipation holes are distributed on the surface of the upper casing 1 in a partitioned manner, preferably, first area heat dissipation holes 16 which correspond to the positions of the ducted fans and are circularly distributed are respectively arranged on the upper surfaces of the first ducted fan 12 and the second ducted fan 13, second area heat dissipation holes 17 which extend along the length direction of the upper casing 1 are respectively arranged on the front side surface and the rear side surface of the upper casing 1, third area heat dissipation holes 18 which are connected with the upper surface and the lower surface are respectively arranged on the end surfaces of the two sides of the upper casing 1, and fourth area heat dissipation holes 19 which are different in size are further arranged on other blank positions of the upper casing 1 so as to increase the exchange channel with the outside air. For example, the first zone louvers (16) are responsible for high-speed exhaust, the second, third and fourth zone louvers (17, 18, 19) are responsible for auxiliary intake and suppressing turbulence to reduce airflow resistance, or the first zone louvers (16) are responsible for rapid intake, and the second, third and fourth zone louvers (17, 18, 19) are responsible for auxiliary exhaust and suppressing turbulence to reduce airflow resistance, thereby improving flow rate and wind cooling efficiency. In other embodiments, the exhaust and intake may be respectively performed according to the position distribution and the size and shape of the heat dissipation holes.

The first cavity 4 formed by the upper shell 1 can be used for accommodating a ducted fan and forms an air-cooling heat dissipation system together with the ducted fan. The outside air current gets into first appearance chamber 4 through the louvre that a plurality of partitions were arranged on last casing 1 to further reach the upper surface of fin through the suction of first duct fan 12, under the exhaust thrust effect of second duct fan 13, take place the forced flow, take away the heat on the fin fast, and discharge through the louvre that a plurality of partitions were arranged on last casing 1, accomplish the dynamic air-cooled heat dissipation work of whole air-cooled cooling system.

Go up the inside support column 20 that still is equipped with a plurality of equallys and arranges of casing 1, support column 20 is hollow cylinder, built-in screw and the tight assembly of middle base 3, still is equipped with the strengthening rib 21 that is used for strengthening first chamber 4 intensity between the support column 20 or on the main holding surface of last casing 1, can effectively avoid first chamber 4 to warp the influence that leads to the fact forced air cooling heat dissipation route.

A power interface, such as a DC-In interface 22, is arranged In the upper shell 1 and can provide an external power interface for the refrigeration heat-preservation box. Go up casing 1 one end and be equipped with inclined plane portion 23, the appearance chamber that inclined plane portion 23 formed is used for holding display screen 24, control button 25, temperature sensor, circuit board etc. electrical control equipment, looks over/control when convenient to use, and display screen 24 installs on mount table 26 and is fixed in inclined plane portion 23 inboard through modes such as pasting or screw fastening, still is equipped with control button 25 etc. on the mount table 26.

Preferably, the hot end radiator 9 is in a strip shape extending along the length direction of the middle base 3, and is arranged at the lower part of the ducted fan and above the middle base 3, so that the contact area with air is accelerated, and the heat dissipation area is effectively increased. Cold junction heat absorber 8 adopts the special-shaped structure, be different from traditional semiconductor refrigeration insulation can and adopt the endothermic mode of direct contact, but through the heat absorption heat preservation system, connect whole inner bag metal level, the directness that can dangle stretches into refrigeration heat preservation intracavity portion, link 81 on the heat absorption gas 8 through the cold junction links to each other with the holding tank 31 of heat preservation cavity is direct, all the other positions are unsettled, do not keep warm the cavity direct contact with needs, thereby refrigeration efficiency no longer receives the thermally conductive restriction of cavity, thereby refrigeration efficiency has been improved.

Referring to fig. 6 to 7, the middle base 3 is a special-shaped annular frame for supporting and connecting the upper and lower housings (1, 2) and the semiconductor refrigerator 7. The intermediate base 3 is formed with a receiving space that can partially receive a heat absorption and insulation system. This embodiment provides a heat absorption heat preservation system, including two heat preservation chambeies of butt joint fixed, be first heat preservation chamber 27 and second heat preservation chamber 28 respectively, the inside cavity in first heat preservation chamber 27, the inside packing of second heat preservation chamber 28 have heat insulating mattress 39, first heat preservation chamber 27 and second heat preservation chamber 28 butt joint fixed, form the refrigeration heat preservation cavity that can hold cold junction heat absorber 8.

The first heat preservation cavity 27 oral area is equipped with the screw thread, and the screw thread is located the one end of deviating from the butt joint department of first heat preservation cavity 27 and heat preservation cavity 28 for link to each other with the heat preservation body fastening. In other embodiments, the first thermal insulation cavity 27 and the second thermal insulation cavity 28 may be connected by other common detachable methods such as snap connection, ultrasonic welding, or thread fastening, insertion, or the first thermal insulation cavity 27 and the second thermal insulation cavity 28 may be designed as a common cavity, and the connection end 81 of the cold-end heat absorber 8 is suspended in the thermal insulation cavities and then integrally molded and cast.

The second holding chamber 28 comprises a central groove 41 and an annular groove 42 at least partially surrounding the central groove 41, the central groove 41 opens in the direction of abutting with the first holding chamber 27, the bottom surface of the central groove 41 forms part of the rear surface of the holding chamber, the annular groove 42 opens in the opposite direction to the central groove 41, and the bottom surface of the annular groove 42 forms the abutting surface of the second holding chamber 28 with the first holding chamber 27. In this embodiment, the annular groove 42 partially surrounds the outside of the central groove 41, and in other embodiments, the annular groove 42 may also completely surround the outside of the central groove 41. The second heat preservation cavity 28 is provided with three columns distributed in a shape like a Chinese character pin, the corresponding position of the first heat preservation cavity 27 is provided with a hole groove, and the first heat preservation cavity 27 and the second heat preservation cavity 28 are inserted into the hole groove through the columns and are fastened and connected through screws. In other embodiments, the number and position of the columns and the holes can be selected as appropriate, for example, the holes and the grooves are formed in the second insulating chamber 28, the columns are formed in the first insulating chamber 27, and the like. In other embodiments, the first thermal insulation cavity 27 and the second thermal insulation cavity 28 may further include a viscose area disposed in the butt joint area, the viscose area is disposed in a notch or an annular groove of a step type, and an adhesive is added in the notch or the annular groove, so that the first thermal insulation cavity 27 and the second thermal insulation cavity 28 are fixed by gluing, and when the first thermal insulation cavity 27 and the second thermal insulation cavity 28 are fixed by gluing, the thermal insulation between the first thermal insulation cavity 27 and the second thermal insulation cavity 28 is further facilitated, and the thermal conduction is reduced.

In order to prevent the mouth of the heat retaining body from directly contacting with the heat source, heat insulating pads 39 are respectively arranged at the gap of the second heat retaining cavity 28, the central groove 41 of the second heat retaining cavity 28 and the annular groove 42 of the second heat retaining cavity 28, and in other embodiments, heat insulating pads 39 can be arranged at the above parts by injecting heat insulating foam and the like.

In order to facilitate installation and fixation, the outer parts of the first heat preservation cavity 27 and the second heat preservation cavity 28 are respectively provided with a positioning protrusion 36, and the positioning protrusion 36 is connected with or propped against the middle base 3 to play a role in positioning and supporting the installation positions of the first heat preservation cavity 27 and the second heat preservation cavity 28.

The upper surface of the first heat preservation cavity 27 is provided with a first accommodation area 29, and the upper surface of the second heat preservation cavity 28 is provided with a second accommodation area 30. The first accommodation area 29 and the second accommodation area 30 are correspondingly positioned and are butt-connected to form an accommodation area which can accommodate the semiconductor refrigeration piece 7 and the like. One side of the second receiving area 30 facing the first receiving area 29 extends downward to form a receiving groove 31 capable of receiving the connecting end 81 of the cold-end heat absorber 8, preferably, the receiving groove 31 is shaped as a fin-shaped groove, so as to be adapted to the connecting end 81. The end of the accommodating groove 31 is located at the joint of the first accommodating area 29 and the second accommodating area 30, so that the cold end heat absorber 8 directly stretches into the heat preservation cavity in a hanging manner through the accommodating groove 31. In other embodiments, the receiving groove 31 may be opened at one side of the first receiving area 29 or one side of the second receiving area 30, or at other positions such as the end of the second insulating cavity 28, so long as the receiving groove 31 can receive the connecting end 81 of the cold-end heat absorber 8 to be inserted into and suspended in the insulating body.

Since the cylinder is a high-efficiency heat-preservation shape next to the sphere, the cylinder has the advantages of relatively minimum surface area and relatively maximum volume, and can reduce the heat conduction contact area with the outside to the maximum extent, preferably, the vacuum cylindrical heat-preservation body 35 is adopted in the embodiment. In order to reduce the heat conduction in the thermal insulator material, the external part of the shell of the vacuum cylindrical thermal insulator 35 adopts a stainless steel mirror polishing process, electromagnetic wave irradiation with various wavelengths is reflected to the maximum extent, and the heating effect of thermal radiation on the thermal insulator is reduced. During the use, will be equipped with and need cold-stored heat retaining article and put into the cylindrical heat insulator 35 of vacuum, screw up the cylindrical heat insulator 35 opening part of vacuum through 27 oral area screw rotations in first heat preservation chamber to push the second along the passageway that the location support rib formed and hold 5 in the chamber fixedly, make 8 unsettled internal bladders openings of vacuum cylindrical heat insulator 35 of arranging in of cold junction heat absorber, no longer receive the restriction of casing heat conductance, directly refrigerate the heat preservation to the article of depositing in the cup, greatly improve refrigeration efficiency. The mouth part adopts a thread rotary sealing structure, the sealing efficiency is higher than that of an opening-closing door cover, and the heat preservation effect is better. In other embodiments, the connection between the thermal insulation body 35 and the thermal insulation cavity may be a snap connection, an insertion connection, and a tightening connection via an elastic member such as a spring, or other common detachable connection, which only needs to ensure the sealing property of the thermal insulation body 35 after being connected to the thermal insulation cavity.

Referring to fig. 8, the refrigeration heat preservation box provided by this embodiment is a supporting structure made of food-grade plastic material, and is used to form an air duct of an air-cooling heat dissipation system and a supporting and fixing main body of a heat absorption and heat preservation system, and is also provided with a containing unit of a temperature control display circuit system. A first ducted fan 12 and a second ducted fan 13 are connected above the middle base 3, and form an air-cooling heat dissipation system by matching with the upper shell 1; a first heat preservation cavity 27 and a second heat preservation cavity 28 are connected to one side below the middle base 3, and the cold-end heat absorber 8 is directly extended into the opening of the heat insulator in a suspension mode to form a heat absorption and heat preservation system; in the second cavity 5, a plurality of positioning support ribs 37 are equally distributed along the length direction of the lower part of the middle base 3 and are used for supporting and positioning the heat insulator 35. Preferably, the position support rib 37 adopts the triangle-shaped design, including two right-angle sides and arc hypotenuse, two right-angle sides link to each other or offset with the midseat inboard, the hypotenuse adopts the arc design, the hypotenuse is the arc transition respectively with the contact department on right-angle side, the radian of arc limit 38 and the surface radian adaptation of the heat preservation body 35 guarantee that the heat preservation body 35 can push along the arc hypotenuse of position support rib 37 to the location guarantees that the accuracy of pushing the direction is firm with placing of the heat preservation body 35 in the second holds the intracavity 5. Preferably, the positioning support ribs 37 are designed to be vertically and symmetrically distributed, the gaps are arranged side by side, 8 positioning support ribs 37 are arranged on the upper side, 8 positioning support ribs 37 are arranged on the lower side, and the upper position and the lower position correspond to each other, so that the positioning support effect is ensured. In other embodiments, the specific shape of the positioning support ribs 37 may also be circular, convex, or other polygonal shapes, and the position and number of the positioning support ribs 37 may also be determined by a more dense or loose arrangement, so long as the heat insulation body 35 is stable in the second cavity 5. The positioning support ribs 37 are distributed up and down, a channel 43 is formed in the middle, and because the cold end is easy to produce condensed water and is not easy to clean, an operator can conveniently wipe the condensed water along the channel.

In this embodiment, the cavity structure is used to assist in positioning the supporting rib 37 to form the second cavity 5, so as to block the heat conduction between the heat insulator 35 and the outside. In order to reduce the heat conduction of the inner container of the heat insulator and reduce the influence of external heat on the temperature in the inner container as much as possible, the inner surface of the heat insulator can be coated with a silver coating, and the silver coating can reflect radiant heat and effectively prevent the heat conduction outside.

Referring to fig. 9, the refrigeration heat preservation box provided by this embodiment further includes a power supply cavity provided outside, and a battery 34 and a circuit board 35 are provided in the power supply cavity. The power supply cavity is detachably connected with the refrigeration heat preservation box main body through a buckle 32 structure. The buckle 32 structure is equipped with protruding and the draw-in groove of card that is the distribution of article font including being the refrigeration heat preservation box one side and the corresponding side in power supply chamber respectively, links to each other through buckle 32 structure detachable. And one side of the refrigeration heat-preservation box and the corresponding side of the power supply cavity are respectively provided with an electric contact 33, so that the electrical connection between the refrigeration heat-preservation box and the power supply cavity is ensured. In other embodiments, other quick-release structures may be adopted, such as a quick-release structure composed of a spring plate and an insertion structure, a quick-release structure composed of a spring and a hook, or other common detachable connection methods such as insertion, tenon, etc.

Preferably, in this embodiment, the temperature measuring sensor is a patch type temperature sensor, and in other embodiments, other non-contact or contact type temperature sensors may also be used. The insulator 35 adopts the cylindrical thermos cup in vacuum, and 304 stainless steel, 316 stainless steel or borosilicate glass etc. are chooseed for use to the material, and adopt the double-deck, bottom individual layer structure of lateral wall, and the bilayer structure lateral wall leaves the space, and this space is the vacuum setting, and the both ends of lateral wall adopt the sealed setting of food level silica gel sealing washer simultaneously, increase the heat preservation effect. The integrated controller adopts a chip with the model number of STM32F103RBT6, and the display screen 24 preferably adopts an LCD128464 liquid crystal display screen.

When the vacuum heat preservation device is used, materials needing heat preservation are firstly loaded into the vacuum cylindrical heat preservation body 35, the heat preservation body 35 is transversely placed, the vacuum cylindrical heat preservation body 35 is pushed into the opening of the second containing cavity 5 along a channel formed by the positioning support ribs 37 and is screwed up through threads in a rotating mode, then the vacuum cylindrical heat preservation body is connected with an external power supply through a power plug, or a battery is directly started through a power switch to supply power, and refrigeration and heat preservation are started. At the moment, the semiconductor refrigerator 6 starts to work, the temperature inside the vacuum cylindrical heat insulator is displayed on the display screen 24 in real time, and meanwhile, if the working state is abnormal, the alarm signal module prompts a problem signal.

The sequence of the above embodiments is only for convenience of description, and does not represent the merits of the embodiments.

The above description is only for the purpose of illustrating the present invention and is not to be construed as limiting, and any modifications or alterations that are within the scope of the invention as disclosed herein are easily contemplated by those skilled in the art and are intended to be covered by the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A heat absorption and insulation system for a refrigerated insulation box comprising:

the semiconductor refrigerator comprises a refrigerating sheet, a cold-end heat absorber and a hot-end heat radiator;

the heat preservation body is used for containing materials needing refrigeration and heat preservation, and the opening part of the heat preservation body is provided with threads;

the heat preservation chamber, the cold junction heat absorber with the heat preservation chamber links to each other, and hang in the heat insulator with in the airtight cavity that the heat preservation chamber formed.

2. The heat absorption and insulation system for a refrigerated insulation box of claim 1 wherein: the heat preservation chamber is including the first heat preservation chamber and the second heat preservation chamber of butt joint, first heat preservation chamber cavity, and the oral area be equipped with the sealed screw thread of heat retainer oral area adaptation.

3. The heat absorption and insulation system for a refrigerated insulation box of claim 2 wherein: the second heat preservation cavity comprises a central groove and an annular groove at least partially surrounding the central groove, the opening of the central groove faces the butt joint direction of the first heat preservation cavity, the bottom surface of the central groove forms at least part of the rear surface of the heat preservation cavity, the opening direction of the annular groove is opposite to that of the central groove, and the bottom surface of the annular groove forms the butt joint surface of the second heat preservation cavity and the first heat preservation cavity.

4. A heat absorption and preservation system for a refrigerated heat preservation box according to claim 3, characterized in that: first heat preservation chamber with the butt joint department in second heat preservation chamber is equipped with and is used for holding semiconductor cooler's holding tank, the cold junction heat absorber includes the link, the link with the holding tank adaptation, so that the cold junction heat absorber hang in heat preservation intracavity portion.

5. The heat absorption and insulation system for a refrigerated insulation box of claim 4 wherein: the heat preservation cavity further comprises a containing area, the upper surfaces of the first heat preservation cavity and the second heat preservation cavity are respectively provided with a first containing area and a second containing area, and a containing space for containing the semiconductor refrigerator is formed after the first containing area and the second containing area are in butt joint.

6. The heat absorption and insulation system for a refrigerated insulation box of claim 5 wherein: the second heat preservation cavity is provided with a column body/hole groove, the corresponding position of the first heat preservation cavity is provided with a hole groove/column body, and the first heat preservation cavity and the second heat preservation cavity are inserted into the hole groove through the column body and are fastened and connected by matching with screws; or the joint of the second heat preservation cavity and the first heat preservation cavity is provided with an adhesive area, and the first heat preservation cavity is connected with the second heat preservation cavity through adhesive.

7. The heat absorption and insulation system for a refrigerated insulation box of claim 6 wherein: still include the heat insulating mattress, the heat insulating mattress is located the refrigeration piece with the cold junction heat absorber and the refrigeration piece with between the hot junction radiator, and/or the heat insulating mattress fill in inside the ring channel, and/or the heat insulating mattress fill in inside the central slot.

8. The heat absorption and insulation system for a refrigerated insulation box of claim 7 wherein: and positioning protrusions are arranged outside the first heat preservation cavity and/or the second heat preservation cavity.

9. A refrigeration and thermal insulation box comprising the heat absorption and thermal insulation system according to any one of claims 1 to 8, wherein: still include middle base and lower casing, down the casing with middle base encloses synthetic second and holds the chamber, the heat preservation chamber is located the second holds the intracavity, the heat retainer is mobilizable to be located the second holds the intracavity, and with the heat preservation chamber is sealed.

10. A refrigeration and heat retention cassette as defined in claim 9, wherein: still include power supply cavity, temperature sensor, power source, power, PCB circuit board, the power is located the power intracavity and with refrigeration heat preservation box main part electrical property links to each other, temperature sensor, power source, PCB circuit board electrical property link to each other respectively.

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