CN111941837A - Three-dimensional flexible circuit printing device and printing method - Google Patents

Three-dimensional flexible circuit printing device and printing method Download PDF

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Publication number
CN111941837A
CN111941837A CN202010652903.3A CN202010652903A CN111941837A CN 111941837 A CN111941837 A CN 111941837A CN 202010652903 A CN202010652903 A CN 202010652903A CN 111941837 A CN111941837 A CN 111941837A
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China
Prior art keywords
ink
assembly
axis
printing
flexible circuit
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Chinese (zh)
Inventor
谢小柱
申超
翁沛希
龙江游
徐美芳
武文杰
周文倩
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Guangdong University of Technology
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Guangdong University of Technology
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Priority to CN202010652903.3A priority Critical patent/CN111941837A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/106Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • B29C64/135Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)

Abstract

The invention relates to the technical field of electronic circuits, in particular to a three-dimensional flexible circuit printing device and a printing method, wherein the three-dimensional flexible circuit printing device comprises a base and a protective cover arranged on the base, and a hollow cavity is arranged between the base and the protective cover; the base is provided with a three-axis movement assembly, the three-axis movement assembly is provided with a mounting plate, and the mounting plate is provided with an ink extrusion assembly and an ink curing assembly; a working platform is arranged below the printing ink extruding assembly and the printing ink curing assembly, the working platform is movably arranged on the base, and a base material to be printed is clamped on the working platform; the triaxial movement assembly, the printing ink extrusion assembly, the printing ink curing assembly and the working platform are all arranged in the hollow cavity. Different sintering and curing modes are selected according to the material of the substrate and the characteristics of the conductive ink, so that the conductive ink is suitable for extrusion and curing of different types of conductive ink, and the application range is wide; the invention is provided with a plurality of degrees of freedom, can flexibly prepare a supporting circuit structure at any position in space, has high flexibility and can realize high-resolution three-dimensional flexible circuit printing.

Description

Three-dimensional flexible circuit printing device and printing method
Technical Field
The invention relates to the technical field of electronic circuits, in particular to a three-dimensional flexible circuit printing device and a printing method.
Background
With the progress of science and technology, the electronic circuit industry is rapidly developing towards the direction of integration and flexibility. The density and complexity of devices in electronic chips are also exponentially increased, and the area of a traditional PCB is continuously reduced, which is in contradiction with the extremely-caused appearance and rich functions pursued by people. How to utilize the effective electronic circuit space and integrate more electronic devices becomes a necessary requirement for the development of future electronic circuits, and three-dimensional circuits are produced. At present, the preparation of the three-dimensional circuit generally has two modes: preparing a multilayer circuit structure, and arranging a passage between layers to connect circuits of each layer; the self-supporting structure is directly prepared. Although the circuit with the layer-by-layer structure can increase the space utilization of an electronic circuit and is similar to the layer-by-layer structure of a chip, the circuit prepared by the method is difficult to be applied to wearable electronic equipment or flexible electronic devices, has very limited tensile property, can not be connected in a space cross-scale manner, and can not bear repeated bending and stretching and large-degree strain; the self-supporting structure circuit can well overcome the defects of the layer-by-layer circuit, but the usability and the characteristics of materials in practical application are lack of relevant research.
Chinese patent CN110901067A discloses a coaxial 3D printing device for preparing a spatial stereo circuit, which alternately extrudes different types of materials through a two-layer extrusion mechanism, extrudes an insulating material on the outer layer, extrudes a conductive material on the inner layer, and prints the conductive material on a substrate in layers. Chinese patent CN106817846A discloses a method for manufacturing a liquid metal three-dimensional circuit based on 3D printing technology, which is to inject liquid metal into a three-dimensional solid hollow flow channel for 3D printing, and if the flow channel is too thin, the liquid metal is difficult to be injected into the flow channel at the later stage, and the prepared circuit has no extensibility and is too complex in process. KR1020160118587 proposes injection molding of a polymer, coating of a conductive polymer onto a thermoplastic resin, melting of the thermoplastic resin by laser etching and adsorption of the conductive polymer onto ABS, the ductility of the circuit being completely determined by the inherent stretchability of the collective carrier itself, and the space occupancy being high. Patent WO2016164729 adopts 3D print platform device, extrudes the electrically conductive silver thick liquid through the nozzle and combines laser real-time curing, makes electrically conductive silver thick liquid form three-dimensional circuit at space shaping, and its electrically conductive printing ink material that is suitable for is too single, and the silver thick liquid configuration condition is harsh, with high costs.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a three-dimensional flexible circuit printing device, which can flexibly prepare a supporting circuit structure at any position in space, has few limitations on the types of conductive printing ink and has strong practicability and applicability.
In order to solve the technical problems, the invention adopts the technical scheme that:
the three-dimensional flexible circuit printing device comprises a base and a protective cover arranged on the base, wherein a hollow cavity is arranged between the base and the protective cover; the base is provided with a three-axis movement assembly capable of generating three-dimensional movement of an X axis, a Y axis and a Z axis, the three-axis movement assembly is provided with a mounting plate, and the mounting plate is provided with an ink extrusion assembly and an ink curing assembly; a working platform is arranged below the printing ink extruding assembly and the printing ink curing assembly, the working platform is movably arranged on the base, and a base material to be printed is clamped on the working platform; the three-axis movement assembly, the printing ink extrusion assembly, the printing ink curing assembly and the working platform are all arranged in the hollow cavity.
According to the three-dimensional flexible circuit printing device, a substrate to be printed is clamped on the working platform, the printing ink curing assembly matched with the conductive printing ink is selected to be arranged on the mounting plate, the positions of the printing ink extruding assembly, the printing ink curing assembly and the working platform are all adjustable, the angle of the printing ink extruding direction relative to the substrate can be rapidly adjusted, and the conductive printing ink is sintered and cured in real time under the action of the printing ink curing assembly. The invention is suitable for the extrusion and solidification of different types of conductive ink, and has wide application range; the invention is provided with a plurality of degrees of freedom, can flexibly prepare a supporting circuit structure at any position in space, has high flexibility and can realize high-resolution three-dimensional flexible circuit printing.
Further, the triaxial moving assembly comprises an X-axis module, a Y-axis module and a Z-axis module, the Y-axis module is installed on the base, the X-axis module is installed on the Y-axis module, the Z-axis module is installed on the X-axis module, and the installing plate is installed on the Z-axis module.
Furthermore, the two Y-axis modules are arranged in parallel; the Y-axis module comprises a second servo motor, a second screw rod connected to an output shaft of the second servo motor and second sliding blocks connected with the second screw rod, and two ends of the X-axis module are respectively installed on the two groups of second sliding blocks.
Furthermore, the X-axis module comprises a first servo motor, a first screw rod connected to an output shaft of the first servo motor and a first sliding block connected with the first screw rod, the Z-axis module is mounted on the first sliding block, and the Z-axis module is perpendicular to the plane where the two groups of X-axis modules are located.
Further, the Z-axis module comprises a third servo motor, a third screw rod connected to an output shaft of the third servo motor and a third sliding block connected with the third screw rod, and the mounting plate is mounted on the third sliding block.
Furthermore, the printing ink extrusion assembly comprises a piston, a feeding injector, a nozzle and a driving mechanism for driving the piston to move, the piston is connected to the output end of the driving mechanism, the piston can be movably attached to the inner wall of the feeding injector, and the nozzle is communicated with the tail end of the feeding injector.
Further, the ink extrusion assembly is detachably mounted on the mounting plate through a first universal bracket, and the nozzle outlet direction is perpendicular to the cross section of the conductive ink at the nozzle outlet.
Furthermore, the ink curing assembly comprises a xenon flash lamp and a laser reflection focusing module, the laser reflection focusing module is fixedly arranged on the mounting plate, and the xenon flash lamp is detachably arranged on the mounting plate through a second universal bracket.
Further, the working platform is mounted on the base through a first rotating platform and a second rotating platform, the working platform is mounted on the first rotating platform, the first rotating platform is mounted on the second rotating platform, the second rotating platform is rotatably connected with the base, and the rotating directions of the first rotating platform and the second rotating platform are vertical; the first rotating platform is connected with a fourth servo motor, and the second rotating platform is connected with a fifth servo motor.
The invention also provides a three-dimensional flexible circuit printing method, which comprises the following steps:
s10, clamping a substrate to be printed on a working platform, selecting an ink curing assembly matched with the conductive ink, and adjusting the positions of the working platform and the ink extrusion assembly to enable the cross section printed by the conductive ink to be always vertical to the outlet section of the nozzle;
s20, fitting a spatial track of the three-dimensional flexible circuit through MATLAB software, and deriving coordinate data points in the fitted spatial track;
and S30, controlling the actions of the three-axis motion assembly, the first universal support, the second universal support, the first rotating table and the second rotating table based on the coordinate data points obtained in the step S20 to realize the printing of the three-dimensional flexible circuit.
According to the three-dimensional flexible circuit printing method, different sintering and curing modes are selected according to the material of the base material and the characteristics of the conductive ink, so that the three-dimensional flexible circuit printing method can be suitable for metal conductive ink in a wider range; the cross section printed by the conductive ink is always vertical to the section of the outlet of the nozzle, so that the shearing rate of the conductive ink at the outlet of the nozzle can be reduced, and the shape retention of the ink outlet is improved; and a plurality of degrees of freedom are arranged, so that a supporting circuit structure can be flexibly prepared at any position in space, the flexibility is high, and high-resolution three-dimensional flexible circuit printing can be realized.
Compared with the prior art, the invention has the beneficial effects that:
according to the three-dimensional flexible circuit printing device and the printing method, different sintering and curing modes are selected according to the material of the substrate and the characteristics of the conductive ink, so that the three-dimensional flexible circuit printing device and the printing method are suitable for extruding and curing different types of conductive ink, and are wide in application range; the invention is provided with a plurality of degrees of freedom, can flexibly prepare a supporting circuit structure at any position in space, has high flexibility and can realize high-resolution three-dimensional flexible circuit printing.
Drawings
FIG. 1 is a schematic structural diagram of a three-dimensional flexible circuit printing apparatus according to the present invention;
FIG. 2 is a schematic view of the three-dimensional flexible circuit printing apparatus with the protective cover removed;
FIG. 3 is a schematic diagram of a three-axis motion assembly;
in the drawings: 1-a base; 2-a protective cover; 3-a three-axis motion assembly; 31-X axis module; a 32-Y axis module; a 33-Z axis module; 34-a first slider; 35-a second slide; 36-a third slider; 4-mounting a plate; 5-an ink extrusion assembly; 52-a nozzle; 53-first universal stand; 6-an ink curing component; 61-xenon flash lamp; 62-laser reflection focusing module; 63-a second gimbal; 7-a working platform; 71-a first rotating table; 72-a fourth servo motor; 73-a second rotating table; 74-fifth servomotor.
Detailed Description
The present invention will be further described with reference to the following embodiments. Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; to better illustrate the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of describing the present invention and simplifying the description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and are not to be construed as limiting the present patent, and the specific meaning of the terms may be understood by those skilled in the art according to specific circumstances.
Example one
Fig. 1 to 3 show an embodiment of a three-dimensional flexible circuit printing apparatus according to the present invention, which includes a base 1 and a protection cover 2 installed on the base 1, wherein a hollow cavity is disposed between the base 1 and the protection cover 2; the base 1 is provided with a three-axis movement assembly 3 capable of generating three-dimensional movement of an X axis, a Y axis and a Z axis, the three-axis movement assembly 3 is provided with a mounting plate 4, and the mounting plate 4 is provided with an ink extrusion assembly 5 and an ink curing assembly 6; a working platform 7 is arranged below the printing ink extruding component 5 and the printing ink curing component 6, the working platform 7 is movably arranged on the base 1, and a base material to be printed is clamped on the working platform 7; the three-axis movement assembly 3, the printing ink extrusion assembly 5, the printing ink curing assembly 6 and the working platform 7 are all arranged in the hollow cavity. The protective cover 2 can isolate the harm caused by the operation of the ink curing assembly 6 in the printing work; in the embodiment, an observation operation window can be arranged on one side surface of the base 1, and the base 1 can be connected with a transparent door body to realize the purpose of observation.
In the implementation of the embodiment, the substrate to be printed is clamped on the working platform 7, the printing ink curing assembly 6 matched with the conductive printing ink is selected to be installed on the installation plate 4, the positions of the printing ink extrusion assembly 5, the printing ink curing assembly 6 and the working platform 7 are adjustable, the angle of the printing ink extrusion direction relative to the substrate can be rapidly adjusted, the conductive printing ink is sintered and cured in real time under the action of the printing ink curing assembly 6, and the high-resolution three-dimensional flexible circuit printing is realized. Wherein, different sintering and curing modes are selected according to the material of the substrate and the characteristics of the conductive ink, and the method can be suitable for various metal conductive inks, such as: various kinds of metal conductive ink such as silver paste, copper paste, alloy metal nano ink, metal oxide nano ink, core-shell bimetal nano ink and the like; besides the liquid ink containing the metal conductive particles, the conductive ink can also be applied to the conductive ink in a sol state, a gel state or a paste state.
In one embodiment, the three-axis moving assembly 3 comprises an X-axis module 31, a Y-axis module 32 and a Z-axis module 33, the Y-axis module 32 is mounted on the base 1, the X-axis module 31 is mounted on the Y-axis module 32, the Z-axis module 33 is mounted on the X-axis module 31, and the mounting plate 4 is mounted on the Z-axis module 33. In the embodiment, when the position of the mounting plate 4 is adjusted, the X-axis module 31 can slide on the Y-axis module 32, the Z-axis module 33 slides on the X-axis module 31, and the mounting plate 4 slides up and down under the driving action of the Z-axis module 33. In the process of adjusting the position of the mounting plate 4, the positions of the ink extruding assembly 5 and the ink curing assembly 6 mounted on the mounting plate 4 are changed along with the change of the position of the mounting plate 4, so that the positions of the ink extruding assembly 5 and the ink curing assembly 6 relative to the working platform 7 are adjusted. In this embodiment, the X-axis module 31, the Y-axis module 32, and the Z-axis module 33 may all be commercially available linear modules, specifically:
the two Y-axis modules 32 are arranged in parallel; the Y-axis module 32 is a second linear module including second sliders 35, and two ends of the X-axis module 31 are respectively mounted on the two sets of second sliders 35. The X-axis module 31 is a first linear module including a first slider 34, the Z-axis module 33 is mounted on the first slider 34, and the Z-axis module 33 is perpendicular to a plane where the two X-axis modules 31 are located. The Z-axis module 33 is a third linear module including a third slider 36, and the mounting plate 4 is mounted to the third slider 36. In this embodiment, the X-axis module 31, the Y-axis module 32, and the Z-axis module 33 have the same structure, and each of the X-axis module 31, the Y-axis module 32, and the Z-axis module 33 includes a servo motor, a lead screw, and a slider, the sliders of the X-axis module 31, the Y-axis module 32, and the Z-axis module 33 correspond to the first slider 34, the second slider 35, and the third slider 36, respectively, the servo motor rotates to drive the lead screw to rotate, the lead screw is connected with the sliders through a thread, and the rotation of the lead screw is converted into a linear motion of the slider, so that a linear change of displacement of the mounting plate; in this embodiment, the servo motors of the X-axis module 31, the Y-axis module 32, and the Z-axis module 33 can be connected to the control system to realize the automatic control of the three-axis moving assembly 3. However, the transmission of the X-axis module 31, the Y-axis module 32, and the Z-axis module 33 is not limited to the transmission using the screw slider, and other transmission methods such as chain transmission and belt transmission that can realize linear motion are also applicable to the present invention.
In one embodiment, the ink extruding assembly 5 includes a piston connected to the output end of the driving motor, a feeding syringe, a nozzle 52 and a driving mechanism for driving the piston to move, the piston is movably attached to the inner wall of the feeding syringe, and the nozzle 52 is communicated with the tail end of the feeding syringe. The driving mechanism in this embodiment may directly drive the piston to move by using the electric push rod, or may drive the motor to drive the screw rod to rotate, and the screw rod is connected to the piston by a thread, so as to convert the rotation of the screw rod into the movement of the piston, so as to drive the piston to move, so as to obtain better motion stability. In this embodiment, the driving mechanism drives the piston to move to pressurize the feeding injector, the conductive ink stored in the feeding injector is extruded to the nozzle 52, and the speed and pressure of extruding the conductive ink can be adjusted by adjusting the working power of the driving mechanism. The connecting conduit between the feeding injector and the nozzle 52 of the embodiment can transport and guide the flow of the conductive ink, the nozzle 52 can adopt a needle head which is low in price and easy to disassemble and replace, the inner diameter of the outlet of the needle head is 0.1 mm-0.2 mm, the inner diameter of the needle head is not limited to the range, and the inner diameter of the needle head can be adjusted according to the resolution requirement of a printed three-dimensional circuit.
In one embodiment, the ink extruding assembly 5 is detachably mounted on the mounting plate 4 through a first universal bracket 53, the outlet direction of the nozzle 52 is perpendicular to the cross section of the conductive ink at the outlet of the nozzle 52, so that the viscoelasticity of the conductive ink and the internal compression stress caused by the capillary tension of the nozzle 52 are balanced, and the pulling force of the nozzle 52 on the ink is balanced with the gravity of the conductive oil at the outlet section; meanwhile, the shearing force borne by the conductive ink at the outlet of the nozzle 52 can be reduced, the shearing thinning property of the conductive ink at the outlet of the nozzle 52 is avoided, the situation that the conductive ink collapses or deforms before being solidified is reduced, meanwhile, the insufficient viscosity caused by the insufficient solid content in the conductive ink is also avoided, and the applicability of the common conductive ink is improved to a greater extent. To fine tune the position of the ink extrusion assembly 5, the present embodiment may be provided with a commercially available manual three-axis precision motion slide on the back of the mounting plate 4 to more precisely control the position of the nozzle 52.
The ink curing assembly 6 comprises a xenon flash lamp 61 and a laser reflection focusing module 62, the laser reflection focusing module 62 is fixedly arranged on the mounting plate 4, the xenon flash lamp 61 is detachably arranged on the mounting plate 4 through a second universal bracket 63, and the second universal bracket 63 is arranged to adjust the position of the xenon flash lamp 61 to align the xenon flash lamp 61 to the working platform 7. The xenon flash lamp 61 can generate high-energy instantaneous intense pulsed light for sintering and curing the conductive ink to form a three-dimensional circuit; the laser reflection focusing module 62 can generate infrared laser, ultraviolet laser or green light according to different conductive ink materials, and is also used for sintering and curing the conductive ink to form a three-dimensional circuit. The embodiment can adopt a curing mode combining strong pulse light and laser curing, and can also select the curing mode of strong pulse light or laser curing according to the material of the conductive ink. In addition, the xenon flash lamp 61 and the ink extrusion module of the embodiment can be replaced by a melt extrusion module and a cold cutting module so as to be suitable for printing the three-dimensional flexible circuit by using the thermoplastic polymer material doped with the conductive metal particles.
The first gimbal 53 and the second gimbal 63 are fixed to the mounting plate 4, and the first gimbal 53 and the second gimbal 63 have the same structure, and both can rotate 360 ° around the Z axis and can also swing around the Z axis. Specifically, the first gimbal 53 and the second gimbal 63 may include: the first installation seat 73 installed on the installation plate 4, a rotating shaft rotatably connected with the first installation seat 73, and a direction of the rotating shaft are parallel to the Z axis, one end of the rotating shaft is connected with the second installation seat 73, the second installation seat 73 is provided with a swing motor, and the ink extrusion assembly 5 and the xenon flash lamp 61 are installed on an output shaft of the swing motor. It should be noted that, in order to adjust the positions of the ink squeezing assembly 5 and the xenon flash lamp 61, other universal supports capable of rotating and swinging at the same time may be used.
In one embodiment, the working platform 7 is mounted on the base 1 through a first rotating platform 71 and a second rotating platform 73, the working platform 7 is mounted on the first rotating platform 71, the first rotating platform 71 is mounted on the second rotating platform 73, the second rotating platform 73 is rotatably connected with the base 1, and the axial lines of the first rotating platform 71 and the second rotating platform 73 are perpendicular; the fourth servo motor 72 is connected to the first rotating table 71, and the fifth servo motor 74 is connected to the second rotating table 73. In particular, the fourth servomotor 72 drives the first rotating table 71 to rotate, and the fifth servomotor 75 drives the second rotating table 73 to rotate, so that the rotation of the working platform 7 on the other plane can be realized. With such a configuration, the present embodiment can provide a more flexible printing scheme for the three-dimensional flexible circuit; in addition, when the solid content of the conductive ink is low, the working platform 7 can be rotated by the first rotating platform 71 and the second rotating platform 73, the outlet direction of the nozzle 52 is kept vertical to the cross section of the conductive ink at the outlet of the nozzle 52, the shearing rate of the conductive ink at the outlet of the nozzle 52 is reduced, and the shape-keeping property of the ink outlet is improved.
In the detailed description of the embodiments, various technical features may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
Example two
The embodiment is an embodiment of a method for printing a three-dimensional flexible circuit, and comprises the following steps:
s10, clamping a substrate to be printed on a working platform 7, selecting an ink curing assembly 6 matched with the conductive ink, and adjusting the positions of the working platform 7 and the ink extruding assembly 5 to enable the cross section printed by the conductive ink to be always vertical to the outlet section of the nozzle 52;
s20, fitting a spatial track of the three-dimensional flexible circuit through MATLAB software, and deriving coordinate data points in the fitted spatial track;
and S30, controlling the actions of the three-axis motion assembly 3, the first universal support 53, the second universal support 63, the first rotating table and the second rotating table based on the coordinate data points obtained in the step S20 to realize the printing of the three-dimensional flexible circuit.
In step S10, the cross section of the conductive ink printing is always perpendicular to the section of the outlet of the nozzle 52, that is, the printing method of ink direct writing is adopted, so that the viscoelasticity of the conductive ink and the internal pressure stress caused by the capillary tension of the nozzle 52 can be balanced out, and the pulling force of the nozzle 52 on the ink can be balanced against the gravity of the conductive oil at the outlet section, and meanwhile, the shearing force applied to the conductive ink at the outlet of the nozzle 52 can be reduced by such a processing mode, thereby avoiding the shearing thinning property of the conductive ink at the outlet of the nozzle 52; the conductive ink reduces the collapse or deformation of the conductive ink before solidification, avoids the viscosity deficiency caused by insufficient solid content in the conductive ink, and improves the applicability of the common conductive ink to a great extent.
In the step S20, the three-dimensional flexible circuit track is fitted through MATLAB software, the distribution and the trend of the circuit are reasonably planned, and the three-dimensional circuit is ensured not to be crossed and short-circuited in space;
in step S30, the programmed PMAC upper computer is used to convert the trajectory coordinates into a coordinate point format that can be identified by PMAC CK3M, and the coordinate point format is transmitted to the lower computer motion program, so as to control the motion system to realize high-resolution three-dimensional flexible circuit printing. In the step S30, the printing process adopts a double-swing-axis five-axis printer, which has high flexibility and is easy to realize high-resolution three-dimensional flexible circuit printing.
The embodiment can optimize the conditions of the viscosity of the conductive ink, the extrusion pressure, the printing speed, the height of the nozzle 52 from the printing working platform 7 and the like so as to improve the resolution of the three-dimensional flexible circuit. In addition, the three-dimensional flexible circuit obtained by the embodiment is used for pin interconnection of chips or other components in the wearable electronic equipment, and the problems that the pins are broken or damaged when the chip position is changed and deviated due to deformation or displacement of the flexible substrate under the action of external force are solved, and the signal bearing quality of the pins cannot be affected.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (10)

1. The three-dimensional flexible circuit printing device is characterized by comprising a base (1) and a protective cover (2) arranged on the base (1), wherein a hollow cavity is arranged between the base (1) and the protective cover (2); the ink curing device is characterized in that a three-axis movement assembly (3) capable of generating three-dimensional movement of an X axis, a Y axis and a Z axis is installed on the base (1), an installation plate (4) is installed on the three-axis movement assembly (3), and an ink extruding assembly (5) and an ink curing assembly (6) are installed on the installation plate (4); a working platform (7) is arranged below the printing ink extruding component (5) and the printing ink curing component (6), the working platform (7) is movably arranged on the base (1), and a base material to be printed is clamped on the working platform (7); the three-axis movement assembly (3), the printing ink extrusion assembly (5), the printing ink curing assembly (6) and the working platform (7) are all installed in the hollow cavity.
2. The stereoscopic flexible circuit printing device according to claim 1, wherein the three-axis motion assembly (3) comprises an X-axis module (31), a Y-axis module (32) and a Z-axis module (33), the Y-axis module (32) is mounted on the base (1), the X-axis module (31) is mounted on the Y-axis module (32), the Z-axis module (33) is mounted on the X-axis module (31), and the mounting plate (4) is mounted on the Z-axis module (33).
3. The stereoscopic flexible circuit printing apparatus according to claim 2, wherein the Y-axis modules (32) are two groups, and the two groups of Y-axis modules (32) are arranged in parallel; the Y-axis module (32) comprises a second servo motor, a second screw rod connected to an output shaft of the second servo motor and second sliding blocks (35) connected with the second screw rod, and two ends of the X-axis module (31) are respectively installed on the two groups of second sliding blocks (35).
4. The printing device of claim 3, wherein the X-axis module (31) comprises a first servo motor, a first lead screw connected to an output shaft of the first servo motor, and a first slide block (34) connected with the first lead screw, the Z-axis module (33) is mounted on the first slide block (34), and the Z-axis module (33) is perpendicular to a plane where the two groups of X-axis modules (31) are located.
5. The stereoscopic flexible circuit printing apparatus according to claim 4, wherein the Z-axis module (33) comprises a third servo motor, a third lead screw connected to an output shaft of the third servo motor, and a third slider (36) connected to the third lead screw, and the mounting plate (4) is mounted to the third slider (36).
6. The device according to any one of claims 1 to 5, wherein the ink extruding assembly (5) comprises a piston, a feeding syringe, a nozzle (52) and a driving mechanism for driving the piston to move, the piston is connected to an output end of the driving mechanism and is movably attached to an inner wall of the feeding syringe, and the nozzle (52) is communicated with a tail end of the feeding syringe.
7. The stereoscopic flexible circuit printing apparatus according to claim 6, wherein the ink extrusion assembly (5) is detachably mounted to the mounting plate (4) by a first gimbal (53), and the outlet direction of the nozzle (52) is perpendicular to the cross section of the conductive ink at the outlet of the nozzle (52).
8. The printing device according to claim 6, wherein the ink curing assembly (6) comprises a xenon flash lamp (61) and a laser reflection focusing module (62), the laser reflection focusing module (62) is fixedly mounted on the mounting plate (4), and the xenon flash lamp (61) is detachably mounted on the mounting plate (4) through a second gimbal (63).
9. The stereoscopic flexible circuit printing device according to claim 1, wherein the working platform (7) is mounted on the base (1) through a first rotating platform (71) and a second rotating platform (73), the working platform (7) is mounted on the first rotating platform (71), the first rotating platform (71) is mounted on the second rotating platform (73), the second rotating platform (73) is rotatably connected with the base (1), and the axial lines of the first rotating platform (71) and the second rotating platform (73) are vertical; the first rotating table (71) is connected with a fourth servo motor (72), and the second rotating table (73) is connected with a fifth servo motor (74).
10. A three-dimensional flexible circuit printing method is characterized by comprising the following steps:
s10, clamping a substrate to be printed on a working platform (7), selecting an ink curing assembly (6) matched with the conductive ink, and adjusting the positions of the working platform (7) and the ink extruding assembly (5) to enable the cross section printed by the conductive ink to be always vertical to the outlet section of the nozzle (52);
s20, fitting a spatial track of the three-dimensional flexible circuit through MATLAB software, and deriving coordinate data points in the fitted spatial track;
and S30, controlling the actions of the three-axis motion assembly (3), the first universal bracket (53), the second universal bracket (63), the first rotating table (71) and the second rotating table (73) based on the coordinate data points obtained in the step S20 to realize the printing of the three-dimensional flexible circuit.
CN202010652903.3A 2020-07-08 2020-07-08 Three-dimensional flexible circuit printing device and printing method Pending CN111941837A (en)

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CN202010652903.3A CN111941837A (en) 2020-07-08 2020-07-08 Three-dimensional flexible circuit printing device and printing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010652903.3A CN111941837A (en) 2020-07-08 2020-07-08 Three-dimensional flexible circuit printing device and printing method

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CN111941837A true CN111941837A (en) 2020-11-17

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112793155A (en) * 2020-12-18 2021-05-14 华南理工大学 Cartilage repair device and method adopting parallel mechanical arm 3D printing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112793155A (en) * 2020-12-18 2021-05-14 华南理工大学 Cartilage repair device and method adopting parallel mechanical arm 3D printing
CN112793155B (en) * 2020-12-18 2022-06-24 华南理工大学 Cartilage repair device and method adopting parallel mechanical arm 3D printing

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