CN111935919A - Novel aluminum substrate blind hole electroplating process - Google Patents

Novel aluminum substrate blind hole electroplating process Download PDF

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Publication number
CN111935919A
CN111935919A CN202010690510.1A CN202010690510A CN111935919A CN 111935919 A CN111935919 A CN 111935919A CN 202010690510 A CN202010690510 A CN 202010690510A CN 111935919 A CN111935919 A CN 111935919A
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CN
China
Prior art keywords
copper
washing
blind hole
layer
water jet
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CN202010690510.1A
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Chinese (zh)
Inventor
钟华爱
张勇
黎一鹏
何川
党雷明
曾勇志
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Jiangmen Benlida Printed Circuit Co ltd
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Jiangmen Benlida Printed Circuit Co ltd
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Priority to CN202010690510.1A priority Critical patent/CN111935919A/en
Publication of CN111935919A publication Critical patent/CN111935919A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0766—Rinsing, e.g. after cleaning or polishing a conductive pattern

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention discloses a novel aluminum substrate blind hole electroplating process, which comprises the following steps: plate taking: taking the substrate with drilled blind holes; polymer conductive film: the method comprises the following steps of replacing common chemical copper deposition, depositing a thin organic conductive film on a dielectric layer of a blind hole, and directly plating copper during electroplating production, wherein the method comprises the following specific steps: (1) microetching, removing oxides and other impurities on the copper surface of the plate, roughening the copper surface, and performing water jet flow of 30-70L/min; according to the invention, through setting the process flows of taking the plate, conducting polymer film, VCP electroplating and finishing operation, the problems that the conduction resistance value is large after plugging holes and the reliability is poor due to colloid existing in copper paste or silver paste are solved; and ordinary chemical copper deposition + VCP electroplating process leads to downthehole aluminium lamination to corrode again, and electricity does not go up the copper, can't realize the circuit layer problem of the intercommunication of copper layer and aluminium lamination promptly, and this neotype aluminium base board blind hole electroplating process possesses the advantage that can not disturb and switch on the resistance, and good reliability can effectively realize copper layer and aluminium lamination intercommunication.

Description

Novel aluminum substrate blind hole electroplating process
Technical Field
The invention relates to the technical field of aluminum substrate manufacturing, in particular to a novel aluminum substrate blind hole electroplating process.
Background
The aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, and a single-sided board generally comprises a three-layer structure, namely a circuit layer (copper foil), an insulating layer and a metal base layer. Commonly found in LED lighting products. The LED lamp has a front surface and a back surface, wherein the white surface is welded with an LED pin, and the other surface is in an aluminum natural color and is generally coated with heat conduction slurry and then contacted with a heat conduction part. And ceramic substrates, etc.
The copper surface of the aluminum substrate is communicated with the aluminum layer, the via hole is a blind hole, the conventional method is to plug copper paste or silver paste to realize the communication between the copper layer and the aluminum layer, but the colloid existing in the copper paste or the silver paste easily causes the larger conducting resistance value after the hole is plugged, and the reliability is poor; the common chemical copper deposition and VCP electroplating process causes corrosion of an aluminum layer in a hole, does not add copper, and cannot realize communication between a copper layer and the aluminum layer.
Disclosure of Invention
The invention aims to provide a novel electroplating process for blind holes of an aluminum substrate, which has the advantages of no interference on conduction resistance, good reliability and capability of effectively realizing the communication between a copper layer and an aluminum layer, and solves the problems that the traditional method is to plug copper paste or silver paste to realize the conduction between the copper layer and the aluminum layer, but the colloid existing in the copper paste or silver paste easily causes the large conduction resistance after plugging the holes and has poor reliability; and the common chemical copper deposition and VCP electroplating process causes the corrosion of the aluminum layer in the hole, the copper is not coated, and the communication between the copper layer and the aluminum layer which are circuit layers can not be realized.
In order to achieve the purpose, the invention provides the following technical scheme: a novel aluminum substrate blind hole electroplating process comprises the following steps:
step 1: plate taking: taking the substrate with drilled blind holes;
step 2: polymer conductive film: the method comprises the following steps of replacing common chemical copper deposition, depositing a thin organic conductive film on a dielectric layer of a blind hole, and directly plating copper during electroplating production, wherein the method comprises the following specific steps: (1) microetching to remove oxide and other impurities on the copper surface of the plate, roughening the copper surface, wherein the flow rate of a water jet is 30-70L/min, the operating temperature is 48-52 ℃, and (2) the water jetWashing, 4-stage circulating water washing, washing residual micro-etching liquid medicine on the board surface, wherein the flow rate of a water jet is 30-70L/min; (3) the method comprises the steps of finishing holes, improving the activity of the hole wall of the PCB, and enabling the hole wall to comprise resin, glass fibers, fillers of base materials and the like, so that the hole wall is easier to react with subsequent oxidizing liquid, slight oxides and slight stains on the surface and the hole wall of the PCB can be effectively removed, the flow rate of a water jet is 30-70L/min, and the operating temperature is 48-52 ℃; (4) water jet cleaning, 4-stage circulating water cleaning, and cleaning the residual liquid medicine in the whole holes on the board surface; (5) oxidizing, reacting the permanganate with the resin and glass fiber on the hole wall under the weak acidic condition to form a layer of MnO connected with a chemical bond on the hole wall2The layer MnO2Will become the oxidant for the subsequent catalytic reaction; (6) recycling and washing the oxidized liquid medicine remained on the board surface, and recycling sewage; (7) water jet washing, 4-stage circulating washing and washing for washing residual oxidized liquid medicine on the board surface; (8) catalysis, high molecular weight substances 8230A and 8230R under acidic condition (PH:1.6-2.1) and MnO2Under the oxidation action of the organic conducting film, polymerizing the organic conducting film into a polymer with hole conducting property, namely depositing a thin organic conducting film on the medium layer in the hole; (9) water jet washing, 4-stage circulating washing and cleaning residual catalytic chemical liquid on the board surface; (10) drying, namely drying water stains on the surface and in holes of the PCB to avoid the surface oxidation from affecting the subsequent electrolytic copper, wherein the operation temperature is 80-90 ℃;
and step 3: VCP plating: plating a layer of copper, a connecting circuit copper layer and an aluminum layer on the blind holes of the aluminum substrate which is manufactured with the polymer conductive film, and the specific steps are as follows: (1) acid washing with 4-6% H2SO4Cleaning the oxide on the board surface, pre-wetting the PCB before the PCB enters a copper plating cylinder, and pickling for 33 seconds; (2) copper plating, namely plating a copper layer with required thickness (the principle is consistent with that of hole copper plating after ordinary chemical copper deposition) on the blind hole on which a thin organic conductive film is deposited under the action of current, wherein the copper plating time is 40 minutes, the copper plating current density is 35ASF, and copper sulfate pentahydrate and H are required to be used in the copper plating process2SO4CL-, Cu gloss agent supplement ST-2000(BST) and copper plating regulator ST-2000 (CST); (3) washing, namely circularly washing, and using the liquid medicine for washing the copper plating tank remained on the surface of the plate; (4) drying, namely drying water stains on the surface and in the holes of the PCB at the temperature of 80-90 ℃;
and 4, step 4: and (4) finishing the operation: and completing the conduction of the blind hole.
Preferably, in step 2, the conveying device is used to ensure that the plate obtains sufficient washing time in each washing tank and reaction time in each washing tank.
Preferably, in the step 2, the microetching, pore-shaping, oxidizing, catalytic chemical reaction section and the recycling water washing section after the oxidation are carried out by adopting a water knife immersion bath, and the immersion bath type is recommended to be adopted for the subsequent water washing of the oxidizing and catalytic sections.
Preferably, in step 2, the water jet blades must be designed according to the characteristics of the plate to design the opening size and the jet flow rate, and the distribution mode of the water jet blades; the water jet needs to be maintained regularly to prevent blockage.
Preferably, in step 2, the whole hole needs to be provided with ultrasonic oscillation, the frequency is 28.5KHZ, and the power is: 20-30W/Lit; after the frequency and the power of the ultrasonic waves are debugged, the frequency and the power of the ultrasonic waves cannot be changed randomly; and needs to be checked regularly.
Preferably, in step 2, all the drug solution tanks must have strict temperature control; and is provided with a temperature control alarm; the temperature control needs to be corrected regularly, and all the liquid medicine tanks need to be provided with alarm devices with independent upper tank liquid levels and lower tank liquid levels.
Preferably, in the step 2, the oxidation tank needs an automatic water replenishing device, in order to keep the temperature of the tank liquor stable, the water replenishing amount is not more than 1% of the cylinder opening volume each time, and the time interval of the water replenishing for two times is not less than 3 minutes.
Preferably, in the step 3, the water washing time is 41 seconds, and the spraying pressure is 2-3kg/cm2。
Preferably, in step 3, the plate is conveyed by using equipment, so that the plate can be ensured to obtain sufficient washing time in each washing tank and reaction time in each washing tank.
Preferably, in step 4, the copper surface of the aluminum substrate is electrically connected to the aluminum layer (the via hole is a blind hole, the aperture of the blind hole is 1.2mm, and the depth of the blind hole is required to be 1.3mm), and the aluminum-copper alloy substrate needs to resist 25A current for 60s, and the voltage reduction value between copper and aluminum is less than 2.5V.
Compared with the prior art, the invention has the beneficial effects that: according to the invention, through setting the process flows of taking the plate, conducting polymer film, VCP electroplating and finishing operation, the problems that the conduction resistance value is large after plugging holes and the reliability is poor due to colloid existing in copper paste or silver paste are solved; and ordinary chemical copper deposition + VCP electroplating process leads to downthehole aluminium lamination to corrode again, and electricity does not go up the copper, can't realize the circuit layer problem of the intercommunication of copper layer and aluminium lamination promptly, and this neotype aluminium base board blind hole electroplating process possesses the advantage that can not disturb and switch on the resistance, and good reliability can effectively realize copper layer and aluminium lamination intercommunication.
Detailed Description
The present invention will now be described in more detail by way of examples, which are given by way of illustration only and are not intended to limit the scope of the present invention in any way.
The invention provides a technical scheme that: a novel aluminum substrate blind hole electroplating process comprises the following steps:
step 1: plate taking: taking the substrate with drilled blind holes;
step 2: polymer conductive film: the method comprises the following steps of replacing common chemical copper deposition, depositing a thin organic conductive film on a dielectric layer of a blind hole, and directly plating copper during electroplating production, wherein the method comprises the following specific steps: (1) microetching, removing oxides and other impurities on the copper surface of the plate, roughening the copper surface, wherein the flow rate of a water jet is 30-70L/min, the operating temperature is 48-52 ℃, the (2) water jet washing and the 4-stage circulating water washing are carried out, and the residual microetching liquid medicine on the plate surface is washed, and the flow rate of the water jet is 30-70L/min; (3) the method comprises the steps of finishing holes, improving the activity of the hole wall of the PCB, and enabling the hole wall to comprise resin, glass fibers, fillers of base materials and the like, so that the hole wall is easier to react with subsequent oxidizing liquid, slight oxides and slight stains on the surface and the hole wall of the PCB can be effectively removed, the flow rate of a water jet is 30-70L/min, and the operating temperature is 48-52 ℃; (4) water jet cleaning, 4-stage circulating water cleaning, and cleaning the residual liquid medicine in the whole holes on the board surface; (5) oxidizing, reacting the permanganate with the resin and glass fiber on the hole wall under the weak acidic condition to form a layer of MnO connected with a chemical bond on the hole wall2The layer MnO2Will become the oxidant for the subsequent catalytic reaction; (6) recycling and washing the oxidized liquid medicine remained on the board surface, and recycling sewage; (7) water jet washing, 4-stage circulating washing and washing for washing residual oxidized liquid medicine on the board surface; (8) catalytic, high molecular weight substance 8230A and 8230R under acidic conditions (pH:1.6-2.1) and MnO2Under the oxidation action of the organic conducting film, polymerizing the organic conducting film into a polymer with hole conducting property, namely depositing a thin organic conducting film on the medium layer in the hole; (9) water jet washing, 4-stage circulating washing and cleaning residual catalytic chemical liquid on the board surface; (10) drying, namely drying water stains on the surface and in holes of the PCB to avoid the surface oxidation from affecting the subsequent electrolytic copper, wherein the operation temperature is 80-90 ℃;
and step 3: VCP plating: plating a layer of copper, a connecting circuit copper layer and an aluminum layer on the blind holes of the aluminum substrate which is manufactured with the polymer conductive film, and the specific steps are as follows: (1) acid washing with 4-6% H2SO4Cleaning the oxide on the board surface, pre-wetting the PCB before the PCB enters a copper plating cylinder, and pickling for 33 seconds; (2) copper plating, namely plating a copper layer with required thickness (the principle is consistent with that of hole copper plating after ordinary chemical copper deposition) on the blind hole on which a thin organic conductive film is deposited under the action of current, wherein the copper plating time is 40 minutes, the copper plating current density is 35ASF, and copper sulfate pentahydrate and H are required to be used in the copper plating process2SO4CL-, Cu gloss agent supplement ST-2000(BST) and copper plating regulator ST-2000 (CST); (3) washing, namely circularly washing, and using the liquid medicine for washing the copper plating tank remained on the surface of the plate; (4) drying, namely drying water stains on the surface and in the holes of the PCB at the temperature of 80-90 ℃;
and 4, step 4: and (4) finishing the operation: and completing the conduction of the blind hole.
The first embodiment is as follows:
plate taking: taking the substrate with drilled blind holes; polymer conductive film: the method comprises the following steps of replacing common chemical copper deposition, depositing a thin organic conductive film on a dielectric layer of a blind hole, and directly plating copper during electroplating production, wherein the method comprises the following specific steps: (1) microetching, removing oxides and other impurities on the copper surface of the plate, roughening the copper surface, wherein the flow rate of a water jet is 30-70L/min, the operating temperature is 48-52 ℃, the (2) water jet washing and the 4-stage circulating water washing are carried out, and the residual microetching liquid medicine on the plate surface is washed, and the flow rate of the water jet is 30-70L/min; (3) the whole hole is finished, the activity of the hole wall of the PCB is improved, the PCB comprises resin, glass fiber, filler of a base material and the like, the PCB is easier to react with subsequent oxidizing liquid, slight oxides and slight stains on the surface and the hole wall of the PCB can be effectively removed, the water jet flow is 30-70L/min, and the operation is carried outThe temperature is 48-52 ℃; (4) water jet cleaning, 4-stage circulating water cleaning, and cleaning the residual liquid medicine in the whole holes on the board surface; (5) oxidizing, reacting the permanganate with the resin and glass fiber on the hole wall under the weak acidic condition to form a layer of MnO connected with a chemical bond on the hole wall2The layer MnO2Will become the oxidant for the subsequent catalytic reaction; (6) recycling and washing the oxidized liquid medicine remained on the board surface, and recycling sewage; (7) water jet washing, 4-stage circulating washing and washing for washing residual oxidized liquid medicine on the board surface; (8) catalysis, high molecular weight substances 8230A and 8230R under acidic condition (PH:1.6-2.1) and MnO2Under the oxidation action of the organic conducting film, polymerizing the organic conducting film into a polymer with hole conducting property, namely depositing a thin organic conducting film on the medium layer in the hole; (9) water jet washing, 4-stage circulating washing and cleaning residual catalytic chemical liquid on the board surface; (10) drying, namely drying water stains on the surface and in holes of the PCB to avoid the surface oxidation from affecting the subsequent electrolytic copper, wherein the operation temperature is 80-90 ℃; VCP plating: plating a layer of copper, a connecting circuit copper layer and an aluminum layer on the blind holes of the aluminum substrate which is manufactured with the polymer conductive film, and the specific steps are as follows: (1) acid washing with 4-6% H2SO4Cleaning the oxide on the board surface, pre-wetting the PCB before the PCB enters a copper plating cylinder, and pickling for 33 seconds; (2) copper plating, namely plating a copper layer with required thickness (the principle is consistent with that of hole copper plating after ordinary chemical copper deposition) on the blind hole on which a thin organic conductive film is deposited under the action of current, wherein the copper plating time is 40 minutes, the copper plating current density is 35ASF, and copper sulfate pentahydrate and H are required to be used in the copper plating process2SO4CL-, Cu gloss agent supplement ST-2000(BST) and copper plating regulator ST-2000 (CST); (3) washing, namely circularly washing, and using the liquid medicine for washing the copper plating tank remained on the surface of the plate; (4) drying, namely drying water stains on the surface and in the holes of the PCB at the temperature of 80-90 ℃; and (4) finishing the operation: and completing the conduction of the blind hole.
Example two:
in the first embodiment, the following steps are added:
in the step 2, the conveying equipment is used to ensure that the board obtains sufficient washing time in each washing cylinder and reaction time in each liquid medicine cylinder, so that the cleanness of the PCB board is ensured, and the influence of residual substances on the next operation is avoided.
Plate taking: taking the substrate with drilled blind holes; polymer conductive film: the method comprises the following steps of replacing common chemical copper deposition, depositing a thin organic conductive film on a dielectric layer of a blind hole, and directly plating copper during electroplating production, wherein the method comprises the following specific steps: (1) microetching, removing oxides and other impurities on the copper surface of the plate, roughening the copper surface, wherein the flow rate of a water jet is 30-70L/min, the operating temperature is 48-52 ℃, the (2) water jet washing and the 4-stage circulating water washing are carried out, and the residual microetching liquid medicine on the plate surface is washed, and the flow rate of the water jet is 30-70L/min; (3) the method comprises the steps of finishing holes, improving the activity of the hole wall of the PCB, and enabling the hole wall to comprise resin, glass fibers, fillers of base materials and the like, so that the hole wall is easier to react with subsequent oxidizing liquid, slight oxides and slight stains on the surface and the hole wall of the PCB can be effectively removed, the flow rate of a water jet is 30-70L/min, and the operating temperature is 48-52 ℃; (4) water jet cleaning, 4-stage circulating water cleaning, and cleaning the residual liquid medicine in the whole holes on the board surface; (5) oxidizing, reacting the permanganate with the resin and glass fiber on the hole wall under the weak acidic condition to form a layer of MnO connected with a chemical bond on the hole wall2The layer MnO2Will become the oxidant for the subsequent catalytic reaction; (6) recycling and washing the oxidized liquid medicine remained on the board surface, and recycling sewage; (7) water jet washing, 4-stage circulating washing and washing for washing residual oxidized liquid medicine on the board surface; (8) catalysis, high molecular weight substances 8230A and 8230R under acidic condition (PH:1.6-2.1) and MnO2Under the oxidation action of the organic conducting film, polymerizing the organic conducting film into a polymer with hole conducting property, namely depositing a thin organic conducting film on the medium layer in the hole; (9) water jet washing, 4-stage circulating washing and cleaning residual catalytic chemical liquid on the board surface; (10) drying, namely drying water stains on the surface and in holes of the PCB to avoid the surface oxidation from affecting the subsequent electrolytic copper, wherein the operation temperature is 80-90 ℃; VCP plating: plating a layer of copper, a connecting circuit copper layer and an aluminum layer on the blind holes of the aluminum substrate which is manufactured with the polymer conductive film, and the specific steps are as follows: (1) acid washing with 4-6% H2SO4Cleaning the oxide on the board surface, pre-wetting the PCB before the PCB enters a copper plating cylinder, and pickling for 33 seconds; (2) copper plating, namely plating a copper layer with required thickness on the blind hole on which a thin organic conductive film is deposited under the action of current (the principle is consistent with that of hole copper plating after ordinary chemical copper deposition), wherein the copper plating time is 40 minutes, and the copper plating is carried out electricallyThe flow density is 35ASF, and copper sulfate pentahydrate and H are required to be used in the copper plating process2SO4CL-, Cu gloss agent supplement ST-2000(BST) and copper plating regulator ST-2000 (CST); (3) washing, namely circularly washing, and using the liquid medicine for washing the copper plating tank remained on the surface of the plate; (4) drying, namely drying water stains on the surface and in the holes of the PCB at the temperature of 80-90 ℃; and (4) finishing the operation: and completing the conduction of the blind hole.
Example three:
in the second embodiment, the following steps are added:
in the step 2, a water jet knife immersion bath is required to be adopted in a microetching, pore-finishing, oxidizing, catalytic chemical reaction section and a recycling water washing section after oxidation, a immersion bath type is suggested to be adopted in the subsequent water washing of the oxidizing and catalytic section, and the water jet knife is required to design the opening size and the jet flow rate according to the characteristics of the plate and the distribution mode of the water jet knife; the water jet needs to be maintained regularly to prevent blockage, and the interference of the previous step to the next operation is avoided.
Plate taking: taking the substrate with drilled blind holes; polymer conductive film: the method comprises the following steps of replacing common chemical copper deposition, depositing a thin organic conductive film on a dielectric layer of a blind hole, and directly plating copper during electroplating production, wherein the method comprises the following specific steps: (1) microetching, removing oxides and other impurities on the copper surface of the plate, roughening the copper surface, wherein the flow rate of a water jet is 30-70L/min, the operating temperature is 48-52 ℃, the (2) water jet washing and the 4-stage circulating water washing are carried out, and the residual microetching liquid medicine on the plate surface is washed, and the flow rate of the water jet is 30-70L/min; (3) the method comprises the steps of finishing holes, improving the activity of the hole wall of the PCB, and enabling the hole wall to comprise resin, glass fibers, fillers of base materials and the like, so that the hole wall is easier to react with subsequent oxidizing liquid, slight oxides and slight stains on the surface and the hole wall of the PCB can be effectively removed, the flow rate of a water jet is 30-70L/min, and the operating temperature is 48-52 ℃; (4) water jet cleaning, 4-stage circulating water cleaning, and cleaning the residual liquid medicine in the whole holes on the board surface; (5) oxidizing, reacting the permanganate with the resin and glass fiber on the hole wall under the weak acidic condition to form a layer of MnO connected with a chemical bond on the hole wall2The layer MnO2Will become the oxidant for the subsequent catalytic reaction; (6) recycling and washing the oxidized liquid medicine remained on the board surface, and recycling sewage; (7) water jet washing, 4-stage circulating washing and washing for washing residual oxidized liquid medicine on the board surface; (8) catalysis, high molecular weightSub-products 8230A and 8230R under acidic conditions (pH:1.6-2.1) and MnO2Under the oxidation action of the organic conducting film, polymerizing the organic conducting film into a polymer with hole conducting property, namely depositing a thin organic conducting film on the medium layer in the hole; (9) water jet washing, 4-stage circulating washing and cleaning residual catalytic chemical liquid on the board surface; (10) drying, namely drying water stains on the surface and in holes of the PCB to avoid the surface oxidation from affecting the subsequent electrolytic copper, wherein the operation temperature is 80-90 ℃; VCP plating: plating a layer of copper, a connecting circuit copper layer and an aluminum layer on the blind holes of the aluminum substrate which is manufactured with the polymer conductive film, and the specific steps are as follows: (1) acid washing with 4-6% H2SO4Cleaning the oxide on the board surface, pre-wetting the PCB before the PCB enters a copper plating cylinder, and pickling for 33 seconds; (2) copper plating, namely plating a copper layer with required thickness (the principle is consistent with that of hole copper plating after ordinary chemical copper deposition) on the blind hole on which a thin organic conductive film is deposited under the action of current, wherein the copper plating time is 40 minutes, the copper plating current density is 35ASF, and copper sulfate pentahydrate and H are required to be used in the copper plating process2SO4CL-, Cu gloss agent supplement ST-2000(BST) and copper plating regulator ST-2000 (CST); (3) washing, namely circularly washing, and using the liquid medicine for washing the copper plating tank remained on the surface of the plate; (4) drying, namely drying water stains on the surface and in the holes of the PCB at the temperature of 80-90 ℃; and (4) finishing the operation: and completing the conduction of the blind hole.
Example four:
in the third embodiment, the following steps are added:
in step 2, the whole hole needs to be equipped with ultrasonic oscillation, the frequency is 28.5KHZ, and the power is: 20-30W/Lit; after the frequency and the power of the ultrasonic waves are debugged, the frequency and the power of the ultrasonic waves cannot be changed randomly; regular inspection is needed to ensure the smooth operation of the whole hole, and all the liquid medicine tanks need to be strictly controlled by temperature; and is provided with a temperature control alarm; the temperature control needs to be corrected regularly, all the liquid medicine tanks need to be provided with alarm devices with independent upper tank liquid levels and lower tank liquid levels, the temperature of operation is convenient to master, the oxidation tank needs to be provided with an automatic water replenishing device, in order to keep the temperature of the tank liquid stable, the water replenishing amount is not more than 1% of the volume of the opened cylinder every time, the time interval of water replenishing for two times is not less than 3 minutes, and smooth proceeding of oxidation is ensured.
Plate taking: taking the substrate with drilled blind hole(ii) a Polymer conductive film: the method comprises the following steps of replacing common chemical copper deposition, depositing a thin organic conductive film on a dielectric layer of a blind hole, and directly plating copper during electroplating production, wherein the method comprises the following specific steps: (1) microetching, removing oxides and other impurities on the copper surface of the plate, roughening the copper surface, wherein the flow rate of a water jet is 30-70L/min, the operating temperature is 48-52 ℃, the (2) water jet washing and the 4-stage circulating water washing are carried out, and the residual microetching liquid medicine on the plate surface is washed, and the flow rate of the water jet is 30-70L/min; (3) the method comprises the steps of finishing holes, improving the activity of the hole wall of the PCB, and enabling the hole wall to comprise resin, glass fibers, fillers of base materials and the like, so that the hole wall is easier to react with subsequent oxidizing liquid, slight oxides and slight stains on the surface and the hole wall of the PCB can be effectively removed, the flow rate of a water jet is 30-70L/min, and the operating temperature is 48-52 ℃; (4) water jet cleaning, 4-stage circulating water cleaning, and cleaning the residual liquid medicine in the whole holes on the board surface; (5) oxidizing, reacting the permanganate with the resin and glass fiber on the hole wall under the weak acidic condition to form a layer of MnO connected with a chemical bond on the hole wall2The layer MnO2Will become the oxidant for the subsequent catalytic reaction; (6) recycling and washing the oxidized liquid medicine remained on the board surface, and recycling sewage; (7) water jet washing, 4-stage circulating washing and washing for washing residual oxidized liquid medicine on the board surface; (8) catalysis, high molecular weight substances 8230A and 8230R under acidic condition (PH:1.6-2.1) and MnO2Under the oxidation action of the organic conducting film, polymerizing the organic conducting film into a polymer with hole conducting property, namely depositing a thin organic conducting film on the medium layer in the hole; (9) water jet washing, 4-stage circulating washing and cleaning residual catalytic chemical liquid on the board surface; (10) drying, namely drying water stains on the surface and in holes of the PCB to avoid the surface oxidation from affecting the subsequent electrolytic copper, wherein the operation temperature is 80-90 ℃; VCP plating: plating a layer of copper, a connecting circuit copper layer and an aluminum layer on the blind holes of the aluminum substrate which is manufactured with the polymer conductive film, and the specific steps are as follows: (1) acid washing with 4-6% H2SO4Cleaning the oxide on the board surface, pre-wetting the PCB before the PCB enters a copper plating cylinder, and pickling for 33 seconds; (2) copper plating, namely plating a copper layer with required thickness (the principle is consistent with that of hole copper plating after ordinary chemical copper deposition) on the blind hole on which a thin organic conductive film is deposited under the action of current, wherein the copper plating time is 40 minutes, the copper plating current density is 35ASF, and copper sulfate pentahydrate and H are required to be used in the copper plating process2SO4CL-, Cu gloss agent supplement ST-2000(BST) and copper plating regulator ST-2000 (CST); (3) washing, namely circularly washing, and using the liquid medicine for washing the copper plating tank remained on the surface of the plate; (4) drying, namely drying water stains on the surface and in the holes of the PCB at the temperature of 80-90 ℃; and (4) finishing the operation: and completing the conduction of the blind hole.
Example five:
in the fourth example, the following steps were added:
in step 3, the water washing time is 41 seconds, and the spraying pressure is 2-3kg/cm2The PCB board can be cleaned cleanly by using equipment for conveying and ensuring that the board obtains sufficient washing time in each washing cylinder and reaction time in each liquid medicine cylinder, and the interference of the previous step is reduced.
Plate taking: taking the substrate with drilled blind holes; polymer conductive film: the method comprises the following steps of replacing common chemical copper deposition, depositing a thin organic conductive film on a dielectric layer of a blind hole, and directly plating copper during electroplating production, wherein the method comprises the following specific steps: (1) microetching, removing oxides and other impurities on the copper surface of the plate, roughening the copper surface, wherein the flow rate of a water jet is 30-70L/min, the operating temperature is 48-52 ℃, the (2) water jet washing and the 4-stage circulating water washing are carried out, and the residual microetching liquid medicine on the plate surface is washed, and the flow rate of the water jet is 30-70L/min; (3) the method comprises the steps of finishing holes, improving the activity of the hole wall of the PCB, and enabling the hole wall to comprise resin, glass fibers, fillers of base materials and the like, so that the hole wall is easier to react with subsequent oxidizing liquid, slight oxides and slight stains on the surface and the hole wall of the PCB can be effectively removed, the flow rate of a water jet is 30-70L/min, and the operating temperature is 48-52 ℃; (4) water jet cleaning, 4-stage circulating water cleaning, and cleaning the residual liquid medicine in the whole holes on the board surface; (5) oxidizing, reacting the permanganate with the resin and glass fiber on the hole wall under the weak acidic condition to form a layer of MnO connected with a chemical bond on the hole wall2The layer MnO2Will become the oxidant for the subsequent catalytic reaction; (6) recycling and washing the oxidized liquid medicine remained on the board surface, and recycling sewage; (7) water jet washing, 4-stage circulating washing and washing for washing residual oxidized liquid medicine on the board surface; (8) catalysis, high molecular weight substances 8230A and 8230R under acidic condition (PH:1.6-2.1) and MnO2Under the oxidation action of the organic conducting film, polymerizing the organic conducting film into a polymer with hole conducting property, namely depositing a thin organic conducting film on the medium layer in the hole; (9) water (W)Knife washing, 4-stage circulating water washing, and cleaning residual catalytic chemical liquid on the board surface; (10) drying, namely drying water stains on the surface and in holes of the PCB to avoid the surface oxidation from affecting the subsequent electrolytic copper, wherein the operation temperature is 80-90 ℃; VCP plating: plating a layer of copper, a connecting circuit copper layer and an aluminum layer on the blind holes of the aluminum substrate which is manufactured with the polymer conductive film, and the specific steps are as follows: (1) acid washing with 4-6% H2SO4Cleaning the oxide on the board surface, pre-wetting the PCB before the PCB enters a copper plating cylinder, and pickling for 33 seconds; (2) copper plating, namely plating a copper layer with required thickness (the principle is consistent with that of hole copper plating after ordinary chemical copper deposition) on the blind hole on which a thin organic conductive film is deposited under the action of current, wherein the copper plating time is 40 minutes, the copper plating current density is 35ASF, and copper sulfate pentahydrate and H are required to be used in the copper plating process2SO4CL-, Cu gloss agent supplement ST-2000(BST) and copper plating regulator ST-2000 (CST); (3) washing, namely circularly washing, and using the liquid medicine for washing the copper plating tank remained on the surface of the plate; (4) drying, namely drying water stains on the surface and in the holes of the PCB at the temperature of 80-90 ℃; and (4) finishing the operation: and completing the conduction of the blind hole.
Example six:
in the fifth example, the following steps were added:
in step 4, the copper surface of the aluminum substrate is conducted with the aluminum layer (the via hole is a blind hole, the aperture of the blind hole is 1.2mm, and the depth of the blind hole is required to be 1.3mm), 25A current is required to be resisted for 60s, the voltage reduction value between copper and aluminum is less than 2.5V, and the final production quality of the process is ensured.
Plate taking: taking the substrate with drilled blind holes; polymer conductive film: the method comprises the following steps of replacing common chemical copper deposition, depositing a thin organic conductive film on a dielectric layer of a blind hole, and directly plating copper during electroplating production, wherein the method comprises the following specific steps: (1) microetching, removing oxides and other impurities on the copper surface of the plate, roughening the copper surface, wherein the flow rate of a water jet is 30-70L/min, the operating temperature is 48-52 ℃, the (2) water jet washing and the 4-stage circulating water washing are carried out, and the residual microetching liquid medicine on the plate surface is washed, and the flow rate of the water jet is 30-70L/min; (3) the whole hole is treated to improve the activity of the PCB hole wall, and the activity comprises resin, glass fiber, filler of a base material and the like, so that the PCB hole wall is easier to react with subsequent oxidizing liquid, and the surface and the light wall of the PCB plate can be effectively removedMicro-oxide and slight stain, the flow rate of a water jet is 30-70L/min, and the operating temperature is 48-52 ℃; (4) water jet cleaning, 4-stage circulating water cleaning, and cleaning the residual liquid medicine in the whole holes on the board surface; (5) oxidizing, reacting the permanganate with the resin and glass fiber on the hole wall under the weak acidic condition to form a layer of MnO connected with a chemical bond on the hole wall2The layer MnO2Will become the oxidant for the subsequent catalytic reaction; (6) recycling and washing the oxidized liquid medicine remained on the board surface, and recycling sewage; (7) water jet washing, 4-stage circulating washing and washing for washing residual oxidized liquid medicine on the board surface; (8) catalysis, high molecular weight substances 8230A and 8230R under acidic condition (PH:1.6-2.1) and MnO2Under the oxidation action of the organic conducting film, polymerizing the organic conducting film into a polymer with hole conducting property, namely depositing a thin organic conducting film on the medium layer in the hole; (9) water jet washing, 4-stage circulating washing and cleaning residual catalytic chemical liquid on the board surface; (10) drying, namely drying water stains on the surface and in holes of the PCB to avoid the surface oxidation from affecting the subsequent electrolytic copper, wherein the operation temperature is 80-90 ℃; VCP plating: plating a layer of copper, a connecting circuit copper layer and an aluminum layer on the blind holes of the aluminum substrate which is manufactured with the polymer conductive film, and the specific steps are as follows: (1) acid washing with 4-6% H2SO4Cleaning the oxide on the board surface, pre-wetting the PCB before the PCB enters a copper plating cylinder, and pickling for 33 seconds; (2) copper plating, namely plating a copper layer with required thickness (the principle is consistent with that of hole copper plating after ordinary chemical copper deposition) on the blind hole on which a thin organic conductive film is deposited under the action of current, wherein the copper plating time is 40 minutes, the copper plating current density is 35ASF, and copper sulfate pentahydrate and H are required to be used in the copper plating process2SO4CL-, Cu gloss agent supplement ST-2000(BST) and copper plating regulator ST-2000 (CST); (3) washing, namely circularly washing, and using the liquid medicine for washing the copper plating tank remained on the surface of the plate; (4) drying, namely drying water stains on the surface and in the holes of the PCB at the temperature of 80-90 ℃; and (4) finishing the operation: and completing the conduction of the blind hole.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (10)

1. A novel aluminum substrate blind hole electroplating process is characterized in that: the method comprises the following steps: step 1: plate taking: taking the substrate with drilled blind holes; step 2: polymer conductive film: the method comprises the following steps of replacing common chemical copper deposition, depositing a thin organic conductive film on a dielectric layer of a blind hole, and directly plating copper during electroplating production, wherein the method comprises the following specific steps: (1) microetching, removing oxides and other impurities on the copper surface of the plate, roughening the copper surface, wherein the flow rate of a water jet is 30-70L/min, the operating temperature is 48-52 ℃, the (2) water jet washing and the 4-stage circulating water washing are carried out, and the residual microetching liquid medicine on the plate surface is washed, and the flow rate of the water jet is 30-70L/min; (3) the method comprises the steps of finishing holes, improving the activity of the hole wall of the PCB, and enabling the hole wall to comprise resin, glass fibers, fillers of base materials and the like, so that the hole wall is easier to react with subsequent oxidizing liquid, slight oxides and slight stains on the surface and the hole wall of the PCB can be effectively removed, the flow rate of a water jet is 30-70L/min, and the operating temperature is 48-52 ℃; (4) water jet cleaning, 4-stage circulating water cleaning, and cleaning the residual liquid medicine in the whole holes on the board surface; (5) oxidizing, reacting the permanganate with the resin and glass fiber on the hole wall under the weak acidic condition to form a layer of MnO connected with a chemical bond on the hole wall2The layer MnO2Will become the oxidant for the subsequent catalytic reaction; (6) recycling and washing the oxidized liquid medicine remained on the board surface, and recycling sewage; (7) water jet washing, 4-stage circulating washing and washing for washing residual oxidized liquid medicine on the board surface; (8) catalysis, high molecular weight substances 8230A and 8230R under acidic condition (PH:1.6-2.1) and MnO2Under the oxidation action of the organic conducting film, polymerizing the organic conducting film into a polymer with hole conducting property, namely depositing a thin organic conducting film on the medium layer in the hole; (9) water jet washing, 4-stage circulating washing and cleaning residual catalytic chemical liquid on the board surface; (10) drying, namely drying water stains on the surface and in holes of the PCB to avoid the surface oxidation from affecting the subsequent electrolytic copper, wherein the operation temperature is 80-90 ℃; and step 3: VCP plating: plating a layer of copper, a connecting circuit copper layer and an aluminum layer on the blind holes of the aluminum substrate which is manufactured with the polymer conductive film, and the specific steps are as follows: (1) acid washing with 4-6% H2SO4Cleaning the oxide on the board surface, pre-wetting the PCB before the PCB enters a copper plating cylinder, and pickling for 33 seconds; (2) plating ofCopper, plating a copper layer with required thickness on the blind hole deposited with a thin organic conductive film (the copper layer is consistent with the principle of electroplating the hole after ordinary chemical copper deposition) under the action of current, wherein the copper plating time is 40 minutes, the copper plating current density is 35ASF, and copper sulfate pentahydrate and H are required to be used in the copper plating process2SO4CL-, Cu gloss agent supplement ST-2000(BST) and copper plating regulator ST-2000 (CST); (3) washing, namely circularly washing, and cleaning the residual liquid medicine of the copper plating tank on the surface of the plate; (4) drying, namely drying water stains on the surface and in the holes of the PCB at the temperature of 80-90 ℃; and 4, step 4: and (4) finishing the operation: and completing the conduction of the blind hole.
2. The novel aluminum substrate blind hole electroplating process according to claim 1, characterized in that: in step 2, the use of a conveying device ensures that the plate gets sufficient washing time in each washing tank and reaction time in each washing tank.
3. The novel aluminum substrate blind hole electroplating process according to claim 1, characterized in that: in the step 2, the microetching, pore-forming, oxidizing, catalytic chemical reaction section and the oxidized recycling water washing section need to adopt water jet immersion bath, and the subsequent water washing of the oxidizing and catalytic section is suggested to adopt an immersion bath type.
4. The novel aluminum substrate blind hole electroplating process according to claim 1, characterized in that: in the step 2, the size of the opening and the spraying flow rate of the water jet cutter and the distribution mode of the water jet cutter are designed according to the characteristics of the plate; the water jet needs to be maintained regularly to prevent blockage.
5. The novel aluminum substrate blind hole electroplating process according to claim 1, characterized in that: in step 2, the whole hole needs to be equipped with ultrasonic oscillation, the frequency is 28.5KHZ, and the power is: 20-30W/Lit; after the frequency and the power of the ultrasonic waves are debugged, the frequency and the power of the ultrasonic waves cannot be changed randomly; and needs to be checked regularly.
6. The novel aluminum substrate blind hole electroplating process according to claim 1, characterized in that: in the step 2, all the liquid medicine tanks need to be strictly controlled by temperature; and is provided with a temperature control alarm; the temperature control needs to be corrected regularly, and all the liquid medicine tanks need to be provided with alarm devices with independent upper tank liquid levels and lower tank liquid levels.
7. The novel aluminum substrate blind hole electroplating process according to claim 1, characterized in that: in the step 2, the oxidation tank needs an automatic water replenishing device, in order to keep the temperature of the tank liquor stable, the water replenishing amount is not more than 1% of the volume of the opened cylinder each time, and the time interval of the water replenishing for two times is not less than 3 minutes.
8. The novel aluminum substrate blind hole electroplating process according to claim 1, characterized in that: in the step 3, the water washing time is 41 seconds, and the spraying pressure is 2-3kg/cm2。
9. The novel aluminum substrate blind hole electroplating process according to claim 1, characterized in that: in step 3, the plates are transported using equipment to ensure that sufficient washing time is available for the plates in each washing tank and reaction time is available in each washing tank.
10. The novel aluminum substrate blind hole electroplating process according to claim 1, characterized in that: in the step 4, the copper surface of the aluminum substrate is conducted with the aluminum layer (the via hole is a blind hole, the aperture of the blind hole is 1.2mm, and the depth of the blind hole is required to be 1.3mm), 25A current is required to be resisted for 60s, and the voltage reduction value between copper and aluminum is less than 2.5V.
CN202010690510.1A 2020-07-16 2020-07-16 Novel aluminum substrate blind hole electroplating process Pending CN111935919A (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2447296A1 (en) * 2010-10-29 2012-05-02 Enthone, Inc. Compostion and method for the deposition of conductive polymers on dielectric substrates
CN103491710A (en) * 2013-09-09 2014-01-01 莆田市龙腾电子科技有限公司 Process for processing two-sided and multilayer circuit board
CN103957670A (en) * 2014-05-21 2014-07-30 广东达进电子科技有限公司 Direct plating technology of circuit board
CN108738237A (en) * 2018-08-06 2018-11-02 深圳市博敏电子有限公司 A kind of manufacturing method of potting aluminium row structure printed circuit board
CN109275284A (en) * 2018-10-26 2019-01-25 昆山中哲电子有限公司 A kind of HDI circuit board electroplating filling perforation method
CN110677978A (en) * 2019-09-11 2020-01-10 珠海精路电子有限公司 Printed circuit board and manufacturing method thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2447296A1 (en) * 2010-10-29 2012-05-02 Enthone, Inc. Compostion and method for the deposition of conductive polymers on dielectric substrates
CN103491710A (en) * 2013-09-09 2014-01-01 莆田市龙腾电子科技有限公司 Process for processing two-sided and multilayer circuit board
CN103957670A (en) * 2014-05-21 2014-07-30 广东达进电子科技有限公司 Direct plating technology of circuit board
CN108738237A (en) * 2018-08-06 2018-11-02 深圳市博敏电子有限公司 A kind of manufacturing method of potting aluminium row structure printed circuit board
CN109275284A (en) * 2018-10-26 2019-01-25 昆山中哲电子有限公司 A kind of HDI circuit board electroplating filling perforation method
CN110677978A (en) * 2019-09-11 2020-01-10 珠海精路电子有限公司 Printed circuit board and manufacturing method thereof

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Application publication date: 20201113