CN111935576A - Earphone and assembling method thereof - Google Patents
Earphone and assembling method thereof Download PDFInfo
- Publication number
- CN111935576A CN111935576A CN202010624381.6A CN202010624381A CN111935576A CN 111935576 A CN111935576 A CN 111935576A CN 202010624381 A CN202010624381 A CN 202010624381A CN 111935576 A CN111935576 A CN 111935576A
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- upper cover
- accommodating space
- lower cover
- fixed
- mainboard
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- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000001746 injection moulding Methods 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 238000010276 construction Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 13
- 230000005611 electricity Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1025—Accumulators or arrangements for charging
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1033—Cables or cables storage, e.g. cable reels
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1058—Manufacture or assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
- H04R2201/105—Manufacture of mono- or stereophonic headphone components
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Battery Mounting, Suspending (AREA)
- Headphones And Earphones (AREA)
Abstract
The invention provides an earphone and an assembly method thereof, wherein the earphone comprises a battery module, a mainboard, a first electric connecting element, a loudspeaker module and a second electric connecting element; the battery module comprises a shell with a first accommodating space and a battery element accommodated in the first accommodating space and used for supplying power; the loudspeaker module is fixedly connected with the shell and forms a second accommodating space together with the shell, and the mainboard is positioned in the second accommodating space; the main board is fixedly accommodated in the second accommodating space; the first electric connecting element penetrates through the shell from the first accommodating space to extend into the second accommodating space, one end of the first electric connecting element is electrically connected with the battery element, and the other end of the first electric connecting element extends into the second accommodating space to be electrically connected with the mainboard; the second electric connecting element is fixed on the mainboard and electrically connects the mainboard with the loudspeaker module. Compared with the related art, the earphone has the advantages of few welding spots, simple circuit structure and high assembly efficiency.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of electroacoustic conversion devices, in particular to an earphone.
[ background of the invention ]
With the advent of the mobile internet age, the number of smart mobile devices is increasing. Among them, the TWS wireless headset is popular with consumers since its appearance, and the demand thereof is greatly increased year by year.
In the related art, a TWS wireless headset includes a housing having a first receiving space, a main board and a speaker box, wherein a battery element received in the first receiving space is respectively fixed to an outer side of the housing, the main board is electrically connected to the battery element by a cable wound around the housing, the cable needs to be soldered to a solder joint of the main board, and the speaker module and the main board need to be soldered to form an electrical connection therebetween.
The volume is less more and more, and the function is more and more, and consequently, various circuit connection and control relation are also more complicated, and then bring the circuit board welding more, and the cable wire winding is complicated, and the production assembly is difficult, needs glue fixed sometimes, and then causes the product uniformity poor, and the reliability reduces in the use.
However, in the earphones of the related art, because various circuit connections and control relations are complex, a plurality of welding points need to be welded, and the cable is complex in winding, so that the circuit structure is complex; in addition, during assembly, due to the fact that welding spots are too many, welding needs to be carried out for many times, and assembly production efficiency of the TWS wireless earphone is seriously affected.
Therefore, it is necessary to provide a new earphone to solve the above technical problems.
[ summary of the invention ]
The invention aims to provide an earphone with few welding spots, simple circuit structure and high assembly efficiency.
In order to achieve the above object, the present invention provides an earphone comprising:
the battery module comprises a shell with a first accommodating space and a battery element accommodated in the first accommodating space and used for supplying power;
the loudspeaker module is fixedly connected to one side of the shell, which is far away from the first accommodating space, and forms a second accommodating space together with the shell;
the main board is fixedly accommodated in the second accommodating space;
the first electric connecting element penetrates through the shell from the first accommodating space and extends into the second accommodating space, one end of the first electric connecting element is electrically connected with the battery element, and the other end of the first electric connecting element extends into the second accommodating space and is electrically connected with the mainboard; and the number of the first and second groups,
and the second electric connecting element is fixed on the mainboard and electrically connects the mainboard with the loudspeaker module.
Preferably, the first electrical connecting element is fixed to the housing, and the first electrical connecting element and the housing are of an integrally formed structure.
Preferably, the housing includes an upper cover and a lower cover covering the upper cover and enclosing the first accommodating space together with the upper cover, the speaker module is covered and fixed on the upper cover, and the main board is fixed on the upper cover; the first electric connection element comprises a first element fixed on the upper cover and a second element fixed on the lower cover, and the main board is electrically connected with the positive pole and the negative pole of the battery element through the first element and the second element respectively.
Preferably, one side of the upper cover, which is close to the main board, is recessed to form an accommodating groove, the main board is accommodated in the accommodating groove, and the speaker module is covered on the accommodating groove.
Preferably, the first element is a conductive elastic sheet or a spring thimble, and the first element and the upper cover form an integrally formed structure through an injection molding process.
Preferably, the second element is a conductive elastic sheet, and the second element and the lower cover form an integrally formed structure through an injection molding process.
Preferably, the lower cover is made of laser direct forming plastic, the second element is a laser direct forming line, and the second element is formed on the lower cover through a laser direct forming process.
Preferably, the earphone further includes an antenna element affixed to an outer side of the housing, and a shielding element housed in the first housing space and fixed to a side of the housing close to the antenna element, wherein the shielding element is located between the battery element and the antenna element for shielding and protecting the antenna element.
Preferably, the housing is made of laser direct structuring plastic, the antenna element is a laser direct structuring antenna, and the antenna element is formed outside the housing by a laser direct structuring process.
Preferably, the casing includes set up in the upper cover with first buckle structure between the lower cover and set up in the upper cover is close to the second buckle structure of speaker module one side, the upper cover with realize the buckle fixed through first buckle structure between the lower cover, the speaker module passes through the second buckle structure with the upper cover realizes the buckle fixed.
Preferably, the housing further comprises a sealing ring, and the sealing ring is compressed between the upper cover and the lower cover to seal the upper cover and the lower cover.
The invention provides an assembling method of an earphone, which comprises the following steps:
step S1, providing an upper cover, a lower cover, a battery element, a mainboard and a loudspeaker module; the upper cover is provided with a first element, the first element and the upper cover are of an integrally formed structure, the lower cover is provided with a second element, the second element and the lower cover are of an integrally formed structure, and the mainboard is provided with a second electric connection element;
step S2, fixedly connecting the upper cover and the lower cover, and fixedly accommodating the battery element in a first accommodating space formed by the upper cover and the lower cover;
step S3, fixing the main board to the upper cover, and electrically connecting the main board to the positive electrode and the negative electrode of the battery element through the first element and the second element, respectively;
and step S4, fixing the loudspeaker module on the upper cover, and electrically connecting the loudspeaker module with the mainboard through the second electric connection element.
Preferably, in the step S2, the upper cover and the lower cover are provided with a first snap structure, and the upper cover and the lower cover are fixed by the first snap structure.
Preferably, in step S4, a second fastening structure is disposed on a side of the upper cover close to the speaker module, and the speaker module is fastened and fixed with the upper cover through the second fastening structure.
Compared with the prior art, in the earphone, the first electric connecting element passes through the shell from the first accommodating space and extends into the second accommodating space, one end of the first electric connecting element is electrically connected with the battery element, and the other end of the first electric connecting element extends into the second accommodating space and is electrically connected with the main board; in the structure, when actual assembly, the mainboard is installed in the second accommodating space, the direct first electrical connection component contact of mainboard realizes the electricity between mainboard and the battery element and is connected, the process of coiling the cable on the casing has not only been saved, effectively simplify circuit structure, solder joint between mainboard and the battery module has still been reduced, the welding process of the electrical contact between mainboard and the battery module has been saved, in addition, through the setting of second electrical connection component, make the speaker module can realize the electricity between speaker module and the mainboard with the contact of second electrical connection component and be connected, the welding process of the electrical contact between speaker module and the second electrical connection component has also been saved, the efficiency of assembly has effectively been improved.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
fig. 1 is a schematic structural diagram of the earphone of the present invention;
fig. 2 is a view illustrating an assembly method of the earphone of the present invention.
[ detailed description ] embodiments
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides an earphone 100, which includes a battery module 1, a main board 2, a first electrical connecting element 3, a speaker module 4, and a second electrical connecting element 5.
The battery module 1 includes a housing 11 having a first receiving space 110, and a battery element 12 received in the first receiving space 110 for supplying power.
In the present embodiment, the housing 11 includes an upper cover 111 and a lower cover 112 covering the upper cover 111 and enclosing the first accommodating space 110 together with the upper cover 111; the battery element 12 is a button battery and comprises a positive electrode 121 and a negative electrode 122, the internal cells of the battery element 12 are packaged once by an aluminum plastic film before packaging, and the internal cells of the battery element 12 are better protected and the reliability of the battery element is ensured.
The speaker module 4 is fixedly connected to the housing 11 and encloses the second accommodating space 40 together with the housing 11; the main board 2 is fixed to the outer side of the housing 11 and located in the second receiving space 40, the first electrical connecting element 3 passes through the housing 11 from the first receiving space 110 and extends into the second receiving space 40, one end of the first electrical connecting element 3 is electrically connected to the battery element 12, the other end of the first electrical connecting element 3 extends into the second receiving space 40, the main board 2 is electrically connected, the second electrical connecting element 5 is fixed to the main board 2 at a side close to the upper speaker module 4, and the speaker module 4 is electrically connected to the main board 2 through the second electrical connecting element 5.
It should be noted that, for the convenience of assembly, in the present embodiment, the first electrical connecting element 3 is integrated on the housing 11, and more specifically, the first electrical connecting element 3 is fixed to the housing 11, and the first electrical connecting element 3 and the housing 11 are integrally formed.
Further, the first electrical connection element 3 includes a first element 31 fixed to the upper cover 111 and electrically connected to the positive electrode 121, and a second element 32 fixed to the lower cover 112 and electrically connected to the negative electrode 122; the main board 2 is fixed to the upper cover 111, and the main board 2 is electrically connected to the positive electrode 121 and the negative electrode 122 of the battery element 12 through the first element 31 and the second element 32, respectively; speaker module 4 lid is established and is fixed in upper cover 111 is located mainboard 2 is kept away from one side of upper cover 111, more specifically, speaker module 4 is located in including fixed lid the support 41 of upper cover 111 and be fixed in support 41 is close to the speaker 42 of mainboard 2 one side, speaker 42 with mainboard 2 just to setting up and pass through second electrical connecting element 5 with mainboard 2 realizes the electricity and connects.
Preferably, a receiving groove 1110 is formed by recessing the upper cover 111 near the main board 2, the main board 2 is received in the receiving groove 1110, the bracket 41 of the speaker module 4 is covered in the receiving groove 1110, at this time, the receiving groove 1110 serves as the second receiving space 40, the first element 31 and the second element 32 respectively extend into the receiving groove 1110, and by the receiving groove 1110, the space utilization rate of the housing 11 is effectively improved, so that the overall size of the earphone 100 is reduced, and the miniaturization design of the earphone 100 is facilitated.
It should be noted that the first element 31 is a conductive elastic sheet or a pogo pin (i.e. pogo pin), and the first element 31 and the upper cover 111 form an integrated structure through an injection molding process. The second element 32 is a conductive elastic sheet or a Laser Direct Structuring (i.e., LDS) circuit, for example, in the present embodiment, the lower cover 112 is made of Laser Direct Structuring plastic (i.e., LDS plastic), and the second element 32 is a Laser Direct Structuring circuit, i.e., the second element 32 is formed on the lower cover 112 by a Laser Direct Structuring process (i.e., LDS process); of course, in other embodiments, the lower cover may also be a conductive elastic sheet, and in this case, the second element and the lower cover form an integrally formed structure through an injection molding process.
The second electrical connection element 5 is a conductive elastic sheet or a pogo pin, for example, in the present embodiment, the second electrical connection element 5 is a pogo pin, and the pogo pin is mounted on the motherboard 2 by an SMT process (Surface Mount Technology).
In the above structure, the first component 31 and the second component 32 are directly integrated on the upper cover 111 and the lower cover 112, respectively, during the actual assembly, after the upper cover 111 and the lower cover 112 are assembled together, the internal battery component 12 is electrically connected with the first component 31 and the second component 32, respectively, then the motherboard 2 is assembled on the upper cover 111, the motherboard 2 is directly electrically connected with the first component 31 and the second component 32, here, no additional cable is needed to be arranged to electrically connect the motherboard 2 and the battery module 1, the problem of complex winding of redundant cables and cables in the related art is avoided, the circuit structure is effectively simplified, meanwhile, the welding points between the motherboard 2 and the battery module 1 are effectively reduced, so that in the actual assembly process, only the modules are directly assembled, the welding process of the electrical contact points between the motherboard 2 and the battery module 1 is omitted, in addition, through the arrangement of the second electrical connection element 5, the speaker 42 of the speaker module 4 is in contact with the second electrical connection element 5, so that the electrical connection between the speaker 42 and the main board 2 can be realized, the welding process of the electrical contact point between the speaker 42 and the second electrical connection element 5 is also effectively omitted, and the assembly efficiency is effectively improved.
Preferably, in order to facilitate the assembly, the housing 11 includes a first fastening structure 1101 disposed between the upper cover 111 and the lower cover 112 and a second fastening structure 1102 disposed on a side of the upper cover 111 close to the bracket 41 of the speaker module 4, the upper cover 111 and the lower cover 112 are fastened and fixed by the first fastening structure 1101, and the bracket 41 is fastened and fixed with the upper cover 111 by the second fastening structure 1102, so that the assembly process is omitted, the packaging of the battery module 1 and the assembly of the speaker module 4 on the battery module 1 are more convenient, the assembly process is simple, the assembly efficiency is effectively improved, and the assembly is more favorable for automatic production.
In order to ensure the sealing performance inside the casing 11, the casing 11 may be further provided with a sealing ring 7, and the sealing ring 7 is compressed between the upper cover 111 and the lower cover 112 to seal between the upper cover 111 and the lower cover 112, that is, the battery element 12 is accommodated in a sealed cavity, so as to prevent external moisture or foreign matters from entering the first accommodating space 110, thereby causing adverse effects on the battery element 12 and improving the reliability of the battery element 12.
Preferably, the earphone 100 further includes an antenna element 6 attached and fixed to an outer side of the housing 11, and a shielding element 7 accommodated in the first accommodating space 110 and fixed to a side of the housing 11 close to the antenna element 6, wherein the shielding element 7 is located between the battery element 12 and the antenna element 6 for shielding and protecting the antenna element 6.
It is worth mentioning that the antenna element 6 is a laser direct structuring antenna (i.e., LDS antenna), and the antenna element 6 is formed on the lower cover 112 of the housing 11 through a laser direct structuring process (i.e., LDS process); of course, in other embodiments, the antenna element may be attached and fixed to the housing by an SMT process.
The present invention provides a method for manufacturing the earphone 100, which includes the following steps:
step S1, providing the upper cover 111, the lower cover 112, the battery element 12, the main board 2 and the speaker module 4; the upper cover 111 is provided with a first element 31, the first element 31 and the upper cover 111 are of an integrally formed structure, the lower cover 112 is provided with a second element 32, the second element 32 and the lower cover 112 are of an integrally formed structure, and the main board 2 is provided with a second electrical connection element 5.
Step S2, fixedly connecting the upper cover 111 and the lower cover 112 to form the housing 11, and fixedly accommodating the battery element 12 in the first accommodating space 110 formed by the upper cover 111 and the lower cover 112; here, the case 11 and the battery element 12 are assembled to realize an overall packaging process of the battery module 1.
Preferably, in step S2, in order to facilitate the assembly between the upper cover 111 and the lower cover 112, a first snap structure 1101 is disposed between the upper cover 111 and the lower cover 112, and the upper cover 111 and the lower cover 112 are fixed by the first snap structure 1101.
Step S3 is to fix the main board 2 to the upper cover 111, and to electrically connect the main board 2 to the positive electrode 121 and the negative electrode 122 of the battery element 12 through the first element 31 and the second element 31, respectively.
Step S4, the bracket 41 of the speaker module 4 is fixed to the upper cover 111 in a covering manner, and the speaker 42 of the speaker module 4 is electrically connected to the main board 2 through the second electrical connecting element 5.
Preferably, in step S4, in order to facilitate the assembly between the speaker module 4 and the upper cover 111, a second latching structure 1102 is disposed on a side of the upper cover 111 close to the speaker module 4, and the speaker module 4 is latched and fixed to the upper cover 111 through the second latching structure 1102.
Compared with the prior art, in the earphone, the first electric connecting element passes through the shell from the first accommodating space and extends into the second accommodating space, one end of the first electric connecting element is electrically connected with the battery element, and the other end of the first electric connecting element extends into the second accommodating space and is electrically connected with the main board; in the structure, when actual assembly, the mainboard is installed in the second accommodating space, the direct first electrical connection component contact of mainboard realizes the electricity between mainboard and the battery element and is connected, the process of coiling the cable on the casing has not only been saved, effectively simplify circuit structure, solder joint between mainboard and the battery module has still been reduced, the welding process of the electrical contact between mainboard and the battery module has been saved, in addition, through the setting of second electrical connection component, make the speaker module can realize the electricity between speaker module and the mainboard with the contact of second electrical connection component and be connected, the welding process of the electrical contact between speaker module and the second electrical connection component has also been saved, the efficiency of assembly has effectively been improved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (14)
1. An earphone, characterized in that it comprises:
the battery module comprises a shell with a first accommodating space and a battery element accommodated in the first accommodating space and used for supplying power;
the loudspeaker module is fixedly connected to one side of the shell, which is far away from the first accommodating space, and forms a second accommodating space together with the shell;
the main board is fixedly accommodated in the second accommodating space;
the first electric connecting element penetrates through the shell from the first accommodating space and extends into the second accommodating space, one end of the first electric connecting element is electrically connected with the battery element, and the other end of the first electric connecting element extends into the second accommodating space and is electrically connected with the mainboard; and the number of the first and second groups,
and the second electric connecting element is fixed on the mainboard and electrically connects the mainboard with the loudspeaker module.
2. The headset of claim 1, wherein the first electrical connection element is secured to the housing, the first electrical connection element being of unitary construction with the housing.
3. The earphone according to claim 2, wherein the housing comprises an upper cover and a lower cover covering the upper cover and enclosing the first receiving space together with the upper cover, the speaker module is covered and fixed on the upper cover, and the main board is fixed on the upper cover; the first electric connection element comprises a first element fixed on the upper cover and a second element fixed on the lower cover, and the main board is electrically connected with the positive pole and the negative pole of the battery element through the first element and the second element respectively.
4. The earphone according to claim 3, wherein the upper cover is recessed to form a receiving groove near the main board, the main board is received in the receiving groove, and the speaker module is covered in the receiving groove.
5. The earphone according to claim 3, wherein the first element is a conductive elastic sheet or a spring thimble, and the first element and the upper cover form an integral structure through an injection molding process.
6. The earphone according to claim 3, wherein the second element is a conductive elastic sheet, and the second element and the lower cover form an integrated structure through an injection molding process.
7. The headset of claim 3, wherein the lower cover is made of laser direct structuring plastic, the second element is a laser direct structuring wire, and the second element is formed on the lower cover by a laser direct structuring process.
8. The earphone according to claim 1, further comprising an antenna element attached and fixed to an outer side of the housing, and a shielding element accommodated in the first accommodating space and fixed to a side of the housing close to the antenna element, wherein the shielding element is located between the battery element and the antenna element for shielding and protecting the antenna element.
9. The headset of claim 8, wherein the housing is laser direct structuring plastic, and wherein the antenna element is a laser direct structuring antenna, the antenna element being formed outside the housing by a laser direct structuring process.
10. The earphone according to claim 3, wherein the housing comprises a first fastening structure disposed between the upper cover and the lower cover and a second fastening structure disposed on a side of the upper cover close to the speaker module, the upper cover and the lower cover are fastened and fixed by the first fastening structure, and the speaker module is fastened and fixed by the second fastening structure and the upper cover.
11. The headset of claim 10, wherein the housing further comprises a sealing ring compressed between the upper cover and the lower cover to seal the upper cover and the lower cover.
12. A method of assembling a headset, comprising the steps of:
step S1, providing an upper cover, a lower cover, a battery element, a mainboard and a loudspeaker module; the upper cover is provided with a first element, the first element and the upper cover are of an integrally formed structure, the lower cover is provided with a second element, the second element and the lower cover are of an integrally formed structure, and the mainboard is provided with a second electric connection element;
step S2, fixedly connecting the upper cover and the lower cover, and fixedly accommodating the battery element in a first accommodating space formed by the upper cover and the lower cover;
step S3, fixing the main board to the upper cover, and electrically connecting the main board to the positive electrode and the negative electrode of the battery element through the first element and the second element, respectively;
and step S4, fixing the loudspeaker module on the upper cover, and electrically connecting the loudspeaker module with the mainboard through the second electric connection element.
13. The assembling method of the earphone according to claim 12, wherein in the step S2, the upper cover and the lower cover are provided with a first snap structure, and the upper cover and the lower cover are fixed by the first snap structure.
14. The method for assembling earphone according to claim 12, wherein in step S4, a second snap structure is provided on a side of the upper cover close to the speaker module, and the speaker module is fixed to the upper cover by the second snap structure.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010624381.6A CN111935576B (en) | 2020-06-30 | 2020-06-30 | Earphone and assembling method thereof |
| PCT/CN2020/102775 WO2022000582A1 (en) | 2020-06-30 | 2020-07-17 | Earphone and assembly method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010624381.6A CN111935576B (en) | 2020-06-30 | 2020-06-30 | Earphone and assembling method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111935576A true CN111935576A (en) | 2020-11-13 |
| CN111935576B CN111935576B (en) | 2022-05-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010624381.6A Expired - Fee Related CN111935576B (en) | 2020-06-30 | 2020-06-30 | Earphone and assembling method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111935576B (en) |
| WO (1) | WO2022000582A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113635053A (en) * | 2021-09-14 | 2021-11-12 | 东莞市猎声电子科技有限公司 | Earphone equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170078784A1 (en) * | 2014-08-12 | 2017-03-16 | Google Technology Holdings LLC | Circuit assembly for compact acoustic device |
| CN208707890U (en) * | 2018-09-11 | 2019-04-05 | 深圳市沃特沃德股份有限公司 | The fixed structure of bluetooth headset battery |
| CN208724160U (en) * | 2018-09-11 | 2019-04-09 | 深圳市沃特沃德股份有限公司 | Bluetooth headset |
| CN109660900A (en) * | 2018-12-31 | 2019-04-19 | 周利英 | True wireless Bluetooth headsets |
| CN110049398A (en) * | 2019-05-23 | 2019-07-23 | 深圳市迈斯高科技有限公司 | A kind of Novel earphone structure and assemble method |
| CN209419799U (en) * | 2019-03-25 | 2019-09-20 | 安克创新科技股份有限公司 | A kind of bluetooth headset |
| CN210609609U (en) * | 2019-09-26 | 2020-05-22 | 中山市嵘鑫电子科技有限公司 | Welding-free connecting structure for internal modules of Bluetooth headset |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107889003B (en) * | 2016-09-30 | 2024-04-02 | 深圳市三诺声智联股份有限公司 | Wireless earphone |
| CN208386867U (en) * | 2018-06-04 | 2019-01-15 | Oppo广东移动通信有限公司 | Wireless headset |
| CN208707887U (en) * | 2018-09-11 | 2019-04-05 | 深圳市沃特沃德股份有限公司 | The main board fixed structure of bluetooth headset |
| TWI750436B (en) * | 2018-12-20 | 2021-12-21 | 華龍國際科技股份有限公司 | Inner mold assembly for wireless earphones |
| CN110198503B (en) * | 2019-04-25 | 2021-08-13 | 华为技术有限公司 | Wireless earphone |
| CN110519671A (en) * | 2019-08-26 | 2019-11-29 | 华为技术有限公司 | Wireless headset |
-
2020
- 2020-06-30 CN CN202010624381.6A patent/CN111935576B/en not_active Expired - Fee Related
- 2020-07-17 WO PCT/CN2020/102775 patent/WO2022000582A1/en active Application Filing
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170078784A1 (en) * | 2014-08-12 | 2017-03-16 | Google Technology Holdings LLC | Circuit assembly for compact acoustic device |
| CN208707890U (en) * | 2018-09-11 | 2019-04-05 | 深圳市沃特沃德股份有限公司 | The fixed structure of bluetooth headset battery |
| CN208724160U (en) * | 2018-09-11 | 2019-04-09 | 深圳市沃特沃德股份有限公司 | Bluetooth headset |
| CN109660900A (en) * | 2018-12-31 | 2019-04-19 | 周利英 | True wireless Bluetooth headsets |
| CN209419799U (en) * | 2019-03-25 | 2019-09-20 | 安克创新科技股份有限公司 | A kind of bluetooth headset |
| CN110049398A (en) * | 2019-05-23 | 2019-07-23 | 深圳市迈斯高科技有限公司 | A kind of Novel earphone structure and assemble method |
| CN111050249A (en) * | 2019-05-23 | 2020-04-21 | 深圳市迈斯高科技有限公司 | Earphone set |
| CN210609609U (en) * | 2019-09-26 | 2020-05-22 | 中山市嵘鑫电子科技有限公司 | Welding-free connecting structure for internal modules of Bluetooth headset |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113635053A (en) * | 2021-09-14 | 2021-11-12 | 东莞市猎声电子科技有限公司 | Earphone equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022000582A1 (en) | 2022-01-06 |
| CN111935576B (en) | 2022-05-03 |
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