CN111933682A - Display panel and preparation method thereof - Google Patents

Display panel and preparation method thereof Download PDF

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Publication number
CN111933682A
CN111933682A CN202010989635.4A CN202010989635A CN111933682A CN 111933682 A CN111933682 A CN 111933682A CN 202010989635 A CN202010989635 A CN 202010989635A CN 111933682 A CN111933682 A CN 111933682A
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layer
transport layer
injection layer
thickness
electron
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CN111933682B (en
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夏宇飞
岳春波
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Ji Hua Laboratory
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Ji Hua Laboratory
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/35Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing

Abstract

The invention relates to the technical field of display devices, and particularly discloses a display panel and a preparation method thereof, wherein the preparation method comprises the following steps: a substrate divided into a first region and a second region, the pixel density of the second region being less than the pixel density of the first region; the first area is provided with a first pixel definition layer, the second area is provided with a second pixel definition layer, and the density and the height of the second pixel definition layer are different from those of the first pixel definition layer; a first hole injection layer, a first hole transport layer, a first light emitting layer, a first electron transport layer, and a first electron injection layer are prepared on the first region and the second region, respectively, by inkjet printing, and the thickness of each film layer of the second region is smaller than that of each film layer of the second region. The invention prints two areas with different pixel densities on the same display substrate by an ink-jet printing method, the ink-jet printing method has high precision, is suitable for large-area flexible printing manufacture procedures, and can improve the uniformity of film formation by debugging a printing algorithm.

Description

Display panel and preparation method thereof
Technical Field
The invention relates to the technical field of display devices, in particular to a display panel and a preparation method thereof.
Background
With the rapid development of electronic products in recent years, mobile phones have become the most interesting electronic products for the public. The mobile phone display screen is a window of a consumer sensing mobile phone, and for the mobile phone, the design of the display window is very important. The full screen is designed to be close to 100% in screen ratio, in the design of the full-screen mobile phone, the front screen ratio is close to 100%, and optical devices such as a camera and a photosensitive device are not placed at positions. Therefore, in order to place the optical device under the screen, the screen body directly above the optical device needs to have both higher light transmittance and better display effect, so that a real full screen can be realized.
The existing OLED panel is used for preparing a full screen with two different pixel densities by an evaporation method, however, the method needs double masks, for example, six masks are needed for evaporation of red, green and blue light emitting layers, so that the process preparation cost is greatly increased, and the development of the full screen is restricted.
How to obtain a full-screen preparation method with lower process cost has important significance.
Disclosure of Invention
A first object of the present invention is to provide a display panel, which includes a substrate divided into a first region and a second region, wherein the pixel density of the second region is less than that of the first region;
the first region is provided with a first pixel defining layer, and a first anode, a first hole injection layer, a first hole transport layer, a first light emitting layer, a first electron transport layer, a first electron injection layer, a first cathode and a first light extraction layer are sequentially arranged on the first region;
the second region is provided with a second pixel defining layer, and a second anode, a second hole injection layer, a second hole transport layer, a second light emitting layer, a second electron transport layer, a second electron injection layer, a second cathode and a second light extraction layer are sequentially arranged on the second region;
the density of the second pixel definition layer is less than the density of the first pixel definition layer, the height of the second pixel definition layer is less than the height of the first pixel definition layer, or the height of the second pixel definition layer is equal to the height of the first pixel definition layer;
the thickness of the second anode is smaller than that of the first anode, the thickness of the second hole injection layer is smaller than that of the first hole injection layer, the thickness of the second hole transport layer is smaller than that of the first hole transport layer, the thickness of the second light emitting layer is smaller than that of the first light emitting layer, the thickness of the second electron transport layer is smaller than that of the first electron transport layer, the thickness of the second electron injection layer is smaller than that of the first electron injection layer, the thickness of the second cathode is smaller than that of the first cathode, and the thickness of the second light extraction layer is smaller than that of the first light extraction layer.
Further, the thickness of the first anode is 60-300 nm; the thickness of the first hole injection layer is 20-30 nm; the thickness of the first hole transport layer is 10-30 nm; the thickness of the first light-emitting layer is 30-80 nm; the thickness of the first electron transmission layer is 10-30 nm; the thickness of the first electron injection layer is 1-10 nm; the thickness of the first cathode is 10-100 nm; the thickness of the first light extraction layer is 40-100 nm.
Further, the thickness of each film layer of the second area is 50% -90% of that of each film layer of the first area.
Correspondingly, the invention also provides a display panel preparation method, which is used for preparing the display panel and comprises the following steps:
providing a substrate, and dividing the substrate into a first area and a second area;
preparing a first pixel defining layer on the first region and a second pixel defining layer on the second region;
sequentially preparing a first anode, a first hole injection layer, a first hole transport layer, a first light emitting layer, a first electron transport layer, a first electron injection layer, a first cathode and a first light extraction layer on the first region;
the first hole injection layer, the first hole transport layer, the first light emitting layer, the first electron transport layer and the first electron injection layer are prepared by adopting an ink-jet printing method;
sequentially preparing a second anode, a second hole injection layer, a second hole transport layer, a second light emitting layer, a second electron transport layer, a second electron injection layer, a second cathode and a second light extraction layer on the second region;
the second hole injection layer, the second hole transport layer, the second light-emitting layer, the second electron transport layer and the second electron injection layer are prepared by adopting an ink-jet printing method.
Further, the ink jet printing method comprises the following processes: the ink is driven into a pixel groove formed by a pixel definition layer through a nozzle module of the ink-jet printer, and then the ink in the pixel groove is subjected to vacuum drying and baking film forming treatment.
Further, the temperature of the baking film forming treatment is 100-250 ℃.
Further, performing ink-jet printing by adopting an ink-jet printing method, and sequentially printing a first hole injection layer, a first hole transport layer, a first light-emitting layer, a first electron transport layer and a first electron injection layer; and simultaneously printing a second hole injection layer, a second hole transport layer, a second light emitting layer, a second electron transport layer and a second electron injection layer in sequence;
or, the ink-jet printing method is adopted for ink-jet printing, the first hole injection layer, the first hole transport layer, the first luminescent layer, the first electron transport layer and the first electron injection layer are printed in sequence, and then the second hole injection layer, the second hole transport layer, the second luminescent layer, the second electron transport layer and the second electron injection layer are printed in sequence;
or, the ink-jet printing method is adopted for ink-jet printing, the second hole injection layer, the second hole transport layer, the second luminescent layer, the second electron transport layer and the second electron injection layer are printed in sequence, and then the first hole injection layer, the first hole transport layer, the first luminescent layer, the first electron transport layer and the first electron injection layer are printed in sequence.
Further, the first anode and the second anode are made of one or more of indium tin oxide, silver and aluminum, and are prepared by a sputtering film forming process and a yellow light process.
Further, the first cathode and the second cathode are made of one or more of indium tin oxide, silver and magnesium, and are prepared by an evaporation process or an ink-jet printing mode.
The first light extraction layer and the second light extraction layer are made of organic polymer materials, and are one or more of triarylamines, cyclic ureas, acyl structures, dibenzothiophenes, dibenzofurans and carbazoles.
Compared with the prior art, the invention has the following beneficial effects:
according to the preparation method of the display panel, two regions with different pixel densities are printed on the same display substrate through an ink-jet printing method, red, green and blue light-emitting layer materials are sequentially printed on the display substrate and dried to form a film, the ink-jet printing method is high in precision, is suitable for large-area flexible printing processes, can be used for improving the uniformity of the formed film through debugging a printing algorithm, and can be used for accurately and conveniently controlling the thicknesses of different regions through adjusting the ink drop amount of printing ink each time, so that the use of a large number of high-precision masks is avoided, the process cost is saved, the flexibility and diversity of process research and development are improved, and the development of a comprehensive screen technology is facilitated.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic diagram of a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a first region structure according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a second region according to an embodiment of the present invention.
Reference numerals:
100-a first area; 101-a first pixel definition layer; 102-a first anode; 103-a first hole injection layer; 104-first hole transport layer; 105-a first light emitting layer; 106-a first electron transport layer; 107-first electron injection layer; 108-a first cathode; 109 — first light extraction layer;
200-a second region; 201-a second pixel definition layer; 202-a second anode; 203-a second hole injection layer; 204 — a second hole transport layer; 205-a second light emitting layer; 206-a second electron transport layer; 207-a second electron injection layer; 208-a second cathode; 209-a second light extraction layer;
300-substrate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
It will also be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit indication of the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Fig. 1-3 are schematic diagrams of embodiments of a display panel according to the present invention.
Referring to fig. 1, in particular to an OLED full-screen scheme, in the embodiment, a display panel is divided into a first area 100 and a second area 200, wherein an AMOLED display module in a normal form is disposed on the first area 100, and an AMOLED or PMOLED display module with a lower pixel density than the first area 100 is disposed on the second area 200, so that the second area 200 has a higher light transmittance and can be matched with the first area 100 for displaying, thereby realizing a function of ensuring full-screen display of an optical device on the basis of providing a light transmission condition for the optical device.
Specifically, the display panel includes a first region 100 and a second region 200, and the pixel density of the second region 200 is less than that of the first region 100. The pixel density of the second region 200 is half of the pixel density of the first region 100, for example: the pixel density of the first region 100 is set to 300ppi, and the pixel density of the second region 200 is selected to be 150ppi, which can effectively ensure the light transmission condition of the optical device and good overall display function.
Referring to fig. 2, the first region 100 includes a substrate 300 and a first pixel definition layer 101 disposed on the substrate 300, wherein the first pixel definition layer 101 is a concave-convex structure and forms a plurality of pixel grooves. On the substrate 300, a first anode 102, a first hole injection layer 103, a first hole transport layer 104, a first light emitting layer 105, a first electron transport layer 106, a first electron injection layer 107, a first cathode 108, and a first light extraction layer 109 are provided in this order. The functional layer is divided into a plurality of pixel cells by pixel grooves formed by the first pixel defining layer 101.
Referring to fig. 3, the second region 200 includes a substrate 300 and a second pixel defining layer 201 disposed on the substrate 300, wherein the second pixel defining layer 201 is a concave-convex structure and forms a plurality of pixel grooves. And the thickness and height of the second pixel defining layer 201 are smaller than those of the first pixel defining layer 101. On the substrate 300, a second anode 202, a second hole injection layer 203, a second hole transport layer 204, a second light emitting layer 205, a second electron transport layer 206, a second electron injection layer 207, a second cathode 208, and a second light extraction layer 209 are provided in this order. The pixel groove formed by the second pixel defining layer 201 divides the functional layer into a plurality of pixel units.
Since the thickness and height of the second pixel defining layer 201 of the second region 200 are smaller than those of the first pixel defining layer 101 of the first region 100, the pixel density of the second region 200 is smaller than that of the first region 100, and when the second region 200 is placed on the optical device, the optical device can be provided with a light transmission condition, so that the normal use of the optical device is ensured, and meanwhile, the display function is also provided.
The preparation method of the display panel comprises the following steps:
10. providing a substrate and dividing regions
A substrate is provided, and a first region and a second region are defined on the substrate according to the mounting position and size of an optical device.
20. Preparing a pixel defining layer
Preparing a first pixel defining layer on the first region, and a second pixel defining layer on the second region, and the second pixel defining layer having a smaller height and density than the first pixel defining layer; the pixel defining layer can be prepared by means of photolithography, and can also be prepared by means of inkjet printing.
In an embodiment, the height of the second pixel defining layer may also be equal to the height of the first pixel defining layer.
30. Preparing a first region film layer
The method comprises the following steps of sequentially preparing a first anode, a first hole injection layer, a first hole transport layer, a first light emitting layer, a first electron transport layer, a first electron injection layer, a first cathode and a first light extraction layer on a first area, wherein the first hole injection layer, the first hole transport layer, the first light emitting layer, the first electron transport layer and the first electron injection layer are prepared by adopting ink-jet printing.
40. Preparing the second region film layer
And a second anode, a second hole injection layer, a second hole transport layer, a second luminescent layer, a second electron transport layer, a second electron injection layer, a second cathode and a second light extraction layer are sequentially prepared on the second region, and the second hole injection layer, the second hole transport layer, the second luminescent layer, the second electron transport layer and the second electron injection layer are prepared by adopting ink-jet printing.
The ink-jet printing process comprises the following steps: dissolving an OLED material in a proper solvent according to a certain proportion to prepare an ink solution, inputting a drawing of a full screen comprising a first area and a second area into an ink-jet printing device, driving the ink into a pixel groove formed by a pixel definition layer through a nozzle module of the ink-jet printer, and then carrying out vacuum drying and baking film-forming treatment on the ink in the pixel groove, wherein the baking temperature is 100-250 ℃.
In this embodiment, the first hole injection layer, the first hole transport layer, the first light emitting layer, the first electron transport layer, and the first electron injection layer of the first region and the second hole injection layer, the second hole transport layer, the second light emitting layer, the second electron transport layer, and the second electron injection layer of the second region are simultaneously prepared using an inkjet printer. The simultaneous printing is realized by changing the ink drop amount of the nozzle module in the ink-jet printer, and the ink jet amount is reduced in the second area with relatively low pixel density. By replacing the printing drawing or configuring the printing scheme with different pixel densities, the ink drop amount of the printing ink at each time is adjusted to adjust the film thickness, so that the printing effect of two different pixel areas can be realized.
In an embodiment, the first hole injection layer, the first hole transport layer, the first light emitting layer, the first electron transport layer, and the first electron injection layer in the first region may be printed first, and then the second hole injection layer, the second hole transport layer, the second light emitting layer, the second electron transport layer, and the second electron injection layer in the second region may be printed. Or printing a second hole injection layer, a second hole transport layer, a second luminescent layer, a second electron transport layer and a second electron injection layer in the second area, and then printing a first hole injection layer, a first hole transport layer, a first luminescent layer, a first electron transport layer and a first electron injection layer in the first area.
And each film thickness of the second region is less than each film thickness of the second region.
Specifically, the first anode and the second anode are made of one or a combination of indium tin oxide, silver and aluminum, wherein the thickness of the first anode is 60-300 nm, the thickness of the second anode is 50-90% of the thickness of the first anode, and the first anode and the second anode are used for preparing a patterned anode on the upper surface of the array substrate by a sputtering film forming process and a yellow light process.
The first hole injection layer is arranged on the upper surface of the first anode, the second hole injection layer is arranged on the surface of the second anode and is made of ink, the thickness of the first hole injection layer is about 20-30 nm, and the thickness of the second hole injection layer is 50-90% of that of the first hole injection layer. The method comprises the steps of driving ink into an OLED pixel groove in an ink-jet printing mode, and then carrying out vacuum drying and baking film forming treatment on the ink at the temperature of 100-250 ℃.
The first hole transport layer is arranged on the upper surface of the first hole injection layer, the second hole transport layer is arranged on the upper surface of the second hole injection layer and is made of ink, the thickness of the first hole transport layer is 10-30 nm, and the thickness of the second hole transport layer is 50-90% of that of the first hole transport layer. And (3) driving the ink into an OLED pixel groove by adopting an ink-jet printing mode, and then carrying out vacuum drying and baking film-forming treatment on the ink at the temperature of 100-250 ℃.
The first light-emitting layer is arranged on the upper surface of the first hole transport layer, the second light-emitting layer is arranged on the upper surface of the second hole transport layer, the material of the second light-emitting layer is ink, the thickness of the first light-emitting layer is 30-80 nm, and the thickness of the second light-emitting layer is 50% -90% of that of the first light-emitting layer. And respectively injecting red ink, green ink and blue ink into the OLED pixel groove by adopting an ink-jet printing mode, then carrying out vacuum drying and baking film-forming treatment on the light-emitting layer at the temperature of 100-250 ℃, and finally forming a red sub-pixel light-emitting layer, a green sub-pixel light-emitting layer and a blue sub-pixel light-emitting layer.
The first electron transmission layer is arranged on the upper surface of the first light emitting layer, the second electron transmission layer is arranged on the upper surface of the second light emitting layer and is made of ink, the thickness of the first electron transmission layer is 10-30 nm, and the thickness of the second electron transmission layer is 50-90% of that of the first electron transmission layer. The method comprises the steps of driving ink into an OLED pixel groove in an ink-jet printing mode, and then carrying out vacuum drying and baking film forming treatment on the ink at the temperature of 100-250 ℃.
The first electron injection layer is arranged on the upper surface of the first electron transmission layer, the second electron injection layer is arranged on the upper surface of the second electron transmission layer and is made of ink, the thickness of the first electron injection layer is 1-10 nm, and the thickness of the second electron injection layer is 50-90% of that of the first electron injection layer. The method comprises the steps of driving ink into an OLED pixel groove in an ink-jet printing mode, and then carrying out vacuum drying and baking film forming treatment on the ink at the temperature of 100-250 ℃.
The first cathode is arranged on the upper surface of the first electron injection layer, the second cathode is arranged on the upper surface of the second electron injection layer, the first cathode and the second cathode are made of materials including but not limited to one or a combination of more of indium tin oxide, silver and magnesium, a film is formed by adopting an evaporation process or an ink-jet printing mode, the thickness of the first cathode is 10-100 nm, and the thickness of the second cathode is 50-90% of that of the first cathode.
The first light extraction layer is arranged on the upper surface of the first cathode, and the second light extraction layer is arranged on the upper surface of the second cathode. The first light extraction layer and the second light extraction layer are made of organic high polymer materials and comprise one or more of triarylamines, cyclic ureas, acyl structures, dibenzothiophenes, dibenzofurans and carbazoles, wherein the thickness of the first cathode is 40-100 nm, and the thickness of the second cathode is 50-90% of that of the first cathode.
The second area adopts the pixel density and the film thickness which are relatively smaller than those of the first area, so that the effect of improving the light transmittance of the panel in the second area is achieved, and meanwhile, a certain display effect is kept.
After the light emitting devices in the first area and the second area are prepared, film packaging and other rear-end module section processes can be carried out according to actual conditions to obtain a final full-screen display panel.
In summary, the embodiment of the display panel manufacturing method provided by the invention replaces the conventional evaporation process using a mask. The high-precision non-contact printing technology is adopted, the ink-jet printing is suitable for large-area flexible printing process, the film forming uniformity can be improved through the debugging of the printing algorithm, the film thickness of different areas can be accurately and conveniently controlled by adjusting the ink drop amount of printing ink at each time, the use of a large number of high-precision mask plates is avoided, the process cost is greatly saved, the flexibility and diversity of process research and development are improved, and the development of a comprehensive screen technology is facilitated. According to the OLED display panel provided by the invention, the two regions with different pixels are prepared by ink-jet printing, so that the light transmittance of the panel in the region above the optical device is ensured, a certain display effect is maintained, and the overall screen obtained by ink-jet printing has high yield and good quality.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. The display panel is characterized by comprising a substrate, wherein the substrate is divided into a first area and a second area, and the pixel density of the second area is less than that of the first area;
the first region is provided with a first pixel defining layer, and a first anode, a first hole injection layer, a first hole transport layer, a first light emitting layer, a first electron transport layer, a first electron injection layer, a first cathode and a first light extraction layer are sequentially arranged on the first region;
the second region is provided with a second pixel defining layer, and a second anode, a second hole injection layer, a second hole transport layer, a second light emitting layer, a second electron transport layer, a second electron injection layer, a second cathode and a second light extraction layer are sequentially arranged on the second region;
the density of the second pixel definition layer is less than the density of the first pixel definition layer, the height of the second pixel definition layer is less than the height of the first pixel definition layer, or the height of the second pixel definition layer is equal to the height of the first pixel definition layer;
the thickness of the second anode is smaller than that of the first anode, the thickness of the second hole injection layer is smaller than that of the first hole injection layer, the thickness of the second hole transport layer is smaller than that of the first hole transport layer, the thickness of the second light emitting layer is smaller than that of the first light emitting layer, the thickness of the second electron transport layer is smaller than that of the first electron transport layer, the thickness of the second electron injection layer is smaller than that of the first electron injection layer, the thickness of the second cathode is smaller than that of the first cathode, and the thickness of the second light extraction layer is smaller than that of the first light extraction layer.
2. The display panel according to claim 1, wherein the first anode has a thickness of 60 to 300 nm; the thickness of the first hole injection layer is 20-30 nm; the thickness of the first hole transport layer is 10-30 nm; the thickness of the first light-emitting layer is 30-80 nm; the thickness of the first electron transmission layer is 10-30 nm; the thickness of the first electron injection layer is 1-10 nm; the thickness of the first cathode is 10-100 nm; the thickness of the first light extraction layer is 40-100 nm.
3. The display panel of claim 1, wherein the thickness of each film layer in the second area is 50% to 90% of the thickness of each film layer in the first area.
4. A method for manufacturing a display panel according to any one of claims 1 to 3, comprising:
providing a substrate, and dividing the substrate into a first area and a second area;
preparing a first pixel definition layer on the first area, and preparing a second pixel definition layer on the second area;
then, sequentially preparing a first anode, a first hole injection layer, a first hole transport layer, a first light emitting layer, a first electron transport layer, a first electron injection layer, a first cathode and a first light extraction layer on the first region;
the first hole injection layer, the first hole transport layer, the first light emitting layer, the first electron transport layer and the first electron injection layer are prepared by adopting an ink-jet printing method;
sequentially preparing a second anode, a second hole injection layer, a second hole transport layer, a second light emitting layer, a second electron transport layer, a second electron injection layer, a second cathode and a second light extraction layer on the second region;
the second hole injection layer, the second hole transport layer, the second light-emitting layer, the second electron transport layer and the second electron injection layer are prepared by adopting an ink-jet printing method.
5. The method for manufacturing a display panel according to claim 4, wherein the inkjet printing method comprises the steps of: the ink is driven into a pixel groove formed by a pixel definition layer through a nozzle module of the ink-jet printer, and then the ink in the pixel groove is subjected to vacuum drying and baking film forming treatment.
6. The method of claim 5, wherein the baking film forming process is performed at a temperature of 100-250 ℃.
7. The method for manufacturing a display panel according to claim 4, wherein the method comprises performing ink-jet printing by an ink-jet printing method, and sequentially printing the first hole injection layer, the first hole transport layer, the first light-emitting layer, the first electron transport layer, and the first electron injection layer; and simultaneously printing a second hole injection layer, a second hole transport layer, a second light emitting layer, a second electron transport layer and a second electron injection layer in sequence;
or, the ink-jet printing method is adopted for ink-jet printing, the first hole injection layer, the first hole transport layer, the first luminescent layer, the first electron transport layer and the first electron injection layer are printed in sequence, and then the second hole injection layer, the second hole transport layer, the second luminescent layer, the second electron transport layer and the second electron injection layer are printed in sequence;
or, the ink-jet printing method is adopted for ink-jet printing, the second hole injection layer, the second hole transport layer, the second luminescent layer, the second electron transport layer and the second electron injection layer are printed in sequence, and then the first hole injection layer, the first hole transport layer, the first luminescent layer, the first electron transport layer and the first electron injection layer are printed in sequence.
8. The method of claim 4, wherein the first anode and the second anode are made of one or more of indium tin oxide, silver and aluminum, and are formed by a sputtering film forming process and a yellow light process.
9. The method for manufacturing a display panel according to claim 4,
the first cathode and the second cathode are made of one or more of indium tin oxide, silver and magnesium, and are prepared by an evaporation process or an ink-jet printing mode.
10. The method of claim 4, wherein the first and second light extraction layers are made of organic polymer materials selected from one or more of triarylamines, cyclic ureas, acyl structures, dibenzothiophenes, dibenzofurans, and carbazoles.
CN202010989635.4A 2020-09-18 2020-09-18 Display panel and preparation method thereof Active CN111933682B (en)

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