CN111933556B - Semiconductor chip manufacturing substrate processing equipment - Google Patents
Semiconductor chip manufacturing substrate processing equipment Download PDFInfo
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- CN111933556B CN111933556B CN202011002338.2A CN202011002338A CN111933556B CN 111933556 B CN111933556 B CN 111933556B CN 202011002338 A CN202011002338 A CN 202011002338A CN 111933556 B CN111933556 B CN 111933556B
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- housing
- manipulator
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- 239000000758 substrate Substances 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000004065 semiconductor Substances 0.000 title claims abstract description 12
- 238000006243 chemical reaction Methods 0.000 claims abstract description 40
- 238000004140 cleaning Methods 0.000 claims abstract description 22
- 238000007599 discharging Methods 0.000 claims abstract description 11
- 230000007246 mechanism Effects 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 11
- 238000000926 separation method Methods 0.000 claims 4
- 239000010408 film Substances 0.000 description 29
- 239000007789 gas Substances 0.000 description 23
- 238000005192 partition Methods 0.000 description 12
- 238000004891 communication Methods 0.000 description 10
- 230000006872 improvement Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
Abstract
The invention discloses a semiconductor chip manufacturing substrate processing device, which comprises a reaction chamber, a feeding guide groove and a discharging guide groove, wherein the reaction chamber is a cuboid shell, the feeding guide groove is connected to one side of the reaction chamber in the length direction, the discharging guide groove is connected to the other side of the reaction chamber in the length direction, a placing component for placing a substrate is arranged in the reaction chamber, the placing component comprises a placing plate, a base, a first motor, a first screw rod, a first guide rod and a second motor, a first supporting plate and a second supporting plate are vertically arranged in the reaction chamber, the first supporting plate and the second supporting plate are oppositely arranged, the first motor is arranged on the first supporting plate, when more films are adhered to a fan, a grabbing brush can grab the films and place the films in a cleaning chamber, and when a pushing motor can drive a pushing plate to move downwards along the wall part of the discharging shell, the push pedal promotes the division board and opens, and the film can drop to in the collecting chamber.
Description
Technical Field
The invention relates to the technical field of chip manufacturing, in particular to a semiconductor chip manufacturing substrate processing device.
Background
The chemical vapor deposition process is widely used in the manufacture of semiconductor chips and liquid crystal panels, and its basic principle is to introduce one or more compounds containing elements constituting a thin film and a simple substance gas into a reaction chamber in which a substrate is placed, and to deposit and form a thin film on the surface of the substrate by means of a space vapor chemical reaction or thermal decomposition of a raw material gas. Although the film desired by a producer can be obtained through deposition, the tail gas discharged to the dry pump in the production process is subjected to chemical reaction in the exhaust pipeline and the dry pump and deposited on the exhaust pipeline and the dry pump, so that the exhaust function of the exhaust pipeline is reduced, the dry pump is shut down, and serious production accidents are caused.
Disclosure of Invention
To overcome the disadvantages of the prior art, an object of the present invention is to provide a semiconductor chip manufacturing substrate processing apparatus.
In order to achieve the technical purpose, the technical scheme adopted by the invention is as follows.
A semiconductor chip manufacturing substrate processing apparatus, comprising:
the reaction chamber is a cuboid shell, the feeding guide groove is connected to one side of the reaction chamber in the length direction, the discharging guide groove is connected to the other side of the reaction chamber in the length direction, a placing assembly for placing a substrate is arranged in the reaction chamber, the placing assembly comprises a placing plate, a base, a first motor, a first screw rod, a first guide rod and a second motor, a first support plate and a second support plate are vertically arranged in the reaction chamber, the first support plate and the second support plate are oppositely arranged, the first motor is arranged on the first support plate, an output shaft of the first motor is horizontally arranged and parallel to the length direction of the reaction chamber, one end of the first screw rod is coaxially and fixedly connected with an output shaft end of the first motor, the other end of the first screw rod is movably connected with the second support plate, and the first guide rod is parallelly arranged on one side of the first screw, the base is sleeved on the first screw rod and the first guide rod, the placing plate is arranged above the base, the second motor is arranged at the bottom of the base, an output shaft of the second motor is vertically upward, an output shaft end of the second motor penetrates through the base to be connected with the placing plate, a suction manipulator used for grabbing the substrate is arranged in the reaction cavity, and the suction manipulator is close to the placing assembly;
the reaction chamber is internally provided with a first air inlet manipulator and a second air inlet manipulator, the first air inlet manipulator and the second air inlet manipulator are close to the placing assembly, and the first air inlet manipulator and the second air inlet manipulator can exhaust the substrate on the placing assembly;
and the gas inlet mechanical arm I and the gas inlet mechanical arm II are connected with a tail gas discharge mechanism for treating tail gas, and the tail gas of the reaction chamber is discharged through the tail gas discharge mechanism.
As a further improvement of this technical scheme, the tip of manipulator that admits air be provided with exhaust air gun one, the tip of manipulator that admits air two is provided with exhaust air gun two, exhaust air gun one, exhaust air gun two are in and place the board top, and gas is arranged to placing the base plate of board through exhaust air gun one, exhaust air gun two, the tip of manipulator that admits air be provided with communicating pipe one, the inlet end of communicating pipe one is close to exhaust air gun one, and manipulator both ends that admit air are provided with communicating pipe two, and the inlet end of communicating pipe two is close to exhaust air gun two, communicating pipe one, communicating pipe two cross the intercommunication, communicating pipe one, communicating pipe two cross the end intercommunication and have communicating pipe three, the exhaust end and the tail gas discharge mechanism intercommunication of communicating pipe three.
As a further improvement of this technical scheme, tail gas emission mechanism including discharging the casing, the casing admits air, the casing that admits air and the exhaust end switch-on of communicating pipe three discharge the casing and communicate with the casing that admits air, the casing that admits air in install the fan, the wall portion of discharging the casing has seted up the exhaust hole, the bottom of the casing that admits air be provided with the cleaning chamber, install the cylinder brush in the cleaning chamber, the cylinder brush is provided with on the cylinder brush and grabs the material brush through external motor drive, the groove of dodging that is used for grabbing the material brush and passes is offered to the bottom of the casing that admits air.
As a further improvement of the technical scheme, a pushing assembly for pushing the film is arranged in the discharge shell and comprises a pushing motor, a second screw rod, a second guide rod, a push plate, a first guide sleeve and a second guide sleeve, the pushing motor is installed at the top of the discharge shell and is close to the wall of the discharge shell, an output shaft of the pushing motor is vertically downward, the end of the second screw rod is coaxially and fixedly connected to the output shaft end of the pushing motor, the push plate is located in the discharge shell and is tightly attached to the wall of the discharge shell, the first guide sleeve and the second guide sleeve are vertically arranged on the push plate, the second guide rod is arranged on one side of the second screw rod in parallel, and the first guide sleeve and the second guide sleeve are respectively sleeved on the second.
As a further improvement of the technical scheme, a guide pillar is vertically arranged in the air inlet shell, the fan is sleeved on the guide pillar, a spring is sleeved on the guide pillar, one end of the spring is abutted to the bottom of the air inlet shell, the other end of the spring is abutted to the bottom of the fan, a sensor is arranged in the cleaning chamber, and the sensor is a position sensor.
As a further improvement of the technical scheme, one side of the cleaning chamber is provided with a partition plate, the end part of the partition plate is hinged with the side wall of the cleaning chamber, the partition plate is connected with the side wall of the cleaning chamber through an elastic part, and the space below the partition plate is a collecting chamber.
As a further improvement of the technical scheme, a collecting shell is arranged in the collecting chamber and is drawn in the discharging shell.
Compared with the prior art, the invention has the advantages that in the using process, when the film is formed in the air inlet shell, the roller brush rotates, the grabbing brush can grab the film and place the film in the cleaning chamber, the pushing motor can drive the pushing plate to move downwards along the wall of the discharge shell, so that the film adhered to the wall of the discharge shell is pushed, the exhaust hole of the wall of the discharge shell is further prevented from being blocked, when more films are adhered to the fan, the grabbing brush can grab the film and place the film in the cleaning chamber, and when the pushing motor can drive the pushing plate to move downwards along the wall of the discharge shell, the pushing plate pushes the partition plate to be opened, so that the film can fall into the collection chamber.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described below. It is obvious that the drawings described below are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a schematic view of the overall structure of the present invention.
FIG. 2 is a schematic view of the internal structure of the reaction chamber according to the present invention.
Fig. 3 is a schematic view of the first air inlet manipulator and the second air inlet manipulator of the present invention.
Fig. 4 is a schematic connection diagram of the exhaust emission mechanism of the present invention.
FIG. 5 is a schematic view of a placement assembly of the present invention.
Fig. 6 is a schematic view of the mounting plate of the present invention.
Fig. 7 is a schematic view of the exhaust emission mechanism of the present invention.
Fig. 8 is a schematic view of the interior of the air intake housing of the present invention.
FIG. 9 is a schematic view of the fan assembly of the present invention.
Figure 10 is a schematic view of the installation of the pusher assembly of the present invention.
Fig. 11 is a schematic view of the divider plate attachment of the present invention.
FIG. 12 is a schematic diagram of a pushing assembly according to the present invention.
Labeled as:
10. a reaction chamber; 110. a feeding guide groove; 120. a discharge guide groove;
20. a tail gas discharge mechanism; 210. a discharge housing; 211. a partition plate; 220. an air intake housing; 222. a push assembly; 223. an elastic member; 224. a pushing motor; 225. a second screw rod; 226. a second guide rod; 227. pushing the plate; 228. a first guide sleeve; 229. a second guide sleeve; 230. a collection housing; 240. a cleaning chamber; 250. a collection chamber; 260. a fan; 270. a guide post; 280. a roller brush; 290. a sensor;
30. a suction manipulator;
40. placing the component; 410. placing the plate; 420. a base; 430. a first motor; 440. a first screw rod; 450. a first guide rod; 460. a second motor; 470. a first support plate; 480. a second support plate;
50. a first air inlet manipulator; 510. a first exhaust air gun; 520. a first communicating pipe;
60. a second air inlet manipulator; 610. a second exhaust air gun; 620. a second communicating pipe; 630. and a third communicating pipe.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; to better illustrate the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not indicated or implied that the referred device or element must have a specific orientation, be constructed in a specific orientation and be operated, and therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and are not to be construed as limitations of the present patent, and the specific meanings of the terms may be understood by those skilled in the art according to specific situations.
In the description of the present invention, unless otherwise explicitly specified or limited, the term "connected" or the like, if appearing to indicate a connection relationship between the components, is to be understood broadly, for example, as being fixed or detachable or integral; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through one or more other components or may be in an interactive relationship with one another. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1 to 12, a semiconductor chip manufacturing substrate processing apparatus includes:
the reaction chamber 10 is a cuboid shell, the feeding guide groove 110 is connected to one side of the reaction chamber 10 in the length direction, the discharging guide groove 120 is connected to the other side of the reaction chamber 10 in the length direction, a placing component 40 for placing a substrate is arranged in the reaction chamber 10, the placing component 40 comprises a placing plate 410, a base 420, a first motor 430, a first screw rod 440, a first guide rod 450 and a second motor 460, a first support plate 470 and a second support plate 480 are vertically arranged in the reaction chamber 10, the first support plate 470 and the second support plate 480 are oppositely arranged, the first motor 430 is installed on the first support plate 470, an output shaft of the first motor 430 is horizontally arranged and parallel to the length direction of the reaction chamber 10, one end of the first screw rod 440 is coaxially and fixedly connected with an output shaft end of the first motor 430, The other end of the reaction chamber 10 is movably connected with a second support plate 480, the first guide rod 450 is arranged on one side of the first screw rod 440 in parallel, the base 420 is sleeved on the first screw rod 440 and the first guide rod 450, the placing plate 410 is arranged above the base 420, the second motor 460 is arranged at the bottom of the base 420, an output shaft of the second motor 460 is vertically upward, an output shaft end of the second motor 460 penetrates through the base 420 to be connected with the placing plate 410, an absorption manipulator 30 for grabbing the substrate is arranged in the reaction chamber 10, and the absorption manipulator 30 is close to the placing assembly 40;
the reaction chamber 10 is internally provided with a first air inlet manipulator 50 and a second air inlet manipulator 60, the first air inlet manipulator 50 and the second air inlet manipulator 60 are close to the placing assembly 40, the first air inlet manipulator 50 and the second air inlet manipulator 60 can exhaust the substrate on the placing assembly 40, the gas is deposited on the surface of the substrate to form a film, after the substrate is processed, the first motor 430 drives the placing plate 410 to move towards the direction close to the material discharge guide groove 120, and then the second motor 460 drives the placing plate 410 to rotate, so that the processed substrate is conveniently discharged through the material discharge guide groove 120;
the first air inlet mechanical arm 50 and the second air inlet mechanical arm 60 are connected with a tail gas discharge mechanism 20 for treating tail gas, and the tail gas of the reaction chamber 10 is discharged through the tail gas discharge mechanism 20.
As shown in fig. 3 to 5, a first exhaust air gun 510 is disposed at an end of the first air intake manipulator 50, a second exhaust air gun 610 is disposed at an end of the second air intake manipulator 60, the first exhaust air gun 510 and the second exhaust air gun 610 are located above the placing plate 410, air is discharged onto the substrate of the placing plate 410 through the first exhaust air gun 510 and the second exhaust air gun 610, a first communication pipe 520 is disposed at an end of the first air intake manipulator 50, an air inlet end of the first communication pipe 520 is close to the first exhaust air gun 510, a second communication pipe 620 is disposed at an end of the second air intake manipulator 60, an air inlet end of the second communication pipe 620 is close to the second exhaust air gun 610, the first communication pipe 520 and the second communication pipe 620 are communicated with each other, a third communication pipe 630 is communicated with an intersection end of the first communication pipe 520 and the second communication pipe 620, and an exhaust.
As shown in fig. 4 and fig. 7-10, the exhaust gas discharge mechanism 20 includes a discharge housing 210 and an intake housing 220, the intake housing 220 is communicated with the discharge end of a communication pipe three 630, the discharge housing 210 is communicated with the intake housing 220, a fan 260 is installed in the air inlet casing 220, an exhaust hole is opened on the wall of the exhaust casing 210, when the gas enters the gas inlet housing 220, in order to prevent the exhaust path from being blocked by the film formed by the reaction between the gases, the bottom of the air inlet shell 220 is provided with a cleaning chamber 240, a roller brush 280 is arranged in the cleaning chamber 240, the roller brush 280 is driven by an external motor, a material grabbing brush is arranged on the roller brush 280, the bottom of the air inlet shell 220 is provided with an avoiding groove for the material grabbing brush to pass through, when the film is formed in the air intake housing 220, the roller brush 280 rotates, and the film can be grabbed by the grab brush and placed in the cleaning chamber 240.
As shown in fig. 7 and 10-12, in order to further clean the film, a pushing assembly 222 for pushing the film is disposed in the discharge housing 210, the pushing assembly 222 includes a pushing motor 224, a second screw 225, a second guide rod 226, a pushing plate 227, a first guide sleeve 228, and a second guide sleeve 229, the pushing motor 224 is mounted at the top of the discharge housing 210 and is close to the wall of the discharge housing 210, an output shaft of the pushing motor 224 is directed downward, an end of the second screw 225 is coaxially and fixedly connected to an output shaft end of the pushing motor 224, the pushing plate 227 is disposed in the discharge housing 210 and is closely attached to the wall of the discharge housing 210, the first guide sleeve 228 and the second guide sleeve 229 are vertically disposed on the pushing plate 227, the second guide rod 226 is disposed at one side of the second screw 225 in parallel, the first guide sleeve 228 and the second guide sleeve 229 are respectively sleeved on the second screw 225 and the second guide rod 226, the pushing motor 224 can drive the pushing plate, thereby pushing the thin film adhered to the wall of the discharge casing 210, thereby further preventing the exhaust holes of the wall of the discharge casing 210 from being clogged.
More specifically, the air inlet housing 220 in be vertically provided with the guide pillar 270, the fan 260 cover is established and is installed on guide pillar 270, the cover is equipped with the spring on the guide pillar 270, the one end of spring offsets with the bottom of air inlet housing 220, the other end offsets with the bottom of fan 260, the clearance room 240 in install sensor 290, sensor 290 is position sensor, when the more film of adhesion on the fan 260, fan 260 moves down, sensor 290 can respond to fan 260 and move down the signal and transmit to the controller, then the controller control cylinder brush 280 rotates, grab the material brush and can snatch the film and place in clearance room 240.
More specifically, one side of the cleaning chamber 240 is provided with a partition plate 211, the end of the partition plate 211 is hinged to the side wall of the cleaning chamber 240, the partition plate 211 is connected with the side wall of the cleaning chamber 240 through an elastic member 223, the space below the partition plate 211 is a collecting chamber 250, when the pushing motor 224 can drive the pushing plate 227 to move downwards along the wall of the discharge casing 210, the pushing plate 227 pushes the partition plate 211 to open, and the film can fall into the collecting chamber 250.
More specifically, the collection chamber 250 is provided with a collection housing 230 therein, and the collection housing 230 is drawn into the discharge housing 210 to facilitate the collection of the film.
The working principle is as follows:
in the using process of the invention, the first air inlet mechanical arm 50 and the second air inlet mechanical arm 60 can exhaust the substrate on the placing assembly 40, the gas is deposited on the surface of the substrate to form a film, after the substrate is treated, the first motor 430 drives the placing plate 410 to move towards the direction close to the discharge guide groove 120, then the second motor 460 drives the placing plate 410 to rotate, so that the treated substrate is conveniently discharged through the discharge guide groove 120, when the film is formed in the air inlet shell 220, the roller brush 280 rotates, the material grabbing brush can grab the film and place the film in the cleaning chamber 240, the pushing motor 224 can drive the pushing plate 227 to move downwards along the wall of the discharge shell 210, so as to push the film adhered to the wall of the discharge shell 210, thereby further avoiding the exhaust hole blockage of the wall of the discharge shell 210, when more films are adhered to the fan 260, the fan 260 moves downwards, the sensor 290 can sense the downward movement signal of the fan 260 and transmit the downward movement signal to the, the controller then controls the roller brush 280 to rotate, the material grabbing brush can grab the film and place the film in the cleaning chamber 240, when the pushing motor 224 can drive the pushing plate 227 to move downwards along the wall of the discharge shell 210, the pushing plate 227 pushes the partition plate 211 to open, and the film can fall into the collection chamber 250.
It should be understood that the above-described embodiments are merely preferred embodiments of the invention and the technical principles applied thereto. It will be understood by those skilled in the art that various modifications, equivalents, changes, and the like can be made to the present invention. However, such variations are within the scope of the invention as long as they do not depart from the spirit of the invention. In addition, certain terms used in the specification and claims of the present application are not limiting, but are used merely for convenience of description.
Claims (5)
1. A semiconductor chip manufacturing substrate processing apparatus, comprising:
the reaction chamber (10) is a cuboid shell, the feeding guide groove (110) is connected to one side of the reaction chamber (10) in the length direction, the discharging guide groove (120) is connected to the other side of the reaction chamber (10) in the length direction, a placing assembly (40) for placing a substrate is arranged in the reaction chamber (10), the placing assembly (40) comprises a placing plate (410), a base (420), a first motor (430), a first screw rod (440), a first guide rod (450) and a second motor (460), a first support plate (470) and a second support plate (480) are vertically arranged in the reaction chamber (10), the first support plate (470) and the second support plate (480) are oppositely arranged, the first motor (430) is installed on the first support plate (470), an output shaft of the first motor (430) is horizontally arranged and is parallel to the length direction of the reaction chamber (10), one end of the first screw rod (440) is coaxially and fixedly connected with an output shaft end of the first motor (430), the other end of the first screw rod is movably connected with the second support plate (480), the first guide rod (450) is arranged on one side of the first screw rod (440) in parallel, the base (420) is sleeved on the first screw rod (440) and the first guide rod (450), the placing plate (410) is arranged above the base (420), the second motor (460) is arranged at the bottom of the base (420), an output shaft of the second motor (460) is vertically upward, an output shaft end of the second motor (460) penetrates through the base (420) to be connected with the placing plate (410), an absorbing manipulator (30) used for grabbing the substrate is arranged in the reaction chamber (10), and the absorbing manipulator (30) is close to the placing assembly (40);
a first air inlet manipulator (50) and a second air inlet manipulator (60) are arranged in the reaction chamber (10), the first air inlet manipulator (50) and the second air inlet manipulator (60) are close to the placing assembly (40), and the first air inlet manipulator (50) and the second air inlet manipulator (60) can exhaust the substrate on the placing assembly (40);
the gas inlet manipulator I (50) and the gas inlet manipulator II (60) are connected with a tail gas discharge mechanism (20) for treating tail gas, and the tail gas of the reaction chamber (10) is discharged through the tail gas discharge mechanism (20);
the end part of the first air inlet manipulator (50) is provided with a first exhaust air gun (510), the end part of the second air inlet manipulator (60) is provided with a second exhaust air gun (610), the first exhaust air gun (510) and the second exhaust air gun (610) are positioned above the placing plate (410), the gas is discharged onto the substrate of the placing plate (410) through the first exhaust air gun (510) and the second exhaust air gun (610), the end part of the first air inlet manipulator (50) is provided with a first communicating pipe (520), the air inlet end of the first communicating pipe (520) is close to a first exhaust air gun (510), the end part of the second air inlet manipulator (60) is provided with a second communicating pipe (620), the air inlet end of the second communicating pipe (620) is close to a second exhaust air gun (610), the first communicating pipe (520) and the second communicating pipe (620) are communicated in a crossing manner, the crossing end of the first communicating pipe (520) and the second communicating pipe (620) is communicated with a third communicating pipe (630), and the air outlet end of the third communicating pipe (630) is communicated with a tail gas discharge;
tail gas emission mechanism (20) including discharging casing (210), air inlet housing (220) and the exhaust end switch-on of communicating pipe three (630), discharge casing (210) and air inlet housing (220) intercommunication, air inlet housing (220) in install fan (260), the exhaust hole has been seted up to the wall portion of discharging casing (210), the bottom of air inlet housing (220) be provided with clearance room (240), install roller brush (280) in clearance room (240), roller brush (280) are through external motor drive, be provided with on roller brush (280) and grab the material brush, the bottom of air inlet housing (220) is seted up and is used for grabbing the groove of dodging that the material brush passed.
2. The semiconductor chip manufacturing substrate processing apparatus according to claim 1, wherein a pushing assembly (222) for pushing the film is disposed in the discharge housing (210), the pushing assembly (222) comprises a pushing motor (224), a second lead screw (225), a second guide rod (226), a pushing plate (227), a first guide sleeve (228), and a second guide sleeve (229), the pushing motor (224) is mounted on the top of the discharge housing (210) and is close to the wall of the discharge housing (210), an output shaft of the pushing motor (224) is vertically downward, an end of the second lead screw (225) is coaxially and fixedly connected to an output shaft end of the pushing motor (224), the pushing plate (227) is disposed in the discharge housing (210) and is closely attached to the wall of the discharge housing (210), the first guide sleeve (228), the second guide sleeve (229) are vertically disposed on the pushing plate (227), the second guide rod (226) is disposed in parallel to one side of the second lead screw (225), the first guide sleeve (228) and the second guide sleeve (229) are respectively sleeved on the second screw rod (225) and the second guide rod (226).
3. The semiconductor chip manufacturing substrate processing apparatus according to claim 2, wherein a guide post (270) is vertically disposed in the air intake housing (220), the fan (260) is sleeved on the guide post (270), a spring is sleeved on the guide post (270), one end of the spring abuts against the bottom of the air intake housing (220), the other end of the spring abuts against the bottom of the fan (260), a sensor (290) is disposed in the cleaning chamber (240), and the sensor (290) is a position sensor.
4. The semiconductor chip manufacturing substrate processing apparatus according to claim 3, wherein a separation plate (211) is provided at one side of the cleaning chamber (240), an end of the separation plate (211) is hinged to a side wall of the cleaning chamber (240), the separation plate (211) is connected to the side wall of the cleaning chamber (240) through an elastic member (223), and a space below the separation plate (211) is a collection chamber (250).
5. The apparatus of claim 4, wherein the collection chamber (250) has a collection housing (230) disposed therein, the collection housing (230) being drawn into the exhaust housing (210).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011002338.2A CN111933556B (en) | 2020-09-22 | 2020-09-22 | Semiconductor chip manufacturing substrate processing equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011002338.2A CN111933556B (en) | 2020-09-22 | 2020-09-22 | Semiconductor chip manufacturing substrate processing equipment |
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| CN111933556A CN111933556A (en) | 2020-11-13 |
| CN111933556B true CN111933556B (en) | 2021-03-23 |
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| JP3527914B2 (en) * | 2002-03-27 | 2004-05-17 | 株式会社ルネサステクノロジ | CVD apparatus and cleaning method of CVD apparatus using the same |
| JP5524132B2 (en) * | 2010-07-15 | 2014-06-18 | 東京エレクトロン株式会社 | Thin film forming apparatus cleaning method, thin film forming method, and thin film forming apparatus |
| KR101541155B1 (en) * | 2012-12-13 | 2015-08-06 | 엘아이지인베니아 주식회사 | atomic layer deposition apparatus |
| CN109750274B (en) * | 2017-11-01 | 2021-10-22 | 长鑫存储技术有限公司 | Semiconductor production equipment and semiconductor process method |
| CN111128788A (en) * | 2018-10-31 | 2020-05-08 | 长鑫存储技术有限公司 | Exhaust system and semiconductor device |
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