CN111933524A - Electrical connection assembly, preparation method thereof and semiconductor device - Google Patents

Electrical connection assembly, preparation method thereof and semiconductor device Download PDF

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Publication number
CN111933524A
CN111933524A CN202010834777.3A CN202010834777A CN111933524A CN 111933524 A CN111933524 A CN 111933524A CN 202010834777 A CN202010834777 A CN 202010834777A CN 111933524 A CN111933524 A CN 111933524A
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length
metal
connection assembly
electrical connection
conductor wire
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刘学刚
孙娜娜
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Quanxin Integrated Circuit Manufacturing Jinan Co Ltd
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Quanxin Integrated Circuit Manufacturing Jinan Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268

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Abstract

The invention provides an electric connection assembly, a preparation method thereof and a semiconductor device. The electric connection assembly comprises a conductor wire and a plurality of metal wires formed on the conductor wire, the length direction of the plurality of metal wires is vertical to the length direction of the conductor wire, and the plurality of metal wires are arranged in parallel at intervals; wherein, the parts of the two ends of the conductor wire respectively extending out of the metal wire are a first extension part and a second extension part, the length E1 of the first extension part and the length E2 of the second extension part are according to the length L of the conductor wire, the calculated number n of the metal wires and the minimum spacing S of the adjacent metal wiresmExtremely small width W of metal wiremAnd a very small extension E of the end of the conductor wiremAnd (4) determining. Therefore, complete and accurate dimension data of the conductor wire and the metal wire can be obtained, the conductor wire and the metal wire with higher dimension precision can be prepared according to the dimension data, particularly, the dimension precision of the length E1 of the first extension part and the length E2 of the second extension part is reliable, and the yield of the device is improved.

Description

Electrical connection assembly, preparation method thereof and semiconductor device
Technical Field
The invention relates to the technical field of semiconductors, in particular to an electric connection assembly, a preparation method of the electric connection assembly and a semiconductor device.
Background
At present, with the rapid development of semiconductor technology, nanoscale circuit design has become the mainstream technology. In the circuit design of nanometer level, the requirement for design error is very strict, and if an error of one nanometer occurs, the product is affected.
For example, in circuit designs on the nanometer scale, it is important that the metal lines be evenly spaced on the conductor lines. At present, in the design, firstly, the distance between two adjacent metal wires is satisfied as the minimum spacing (min-spacing), then, the lengths (E1 and E2) of the two sides of the conductor wire extending out of the metal wires are calculated, and the requirements that both E1 and E2 are greater than the minimum extension length (min-extension) are satisfied. However, in the calculation process, since the maximum precision of each value is 1nm, the actual value may generate errors smaller than 1nm, for example, errors of 0.5nm, which will be randomly discarded or carried by EDA tools (chip design tools), and the probability of discarding or carrying is uncertain and uncontrollable. Therefore, it is extremely difficult to form a high-precision electrical connection component of a conductor line and a metal line by the conventional design method.
Therefore, aiming at the nano-scale circuit design, an electrical connection assembly and a preparation method thereof are designed, so that the dimensional accuracy of a conductor wire and a metal wire is high, the size (| E1-E2|) is minimized, and the yield of devices is improved, which is a technical problem to be solved urgently at present.
Disclosure of Invention
The invention aims to provide an electric connection assembly, a preparation method thereof and a semiconductor device, which can enable the dimensional accuracy of conductor wires and metal wires to be higher and improve the yield of the device.
Embodiments of the invention may be implemented as follows:
in a first aspect, an embodiment of the present invention provides an electrical connection assembly, where the electrical connection assembly includes a conductor line and a plurality of metal lines formed on the conductor line, a length direction of the plurality of metal lines is perpendicular to a length direction of the conductor line, and the plurality of metal lines are arranged in parallel at intervals; wherein, the parts of the two ends of the conductor wire respectively extending out of the metal wire are a first extension part and a second extension part, the length E1 of the first extension part and the length E2 of the second extension part are according to the length L of the conductor wire, the calculated number n of the metal wires and the minimum spacing S of the adjacent metal wiresmExtremely small width W of metal wiremAnd a very small extension E of the end of the conductor wiremAnd (4) determining.
In an alternative embodiment, the calculation formula of the calculated number n of metal lines is:
n＝floor((L-Em*2-Wm)/(Sm+Wm))+1；
where floor is a function taking the largest integer not greater than the argument.
In an alternative embodiment, when the condition E1+ E2 is satisfied, M is an even number, the calculation formula of E1 and E2 is:
E1＝E2＝(L-(n-1)*(Wm+Sm)-Wm)/2。
in an alternative embodiment, when the condition E1+ E2 ═ M, E1> E2 is satisfied, and M is an odd number, the calculation formula of E1 is:
E1＝(L+1-(n-1)*(Wm+Sm)-Wm)/2；
the formula for E2 is:
E2＝(L-1-(n-1)*(Wm+Sm)-Wm)/2。
in an alternative embodiment, when the condition E1+ E2 is M, E1< E2, and M is an odd number, the formula for E1 is:
E1＝(L-1-(n-1)*(Wm+Sm)-Wm)/2；
the formula for E2 is:
E2＝(L+1-(n-1)*(Wm+Sm)-Wm)/2。
in a second aspect, embodiments of the present invention provide a semiconductor device comprising an electrical connection assembly according to any one of the preceding embodiments.
In a third aspect, an embodiment of the present invention provides a method for manufacturing an electrical connection assembly, where the method includes the following steps: obtaining the length L of the conductor line and the minimum spacing S of the metal linesmExtremely small width W of metal wiremAnd a very small extension E of the end of the conductor wirem(ii) a According to L, Sm、WmAnd EmCalculating the calculated number n of the metal wires; according to L, Sm、Wm、EmAnd n, calculating the length E1 of the first extension part and the length E2 of the second extension part of the conductor wire.
In an alternative embodiment, according to L, Sm、WmAnd EmCalculating the calculated number n of metal lines comprises:
the calculation formula of the calculated number n of metal wires is as follows:
n＝floor((L-Em*2-Wm)/(Sm+Wm))+1；
where floor is a function taking the largest integer not greater than the argument.
In an alternative embodiment, according to L, Sm、Wm、EmAnd n, calculating the length E1 of the first extension part and the length E2 of the second extension part of the conductor wire comprises:
when E1+ E2 is M, and M is an even number, the calculation formula of E1 and E2 is:
E1＝E2＝(L-(n-1)*(Wm+Sm)-Wm)/2。
in an alternative embodiment, according to L, Sm、Wm、EmAnd n, calculating the length E1 of the first extension part and the length E2 of the second extension part of the conductor wire comprises:
when the condition E1+ E2 > M, E1> E2 is satisfied and M is an odd number, the calculation formula of E1 is:
E1＝(L+1-(n-1)*(Wm+Sm)-Wm)/2；
the formula for E2 is:
E2＝(L-1-(n-1)*(Wm+Sm)-Wm)/2。
in an alternative embodiment, according to L, Sm、Wm、EmAnd n, calculating the length E1 of the first extension part and the length E2 of the second extension part of the conductor wire comprises:
when the condition E1+ E2 is satisfied, M, E1< E2, and M is an odd number, the calculation formula of E1 is:
E1＝(L-1-(n-1)*(Wm+Sm)-Wm)/2；
the formula for E2 is:
E2＝(L+1-(n-1)*(Wm+Sm)-Wm)/2。
the electric connection assembly, the preparation method thereof and the semiconductor device provided by the embodiment of the invention have the beneficial effects that: firstly, according to the design requirements of the device, the length L of the conductor line, the calculated number n of the metal lines and the minimum spacing S of the adjacent metal lines can be determinedmExtremely small width W of metal wiremAnd a very small extension E of the end of the conductor wiremThen, according to L, Sm、Wm、EmAnd n, calculating the length E1 of the first extension part and the length E2 of the second extension part of the conductor wire, so that complete and accurate size data of the conductor wire and the metal wire can be obtained, and preparing the conductor wire and the metal wire with higher size accuracy according to the size data. However, the technical concept provided by the embodiment of the present invention is lacking in the prior art: first determining L, Sm、Wm、EmAnd n, calculating E1 and E2 to obtain complete and accurate size data of the conductor wire and the metal wire, and forming an electric connection assembly according to the size data, so that the size precision of the conductor wire and the metal wire can be higher, particularly, the size precision of the length E1 of the first extension part and the length E2 of the second extension part of the conductor wire is reliable, the (| E1-E2|) is as small as possible, and the yield of the device is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of an electrical connection assembly according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of an electrical connection assembly according to a second embodiment of the present invention;
fig. 3 is a schematic structural diagram of an electrical connection assembly according to a third embodiment of the present invention;
fig. 4 is a flowchart of a method for manufacturing an electrical connection assembly according to a fourth embodiment of the present invention.
Icon: 100-an electrical connection assembly; 200-conductor lines; 210-a first extension; 220-a second extension; 300-metal lines.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", etc. are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship which is usually placed when the product of the present invention is used, the description is only for convenience of describing the present invention and simplifying the description, but the indication or suggestion that the device or the element to be referred must have a specific orientation, be constructed in a specific orientation and be operated, and thus, the present invention cannot be construed as being limited.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
In the prior art, the arrangement of the metal wires on the conductor wire can only meet the requirement of the distance between two adjacent metal wires, and then the positions of the metal wires on the conductor wire are randomly arranged, so that the dimensional accuracy of the reserved extension lengths at two ends of the conductor wire is unreliable. In view of the above, the present embodiment provides an electrical connection assembly, which can solve the above technical problems.
First embodiment
Referring to fig. 1, the electrical connection assembly 100 of the present embodiment includes a conductor line 200 and a plurality of metal lines 300 formed on the conductor line 200, the plurality of metal lines 300 are disposed in parallel at intervals, the plurality of metal lines 300 are perpendicular to the conductor line 200, the middle position of each metal line 300 is overlapped with the conductor line 200, and the middle lines of all the metal lines 300 are overlapped.
The length L of the conductor line 200 and the minimum spacing S between adjacent metal lines 300 may be predetermined according to design requirementsmExtremely small width W of metal line 300mAnd a very small extension length E of the end of the conductor wire 200m。
According to L, Sm、WmAnd EmThe calculated number n of the metal lines 300 can be calculated, and in this embodiment, the calculation formula of the calculated number n of the metal lines 300 is:
n＝floor((L-Em*2-Wm)/(Sm+Wm))+1；
where floor is a function taking the largest integer not greater than the argument.
A calculation formula for the calculated number n based on the metal line 300, in (L-E)m*2-Wm)/(Sm+Wm) When the value of (A) is not an integer, then the largest integer not greater than the argument is taken, e.g., (L-E)m*2-Wm)/(Sm+Wm) When 3.2 is equal, then floor ((L-E)m*2-Wm)/(Sm+Wm) ) is 3 and n is equal to 4. Therefore, the operation of random abandoning or carrying of the EDA tool in the prior art can be avoided, and the obtained size data is more accurate and reliable.
Then according toL、Sm、Wm、EmAnd n, the length E1 of the first extension portion 210 and the length E2 of the second extension portion 220 of the conductor wire 300, respectively, protruding from both ends of the conductor wire 200 can be calculated. Here, the length E1 of the first extension portion 210 indicates a length of the upper end of the conductor line 200 of fig. 1 extending out of the metal line 300, and the length E2 of the second extension portion 220 indicates a length of the lower end of the conductor line 200 of fig. 1 extending out of the metal line 300. The present embodiment provides the following three ways to calculate the length E1 of the first extension 210 and the length E2 of the second extension 220.
The first method is as follows: when the condition E1+ E2 is satisfied, M is an even number, the calculation formula of E1 and E2 is:
E1＝E2＝(L-(n-1)*(Wm+Sm)-Wm)/2。
the second method comprises the following steps: when the condition E1+ E2 > M, E1> E2 is satisfied and M is an odd number, the calculation formula of E1 is:
E1＝(L+1-(n-1)*(Wm+Sm)-Wm)/2；
the formula for E2 is:
E2＝(L-1-(n-1)*(Wm+Sm)-Wm)/2。
the third method comprises the following steps: when the condition E1+ E2 is satisfied, M, E1< E2, and M is an odd number, the calculation formula of E1 is:
E1＝(L-1-(n-1)*(Wm+Sm)-Wm)/2；
the formula for E2 is:
E2＝(L+1-(n-1)*(Wm+Sm)-Wm)/2。
for example, in the present embodiment, the length L of the conductor line 200 is 480nm, and the minimum spacing S between the adjacent metal lines 300mA minimum width W of 65nm for the metal line 300mA minimum extension E of the end of the conductor line 200 at 40nmmThe value is 10nm, and the following can be obtained:
n＝floor((L-Em*2-Wm)/(Sm+Wm))+1
n＝floor((480-10*2-40)/(65+40))+1
n＝floor(4)+1
n＝5
the first method is as follows: when the condition E1+ E2 is satisfied, M is an even number:
E1＝E2＝(L-(n-1)*(Wm+Sm)-Wm)/2
E1＝E2＝(480-(5-1)*(40+65)-40)/2
E1＝E2＝10nm
the second method comprises the following steps: when the condition E1+ E2 > M, E1> E2 is satisfied, and M is an odd number, the length L of the conductor line 200 takes a value of 481 nm:
E1＝(L+1-(n-1)*(Wm+Sm)-Wm)/2
E1＝(481+1-(5-1)*(40+65)-40)/2
E1＝11nm；
E2＝(L-1-(n-1)*(Wm+Sm)-Wm)/2
E2＝(481-1-(5-1)*(40+65)-40)/2
E2＝10nm；
in the second embodiment, the length L of the conductor line 200 is increased by 1nm upward relative to the first embodiment, and the value of E1 is increased by 1 nm.
The third method comprises the following steps: when the condition E1+ E2 is satisfied, M, E1< E2, and M is an odd number, the length L of the conductor line 200 takes a value of 481 nm:
E1＝(L-1-(n-1)*(Wm+Sm)-Wm)/2
E1＝(481-1-(5-1)*(40+65)-40)/2
E1＝10nm；
E2＝(L+1-(n-1)*(Wm+Sm)-Wm)/2
E2＝(481+1-(5-1)*(40+65)-40)/2
E2＝11nm；
in the third embodiment, the length L of the conductor line 200 is increased by 1nm downward compared to the first embodiment, and the value of E2 is increased by 1 nm.
It can be seen that in the first mode, the metal lines 300 are uniformly spaced, the length E1 of the first extension portion 210 of the conductor line 200 is equal to the length E2 of the second extension portion 220, and the various dimensional data satisfy the design requirements. The metal lines 300 are uniformly spaced in the second and third modes, the length E1 of the first extension portion 210 and the length E2 of the second extension portion 220 of the conductor line 200 are different by only 1nm, and the various dimensional data satisfy the design requirements. Thus, complete and accurate dimension data of the conductor line 200 and the metal line 300 can be obtained by any one of the three methods, and the electrical connection assembly 100 is formed according to the dimension data, so that the dimension accuracy of the conductor line 200 and the metal line 300 can be higher, particularly, the dimension accuracy of the length E1 of the first extension part 210 and the length E2 of the second extension part 220 of the conductor line 200 is reliable, the (| E1-E2|) is as small as possible, and the yield of the device is improved.
Second embodiment
Referring to fig. 2, the present embodiment provides an electrical connection assembly 100, which has a similar structure to the electrical connection assembly 100 provided in the first embodiment, but the arrangement of the metal lines 300 is different.
The electrical connection assembly 100 of the present embodiment includes a conductor line 200 and a plurality of metal lines 300 formed on the conductor line 200, the plurality of metal lines 300 are disposed in parallel at intervals, the plurality of metal lines 300 are perpendicular to the conductor line 200, an end of each metal line 300 is overlapped with the conductor line 200, and middle lines of all the metal lines 300 are overlapped.
Likewise, the length L of the conductor line 200, the minimum spacing S of adjacent metal lines 300 may be predetermined according to design requirementsmExtremely small width W of metal line 300mAnd a very small extension length E of the end of the conductor wire 200m. According to L, Sm、WmAnd EmThe calculated number n of the metal lines 300 can be calculated. According to L, Sm、Wm、EmAnd n, the length E1 of the first extension portion 210 and the length E2 of the second extension portion 220 of the conductor wire 300, respectively, protruding from both ends of the conductor wire 200 can be calculated.
Third embodiment
Referring to fig. 3, the present embodiment provides an electrical connection assembly 100, which has a similar structure to the electrical connection assembly 100 provided in the first embodiment, except that the arrangement of the metal wires 300 is different.
The electrical connection assembly 100 of the present embodiment includes a conductor line 200 and a plurality of metal lines 300 formed on the conductor line 200, the plurality of metal lines 300 are disposed in parallel at intervals, the plurality of metal lines 300 are perpendicular to the conductor line 200, an end of each metal line 300 coincides with the conductor line 200, and middle lines of two adjacent metal lines 300 are disposed in parallel at intervals, that is, two adjacent metal lines 300 are located at two opposite sides of the conductor line 200.
Likewise, the length L of the conductor line 200, the minimum spacing S of adjacent metal lines 300 may be predetermined according to design requirementsmExtremely small width W of metal line 300mAnd a very small extension length E of the end of the conductor wire 200m. According to L, Sm、WmAnd EmThe calculated number n of the metal lines 300 can be calculated. According to L, Sm、Wm、EmAnd n, the length E1 of the first extension portion 210 and the length E2 of the second extension portion 220 of the conductor wire 300, respectively, protruding from both ends of the conductor wire 200 can be calculated.
Fourth embodiment
Referring to fig. 4, the present embodiment provides a method for manufacturing any one of the electrical connection assemblies 100 in the first to third embodiments, the method including the following steps:
s41: obtaining the length L of the conductor line 200 and the minimum spacing S of the metal lines 300mExtremely small width W of metal line 300mAnd a very small extension length E of the end of the conductor wire 200m。
The length L of the conductor line 200 and the minimum spacing S between adjacent metal lines 300 may be predetermined according to design requirementsmExtremely small width W of metal line 300mAnd a very small extension length E of the end of the conductor wire 200m。
For example, in the present embodiment, the length L of the conductor line 200 is 480nm, and the minimum spacing S between the adjacent metal lines 300mA minimum width W of 65nm for the metal line 300mA minimum extension E of the end of the conductor line 200 at 40nmmThe value is 10 nm.
S42: according to L, Sm、WmAnd EmThe calculated number n of the metal lines 300 is calculated.
In this embodiment, the calculation formula of the calculated number n of the metal lines 300 is:
n＝floor((L-Em*2-Wm)/(Sm+Wm))+1；
where floor is a function taking the largest integer not greater than the argument.
A calculation formula for the calculated number n based on the metal line 300, in (L-E)m*2-Wm)/(Sm+Wm) When the value of (A) is not an integer, then the largest integer not greater than the argument is taken, e.g., (L-E)m*2-Wm)/(Sm+Wm) When 3.2 is equal, then floor ((L-E)m*2-Wm)/(Sm+Wm) ) is 3 and n is equal to 4. Therefore, the operation of random abandoning or carrying of the EDA tool in the prior art can be avoided, and the obtained size data is more accurate and reliable.
Based on the values of the respective size data in S41, it is possible to obtain:
n＝floor((L-Em*2-Wm)/(Sm+Wm))+1
n＝floor((480-10*2-40)/(65+40))+1
n＝floor(4)+1
n＝5
s43: according to L, Sm、Wm、EmAnd n, calculating a length E1 of the first extension part 210 and a length E2 of the second extension part 220 of the conductor wire 200, both ends of which protrude out of the metal wire 300, respectively.
Here, the length E1 of the first extension portion 210 indicates a length of the upper end of the conductor line 200 of fig. 1 extending out of the metal line 300, and the length E2 of the second extension portion 220 indicates a length of the lower end of the conductor line 200 of fig. 1 extending out of the metal line 300. The present embodiment provides the following three ways to calculate the length E1 of the first extension 210 and the length E2 of the second extension 220.
The first method is as follows: when the condition E1+ E2 is satisfied, M is an even number, the calculation formula of E1 and E2 is:
E1＝E2＝(L-(n-1)*(Wm+Sm)-Wm)/2。
based on the values of the respective size data in S41 and S42, it can be obtained:
E1＝E2＝(L-(n-1)*(Wm+Sm)-Wm)/2
E1＝E2＝(480-(5-1)*(40+65)-40)/2
E1＝E2＝10nm
the second method comprises the following steps: when the condition E1+ E2 > M, E1> E2 is satisfied and M is an odd number, the calculation formula of E1 is:
E1＝(L+1-(n-1)*(Wm+Sm)-Wm)/2；
the formula for E2 is:
E2＝(L-1-(n-1)*(Wm+Sm)-Wm)/2。
based on the values of the respective size data in S41 and S42, it can be obtained:
when the condition E1+ E2 > M, E1> E2 is satisfied, and M is an odd number, the length L of the conductor line 200 takes a value of 481 nm:
E1＝(L+1-(n-1)*(Wm+Sm)-Wm)/2
E1＝(481+1-(5-1)*(40+65)-40)/2
E1＝11nm；
E2＝(L-1-(n-1)*(Wm+Sm)-Wm)/2
E2＝(481-1-(5-1)*(40+65)-40)/2
E2＝10nm；
in the second embodiment, the length L of the conductor line 200 is increased by 1nm upward relative to the first embodiment, and the value of E1 is increased by 1 nm.
The third method comprises the following steps: when the condition E1+ E2 is satisfied, M, E1< E2, and M is an odd number, the calculation formula of E1 is:
E1＝(L-1-(n-1)*(Wm+Sm)-Wm)/2；
the formula for E2 is:
E2＝(L+1-(n-1)*(Wm+Sm)-Wm)/2。
based on the values of the respective size data in S41 and S42, it can be obtained:
when the condition E1+ E2 is satisfied, M, E1< E2, and M is an odd number, the length L of the conductor line 200 takes a value of 481 nm:
E1＝(L-1-(n-1)*(Wm+Sm)-Wm)/2
E1＝(481-1-(5-1)*(40+65)-40)/2
E1＝10nm；
E2＝(L+1-(n-1)*(Wm+Sm)-Wm)/2
E2＝(481+1-(5-1)*(40+65)-40)/2
E2＝11nm；
in the third embodiment, the length L of the conductor line 200 is increased by 1nm downward compared to the first embodiment, and the value of E2 is increased by 1 nm.
It can be seen that in the first mode, the metal lines 300 are uniformly spaced, the length E1 of the first extension portion 210 of the conductor line 200 is equal to the length E2 of the second extension portion 220, and the various dimensional data satisfy the design requirements. The metal lines 300 are uniformly spaced in the second and third modes, the length E1 of the first extension portion 210 and the length E2 of the second extension portion 220 of the conductor line 200 are different by only 1nm, and the various dimensional data satisfy the design requirements. Thus, complete and accurate dimension data of the conductor line 200 and the metal line 300 can be obtained by any one of the three methods, and the electrical connection assembly 100 is formed according to the dimension data, so that the dimension accuracy of the conductor line 200 and the metal line 300 can be higher, particularly, the dimension accuracy of the length E1 of the first extension part 210 and the length E2 of the second extension part 220 of the conductor line 200 is reliable, the (| E1-E2|) is as small as possible, and the yield of the device is improved.
Fifth embodiment
The present embodiment provides a semiconductor device including the electrical connection assembly 100 of any one of the first to third embodiments. The semiconductor devices herein may include fin-type multi-gate transistors (also referred to as FinFET devices), which may be double-gate devices, tri-gate devices, bulk devices, silicon-on-insulator (SOI) devices, or other configurations. Other examples of semiconductor devices will be recognized by those of ordinary skill in the art, given the benefit of the present description. For example, some embodiments described herein may also be applied to a Gate All Around (GAA) device, an omega gate (gate) device, or a Pi gate (II gate) device.
The present embodiment also provides a method of manufacturing a semiconductor device, which includes the method of manufacturing the electrical connection assembly 100 provided in the fourth embodiment, and which can be used to manufacture various types of semiconductor devices described above. It should be appreciated that the fabrication method provided by the present embodiment includes steps having features of a Complementary Metal Oxide Semiconductor (CMOS) technology process flow. Additional steps may be performed before, after, or during the manufacturing process.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. An electrical connection assembly, comprising:
a conductor line (200);
a plurality of metal lines (300) formed on the conductor line (200), the plurality of metal lines (300) being perpendicular to the conductor line (200), the plurality of metal lines (300) being arranged in parallel at intervals;
wherein, the parts of the two ends of the conductor wire (200) respectively extending out of the metal wire (300) are a first extension part (210) and a second extension part (220), the length E1 of the first extension part (210) and the length E2 of the second extension part (220) are determined according to the length L of the conductor wire (200), the calculated number n of the metal wires (300) and the minimum spacing S of the adjacent metal wires (300)mA very small width W of the metal line (300)mAnd a very small extension E of the end of the conductor line (200)mAnd (4) determining.
2. The electrical connection assembly according to claim 1, wherein the calculated number n of metal wires (300) is calculated by the formula:
n＝floor((L-Em*2-Wm)/(Sm+Wm))+1；
where floor is a function taking the largest integer not greater than the argument.
3. The electrical connection assembly of claim 2, wherein when the condition E1+ E2 is satisfied, M being an even number, the calculation formula of E1 and E2 is:
E1＝E2＝(L-(n-1)*(Wm+Sm)-Wm)/2。
4. the electrical connection assembly of claim 2, wherein when the condition E1+ E2 > M, E1> E2 is satisfied, and M is an odd number, the calculation formula of E1 is:
E1＝(L+1-(n-1)*(Wm+Sm)-Wm)/2；
the formula for E2 is:
E2＝(L-1-(n-1)*(Wm+Sm)-Wm)/2。
5. the electrical connection assembly of claim 2, wherein when the condition E1+ E2 is M, E1< E2, M is an odd number, the formula for E1 is:
E1＝(L-1-(n-1)*(Wm+Sm)-Wm)/2；
the formula for E2 is:
E2＝(L+1-(n-1)*(Wm+Sm)-Wm)/2。
6. a semiconductor device comprising the electrical connection assembly of any one of claims 1 to 5.
7. A method of making an electrical connection assembly, the method comprising the steps of:
obtaining the length L of the conductor line (200) and the minimum spacing S of the metal line (300)mA very small width W of the metal line 300mAnd a very small extension E of the end of the conductor wire (200)m；
According to L, Sm、WmAnd EmCalculating the calculated number n of the metal wires (300);
according to L, Sm、Wm、EmAnd n, calculating the length E1 of the first extension part (210) and the length E2 of the second extension part (220) of the conductor wire (200).
8. Method for manufacturing an electrical connection assembly according to claim 7, characterized in that said assembly is according to L, Sm、WmAnd EmCalculating the calculated number n of wires (300) comprises:
the calculation formula of the calculated number n of the metal wires (300) is as follows:
n＝floor((L-Em*2-Wm)/(Sm+Wm))+1；
where floor is a function taking the largest integer not greater than the argument.
9. Method for manufacturing an electrical connection assembly according to claim 8, characterized in that said assembly is according to L, Sm、Wm、EmAnd n, the calculating of the length E1 of the first extension portion (210) and the length E2 of the second extension portion (220) of the conductor wire (200) includes:
when the condition E1+ E2 is satisfied, M is an even number, the calculation formula of E1 and E2 is:
E1＝E2＝(L-(n-1)*(Wm+Sm)-Wm)/2。
10. method for manufacturing an electrical connection assembly according to claim 8, characterized in that said assembly is according to L, Sm、Wm、EmAnd n, the calculating of the length E1 of the first extension portion (210) and the length E2 of the second extension portion (220) of the conductor wire (200) includes:
when the condition E1+ E2 is satisfied, M is an odd number, E1> E2, and the calculation formula of E1 is:
E1＝(L+1-(n-1)*(Wm+Sm)-Wm)/2；
the formula for E2 is:
E2＝(L-1-(n-1)*(Wm+Sm)-Wm)/2；
alternatively, when the condition E1+ E2 is M, E1< E2, and M is an odd number, the calculation formula of E1 is:
E1＝(L-1-(n-1)*(Wm+Sm)-Wm)/2；
the formula for E2 is:
E2＝(L+1-(n-1)*(Wm+Sm)-Wm)/2。
CN202010834777.3A 2020-08-19 2020-08-19 Electrical connection assembly, preparation method thereof and semiconductor device Pending CN111933524A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6207479B1 (en) * 1999-06-14 2001-03-27 Taiwan Semiconductor Manufacturing Co., Ltd. Place and route method for integrated circuit design
US20080079114A1 (en) * 2006-09-29 2008-04-03 International Business Machines Corporation Striped on-chip inductor
CN108073754A (en) * 2016-11-18 2018-05-25 台湾积体电路制造股份有限公司 The method of layout

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6207479B1 (en) * 1999-06-14 2001-03-27 Taiwan Semiconductor Manufacturing Co., Ltd. Place and route method for integrated circuit design
US20080079114A1 (en) * 2006-09-29 2008-04-03 International Business Machines Corporation Striped on-chip inductor
CN101512724A (en) * 2006-09-29 2009-08-19 国际商业机器公司 Design rules for on-chip inductors
CN108073754A (en) * 2016-11-18 2018-05-25 台湾积体电路制造股份有限公司 The method of layout

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